TWI422436B - Coating method and coating device - Google Patents

Description

Coating method and coating device

The present invention relates to a technique of coating a liquid on a substrate to be processed, and more particularly to a coating method and a coating apparatus for forming a coating film on a substrate in a non-rotating manner.

Recently, in the photolithography step of the process of a flat panel display (FPD), the resist coating method which is advantageous for the enlargement of a substrate to be processed (for example, a glass substrate) is a non-rotation method (for example, refer to Patent Document 1) In the popularization, the strip-shaped resist nozzle discharges the resist liquid from the slit-like discharge port in a strip shape, and relatively moves or scans the substrate, and does not require a rotary motion. The resist liquid can be applied to the substrate at a desired film thickness.

In the non-rotation type (also referred to as slit type) resist treatment, the pre-treatment is also subjected to a cleaning treatment and an adhesion treatment, and the cleaning treatment removes contamination of particles or organic substances on the surface of the substrate. In the adhesion treatment, vapor-like HMDS is applied to the substrate in order to improve the adhesion between the substrate and the resist film. Further, the resist coating treatment is performed on the unpatterned substrate after the adhesion treatment.

[Patent Document 1] Japanese Patent Laid-Open No. 10-156255

However, the conventional non-rotation method has an improvement in controlling the film thickness of the resist coating film formed on the substrate, and in particular, it has become a problem in improving in-plane uniformity. Specifically, there is a problem that the coating film thickness at the coating start portion is lowered, and on the other hand, the coating film layer is uncontrollable at the left and right end portions in the intermediate portion to be applied to the coating end portion. The film is easily bulged significantly.

More specifically, if a non-rotating manner is employed, a coating film 200 of a resist liquid is formed on the substrate G in a plan view pattern as shown in FIG. Here, at the application start position A, as shown in FIG. 23(A), the elongated resist nozzle 202 reduces the gap D _A with the substrate G to perform pre-discharge or liquid of the resist liquid. Although it is adhered, the resist liquid which is discharged from the slit-shaped discharge port 202a of the resist nozzle 202 tends to spread excessively on the outer side of the substrate G (especially, the outer side in the longitudinal direction of the nozzle). As a result, as shown in FIG. 24, at the application start position A (particularly, the right and left corners), the film thickness of the resist coating film 200 may sag so as to hang down to the outside.

In the coating scan, as shown in FIG. 23(B), the gap D _B between the resist nozzle 202 and the substrate G is larger than the start of coating, and a meniscus is formed on the lower end portion of the back surface. When the upper side moves, the sister drags the resist liquid that has just been discharged onto the substrate G by the nozzle 202. Therefore, as shown in FIG. 25, the resist liquid is applied to the inner and left end portions of the intermediate portion B, and the resist liquid is easily formed. Uplift 204. When the scanning speed is higher or the gap D _{B is} larger, the ridge 204 tends to become larger as indicated by the broken line 204'.

Further, when the discharge of the resist liquid is completed, the resist nozzle 202 is moved upward to retreat, and the liquid of the resist liquid is cut off from both ends of the slit-shaped discharge port 202a, so that the end portion C is applied. (especially in the left and right corners), the resist liquid tends to be more inward, and it is easy to form a larger bulge.

The film thickness of the resist coating film varies or is uneven, and the discharge structure of the resist nozzle 202 is optimized in accordance with the specifications or conditions of the resist treatment, and can be eliminated to some extent. However, this method has no versatility, and it is necessary to replace the resist nozzle hardly each time the specification (e.g., film thickness) or condition (e.g., resist type) is changed, which is practically disadvantageous in terms of cost or application.

Further, in the conventional non-rotation method, as shown in FIG. 26, when the pre-discharge is performed at the coating start position A, the gap between the resist nozzle 202 and the substrate G often occurs without being completely filled with the resist liquid. A gap is formed (the liquid is poorly attached) 206 occurs. When the coating scan is started in a state where the liquid adhesion defect 206 is present, as shown in FIG. 27, the ridge line (wet line) of the meniscus formed on the lower portion of the back surface of the resist nozzle 202 may be in a poor adhesion of the liquid. The depression of 206 causes a strip-like coating unevenness 208 to be easily generated in the scanning direction at a position on the resist coating film 200 corresponding to the position.

The present invention has been made in view of the problems of the prior art, and an object thereof is to provide a non-rotating coating method and a coating device, which are easy to perform film thickness control of a coating film. The film thickness is uniform, especially in the peripheral portion.

Another object of the present invention is to provide a non-rotating method and a coating apparatus which can fill a gap between a nozzle and a substrate to be processed at a coating start position so that the treatment liquid can be filled without gaps. Prevent uneven coating. In order to achieve the above object, the coating method of the present invention has a linear coating step of applying a treatment liquid to a portion of the peripheral portion of the coating region set on the substrate to be processed to form a linear shape. A coating film; a surface coating step of applying a treatment liquid to the coating region on the substrate to form a planar coating film.

Moreover, the coating apparatus of the present invention has a linear coating treatment unit that applies a treatment liquid to a part or all of the peripheral portion of the coated portion to form a linear coating. A film coating treatment unit that applies a treatment liquid to the coating region on the substrate to form a planar coating film.

According to the present invention, before the surface coating step of applying the treatment liquid to the coating region on the substrate, the coating liquid is applied to the peripheral portion of the coating region in a linear coating step. A linear coating film is formed. In the planar coating step, the treatment liquid applied to the substrate in a planar shape controls the film thickness corresponding to the contour of the linear coating film by the contact or integration of the peripheral portion of the coating region with the linear coating film. .

According to a preferred embodiment of the present invention, the linear coating film is selected in such a manner that the expansion of the treatment liquid applied to the substrate by the surface coating step can be prevented by the linear coating film. profile. According to another preferred embodiment, the treatment liquid applied to the substrate by the surface coating step can be extended to the peripheral side of the coating region by the attraction force generated by the adhesion to the linear coating film. The way to select the contour of the linear coating film. In the coating method of the present invention, it is preferred that the linear coating film is heated and dried before the planar coating step. Therefore, the coating apparatus of the present invention is also preferably provided with a drying mechanism for heating and drying the linear coating film before the planar coating step.

Moreover, according to a preferred embodiment, the linear coating processing unit includes a first nozzle that discharges the processing liquid in a line from the upper side toward the substrate in a substantially horizontal state, and the first coating scanning unit The processing liquid formed on the substrate by the first nozzle forms a linear coating film, and the first nozzle moves relative to the substrate. The first nozzle is preferably An ink jet type nozzle that pressurizes the processing liquid in the nozzle and ejects it in the form of droplets, corresponding to the electric drive signal.

Moreover, according to a preferred embodiment, the planar coating treatment unit includes a second nozzle that discharges the treatment liquid in a strip shape from above in a substantially horizontal state, and a second coating scan unit. The second nozzle is relatively moved to the substrate so that the processing liquid discharged from the second nozzle onto the substrate is entirely applied to the coating region. Preferably, the second nozzle is an elongated nozzle having a slit-shaped discharge port that can include a length from one end to the other end of the coating region in one direction. In the planar coating step, the elongated nozzle may be moved in a direction parallel to the substrate and substantially perpendicular to the longitudinal direction of the nozzle.

According to a preferred embodiment, the coating liquid applied from the second nozzle onto the substrate at the start of the planar coating step is adhered to the linear coating film to fill the gap, thereby selecting the linear coating. The contour of the membrane.

In the present invention, the linear coating treatment and the planar coating treatment may be performed at the respective substrate supporting portions (changing places), or may be performed at the same substrate supporting portion (same place).

According to another aspect of the present invention, in the coating method, the processing substrate and the ejection opening of the elongated nozzle are substantially horizontally opposed to each other with a small gap therebetween, and the processing liquid is discharged from the nozzle to the substrate, and the nozzle is opposed to the nozzle. a method of applying a planar coating film for forming the treatment liquid on the substrate by moving in a horizontal direction to perform coating scanning, and performing the coating scan on a position near the end of the coating scan on the substrate In the prior art, a leading coating film composed of the treatment liquid is formed in a desired pattern, and the end of the surface coating film formed on the substrate by the coating scanning is combined with the preceding coating film to advance the foregoing. The coating film is an expanded portion of the above-mentioned planar coating film.

Furthermore, in another aspect of the present invention, the coating apparatus includes a planar coating processing unit that faces the substrate from the nozzle by a horizontal gap between the substrate to be processed and the ejection nozzle of the elongated nozzle. a processing solution for discharging the surface of the processing liquid on the substrate while the nozzle is being horizontally moved to perform coating scanning, and a coating film forming portion is formed on the substrate. In the vicinity of the position where the coating scanning is completed, the preceding coating film composed of the treatment liquid is formed in the desired pattern before the coating scan of the planar coating treatment portion is performed; and the surface coating treatment portion is applied The end of the planar coating film formed by coating and scanning on the substrate is combined with the preceding coating film, and the preceding coating film is an expanded portion of the planar coating film.

In a preferred aspect of the invention, the substrate is rectangular, and the coating film is formed on the substrate at the corner portion on the coating scanning end side.

According to the above aspect, in the surface coating treatment, the surface coating film is applied to the preceding coating film (integrated) in the vicinity of the end position of the coating scanning, and the preceding coating film is formed as an expanded portion of the planar coating film. Therefore, the contour of the planar coating film can be arbitrarily adjusted at the coating end portion.

According to the coating method or the coating apparatus of the present invention, the coating film thickness control can be easily performed in the non-rotating coating treatment by the above-described constitution and action, and in particular, the film thickness of the peripheral portion is made uniform. Further, it is possible to fill the gap between the nozzle and the substrate to be processed without any gap at the application start position to prevent coating unevenness.

Hereinafter, preferred embodiments of the present invention will be described with reference to Figs. 1 to 21 .

Fig. 1 shows a coating and developing treatment system which is a configuration example in which the coating method and the coating apparatus of the present invention are applicable. The coating and developing treatment system is disposed in a clean room, for example, using a glass substrate for LCD as a substrate to be processed, and performing cleaning, resist coating, prebaking, developing, and post-baking in the photolithography step of the LCD process. Each treatment. The exposure processing is performed by an external exposure device (not shown) provided adjacent to the system.

This coating and developing treatment system is largely divided into a following configuration: a cassette station (C/S) 10, a processing station (P/S) 12, and an interface unit (I/F) 14.

The cassette station (C/S) 10 provided at one end of the system is provided with: a cassette pedestal 16 capable of mounting a predetermined number, for example, up to four cassettes CR for accommodating a plurality of substrates G; 17. The side of the cassette pedestal 16 is disposed parallel to the arrangement direction of the cassette CR; and the transport mechanism 20 is freely movable on the transport path 17 and the cassette G on the pedestal 16 is used for the entry and exit of the substrate G. . The transport mechanism 20 has a mechanism capable of holding the substrate G, for example, a transport arm, and is operable on the X, Y, Z, and θ4 axes, and can transport the substrate G to the transport device 38 on the side of the processing station (P/S) 12 to be described later.

The processing station (P/S) 12 is provided with the cleaning processing unit 22, the coating processing unit 24, and the development processing unit 26 in this order from the side of the cassette station (C/S) 10, and the substrate relay unit 23 and the chemistry are interposed therebetween. The drug solution supply unit 25 and the space 27 (separated) are arranged side by side in a row.

The cleaning processing unit 22 includes two scrubbing cleaning units (SCR) 28, two upper and lower ultraviolet irradiation/cooling units (UV/COL) 30, a heating unit (HP) 32, and a cooling unit (COL) 34.

The coating treatment unit 24 includes a non-rotating surface coating unit (ACT) 40, a reduced-pressure drying unit (VD) 42, a linear coating unit (LCT) 44, and a top and bottom two-stage adhesion/cooling unit (AD). /COL) 46, upper and lower 2-stage heating/cooling unit (HP/COL) 48, and heating unit (HP) 50.

The development processing unit 26 includes three developing units (DEV) 52, two upper and lower two-stage heating/cooling units (HP/COL) 53, and a heating unit (HP) 55.

In the central portion of each of the processing units 22, 24, and 26, transport paths 36, 47, and 58 are provided in the longitudinal direction, and the transport devices 38, 54, and 60 are moved along the transport paths 36, 47, and 58 to approach each of the processing units. Each unit can carry in/out or transport the substrate G. Further, in each of the processing units 22, 24, and 26, the liquid processing system unit (SCR, CT, DEV, etc.) is disposed on one side of the transport paths 36, 47, and 58, and the heat treatment system is disposed on the other side. Unit (HP, COL, etc.).

An interface portion (I/F) 14 provided at the other end of the system is provided with an extending portion (substrate transfer portion) 56 and a buffer pedestal 57 on the side adjacent to the processing station 12, and a transport mechanism 59 is provided adjacent to the exposure device. The transport mechanism 59 is movably movable on the transport path 19 extending in the Y direction, and the substrate G is moved in and out of the buffer pedestal 57. Further, the substrate G can be delivered to the extension portion (substrate transfer portion) 56 or an adjacent exposure device.

Figure 2 shows the steps of the treatment in the coating and development treatment system. First, Yuka At the station (C/S) 10, the transport mechanism 20 takes out a piece of the substrate G from the predetermined cassette CR on the cassette pedestal 16 and delivers it to the transport unit 38 of the cleaning processing unit 22 of the processing station (P/S) 12 (step S1). .

In the cleaning processing unit 22, the substrate G is first loaded into the ultraviolet irradiation/cooling unit (UV/COL) 30, and the first ultraviolet irradiation unit (UV) is subjected to dry cleaning by ultraviolet irradiation, and the second cooling unit (COL). Cool to a predetermined temperature (step S2). The ultraviolet cleaning mainly removes organic matter on the surface of the substrate.

Next, the substrate G is subjected to a rubbing cleaning process in one of the scrubbing cleaning units (SCR) 28 to remove particulate contamination from the surface of the substrate (step S3). After the rubbing cleaning, the substrate G is subjected to a dehydration baking treatment by heating at the heating unit (HP) 32 (step S4), and then cooled to a constant substrate temperature by the cooling unit (COL) 34 (step S5). When the cleaning processing unit 22 ends the pre-processing, the substrate G is transported to the coating processing unit 24 through the substrate relay unit 23 by the transport device 38.

In the coating processing unit 24, the substrate G is first carried into the linear coating unit (LCT) 44. Here, as will be described later, the resist liquid is applied in a line shape on the substrate G to the outside of the set coating region or The peripheral portion (step S6). The linear resist coating film formed on the substrate G in this manner is heated by the heating unit (HP) 50 to be dried (step S7). Next, the substrate G is sequentially carried into the adhesion/cooling unit (AD/COL) 46, subjected to hydrophobicization treatment (HMDS) in the first adhesion unit (AD) (step S8), and cooled to constant in the second cooling unit (COL). The substrate temperature (step S9). Further, a cooling treatment (COL) may be placed between the heat drying step (HP) and the hydrophobizing step (HMDS).

Thereafter, the substrate G is entirely coated with the resist liquid in the coating region by the non-rotation method in the planar coating unit (ACT) 40, and then subjected to drying treatment under reduced pressure in the reduced-pressure drying unit (VD) 42. (Step S10).

Next, the substrate G is sequentially carried into the heating/cooling unit (HP/COL) 48, and is baked (pre-baked) after coating in the first heating unit (HP) (step S11), followed by the cooling unit (COL). Cool to a constant substrate temperature (step S12). Further, a heating unit (HP) 50 may be used for the baking after the coating.

After the coating process described above, the substrate G is transported by the coating processing unit 24 The conveying device 60 of the developing treatment unit 26 is conveyed to the interface portion (I/F) 14 and delivered to the exposure device (step S13). The exposure device exposes the resist on the substrate G in a predetermined circuit pattern. Then, the substrate G whose pattern has been exposed is returned from the exposure device to the interface portion (I/F) 14. The transport mechanism 59 of the interface unit (I/F) 14 passes the substrate G picked up from the exposure device through the extension portion 56 and delivers it to the development processing unit 26 of the processing station (P/S) 12 (step S13).

In the development processing unit 26, the substrate G is subjected to development processing in any of the developing units (DEV) 52 (step S14), and then sequentially carried into one of the heating/cooling units (HP/COL) 53 to be performed in the first heating unit (HP). Post-baking (step S15), followed by cooling unit (COL) to a constant substrate temperature (step S16). A heating unit (HP) 55 can also be used for this post-baking.

The substrate G that has been subjected to a series of processes in the development processing unit 26 is returned to the cassette station (C/S) 10 by the transfer devices 60, 54, 38 of the processing station (P/S) 12, and is accommodated by the transport mechanism 20. One card CR (step S1).

In the coating and developing treatment system, the coating treatment portion 24, particularly the linear coating unit (LCT) 44 and the planar coating unit (ACT) 40, can be applied to the present invention. Hereinafter, the configuration and action of the linear coating unit (LCT) 44 and the planar coating unit (ACT) 40 in one embodiment of the present invention will be described in detail with reference to Figs. 3 to 14 .

Fig. 3 shows the essential part of the linear coating unit (LCT) 44 in this embodiment. The linear coating unit (LCT) 44 has a pedestal 62 for holding and holding the substrate G horizontally, and a nozzle scanning mechanism 66 for causing the resist liquid to have a dot shape or a filament on the substrate G on the pedestal 62. The inkjet resist nozzle (hereinafter referred to as "inkjet nozzle") 64 that is discharged is moved in the XY direction, and a controller (not shown) that controls each unit.

In the nozzle scanning mechanism 66, a pair of Y guide rails 68, 68 extending in the Y direction are disposed on the left and right sides of the pedestal 62, and an X guide rail 70 extending across the pedestal 62 and extending in the X direction is, for example, electrically The Y-direction drive unit 72 of the motor moves in the Y direction on the Y guide rails 68 and 68. Further, a carriage (carrier) 74 capable of moving in the X direction by, for example, a self-propelled or externally driven type is mounted on the X guide rail 70, and an inkjet nozzle 64 is attached to the carriage 74. By driving in the Y direction The Y-direction movement of the movable portion 72 is combined with the X-direction movement by the carriage 74, so that the ink-jet nozzle 64 can be moved between any two points on the XY plane above the pedestal 62 or an arbitrary straight or curved path.

The ink jet nozzle 64 is configured such that a piezoelectric element as an ejection mechanism is built in the inside of the discharge port, and the piezoelectric element is contracted by an electric drive signal from the controller, and the nozzle is contracted by the contraction pressure. The resist liquid inside is pressurized and ejected from the spout outlet in the form of droplets. Further, the resist liquid supply unit (not shown) is directly connected to the ink jet nozzle 64 as a sump or through a pipe (not shown).

The linear coating unit (LCT) 44 is configured as described above, and applies a treatment liquid to a part or all of the peripheral portion of the predetermined coating region on the substrate G to form a linear resist coating. Cloth film. For example, as shown in FIG. 4, the inkjet nozzle 64 is moved by the nozzle scanning mechanism 66 along the four sides of the substrate G by the path of (1) → (2) → (3) → (4), and by The inkjet nozzle 64 drops a desired amount of the resist liquid at each point on the path, and a rectangular linear resist coating film 76 can be formed on the peripheral portion of the application region RE. Here, the application region RE is a region on the substrate G in which the resist liquid is applied in a planar shape by a non-rotation method in a planar coating unit (ACT) 40 to be described later. Usually, the outer edge position of the coating region RE is set to be some (for example, 10 mm) from the inner side of the end portion of the substrate G.

The planar pattern shape of the linear resist coating film 76 is based on the shape of the mating substrate G (quadruple), but is in accordance with the specifications required in the planar resist coating unit (ACT) of the subsequent step or Processing conditions can be varied arbitrarily. For example, in the conventional technique shown in Figs. 22 to 27, in order to reduce the film thickness variation or unevenness of the edge portion of the resist coating film 200 more effectively, it is preferable to face the latter step. In the resist application unit (ACT), the corner portion 76A of the linear resist coating film 76 is enlarged in the circle portion of FIG. 8 at the one end side of the substrate in the X direction which is the application start position A. FIG. The pattern shown in the rounded manner on the inner side or the other end side of the substrate in the X direction of the coating end position C, the corner portion 76C of the linear resist coating film 76 is enlarged as shown in the inside of the circle of FIG. The pattern shown in Fig. LC is sharply angled and expanded outward.

Further, as shown in FIG. 5, the cross-sectional shape or size of the linear resist coating film 76 (especially It is a width W or a height H, etc., and can be arbitrarily selected within certain limits. In the figure, a broken line J shows the boundary between the product area and the non-product area on the substrate G. In general, the outer circumferential position of the application region RE is set to the outer side of the boundary J. Therefore, the linear resist coating film 76 may be formed on the outer side of the boundary J.

As described above, the linear resist coating film 76 formed on the substrate G in the linear coating unit (LCT) 44 is dried by the heating unit (HP) 50 by heat treatment (step S7). This heat drying is performed by evaporating the solvent remaining in the linear resist coating film 76 to improve the adhesion to the substrate G, and it is not necessary to dry as much as possible (step S11), and may be semi-dry. .

In Fig. 6, the main components in the planar coating unit (ACT) 40 are shown. The surface coating unit (ACT) 40 has a pedestal 80 for holding and holding the substrate G horizontally, and a coating processing portion 84 for being placed on the substrate G placed on the pedestal 80 (correct In the coating region RE), a strip-shaped resist nozzle (hereinafter referred to as "long nozzle") 82 is used, and the resist liquid is applied in a planar shape by a non-rotation method.

The coating processing unit 84 includes a resist liquid supply mechanism 86 including an elongated nozzle 82, and a nozzle moving mechanism 88 that horizontally moves the elongated nozzle 82 in the X direction above the pedestal 80 during the coating process. In the resist liquid supply mechanism 86, the elongated nozzle 82 has a slit-shaped discharge port extending in the Y direction, and the length thereof can cover one end of the substrate G on the cover pedestal 80 to the other end, and is connected to the liquid from the resist. A resist liquid supply pipe 90 (not shown) is supplied. The nozzle moving mechanism 88 has a nozzle support body 92 which is a U-shaped or gate shape for horizontally supporting the elongated nozzle 82, and a straight drive unit 94 for moving the nozzle support body 92 in the X direction. The linear drive unit 94 can be constituted by, for example, a guide linear motor mechanism or a ball screw mechanism. Further, the guide elevating mechanism 96 for changing or adjusting the height position of the elongated nozzle 82 may be provided, for example, at a connecting portion 98 that connects the nozzle support body 92 and the elongated nozzle 82. The lifting mechanism 96 can adjust or change the height position of the elongated nozzle 82, so that the distance between the lower end of the elongated nozzle 82 or the discharge port and the upper surface of the substrate G on the pedestal 80 (the surface to be treated) can also be That is, the gap size can be adjusted or changed arbitrarily.

The elongated nozzle 82 is made of, for example, a metal structure excellent in rust resistance and workability such as stainless steel. A tapered surface having a slit-shaped discharge port toward the lower end and having a tip end tapered. The total length of the slit-shaped discharge port of the elongated nozzle 82 corresponds to the width dimension of the substrate G or the width (distance gap) between the linear resist coating films which are described later. Thereby, both ends of the discharge port of the elongated nozzle 82 can be moved substantially in the X direction on the right and left ends of the application region RE on the substrate G.

In the surface coating unit (ACT) 40, the substrate G is placed on the pedestal 80, and the resist liquid supply mechanism 86, the nozzle moving mechanism 88, and the like are controlled by a controller (not shown). As shown in FIG. 8, the coating region RE on the substrate G, that is, the region surrounded by the rectangular frame or the bank of the linear resist coating film 76 can be formed in a desired film thickness. The resist coating film 100 is formed.

More specifically, as shown in FIG. 6, the elongated nozzle 82 is moved at a constant speed by the nozzle moving mechanism 88 at a predetermined height above the pedestal 80 in a manner of being cut or scanned in the X direction. The etchant supply mechanism 86 supplies the strip-shaped discharge flow in which the resist liquid is expanded in the Y direction from the slit-shaped discharge port of the elongated nozzle 82 to the application region RE of the substrate G on the pedestal 80. By the coating scanning of the elongated nozzle 82, as shown in FIG. 7, the surface of the resist liquid is formed on the substrate G from the one end of the substrate to the other end in such a manner as to follow the elongated nozzle 82. The film 100 is coated. At this time, the planar resist coating film 100 is in contact with or integrated with the linear resist coating film 76 in the process of expanding toward the outer side (particularly the left and right outer sides) of the substrate G, by the linear resist. The coating film 76 defines the position of the outer edge of the planar resist coating film 100 while the film thickness is also controlled.

In other words, at the coating start position A, since the gap between the elongated nozzle 82 and the substrate G is narrowed, the resist liquid is discharged beforehand or the liquid is adhered. Therefore, the slit shape of the elongated nozzle 82 is formed. The resist liquid discharged from the discharge is easily spread over the substrate G to the outside (especially, the outer side in the longitudinal direction of the nozzle). However, in this embodiment, the linear resist coating film 76 is formed in advance in the outer edge portion of the application region RE. As a result, as shown in FIG. 9, the outer edge of the planar resist coating film 100 is restricted by the bank portion of the linear resist coating film 76, so that it is not expanded to the outside (dike effect), such as imaginary The apex thinning (sag) of the film thickness indicated by line 100' is prevented. In particular, as shown in Figure 8, the inside of the circle is enlarged. As shown in FIG. LA, in the pattern in which the corner portion (corner portion) of the linear resist coating film 76 on the application start position A side is rounded, the effect of preventing the embankment effect or the film thickness sinking can be further improved. .

On the other hand, in the coating scanning, as shown in FIG. 7, the elongated nozzle 82 is moved in the X direction above the substrate G in a state where a meniscus is formed at the lower end portion of the back surface, so that the substrate G can be discharged immediately. Since the resist liquid is dragged by the elongated nozzle 82, the resist liquid is subjected to a force approaching the inside at the right and left end portions of the intermediate portion B. However, in this embodiment, since the linear resist coating film 76 is formed in the outer edge portion of the application region RE, the outer edge portion of the planar resist coating film 100 is as shown in FIG. Since it stays at a predetermined outer peripheral position due to the attraction with the adhesion (wetting) of the linear resist coating film 76, it does not approach to the inside, and the film thickness bulge as shown by the imaginary line 100' is suppressed. .

Further, at the coating end portion, the resist liquid discharged onto the substrate G receives a larger inward force from the side of the elongated nozzle 82 than the intermediate portion B of the coating, but still due to the linear resist The attraction of the coating film 76 (wetting) stays at a predetermined outer circumferential position without coming close to the inner side, and the film thickness bulging is prevented. In particular, as shown in the in-circle portion enlarged view LC in FIG. 8, the corner portion 76C of the linear resist coating film 76 at the application end position C forms an acute angle and spreads outward, and the coating is finished. At this time, an excessive amount of the resist liquid discharged from the elongated nozzle 82 is guided to the expanded portion of the region and is firmly held by the adhesion of the linear resist coating film 76. The effect of preventing the film thickness bulging as described above is further enhanced.

Further, in this embodiment, at the application start position A, the liquid adhesion property in the gap between the elongated nozzle 82 and the substrate G is filled with the resist liquid at the application start position A for good reproduction. Sexuality. In other words, as shown in FIG. 12, since the linear resist coating film 76 is formed in the vicinity of the coating start position A or the X-direction outer side, the slit-shaped discharge port 82a of the elongated nozzle 82 is formed. The liquid repellent liquid R to be discharged is adhered or integrated so as to overlap the linear resist coating film 76 from above, and is expanded in the Y direction of the nozzle side, so that the resist liquid R can be free of voids. Fill the gap in the gap and fill it completely.

As described above, the coating scan is started by completely filling the resist liquid in the gap between the elongated nozzle 82 and the substrate G, and as shown in Fig. 7, the curved portion formed at the lower portion of the back surface of the elongated nozzle 82 is formed. The ridge line (wet line) WL of the liquid surface can be maintained at a horizontal straight line, and a flat coating of the resist coating film 100 is formed on the substrate G.

In this embodiment, it is not necessary to change or replace the hard body of the elongated nozzle 82 with respect to various specifications or conditions of the resist processing, and the outline of the linear resist coating film 76 is appropriately selected (coating position) , height H, width W, etc., film thickness control as described above can be easily performed.

For example, if the film thickness setting value of the planar resist coating film 100 is changed from T _a to approximately twice the T _b without changing the coating conditions such as the scanning speed or the resist characteristics, the coating scan is performed. The intermediate portion B has a stronger force against the amount of the resist liquid which is spread outward from the substrate due to the force which is inwardly moved by the elongated nozzle 82, and is easily raised in the left and right end portions. Or drooping outwards (sag).

In this case, as shown in FIG. 11, the coating position of the linear resist coating film 76 is brought closer to the inner side of the substrate (the product region side), so that the linear resist coating film 76 can be prevented. The resist coating film 100 is expanded toward the outer edge portion and has a function of a dike effect. Thereby, the film thickness of the planar resist coating film 10 shown by the imaginary line (single-dotted line) 100' can be reduced or drooped, and the film thickness can be made uniform.

As described above, according to the embodiment, in the non-rotation type resist coating, the linear resist coating film 76 can be formed in advance on the outer periphery of the application region RE set on the substrate G. In the normal non-rotation coating treatment, the film thickness control of the planar resist coating film 100 is easily performed, and in particular, the film thickness uniformity control of the peripheral portion is controlled. Further, in the liquid adhering operation at the start of application or immediately before the start of the coating, the gap between the elongated nozzle 82 and the substrate G can be reliably filled with the resist liquid with good reproducibility, thereby preventing it from being prevented. The coating scanning resulted in strip coating unevenness, and a flat surface good resist film was obtained.

In the above embodiment, the process of forming the linear resist coating film 76 on the substrate G is performed by a dedicated linear coating unit (LCT) 44. However, the apparatus for performing the linear coating treatment may be disposed in parallel or discharged into the planar coating unit (ACT) 40.

For example, as shown in FIG. 14, in the surface coating unit (ACT) 40, the ink jet nozzle 64 can be transmitted through the linear coating processing device (FIG. 3) constituting the linear coating unit (LCT) 41. The same X guide rail 70 and the carriage 74 are mounted on the nozzle holder 92 of the nozzle moving mechanism 88. In this case, in the coating scan in which the nozzle moving mechanism 88 moves the elongated nozzle 82 in the predetermined direction (X direction) above the pedestal 80, the ink jet nozzle 64 can be moved to the position before the elongated nozzle 82 and the pedestal. Above the 80, a linear coating scan by the inkjet nozzle 64 can be performed before the planar coating scan by the elongated nozzle 82.

When the linear coating processing apparatus is provided in the planar coating unit (ACT) 40 in this manner, it is preferable to provide the linear resist which is formed on the substrate G in the unit (ACT) 40 as well. The mechanism in which the membrane 76 is dried. For example, as shown in FIG. 16, the warm air heater 102 may be scanned behind the ink jet nozzle 64. The warm air heater 102 has, for example, a heat generating portion 104 composed of a resistance heat generating mechanism, and introduces air or nitrogen gas through the gas pipe 106, and is blown and dried by the warm air heater 102 toward the linear resist coating film 76 on the substrate G. Use the warm wind. Alternatively, the effect of the action of the linear resist coating film 76 may be reduced to some extent, and the surface coating treatment may be performed without performing a special drying treatment after the linear coating treatment.

In the above embodiment, the linear resist coating film 76 is formed on the substrate G in a single manner on the outer edge of the application region RE. However, it is also possible to form a linear resistance only in a part of the outer circumference of the coating region RE, for example, only in the vicinity of the coating start position A, or only the coating scanning intermediate portion, or only the coating end portion, or only the corner portion. The etchant coats the film 76. Further, in a modification of the application pattern shown in the enlarged view LC of FIG. 8, the linear resist film 76 of the corner portion (corner portion) can be left without being bonded, and this configuration can also be obtained. The same effect as above.

In the above embodiment, the coating scanning system fixes the substrate G to the pedestal 80, and moves the inkjet nozzle 64 or the elongated nozzle 82 in a predetermined direction or path above it. However, the method in which the substrate G is moved in a predetermined direction or the nozzles 64 and 82 and the substrate G may be simultaneously moved by fixing the nozzles 64 and 82. It is also possible to float the transport type in which the substrate G is floated in the air during the coating scan.

In the above-described embodiment, when the liquid adheres at the start of application, a small amount of the resist liquid is discharged from the elongated nozzle 82 to a narrow gap between the substrate and the substrate G, but other methods are also used. Liquid adhesion can be performed by a priming process. According to the primer treatment method, the resist liquid is applied to the vicinity of the discharge port of the elongated nozzle 82 in the substrate processing portion provided near the pedestal 80, and then the elongated nozzle 82 is moved over the pedestal 80 and then lowered. The height of the predetermined narrow gap is formed between the substrate G and the substrate, and then the resist liquid film adhering to the lower end of the substrate G contacts the application start position A of the substrate G. According to the invention, since the linear resist coating film is formed in advance in the vicinity of the coating start position A, the liquid adhesion by the primer treatment method can be performed with good reproducibility.

Further, while the resist liquid discharged from the elongated nozzle 82 reaches the first time of liquid contact with the linear resist coating film 76, it is preferable to first stop or move the elongated nozzle 82. Once the resist is liquid-contacted to the linear resist coating film 76, even if the elongated nozzle 82 is moved, the resist is attracted to the linear resist coating film 76, and can be elongated. The resist is supplied between the nozzle 82 and the linear resist coating film 76 without a gap. The period from when the resist is ejected to when the elongated nozzle 82 starts to move can be obtained by experiments or the like in advance.

Further, in order to discharge the resist from the elongated nozzle 82 and quickly contact the linear resist film 76, the resist may be discharged more than the predetermined amount at the initial stage, and may be discharged. After the resist is wetted with the linear resist coating film 76, the remaining amount of the resist is sucked into the elongated nozzle 82. The period from the discharge of the resist to the start of the suction can be obtained by a preliminary experiment or the like.

Further, although not shown in the drawings, the device configuration may be such that a linear coating unit (LCT) 44 has a plurality of (for example, four) nozzles 64 corresponding to respective sides of the substrate, and linear resistance is formed along each side of the substrate. The etchant coats the film 76. In this case, the desired linear resist coating film 76 can be formed on the substrate in a shorter time.

The nozzle for coating a linear resist film and the nozzle for coating a planar resist film used in the present invention may be variously modified. For example, an ink jet nozzle 64 may be used instead, and a solenoid valve opening/closing nozzle having a discharge port of a fine hole may be used. Also, long strip The discharge port of the nozzle 82 is not limited to the slit type, and a plurality of fine hole discharge ports may be arranged in a line.

Further, in the linear coating step, the shape of the linear resist coating film 76 can be deformed into an arbitrary pattern other than the line. In particular, in the planar coating by the non-rotation method, as described above, the resist liquid film is likely to be on the inner side of the coating end portion (particularly the right and left corner portions) on the substrate G (perpendicular to the coating scanning direction). The center side of the substrate in the direction is substantially close. According to the present invention, in the vicinity of the end of the planar resist coating film on the substrate G (especially the right and left corner portions), it can be previously (for example, in the same coating step as the above-described linear coating step) The desired pattern forms the outline of the planar resist coating film, in particular, the preceding resist coating film for expanding the outline of the left and right corners.

For example, as shown in FIG. 17, the preceding resist coating film 110 can be formed in a substantially right-angled or "shaped" pattern on the left and right corners of the rear surface side of the planar coating on the substrate G. In this case, in the planar coating step, the planar resist coating film 112 formed on the substrate G can be as shown in FIG. 18 even if the coating scanning end portion is inwardly located (especially as the inner portion of the circle). In the left and right corners of the substrate G, a portion of the planar resist coating film 112 is superposed on the preceding resist coating film 110 and combined (integrated) to obtain a prior resist coating. The film film 110 is a synthetic resist coating film 114 which defines a corner shape (orthogonal shape) as an expanded portion of the planar resist coating film 112.

Further, in the present invention, the pattern or layout of the preceding resist coating film 110 can be arbitrarily deformed. For example, it may be a circular pattern as shown in FIG. 19, a short booklet shape or a rectangular pattern extending in the scanning direction of the planar coating as shown in FIG. 20, and perpendicular to the scanning direction of the planar coating as shown in FIG. A short booklet or rectangular pattern extending in the direction. In such a case, it is also possible to obtain, at the terminal of the surface coating scanning, the planar resist coating film 112 and the preceding resist coating film 110 are combined (integrated), and the resist coating film 110 is used as the surface. The extended portion of the resist coating film 112 defines a synthetic resist coating film 114 having a predetermined corner shape.

Further, in the present invention, a resist liquid may be taken from the preceding coating film, and a solvent such as a thinner may be used instead, to form the same pattern or layout as described above. In this case, although the illustration is omitted, if the planar resist coating step is applied to the planar resist coating film When the first diluent coating film is blended, the resist liquid of the planar resist coating film is wetted on the first thin film coating film and diffused, and as a result, the contour of the planar resist coating film is expanded. Or extend the profile of the leading thinner coated film. Thereby, the planar resist coating film can form the coating film profile of the right and left corners in a desired shape (for example, a right-angle shape) even if the coating scanning end portion is approached inside.

The above embodiment relates to a resist coating apparatus in a coating and developing treatment system for LCD manufacturing, but the present invention is applicable to any processing apparatus or apparatus that supplies a processing liquid to a substrate to be processed. Therefore, in the present invention, the treatment liquid may be, for example, a coating liquid such as an interlayer insulating material, a dielectric material, or a wiring material, or a developing solution or a rinse liquid, in addition to the resist liquid. In the present invention, the substrate to be processed is not limited to the LCD substrate, and may be another substrate for a flat display, a semiconductor wafer, a CD substrate, a glass substrate, a photomask, a printed substrate, or the like.

A‧‧‧ Coating start position

B‧‧‧ Coating intermediate

C‧‧‧ Coating Terminal

CR‧‧‧Carmen

G‧‧‧Substrate

WL‧‧‧ ridge line (wet line)

RE‧‧‧coated area

10‧‧‧Card Station (C/S)

12‧‧‧Processing Station (P/S)

14‧‧‧Interface Department (I/F)

16‧‧‧Card pedestal

17‧‧‧Transportation

19‧‧‧Transportation

20‧‧‧Transportation agency

22‧‧‧ Cleaning and Processing Department

23‧‧‧Substrate relay department

24‧‧‧ Coating Processing Department

25‧‧‧Chemical solution supply unit

26‧‧‧Development Processing Department

27‧‧‧ Space

28‧‧‧ wipe cleaning unit (SCR)

30‧‧‧UV irradiation/cooling unit (UV/COL)

32‧‧‧heating unit (HP)

34‧‧‧Cooling unit (COL)

36‧‧‧Transportation

38‧‧‧Conveyor

40‧‧‧Face coating unit (ACT)

42‧‧‧Decompression Drying Unit (VD)

44‧‧‧Line coating unit (LCT)

46‧‧‧Adhesive/Cooling Unit (AD/COL)

47‧‧‧Transportation

48‧‧‧Heating/cooling unit (HP/COL)

50‧‧‧heating unit (HP)

52‧‧‧Development unit (DEV)

53‧‧‧Heating/cooling unit (HP/COL)

54‧‧‧Conveyor

55‧‧‧heating unit (HP)

56‧‧‧Extension

57‧‧‧buffer pedestal

58‧‧‧Transportation

59‧‧‧Transportation agencies

60‧‧‧Conveyor

62‧‧‧ pedestal

64‧‧‧Inkjet Resist Nozzles

66‧‧‧Nozzle scanning mechanism

68Y‧‧‧ Guide rail

70X‧‧‧guide track

72Y‧‧ Direction Drive Department

74‧‧‧Slide

76‧‧‧Line resist coating film

76A‧‧‧ corner

76C‧‧‧ corner

80‧‧‧ pedestal

82‧‧‧resist nozzle

82a‧‧‧Slit-like spit

84‧‧‧ Coating Processing Department

86‧‧‧Resist liquid supply mechanism

88‧‧‧Nozzle moving mechanism

90‧‧‧resist solution supply tube

92‧‧‧Nozzle Support

94‧‧‧Direct drive department

96‧‧‧ with guiding lifting mechanism

98‧‧‧Connecting Department

100‧‧‧Face coating film

100’‧‧‧ imaginary line

102‧‧‧Warm heater

104‧‧‧The Ministry of Heating

106‧‧‧ gas pipe

110‧‧‧First resist coating film

112‧‧‧Face coating film

114‧‧‧Synthetic resist coating film

200‧‧‧resist coating film

202‧‧‧resist nozzle

202a‧‧‧Slit-like spit

204‧‧ ‧ uplift

204’‧‧‧ dotted line

206‧‧‧ Between the gaps

208‧‧‧Uneven coating

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a plan view showing the constitution of a coating and developing treatment system to which the present invention is applicable.

Fig. 2 is a flow chart showing the processing steps in the coating and developing treatment system of the embodiment.

Fig. 3 is a perspective view showing the configuration of essential parts in a linear coating unit included in the coating and developing treatment system of the embodiment.

Fig. 4 is a schematic plan view showing a plan view pattern of a linear resist coating film formed on a substrate in the embodiment.

Fig. 5 is a schematic cross-sectional view showing a coating position and a cross-sectional shape of a linear resist coating film formed on a substrate in the embodiment.

Fig. 6 is a perspective view showing the configuration of essential parts in the surface coating unit included in the coating and developing treatment system of the embodiment.

Fig. 7 is a perspective view showing the action in the surface coating unit of the embodiment.

Fig. 8 is a schematic plan view showing a plan view pattern of a planar resist coating film formed on a substrate in the embodiment.

Fig. 9 is a view showing the action of one of the linear resist coating films in the embodiment; Partial section view.

Fig. 10 is a schematic partial cross-sectional view showing the action of one of the linear resist coating films in the embodiment.

Fig. 11 is a schematic partial cross-sectional view showing the action of one of the linear resist coating films in the embodiment.

Fig. 12 is a schematic partial cross-sectional view showing the action of one of the linear resist coating films in the embodiment.

Fig. 13 is a schematic partial cross-sectional view showing the action of one of the linear resist coating films in the embodiment.

Fig. 14 is a perspective view showing a configuration of a modified example in which the planar coating treatment apparatus is discharged into the linear coating processing apparatus in the embodiment.

Fig. 15 is a schematic plan view showing the action of the coating treatment of the configuration example of Fig. 14.

Fig. 16 is a schematic side view showing a configuration example in which the configuration of Fig. 14 is discharged into a heating and drying device.

Fig. 17 is a plan view showing an example of a pattern of a prior resist coating film in the embodiment.

Fig. 18 is a plan view showing the action of the coating film in the first embodiment.

Fig. 19 is a plan view showing another example of the pattern of the preceding coating film in the embodiment.

Fig. 20 is a plan view showing another example of the pattern of the preceding coating film in the embodiment.

Fig. 21 is a plan view showing another example of the pattern of the preceding coating film in the embodiment.

Fig. 22 is a schematic plan view showing a plan view pattern of a resist coating film obtained on a substrate by a non-rotation coating process of a prior art.

Figure 23 is a schematic front view showing the effect of a non-rotating coating process of the prior art.

Figure 24 is a schematic partial cross-sectional view showing a problem point in the prior art.

Figure 25 is a schematic partial cross-sectional view showing a problem point in the prior art.

Fig. 26 is a schematic front view showing a problem point in the prior art.

Fig. 27 is a schematic perspective view showing a problem point in the prior art.

G‧‧‧Substrate

J‧‧ Realm

76‧‧‧Line resist coating film

100‧‧‧Face coating film

100’‧‧‧ imaginary line

Claims (24)

A coating method comprising: a coating step of setting a coating region on a substrate to be processed, applying a treatment liquid to a part or all of a peripheral portion thereof to form a linear coating film; and coating the surface a step of applying a treatment liquid to the coating region on the substrate to form a planar coating film; wherein the contour of the linear coating film is selected in the linear coating step by The linear coating film prevents expansion of the treatment liquid applied to the substrate by the planar coating step; and in the linear coating step, at the coating start position of the planar coating step, the line The corners of the coated film form a smooth pattern. A coating method comprising: a coating step of setting a coating region on a substrate to be processed, applying a treatment liquid to a part or all of a peripheral portion thereof to form a linear coating film; and coating the surface a step of applying a treatment liquid to the coating region on the substrate to form a planar coating film; wherein the contour of the linear coating film is selected in the linear coating step to enable The coating liquid coated on the substrate by the planar coating step is expanded toward the peripheral side of the coating region by the attraction force caused by adhesion to the linear coating film; and the linear coating step is At the coating start position of the surface coating step, the corner portion of the linear coating film forms a smooth pattern. The coating method according to claim 1 or 2, wherein the linear coating step includes a step of moving a first nozzle that discharges the treatment liquid in a line shape with respect to the substrate. The coating method according to claim 1 or 2, wherein the planar coating step includes a step of moving a second nozzle that discharges the treatment liquid in a strip shape with respect to the substrate. The coating method of claim 4, wherein the second nozzle is an elongated nozzle having a slit-shaped discharge port, and the elongated nozzle is parallel to the substrate in the planar coating step Moves in a direction perpendicular to the longitudinal direction of the nozzle. The coating method of claim 5, wherein the outline of the linear coating film is selected, and the treatment liquid coated on the substrate by the second nozzle is formed at the beginning of the surface coating step The linear coating film adheres to fill the gap. The coating method of claim 1 or 2, wherein the contour of the linear coating film comprises at least one of a coating film thickness, a line width, and a position on the substrate. The coating method according to claim 1 or 2, wherein the linear coating film formed by the linear coating step is heated and dried before the surface coating step. A coating apparatus comprising: a linear coating treatment unit that sets a coating region on a substrate to be processed, and applies a treatment liquid to a part or all of a peripheral portion thereof to form a linear coating film; and a planar coating film; a cloth processing unit that applies a processing liquid to form a planar coating film on the coating region on the substrate, and is characterized in that the outline of the linear coating film is selected to be coated by the linear coating film The expansion of the treatment liquid applied to the substrate by the planar coating treatment portion is prevented; and the corner portion of the linear coating film forms a smooth pattern at the application start position of the planar coating film. The coating apparatus according to the ninth aspect of the invention, wherein the linear coating processing unit includes: a first nozzle; the substrate facing the horizontal state discharges the processing liquid in a line shape from above; and the first coating scanning unit The first nozzle is moved relative to the substrate, and the linear coating film is formed by the treatment liquid discharged from the first nozzle onto the substrate. The coating device of claim 10, wherein the first nozzle is a spray that pressurizes the treatment liquid in the nozzle according to an electric drive signal and ejects in the form of droplets. It is composed of a jet nozzle. The coating apparatus according to any one of claims 9 to 11, wherein the surface coating treatment unit has a second nozzle, and the substrate facing the horizontal state discharges the treatment liquid in a strip shape from above; 2. The scanning unit is applied to move the second nozzle relative to the substrate, and the processing liquid discharged from the second nozzle onto the substrate is applied to the entire coating area. The coating device of claim 12, wherein the second nozzle is formed by an elongated nozzle having a length extending from one end to the other end of the coating region in one direction Slit-like spout. The coating device according to claim 12, wherein the linear coating treatment portion and the planar coating treatment portion have independent support portions for supporting the substrate in a horizontal state. The coating apparatus according to claim 12, wherein the linear coating processing unit and the planar coating processing unit have a common supporting portion for supporting the substrate in a horizontal state. The coating apparatus according to any one of claims 9 to 11, wherein the coating device has a drying mechanism, and the linear coating film formed on the substrate by the linear coating treatment portion is heated and dried. A coating apparatus comprising: a linear coating treatment unit that sets a coating region on a substrate to be processed, and applies a treatment liquid to a part or all of a peripheral portion thereof to form a linear coating film; and a planar coating film; a cloth processing unit that applies a processing liquid to form a planar coating film on the coating region on the substrate, and selects a contour of the linear coating film to be coated by the planar coating The treatment liquid applied to the substrate is expanded toward the peripheral side of the coating region by the attraction force caused by adhesion to the linear coating film; and at the coating start position of the planar coating film , the corner of the linear coating film forms a circle Slip pattern. The coating apparatus according to claim 17, wherein the linear coating processing unit includes a first nozzle, and the substrate is discharged in a line from a top to the substantially horizontal state; and the first coating scan is performed. The first nozzle moves relative to the substrate, and the linear coating film is formed by the treatment liquid discharged from the first nozzle onto the substrate. The coating apparatus according to claim 18, wherein the first nozzle is constituted by a jet nozzle that pressurizes the processing liquid in the nozzle in accordance with an electric driving signal and ejects it as a droplet. The coating apparatus according to any one of claims 17 to 19, wherein the surface coating treatment unit has a second nozzle, and the substrate is discharged in a strip shape from above in a substantially horizontal state; The second coating scanning unit moves the second nozzle relative to the substrate, and the processing liquid discharged from the second nozzle onto the substrate is applied to the entire coating area. The coating device of claim 20, wherein the second nozzle is formed by an elongated nozzle having a length extending from one end to the other end of the coating region in one direction Slit-like spout. The coating device according to claim 20, wherein the linear coating treatment portion and the planar coating treatment portion have independent support portions for supporting the substrate in a horizontal state. The coating apparatus according to claim 20, wherein the linear coating processing unit and the planar coating processing unit have a common supporting portion for supporting the substrate in a horizontal state. The coating apparatus according to any one of claims 17 to 19, further comprising a drying mechanism that heats and dries the linear coating film formed on the substrate by the linear coating treatment portion.