TWI428605B - Method of Making High Frequency Probe Card - Google Patents

Description

High-frequency probe card manufacturing method

The invention relates to a probe card, in particular to a method for manufacturing a high frequency probe card.

When the semiconductor is tested, the test machine must contact the device under test (DUT) through a probe card, and transmit and analyze the electrical signal to obtain the test result of the test object. The probe card usually comprises a substrate and a plurality of precision-sized probes disposed on the substrate, each probe generating a uniform deformation amount and stress to contact a corresponding solder pad on the object to be tested, so as to reliably transmit the test device. Test signal; at the same time, with the control and analysis procedures of the probe card and the test machine, the purpose of measuring the object to be tested is achieved.

It can be known from the above description that the precision of probe card fabrication is very important. With the advancement of integrated circuit technology, the volume of the wafer is getting smaller and smaller. In order to measure each wafer, the number on the probe card is plural. The distance between the probes is gradually reduced. In addition, the processing speed of the wafer is also improved with the advancement of technology. Therefore, the measurement frequency of the probe card must also be increased to meet the demand of the wafer. The accuracy of the high-frequency probe card greatly affects the accuracy of the measurement. How to accurately perform the alignment of the substrate and the probe during the production process is a problem that the relevant enterprise wants to solve.

For example, the "Inspection unit" of the U.S. Patent No. 7,651,715 discloses a probe card structure. Generally, the probe card is made separately from the substrate, the upper cover and the lower cover. When assembling, the probe is inserted before the substrate. Then, the upper cover and the lower cover are respectively assembled with the substrate by means of alignment, and the probe is fixed in the probe card. The manufacture of the substrate is usually manufactured by a factory, and the procedure for assembling the alignment is mostly purchased from the substrate. The vendor is conducting. In addition, as disclosed in U.S. Patent No. 4,724,180, the patent name is "Electrically shielded connectors", and the probe card disclosed therein must also be manufactured in two stages, and the probe card is inserted and aligned to fix the probe card. Similarly, in general, the process of assembling the alignment is handled by the manufacturer who purchased the substrate. As mentioned above, in the module of the high-frequency probe, the precision required for assembly alignment is quite high, which is time-consuming and labor-intensive, which does not meet the needs of today's manufacturers.

The main object of the present invention is to reduce the production time and cost of the probe card.

Another object of the present invention is to improve the alignment accuracy of the probe card.

To achieve the above objective, the present invention provides a method for fabricating a high frequency probe card, which comprises the following steps:

S1: manufacturing a probe substrate, which is formed into a multilayer structure by lamination, wherein at least two conductive portions are disposed in the multilayer structure during the lamination process for fabricating the probe substrate, and the at least two conductive layers are Each of the portions has a probe ring body and a grounding portion, and the probe ring system is electrically connected to the grounding portion, and the at least two conductive portions are corresponding to each other and disposed in parallel with each other;

S2: forming a signal hole and a grounding hole in each inner ring region of each probe ring body and each of the grounding segments, and the signal hole has a smaller aperture than the inner diameter of the probe ring body;

S3: a first grounding conductor is disposed, the first grounding conductor is disposed in a region of each of the probe ring bodies, and the first grounding conductor is electrically connected to each of the probe ring bodies;

S4: inserting a probe to complete the setting of the signal hole, the grounding hole and the first grounding conductor, respectively, and setting a signal probe and a grounding probe respectively corresponding to the position of the signal hole and the grounding hole, The ground probe contacts each of the ground segments.

Through the above manufacturing process, the substrate, the signal hole and the grounding hole are completed at the time of factory production, and the manufacturer who purchases the substrate only needs to put the probe after receiving the substrate, which does not need to be precise. The alignment program can also reduce the time cost of assembly alignment.

The detailed description and technical contents of the present invention will now be described as follows:

Please refer to FIG. 1 and FIG. 2A to FIG. 2G. FIG. 1 is a perspective view of a preferred embodiment of the present invention. FIG. 2A to FIG. 2G are a preferred embodiment of the present invention. A schematic diagram of a production process, as shown in the figure: The present invention is a method for manufacturing a high frequency probe card, which comprises the following steps:

S1: manufacturing a probe substrate 10 which is formed into a multilayer structure by lamination, wherein at least two conductive portions 13 are disposed in the multilayer structure during the lamination process for fabricating the probe substrate 10, In the embodiment of the present invention, the two conductive portions 13 are representative, and the conductive portion 13 is not limited to a specific design structure according to the circuit layout design of the probe substrate 10, and may be a sheet shape of "FIG. 1". The structure or other structure, and the two conductive portions 13 are symmetric structures and spaced apart to achieve the function of impedance matching, and the probe substrate 10 is made of an insulating material. The insulating material may be a multi-layer ceramic substrate (MLC), a multi-layer organic (MLO), a glass substrate, a germanium substrate or a printed circuit board. In this embodiment, it is a low-temperature co-firing. Low-Temperature Co-fired Ceramics (LTCC). Referring to FIG. 2A and FIG. 2B, when the probe substrate 10 is formed by lamination, the conductive portion 13 is provided in the probe substrate 10. Here, the conductive portion 13 is respectively disposed on the probe substrate. The sides of 10 are close to the surface. When the probe substrate 10 is a multilayer ceramic substrate, the probe substrate 10 can be formed by sintering.

S2: forming a plurality of pinholes, as shown in FIG. 2C, forming a plurality of pinholes on the probe substrate 10, including a signal pinhole 71 and a ground pinhole 72, the signal The pin hole 71 and the ground pin hole 72 are connected to the conductive portion 13, respectively. In FIG. 2C, the signal pinhole 71 and the ground pinhole 72 are drilled or otherwise penetrated on both sides of the probe substrate 10 on the probe substrate 10.

S3: a first grounding conductor 40 is disposed. Please refer to FIG. 2D. The first grounding conductor 40 is formed on the inner wall of the signal pinhole 71. In this embodiment, the first grounding conductor is electrically conductive. The body 40 is disposed on the inner wall surface of the signal pinhole 71 by electroplating after the signal pinhole 71 is completed.

In the step S3, there is a step S3A: a second grounding conductor 41 is disposed, and the second grounding conductor 41 is also formed in the manner of electroplating around the inner wall of the grounding pinhole 72. After the second grounding conductor 41 is disposed, the through hole formed in the second grounding conductor 41 is a grounding hole 12. In the step S3, the second grounding conductor 41 is not a manufacturing process that must be made. When the ground conductor 41 is used, the ground pin hole 72 of "FIG. 2C" does not need to be processed otherwise, and the ground pin hole 72 can be regarded as the ground hole 12. In step S3, since the grounding hole (ie, the grounding pinhole 72) is in communication with the conductive portion 13, the grounding probe 30 is grounded at the end of the process when the grounding probe 30 is placed in the grounding hole (the grounding pinhole 72). Electrically contacting the conductive portion 13, and in step S3A, the second grounding conductor 41 is disposed to strengthen the electrical connection between the conductive portion 13 and the grounding probe 30, and the grounding probe 30 is placed. Placed in the grounding hole 12.

S4: an insulator 50 is provided. Please refer to FIG. 2E. The insulator 50 is disposed on the inner wall of the first grounding conductor 40. Further, after the first grounding conductor 40 is disposed, the insulating material is filled. Forming a through hole on the inner side of the first grounding conductor 40 to cure the insulating material, and then forming a through hole through the two sides of the probe substrate 10 on the insulating material by drilling, thereby forming the insulator 50, The perforation formed here is a signal hole 11.

S5: Inserting a plurality of probes, please refer to FIG. 2F, and placing the signal probe 20 into the corresponding signal hole 11 into which the grounding probe 30 is placed. The signal probe 20 is used by the signal probe 20 The insulator 50 is electrically isolated from the first ground conductor 40, and the ground probe 30 is connected to the second ground conductor 41 disposed in the ground hole 12. It should be noted that if the grounding pin hole 72 is not provided with the second grounding conductor 41, the grounding probe 30 is directly disposed in the grounding pinhole 72. The signal probe 20 and the ground probe 30 are in the form of a pogo pin. Since the signal probe 20 and the grounding probe 30 are arranged corresponding to the positions of the pads on the object to be tested (not shown), the spacing between the signal probe 20 and the grounding probe 30 is fixed and cannot be adjusted. The pitch of the grounding probe 20 and the first grounding conductor 40 can be controlled by the structural design of the first grounding conductor 40 and the second grounding conductor 41. In order to achieve the effect of impedance matching between the signal probe 20 and the first ground conductor 40, the purpose of high frequency testing is achieved. Further, the above process steps are to control the inner and outer diameters of the insulator 50 (ie, the distance between the signal probe 20 and the first ground conductor 40) and the signal probe 20 and the first ground conductor 40. The size of the person.

In addition to the above embodiments, the present invention may also provide a step S6: providing an underlying substrate 60, please refer to FIG. 2G, which is disposed adjacent to an object to be tested (not shown) on the probe substrate 10. On one side, the bottom substrate 60 has a signal fixing hole 61 and a ground fixing hole 62. The signal fixing hole 61 has a smaller aperture than the signal hole 11. The ground fixing hole 62 has a smaller aperture than the ground hole 12. Generally, the probe substrate 10 is disposed on a substrate (not shown) having a space conversion function, and the substrate has a first pitch at adjacent contacts on the upper surface, and adjacent contacts on the lower surface have a second pitch, the first pitch being greater than the second pitch, wherein the spatial conversion is defined as converting a first pitch of the upper surface of the substrate into a second pitch of the lower surface, and placing the lower pitch of the probe substrate 10 The test object is used to make the signal probe 20 and the ground probe 30 point to test the object to be tested. In order to avoid the sliding of the signal probe 20 and the ground probe 30, the bottom substrate 60 provided in step S5 can be used to avoid the object. The signal probe 20 and the ground probe 30 slide down in the direction of the object to be tested.

In addition, please refer to FIG. 3, which is a schematic perspective view of a second embodiment of the present invention. Please refer to FIG. 4A to FIG. 4E for the probe substrate 10a. 3A is a cross-sectional view of AA, and it is necessary to specifically explain that "FIG. 4A" to "FIG. 4E" are schematic diagrams of the process seen according to the AA position of FIG. 3, which is not a regular sectional view, and the steps thereof include:

S1: manufacturing a probe substrate 10a, which is referred to as "FIG. 4A". The probe substrate 10a is formed into a multilayer structure by lamination, wherein at least two conductive portions are provided during the lamination process for fabricating the probe substrate 10a. 13a between the multilayer structure, in the embodiment of the present invention, represented by two conductive portions 13a, and each of the conductive portions 13a has a probe ring body 131 and a grounding portion 132, and the probe ring The body 131 is electrically connected to the grounding portion 132. Specifically, the hollow portion of the inner ring region of the probe ring body 131 is filled with the same plate material as the probe substrate 10a, and the probe substrate 10a is The material is selected from the group consisting of a multilayer ceramic substrate, a multilayer organic substrate, a glass substrate, a germanium substrate, and a printed circuit board. As shown in FIG. 3, the two conductive portions 13a are required to be corresponding to each other and arranged in parallel with each other. It is disposed on both sides of the probe substrate 10a near the surface.

S2: a signal hole 11a and a ground hole 12a are formed in the inner ring region of the probe ring body 131 and the grounding portion 132. Please refer to FIG. 4B. The signal hole 11a and the ground hole 12a are drilled. A hole or other processing manner is formed, and the aperture of the signal hole 11a is smaller than the inner diameter of the probe ring body 131, so that the signal hole 11a and the probe ring body 131 are separated by a certain distance, so that the signal hole 11a The material of the probe substrate 10a itself is electrically insulated from the conductive portion 13a. In this embodiment, the grounding portion 132 needs to be disposed with the grounding hole 12a, so that the probe can be placed in the subsequent step. In the grounding hole 12a, the grounding section 132 is thus formed into a ring structure.

S3: A first grounding conductor 40a is disposed. The first grounding conductor 40a is disposed in a region of the probe ring body 131, and the first grounding conductor 40a is electrically connected to the probe ring body 131. In the present invention, as shown in FIG. 4C and FIG. 4D, the position of the probe substrate 10a corresponding to the probe ring body 131 is processed by drilling or other processing methods. It is processed in the region of the probe ring body 131 to form a hole 42 and then poured into the conductive solution to form the first ground conductor 40a after solidification, or directly after the hole 42 is formed. A wire is placed in 42 as the first ground conductor 40a. In this embodiment, a total of four first ground conductors 40a are disposed, which are disposed in the region of the probe ring body 131 at a distance of 90 degrees. It should be emphasized that since the arrangement of the hole 42 and the signal hole 11a and the ground hole 12a is not in an absolute order relationship, the steps S2 and S3 can be completed in the order of the adjustment.

S4: Inserting the probe, as shown in FIG. 4E, after the signal hole 11a, the grounding hole 12a, and the first grounding conductor 40a are disposed, the corresponding signal hole 11a and the grounding hole 12a are disposed. A signal probe 20 and a ground probe 30 are respectively disposed at positions. The grounding probe 30 is placed in the grounding hole 12a, and the grounding probe 30 is electrically connected to the grounding section 132 by contacting the inner wall of the grounding section 132. Between the signal probe 20 and the probe ring body 131, the probe substrate 10a can be spaced apart to insulate the two. When the probe substrate 10a is fabricated, the distance between the first ground conductor 40a and the signal hole 11a is controlled, and the impedance matching of the signal probe 20 can be controlled to achieve the purpose of high frequency detection.

S5: An underlying substrate (not shown) is provided. The present invention can also provide an underlying substrate in the same manner as the first embodiment, thereby fixing the signal probe 20 and the grounding probe 30. The bottom substrate is disposed on a side of the probe substrate 10a adjacent to an object to be tested, and the bottom substrate has a signal fixing hole and a ground fixing hole. The signal fixing hole has a smaller aperture than the signal hole 11a. The aperture of the fixing hole is smaller than the grounding hole 12a.

In each of the above embodiments, the probe substrate has the effect of a high-frequency probe card, and at least two conductive portions are disposed inside the probe substrate, and the two conductive portions are respectively disposed on the two sides of the probe substrate. Wherein, the two conductive portions need to be parallel to each other, and the two conductive portions can be regarded as an impedance matching structure of a set of signal probes, and the two conductive portions can electrically connect the ground potential of the ground probe to the periphery of the signal probe, To achieve the effect of coaxial or impedance matching, of course, the two conductive parts need to be located at both ends of the signal probe (the two sides of the probe substrate are close to the surface), so that the signal probe has the effect of impedance matching. In the probe substrate of the present invention, a plurality of sets of impedance matching structures (two conductive portions) can be simultaneously provided.

In summary, since the present invention utilizes the above-described manufacturing process, the substrate and the probe hole have been fabricated or sintered at the time of factory production, and the manufacturer who purchases the substrate only needs to insert the probe after receiving the substrate. It does not require precise alignment procedures and reduces the time cost of assembly alignment. In particular, in the case where the conductive portion is built in, the sintering operation or other related processes are directly performed in the production plant by the present invention, and it is possible to avoid the fact that, as in the prior art, it is necessary to divide into three substrates, and after the probe is placed, it is carried out. The assembly of the substrate is aligned, causing problems in alignment. Therefore, the present invention is highly progressive and conforms to the requirements of the invention patent application, and the application is filed according to law, and the praying office grants the patent as soon as possible.

The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.

10, 10a‧‧‧ probe substrate

11, 11a‧‧‧ signal hole

12, 12a‧‧‧ grounding hole

13, 13a‧‧‧Electrical Department

131‧‧‧ probe ring

132‧‧‧ Grounding section

20‧‧‧Signal probe

30‧‧‧ Grounding probe

40, 40a‧‧‧First grounding conductor

41‧‧‧Second grounding conductor

42‧‧‧ holes

50‧‧‧Insulator

60‧‧‧Bottom substrate

61‧‧‧ Signal fixing hole

62‧‧‧Ground fixing hole

71‧‧‧ Signal pinhole

72‧‧‧ Ground pinhole

Figure 1 is a perspective view of a preferred embodiment of the present invention.

2A-2G are schematic diagrams showing a manufacturing process of a preferred embodiment of the present invention.

Fig. 3 is a perspective view showing the structure of a second embodiment of the present invention.

4A-4E are schematic views showing a process of a second embodiment of the present invention.

10‧‧‧Probe substrate

13‧‧‧Electrical Department

20‧‧‧Signal probe

30‧‧‧ Grounding probe

40‧‧‧First grounding conductor

41‧‧‧Second grounding conductor

50‧‧‧Insulator

Claims (10)

A method for manufacturing a high frequency probe card, comprising the following steps:
S1: manufacturing a probe substrate, which is formed into a multilayer structure by lamination, wherein at least two conductive portions are disposed in the multilayer structure during the lamination process for fabricating the probe substrate, and the at least two conductive layers are Each of the portions has a probe ring body and a grounding portion, and the probe ring system is electrically connected to the grounding portion, and the at least two conductive portions are corresponding to each other and disposed in parallel with each other;
S2: forming a signal hole and a grounding hole in each inner ring region of each probe ring body and each of the grounding segments, and the signal hole has a smaller aperture than the inner diameter of the probe ring body;
S3: a first grounding conductor is disposed, the first grounding conductor is disposed in a region of each of the probe ring bodies, and the first grounding conductor is electrically connected to each of the probe ring bodies;
S4: inserting a probe to complete the setting of the signal hole, the grounding hole and the first grounding conductor, respectively, and setting a signal probe and a grounding probe respectively corresponding to the position of the signal hole and the grounding hole, The ground probe contacts each of the ground segments. The method for manufacturing a high-frequency probe card according to claim 1, wherein the material of the probe substrate is selected from the group consisting of a multilayer ceramic substrate, a multilayer organic substrate, a glass substrate, a germanium substrate, and a printed circuit board. Group of. The method for manufacturing a high-frequency probe card according to the second aspect of the invention, wherein the probe substrate is a multilayer ceramic substrate, and the probe substrate is formed by sintering to fix a position of the multilayer structure of the probe substrate. . The method for manufacturing a high-frequency probe card according to claim 1, wherein in step S3, the position of the probe substrate corresponding to the probe ring body is processed by drilling to form a hole. Then, the conductive solution is poured and cured to form the first ground conductor. The method for manufacturing a high-frequency probe card according to claim 1, wherein in step S3, the position of the probe substrate corresponding to the probe ring body is processed by drilling to form a hole. And placing a wire in the hole as the first grounding conductor. The method for manufacturing a high-frequency probe card according to claim 1, wherein there is a further step of: providing an underlying substrate disposed on a side of the probe substrate adjacent to an object to be tested, and the bottom layer The substrate has a signal fixing hole and a ground fixing hole, and the signal fixing hole has a smaller aperture than the signal hole, and the ground fixing hole has a smaller aperture than the ground hole. A method for manufacturing a high frequency probe card, comprising the following steps:
S1: manufacturing a probe substrate, wherein the probe substrate is formed into a multilayer structure by lamination, wherein at least two conductive portions are disposed in the multilayer structure during the lamination process for fabricating the probe substrate;
S2: forming a plurality of pinholes, forming a plurality of pinholes on the probe substrate, comprising: a signal pinhole and a ground pinhole, the signal pinhole and the ground pinhole respectively and the pinhole Connecting two conductive portions;
S3: forming a first grounding conductor, the first grounding conductor is formed on a periphery of an inner wall of the signal pinhole;
S4: an insulator is disposed, the insulator is disposed on a periphery of an inner wall of the first grounding conductor, and forms a signal hole;
S5: Inserting a plurality of probes, respectively, a signal probe and a grounding probe are disposed in the signal hole and the grounding pinhole, and the grounding probe contacts the at least two conductive portions. The method for manufacturing a high-frequency probe card according to claim 7, wherein in step S3, there is a step S3A: providing a second grounding conductor formed on a periphery of the inner wall of the grounding pinhole. The second grounding conductor thus forms a grounding hole for placing the grounding probe. The method for manufacturing the high-frequency probe card according to the eighth aspect of the invention, wherein after the step S5, there is a step S6: providing an underlying substrate disposed adjacent to the object to be tested On one side, the bottom substrate has a signal fixing hole and a ground fixing hole, and the signal fixing hole has a smaller aperture than the signal hole, and the ground fixing hole has a smaller aperture than the ground hole. The method for manufacturing a high frequency probe card according to claim 7, wherein the first grounding conductive system is formed by plating on a periphery of an inner wall of the signal pinhole.