TWI419820B - Manufacturing method of middle layer of packing tape for passive components and its structure - Google Patents

Description

Method for manufacturing intermediate layer of passive component carrier tape and structure thereof

The present invention relates to a container for storage or transportation of an object or material, and more particularly to a method of manufacturing an intermediate layer of a passive component carrier tape and a structure thereof.

With the advancement of technology, electronic products on the market are becoming more and more compact, and manufacturers are putting more passive components into smaller structures as much as possible to meet the demand for miniaturization of the current customer base. Current passive components, such as multilayer ceramic capacitors (MLCC), are mostly mounted on a circuit board using a surface mounted technology (SMT) process. In the past, in order to accurately and quickly install a passive component in an electronic product, a carrier tape was used as a carrier for transporting a passive component in the manufacturing process, and was manufactured in response to a large amount of automation. Regarding the manufacture of the carrier tape, a plurality of through-holes are formed on the intermediate layer of the carrier tape, and then the bottom layer is attached to accommodate the passive components to be loaded for carrying the package. . However, as the passive components are light and thin, especially for example, the 0201 size, the loading holes are relatively narrow. When the loading holes are punched, burrs are generated in the loading holes, which will seriously hinder the passive components and cannot be completely inserted. The problem of an increase in the rate of non-performing has been found by existing manufacturing techniques.

At present, although the mainstream specifications of passive components in the market are 0805 and 0402, the application of smaller passive components (such as 0201, size 0.6×0.3×0.3 mm) is increasing, and the smaller the size of passive components on electronic products is required. The components, so the carrier holes for the passive components placed on the carrier tape are also required to be made smaller and smaller, so that the adverse effects of the burrs on the small-sized passive components are relatively increased. If a burr is formed in the loading hole or at one end of the loading hole, the passive component will be caught in the loading hole during the loading operation, so that the reclaiming operation or the flying cannot be successfully completed in the subsequent reclaiming operation. In the case of materials, even after the reclaiming, the passive components are affected by the burrs and the displacement problem occurs. In addition, passive components of small size are more susceptible to burrs, resulting in incomplete placement into the carrier aperture and protruding from the smooth surface of the carrier tape. When the adhesive can tear off the cover layer, it is easy for the passive component to directly adhere to the peelable cover layer and be peeled off together with the peelable cover layer, so that the carrier tape is empty. Therefore, the burrs in the loading holes can have many adverse effects on the passive components, and become more serious as the size of the passive components shrinks. Therefore, subject to the processing precision of existing products, the size of the loading holes and the small passive components are increasingly difficult to match.

For example, in the method of manufacturing a carrier tape for a microelectronic component, the first step is to first punch a pre-punching hole on the carrier tape with the first punch, and then perform the second step, The second punch is aligned with the pre-punching hole and the receiving groove for accommodating the micro electronic component (passive component) is punched out, so that the material is pressed toward the pre-punching hole during the punching process of the accommodating groove to provide material punching and pressing The gap. It is not the same as the method of punching the through-holes and covering the bottom layer directly on the loading belt, and not only the engineering steps of forming holes but also the operation is difficult. In addition, an attempt has been made to form a carrier hole on a carrier tape in a laser manner, such as the method of forming a carrier tape and a device thereof, which is an actuating energy beam generator that emits an energy beam to burn. The carrier tape is formed to form a carrier hole in order to reduce the problem of burrs in the carrier hole. However, the use of laser perforation is too expensive and is not suitable for passive component carriers used as consumables. In order for the cauterization step to proceed smoothly, a cooling step must be performed before the cauterization step to cool the carrier tape. The surface of the carrier hole is formed, resulting in a substantial increase in manufacturing cost.

In order to solve the above problems, the main object of the present invention is to manufacture a passive component carrier tape intermediate layer and a structure thereof, which can prevent the passive component from being obstructed by the burrs in the carrier hole for accurately performing the loading of the passive component. With reclaiming operations.

A second object of the present invention is to provide a method for manufacturing an intermediate layer of a passive component carrier tape and a structure thereof, which can be applied to mass production of automation, and can prevent the carrier hole of the flexible tape from being incapable of matching the size of the passive component. The problem is to improve the processing accuracy of the product.

The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. The invention discloses a method for manufacturing an intermediate layer of a passive component carrier tape, comprising: providing a flexible tape body having a smooth surface and a bottom surface. Performing a punching step, so that the flexible strip body forms a plurality of positioning holes and a plurality of loading holes, and the positioning holes and the plurality of loading holes are penetrated from the smooth surface to the bottom surface, The alignment holes are arranged in a direction parallel to the arrangement direction of the plurality of carrier holes, and the carrier holes are rectangular for receiving the passive components. Performing a sand blasting step, the bottom surface of the flexible strip is subjected to single-side blasting to remove the burrs in the loading holes. The invention further discloses a structure made in accordance with this method.

The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures.

In the manufacturing method of the intermediate layer of the passive component carrier tape, the hole length of the carrier holes may not be larger than the aperture of the positioning holes.

In the above-described manufacturing method of the intermediate layer of the passive component carrier tape, the bottom surface of the flexible tape which has been blasted can be simultaneously jet-cleaned in the above-described blasting step.

In the aforementioned method for manufacturing the intermediate layer of the passive component carrier tape, the blasting pressure in the blasting step may be between 0.4 MPa and 1.0 MPa.

In the above manufacturing method of the intermediate layer of the passive component carrier tape, in the blasting step, the flexible tape system can be conveyed by the tape and the bottom surface of the flexible tape can be carried out from the top to the bottom. Sandblasted.

It can be seen from the above technical solutions that the manufacturing method of the intermediate layer of the passive component carrier tape of the present invention has the following advantages and effects:

1. The blasting step can be performed after the punching step as one of the technical means, since the bottom surface of the flexible strip body is subjected to single-side blasting in the blasting step to remove the loading hole of the flexible strip body. The inside of the burrs. Therefore, it is possible to prevent the passive component from being obstructed by the burrs in the carrier hole for accurately performing the loading and unloading operations of the passive component.

2. The sandblasting step can be performed after the punching step as one of the technical means, since the flexible belt system is conveyed by the web and the bottom surface of the flexible strip is sandblasted from the top to the bottom, It can be applied to mass production of automation, and can avoid the problem that the loading hole of the flexible tape body cannot be matched with the size of the passive component, so as to improve the processing precision of the product.

The embodiments of the present invention will be described in detail below with reference to the accompanying drawings in which FIG. The components and combinations related to this case, the components shown in the figure are not drawn in proportion to the actual number, shape and size of the actual implementation. Some size ratios are proportional to other related sizes or have been exaggerated or simplified to provide clearer description of. The actual number, shape and size ratio of the implementation is an optional design, and the detailed component layout may be more complicated.

According to an embodiment of the present invention, a method for manufacturing an intermediate layer of a passive component carrier tape is illustrated in a flow block diagram of FIG. 1 , a schematic diagram of components in a process of FIGS. 2A to 2D, and a passive image in FIG. 4 . A schematic cross-sectional view of the state of the component. According to FIG. 1, the manufacturing method of the intermediate layer of the passive component carrier tape mainly comprises the following steps: "providing a flexible tape body" step 1. "Performing a punching step to form a flexible tape body to form a positioning Step 2 of the hole and the loading hole and Step 3 of "Single-sand blasting the bottom surface of the flexible tape by performing a sand blasting step", please refer to Figures 2A to 2D for detailed steps, as explained below.

Referring to FIG. 2A, a flexible tape body 110 is provided. The flexible tape body 110 has a smooth surface 111 and a bottom surface 112. Referring to FIG. 4, the flexible tape 110 serves as an intermediate layer of the carrier tape of the plurality of passive components 40. After the flexible tape body 110 is punched, the bottom surface 112 is used to adhere to the surface of the bottom layer 130, so that the through hole is a receiving groove of the passive component, and the smooth surface 111 is used for pasting. The surface of the cover layer 120 is peeled off to cover the passive elements within the perforations. As shown in FIG. 3, the flexible tape body 110 can be wound up in a carrier reel 20. In this step, the flexible tape body 110 is wound such that the smooth surface 111 faces outward and the bottom surface 112 faces inward.

Referring to FIG. 2B, a punching step is performed to form the plurality of positioning holes 113 and the plurality of loading holes 114, and the positioning holes 113 and the loading holes 114 are formed in the flexible strip 110. The smooth surface 111 is penetrated to the bottom surface 112, and the flexible strip 110 can be stamped by a stamping jig, and the stamped portion is pressed to form the positioning holes 113 and the loads. The holes 114 are available for passive components or wafer-type electronic components. The positioning holes 113 are generally circular, which are arranged adjacent to one side of the flexible strip 110 and are arranged at right equidistant intervals. The alignment holes 113 are arranged in parallel to the loading holes 114. The direction of the arrangement is such that the plurality of loading holes 114 are rectangular for receiving the passive components. Specifically, the hole lengths of the load holes 114 (referring to the longer sides of the load holes 114) may be no larger than the apertures of the positioning holes 113 for accommodating and positioning passive components of smaller size. For example, the length of the holes of the loading holes 114 may be about one third of the diameter of the positioning holes 113. In a preferred embodiment, the positioning holes 113 and the loading holes 114 can be completed in the same punching and punching process to reduce the process steps, or can perform two punching operations, for example, can be formed first. The positioning holes 113 further form the loading holes 114. In this embodiment, the plurality of loading holes 114 may correspond to passive components of smaller size, such as 0201 (size 0.6 x 0.3 x 0.3 mm). Alternatively, the loading holes 114 may be changed to other possible sizes to correspond to larger size passive components, such as 0805 and 0402, and the like. In a preferred embodiment, the positioning holes 113 are formed at equal intervals on the flexible tape body 110, and the flexible tape body 110 is unwound from the carrier reel and transferred to an external machine. When not shown in the figure, the flexible tape body 110 can be fixed and driven by the positioning holes 113, so that the flexible tape body 110 can be counted and rolled like a chain. In general, the external machine can utilize a plurality of carrier reels for the winding and unwinding of the flexible tape body 110, so that the flexible tape body 110 can be moved to differently by the tape transfer method. The processing area is processed to perform corresponding processing steps. As shown in FIG. 3, after the punching step, the flexible tape body 110 can be wound up to the carrier reel 20 to facilitate transfer to the next processing zone. After the puncturing step, as shown in the enlarged view of FIG. 2B, the burrs 115 are easily formed around the holes of the loading holes 114 and the positioning holes 113, which easily affect the insertion and removal of the passive components.

Referring to FIG. 2C, a sand blasting step can be performed by a sand blasting machine 10, and the bottom surface 112 of the flexible strip 110 is sandblasted by a single blasting nozzle 11 of the blasting machine 10 to remove The burrs 115 in the loading holes 114 (as shown in FIG. 2B). In a preferred embodiment, the flexible strip 110 can be transported by a web and wound in the carrier reel 20, transported through the blasting machine 10 and re-rolled onto another reel. 30. The loading reel 20 and the loading reel 30 are respectively disposed at the feeding opening and the discharging opening of the blasting machine 10, and are driven to rotate in the same direction by driving the loading reels 20 and 30. The flexible tape body 110 is led out of the carrier reel 20 and passed through the sand blasting machine 10, and is then retracted into the carrier reel 30. As shown in FIG. 2C, when entering the blasting machine 10, the bottom surface 112 of the flexible strip 110 is oriented upward so that the blasting nozzle 11 of the blasting machine 10 can be aligned with the flexible belt. The bottom surface 112 of the body 110 is subjected to single-side blasting of the bottom surface 112 of the flexible strip 110 from top to bottom. Therefore, the sand body particles sprayed by the sand blasting nozzle 11 can be impinged on the inside of the plurality of loading holes 114 and the positioning holes 113 to more reliably remove the burrs 115 around the holes. In this embodiment, the blasting pressure in the blasting step may be between 0.4 MPa and 1.0 MPa. Generally, the higher the blasting pressure, the higher the blasting efficiency, but the rougher the surface to be blasted, and the smoother surface is smoother, so the blasting pressure in the blasting step can be according to the flexible belt 110. The material is adjusted to an appropriate pressure to prevent the flexible tape body 110 from being excessively worn. The smooth surface 111 is not blasted to remain smooth, so that it has a rough difference from the bottom surface 112, so that the subsequent step of removing the passive component can be removed from the cover layer. In addition, preferably, the blasting machine 10 is further provided with a jet cleaning head 12, in which the air jet cleaning head 12 of the blasting machine 10 can simultaneously blast the flexible belt 110. The bottom surface 112 of the process is jet cleaned. The air jet cleaning head 12 is capable of ejecting gas toward the bottom surface 112 of the blasted surface by means of a high-pressure jet method for blowing sand bodies adhering or remaining on the bottom surface 112, the positioning holes 113, and the loading holes 114. The flexible tape body 110 that facilitates the winding of the tape is wound into the carrier reel 30, so that the blasting operation of the tape conveying method is more feasible.

Referring to FIG. 2D, after the blasting step is performed, the burrs originally remaining in the loading holes 114 or the positioning holes 113 can be effectively removed, so that the inner walls and the two ends of the loading holes 114 are It is flat and smooth, which facilitates the insertion and removal of passive components.

In the present invention, the blasting step can be performed after the puncturing step as one of the technical means, since the bottom surface 112 of the flexible strip 110 is subjected to single-side blasting in the blasting step, The burrs 115 in the plurality of loading holes 114 of the flexible strip 110 are removed (as shown in FIG. 2B). Therefore, it is possible to prevent the passive components from being obstructed by the burrs in the load holes 114 for accurately performing the loading and unloading operations of the passive components. In a more specific form, the present invention can take up the flexible tape body 110 in a tape transfer manner and carry out the process of setting and deburring the hole, so that it can be applied to mass production of automation, and can avoid the The loading holes 114 of the flexible strip 110 cannot be matched with the size of the passive components to improve the processing precision of the product.

The intermediate layer of the passive component carrier tape produced by the above manufacturing method can be as shown in FIG. 2D, and the bottom surface 112 of the flexible tape body 110 is subjected to single-side blasting treatment so that the loading holes 114 are not There will be raw edges. In a preferred embodiment, the flexible tape body 110 can be made of paper, which not only reduces the overall material cost, but also effectively removes the burrs of the paper fibers in the holes by the method of the present invention. Alternatively, in a variant, the flexible strip 110 may be made of plastic to have a high structural strength.

Please refer to FIG. 4 , which is a schematic cross-sectional view of the passive component carrier tape intermediate layer after receiving the passive components 40 . In detail, the bottom surface 112 of the flexible strip 110 can be pre-adhered to the bottom layer 130. The bottom layer 130 can be a tape that serves as a portion for carrying the passive components 40 to prevent the passive components 40. Dropped, the bottom surface 112 of the single side blasting will facilitate the adhesion of the bottom layer 130. After the bottom layer 130 is pasted, the passive components 40 are placed in the loading holes 114, and the peelable cover layer 120 is adhered to the smooth surface 111 of the flexible tape 110 to close the Passive elements 40 are within the load holes 114. In a preferred embodiment, the tearable cover layer 120 can be a film and cover the plurality of loading holes 114, but does not cover the positioning holes to prevent the passive components 40 from falling off. And provide a protection function. Since the passive components 40 are disposed in the loading holes 114, and the smooth surface 111 and the bottom surface 112 of the flexible tape 110 are respectively adhered to the peelable cover layer 120 and the bottom layer 130, The passive components 40 can be packaged and carried.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. Any simple modifications, equivalent changes and modifications made without departing from the technical scope of the present invention are still within the technical scope of the present invention.

Step 1 provides a flexible tape body

Step 2 Perform a punching step to form the flexible strip body to form the positioning hole and the loading hole

Step 3 Perform a sand blasting step to single-side blast the bottom surface of the flexible strip

10. . . Sandblasting machine

11. . . Sandblasting nozzle

12. . . Jet cleaning head

20, 30. . . Load reel

40. . . Passive component

110. . . Flexible belt

111. . . Smooth surface

112. . . Bottom

113. . . Positioning hole

114. . . Loading hole

115. . . Burr

120. . . Peelable cover

130. . . Bottom layer

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow block diagram showing a method of manufacturing an intermediate layer of a passive component carrier tape in accordance with an embodiment of the present invention.

2A to 2D are diagrams showing the components of the method for manufacturing the intermediate layer of the passive component carrier tape in accordance with an embodiment of the present invention.

Fig. 3 is a perspective view showing the intermediate layer of the passive component carrier tape wound around the carrier reel according to an embodiment of the present invention.

Figure 4 is a cross-sectional view showing the state in which the intermediate layer of the passive component carrier tape accommodates the passive component in accordance with an embodiment of the present invention.

10. . . Sandblasting machine

11. . . Sandblasting nozzle

12. . . Jet cleaning head

20, 30. . . Load reel

110. . . Flexible belt

111. . . Smooth surface

112. . . Bottom

Claims (9)

A method for manufacturing a passive component carrier tape intermediate layer, comprising: providing a flexible tape body having a smooth surface and a bottom surface; performing a punching step to form the flexible tape body to form a plurality of positioning a hole and a plurality of loading holes, wherein the positioning holes and the plurality of carrier holes are penetrated from the smooth surface to the bottom surface, and the positioning holes are arranged in a direction parallel to the arrangement direction of the loading holes, and The loading holes are rectangular for receiving the passive components; and a sand blasting step is performed, and the bottom surface of the flexible strip is subjected to single-side blasting to remove the burrs in the loading holes. The manufacturing method of the intermediate layer of the passive component carrier tape according to the first aspect of the patent application, wherein the hole length of the carrier holes is not larger than the aperture of the positioning holes. A method of manufacturing an intermediate layer of a passive component carrier tape according to the first aspect of the invention, wherein the bottom surface of the flexible tape which has been blasted is simultaneously subjected to jet cleaning in the sand blasting step. The method for manufacturing an intermediate layer of a passive component carrier tape according to the first aspect of the patent application, wherein the blasting pressure in the blasting step is between 0.4 MPa and 1.0 MPa. A method of manufacturing an intermediate layer of a passive component carrier tape according to claim 1, 2, 3 or 4, wherein in the blasting step, the flexible tape system is conveyed by a tape and wound up from the top to the bottom The bottom surface of the flexible strip is sandblasted. An intermediate layer of a passive component carrier tape is a flexible tape body having a smooth surface and a bottom surface. The flexible tape body is formed with a plurality of positioning holes and a plurality of carrier holes, and the positioning holes are The plurality of carrier holes are penetrated from the smooth surface to the bottom surface, the alignment holes are arranged in a direction parallel to the arrangement direction of the plurality of carrier holes, and the carrier holes are rectangular for receiving the passive And the bottom surface of the flexible strip is sandblasted on one side to remove the burrs in the load holes. The intermediate layer of the passive component carrier tape according to claim 6 of the patent application, wherein the hole length of the carrier holes is not larger than the aperture of the positioning holes. The intermediate layer of the passive component carrier tape according to claim 6 of the patent application, wherein the material of the flexible tape is paper. The intermediate layer of the passive component carrier tape according to claim 6 of the patent application, wherein the flexible tape is made of plastic.