TWI425885B - Image sensor substrate - Google Patents
Image sensor substrate Download PDFInfo
- Publication number
- TWI425885B TWI425885B TW99146947A TW99146947A TWI425885B TW I425885 B TWI425885 B TW I425885B TW 99146947 A TW99146947 A TW 99146947A TW 99146947 A TW99146947 A TW 99146947A TW I425885 B TWI425885 B TW I425885B
- Authority
- TW
- Taiwan
- Prior art keywords
- resin
- board
- positioning
- image sensor
- sensor substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 44
- 239000011347 resin Substances 0.000 claims description 114
- 229920005989 resin Polymers 0.000 claims description 114
- 239000002184 metal Substances 0.000 claims description 35
- 239000007769 metal material Substances 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Studio Devices (AREA)
- Lens Barrels (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
本發明係與基板結構有關，更詳而言之是指一種可使組裝及光學誤差降低之影像感測器基板。The present invention relates to a substrate structure, and more particularly to an image sensor substrate that can reduce assembly and optical errors.
請參閱圖1，為已知鏡頭模組所使用之影像感測器基板200。在鏡頭模組之組裝過程中，須先利用固晶(Die Bonding，D/B)機台將影像感測器210與該影像感測器基板200進行黏合，而固晶機台則是該影像感測器基板200上之十字標記201做為影像感測器210黏合定位之參考基準點，並於黏合及後續作業完成後，再利用該影像感測器基板200上之定位孔202與鏡頭模組之其他構件組合，以完成鏡頭模組之組裝作業。Please refer to FIG. 1 , which is an image sensor substrate 200 used in a known lens module. In the assembly process of the lens module, the image sensor 210 is first bonded to the image sensor substrate 200 by using a Die Bonding (D/B) machine, and the solid crystal machine is the image. The cross mark 201 on the sensor substrate 200 serves as a reference point for the image sensor 210 to be bonded and positioned, and after the bonding and subsequent operations are completed, the positioning hole 202 and the lens module on the image sensor substrate 200 are utilized. The other components of the group are combined to complete the assembly of the lens module.
然而，近年來影像科技之進步，使得鏡頭所能處理之像素(Pixel)值也越來越高，而上述之影像感測器基板200在製作時，該定位孔202與該十字標記201需間隔有一預定距離，但該定位孔202與該十字標記201在製作形成後，通常會與理想之設置位置會產生些微之誤差。另外，在影像感測器210與該影像感測器基板200黏合時，因該固晶機台之基本公差而同樣會有誤差之產生。再者，黏合影像感測器210時與鏡頭模組組合時所使用之定位基準點不同，將使得影像感測器210與鏡頭模組之光學中心點有所不同，而造成影像感測器210感測影像時，亦會有誤差產生。而上述之該些誤差累計後，將會導致鏡頭模組在組裝完成後，產生幾十甚至幾百像素之偏移，進而造成鏡頭模組之成像品質不彰。However, in recent years, advances in imaging technology have made the pixel (Pixel) value that can be processed by the lens higher and higher, and the positioning sensor 202 and the cross mark 201 need to be spaced apart during the production of the image sensor substrate 200. There is a predetermined distance, but after the positioning hole 202 and the cross mark 201 are formed, there is usually a slight error with the ideal setting position. In addition, when the image sensor 210 is bonded to the image sensor substrate 200, an error occurs due to the basic tolerance of the die bonding machine. Moreover, when the image sensor 210 is bonded to the lens module, the positioning reference point used in combination with the lens module will make the image sensor 210 and the optical center point of the lens module different, and the image sensor 210 is caused to be different. There are also errors when sensing images. After the above-mentioned errors are accumulated, the lens module will be offset by tens or even hundreds of pixels after the assembly is completed, thereby causing the imaging quality of the lens module to be inconspicuous.
有鑑於此，本發明之主要目的在於提供一種影像感測器基板，可有效降低組裝作業所產生之偏移誤差。In view of this, the main object of the present invention is to provide an image sensor substrate, which can effectively reduce offset errors caused by assembly operations.
緣以達成上述目的，本發明所提供之影像感測器基板包含有一樹脂硬板以及一樹脂軟板。其中，該樹脂硬板具有二定位孔，且該樹脂硬板上佈設有預定之金屬線路；該樹脂軟板結合於該樹脂硬板之一面上，且該樹脂軟板上佈設有預定之金屬線路與該樹脂硬板之金屬線路連通；該樹脂軟板上對應該二定位孔之位置處，各具有一定位標記。In order to achieve the above object, the image sensor substrate provided by the present invention comprises a resin hard plate and a resin soft plate. Wherein, the resin hard board has two positioning holes, and the resin hard board is provided with a predetermined metal line; the resin soft board is bonded to one side of the resin hard board, and the resin flexible board is provided with a predetermined metal line It is in communication with the metal line of the resin hard plate; the resin flexible board has a positioning mark at a position corresponding to the two positioning holes.
本發明更提供有另一影像感測器基板，其包含有一第一樹脂硬板、一第一樹脂軟板、一第二樹脂軟板以及一第一樹脂硬板。其中，該第一樹脂硬板具有二個定位孔，且該第一樹脂硬板上佈設有預定之金屬線路；該第一樹脂軟板結合於該第一樹脂硬板之一面上，且該第一樹脂軟板上佈設有預定之金屬線路與該第一樹脂硬板之金屬線路連通；該第一樹脂軟板上對應該二定位孔之位置處，各具有一定位標記；該第二樹脂軟板結合於該第一樹脂軟板之一面上，而使該第一樹脂軟板位於該第一樹脂硬板與該第二樹脂軟板之間；該第二樹脂軟板上佈設有預定之金屬線路，且該第二樹脂軟板上對應第一樹脂硬板之該二定位標記之位置處，各具有一定位孔；該第二樹脂硬板結合於該第二樹脂軟板之一面上，而使該第二樹脂軟板位於該第一樹脂軟板與該第二樹脂硬板之間；該第二樹脂硬板上佈設有預定之金屬線路與該第二樹脂軟板之金屬線路連通，且該第二樹脂硬板上具有兩個定位孔分別與該第二樹脂軟板之各該定位孔連通。The invention further provides another image sensor substrate comprising a first resin hard plate, a first resin soft board, a second resin soft board and a first resin hard board. The first resin hard board has two positioning holes, and the first resin hard board is provided with a predetermined metal line; the first resin soft board is bonded to one side of the first resin hard board, and the first a resin flexible board is provided with a predetermined metal line communicating with the metal line of the first resin hard board; the first resin flexible board has a positioning mark corresponding to the position of the two positioning holes; the second resin is soft The board is bonded to one surface of the first resin flexible board such that the first resin flexible board is located between the first resin hard board and the second resin soft board; the second resin flexible board is provided with a predetermined metal a line, and the second resin flexible board has a positioning hole at a position corresponding to the two positioning marks of the first resin hard board; the second resin hard board is bonded to one side of the second resin soft board, and The second resin flexible board is disposed between the first resin flexible board and the second resin hard board; the second resin hard board is provided with a predetermined metal line connected to the metal line of the second resin soft board, and The second resin hard plate has two positioning holes In communication with each of the positioning holes of the second plate of soft resin.
為能更清楚地說明本發明，茲舉較佳實施例並配合圖示詳細說明如後。In order that the present invention may be more clearly described, the preferred embodiments are illustrated in the accompanying drawings.
請參閱圖2，本發明提供之鏡頭模組100包含有一影像感測器基板1、一影像感測器2、一濾光片3、一鏡座4以及一鏡筒5。該影像感測器基板1上黏設有該影像感測器2。該鏡座4與該影像感測器基板1連接，且該鏡座4與該影像感測器2之間設有該濾光片3。該鏡筒5則是固設於該鏡座4上。以上所述與習知技藝無異，其他之詳細結構於此容不再贅述，而本發明之特徵在於：Referring to FIG. 2 , the lens module 100 of the present invention includes an image sensor substrate 1 , an image sensor 2 , a filter 3 , a lens holder 4 , and a lens barrel 5 . The image sensor 2 is adhered to the image sensor substrate 1 . The lens holder 4 is connected to the image sensor substrate 1 , and the filter 3 is disposed between the lens holder 4 and the image sensor 2 . The lens barrel 5 is fixed to the lens holder 4. The above description is the same as the prior art, and other detailed structures are not described herein again, and the present invention is characterized in that:
請參閱圖3及圖4，該影像感測器基板1包含有一樹脂硬板10以及一樹脂軟板20。其中：Referring to FIGS. 3 and 4 , the image sensor substrate 1 includes a resin hard plate 10 and a resin soft plate 20 . among them:
該樹脂硬板10上佈設有預定之金屬線路11，且該樹脂硬板10上之兩端角處附近分別具有一定位孔12。The resin hard plate 10 is provided with a predetermined metal line 11 and a positioning hole 12 is formed in the vicinity of the corners of the resin hard plate 10.
該樹脂軟板20與該樹脂硬板10之一面結合，且該樹脂軟板20上佈設有預定之金屬線路21而與該樹脂硬板10之金屬線路11連通。該樹脂軟板20上對應該二定孔12之位置處各具有一定位標記22，且各該定位標記22之中心係位於該樹脂軟板20上相對各該定位孔12中心的位置處。於本實施例中，該二定位標記22為十字型之金屬材質標記，係利用該樹脂軟板20在金屬線路21設計(Layout)時，一併設計於該樹脂軟板20上，並於蝕刻作業後，形成於該樹脂軟板20上之對應該二定孔12處。必須說明的是，各該定位標記22除使用金屬材質之標記外，亦可利用機器印製而成之漆料標記、或是利用機台以針頂方式形成之立體凸紋等標記做為定位標記之使用。另，該定位標記22除使用十字型外，亦可依使用需求而改用其他形狀代替。The resin flexible sheet 20 is bonded to one surface of the resin rigid sheet 10, and a predetermined metal line 21 is disposed on the resin flexible sheet 20 to communicate with the metal line 11 of the resin rigid sheet 10. The resin flexible board 20 has a positioning mark 22 at a position corresponding to the two holes 12, and the center of each of the positioning marks 22 is located on the resin flexible board 20 at a position opposite to the center of each of the positioning holes 12. In the present embodiment, the two positioning marks 22 are made of a metal material of a cross type, and are designed on the resin flexible board 20 by the resin flexible board 20 during the layout of the metal circuit 21, and are etched. After the operation, the resin soft plate 20 is formed on the corresponding holes 12. It should be noted that, in addition to the mark of the metal material, each of the positioning marks 22 can also be marked by a paint mark printed by a machine or by a mark such as a three-dimensional relief formed by a needle top of the machine. Use of the mark. In addition, the positioning mark 22 can be replaced with other shapes instead of using the cross type.
將各該定位標記22與各該定位孔12重疊設置之好處則是在於可使該影像感測器基板1於製造過程中，不會因定位標記22與定位孔12之需具有一定間距而有誤差產生。The advantage of the positioning of each of the positioning marks 22 and the positioning holes 12 is that the image sensor substrate 1 can be made in the manufacturing process without a certain distance between the positioning marks 22 and the positioning holes 12. The error is generated.
另外，當固晶機台(圖略)以該樹脂軟板20上之該二定位標記22做為影像感測器2黏合定位之參考基準點，而使該影像感測器2與該影像感測器基板1黏合完成後，該鏡座4上之兩定位柱4a便可分別穿過該定位孔12，而使該鏡座4與該影像感測器基板1結合，且因該樹脂軟板20僅具有65μm，該二定位柱4a在穿過該定位孔12之同時，便可直接將該樹脂軟板20之定位標記22處穿破，而不會影響到後續之組裝作業。In addition, when the die attaching machine (not shown) uses the two positioning marks 22 on the resin flexible board 20 as a reference point for the adhesion and positioning of the image sensor 2, the image sensor 2 and the image sense are made. After the test substrate 1 is bonded, the two positioning posts 4a on the lens holder 4 can respectively pass through the positioning holes 12, so that the lens holder 4 is combined with the image sensor substrate 1, and the resin soft board is 20 has only 65 μm, and the two positioning posts 4a can directly penetrate the positioning mark 22 of the resin flexible board 20 while passing through the positioning hole 12 without affecting the subsequent assembly work.
再者，因該鏡座4與該影像感測器基板1結合時定位基準點，與該影像感測器2黏合於該影像感測器基板1上之定位基準點位置相同，將使得該鏡頭模組100組裝完成後，該影像感測器2之光學中心點與該鏡筒5之光學中心點將位於同一位置上，進而避免該鏡頭模組100因該影像感測器2與該鏡筒4之光學中心點不同而產生誤差。In addition, when the lens holder 4 is combined with the image sensor substrate 1 to position the reference point, the position of the positioning reference point on the image sensor substrate 1 is the same as that of the image sensor 2, which will make the lens After the assembly of the module 100 is completed, the optical center point of the image sensor 2 and the optical center point of the lens barrel 5 will be at the same position, thereby preventing the lens module 100 from being affected by the image sensor 2 and the lens barrel 4 The optical center points are different and produce errors.
另外，影像感測器基板除上述兩層式結構外，請參閱圖5，揭示該影像感測器基板6為四層式結構，其包含有依序連接之一第一樹脂硬板60、一第一樹脂軟板70、一第二樹脂軟板80以及一第二樹脂硬板90。其中：In addition, the image sensor substrate, in addition to the above two-layer structure, please refer to FIG. 5 , which discloses that the image sensor substrate 6 has a four-layer structure including a first resin hard plate 60 and a first connection. The first resin flexible board 70, a second resin flexible board 80, and a second resin hard board 90. among them:
該第一樹脂硬板60上佈設有預定之金屬線路61，且該第一樹脂硬板60同樣具有二個定位孔62。該第一樹脂軟板70上佈設有預定之金屬線路71而與該第一樹脂硬板60之金屬線路61連通，且該第一樹脂軟板70上對應該二定位孔62之位置處各具有一定位標記72。第二樹脂軟板80上佈設有預定之金屬線路81，且該第二樹脂軟板80上對應該二定位標記72之位置處各具有一定位孔82。第二樹脂硬板90上佈設有預定之金屬線路91而與該第二樹脂軟板80之金屬線路81連通，且該第二樹脂硬板90具有兩個定位孔92分別與該第二樹脂軟板80之各該定位孔82連通。The first resin hard plate 60 is provided with a predetermined metal line 61, and the first resin hard plate 60 also has two positioning holes 62. The first resin flexible board 70 is provided with a predetermined metal line 71 to communicate with the metal line 61 of the first resin hard board 60, and the first resin flexible board 70 has a position corresponding to the two positioning holes 62. A positioning mark 72. The second resin flexible board 80 is provided with a predetermined metal line 81, and the second resin flexible board 80 has a positioning hole 82 at a position corresponding to the two positioning marks 72. The second resin hard plate 90 is provided with a predetermined metal line 91 to communicate with the metal line 81 of the second resin flexible board 80, and the second resin hard board 90 has two positioning holes 92 respectively softened with the second resin. Each of the positioning holes 82 of the plate 80 is in communication.
藉此，當該二定位標記72做為影像感測器2黏合定位之參考基準點後，鏡座4上之定位柱4a便可同時穿過對應之該等定位孔62、82、92，而完成組裝之作業，並同時可以達到減少誤差之目的。Therefore, after the two positioning marks 72 are used as reference points for the adhesion and positioning of the image sensor 2, the positioning posts 4a on the lens holder 4 can pass through the corresponding positioning holes 62, 82, 92 at the same time. The assembly work is completed, and at the same time, the error can be reduced.
綜合以上各實施例可得知，本發明之影像感測器基板設計可有效地減少誤差之產生，進而提升鏡頭模組100之光學效能。According to the foregoing embodiments, the image sensor substrate design of the present invention can effectively reduce the occurrence of errors, thereby improving the optical performance of the lens module 100.
又，本發明之影像感測器基板並不限於上述之二層式結構或四層式結構，亦可為三層式結構，或者更多層式之結構，都不脫離本發明之精神。另外，本發明定位標記之所在位置並不限於上述實施例所記載者，位於影像感測器基板任何一層樹脂軟板上，也是本發明之另一種實施形態而已。Moreover, the image sensor substrate of the present invention is not limited to the above-described two-layer structure or four-layer structure, and may be a three-layer structure or a multi-layer structure without departing from the spirit of the present invention. Further, the position of the positioning mark of the present invention is not limited to those described in the above embodiments, and is located on any one of the resin flexible boards of the image sensor substrate, and is another embodiment of the present invention.
以上所述僅為本發明較佳可行實施例而已，舉凡應用本發明說明書及申請專利範圍所為之等效結構及製作方法變化，理應包含在本發明之專利範圍內。The above description is only for the preferred embodiments of the present invention, and the equivalent structures and manufacturing methods of the present invention and the scope of the patent application are intended to be included in the scope of the present invention.
100．．．鏡頭模組100. . . Lens module
1．．．影像感測器基板1. . . Image sensor substrate
10．．．樹脂硬板10. . . Resin hard board
11．．．金屬線路11. . . Metal line
12．．．定位孔12. . . Positioning hole
20．．．樹脂軟板20. . . Resin soft board
21．．．金屬線路twenty one. . . Metal line
22．．．定位標誌twenty two. . . Positioning mark
2．．．影像感測器2. . . Image sensor
3．．．濾光片3. . . Filter
4．．．鏡座4. . . Mirror holder
4a．．．定位柱4a. . . Positioning column
5．．．鏡筒5. . . Lens barrel
6．．．影像感測器基板6. . . Image sensor substrate
60．．．第一樹脂硬板60. . . First resin hard board
61．．．金屬線路61. . . Metal line
62．．．定位孔62. . . Positioning hole
70．．．第一樹脂軟板70. . . First resin soft board
71．．．金屬線路71. . . Metal line
72．．．定位標誌72. . . Positioning mark
80．．．第二樹脂軟板80. . . Second resin soft board
81．．．金屬線路81. . . Metal line
82．．．定位孔82. . . Positioning hole
90．．．第二樹脂硬板90. . . Second resin hard board
91．．．金屬線路91. . . Metal line
92．．．定位孔92. . . Positioning hole
200．．．影像感測器基板200. . . Image sensor substrate
201．．．十字標記201. . . Cross mark
202．．．定位孔202. . . Positioning hole
210．．．影像感測器210. . . Image sensor
圖1為習知之影像感測器基板正視圖。1 is a front elevational view of a conventional image sensor substrate.
圖2為本發明之鏡頭模組分解圖。2 is an exploded view of the lens module of the present invention.
圖3為本發明較佳實施例之影像感測器基板正視圖。3 is a front elevational view of an image sensor substrate in accordance with a preferred embodiment of the present invention.
圖4為本發明較佳實施例之影像感測器基板剖視圖。4 is a cross-sectional view of an image sensor substrate in accordance with a preferred embodiment of the present invention.
圖5揭示該影像感測器基板為四層式結構設計。FIG. 5 discloses that the image sensor substrate has a four-layer structure design.
1．．．影像感測器基板1. . . Image sensor substrate
10．．．樹脂硬板10. . . Resin hard board
11．．．金屬線路11. . . Metal line
12．．．定位孔12. . . Positioning hole
22．．．定位標誌twenty two. . . Positioning mark
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99146947A TWI425885B (en) | 2010-12-30 | 2010-12-30 | Image sensor substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99146947A TWI425885B (en) | 2010-12-30 | 2010-12-30 | Image sensor substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201228484A TW201228484A (en) | 2012-07-01 |
| TWI425885B true TWI425885B (en) | 2014-02-01 |
Family
ID=46933649
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99146947A TWI425885B (en) | 2010-12-30 | 2010-12-30 | Image sensor substrate |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI425885B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI288365B (en) * | 2005-12-07 | 2007-10-11 | Metal Ind Res & Dev Ct | Design and image processing method of fiducial marks for the motion control system of two plates alignment |
| TWM328580U (en) * | 2007-07-23 | 2008-03-11 | Asia Optical Co Inc | Lens module |
| TWI297404B (en) * | 2005-09-23 | 2008-06-01 | Asia Optical Co Inc |
-
2010
- 2010-12-30 TW TW99146947A patent/TWI425885B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI297404B (en) * | 2005-09-23 | 2008-06-01 | Asia Optical Co Inc | |
| TWI288365B (en) * | 2005-12-07 | 2007-10-11 | Metal Ind Res & Dev Ct | Design and image processing method of fiducial marks for the motion control system of two plates alignment |
| TWM328580U (en) * | 2007-07-23 | 2008-03-11 | Asia Optical Co Inc | Lens module |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201228484A (en) | 2012-07-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102414837B1 (en) | Electronic module, manufacturing method thereof and camera module having the same | |
| CN100349044C (en) | Display device and manufacturing method thereof | |
| KR101193803B1 (en) | Manufacturing method and manufacturing device for electronic component | |
| WO2011162221A1 (en) | Narrow-frame touch input sheet superior in anti-rusting property and production method thereof | |
| JP2015163463A (en) | Write head unit assembly apparatus and write head unit assembly method | |
| KR101671899B1 (en) | Display device and manufacturing method thereof | |
| CN202857137U (en) | Printed circuit board with character marking | |
| KR101042553B1 (en) | Touch screen panel and manufacturing method | |
| CN104661444A (en) | High-flatness rigid-flex board provided with ink windows shaped like dual nested rectangles and manufacturing method | |
| JP5410564B2 (en) | Tilt correction device and joining method using the same | |
| CN114657506A (en) | Mask, mask assembly and method of manufacturing display panel | |
| CN105208788A (en) | Method for improving aligning precision of solder masks | |
| TWI425885B (en) | Image sensor substrate | |
| KR101319447B1 (en) | Touch panel and manufacturing method thereof | |
| CN202126672U (en) | Precisely positioned touch panel for each layer | |
| CN104039068B (en) | Ultra-thin rigid-flex (R-F) circuit board and manufacturing method thereof | |
| CN104750297A (en) | decorative panel and touch device | |
| CN106564273B (en) | Applying method applied to curved surface touch panel | |
| JPWO2009063730A1 (en) | Screen printing mask, solder paste printing apparatus and solder paste printing method using the same | |
| CN202120232U (en) | Substrates for touch panels that facilitate positioning of upper and lower layers | |
| CN107734827A (en) | Register guide and alignment detecting method | |
| KR102241443B1 (en) | Display device and manufacturing method thereof | |
| JP2007273578A (en) | Electronic component connection structure | |
| KR20110133830A (en) | Method for manufacturing touch panel with air hole, Touch panel manufactured using same, Method for manufacturing touch window with air hole and Touch window manufactured using same | |
| KR100780573B1 (en) | Alignment structure of ITO end of plastic LCD and OW end of flexible printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |