TWI433598B - Light emitting apparatus - Google Patents
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- 238000004146 energy storage Methods 0.000 claims description 53
- 239000003990 capacitor Substances 0.000 claims description 15
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- 238000005286 illumination Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 230000005669 field effect Effects 0.000 description 3
- 210000004508 polar body Anatomy 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
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Description
本發明係關於一種發光裝置,特別關於一種具有光感測元件的發光裝置。The present invention relates to a light emitting device, and more particularly to a light emitting device having a light sensing element.
發光二極體(light emitting diode,LED)是一種由半導體材料製作而成的發光元件。由於發光二極體係屬冷發光,具有耗電量低、元件壽命長、反應速度快等優點,再加上體積小容易製成極小或陣列式元件的特性,因此近年來隨著技術不斷地進步,其應用範圍涵蓋了電腦或家電產品的指示燈、液晶顯示裝置的背光源乃至交通號誌或是車用指示燈。A light emitting diode (LED) is a light-emitting element made of a semiconductor material. Since the light-emitting diode system is a cold light-emitting system, it has the advantages of low power consumption, long component life, fast reaction speed, and the like, and the small size is easy to be made into a very small or array element, so that the technology has been continuously improved in recent years. Its application range covers the indicators of computers or home appliances, the backlight of liquid crystal display devices, traffic signs or vehicle lights.
在一些產品中,具有複數個發光二極體之平均亮度控制係相當重要。以液晶電視為例,其背光模組所需的發光二極體數量通常需要數十至數百顆,而為了使其能夠呈現真實的色彩或較佳的顯示畫面,控制該等發光二極體的平均亮度即成為相當重要的技術。In some products, the average brightness control system with a plurality of light-emitting diodes is quite important. Taking a liquid crystal television as an example, the number of light-emitting diodes required for the backlight module usually needs to be tens to hundreds, and the light-emitting diodes are controlled in order to enable them to display true colors or better display images. The average brightness becomes a very important technology.
請參照圖1A所示,習知技術的背光模組係具有複數個發光二極體11、一光感測器12及一控制器13。光感測器12係於各發光二極體11發光時接收其所產生的光線,並據以產生一回授信號至控制器13,再由控制器13依據回授信號來調整相對應之發光二極體11的亮度。Referring to FIG. 1A , the backlight module of the prior art has a plurality of LEDs 11 , a photo sensor 12 , and a controller 13 . The light sensor 12 receives the light generated by each of the light-emitting diodes 11 when it emits light, and generates a feedback signal to the controller 13, and then the controller 13 adjusts the corresponding light according to the feedback signal. The brightness of the diode 11.
近來又有業者提出另一種習知技術的背光模組,其係將複數個發光二極體11區分為多數個區域,請參照圖1B所示,例如,其係將複數個發光二極體11區分為12個區域,每一區域例如係由四個發光二極體11搭配一個光感測器12,以分區調整發光二極體的亮度。然而,由於發光二極體11係被區分為12個區域,因此用以調整發光二極體11之亮度的控制器(未示於圖)需要12個通道,以分別控制12個區域之發光二極體11的亮度。而當背光模組的發光二極體11數量越多而被區分為更多區域時,控制器所需的通道數量即會隨之增加,如此一來將增加控制器的成本。Recently, another backlight module is known from the prior art, which divides a plurality of light-emitting diodes 11 into a plurality of regions, as shown in FIG. 1B, for example, a plurality of light-emitting diodes 11 are used. It is divided into 12 regions, each of which is composed of four light-emitting diodes 11 and a light sensor 12 to adjust the brightness of the light-emitting diodes in a partition. However, since the light-emitting diode 11 is divided into 12 regions, a controller (not shown) for adjusting the brightness of the light-emitting diode 11 requires 12 channels to respectively control the illumination of 12 regions. The brightness of the polar body 11. When the number of the light-emitting diodes 11 of the backlight module is divided into more regions, the number of channels required by the controller increases, which increases the cost of the controller.
此外,如圖1B所示,發光二極體11與光感測器12係分開設置,以致增加各區域的尺寸,進而造成背光模組的尺寸增加,並且發光二極體11與光感測器12之間的距離亦導致光感測器12易受環境光的影響,而造成光感測器12的精確度下降。In addition, as shown in FIG. 1B, the light emitting diode 11 and the photo sensor 12 are separately disposed, so as to increase the size of each area, thereby increasing the size of the backlight module, and the light emitting diode 11 and the photo sensor The distance between 12 also causes the photo sensor 12 to be susceptible to ambient light, resulting in a decrease in the accuracy of the photo sensor 12.
承上所述,不論上述的何種方法,皆必須藉由光感測器來檢測發光二極體的發光強度,並在回授後根據預置於控制器13內的校準資料來調整發光二極體的功率,而為達到習知技術之目的均需要花費非常高的成本。因此,如何使發光裝置的亮度能夠受到完善的控制,並且能夠降低成本的支出,實屬當前重要課題之一。According to the above, regardless of the above methods, the light intensity of the light emitting diode must be detected by the light sensor, and after the feedback, the light emitting light is adjusted according to the calibration data preset in the controller 13. The power of the polar body requires very high costs for the purpose of the prior art. Therefore, how to make the brightness of the light-emitting device be well controlled and to reduce the cost of expenditure is one of the current important issues.
有鑑於上述課題,本發明之目的為提供一種能夠準確地控制發光裝置之亮度,且能夠降低成本之一種發光裝置。In view of the above problems, an object of the present invention is to provide a light-emitting device capable of accurately controlling the brightness of a light-emitting device and reducing the cost.
為達上述目的,依據本發明之一種發光裝置包含至少一發光單元、至少一第一開關單元、至少一儲能單元以及至少一光感測控制單元。第一開關單元與發光單元電性連接。儲能單元係與第一開關單元電性連接,並儲存一電能量。光感測控制單元係具有一光感測元件,發光單元設置於光感測元件之上,光感測控制單元係與儲能單元電性連接,並感測發光單元之一發光能量,並依據發光能量調節電能量大小,而第一開關單元係依據電能量大小以控制發光單元。To achieve the above object, a light emitting device according to the present invention comprises at least one light emitting unit, at least one first switching unit, at least one energy storage unit, and at least one light sensing control unit. The first switching unit is electrically connected to the light emitting unit. The energy storage unit is electrically connected to the first switching unit and stores an electric energy. The light sensing control unit has a light sensing component, the light emitting unit is disposed on the light sensing component, and the light sensing control unit is electrically connected to the energy storage unit, and senses one of the light emitting energy of the light emitting unit, and is based on The illuminating energy adjusts the magnitude of the electric energy, and the first switching unit controls the illuminating unit according to the magnitude of the electric energy.
承上所述,因依據本發明之一種發光裝置係利用光感測控制單元在接受到點亮後之發光單元的光線後,即會產生漏電流的特性,來消耗或調節儲存於儲能單元中的電能量,並在電能量消耗完後即使得發光單元關閉,藉此即能夠由儲能單元所儲存之電能量決定發光單元的發光時間,以控制發光單元的亮度。或者,可利用光感測元件在接受到發光單元的光照後,即會產生光電流的特性,來調節儲能單元中的電能量進而控制發光單元。藉此,本發明係持續監控發光單元的發光狀態而「自動補償」發光單元的亮度,而非依據預先設置之校準資料來進行補償,使得本發明可不需利用回授及控制器來進行控制,因而大大降低成本。此外,本發明之發光單元設置於光感測元件之上,不僅可縮小發光單元與光感測元件之間的距離,而提升光感測的精確度,並且可縮小發光裝置之尺寸,進而提升產品競爭力。According to the above description, a light-emitting device according to the present invention utilizes a light-sensing control unit to receive a characteristic of leakage current after receiving light from a light-emitting unit after lighting, thereby consuming or adjusting storage in an energy storage unit. The electric energy in the electric energy is turned off after the electric energy is consumed, whereby the electric energy stored by the energy storage unit can determine the lighting time of the light emitting unit to control the brightness of the light emitting unit. Alternatively, the light sensing element can be used to adjust the electrical energy in the energy storage unit to control the light emitting unit after receiving the illumination of the light emitting unit. Therefore, the present invention continuously monitors the illumination state of the illumination unit and "automatically compensates" the brightness of the illumination unit, instead of compensating according to the preset calibration data, so that the present invention can be controlled without using feedback and controller. This greatly reduces costs. In addition, the light emitting unit of the present invention is disposed on the light sensing component, which not only reduces the distance between the light emitting unit and the light sensing component, but also improves the accuracy of the light sensing, and can reduce the size of the light emitting device, thereby improving Product competitiveness.
以下將參照相關圖式,說明依本發明較佳實施例之一種發光裝置,其中相同的元件將以相同的參照符號加以說明。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a light-emitting device according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings, wherein the same elements will be described with the same reference numerals.
請參照圖2所示,依據本發明較佳實施例之發光裝置2係包含至少一發光單元21、一第一開關單元22、一儲能單元23以及一光感測控制單元24。Referring to FIG. 2, the illuminating device 2 according to the preferred embodiment of the present invention includes at least one illuminating unit 21, a first switching unit 22, an energy storage unit 23, and a light sensing control unit 24.
發光單元21係可包含至少一冷陰極螢光燈、一熱陰極螢光燈或一發光二極體。於本實施例中,發光單元21係以一個發光二極體為例。另外,發光二極體可以是白色發光二極體、紅色發光二極體、綠色發光二極體、藍色發光二極體或其他色光之二極體,當然發光單元21也具有複數個發光二極體,且該等發光二極體可以混成白光、其他波長的色光或為單一色光。另外,發光單元21中的發光二極體,可為一裸晶或一封裝元件,於此係以發光二極體為裸晶為例。The light emitting unit 21 can include at least one cold cathode fluorescent lamp, a hot cathode fluorescent lamp or a light emitting diode. In the embodiment, the light-emitting unit 21 is exemplified by one light-emitting diode. In addition, the light emitting diode may be a white light emitting diode, a red light emitting diode, a green light emitting diode, a blue light emitting diode or other color light diode. Of course, the light emitting unit 21 also has a plurality of light emitting diodes. The polar body, and the light emitting diodes may be mixed into white light, color light of other wavelengths or single color light. In addition, the light emitting diode in the light emitting unit 21 may be a bare crystal or a package component, and the light emitting diode is a bare crystal as an example.
第一開關單元22係與發光單元21電性連接,兩者可並聯或串聯連接,於此係以串聯連接為例。其中,第一開關單元22係包含一開關元件,其可例如為一雙載子電晶體(BJT)或一場效電晶體(FET)。於本實施例中,第一開關單元22係以MOS場效電晶體為例。The first switching unit 22 is electrically connected to the light emitting unit 21, and the two can be connected in parallel or in series, and the serial connection is taken as an example. The first switching unit 22 includes a switching element, which may be, for example, a bipolar transistor (BJT) or a field effect transistor (FET). In the embodiment, the first switching unit 22 is exemplified by a MOS field effect transistor.
儲能單元23係與第一開關單元22電性連接,並儲存一電能量。於本實施例中,儲能單元23係例如為一電荷儲存單元,且電荷儲存單元包含一電容器,而電能量則係以電壓形式儲存於電容器中。當然,依據不同儲能單元23的特性,電能量可以不同的型式(例如電流)儲存於儲能單元23中。另外,儲能單元23若以積體電路形式存在則可為平板電容。The energy storage unit 23 is electrically connected to the first switching unit 22 and stores an electric energy. In this embodiment, the energy storage unit 23 is, for example, a charge storage unit, and the charge storage unit includes a capacitor, and the electrical energy is stored in the capacitor in a voltage form. Of course, depending on the characteristics of the different energy storage units 23, the electrical energy can be stored in the energy storage unit 23 in different types (eg, current). Further, the energy storage unit 23 may be a flat capacitor if it exists in the form of an integrated circuit.
光感測控制單元24係與儲能單元23電性連接,並感測發光單元21之一發光能量,並依據發光能量來調節電能量大小,而第一開關單元22係依據儲能單元23所儲存之電能量大小進行開(turn on)、關(turn off)的動作,以控制發光單元21發光與否。在此所謂的開、關動作是指第一開關單元22依據電能量較大的幅度轉變所做的動作。於本實施例中,光感測控制單元24係可包含一光感測元件,其可例如為感光二極體(photo diode)或光敏電阻。於此,光感測控制單元24係與儲能單元23並聯連接。另外,光感測控制單元24亦可包含一控制迴路,並將其與光感測元件電性連接,以作額外的控制。The light sensing control unit 24 is electrically connected to the energy storage unit 23, and senses one of the light-emitting energy of the light-emitting unit 21, and adjusts the electric energy according to the light-emitting energy, and the first switch unit 22 is configured according to the energy storage unit 23. The stored electric energy amount is turned on and turned off to control whether the light emitting unit 21 emits light or not. The so-called on and off actions herein refer to the actions performed by the first switching unit 22 in accordance with a large amplitude of electrical energy. In this embodiment, the light sensing control unit 24 can include a light sensing component, which can be, for example, a photo diode or a photoresistor. Here, the light sensing control unit 24 is connected in parallel with the energy storage unit 23. In addition, the light sensing control unit 24 can also include a control loop and electrically connect it to the light sensing component for additional control.
需注意者,於此所述之電性連接係可為直接電性連接或間接電性連接,而所謂的間接電性連接係指二元件之間藉由另一元件使其相互電性連接之意。It should be noted that the electrical connection described herein may be a direct electrical connection or an indirect electrical connection, and the so-called indirect electrical connection means that the two components are electrically connected to each other by another component. meaning.
以下,請參照圖3A及圖3B,其係本發明較佳實施例之發光裝置之結構示意圖。Hereinafter, please refer to FIG. 3A and FIG. 3B , which are schematic structural diagrams of a light-emitting device according to a preferred embodiment of the present invention.
請參照圖2及圖3A所示,本實施例之光感測控制單元24及其光感測元件係位於一積體電路IC,而發光單元21設置於積體電路IC之上,亦即發光單元21設置於光感測元件之上,且兩者可直接連結或透過一元件而間接連結。於本實施例中,光感測元件係位於積體電路IC內,而第一開關單元22及/或儲能單元23可位於積體電路IC或位於另一積體電路。於此,光感測元件、第一開關單元22及儲能單元23皆位於積體電路IC。發光單元21係藉由打線接合而與積體電路IC內之第一開關單元22電性連接。當然,在積體電路IC中,光感測元件與第一開關單元22及儲能單元23係藉由積體電路IC內之線路而電性連接。此外,積體電路IC係藉由打線接合而與一電路基板25上之線路電性連接。As shown in FIG. 2 and FIG. 3A , the light sensing control unit 24 and the light sensing component of the embodiment are located in an integrated circuit IC, and the light emitting unit 21 is disposed on the integrated circuit IC, that is, the light is emitted. The unit 21 is disposed on the light sensing element, and the two can be directly connected or indirectly connected through an element. In this embodiment, the photo sensing element is located in the integrated circuit IC, and the first switching unit 22 and/or the energy storage unit 23 may be located in the integrated circuit IC or in another integrated circuit. Here, the photo sensing element, the first switching unit 22 and the energy storage unit 23 are all located in the integrated circuit IC. The light emitting unit 21 is electrically connected to the first switching unit 22 in the integrated circuit IC by wire bonding. Of course, in the integrated circuit IC, the photo sensing element and the first switching unit 22 and the energy storage unit 23 are electrically connected by a line in the integrated circuit IC. Further, the integrated circuit IC is electrically connected to a line on a circuit board 25 by wire bonding.
圖3B顯示另一態樣,其中發光單元21係打線接合於電路基板25a,並藉由電路基板25a上之線路與積體電路IC之第一開關單元22電性連接。FIG. 3B shows another aspect in which the light emitting unit 21 is wire bonded to the circuit substrate 25a, and is electrically connected to the first switching unit 22 of the integrated circuit IC by a line on the circuit substrate 25a.
在本實施例中,發光裝置2更包含一封裝膠26,其係覆蓋發光單元21與光感測元件。於此,封裝膠26係覆蓋發光單元21與積體電路IC,亦即封裝膠26亦覆蓋第一開關單元22及儲能單元23。In the embodiment, the light-emitting device 2 further includes an encapsulant 26 covering the light-emitting unit 21 and the light sensing element. Here, the encapsulant 26 covers the light emitting unit 21 and the integrated circuit IC, that is, the encapsulant 26 also covers the first switching unit 22 and the energy storage unit 23.
另外,若發光二極體係為具有顏色之發光二極體,為了能夠針對特定波長範圍作感光,則光感測控制單元24還可包含一彩色濾光片或一彩色濾光層。彩色濾光片(層)對應於發光二極體的發光波長,其可以是紅色濾光片(層)、綠色濾光片(層)、藍色濾光片(層)或白色濾光片(層),甚至也可以是紅外線濾光片(層)。In addition, if the light emitting diode system is a color light emitting diode, the light sensing control unit 24 may further include a color filter or a color filter layer in order to be sensitive to a specific wavelength range. The color filter (layer) corresponds to the light-emitting wavelength of the light-emitting diode, which may be a red filter (layer), a green filter (layer), a blue filter (layer) or a white filter ( Layer), even an infrared filter (layer).
承上所述,於本實施例中,不論發光裝置2、2a、2b係具有單一發光單元21或複數個發光單元21,發光裝置2、2a、2b皆能夠維持其總發光能量能夠一致。以下係以圖2所示之電路來進一步說明本發明之發光裝置2、2a、2b。Q表示電容器所儲存的電荷量(charge),亦即儲能單元23所儲存的電荷量;C表示電容器之電容量(capacitance),亦即儲能單元23之電容量;V表示電容器之跨壓,亦即儲能單元23之跨壓;t表示電容放電時間;α表示已知係數;I表示流經光感測控制單元24之電流;L表示發光單元21之發光功率;E表示發光單元之總發光能量,而其總發光能量之方程式推導如下:As described above, in the present embodiment, regardless of whether the illuminating device 2, 2a, 2b has a single illuminating unit 21 or a plurality of illuminating units 21, the illuminating devices 2, 2a, 2b can maintain their total illuminating energy consistent. Hereinafter, the light-emitting devices 2, 2a, 2b of the present invention will be further described by the circuit shown in FIG. Q represents the charge stored by the capacitor, that is, the amount of charge stored in the energy storage unit 23; C represents the capacitance of the capacitor, that is, the capacitance of the energy storage unit 23; V represents the voltage across the capacitor That is, the voltage across the energy storage unit 23; t represents the capacitance discharge time; α represents the known coefficient; I represents the current flowing through the light sensing control unit 24; L represents the luminous power of the light-emitting unit 21; E represents the light-emitting unit The total luminescence energy, and the equation of its total luminescence energy is derived as follows:
Q =I *t =C *V (1) Q = I * t = C * V (1)
I =α*L (3) I =α* L (3)
由式(1)至(4)可得知,由於流經光感測控制單元24之電流I與發光單元21之發光功率L呈正比關係,而電容器之電容量值C係為一固定值,故發光單元21之總發光能量E即可由電容器之跨壓V(即輸入電容器之電壓)所決定,也因此能夠免除必需藉由控制發光單元21的發光功率來維持其發光能量。換言之,當發光單元21之發光功率比較大時,則光感測控制單元24將會使電容器所儲存之電能量比較快速消耗;反之,當發光單元21之發光功率比較小時,則光感測控制單元24將會使電容器所儲存之電能量比較慢消耗,進而達到在不同的發光功率下,仍可以維持發光單元21之總發光能量一致的效果。It can be seen from the formulas (1) to (4) that since the current I flowing through the light sensing control unit 24 is proportional to the luminous power L of the light emitting unit 21, and the capacitance value C of the capacitor is a fixed value, Therefore, the total luminous energy E of the light-emitting unit 21 can be determined by the voltage across the capacitor V (i.e., the voltage of the input capacitor), and thus it is possible to eliminate the necessity of maintaining the luminous energy by controlling the luminous power of the light-emitting unit 21. In other words, when the light-emitting power of the light-emitting unit 21 is relatively large, the light-sensing control unit 24 will cause the electrical energy stored in the capacitor to be consumed relatively quickly; conversely, when the light-emitting power of the light-emitting unit 21 is relatively small, the light-sensing control The unit 24 will make the electrical energy stored by the capacitor relatively slow to consume, thereby achieving the effect of maintaining the uniform luminous energy of the light-emitting unit 21 at different luminous powers.
當儲能單元23所儲存之電能量足以導通第一開關單元22時,第一開關單元22被導通且發光單元21同時被點亮,於此同時,光感測控制單元24接受發光單元21所產生的光線照射而開始漏電並消耗儲能單元23所儲存之電能量。於本實施例中,光感測控制單元24係以定電流放電來消耗電能量,其放電速率係與發光單元21之亮度約呈正比關係。另外,當發光單元21之發光能量越強,則光感測控制單元24消耗電能量的速率也越快。而當電能量被消耗完後(即電壓小於第一開關單元22之導通臨界電壓值),第一開關單元22隨即關閉,而發光單元21亦隨之關閉而終止發光。承上,本發明係持續監控發光單元21的發光狀態而「自動補償」發光單元21的亮度,而非依據預先設置之校準資料來進行補償。When the electrical energy stored by the energy storage unit 23 is sufficient to turn on the first switching unit 22, the first switching unit 22 is turned on and the light emitting unit 21 is simultaneously illuminated, while the light sensing control unit 24 accepts the light emitting unit 21 The generated light is irradiated to start leakage and consume the electric energy stored in the energy storage unit 23. In the present embodiment, the light sensing control unit 24 consumes electrical energy by constant current discharge, and its discharge rate is approximately proportional to the brightness of the light emitting unit 21. In addition, the stronger the illuminating energy of the light emitting unit 21, the faster the rate at which the light sensing control unit 24 consumes electric energy. When the electrical energy is consumed (ie, the voltage is less than the conduction threshold voltage of the first switching unit 22), the first switching unit 22 is turned off, and the lighting unit 21 is also turned off to terminate the illumination. As described above, the present invention continuously monitors the light-emitting state of the light-emitting unit 21 and "automatically compensates" the brightness of the light-emitting unit 21, instead of compensating according to preset calibration data.
在此,要特別說明的是,於本實施例中係藉由光感測控制單元24感測發光單元21之發光能量,並據以消耗電容器之電能量;反之,亦可藉由光感測控制單元24感測發光單元21之發光能量,並據以增加電容器之電能量,此時上述的t則是代表充電時間。總而言之,即是可藉由光感測控制單元24感測發光單元21之發光能量,據以調節儲能單元23之電能量大小。In this embodiment, in the embodiment, the light-emitting energy of the light-emitting unit 21 is sensed by the light-sensing control unit 24, and the electrical energy of the capacitor is consumed; otherwise, the light is sensed. The control unit 24 senses the illuminating energy of the illuminating unit 21 and accordingly increases the electric energy of the capacitor. At this time, the above t represents the charging time. In summary, the illuminating energy of the illuminating unit 21 can be sensed by the photo sensing control unit 24 to adjust the electric energy of the energy storage unit 23.
本實施例藉由將發光單元21設置於光感測元件(於積體電路IC)之上,不僅可縮小發光單元21與光感測元件之間的距離,而提升光感測的精確度,並且可縮小發光單元與光感測元件所佔據之範圍,進而縮小發光裝置的尺寸。本實施例中,光感測元件感測發光單元21之發光能量於結構上有多種方式,以下舉例說明。In this embodiment, by disposing the light emitting unit 21 on the light sensing element (on the integrated circuit IC), not only the distance between the light emitting unit 21 and the light sensing element can be reduced, but the accuracy of the light sensing is improved. Moreover, the range occupied by the light-emitting unit and the light sensing element can be reduced, thereby reducing the size of the light-emitting device. In this embodiment, the light sensing element senses the illuminating energy of the illuminating unit 21 in various ways, which is exemplified below.
如圖4A所示,發光單元21設置於積體電路IC之一上表面S1,光感測元件之一感光區係位於上表面S1,並且發光單元21於上表面S1上具有一投影區(以垂直投影為例),感光區與投影區至少部分重疊,且感光區與投影區之面積尺寸可不相同。於此係以發光單元21直接設置於上表面S1,且投影區與感光區完全重疊為例。在本實施例中,發光單元21之發光二極體需將靠近表面S1的遮光基板或遮光層去除,以使光感測元件可感測發光二極體的底部出光,據以調節儲能單元(圖中未顯示)之電能量大小。As shown in FIG. 4A, the light emitting unit 21 is disposed on an upper surface S1 of the integrated circuit IC, one photosensitive region of the light sensing element is located on the upper surface S1, and the light emitting unit 21 has a projection area on the upper surface S1 ( For vertical projection, for example, the photosensitive area and the projection area at least partially overlap, and the area of the photosensitive area and the projection area may be different. Here, the light-emitting unit 21 is directly disposed on the upper surface S1, and the projection area and the photosensitive area are completely overlapped as an example. In this embodiment, the light-emitting diode of the light-emitting unit 21 needs to remove the light-shielding substrate or the light-shielding layer near the surface S1, so that the light-sensing element can sense the bottom of the light-emitting diode, thereby adjusting the energy storage unit. The amount of electrical energy (not shown).
如圖4B所示,其係發光單元21與積體電路IC1之俯視圖以利說明感光區的另一種配置方式,其中光感測控制單元24、儲能單元23及第一開關單元22皆位於積體電路IC1內。發光單元21具有一投影區,光感測元件之感光區(斜線部分)係位於該投影區之周圍。在此態樣中,發光二極體的底面不出光,光感測元件係感測發光二極體的側面出光,據以調節儲能單元(圖中未顯示)之電能量大小。As shown in FIG. 4B, it is a top view of the light-emitting unit 21 and the integrated circuit IC1 to illustrate another configuration of the photosensitive region, wherein the light sensing control unit 24, the energy storage unit 23, and the first switching unit 22 are located in the product. Inside the body circuit IC1. The light emitting unit 21 has a projection area, and the photosensitive area (hatched portion) of the light sensing element is located around the projection area. In this aspect, the bottom surface of the light emitting diode does not emit light, and the light sensing component senses the side light of the light emitting diode, thereby adjusting the electrical energy of the energy storage unit (not shown).
另外,在本實施例中,發光單元21、第一開關單元22、儲能單元23以及光感測控制單元24具有多種設置方式,以下舉例說明之。In addition, in the embodiment, the light emitting unit 21, the first switching unit 22, the energy storage unit 23, and the light sensing control unit 24 have various setting manners, which are exemplified below.
如圖5A所示,第一開關單元22、儲能單元23以及光感測控制單元24位於同一個積體電路IC中,而積體電路IC設置於一導線架27上,並藉由打線接合而與導線架27電性連接。發光單元21設置於積體電路IC上,並打線接合於積體電路IC上。封裝膠26a係包覆發光單元21及積體電路IC,而形成一封裝體。As shown in FIG. 5A, the first switching unit 22, the energy storage unit 23, and the light sensing control unit 24 are located in the same integrated circuit IC, and the integrated circuit IC is disposed on a lead frame 27 and bonded by wire bonding. The lead frame 27 is electrically connected. The light emitting unit 21 is disposed on the integrated circuit IC and is wire bonded to the integrated circuit IC. The encapsulant 26a encapsulates the light-emitting unit 21 and the integrated circuit IC to form a package.
如圖5B所示,光感測控制單元24位於一積體電路IC2,且積體電路IC2設置於一電路基板25b上。第一開關單元22與儲能單元23位於另一積體電路IC3,且積體電路IC3亦設置於電路基板25b上。發光單元21藉由打線接合而與積體電路IC3電性連接,積體電路IC2藉由電路基板25b之線路與積體電路IC3的第一開關單元22與儲能單元23電性連接,而積體電路IC3係藉由打線接合而與電路基板25b電性連接。需注意的是,積體電路IC3也可以是以覆晶接合方式而與電路基板25b電性連接。而發光單元21可先打線與電路基板25b電性連接。As shown in FIG. 5B, the photo sensing control unit 24 is located in an integrated circuit IC2, and the integrated circuit IC2 is disposed on a circuit substrate 25b. The first switching unit 22 and the energy storage unit 23 are located in the other integrated circuit IC3, and the integrated circuit IC3 is also disposed on the circuit substrate 25b. The light-emitting unit 21 is electrically connected to the integrated circuit IC3 by wire bonding. The integrated circuit IC2 is electrically connected to the first switching unit 22 of the integrated circuit IC3 and the energy storage unit 23 by the circuit of the circuit substrate 25b. The bulk circuit IC3 is electrically connected to the circuit board 25b by wire bonding. It should be noted that the integrated circuit IC3 may be electrically connected to the circuit board 25b by flip chip bonding. The light emitting unit 21 can be electrically connected to the circuit substrate 25b by first wire bonding.
如圖5C所示,與上述態樣不同的是,發光單元21與積體電路IC3皆藉由打線接合而與電路基板25c電性連接。As shown in FIG. 5C, unlike the above aspect, the light-emitting unit 21 and the integrated circuit IC3 are electrically connected to the circuit board 25c by wire bonding.
如圖5D所示,光感測控制單元24a係為封裝體形式,發光單元21設置於光感測控制單元24a上。第一開關單元22與儲能單元23位於積體電路IC3。發光單元21藉由打線接合而與積體電路IC3電性連接,而光感測控制單元24a藉由表面接合而與電路基板25d電性連接,並藉由電路基板25d上之線路而與積體電路IC3電性連接。在圖5B至圖5D之態樣中,封裝膠可選擇性覆蓋發光單元21及積體電路IC2、及/或積體電路IC3。As shown in FIG. 5D, the light sensing control unit 24a is in the form of a package, and the light emitting unit 21 is disposed on the light sensing control unit 24a. The first switching unit 22 and the energy storage unit 23 are located in the integrated circuit IC3. The light-emitting unit 21 is electrically connected to the integrated circuit IC3 by wire bonding, and the light sensing control unit 24a is electrically connected to the circuit substrate 25d by surface bonding, and is integrated with the circuit on the circuit substrate 25d. The circuit IC3 is electrically connected. In the aspect of FIG. 5B to FIG. 5D, the encapsulant can selectively cover the light emitting unit 21 and the integrated circuit IC2, and/or the integrated circuit IC3.
最後,在電路實施上,本實施例可有多種態樣,以下舉例說明之,但不用以限制本發明。Finally, in the implementation of the circuit, the embodiment can have various aspects, which are exemplified below, but are not intended to limit the present invention.
如圖6A所示,發光裝置2更可包括一第二開關單元28、一電源供應單元30以及一限流單元29。其中,第二開關單元28係與儲能單元23電性連接,並藉由控制第二開關單元28,以將電能量輸入至儲能單元23中。電源供應單元30係與發光單元21電性連接,並提供一電源至發光單元21。限流單元29係分別與電源供應單元30以及發光單元21電性連接,以限制驅動發光單元21發光之電源強度,避免過大的電源強度損壞發光單元21。於本實施例中,第二開關單元28可與第一開關單元22相同係包括雙載子電晶體或場效電晶體;電源供應單元30例如為一電壓源或一電流源,其係提供一直流電源至發光單元21;限流單元29係為一電阻器。As shown in FIG. 6A, the illuminating device 2 further includes a second switching unit 28, a power supply unit 30, and a current limiting unit 29. The second switch unit 28 is electrically connected to the energy storage unit 23 and controls the second switch unit 28 to input electrical energy into the energy storage unit 23 . The power supply unit 30 is electrically connected to the light emitting unit 21 and supplies a power source to the light emitting unit 21. The current limiting unit 29 is electrically connected to the power supply unit 30 and the light emitting unit 21, respectively, to limit the power intensity of the light that drives the light emitting unit 21 to emit light, and to avoid damaging the light emitting unit 21 by excessive power intensity. In this embodiment, the second switching unit 28 can be the same as the first switching unit 22, including a bipolar transistor or a field effect transistor; the power supply unit 30 is, for example, a voltage source or a current source, which provides The power is supplied to the light emitting unit 21; the current limiting unit 29 is a resistor.
另外,於本實施例中,第一開關單元22、儲能單元23、光感測控制單元24以及第二開關單元28之至少其中之二係可設置於一積體電路中。而更進一步,第一開關單元22、儲能單元23、光感測控制單元24、第二開關單元28以及限流單元29之至少其中之二亦可設置於一積體電路。In addition, in this embodiment, at least two of the first switching unit 22, the energy storage unit 23, the light sensing control unit 24, and the second switching unit 28 may be disposed in an integrated circuit. Further, at least two of the first switching unit 22, the energy storage unit 23, the light sensing control unit 24, the second switching unit 28, and the current limiting unit 29 may be disposed in an integrated circuit.
當第二開關單元28導通時,發光裝置2係將電能量(電壓)經由第二開關單元28而輸入至儲能單元23。而當儲能單元23所儲存之電能量足以導通第一開關單元22時,在第一開關單元22導通時則發光單元21同時被點亮,於此同時,光感測控制單元24接受發光單元21所產生的光線照射而開始漏電並消耗儲能單元23所儲存之電能量。於本實施例中,光感測控制單元24係以定電流放電來消耗電能量,其放電速率係與發光單元21之亮度約呈正比關係。另外,當發光單元21之發光能量越強,則光感測控制單元24消耗電能量的速率也越快。而當電能量被消耗完後(即電壓小於第一開關單元22之導通臨界電壓值),第一開關單元22隨即關閉,而發光單元21亦隨之關閉而終止發光。When the second switching unit 28 is turned on, the light-emitting device 2 inputs electric energy (voltage) to the energy storage unit 23 via the second switching unit 28. When the electric energy stored in the energy storage unit 23 is sufficient to turn on the first switching unit 22, the light emitting unit 21 is simultaneously illuminated when the first switching unit 22 is turned on, and at the same time, the light sensing control unit 24 accepts the light emitting unit. The light generated by the 21 is irradiated to start leakage and consumes the electric energy stored in the energy storage unit 23. In the present embodiment, the light sensing control unit 24 consumes electrical energy by constant current discharge, and its discharge rate is approximately proportional to the brightness of the light emitting unit 21. In addition, the stronger the illuminating energy of the light emitting unit 21, the faster the rate at which the light sensing control unit 24 consumes electric energy. When the electrical energy is consumed (ie, the voltage is less than the conduction threshold voltage of the first switching unit 22), the first switching unit 22 is turned off, and the lighting unit 21 is also turned off to terminate the illumination.
然而,在實際的設計考量下,如圖6B所示,第一開關單元22與發光單元21亦可以並聯的方式連接,仍然能夠達到藉由光感測控制單元24感測發光單元21之發光能量,以調節電容器之電能量大小,進而控制發光單元21的功效。However, in actual design considerations, as shown in FIG. 6B, the first switch unit 22 and the light-emitting unit 21 can also be connected in parallel, and the light-emitting energy of the light-emitting unit 21 can still be sensed by the light-sensing control unit 24. In order to adjust the electrical energy of the capacitor, thereby controlling the efficacy of the light-emitting unit 21.
綜上所述,因依據本發明之一種發光裝置係利用光感測控制單元在接受到點亮後之發光單元的光線後,即會產生漏電流的特性,來消耗或調節儲存於儲能單元中的電能量,並在電能量消耗完後即使得發光單元關閉,藉此即能夠由儲能單元所儲存之電能量決定發光單元的發光時間,以控制發光單元的亮度。或者,可利用光感測元件在接受到發光單元的光照後,即會產生光電流的特性,來調節儲能單元中的電能量進而控制發光單元。藉此,本發明係持續監控發光單元的發光狀態而「自動補償」發光單元的亮度,而非依據預先設置之校準資料來進行補償,使得本發明可不需利用回授及控制器來進行控制,因而大大降低成本。此外,本發明之發光單元設置於光感測元件之上,不僅可縮小發光單元與光感測元件之間的距離,而提升光感測的精確度,並且可縮小發光裝置之尺寸,進而提升產品競爭力。In summary, the illuminating device according to the present invention uses the light sensing control unit to receive the light of the illuminating unit after the lighting, and then generates a leakage current characteristic to consume or adjust the storage in the energy storage unit. The electric energy in the electric energy is turned off after the electric energy is consumed, whereby the electric energy stored by the energy storage unit can determine the lighting time of the light emitting unit to control the brightness of the light emitting unit. Alternatively, the light sensing element can be used to adjust the electrical energy in the energy storage unit to control the light emitting unit after receiving the illumination of the light emitting unit. Therefore, the present invention continuously monitors the illumination state of the illumination unit and "automatically compensates" the brightness of the illumination unit, instead of compensating according to the preset calibration data, so that the present invention can be controlled without using feedback and controller. This greatly reduces costs. In addition, the light emitting unit of the present invention is disposed on the light sensing component, which not only reduces the distance between the light emitting unit and the light sensing component, but also improves the accuracy of the light sensing, and can reduce the size of the light emitting device, thereby improving Product competitiveness.
以上所述僅為舉例性,而非為限制性者。任何未脫離本發明之精神與範疇,而對其進行之等效修改或變更,均應包含於後附之申請專利範圍中。The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the invention are intended to be included in the scope of the appended claims.
11...發光二極體11. . . Light-emitting diode
12...光感測器12. . . Light sensor
13...控制器13. . . Controller
2、2a~2f...發光裝置2, 2a ~ 2f. . . Illuminating device
21...發光單元twenty one. . . Light unit
22...第一開關單元twenty two. . . First switch unit
23...儲能單元twenty three. . . Energy storage unit
24、24a...光感測控制單元24, 24a. . . Light sensing control unit
25、25a、25b、25c、25d...電路基板25, 25a, 25b, 25c, 25d. . . Circuit substrate
26、26a...封裝膠26, 26a. . . Packaging adhesive
27...導線架27. . . Lead frame
28...第二開關單元28. . . Second switching unit
29...限流單元29. . . Current limiting unit
30...電源供應單元30. . . Power supply unit
IC、IC1、IC2、IC3...積體電路IC, IC1, IC2, IC3. . . Integrated circuit
S1...上表面S1. . . Upper surface
圖1A為一種習知背光模組之亮度控制的示意圖;1A is a schematic diagram of brightness control of a conventional backlight module;
圖1B為一種習知背光模組的分區示意圖;FIG. 1B is a schematic diagram of a partition of a conventional backlight module; FIG.
圖2為本發明較佳實施例之發光裝置的方塊示意圖;2 is a block diagram of a light emitting device according to a preferred embodiment of the present invention;
圖3A及圖3B為本發明較佳實施例之發光單元與光感測元件的設置示意圖;3A and 3B are schematic diagrams showing the arrangement of a light emitting unit and a light sensing element according to a preferred embodiment of the present invention;
圖4A及圖4B為本發明較佳實施例之發光單元之投影區與光感測元件之感光區的關係示意圖;4A and FIG. 4B are schematic diagrams showing the relationship between a projection area of a light emitting unit and a photosensitive area of a light sensing element according to a preferred embodiment of the present invention;
圖5A至圖5D為本發明較佳實施例之發光裝置之各元件具有不同設置態樣的示意圖;以及5A to 5D are schematic diagrams showing different arrangements of components of a light-emitting device according to a preferred embodiment of the present invention;
圖6A及圖6B為本發明較佳實施例之發光裝置之不同態樣之方塊示意圖。6A and 6B are block diagrams showing different aspects of a light-emitting device according to a preferred embodiment of the present invention.
2...發光裝置2. . . Illuminating device
21...發光單元twenty one. . . Light unit
22...第一開關單元twenty two. . . First switch unit
23...儲能單元twenty three. . . Energy storage unit
24...光感測控制單元twenty four. . . Light sensing control unit
Claims (16)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98141788A TWI433598B (en) | 2009-12-07 | 2009-12-07 | Light emitting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98141788A TWI433598B (en) | 2009-12-07 | 2009-12-07 | Light emitting apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201121365A TW201121365A (en) | 2011-06-16 |
| TWI433598B true TWI433598B (en) | 2014-04-01 |
Family
ID=45045541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98141788A TWI433598B (en) | 2009-12-07 | 2009-12-07 | Light emitting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI433598B (en) |
-
2009
- 2009-12-07 TW TW98141788A patent/TWI433598B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TW201121365A (en) | 2011-06-16 |
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