TWI432944B - A dual fan heat dissipation device - Google Patents

Description

Dual fan heat sink

The invention relates to a heat sink of a circuit board or an electronic device, and more particularly to a dual fan heat sink having a structural design of a relatively inclined fan.

With the rapid development of technology, electronic devices have become a trend by using higher-order integrated circuits to improve their computing power. However, when the integrated circuit performs an operation, the integrated circuit generates a large amount of thermal energy, and the heat dissipation device is required to assist the integrated circuit to dissipate heat. Currently, the heat sink includes a single fan and a dual fan design. At present, there are various methods, for example, the "heat sink" patent case of Taiwan No. 587769 discloses a method of installing a heat dissipating device on a heating element, and the heat dissipating device comprises more than one air inlet fan and a row of air fan; Taiwan 200644780 "Double Fan Cooling Module" patent case discloses a dual fan cooling module, which is a method in which a first centrifugal fan and a second centrifugal fan are arranged side by side in a casing; Taiwan 545104 "Heat Dissipation Device" patent discloses a heat sink device with a first fan and a second fan, with a plurality of heat pipes and a plurality of heat sinks; Taiwan 577582 "double heat module structure" patent case system Disclosed is a method in which a main heat sink and a heat sink are connected in series through a plurality of heat pipes, and the main heat sink and the heat sink respectively include The method of a fan and a fin set; Taiwan Patent No. 200410626 "Electronic Component Heat Dissipation Device" discloses a method of adding a third heat sink between a first fan and a second fan; Taiwan M245506 "forced exhaust type" The computer host heat sink device discloses a method of disposing a first fan and a second fan on a first side and a second side of a heat dissipating member; the same or similar to the 587769, 200644780, 545104 The practice of the patents 577582, 200410626 and 200410626 is to set the two fans horizontally. As for the M245506 patent, one of the two fans is provided with a tilting heat dissipating mechanism, but it is still limited to the two fans being disposed on opposite sides of the heat dissipating mechanism.

The present invention provides a new dual fan heat sink that is used on a circuit board. The dual fan heat dissipation device includes a heat dissipation module, a wind hood, a first fan, a second fan and a partition. The hood covers the heat dissipation module, the hood includes a cover plate and a partition member, the lower wall of the cover plate faces the top of the heat dissipation module, and the cover plate has a top and a bottom wall extending therethrough a first through hole and a second through hole, the partitioning member is located between the first through hole and the second through hole, the partition member extends from the lower wall of the cover plate toward the heat dissipation module; The first fan is disposed obliquely on the hood and located in the first through hole; the second fan is disposed obliquely on the hood, and is located in the second through hole, and the center of rotation of the second fan is virtual The axis intersects the virtual axis of the center of rotation of the first fan outside the upper wall of the cover; the partition is disposed in the hood and between the first through hole and the second through hole, the partition The first fan and the second fan are blocked.

Preferably, the first fan is disposed at a first angle, the first angle is an angle between a virtual axis of the rotation center of the first fan and a bottom of the heat dissipation module; and the second fan is a second The angle is inclined, and the second angle is an angle between a virtual axis of the rotation center of the second fan and a bottom of the heat dissipation module.

Preferably, the heat dissipation module is formed by a plurality of fins arranged side by side at intervals. Each of the fins includes a first oblique side and a second oblique side respectively facing the first fan and the second fan. And the first beveled edge conforms to the first fan, and the second beveled edge conforms to the second fan.

Compared with the prior art, the present invention provides a dual-fan heat dissipating device, which is configured to face the two cooling fans in opposite directions to improve the ineffective airflow generated between the first fan and the second fan to improve the heat dissipating device. Cooling efficiency. Moreover, since the partitioning member is disposed between the first fan and the second fan, the partitioning member can also block the mutual interference airflow between the two fans, and can reduce the noise generated by the interference airflow.

Further invention and its effects will be disclosed in the following description.

The first figure shows a preferred example of a dual fan heat sink 1 of the present invention. The dual fan heat sink 1 is used on a circuit board 2, and the dual fan heat sink 1 includes a windshield 3, a first fan 4, and a The second fan 5, a heat dissipation module 6 and a partition member 31. The circuit board 2 can be a display card or a motherboard or the like. The first fan 4 and the second fan 5 are preferably axial fans, but are not limited thereto.

The second figure shows a schematic view of the hood 3 of the dual fan heat sink 1 of the present invention. The windshield 3 covers the heat dissipation module 6. The windshield 3 has a cover 30. The lower wall 300 of the cover 30 faces the top of the heat dissipation module 6, and the cover 30 has a through plate. A first through hole 302 and a second through hole 303 of the upper wall 301 and the lower wall 300.

The partitioning member 31 is disposed in the hood 3 and located between the first through hole 302 and the second through hole 303. The partitioning member 31 blocks the first fan 4 and the second fan 5.

In this embodiment, the partition member 31 extends from the lower wall 300 of the cover plate 30 toward the heat dissipation module 6 , and the partition member 31 has two opposite sidewalls 310 , each of which has an arc shape, and The two side walls 310 face the first fan 4 and the second fan 5, respectively. When the first fan 4 and the second fan 5 are simultaneously activated, airflow in at least two directions is generated to form an interference airflow, so that the airflow can be blocked by the partitioning member 31 to reduce the generation of the dual fan heat sink 1. The noise, and the ineffective area where the airflow interferes with each other. In practical applications, the partitioning member 31 may also block the two fans by using an additional partitioning plate or other means to reduce the ineffective heat dissipation area on the heat dissipation module 6.

The first fan 4 is disposed on the hood 3 and is located in the first through hole 302. The second fan 5 is disposed on the hood 3 obliquely and located in the second through hole 303. The virtual axis of the center of rotation of the fan 5 intersects the virtual axis L1 of the center of rotation of the first fan 4 outside the upper wall 301 of the cover 30. The two fans 4, 5 are arranged as shown in the first figure.

The first fan 4 is inclined at a first angle θ1, which is an angle between the virtual axis L1 of the center of rotation of the first fan 4 and the bottom of the heat dissipation module 6. The second fan 5 is inclined at a second angle θ2, which is an angle between the virtual axis L2 of the rotation center of the second fan 5 and the bottom of the heat dissipation module 6.

The first fan 4 and the second fan 5 can arbitrarily design the inclination angles of the two fans 4 and 5 according to actual design requirements, for example, designing the first fan 4 and the second fan 5 at different angles, or two fans. 4, 5 is designed with a relative angle, but not limited to this. Furthermore, since the two fans 4 and 5 of the present invention are disposed on the hood 3 and are located in the through holes 302 and 303, the first through hole 302 and the second through hole 303 of the cover 30 are also The hole edges of the through holes 302, 303 may be designed to be inclined to face each other with the inclination angle of the fans 4, 5.

In a practical application, the hood 3 further includes a first fixing frame 32 and a second fixing frame 33. The first fixing frame 32 is connected to the hood 3 in accordance with the inclination of the first fan 4, and the The first fixing frame 32 faces the first opening 302 of the cover plate 30. The first fixing frame 32 is provided with the first fan 4, and the second fixing frame 33 is compliant with the inclined connection of the second fan 5. In the hood 3, the second fixing frame 33 faces the second opening 303 of the cover plate 30, and the second fixing frame 33 is provided with the second fan 5. The two fixing brackets 32, 33 can be directly formed in the windshield 3 or connected to the windshield 3 by the frame of the fan 4, 5 itself.

Referring to the third and fourth figures, the heat dissipation module 6 includes a plurality of fins 60, a heat conducting member 61 and a plurality of heat pipes 62 formed by a plurality of fins 60 arranged side by side. Each of the fins 60 includes a first oblique side 601 and a second oblique side 602 respectively facing the first fan 4 and the second fan 5, and the first oblique side 601 conforms to the first fan 4 Tilt, the second bevel 602 is compliant with the tilt of the second fan 5. The hood 6 further includes two opposite side plates 34 extending downward from the cover plate 30. The spaced-apart fins 60 of the heat dissipation module 6 are aligned with the two side plates 34 in the same direction.

In fact, the inclined surface of the first oblique side 601 and the second oblique side 602 of the fin 60 is inclined in a tapered manner or stepped downward in the middle, but the fin 60 may also be designed in a plane or other form. .

The heat conducting member 61 is attached to the bottom of the fins 60. One end of each of the heat conducting tubes 62 extends through the fins 60. The other end of the heat conducting tube 62 extends through the heat conducting member 61. In fact, the heat conducting member 61 is directly attached to the surface of the integrated circuit 20 on the circuit board 2. After the heat conducting member 61 absorbs the heat energy of the integrated circuit 20, the fins 60 and the heat conducting member 61 are penetrated. The heat pipes 62 disperse heat energy to the outside to improve the heat dissipation performance.

In this embodiment, a support member 7 is disposed between the heat dissipation module 6 and the hood 3 against the bottom of the heat dissipation module 6 , and the support member 7 and the hood 3 are locked by screws 70 . The screw hole (not shown in the figure), however, the fixing manner of the heat dissipation module 6 and the wind hood 3 can also be achieved by the buckle design, and thus is not limited thereto.

FIG. 5 is a schematic diagram showing a preferred application example of the dual fan heat sink 1 of the present invention. When the first fan 4 and the second fan 5 are relatively tilted, the first fan 4 generates a wind flow. After the air outside the hood 3 enters the heat dissipation module 6 through the air inlet of the heat dissipation module 6, the first fan 4 is discharged from the cover 30 of the hood 3, and the second fan also generates another The wind flow, the air that is discharged from the first fan 4 above the cover plate 30 of the hood 3 enters the heat dissipation module 6 , and is discharged from the air outlet of the heat dissipation module 6 to the outside of the air hood 3 . . However, since the fins 60 of the heat dissipation module 6 are arranged in the same direction as the airflow direction, the dual fan heat dissipation device 1 of the present invention can quickly and smoothly circulate the airflow in the fins to reduce the double The ineffective heat dissipation area between the fans, thereby improving the heat dissipation effect of the circuit board 2.

However, the dual-fan heat dissipating device 1 of the present invention can also use a two-blowing fan to guide external air from the first through hole 302 and the second through hole 303 of the cover 30 of the hood 3 to the heat dissipation module. 6. In order to discharge the hot air in the heat dissipation module 6, the opposite inclined fan design of the present invention can be applied to various heat dissipation mechanisms.

In summary, the dual fan heat dissipating device of the present invention uses the two fans to be relatively inclined to reduce the interference airflow generated between the two fans, thereby improving the integrated circuit or system of the dual fan heat dissipating device on the circuit board. Cooling efficiency. In addition, the partition member can also block the generation of interference airflow between the dual fans and reduce the noise when the dual fans are activated.

In any case, anyone can obtain sufficient teaching from the description of the above examples, and it is understood that the present invention is indeed industrially usable and progressive, and the present invention does not have the same or similar technology in the same field. The disclosure of the prior and full of novelty, the invention has indeed met the requirements of the invention patent, and applied in accordance with the law.

1. . . Dual fan heat sink

2. . . Circuit board

20. . . Integrated circuit

3. . . wind cover

30. . . Cover

300. . . Lower wall

301. . . Upper wall

302. . . First through hole

303. . . Second through hole

31. . . Separator

310. . . Side wall

32. . . First holder

33. . . Second holder

34. . . Side panel

L1, L2. . . Virtual axis

Θ1. . . First angle

Θ2. . . Second angle

4. . . First fan

5. . . Second fan

6. . . Thermal module

60. . . Fin

61. . . Heat conductive member

62. . . Heat pipe

601. . . First hypotenuse

602. . . Second bevel

7. . . supporting item

70. . . Screw

The first figure is a schematic diagram of a dual fan heat sink according to a preferred embodiment of the present invention.

The second figure shows an exploded view of the hood of the first figure and the first fan and the second fan.

The third figure shows a schematic diagram of the heat dissipation module of the first figure.

The fourth figure is an exploded view of the dual fan heat sink of the first figure.

The fifth figure shows the application diagram of the dual fan heat sink of the present invention.

1. . . Dual fan heat sink

2. . . Circuit board

30. . . Cover

300. . . Lower wall

301. . . Upper wall

302. . . First through hole

303. . . Second through hole

31. . . Separator

L1, L2. . . Virtual axis

Θ1. . . First angle

Θ2. . . Second angle

4. . . First fan

5. . . Second fan

6. . . Thermal module

Claims (7)

A dual fan heat sink for a circuit board, the dual fan heat sink comprising: a heat sink module; a wind shield covering the heat sink module, the wind shield having a cover plate, the lower wall of the cover plate Facing the top of the heat dissipation module, the cover has a first through hole and a second through hole extending through the upper and lower walls thereof; a first fan is disposed obliquely on the hood and located at the first a second fan disposed obliquely on the hood and located in the second through hole, the virtual axis of the center of rotation of the second fan intersecting the virtual axis of the center of rotation of the first fan An outer wall of the cover plate; and a partitioning member disposed in the hood and located between the first through hole and the second through hole, the partition blocking the first fan and the second fan, The partition member extends from the lower wall of the cover plate toward the heat dissipation module, and the partition member has two opposite side walls, each side wall is curved, and the two side walls respectively face the first fan and the second side fan. The dual-fan heat dissipating device of claim 1, wherein the first fan is inclined at a first angle, wherein the first angle is a virtual axis of a rotation center of the first fan and a bottom of the heat dissipation module The angle between them. The dual fan heat dissipation device of claim 1, wherein the second fan is inclined at a second angle, wherein the second angle is a virtual axis of the rotation center of the second fan and a bottom of the heat dissipation module. The angle between them. The dual-fan heat dissipating device of claim 1, wherein the hood further comprises a first fixing frame and a second fixing frame, wherein the first fixing frame is connected to the wind according to the inclination of the first fan. Inside the cover, the first fixing frame faces the first opening of the cover plate, the first fixing frame is provided with the first fan, and the second fixing frame is connected to the inclined portion of the second fan a windshield, and the second fixing frame faces the second opening of the cover plate, and the second fixing frame is provided with the second fan. The dual-fan heat dissipating device of claim 1, wherein the heat dissipating module is formed by a plurality of fins arranged side by side, each fin including a first oblique side and a second oblique side, respectively Facing the first fan and the second fan, and the first bevel is compliant with the inclination of the first fan, the second bevel is compliant with the inclination of the second fan. The dual-fan heat dissipating device of claim 1 or 5, wherein the hood further comprises two opposite side plates respectively extending downward from the cover plate, and the intervals of the heat dissipation module The side-by-side fins are arranged in the same direction as the two side plates. The dual-fan heat dissipating device of claim 5, wherein the heat dissipating module further comprises a heat conducting member and a plurality of heat pipes, The heat conducting member is attached to the bottom of the fins, and one end of each heat conducting tube penetrates the fins, and the other end of the heat conducting tube penetrates the heat conducting member.