TWI416192B - Camera lens and method of manufacturing diaphragm of camera lens - Google Patents

Abstract

A camera lens includes: a lens; a spacer installed to surround the lens; and a diaphragm installed above the lens and the spacer; wherein the diaphragm has a first opening directly above the lens to let light to input to the lens, and the diaphragm has a second opening is installed directly above a specific position of the spacer.

Description

Lens module and method for manufacturing aperture of lens module

The invention relates to a camera module and a method for manufacturing an opaque layer of the camera module, in particular to a mounting direction indicator of a lens module and a manufacturing method thereof.

The camera includes an image sensor and a lens module. The image sensor is composed of a plurality of sensing units, each of which includes a photo diode for collecting and converting incident light into an electronic signal. The image sensor is formed, for example, on a substrate. The lens module has an aperture and a lens group, and the aperture is located above the lens and has a circular opening for the incident light to pass through. The lens group has one or more lenses that focus the incident light passing through the aperture onto the photodiode.

When assembling the camera, the lens module needs to be assembled to the 矽 substrate with the image sensor through a predetermined mounting direction. However, the lens module and the 矽 substrate have become smaller and smaller, especially the wafer level camera. This makes the assembly more difficult.

Accordingly, it is an object of the present invention to provide a mounting direction indicator of a camera module and a method of manufacturing the same.

According to a first embodiment of the present invention, a lens module is provided, the lens module comprising a lens, a sidewall structure and an opaque layer. The sidewall structure is disposed around the lens to surround the lens. The opaque layer is disposed above the lens and the sidewall structure, wherein the opaque layer has a first gap directly above the lens to allow a light to be incident on the lens, and the opaque layer There is a second gap directly above a specific position of the side wall structure.

According to a first embodiment of the present invention, there is provided a method of fabricating an opaque layer of a lens module. The method includes: forming a opaque layer on a transparent substrate; forming a photoresist layer on the opaque layer, wherein the photonic layer has a notch in a first position and a second position; Etching the region of the opaque layer that is not covered by the photoresist layer; and removing the photoresist layer such that the opaque layer corresponding to the first location has a first gap and corresponding to the second location The opaque layer has a second gap.

Certain terms are used throughout the description and following claims to refer to particular elements. Those of ordinary skill in the art should understand that a hardware manufacturer may refer to the same component by a different noun. The scope of this specification and the subsequent patent application do not use the difference of the names as the means for distinguishing the elements, but the difference in function of the elements as the criterion for distinguishing. The term "including" as used throughout the specification and subsequent claims is an open term and should be interpreted as "including but not limited to". In addition, the term "coupled" is used herein to include any direct and indirect electrical connection means. Therefore, if a first device is coupled to a second device, it means that the first device can be directly electrically connected to the device. The second device is indirectly electrically connected to the second device through other devices or connection means.

Please refer to Figure 1 and Figure 2. 1 is a schematic cross-sectional view of an embodiment of a camera 100 in accordance with the present invention. 2 is a top plan view of the camera 100 of the preferred embodiment, wherein the diagonal tangent is indicated by dashed line 202. The camera 100 includes a lens module and an image sensor 1102. The lens module includes an opaque layer 102, a lens 104, and a sidewall structure 108. The image sensor 1102 is formed on the enamel substrate 110. The image sensor 1102 will include a photodiode, a semiconductor circuit, and other necessary functional circuitry. In addition, the enamel substrate 110 may further include a plurality of pins 1106. The photodiode is used to convert incident light into a current signal, and the semiconductor circuit is used to receive the current signal from the photodiode, and the plurality of pins 1106 are used to transmit the current signal to the next stage circuit, for example A processing circuit.

In the lens module, the sidewall structure 108 is disposed around the lens 104 to surround the lens 104, and the sidewall structure 108 is formed of an opaque substance for supporting the lens 104 and isolating the scattered light. The opaque layer 102 is disposed above the lens 104 and the sidewall structure 108, wherein the opaque layer 102 has a first notch directly above the lens 104 to 1022 such that a light is incident on the lens 104 as a diaphragm (diaphragm) ). It should be noted that the opaque layer 102 has a second notch 1024 directly above a specific position of one of the sidewall structures 108.

In this preferred embodiment, one of the cameras 100 has a top view that is substantially square, and the particular position of the sidewall structure 108 (ie, the second notch 1024) corresponds to a square at a right angle, as shown in FIG. Shown. Furthermore, in assembling the camera, in order to identify the predetermined assembly direction of the lens module and the 矽 substrate, the aperture formed by the opaque layer 102 has an alignment mark (ie, a second notch 1024). In other words, the visible second notch 1024 is a direction indicator for one of the cameras 100.

Figure 3 is a partial plan view of a wafer level lens in accordance with an embodiment of the present invention. The wafer level lens comprises an array of lens modules, and a second gap of each lens module 1024 points to the position in its upper left corner.

Please note that the present invention does not limit the material of the opaque layer 102 to a specific material, and any opaque material belongs to the scope of the present invention. In this preferred embodiment, the opaque layer 102 is comprised of chrome metal. Moreover, the present invention does not limit the shape of the second notch 1024. In this preferred embodiment, the second notch 1024 is shaped like a triangle, which may also be circular or square.

Please refer to Figure 4 and Figure 5A-5D. 4 is a flow diagram of an embodiment of a method 400 of fabricating an opaque layer of a lens module of the present invention. The present invention is described in detail with reference to the accompanying drawings (FIG. 1), but the embodiments are not intended to limit the scope of the invention. If the same result can be substantially achieved, it is not necessary to perform the sequence of steps in the process shown in FIG. 4, and the steps shown in FIG. 4 do not have to be performed continuously, that is, other steps may be inserted therein. . The method 400 includes the following steps: Step 402: forming an opaque layer 102 on a transparent substrate 502 (FIG. 5A); Step 404: Forming a photoresist layer 508 (FIG. 5B) on the opaque layer 102. The light group layer 508 has a gap at a first location 504 and a second location 506; Step 406: etching the region of the opaque layer 102 that is not covered by the photoresist layer 508 (FIG. 5C); and step 408: The photoresist layer 508 is removed such that the opaque layer 102 corresponding to the first location 504 has a first gap 1022, and the opaque layer 102 corresponding to the second location 506 has a second gap 1024 (FIG. 5D).

Please note that the 5A-5D drawings are schematic cross-sectional structures of the opaque layer 102 of the lens module shown in FIG. 2 corresponding to the diagonal tangent 202. FIG. 5A is a schematic cross-sectional view showing a structure corresponding to the opaque layer 102 of the lens module on a transparent substrate 502. FIG. 5B is a schematic cross-sectional view showing the formation of a photoresist layer 508 on the opaque layer 102. FIG. 5C is a schematic cross-sectional view showing the region of the opaque layer 102 not covered by the photoresist layer 508 being etched. FIG. 5D is a schematic cross-sectional view of the opaque layer 102 after the photoresist layer 508 is removed. As can be seen from FIG. 2, the top view of the lens module is substantially square. For convenience of identification, the second position 506 of the preferred embodiment corresponds to a square right angle.

In summary, steps 402-408 of the above method 400 can be implemented by a standard semiconductor process. In other words, therefore, the mounting direction indicator manufactured by the method 400 of the present invention can not only improve its production efficiency, but also maintain a high degree of consistency in its pattern. Further, since the mounting direction indicator is made in the manner of a reticle, the mounting direction indicator is not easily damaged or blurred. On the other hand, since the opaque layer 102 of the present invention can be fabricated through a standard semiconductor process, the method 400 of the present invention does not require additional mask costs. In other words, the mounting direction indicator produced by the method 400 of the present invention does not increase the manufacturing cost of the otherwise opaque layer 102.

The above are only the preferred embodiments of the present invention, and all changes and modifications made to the scope of the present invention should be within the scope of the present invention.

100. . . camera

102. . . Opaque layer

104. . . lens

108. . . Side wall structure

110. . . Tantalum substrate

202. . . Diagonal tangent

502. . . Transparent substrate

504. . . First position

506. . . Second position

508. . . Photoresist layer

1102. . . Image sensor

1106. . . Multiple pins

1022‧‧‧ first gap

1024‧‧‧ second gap

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional view showing one embodiment of a camera provided by the present invention.

Fig. 2 is a top plan view of the camera shown in Fig. 1.

Figure 3 is a partial plan view of a wafer level lens in accordance with an embodiment of the present invention.

Figure 4 is a flow diagram showing an embodiment of a method of fabricating an opaque layer of a lens module of the present invention.

FIG. 5A is a schematic cross-sectional view showing the formation of an opaque layer on a transparent substrate.

FIG. 5B is a schematic cross-sectional view showing the formation of a photoresist layer on the opaque layer.

FIG. 5C is a schematic cross-sectional view of the opaque layer after the region not covered by the photoresist layer is etched.

FIG. 5D is a schematic cross-sectional view of the opaque layer after removing the photoresist layer.

100. . . Camera module

102. . . Opaque layer

104. . . lens

108. . . Side wall structure

110. . . Tantalum substrate

1102. . . Image sensor

1106. . . Multiple pins

1022. . . First gap

1024. . . Second gap

Claims (9)

A lens module includes: a lens; a sidewall structure disposed around the lens to surround the lens; and an opaque layer disposed above the lens and the sidewall structure; wherein the opaque layer The layer has a first notch directly above the lens to allow a light to be incident on the lens, and the opaque layer has a second notch directly above a specific position of the sidewall structure, and the lens module One of the top views is generally a square shape, and the particular position is at a right angle to the square. The lens module of claim 1, wherein the sidewall structure is composed of an opaque substance. The lens module of claim 1, wherein a specific pin (Pin) of the lens module is directly below the specific position. The lens module of claim 1, wherein the second notch is a direction indicator of one of the lens modules. The lens module of claim 1, wherein the opaque layer is made of chrome metal. A method for manufacturing an opaque layer of a lens module, comprising: forming an opaque layer on a surface of a transparent substrate; Forming a photoresist layer on the opaque layer, wherein the photoresist layer has a notch in a first position and a second position; etching the region of the opaque layer not covered by the photoresist layer And removing the photoresist layer such that the opaque layer corresponding to the first location has a first gap, and the opaque layer corresponding to the second location has a second gap. The method of claim 6, wherein one of the lens modules has a substantially square shape in plan view, and the second position corresponds to a square right angle. The method of claim 6, wherein the opaque layer is composed of chrome metal. The method of claim 6, wherein the second indentation is a direction indicator of one of the lens modules.