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TWI434021B - Non - contact optical composite measurement method and system - Google Patents

Non - contact optical composite measurement method and system Download PDF

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TWI434021B
TWI434021B TW98142084A TW98142084A TWI434021B TW I434021 B TWI434021 B TW I434021B TW 98142084 A TW98142084 A TW 98142084A TW 98142084 A TW98142084 A TW 98142084A TW I434021 B TWI434021 B TW I434021B
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light
test piece
beam splitter
optical
photosensitive unit
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TW201120401A (en
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Metal Ind Res Anddevelopment Ct
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Description

非接觸式光學複合量測方法及系統Non-contact optical composite measuring method and system

本發明是有關於一種光學量測方法及系統,特別是指一種非接觸式光學複合量測方法及系統。The invention relates to an optical measuring method and system, in particular to a non-contact optical composite measuring method and system.

量測一物體的表面輪廓,可分為接觸式與非接觸式兩種量測方法,其中,接觸式量測方法因為必須接觸到待量測的試件才能得到量測結果,而一旦有所接觸則必然會產生例如刮傷待量測的試件表面的風險,因此,表面精細度要求較高的試件量測並不適用;而利用如光學量測的非接觸式量測方法,則因為可避免接觸式量測方法的缺點,而廣泛用於表面精細度要求較高的試件量測中。Measuring the surface profile of an object can be divided into two types of contact and non-contact measurement methods. The contact measurement method can obtain the measurement result because it must be in contact with the test piece to be measured. Contact will inevitably cause, for example, the risk of scratching the surface of the test piece to be measured. Therefore, the measurement of the test piece with higher surface fineness is not applicable; and with the non-contact measurement method such as optical measurement, Because it can avoid the shortcomings of the contact measurement method, it is widely used in the measurement of the test piece with high surface fineness.

現行的非接觸式光學量測系統,多是單一功能設計,如Mirau干涉儀僅可量測待量測試件的表面輪廓、Michelson干涉儀或是相位移疊紋干涉儀僅可用於量測得知待量測試件受外力作用前後的變形量。The current non-contact optical measurement system is mostly a single-function design. For example, the Mirau interferometer can only measure the surface profile of the test piece, the Michelson interferometer or the phase-shifted interstitial interferometer can only be used for measurement. The amount of deformation of the test piece before and after the external force is applied.

所以,若是要同時量測得到試件的表面輪廓與受外力作用前後的變形量,則需要同時準備兩種的量測系統,如此,除了費用的考量之外,兩種不同的量測系統的同時架設也會衍生出新的問題。由上述說明可知,目前的非接觸量測方法仍需要加以改進,俾便同時進行表面輪廓與變形量的量測。Therefore, if it is necessary to simultaneously measure the surface profile of the test piece and the amount of deformation before and after the external force, it is necessary to prepare two kinds of measurement systems at the same time, so that in addition to the cost considerations, two different measurement systems At the same time, erection will also generate new problems. It can be seen from the above description that the current non-contact measurement method still needs to be improved, and the measurement of the surface profile and the deformation amount is simultaneously performed.

因此,本發明之目的,即在提供一種可同時量測一試件的表面輪廓、變形量,與應變量的非接觸式光學複合量測方法。Accordingly, it is an object of the present invention to provide a non-contact optical composite measurement method that simultaneously measures the surface profile, the amount of deformation, and the amount of strain of a test piece.

另外,本發明之另一目的,即在提供一種可同時量測一試件的表面輪廓、變形量,與應變量的非接觸式光學複合量測系統。Further, another object of the present invention is to provide a non-contact optical composite measuring system capable of simultaneously measuring a surface profile, a deformation amount, and a strain amount of a test piece.

於是,本發明一種非接觸式光學複合量測方法包含一光學檢測系統架設步驟、一干涉影像得到步驟,及一變形量得到步驟。Therefore, a non-contact optical composite measuring method of the present invention comprises an optical detecting system erecting step, an interference image obtaining step, and a deformation amount obtaining step.

該光學檢測系統架設步驟將一光源、一準直透鏡組,及一第一分光鏡沿一第一光軸依序設置,並以該第一分光鏡為端點定義一異於該第一光軸的第二光軸,將一第一物鏡、一參考面鏡、一第二分光鏡、一第二物鏡,及一感光單元依序沿該第二光軸並遠離該第一分光鏡地設置,該光源發出的光線沿該第一光軸通過該準直透鏡組後產生一平行光束,該平行光束沿該第一、二光軸通過該第一分光鏡、該第一物鏡、該參考面鏡,與該第二分光鏡後聚焦於一待量測的試件,該平行光束經該第二分光鏡分為部分被該第二分光鏡反射至該參考面鏡後反射的一參考光,與部分穿透該第二分光鏡後該試件反射的一測試光,該參考光與該測試光經該第二物鏡聚焦在該感光單元。The optical detecting system erecting step sequentially sets a light source, a collimating lens group, and a first beam splitter along a first optical axis, and defines a first light different from the first light splitting mirror as an end point. a second optical axis of the shaft, a first objective lens, a reference mirror, a second beam splitter, a second objective lens, and a photosensitive unit are sequentially disposed along the second optical axis and away from the first beam splitter The light emitted by the light source passes through the collimating lens group along the first optical axis to generate a parallel beam, and the parallel beam passes the first beam splitter, the first objective lens, and the reference plane along the first and second optical axes. The mirror and the second beam splitter are focused on a test piece to be measured, and the parallel light beam is divided by the second beam splitter into a reference light that is partially reflected by the second beam splitter and reflected by the reference mirror. And a test light reflected by the test piece after partially penetrating the second beam splitter, the reference light and the test light being focused on the photosensitive unit via the second objective lens.

該干涉影像得到步驟調整該參考面鏡相對該第二光軸的傾斜角度,使該參考光與該測試光經該第二物鏡聚焦在該感光單元後產生干涉影像,供該感光單元分別得到該試件的一第一干涉影像,及一第二干涉影像。The interference image obtaining step adjusts an inclination angle of the reference mirror relative to the second optical axis, so that the reference light and the test light are focused on the photosensitive unit through the second objective lens to generate an interference image, and the photosensitive unit respectively obtains the interference image a first interference image of the test piece and a second interference image.

該變形量得到步驟用一影像處理裝置對該第一、二干涉影像進行剪影術得到該試件的變形量後,並經過該影像處理裝置計算干涉影像的條紋序數得到該試件的應變量。The deformation amount obtaining step performs a silhouette operation on the first and second interference images by an image processing device to obtain a deformation amount of the test piece, and calculates a strain amount of the interference image by the image processing device to obtain a strain amount of the test piece.

另外,本發明一種非接觸式光學複合量測系統包含一平行光發出裝置、一光學檢測裝置,及一影像處理裝置。In addition, a non-contact optical composite measuring system of the present invention comprises a parallel light emitting device, an optical detecting device, and an image processing device.

該平行光發出裝置包括一光源,及一準直透鏡組,間隔地沿一第一光軸依序設置,使該光源發出的光線通過該準直透鏡組發散後成平行於該第一光軸的平行光束。The parallel light emitting device includes a light source and a collimating lens group disposed at intervals along a first optical axis, such that light emitted by the light source is diverged through the collimating lens group to be parallel to the first optical axis Parallel beams.

該光學檢測裝置包括一第一分光鏡、一第一物鏡、一參考面鏡、一第二分光鏡、一第二物鏡,及一感光單元,間隔地沿一第二光軸依序設置,將來自該平行光發出裝置的平行光束入射該第一分光鏡後依序通過該第一物鏡、該參考鏡面、該第二分光鏡聚焦於一待量測的試件上,該平行光束經該第二分光鏡分為部分被該第二分光鏡反射至該參考面鏡後反射的一參考光,與部分穿透該第二分光鏡後該試件反射的一測試光,該參考面鏡可相對該第二光軸調整傾斜角度,使該參考光與該測試光經該第二物鏡聚焦在該感光單元後產生干涉影像。The optical detecting device includes a first beam splitter, a first objective lens, a reference mirror, a second beam splitter, a second objective lens, and a photosensitive unit, which are sequentially disposed along a second optical axis. A parallel light beam from the parallel light emitting device is incident on the first beam splitter, and sequentially passes through the first objective lens, the reference mirror surface, and the second beam splitter to focus on a test piece to be measured, and the parallel light beam passes through the first light beam. The dichroic mirror is divided into a reference light that is reflected by the second spectroscope and reflected by the reference mirror, and a test light that is partially reflected by the second spectroscope, and the reference mirror is relatively The second optical axis adjusts the tilt angle to generate an interference image after the reference light and the test light are focused by the second objective lens on the photosensitive unit.

該影像處理裝置數位化該光學檢測裝置的感光單元擷取的干涉影像成數位資料後,運算處理該等數位資料得到該試件的表面輪廓、變形量,與應變量。The image processing device digitizes the interference image captured by the photosensitive unit of the optical detecting device into digital data, and then processes and processes the digital data to obtain a surface contour, a deformation amount, and a dependent variable of the sample.

本發明之功效在於:藉由調整該參考面鏡相對該第二光軸的傾斜角度,與該影像處理裝置的配合,可同時得到該試件的表面輪廓與變形量,並可再由變形量換算得到應 變量,此外,該平行光發出裝置與該光學檢測裝置可相配合縮小改良成可攜式裝置,可直接對不方便自機台拆卸的試件進行量測,省去拆裝試件的時間以及再次定位試件的問題,有效提升量測的效率與精準度。The utility model has the advantages that: by adjusting the inclination angle of the reference mirror relative to the second optical axis, the surface contour and the deformation amount of the test piece can be simultaneously obtained by the cooperation with the image processing device, and the deformation amount can be further obtained. Conversion should be In addition, the parallel light emitting device and the optical detecting device can be combined with the optical detecting device to be reduced to a portable device, and the test piece that is inconvenient to be disassembled from the machine can be directly measured, and the time for disassembling the test piece can be omitted. Relocate the test piece again to effectively improve the efficiency and accuracy of the measurement.

有關本發明之前述及其他技術內容、特點與功效,在以下配合參考圖式之一個較佳實施例的詳細說明中,將可清楚的呈現。The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments.

參閱圖1、2,本發明非接觸式光學複合量測方法的一較佳實施例,包含一光學檢測系統架設步驟11、一表面輪廓得到步驟12、一干涉影像得到步驟13,及一變形量得到步驟14,用於量測一試件5的外形輪廓、變形量與應變量。Referring to Figures 1 and 2, a preferred embodiment of the non-contact optical composite measuring method of the present invention comprises an optical detecting system erecting step 11, a surface contour obtaining step 12, an interference image obtaining step 13, and a deformation amount. Step 14 is obtained for measuring the contour, deformation and strain of a test piece 5.

首先進行該光學檢測系統架設步驟11,建立一非接觸式光學複合量測系統,該非接觸式光學複合量測系統包含一平行光發出裝置2、一光學檢測裝置3,及一影像處理裝置4。First, the optical detecting system erecting step 11 is performed to establish a non-contact optical composite measuring system, which comprises a parallel light emitting device 2, an optical detecting device 3, and an image processing device 4.

該平行光發出裝置2包括一光源21,及一準直透鏡組22,間隔地沿一第一光軸X1依序設置,使該光源21發出的光線通過該準直透鏡組22發散後成平行於該第一光軸X1的平行光束。在本實施例中,該光源21是一可發出雷射光線的雷射裝置,較佳地,該雷射裝置可發出氦-氖雷射,更佳地,還設置有一去除不必要的雜訊的空間濾波器(圖未示),以濾除非所需波長的雜訊。The parallel light emitting device 2 includes a light source 21 and a collimating lens group 22, which are sequentially disposed along a first optical axis X1, so that the light emitted by the light source 21 is diverged through the collimating lens group 22 and then parallelized. A parallel beam of light on the first optical axis X1. In this embodiment, the light source 21 is a laser device capable of emitting laser light. Preferably, the laser device can emit a 氦-氖 laser, and more preferably, an unnecessary noise is disposed. A spatial filter (not shown) to filter out noise at the desired wavelength.

該光學檢測裝置3包括一第一分光鏡31、一第一物鏡32、一參考面鏡33、一第二分光鏡34、一第二物鏡35,及一感光單元36,間隔地沿一第二光軸X2依序設置,將來自該平行光發出裝置2的平行光束入射該第一分光鏡31後依序通過該第一物鏡32、該參考鏡面33、該第二分光鏡34聚焦於一待量測的試件5上,該平行光束經該第二分光鏡34分為部分被該第二分光鏡34反射至該參考面鏡33後反射的一參考光37,與部分穿透該第二分光鏡34後該試件5反射的一測試光38,該參考面鏡33可相對該第二光軸X2調整傾斜角度,使該參考光37與該測試光38經該第二物鏡35聚焦在該感光單元36後產生干涉影像。在本實施例中,該感光單元36是一電荷耦合元件;另外,該第一、二物鏡32、35可依該試件5的幾何外形、尺寸,及表面的精細程度,搭配不同倍數的光學鏡頭,以獲得更佳的量測結果。The optical detecting device 3 includes a first beam splitter 31, a first objective lens 32, a reference mirror 33, a second beam splitter 34, a second objective lens 35, and a photosensitive unit 36 spaced apart along a second The optical axis X2 is sequentially disposed, and the parallel light beam from the parallel light emitting device 2 is incident on the first beam splitter 31, and then sequentially passed through the first objective lens 32, the reference mirror 33, and the second beam splitter 34. The reference beam 5 is divided by the second beam splitter 34 into a reference light 37 which is partially reflected by the second beam splitter 34 and reflected by the reference mirror 33, and partially penetrates the second light. After the beam splitter 34, the test piece 5 reflects a test light 38, and the reference mirror 33 can adjust the tilt angle with respect to the second optical axis X2, so that the reference light 37 and the test light 38 are focused by the second objective lens 35. The photosensitive unit 36 generates an interference image. In this embodiment, the photosensitive unit 36 is a charge coupled component; in addition, the first and second objective lenses 32 and 35 can be matched with different multiples of optical depending on the geometric shape, size, and surface roughness of the test piece 5. Lens for better measurement results.

該影像處理裝置4包括一影像擷取單元41,及一數位資料處理程式42,該影像擷取單元41數位化該光學檢測裝置3的感光單元36擷取的干涉影像成數位資料,該數位資料處理程式42運算處理該等數位資料得到該試件5的表面輪廓與變形量,再由該變形量得到應變量(此過程請容後再詳述),在本實施例中,該影像處理裝置4為一具有該影像擷取單元41,及該數位資料處理程式42的電腦。The image processing device 4 includes an image capturing unit 41 and a digital data processing unit 42. The image capturing unit 41 digitizes the interference image captured by the photosensitive unit 36 of the optical detecting device 3 into digital data. The processing program 42 calculates and processes the digital data to obtain the surface contour and the deformation amount of the test piece 5, and then obtains the strain amount from the deformation amount (this process will be described later in detail). In this embodiment, the image processing apparatus 4 is a computer having the image capturing unit 41 and the digital data processing program 42.

進行完該光學檢測系統架設步驟11即可進行該表面輪廓得到步驟12,開啟該平行光發出裝置2的光源21,發射 出氦-氖雷射後經該準直透鏡組22發散形成一平行光束,該平行光束入射該光學檢測裝置3後經該第二分光鏡34分為參考光37與測試光38,接著調整該參考面鏡33相對該第二光軸X2的傾斜角度,以改變參考光37與測試光38間的光程差,當光程差符合而干涉條紋出現時,紀錄該試件5表面的位置與該參考面鏡33的傾斜角度,經該影像處理裝置4計算消除因該參考面鏡33的傾斜角度帶來的高度影響後,即可得到該試件5表面的高度,之後再與該試件5表面的位置相配合即可描繪出該試件5的表面輪廓。After the optical detection system erection step 11 is performed, the surface contour obtaining step 12 is performed, the light source 21 of the parallel light emitting device 2 is turned on, and the light is emitted. After exiting the 氦-氖 laser, the collimating lens group 22 is diverged to form a parallel beam, and the parallel beam is incident on the optical detecting device 3, and then divided into the reference light 37 and the test light 38 via the second beam splitter 34, and then the adjustment is performed. The angle of inclination of the reference mirror 33 with respect to the second optical axis X2 is to change the optical path difference between the reference light 37 and the test light 38. When the optical path difference is met and the interference fringe appears, the position of the surface of the test piece 5 is recorded. The tilt angle of the reference mirror 33 is calculated by the image processing device 4 to eliminate the height influence caused by the tilt angle of the reference mirror 33, and then the height of the surface of the test piece 5 can be obtained, and then the test piece is obtained. The surface contour of the test piece 5 can be drawn by the matching of the positions of the surfaces.

接下來進行該干涉影像得到步驟13,當該平行光發出裝置2的光源21發出的平行光束入射該光學檢測裝置3後,該平行光束經該第二分光鏡34分為參考光37與測試光38,調整該參考面鏡33相對該第二光軸X2的傾斜角度,使參考光37與測試光38經該第二物鏡35聚焦在該感光單元36後產生二不同時間點的干涉影像;在本例中,是調整該光學檢測裝置3的參考面鏡33相對該第二光軸X2的傾斜角度,分別由該感光單元36得到該試件5受熱或其它外力影響前的第一干涉影像,如附件1所示,以及該試件5受熱或其它外力影響後的第二干涉影像,如附件2所示。Next, the interference image obtaining step 13 is performed. After the parallel light beam emitted from the light source 21 of the parallel light emitting device 2 is incident on the optical detecting device 3, the parallel light beam is divided into the reference light 37 and the test light by the second beam splitter 34. 38, adjusting the tilt angle of the reference mirror 33 relative to the second optical axis X2, so that the reference light 37 and the test light 38 are focused on the photosensitive unit 36 via the second objective lens 35 to generate interference images at two different time points; In this example, the angle of inclination of the reference mirror 33 of the optical detecting device 3 with respect to the second optical axis X2 is adjusted, and the first interference image before the specimen 5 is affected by heat or other external force is obtained by the photosensitive unit 36, respectively. As shown in Annex 1, and the second interference image of the test piece 5 after being affected by heat or other external force, as shown in Annex 2.

之後進行該變形量得到步驟14,由該影像擷取單元41數位化該光學檢測裝置3的感光單元36擷取的第一、二干涉影像成數位資料後,再以該數位資料處理程式42進行剪影術,得到如附件3所示的影像相減圖,再計算得到的影像相減後的干涉條紋的分佈與數目,計算干涉條紋的序數 即可得到該試件的變形量,得到該變形量後,該變形量對選定方向進行偏微分計算,進而求出該試件5的應變量。Then, the amount of deformation is obtained in step 14. The image capturing unit 41 digitizes the first and second interference images captured by the photosensitive unit 36 of the optical detecting device 3 into digital data, and then performs the digital data processing program 42. Silhouette technique, obtain the image subtraction map as shown in Annex 3, and then calculate the distribution and number of interference fringes after subtraction of the image, and calculate the ordinal number of the interference fringe The deformation amount of the test piece can be obtained, and after the deformation amount is obtained, the deformation amount is subjected to partial differential calculation in the selected direction, and the strain amount of the test piece 5 is obtained.

另外要說明的是,本步驟還可藉由裝設一液晶相位調變器,導入相位移法,以提升計算干涉條紋的精準度,此外,熟悉影像處理技術的人士也可以應用現有的影像處理技巧增強影像,使得到的干涉條紋的清晰度增加,以更精確地計算干涉條紋序數,由於此等影像處理的技巧並非本發明的創作重點所在,故不就此詳加贅述。In addition, this step can also introduce a phase shift method by installing a liquid crystal phase modulator to improve the accuracy of calculating interference fringes. In addition, those skilled in image processing technology can also apply existing image processing. The technique enhances the image so that the sharpness of the resulting interference fringes is increased to more accurately calculate the interference fringe number. Since the techniques of image processing are not the focus of the present invention, they will not be described in detail.

由上述說明可知,本發明是以平行光發出裝置2與光學檢測裝置3配合待量測的試件5在感光單元36上形成干涉影像,且光路徑並無特殊的長度限制,再以影像處理裝置4計算得到的干涉影像,進而得知試件的外形輪廓、變形量與應變量,所以,該平行光發出裝置2與該光學檢測裝置3可以因應實際需要設計成攜帶式的小型光學量測設備,而可直接至試件作業現場架設以即時量測、即時同步得知試件5於加工作業中的外形輪廓、變形量與應變量。As can be seen from the above description, the present invention forms an interference image on the photosensitive unit 36 by the test piece 5 to be measured by the parallel light emitting device 2 and the optical detecting device 3, and the light path has no special length limitation, and then the image processing is performed. The interference image calculated by the device 4 is used to know the outline, the deformation amount and the strain amount of the test piece. Therefore, the parallel light emitting device 2 and the optical detecting device 3 can be designed into a portable small-scale optical measurement according to actual needs. The equipment can be directly erected to the test piece on-site to instantly measure and instantly synchronize the shape, deformation and strain of the test piece 5 during the machining operation.

要說明的是,該試件5的表面輪廓與變形量可依需求擇一量測或同時量測,即是,在該光學檢測系統架設步驟11完成後,執行該表面輪廓得到步驟12,得到該試件5的表面輪廓,或是執行該干涉影像得到步驟13與該變形量得到步驟14,得到該試件5因受熱或其它外力影響前後的變形量,或是依序執行該表面輪廓得到步驟12、該干涉影像得到步驟13,與該變形量得到步驟14,同時得到該試件5的表面輪廓與變形量,再由該變形量得到應變量。It should be noted that the surface profile and the deformation amount of the test piece 5 can be measured or measured simultaneously according to requirements, that is, after the optical detecting system erection step 11 is completed, the surface contour is obtained to obtain step 12, and The surface contour of the test piece 5, or the interference image is obtained to obtain the step 13 and the deformation amount is obtained in step 14. The deformation amount of the test piece 5 before and after being affected by heat or other external force is obtained, or the surface contour is sequentially obtained. Step 12, the interference image is obtained in step 13, and the deformation amount is obtained in step 14. At the same time, the surface contour and the deformation amount of the test piece 5 are obtained, and the amount of deformation is obtained from the deformation amount.

綜上所述,本發明之非接觸式光學複合量測方法,為供同時量測該試件5表面輪廓與變形量的光學量測方法,並應用現有的影像處理技巧增強影像,使得到的干涉條紋的清晰度增加,若該試件5需要更精細的量測精度需求,在導入相位移法後,可大幅提升量測精度,以更精確地計算干涉條紋序數,並依該試件5的實際量測需求,同時得到該試件5的表面輪廓與變形量,或表面輪廓與變形量二者擇一量測,並非只能針對該試件5的表面輪廓或變形量進行量測,而不需再架設另一光學系統。In summary, the non-contact optical composite measuring method of the present invention is an optical measuring method for simultaneously measuring the surface contour and the deformation amount of the test piece 5, and applying the existing image processing technique to enhance the image, so that The sharpness of the interference fringes is increased. If the test piece 5 requires a finer measurement accuracy requirement, after the phase shift method is introduced, the measurement accuracy can be greatly improved to more accurately calculate the interference fringe number, and according to the test piece 5 The actual measurement requirement, at the same time, obtains the surface profile and deformation amount of the test piece 5, or the surface profile and the deformation amount, and the measurement is not only for the surface profile or the deformation amount of the test piece 5, There is no need to set up another optical system.

本發明之非接觸式光學複合量測系統藉著調整該參考面鏡33相對該第二光軸X2的傾斜角度,達到與現有的Mirau干涉儀一樣的效果,即量測一待量測的試件5的表面輪廓;另外,分別由該感光單元36得到該試件5受熱或其它外力影響前後的第一、二干涉影像,再透過該影像處理裝置4進行影像處理後計算該待量測的該試件5的變形量,再由該變形量求得應變量,以單一非接觸式光學複合量測系統同時達到量測得知該試件5的表面輪廓、變形量與應變量。The non-contact optical composite measuring system of the present invention achieves the same effect as the existing Mirau interferometer by adjusting the tilt angle of the reference mirror 33 with respect to the second optical axis X2, that is, measuring a test to be measured. The surface contour of the member 5 is obtained. In addition, the first and second interference images of the test piece 5 before and after being affected by heat or other external force are obtained by the photosensitive unit 36, and the image processing device 4 performs image processing to calculate the to-be-measured image. The deformation amount of the test piece 5 is further determined by the amount of deformation, and the surface profile, the deformation amount, and the strain amount of the test piece 5 are simultaneously measured by a single non-contact optical composite measurement system.

再者,由上述說明可知,本發明之非接觸式光學複合量測系統因光路徑無特殊的長度限制,且整個量測過程並不需要移動或接觸到待量測試件,所以可因應實際需要設計成攜帶式的小型光學量測設備,直接至試件作業現場架設以即時量測、即時同步得知試件於加工作業中的外形輪廓、變形量與應變量,對於不方便自機台拆卸的試件,省 去拆裝試件的時間及再次定位試件的問題,有效提升量測的效率與精準度,故確實能達成本發明之目的。Furthermore, it can be seen from the above description that the non-contact optical composite measuring system of the present invention has no special length limitation due to the optical path, and the entire measuring process does not need to move or contact the test piece to be tested, so it can be adapted to actual needs. It is designed as a portable small-scale optical measuring equipment, which can be directly placed on the test piece to be built on the site for real-time measurement and instant synchronization. The shape, deformation and strain of the test piece in the machining operation are known, which is inconvenient for the machine to be disassembled. Test piece, province The time to disassemble the test piece and the problem of repositioning the test piece effectively improve the efficiency and accuracy of the measurement, so that the object of the present invention can be achieved.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及發明說明內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

11‧‧‧光學檢測系統架設步驟11‧‧‧ Optical inspection system erection steps

12‧‧‧表面輪廓得到步驟12‧‧‧ Surface contour steps

13‧‧‧干涉影像得到步驟13‧‧‧Interference image acquisition steps

14‧‧‧變形量得到步驟14‧‧‧Deformation step

2‧‧‧平行光發出裝置2‧‧‧Parallel light emitting device

21‧‧‧光源21‧‧‧Light source

22‧‧‧準直透鏡組22‧‧‧ collimating lens group

3‧‧‧光學檢測裝置3‧‧‧Optical inspection device

31‧‧‧第一分光鏡31‧‧‧First Beamsplitter

32‧‧‧第一物鏡32‧‧‧First objective

33‧‧‧參考面鏡33‧‧‧ reference mirror

34‧‧‧第二分光鏡34‧‧‧Second beam splitter

35‧‧‧第二物鏡35‧‧‧Second objective

36‧‧‧感光單元36‧‧‧Photosensitive unit

4‧‧‧影像處理裝置4‧‧‧Image processing device

41‧‧‧影像擷取單元41‧‧‧Image capture unit

42‧‧‧數位資料處理程式42‧‧‧Digital Data Processing Program

5‧‧‧試件5‧‧‧ test pieces

X1‧‧‧第一光軸X1‧‧‧first optical axis

X2‧‧‧第二光軸X2‧‧‧second optical axis

圖1是一流程圖,說明本發明非接觸式光學複合量測方法的一較佳實施例;及圖2是一示意圖,說明本發明較佳實施例實施時的一非接觸式光學複合量測系統。1 is a flow chart illustrating a preferred embodiment of the non-contact optical composite measurement method of the present invention; and FIG. 2 is a schematic view showing a non-contact optical composite measurement when the preferred embodiment of the present invention is implemented system.

【附件簡單說明】[A brief description of the attachment]

附件1是一影像圖,說明一試件變形前的第一干涉影像;附件2是一影像圖,說明該試件變形後的第二干涉影像;及附件3是一影像圖,說明以剪影術進行該試件第一、二干涉影像相減後的結果。Attachment 1 is an image diagram illustrating the first interference image before the deformation of the test piece; Annex 2 is an image view illustrating the second interference image after the deformation of the test piece; and Annex 3 is an image view illustrating the silhouette The result of subtracting the first and second interference images of the test piece is performed.

2...平行光發出裝置2. . . Parallel light emitting device

21...光源twenty one. . . light source

22...準直透鏡組twenty two. . . Collimating lens group

3...光學檢測裝置3. . . Optical detection device

31...第一分光鏡31. . . First beam splitter

32...第一物鏡32. . . First objective

33...參考面鏡33. . . Reference mirror

34...第二分光鏡34. . . Second beam splitter

35...第二物鏡35. . . Second objective

36...感光單元36. . . Photosensitive unit

4...影像處理裝置4. . . Image processing device

41...影像擷取單元41. . . Image capture unit

42...數位資料處理程式42. . . Digital data processing program

5...試件5. . . Specimen

X1...第一光軸X1. . . First optical axis

X2...第二光軸X2. . . Second optical axis

Claims (9)

一種非接觸式光學複合量測方法,包含:一光學檢測系統架設步驟,將一光源、一準直透鏡組,及一第一分光鏡沿一第一光軸依序設置,並以該第一分光鏡為端點定義一異於該第一光軸的第二光軸,將一第一物鏡、一參考面鏡、一第二分光鏡、一第二物鏡,及一感光單元依序沿該第二光軸並遠離該第一分光鏡地設置,該光源發出的光線沿該第一光軸通過該準直透鏡組後產生一平行光束,該平行光束沿該第一、二光軸通過該第一分光鏡、該第一物鏡、該參考面鏡,與該第二分光鏡後聚焦於一待量測的試件,該平行光束經該第二分光鏡分為部分被該第二分光鏡反射至該參考面鏡後反射的一參考光,與部分穿透該第二分光鏡後該試件反射的一測試光,該參考光與該測試光經該第二物鏡聚焦在該感光單元;一干涉影像得到步驟,調整該參考面鏡相對該第二光軸的傾斜角度,使該參考光與該測試光經該第二物鏡聚焦在該感光單元後產生干涉影像,供該感光單元分別得到該試件的一第一干涉影像,及一第二干涉影像;及一變形量得到步驟,用一影像處理裝置對該第一、二干涉影像進行剪影術得到該試件的變形量後,並經過該影像處理裝置計算干涉影像的條紋序數得到該試件的應變量。 A non-contact optical composite measuring method includes: an optical detecting system erecting step of sequentially setting a light source, a collimating lens group, and a first beam splitter along a first optical axis, and using the first The beam splitter defines a second optical axis different from the first optical axis, and a first objective lens, a reference mirror, a second beam splitter, a second objective lens, and a photosensitive unit are sequentially a second optical axis is disposed away from the first beam splitter, and the light emitted by the light source passes through the collimating lens group along the first optical axis to generate a parallel beam, and the parallel beam passes through the first and second optical axes. The first beam splitter, the first objective lens, the reference mirror, and the second beam splitter are then focused on a test piece to be measured, and the parallel beam is divided into portions by the second beam splitter by the second beam splitter a reference light reflected from the reference mirror, and a test light reflected by the test piece after partially penetrating the second beam splitter, the reference light and the test light being focused on the photosensitive unit via the second objective lens; An interference image obtaining step of adjusting the reference mirror relative to the second An angle of inclination of the axis, the reference light and the test light are focused on the photosensitive unit by the second objective lens to generate an interference image, wherein the photosensitive unit respectively obtains a first interference image of the test piece and a second interference image And a deformation amount obtaining step, wherein the first and second interference images are subjected to a silhouette operation by an image processing device to obtain a deformation amount of the test piece, and the image processing device calculates a stripe number of the interference image to obtain the test piece. strain. 根據申請專利範圍第1項所述的非接觸式複合量測方法 ,其中,該光學檢測系統架設步驟使用的光源是一可發出雷射光線的雷射裝置。 Non-contact composite measurement method according to item 1 of the patent application scope The light source used in the erection step of the optical detection system is a laser device that emits laser light. 根據申請專利範圍第1項所述的非接觸式複合量測方法,其中,該光學檢測系統架設步驟使用的感光單元是一電荷耦合元件。 The non-contact composite measuring method according to claim 1, wherein the photosensitive unit used in the optical detecting system erecting step is a charge coupled device. 根據申請專利範圍第1項所述的非接觸式複合量測方法,其中,該變形量得到步驟使用的影像處理裝置具有一數位化該感光單元擷取的影像成數位資料的影像擷取單元,及一運算處理數位資料以得到該試件的表面輪廓、變形量,與應變量的數位資料處理程式。 The non-contact composite measuring method according to claim 1, wherein the image processing device used in the step of obtaining the deformation has an image capturing unit that digitizes the image captured by the photosensitive unit into digital data. And an arithmetic processing digital data to obtain a surface contour, a deformation amount of the test piece, and a digital data processing program of the dependent variable. 根據申請專利範圍第1項所述的非接觸式複合量測方法,還包含一表面輪廓得到步驟,根據該感光單元得到的干涉影像,在消除因該參考面鏡的傾斜角度所造成的高度差後得到該試件的表面輪廓。 The non-contact composite measuring method according to claim 1, further comprising a surface contour obtaining step of eliminating a height difference caused by the tilt angle of the reference mirror according to the interference image obtained by the photosensitive unit The surface profile of the test piece was obtained. 一種非接觸式光學複合量測系統,包含:一平行光發出裝置,包括一光源,及一準直透鏡組,間隔地沿一第一光軸依序設置,使該光源發出的光線通過該準直透鏡組發散後成平行於該第一光軸的平行光束;一光學檢測裝置,包括一第一分光鏡、一第一物鏡、一參考面鏡、一第二分光鏡、一第二物鏡,及一感光單元,間隔地沿一第二光軸依序設置,將來自該平行光發出裝置的平行光束入射該第一分光鏡後依序通過該第一物鏡、該參考鏡面、該第二分光鏡聚焦於一待量測的 試件上,該平行光束經該第二分光鏡分為部分被該第二分光鏡反射至該參考面鏡後反射的一參考光,與部分穿透該第二分光鏡後該試件反射的一測試光,該參考面鏡可相對該第二光軸調整傾斜角度,使該參考光與該測試光經該第二物鏡聚焦在該感光單元後產生干涉影像;及一影像處理裝置,數位化該光學檢測裝置的感光單元擷取的干涉影像成數位資料後,運算處理該等數位資料得到該試件的表面輪廓、變形量,與應變量。 A non-contact optical composite measuring system comprises: a parallel light emitting device, comprising a light source, and a collimating lens group, arranged at intervals along a first optical axis, so that the light emitted by the light source passes through the quasi-alignment The straight lens group is diverged to form a parallel beam parallel to the first optical axis; an optical detecting device includes a first beam splitter, a first objective lens, a reference mirror, a second beam splitter, and a second objective lens. And a photosensitive unit, which is sequentially disposed along a second optical axis, and the parallel light beam from the parallel light emitting device is incident on the first beam splitter, and sequentially passes through the first objective lens, the reference mirror surface, and the second splitting light. The mirror is focused on a measurement In the test piece, the parallel beam is divided by the second beam splitter into a reference light that is reflected by the second beam splitter to the reference mirror, and is reflected by the test piece after partially penetrating the second beam splitter. a test light, the reference mirror can adjust the tilt angle relative to the second optical axis, so that the reference light and the test light are focused on the photosensitive unit through the second objective lens to generate an interference image; and an image processing device, digitizing After the interference image captured by the photosensitive unit of the optical detecting device is digitized, the digital data is processed and processed to obtain the surface contour, the deformation amount, and the dependent variable of the test piece. 根據申請專利範圍第6項所述的非接觸式光學複合量測系統,其中,該平行光發出裝置的光源是一可發出雷射光線的雷射裝置。 The non-contact optical composite measuring system according to claim 6, wherein the light source of the parallel light emitting device is a laser device capable of emitting laser light. 根據申請專利範圍第6項所述的非接觸式光學複合量測系統,其中,該光學檢測裝置的感光單元是一電荷耦合元件。 The non-contact optical composite measuring system according to claim 6, wherein the photosensitive unit of the optical detecting device is a charge coupled device. 根據申請專利範圍第6項所述的非接觸式光學複合量測系統,該影像處理裝置具有一數位化該感光單元擷取的影像成數位資料的影像擷取單元,及一運算處理數位資料得到該試件的表面輪廓、變形量,與應變量的數位資料處理程式。According to the non-contact optical composite measuring system of claim 6, the image processing device has an image capturing unit that digitizes the image captured by the photosensitive unit into digital data, and an arithmetic processing digital data is obtained. The surface contour of the test piece, the amount of deformation, and the digital data processing program of the strain.
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CN102937415B (en) * 2012-11-12 2015-02-18 中国人民解放军国防科学技术大学 Installation device and method for arc-second-level three-dimensional optical deformation measurement device
CN111156918B (en) * 2020-01-18 2025-12-23 上海理工大学 A measuring device for measuring the clamping deformation of thin-walled freeform surface optical elements and its usage method.

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US10260870B2 (en) 2017-09-19 2019-04-16 Industrial Technology Research Institute On-line measuring system, datum calibrating method, deviation measuring method and computer-readable medium
US11408730B2 (en) 2018-11-20 2022-08-09 Industrial Technology Research Institute Stress measuring device and stress measuring method

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