TWI435832B - Loading mechanism capable of matching with different-size wafer boxes - Google Patents

Description

Carrier mechanism capable of assembling different size wafer cassettes

The invention provides a bearing mechanism which can conveniently assemble different large and small size wafer cassettes, thereby improving the use efficiency.

Nowadays, the wafer cassette system is divided into 8 吋, 12 吋 and other different large and small sizes, and is arranged in each workstation for picking and placing wafers of different sizes, and each workstation is provided with a carrying board for mounting and Positioning the wafer cassette, because the wafer cassette is a specification, SEMI (Semiconductor Equipment and Materials Research Institute) is a specification for positioning between different large and small wafer cassettes and dedicated carrier boards to ensure dedicated load The board precisely positions the wafer cassette.

Please refer to FIG. 1 , which is a schematic diagram of the positioning method of the SEMI specification large-sized wafer cassette 11 and the carrier 12 . The bottom surface of the large-sized wafer cassette 11 is provided with a locking portion of a V-shaped straight groove 111 and is provided. There are two engaging portions of the V-shaped chutes 112 and 113. The carrier plate 12 is provided with a Y-axis positioning pin 121 at a position corresponding to the top surface of the V-shaped straight groove 111 of the large-sized wafer cassette 11, and correspondingly The large-sized wafer cassette 11 bis V-shaped chutes 112, 113 are provided with X-axis positioning pins 122, 123; see Fig. 2, when assembling the large-sized wafer cassette 11, the large-sized wafer cassette The V-shaped straight groove 111 and the V-shaped chute 112 and 113 of the 11 are respectively embedded in the Y-axis positioning pin 121 and the X-axis positioning pins 122 and 123 of the carrier plate 12, and the carrier plate 12 can utilize the Y-axis. The large-sized wafer cassette 11 is restricted from being displaced in the Y-axis by the positioning pin 121, and the X-axis positioning pins 122 and 123 are used to restrict the large-sized wafer cassette 11 from being displaced in the X-axis direction, so that the large-sized wafer cassette 11 is positioned on the bearing. The board 12 is used for picking and dropping wafers.

Please refer to FIG. 3 , which is a schematic diagram of the positioning mode of the SEMI specification small-sized wafer cassette 13 and the carrier board 14 . The small-sized wafer cassette 13 is connected to the bottom of the two side plates 131 , 132 and has a bottom plate 133 . The bottom surface is convexly provided with a latching portion for the insert block 134. The carrier plate 14 is respectively provided with a plurality of Y-axis positioning blocks 141 on both sides of the top surface, and is inserted into the corresponding small-sized wafer cassette 13 The 134 position is provided with two X-axis positioning sockets 142; referring to FIG. 4, when the small-sized wafer cassettes 13 are assembled, the small-sized wafer cassettes 13 can be placed on the Y-axis positions on both sides of the carrier board 14. Between the blocks 141, the two side plates 131, 132 of the small-sized wafer cassette 13 are placed against the Y-axis positioning blocks 141 on the side, and the insert block 134 of the small-sized wafer cassette 13 is inserted into the carrier plate 14. The X-axis positioning socket 142, and the carrier plate 14 can restrict the small-sized wafer cassette 13 to the Y-axis displacement by using the Y-axis positioning blocks 141, and restrict the small-sized wafer cassette 13 by the two-X axial positioning sockets 142. The X axial displacement causes the small size wafer cassette 13 to be positioned on the carrier plate 14 for pick and place wafers.

However, regardless of the large and small size of the wafer cassettes 11, 13 are provided with dedicated carrier plates 12, 14, which requires the operator to purchase two different positioning types of the carrier plates 12, 14 in order to assemble different sizes of crystals. The round boxes 11, 13 and, in addition, the number of the different positioning type carrier plates 12, 14 is not only quite space-consuming and is not easy to be finished. If a plurality of carrier plates 12, 14 are stacked and stacked, it is inconvenient. Management, in addition, if the workstation is currently equipped with a plurality of carrier boards 12 for carrying the large-sized wafer cassette 11 and performing the wafer handling operation, the small batch wafer cassette 13 is required for the next batch of workstation operations. When the wafer is picked up and dropped, it is necessary to remove the carrier plate 12 dedicated to the large-sized wafer cassette 11 in a time-consuming and cumbersome manner, and reassemble the carrier board 14 dedicated to the small-sized wafer cassette 13, resulting in a lack of use.

Therefore, how to design a load-bearing mechanism that can be assembled with different sizes of wafer cassettes to improve the performance is the standard developed by the industry.

A first object of the present invention is to provide a carrier mechanism capable of assembling different sizes of wafer cassettes, comprising a body having a receiving groove and a movable member. The system is provided with at least one first Y-axis on a circumferential side of the receiving groove. And a positioning member and at least one second Y-axis positioning member, the movable member is assembled in the receiving groove of the body, and is provided with at least one first X-axis positioning member on one side and at least one first portion on the other side The two X-axis positioning members, and the first X-axis positioning member of the movable member and the first Y-axis positioning member of the body form a first positioning group for fitting and positioning the engaging portion of the large-sized wafer cassette. After the movable member is flipped, the second X-axis positioning member of the movable member and the second Y-axis positioning member of the body form a second positioning group for fitting and positioning the engaging portion of the small-sized wafer cassette; Therefore, the carrying mechanism can accommodate different large and small size wafer cassettes, and does not need to disassemble and replace the special carrying board in time, thereby achieving the practical benefit of improving the use efficiency and convenience.

The object of the present invention is to provide a supporting mechanism for assembling different sizes of wafer cassettes. The receiving groove of the body and the two ends of the movable member are provided with a joint structure, and the joint structure is attached to the receiving groove of the body. Each of the ends is provided with at least one receiving portion, and at least one bridging portion is respectively disposed at two ends of the movable member, and a matching pin and positioning are disposed between the receiving portion of the main body and the bridging portion of the movable member. a hole, and a screw hole and a through hole which are matched with each other, and then the through hole is inserted by the bolt, and the screw hole is screwed to the screw hole, so that the movable member is assembled on the body and is kept on the same plane, so as to smoothly hold the wafer cassette. Practical benefits.

The third object of the present invention is to provide a supporting mechanism capable of assembling different sizes of wafer cassettes, wherein the movable parts of the supporting mechanism are assembled on the body and can be collectively disposed, which not only reduces the storage space, but also facilitates management. Improve the practical benefits of performance.

In order to make the present invention further understand the present invention, a preferred embodiment and a drawing will be described. Referring to FIG. 5, the carrying mechanism 20 of the present invention includes a body 21 and a movable member 22, which The body 21 can be a panel, a base or a frame for receiving the wafer cassettes of different sizes, and is provided with a receiving slot 211 into which the movable member 22 can be placed. In this embodiment, the body 21 is a framing seat 211, and a accommodating groove 211 for accommodating the movable member 22 is disposed on the top surface, and the accommodating groove 211 is recessed on the inner side surface. In the embodiment, the accommodating groove 211 is The two sides are respectively recessed with a plurality of notches 212 for facilitating the removal of the movable member 22, and the body 21 is provided with at least one first Y-axis positioning member and at least one second Y on the circumferential side of the receiving groove 211. In the embodiment, the first Y-axis positioning member 213 is a post-receiving groove 211, and a plurality of axial positioning members 213 are fixed on the two sides of the receiving groove 211. The second Y-axis positioning member 214 is mounted on the receiving groove 211 of the body 21 and is provided on at least one side of the body. The first X-axis positioning member is provided with at least one second X-axis positioning member on the other side. In the embodiment, the movable member 22 is provided with a first X-axis positioning member with two protrusions on one side. A second X-axis positioning member 222 is disposed on the other side of the body, and a coupling structure is disposed between the movable member 22 and the receiving groove 211 of the body 21. The coupling structure is disposed on the body 21. At least one receiving portion is respectively disposed at two ends of the slot 211, and at least one bridging portion is respectively disposed at two ends of the movable member 22 for being positioned on the receiving portion of the body 21 and being held by the body 21 In the embodiment, the joint structure is respectively provided with a receiving portion 215 and a fitting portion 216 at two ends of the receiving groove 211 of the body 21, and a first span is respectively disposed at two ends of the movable member 22 When the first bridging portion 223 of the movable member 22 straddles the receiving portion 215 of the body 21, the second bridging portion 224 is embedded in the fitting portion of the body 21. 216, the movable member 22 and the body 21 are assembled with each other and kept in the same plane. Otherwise, the movable member 22 is turned over so that the second bridging portion 224 is placed across the body 21. When the portion 215 is placed, the first bridging portion 223 is embedded in the fitting portion 216 of the body 21, so that the movable member 22 and the body 21 are assembled to each other and remain in the same plane. Further, the combined structure is further included in the body. Between the receiving portion of the 21 and the bridging portion of the movable member 22, a matching pin and a positioning hole are arranged, and a screw hole and a through hole are matched with each other, and then the through hole is inserted through the bolt and screwed into the screw hole. The movable member 22 is assembled and positioned in the accommodating groove 211 of the body 21. In the embodiment, the receiving structure is provided with a positioning pin 217 and a screw hole 218 in the receiving portion 215 of the body 21, and the movable member 22 The first bridging portion 223 is provided with a first positioning hole 225 and a first through hole 226, and the second bridging portion 224 is provided with a second positioning hole 227 and a second through hole 228, and the first positioning hole of the movable member 22 The 225 or the second positioning hole 227 can be sleeved on the positioning pin 217 of the body 21 to accurately position the movable member 22, and the first through hole 226 or the second through hole 228 is inserted by the bolt 23 and screwed to the body. The screw hole 218 of 21 assembles the movable member 22 to the body 21.

Referring to FIGS. 6 and 7 , the large-sized wafer cassette 30 is a standard product, and is provided with a V-shaped straight groove 31 at a position corresponding to the first Y-axis positioning member 213 of the main body 21 of the supporting mechanism 20 on the bottom surface. The engaging portion has two engaging portions of the V-shaped chutes 32 and 33 at the position of the first X-axis positioning member 221 of the movable member 22 at the bottom surface, and is recessed on the bottom surface of the large-sized wafer cassette 30. There is a accommodating space 34. When the carrying mechanism 20 is to assemble the large-sized wafer cassette 30, the first X-axis positioning member 221 of the movable member 22 is first turned upward, and the first one of the first bridging portions 223 is first. The positioning hole 225 is sleeved on the positioning pin 217 of the receiving portion 215 of the body 21, so that the first bridging portion 223 is placed on the receiving portion 215 of the body 21, and the auxiliary movable member 22 is accurately positioned due to the second bridging. The portion 224 has a height difference with the first bridging portion 223, and the second bridging portion 224 can be embedded in the fitting portion 216 of the body 21, so that the movable member 22 and the body 21 are kept in the same plane, and then inserted by the bolt 23. The first through hole 226 of the movable member 22 is screwed into the screw hole 218 of the body 21, thereby locking and fixing the movable member 22 to the body 21, so that the first X-axis of the movable member 22 is The positional member 221 and the first Y-axis positioning member 213 of the body 21 constitute a first positioning group; please refer to FIGS. 8 and 9. When assembling the large-sized wafer cassette 30, the large-sized wafer cassette 30 can be V-shaped. The straight groove 31 and the V-shaped chutes 32, 33 are respectively aligned on the first Y-axis positioning member 213 of the body 21 of the carrying mechanism 20 and the first X-axis positioning member 221 of the movable member 22, due to the large size The bottom surface of the wafer cassette 30 is recessed with the accommodating space 34, so that the second Y-axis positioning members 214 of the main body 21 can be located in the accommodating space 34 of the large-sized wafer cassette 30, and the carrying mechanism 20 can utilize the body 21 The first Y-axis positioning member 213 and the V-shaped straight groove 31 of the large-sized wafer cassette 30 are mutually engaged to prevent the Y-axis displacement of the large-sized wafer cassette 30, and the first X-axis of the movable member 22 The positioning member 221 and the V-shaped chutes 32 and 33 of the large-sized wafer cassette 30 are mutually engaged to prevent the X-axis displacement of the large-sized wafer cassette 30, so that the large-sized wafer cassette 30 is stably fixed on the carrier mechanism 20. For pick and place wafers.

Referring to FIGS. 10 and 11, the small-sized wafer cassette 40 is a specification, and a connecting member 43 is coupled to the bottom of the two side plates 41 and 42. The assembled member 43 can be a plate or a strip member. In this embodiment, the set of the connecting members 43 is a strip-shaped rod member, and the bottom surface of the connecting member 43 is convexly provided with a engaging portion for the inserting block 44. When the supporting mechanism 20 is to be assembled with a small-sized wafer cassette At 40 o'clock, the bolt 23 on the movable member 22 can be first removed, and the movable member 22 is turned over so that the second X-axis positioning member 222 of the movable member 22 faces upward, and the second jumper portion 224 is The two positioning holes 227 are sleeved on the positioning pin 217 of the body 21, so that the second bridging portion 224 is placed on the receiving portion 215 of the body 21 to assist the movable member 22 to be precisely determined. Because the second bridging portion 224 and the first bridging portion 223 have high and low level differences, the first bridging portion 223 can be embedded in the fitting portion 216 of the body 21, so that the movable member 22 and the body 21 are kept in the same plane. Then, the second through hole 228 of the movable member 22 is inserted into the screw hole 218 of the body 21, and the movable member 22 is locked and assembled on the body 21 to make the second X-axis of the movable member 22 The second positioning group is formed by the positioning member 222 and the second Y-axis positioning member 214 of the body 21; referring to FIGS. 12 and 13, when the small-sized wafer cassette 40 is assembled, the small-sized wafer cassette 40 can be placed. Between each of the second Y-axis positioning blocks 214 of the body 21, the two side plates 41, 42 of the small-sized wafer cassette 40 are placed against the second Y-axis positioning blocks 214 on the side, and the wafers are small-sized. The insert block 44 of the cartridge 40 is inserted into the second X-axis positioning member 222 of the movable member 22, and the carrying mechanism 20 can be clamped to the small-sized wafer cassette 40 by the second Y-axis positioning block 214 of the body 21. The side plates 41, 42 prevent the small-sized wafer cassette 40 from being displaced in the Y-axis, and the second X-axis positioning member 222 of the movable member 22 and the insert block 44 of the small-sized wafer cassette 40 are mutually engaged. Small size cassette stopper 40 for axial displacement X, the small size cassette 40 is positioned firmly on the carrier means 20 for handling a wafer.

Accordingly, the carrying mechanism of the present invention can be assembled with different sizes of wafer cassettes, and the use efficiency is improved, which is a practical and progressive design. However, the same products and publications are not disclosed, thereby allowing patents for inventions. Apply for the requirements and apply in accordance with the law.

[study]

11‧‧‧ Large size wafer cassette

111‧‧‧V type straight slot

112, 113‧‧‧V type chute

12‧‧‧Loading board

121‧‧‧Y axial positioning pin

122, 123‧‧‧X axial positioning pin

13‧‧‧Small size wafer cassette

131, 132‧‧‧ side panels

133‧‧‧floor

134‧‧‧ insert block

14‧‧‧Loading board

141‧‧‧Y axial positioning block

142‧‧‧X axial positioning socket

〔this invention〕

20‧‧‧Loading mechanism

21‧‧‧ body

211‧‧‧ accommodating slots

212‧‧‧ Missing slot

213‧‧‧First Y axial positioning piece

214‧‧‧Second Y axial positioning piece

215‧‧‧ 承部

216‧‧‧Mate

217‧‧‧Locating pins

218‧‧‧ screw holes

22‧‧‧Activities

221‧‧‧First X-axis positioning piece

222‧‧‧Second X axial positioning piece

223‧‧‧First bridging department

224‧‧‧Second bridging

225‧‧‧First positioning hole

226‧‧‧ first through hole

227‧‧‧Second positioning hole

228‧‧‧second through hole

23‧‧‧Equip

30‧‧‧ Large size wafer cassette

31‧‧‧V type straight slot

32, 33‧‧‧V type chute

34‧‧‧ accommodating space

40‧‧‧Small size wafer cassette

41, 42‧‧‧ side panels

43‧‧‧Components

44‧‧‧Interpolation

Figure 1: Schematic diagram of a conventional large-size wafer cassette and a dedicated carrier board.

Figure 2: Schematic diagram of the assembly of the large-size wafer cassette and the special carrier.

Figure 3: Schematic diagram of a small-sized wafer cassette and a dedicated carrier plate.

Figure 4: Schematic diagram of the assembly of a small-sized wafer cassette and a dedicated carrier.

Fig. 5 is an exploded view of the bearing mechanism of the present invention.

Figure 6 is a schematic view of the carrier mechanism and the large-sized wafer cassette of the present invention.

Figure 7 is a partial cross-sectional view of the carrier mechanism of the present invention.

Figure 8 is a schematic view showing the assembly of the large-sized wafer cassette of the carrier mechanism of the present invention.

Figure 9 is a plan view showing the assembly of a large-sized wafer cassette by the carrier mechanism of the present invention.

Figure 10 is a schematic view of the carrier mechanism and the small-sized wafer cassette of the present invention.

Figure 11 is a partial cross-sectional view of the carrier mechanism of the present invention.

Fig. 12 is a schematic view showing the assembly of the small-sized wafer cassette of the carrying mechanism of the present invention.

Figure 13 is a plan view showing the assembly of the small-sized wafer cassette of the carrier mechanism of the present invention.

20. . . Carrying mechanism

twenty one. . . Ontology

211. . . Locating slot

212. . . Missing slot

213. . . First Y axial positioning member

214. . . Second Y axial positioning member

215. . . Bearing department

216. . . Mating part

217. . . Locating pin

218. . . Screw hole

twenty two. . . Moving parts

221. . . First X axial positioning member

222. . . Second X axial positioning member

223. . . First bridging

224. . . Second bridging

225. . . First positioning hole

226. . . First through hole

227. . . Second positioning hole

228. . . Second through hole

twenty three. . . Bolt

Claims (10)

A carrier mechanism capable of assembling different sizes of wafer cassettes, comprising: a body: a receiving groove, and at least one first Y-axis positioning member and at least one second Y-axis on a circumferential side of the receiving groove The movable member is assembled in the receiving groove of the body, and is provided with at least one first X-axis positioning member on one side and at least one second X-axis positioning member on the other side, and the movable member is An X-axis positioning member and a first Y-axis positioning member of the body form a first positioning group for fitting and positioning the engaging portion of the large-sized wafer cassette, and the second X-axis positioning member is second with the body The Y-axis positioning member constitutes a second positioning group for fitting and positioning the engaging portion of the small-sized wafer cassette. According to the first aspect of the patent application, the bearing frame of the different size wafer cassette can be assembled, wherein the system is provided with a first Y-axis positioning member for the protruding post behind the receiving groove, and is accommodated Two Y-axis positioning members, which are two protrusions, are respectively disposed on both sides of the groove. The carrier mechanism of the different size wafer cassettes can be assembled according to the first aspect of the patent application, wherein the body can be a panel, a base or a frame for receiving the wafer cassette. The load-bearing mechanism of the wafer cassette of different sizes can be assembled according to the first aspect of the patent application, wherein the system has at least one notch recessed on at least one side of the accommodating groove. According to the scope of claim 1, the load-bearing mechanism of the wafer cassette of different sizes can be assembled, wherein the movable member is provided with a first X-axis positioning member with two protrusions on one side and two on the other side. To position the second X-axis positioning member of the socket. The bearing mechanism capable of assembling different size wafer cassettes according to the first aspect of the patent application scope is further provided with a joint structure between the movable member and the receiving groove of the body, the joint structure is attached to the two ends of the receiving groove of the body. At least one receiving portion is respectively disposed, and at least one bridging portion is disposed at both ends of the movable member, and is spanned on the receiving portion of the main body by the bridging portion. According to the sixth aspect of the patent application, the load-bearing mechanism of the wafer cassette of different sizes can be assembled, wherein the joint structure is respectively provided with a receiving portion and a fitting portion at two ends of the receiving groove of the main body, and the movable member The first bridging portion and the second bridging portion are respectively disposed at two ends. According to the seventh aspect of the patent application, the load-bearing mechanism of the different size wafer cassettes can be assembled, wherein the joint structure is matched between the bearing portion of the body and the first and second bridging portions of the movable member. The positioning pin and the positioning hole are provided with a screw hole and a through hole which are matched with each other between the bearing portion of the main body and the first and second bridging portions of the movable member, and then the through hole is inserted through the bolt and screwed into the screw hole. According to the eighth aspect of the patent application, the load-bearing mechanism of the wafer cassette of different sizes can be assembled, wherein the joint structure is provided with a positioning pin at the bearing portion of the body, and the first span portion of the movable member is provided with a positioning hole, and a second positioning hole is provided in the second bridging portion. According to the eighth aspect of the patent application, the load-bearing mechanism of the wafer cassette of different sizes can be assembled, wherein the joint structure is provided with a screw hole in the bearing portion of the body, and the first cross-section of the movable member is provided with a through hole, and a second through hole is provided in the second bridging portion.