TWI434627B - Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight unit - Google Patents

Description

Radiation heat dissipation circuit board and manufacturing method thereof, heat generating device package and back thereof Light unit

The present invention claims a Korean Patent No. 10-2010-0099002 filed on October 11, 2010. This is incorporated herein by reference.

The present invention relates to a radiant heat circuit board.

The circuit board includes a circuit pattern on an insulating board. The board is a substrate for mounting electrical components.

These electrical components may include heat generating devices such as light emitting diodes (LEDs). The heating device can emit a considerable amount of heat. The heat emitted from the heat generating device increases the temperature of the circuit board, thereby causing malfunction of the heat generating device and reducing the reliability of the heat generating device.

In order to solve the limitation of the heat dissipation of the spoke, a heat radiating circuit board as shown in FIG. 1 is proposed.

1 is a cross-sectional view of a heat sink circuit board in accordance with one of the prior art techniques.

Referring to FIG. 1, a heat sink circuit board according to the prior art includes a metal plate 1 including a spoke heat sink 2, an insulating layer 3, a circuit pattern 4, and a solder resist 5.

In the radiation heat dissipation circuit board 10, a heat generating device 20 is attached to the radiation heat sink protrusion 2 to transfer heat to the lower metal plate 1. Here, the heat generating device is connected to the circuit pattern 4 via a solder 6.

In the radiation heat dissipation circuit board 10 according to the prior art, heat emitted from the heat generating device 20 is not transmitted to the metal plate 1 to release heat due to the disturbance of the insulating layer 3.

Embodiments provide a spoke heat dissipation circuit board having a novel structure and a heat generating device package having the radiation heat dissipation circuit board.

Embodiments also provide a spoke heat dissipation circuit board with improved efficiency and a heat generating device package having the radiation heat dissipation circuit board.

In one embodiment, a spoke heat dissipation circuit board for mounting a plurality of heat generating devices includes: a metal plate including an integrated metal protrusion to which the heat generating devices are coupled; and an insulating member exposing the integrated metal protrusion, The insulating member includes a plurality of insulating layers disposed on the metal plate; and a first and a second electrode pad are disposed on the insulating member, and the first and second electrode pads are electrically separated from each other. The first or second electrode pad can receive a voltage from circuit wires disposed on different insulating layers of the insulating member.

In another embodiment, a heat generating device package includes: a spoke heat dissipating circuit board including an integrated pad in which a plurality of device mounting regions are defined, the integrating pads passing over the device mounting regions and connected to each other, a plurality of insulating layers exposing the integration pad and burying a plurality of circuit patterns, wherein the integration pad is formed of an alloy having superior thermal conductivity, the alloy comprising one of copper, aluminum, nickel, gold, or platinum And a plurality of electrode pads disposed on the insulating layers and connected to the circuit patterns; and a plurality of heat generating devices coupled to the integrated pads and the electrode pads exposed to each device mounting region.

In still another embodiment, a method for fabricating a heat sink circuit board for mounting a plurality of heat generating devices includes: forming an integrated metal protrusion for simultaneously bonding the heat generating devices to a metal plate; forming an insulating layer exposed to The metal protrusion on the metal plate and including a buried circuit pattern; forming a circuit pattern in which a uniform hole is exposed in the insulating layer; and forming a buried via the through hole An electrode of the circuit pattern is padded on the insulating layer.

One or more embodiments will be described in detail with the accompanying drawings and the description below. Other features will be apparent from the description, drawings, and claims.

In the following, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings, in which FIG. The statement of the embodiment.

In the present specification, when describing, including or including some elements, it is understood that they may include (or include or have) those elements, or may include (or include or have) Other components and these components.

In the drawings, any unnecessary description in the present invention will be omitted for clarity of presentation, and the thickness will become large for the purpose of clearly explaining the layers and regions. The same elements in the drawings will represent the same elements, so their description will be omitted.

In the description, it should be understood that when a layer, a film, a region, or a plate is referred to as another layer, film, region, or plate, it may be directly in other layers or regions. Or a sheet, or a plurality of interposers, a plurality of films, a plurality of regions, or a plurality of plates. On the other hand, it should be understood that when one layer, one film, one region, or one plate system is directly above the other, there may be no other layers, films, regions, and plates.

The present invention provides a circuit board in which a pad projection for mounting a plurality of heat generating devices on a metal plate is integrated to improve heat dissipation.

Hereinafter, a heat radiating circuit board and a heat generating device package having the same may be described with reference to FIGS. 2 through 6 according to an embodiment.

2 is an exploded perspective view of a heat generating device package in accordance with an embodiment. 3 is a top view of the one-radiation heat dissipation circuit board of FIG. 2. Figure 4 is a cross-sectional view of the heat generating device package of Figure 3 taken along line I-I'. Figure 5 is a cross-sectional view of the heat generating device package of Figure 3 taken along line II-II'. Figure 6 is a cross-sectional view of the heat generating device package of Figure 3 taken along line III-III'.

In the following, a spoke heat dissipation circuit board and a heat generating device package having the same will be described together.

Referring to FIGS. 2-6, a heat generating device package according to an embodiment includes a spoke heat dissipation circuit board 100 and a plurality of heat generating devices 200 mounted on the spoke heat dissipation circuit board 100.

The spoke heat dissipation circuit board 100 includes mounting pads 115a arranged in a line to be mounted in a line-arranged heat generating device 200.

Although the strip-shaped radiating heat dissipation circuit board 100 is illustrated in this embodiment, the present invention is not limited thereto. For example, the spoke heat dissipation circuit board 100 can be provided in a circular or matrix type.

When the heat generating devices 200 arranged in a line are mounted on the spoke heat dissipation circuit board 100, the spoke heat dissipation circuit board 100 may include the mounting pads 115a arranged in a line.

The radiating heat dissipation circuit board 100 includes a metal plate 110, insulating layers 120, 140, 160 disposed on the metal plate 110, and circuit patterns 130, 153, 155, 151, 152, 154, 156a, 156b, 156c, 156d disposed in insulation On layers 120, 140.

The metal plate 110 may be formed of an alloy having superior thermal conductivity including one of copper, aluminum, nickel, gold, or platinum.

The metal plate 110 includes a metal protrusion 115 that constitutes a mounting pad 115a for mounting the heat generating device 200.

The metal protrusion 115 extends vertically from the metal plate 110. A portion of the upper surface of the metal protrusion 115 can be used as the mounting pad 115a for mounting the heat generating device 200. At the same time, the metal protrusion 115 has a predetermined width, so that a solder 170 can be disposed on the upper surface thereof.

The metal protrusions 115 can be integrated to provide heat generating devices 200 that are simultaneously arranged in a line.

That is, the metal protrusions 115 disposed under the heat generating device 200 and the metal protrusions 115 disposed under the adjacent heat generating devices 200 are connected to each other. Therefore, the metal protrusion 115 extends between the heat generating device 200 and the adjacent heat generating device 200.

The metal plate 110 may be etched or may perform an electroplating or printing process on the metal plate 110 to produce an integrated metal projection 115.

As described above, since the metal protrusions 115 are integrally provided under the heat generating device 200 arranged in a line, the metal layer is disposed in the same manner as in the prior art, and the insulating layers 120, 140 are filled between the heat generating devices 200. An area to improve heat dissipation.

The integrated metal protrusion 115 can be opened to form a first insulating layer 120.

The first insulating layer 120 may include a plurality of insulating layers. At the same time, the first insulating layer 120 insulates the metal plate 110 from the first circuit pattern 130 disposed thereon.

The first insulating layer 120 may be formed of an epoxy-based insulating resin. At the same time, the first insulating layer 120 can serve as an adhesive layer for bonding the metal plate 110 to an upper copper film, that is, a mother material of the first circuit pattern 130.

The first circuit pattern 130 is disposed on the first insulating layer 120. The first circuit pattern 130 is electrically connected to a first power pad 156a as a signal line for transmitting a positive voltage to the first electrode pads 155.

The first circuit pattern 130 is disposed on one side of the integrated metal protrusion 115 to extend along the metal protrusion 115.

The first circuit pattern 130 is buried to form a second insulating layer 140 on the first insulating layer 120.

The second insulating layer 140 is formed of an epoxy resin-based insulating resin having low conductivity (about 0.2 W/mk to about 0.4 W/mk). On the other hand, the second insulating layer 140 may be formed of a polyimide-based resin having relatively high conductivity.

A prepreg formed by injecting a resin into a solid element 21 such as a reinforcing fiber, a glass fiber, or a filler may be cured to form a second insulating layer 140.

The metal protrusion 115 may be exposed from the second insulating layer 140. Meanwhile, the second insulating layer 140 may have a thickness smaller than the height of the metal protrusions 115.

A plurality of second circuit patterns 153, 155, 151, 152, 154, 156a, 156b, 156c, 156d are disposed on the second insulating layer 140.

The second circuit patterns 153, 155, 151, 152, 154, 156a, 156b, 156c, 156d include a plurality of power pads 156a, 156b, 156c, 156d, a plurality of electrode pads 153, 155, and a plurality of circuit lines The wires 151, 152, 154 connect the power pads 156a, 156b, 156c, 156d to the electrode pads 153, 155.

The power pads 156a, 156b, 156c, 156d are disposed on an edge region of the circuit board 100. The power pads 156a, 156b, 156c, 156d receive a voltage from the outside to provide the voltage to the electrode pads 153, 155 via the circuit lines 151, 152, 154.

The power pads 156a, 156b, 156c, 156d are exposed by a third insulating layer 160 that buryes the circuit lines 151, 152, 154. The power pads 156a, 156b, 156c, 156d include a first power pad 156a for receiving a positive voltage from the outside, and second to fourth power pads 156b, 156c, 156d for receiving a negative voltage.

Although the three power pads 156b, 156c, 156d of the present embodiment are used to receive a negative voltage, the present invention is not limited thereto. For example, the number of power pads can vary differently depending on the number of heat generating devices 200 and the circuit design.

The radiating heat dissipation circuit board 100 can be divided into a plurality of division regions (first to third regions). The number of separation regions may be equivalent to the number of power pads 156b, 156c, 156d used to receive a negative voltage.

Each of the partition regions may include a plurality of heat generating device mounting regions, and as shown in FIG. 3, the three mounting regions may be disposed on a partitioning region.

A mounting pad 115a, a first electrode pad 155 disposed on one side of the mounting pad 115a, and a second electrode pad 153 separated from the first electrode pad 155 by the third insulating layer 160 are disposed in each mounting area. on.

The electrode pads 153, 155 can be pads to provide different voltages to the heat generating device 200 on each heat generating device mounting area.

The first and second electrode pads 153, 155 provide voltages of different polarities into a heat generating device mounting area. Therefore, the first and second electrode pads 153, 155 in a heat generating device mounting region may have voltages of different polarities from the first and second electrode pads 153, 155 in the adjacent heat generating device mounting regions.

Below the third insulating layer, a second electrode pad 153 of a heat generating device mounting region can be connected to the first electrode pad 155 of the adjacent heat generating device mounting region. Here, the same voltage can be applied to the electrode pads 153, 155 which are different from each other and connected to each other.

In detail, in each of the separation regions, the first one of the first electrode pads 155 is connected to the first via a via 145 passing through the second insulating layer 140 in each of the separation regions. The circuit pattern is to simultaneously receive a positive voltage from the first power pad 156a.

In each of the separation regions, the last one of the second electrode pads 153 is connected to the second to fourth power pads 156b, 156c, 156d via the negative circuit wires 151, 152, 154 to receive A negative voltage.

Therefore, in the one separation region, in the first and second electrode pads 153, 155, a voltage alternately applied to the heat generating device mounting regions has an alternately changed polarity. However, the plurality of divided regions may have the same voltage distribution.

Here, the first and second electrode pads 153, 155 are arranged in a layer different from the first circuit pattern 130. The negative electrode circuit lines 151, 152, 154 may be disposed in the same direction as the first and second electrode pads 153, 155 on one side of the mounting pad 115a. Therefore, the metal protrusion 115 capable of forming the heat generating device 200 mounting pad 115a can be widened in the area.

The third insulating layer 160 exposes the power pads 156a, 156b, 156c, 156d and buryes the circuit lines 151, 152, 154. Meanwhile, in each of the heat generating device mounting regions, the third insulating layer 160 exposes the mounting pad 115a, that is, the upper surface of the metal protrusion 115a and the first and second electrode pads 153, 155.

Here, at each of the exposed pads 115a, 153, 155, 156a, 156b, 156c, 156d, a metal used to form the circuit patterns may be surface-treated. For surface treatment, an electroplating process using silver, nickel, or gold can be performed to easily achieve wire bonding or solder bonding.

The third insulating layer 160 may be formed of a solder resist to protect the lower circuit pattern.

A solder 170 may be disposed on the first and second electrode pads 153, 155 and the mounting pads 115a exposed by the third insulating layer 160 to engage the heat generating device 200 to the spoke heat dissipation circuit board 100.

A lead solder cream or a lead-free solder cream may be coated on the metal protrusion 115, and then the heat generating device 200 may be mounted to heat-treat the resultant to form the solder 170.

The heat generating device 200 can be a light emitting device such as a light emitting diode (LED). Each electrode of the heat generating device 200 may be connected to the first and second electrode pads 153, 155 to emit light.

As described above, in the radiation heat dissipation circuit board 100 for mounting the heat generating devices 200, the electrode pads 115a for mounting the heat generating device 200 are manufactured by connecting the upper surface of the metal protrusions 115 to the metal plate 110, and At the same time, the metal protrusions 115 are formed integrally with the heat generating devices 200. Therefore, heat dissipation can be performed via the metal protrusions 115 between the heat generating devices 200 to improve heat dissipation. Meanwhile, the electrode pads 153, 155 may be disposed on one side of the metal protrusion 115, and a circuit line providing a positive voltage may be disposed on the lower insulating layer to enlarge a region occupied by the metal protrusion on the surface of the circuit board.

In the following, FIGS. 7 to 14 illustrate a manufacturing process of the heat generating device package of FIG.

7 to 14 illustrate a manufacturing process of the heat generating device package of FIG. 2.

First, as shown in FIG. 7, a metal plate 110 is prepared. Then, as shown in FIG. 8, the metal protrusions 115 are formed on the metal plate 110.

Here, the metal plate 110 may be formed of an alloy having superior thermal conductivity, the alloy comprising one of copper, aluminum, nickel, gold, or platinum.

The metal plate 110 may be molded into a predetermined shape to form the metal protrusions 115 using a rolling process or etching.

Alternatively, an electroplating or printing process can be performed on the metal plate 110 to form the metal protrusions 115.

Here, the metal protrusions 115 may have a height greater than the thickness of each of the insulating layers 120, 140 in consideration of the thickness of each of the insulating layers 120, 140 to be formed later.

The metal protrusion 115 may be disposed at the center of the metal plate 110 of the spoke heat dissipation circuit board 100. The metal protrusions 115 are preferably disposed at positions that are not equally spaced apart from both edges of the metal plate 110.

As shown in FIG. 9, a first insulating layer 120 and a copper film layer 135 are formed on the metal plate 110.

The first insulating layer 120 can be formed by coating a resin such as an epoxy resin onto a reinforcing fiber, a glass fiber, or a prepreg in a filler on the metal plate 110. Meanwhile, the first insulating layer 120 and the copper film layer 135 may be formed using a copper clad lamination (CCL).

Here, each of the first insulating layer 120 and the copper film layer 135 may have an opening to expose the metal protrusions 115.

A physical process can be performed to form the opening. For example, a drilling process or a laser process can be performed to form the opening.

A first compression layer 120 and a copper film layer 135 may be disposed on the metal plate 110 while the opening exposes the metal protrusions 115 to the integrated metal protrusions, the first insulating layer 120. And a copper film layer 135.

As shown in FIG. 10, the copper film layer 135 is etched to form a first circuit pattern 130 having a predetermined shape. As shown in FIGS. 2 and 3, the first circuit pattern 130 may extend across the metal plate 110 along the metal protrusions 115 in a straight line direction on the side surface of the metal protrusion 115.

The first circuit pattern 130 is buried to form a second insulating layer 140.

The second insulating layer 140 may be formed by coating a resin such as an epoxy resin onto a reinforcing fiber, a glass fiber, or a prepreg in a filler on the metal plate 110. The second insulating layer 140 has an opening that is aligned with the opening of the first insulating layer 120 to expose the metal protrusions 115.

As shown in FIG. 11, a via hole 141 for exposing the lower first circuit pattern 130 is formed on the second insulating layer 140.

The through hole 141 may have a side surface that is inclined by a predetermined angle with respect to the plane of the metal plate 110. On the other hand, the through hole 141 may have a side surface perpendicular to the plane of the metal plate 110.

The through hole 141 can be formed using a laser. Here, a UV laser or a CO2 laser can be used.

At the same time, the through hole 141 can be formed using a physical process such as a drilling process. Alternatively, the second insulating layer 140 may be etched using a chemical process, such as selectively etched to form the vias 141.

As shown in FIG. 12, the through holes 141 may be filled to form a via 145 and second circuit patterns 153, 155, 151, 152, 154, 156a, 156b, 156c, 156d.

A general circuit pattern process can be used as a process for forming the via holes 145 and a process for forming the second circuit patterns 153, 155, 151, 152, 154, 156a, 156b, 156c, 156d.

For example, an electroplating process may be performed to fill the via hole 141 to form the via hole 145. Then, a copper film layer may be formed on the second insulating layer 140. The copper film layer may be patterned to form second circuit patterns 153, 155, 151, 152, 154, 156a, 156b, 156c, 156d.

Alternatively, a conductive paste may be coated in the through hole 141 to fill the through hole 141. Then, the copper film layer may be stacked on the filled via hole 141 and patterned to form the second circuit patterns 153, 155, 151, 152, 154, 156a, 156b, 156c, 156d.

Alternatively, unlike FIG. 11, the copper film layer may be continuously stacked on the second insulating layer 140, and then a through hole may be formed through the copper film layer and the second insulating layer 140 to expose the first circuit pattern 130. 141. Thereafter, an electroplating process may be performed to form a metal layer having conductivity on one side surface of the through hole 141a. Thereafter, the copper film layer may be patterned to form the second circuit patterns 153, 155, 151, 152, 154, 156a, 156b, 156c, and 156d.

As shown in FIG. 13, the electrode pads 153, 155 of the second circuit patterns 153, 155, 151, 152, 154, 156a, 156b, 156c, 156d and the power pads 156a, 156b, 156c, 156d and The mounting pads 115a are exposed to bury the circuit lines 151, 152, 154, thereby forming a third insulating layer 160.

A solder resist may be applied and cured to form a third insulating layer 160.

Here, a surface treatment may be performed on the electrode pads 153, 155 exposed by the third insulating layer 160, the power pads 156a, 156b, 156c, 156d, and the mounting pad 115a to improve a bonding. characteristic.

As shown in FIG. 14, a solder cream 170 may be coated on the mounting pad 115a, that is, the exposed upper surface of the metal protrusion 115a and the electrode pads 153, 155, and the heat generating device 200 may be mounted to perform The heat treatment is performed, whereby the heat generating device package is completed.

As described above, the electrode pads 153, 155 may be formed on one side of the metal protrusion 115 when the metal protrusions 115 are integrally formed. Then, circuit lines for applying power to the electrode pads 153, 155 may be stacked in a plurality of layers. As such, a region of the metal protrusion 115 can extend over the upper surface of the spoke heat dissipation circuit board 100.

Hereinafter, a backlight unit including the heat generating device package of Fig. 14 will be described with reference to Fig. 15.

Referring to FIG. 15 , a backlight unit 300 includes a bottom cover 310 , a reflective layer 320 on the bottom cover 310 , a light guide plate 330 on the reflective layer 320 , and a heat generating device package bonded to the bottom cover 310 . One side of the surface.

The heat generating device package can be a light emitting device package including the light emitting device 200. A light emitting diode chip is mounted on the light emitting device package.

As shown in FIGS. 2-14, the light emitting device package includes a light emitting device 200 to which the heat sink circuit board is bonded. Here, the light emitted from the light-emitting device 200 faces the one surface of the light guide plate 330a.

The light emitting device package can be physically attached to one side surface of the bottom surface 310 via a radiant heat adhesion layer 340 and secured via a bracket.

The reflective layer 320 may extend up to a lower portion of the light guide plate 330 and a lower end portion of the light emitting device package to reflect light scattered on the bottom surface of the light guide plate 330, thereby emitting light toward the upper surface of the light guide plate 330.

The light guide plate 330 may be a surface light source that emits light incident from the side surface toward the upper surface. Therefore, the light guide plate 330 can uniformly emit light to a display panel provided on the upper surface thereof.

The radiation heat dissipation circuit board can be used in the backlight unit to release heat generated from the light emitting device 200 to the outside via the bottom cover 310.

According to an embodiment, a metal plate including a radiant heat projection may be disposed under the mounting pad to directly transfer heat emitted from the heat generating devices to the metal plate, thereby improving thermal efficiency. At the same time, the spoke heat sink protrusions can be integrated to perform heat transfer between the heat generating devices, thereby improving heat dissipation. Meanwhile, an electrode pad may be disposed on one side of the metal protrusion, and the circuit line stacks for applying a power to the electrode pads are like a plurality of layers to ensure metal on the surface of the radiation heat dissipation circuit board. The area where the protrusion is widened.

While the invention has been described with respect to the embodiments of the embodiments of the present invention More particularly, various variations and modifications are possible in the component parts and/or arrangements of the claimed combinations. For those skilled in the art, alternative uses will be apparent in addition to variations and modifications in parts and/or configurations.

1. . . Metal plate

2. . . Radiant heat sink

3. . . Insulation

4. . . Circuit pattern

5. . . Solder resist

6. . . solder

10. . . Radial cooling circuit board

20. . . Heating device

100. . . Radial cooling circuit board

110. . . Metal plate

115. . . Metal protrusion

115a. . . Mounting mat

130. . . First circuit pattern

135. . . Copper layer

120, 140, 160. . . Insulation

141. . . Through hole

145. . . Via

151, 152, 154. . . Circuit line

153, 155. . . Electrode pad

156a, 156b, 156c, 156d. . . Power pad

170. . . solder

200. . . Heating device

300. . . Backlight unit

310. . . Bottom cover

320. . . Reflective layer

330. . . Light guide

340. . . Heat dissipation adhesive layer

1 is a cross-sectional view of a heat sink circuit board in accordance with one of the prior art techniques.

2 is an exploded perspective view of a heat generating device package in accordance with an embodiment.

3 is a top view of the one-radiation heat dissipation circuit board of FIG. 2.

Figure 4 is a cross-sectional view of the heat generating device package of Figure 3 taken along line I-I'.

Figure 5 is a cross-sectional view of the heat generating device package of Figure 3 taken along line II-II'.

Figure 6 is a cross-sectional view of the heat generating device package of Figure 3 taken along line III-III'.

7 to 14 illustrate a manufacturing process of the heat generating device package of FIG. 2.

Figure 15 is a cross-sectional view of the backlight unit of Figure 2 including the heat-generating device package.

110. . . Metal plate

115. . . Metal protrusion

130. . . First circuit pattern

120, 140, 160. . . Insulation

151, 152, 153. . . Second circuit pattern

170. . . solder

200. . . Heating device

Claims (19)

A radiation heat dissipation circuit board for mounting a plurality of heat generating circuit boards, the radiation heat dissipation circuit board comprising: a metal plate including an integrated metal protrusion to which the heat generating devices are coupled; and an insulating member exposing the integrated metal protrusion The insulating member includes a plurality of insulating layers disposed on the metal plate; and a first electrode pad and a second electrode pad disposed on the insulating member, the first electrode pad and the second electrode pad being electrically connected to each other And a separate arrangement, wherein the first electrode pad and the second electrode pad are disposed on one side of the metal protrusion. The radiation-dissipating circuit board of claim 1, wherein the first electrode pad or the second electrode pad receives a voltage from a circuit line disposed on a different insulating layer of the insulating member. The radiation heat dissipation circuit board of claim 1, wherein the metal protrusion comprises: a mounting pad, wherein a portion of the upper surface of the mounting pad is exposed to mount the heat generating device; and a connecting portion connects the mounting Pad to the adjacent mounting mat. The radiation heat dissipation circuit board of claim 1, wherein a mounting pad, the first electrode pad, and the second electrode pad separated from the first electrode pad are disposed in a region where the heat generating device is mounted. The radiation heat dissipation circuit board of claim 4, wherein the first electrode pad is connected to the second electrode pad, wherein the second electrode pad is disposed on an area where the adjacent heat generating device is mounted. The radiation heat dissipation circuit board of claim 1, wherein the insulation member comprises: a first insulation layer disposed on the metal plate; and a second insulation layer disposed on the first insulation layer, wherein the The first electrode pad and the second electrode pad are disposed on the second insulating layer. The radiation heat dissipation circuit board of claim 6, wherein the first electrode pad receives a voltage from a first circuit line disposed on the first insulation layer, and the second electrode pad receives a voltage from a voltage of a second circuit line disposed on the second insulating layer. The radiation heat dissipation circuit board of claim 7, wherein the second insulation layer has a uniform hole exposing the first circuit line, and the first circuit line is electrically connected to the first circuit line through the through hole An electrode pad. The radiation heat dissipation circuit board of claim 7, wherein the radiation heat dissipation circuit board exposes the first electrode pad and the second electrode pad on the insulating member, and further comprises a solder resist for burying The second circuit line is buried. A heat generating device package comprising: a spoke heat dissipating circuit board comprising an integrated mat, wherein a plurality of device mounting regions are defined in the integrated mat, the integrating mat crosses the device mounting regions and are connected to each other, and a plurality of insulating layers The layer exposes the integration pad and burying the complex a plurality of circuit patterns, and a plurality of electrode pads disposed on the insulating layer and connected to the circuit patterns; and a plurality of heat generating devices coupled to the integrated pads and the electrode pads exposed to each of the device mounting regions, wherein The electrode pads include a first electrode pad and a second electrode pad, and the first electrode pad and the second electrode pad are disposed on one side of the integrated pad. The heat-generating device package of claim 10, wherein the heat-generating device is a light-emitting diode. The heat-generating device package of claim 10, wherein the heat-dissipating circuit board comprises: a metal plate including an integrated protrusion, wherein the integrated pad is disposed on the integrated protrusion; and a solder resist, The upper surface of the metal protrusion is exposed on each of the device mounting areas and the electrode pads. The heat-generating device package of claim 10, wherein the electrode pads are connected to the buried circuit patterns via a uniform hole defined in the insulating layer. The heat-generating device package of claim 10, wherein the first electrode pad is configured to receive a first voltage and the second electrode pad electrically separated from the first electrode pad for receiving a second Voltage. A method for manufacturing a radiating heat dissipation circuit board for mounting a plurality of heat generating devices, comprising: Forming an integrated metal protrusion for simultaneously bonding the heat generating devices on a metal plate; forming an insulating layer, the insulating layer exposing the metal protrusions on the metal plate and including a buried circuit pattern, Forming a buried circuit pattern in which the uniform hole is exposed in the insulating layer; and forming an electrode pad connected to the buried circuit pattern through the through hole, wherein the formation of the electrode pad includes Forming a first electrode pad and a second electrode pad on one side of the metal protrusion. The manufacturing method of claim 15, wherein the forming of the insulating layer comprises: stacking a first insulating layer and a copper film layer on the metal plate; etching the copper film layer to form the buried circuit Patterned on one side of the metal protrusion; and forming a second insulating layer to bury the buried circuit pattern, wherein the through hole is formed in the second insulating layer. The manufacturing method of claim 15, wherein the forming of the electrode pad comprises: forming the first electrode pad and the second electrode pad by being aligned with the buried circuit pattern. The manufacturing method of claim 15, wherein the forming of the electrode pad comprises: simultaneously forming a circuit line on the insulating layer to provide a power to the first electrode pad and the second electrode pad. A backlight unit includes: a bottom cover; a light guide plate is received in the bottom cover; and a light emitting module is coupled to one side surface of the bottom cover to emit light toward a side surface of the light guide plate, wherein The illuminating module includes: a spoke heat dissipating circuit board, the radiant heat dissipating circuit board includes: an integrated pad defining a plurality of device mounting regions, the integration pad crossing the device mounting regions and connecting to each other, and a plurality of insulation The layer exposes the integrated pad and buryes a plurality of circuit patterns, and a plurality of electrode pads are disposed on the insulating layers and connected to the circuit patterns; and a plurality of heat generating devices are bonded to be exposed to each device mounting The integration pad of the region and the electrode pads, wherein the electrode pads comprise a first electrode pad and a second electrode pad, and the first electrode pad and the second electrode pad are disposed on one side of the integration pad .