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TWI415692B - Device and method for removing glue - Google Patents

Device and method for removing glue Download PDF

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Publication number
TWI415692B
TWI415692B TW97147324A TW97147324A TWI415692B TW I415692 B TWI415692 B TW I415692B TW 97147324 A TW97147324 A TW 97147324A TW 97147324 A TW97147324 A TW 97147324A TW I415692 B TWI415692 B TW I415692B
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Taiwan
Prior art keywords
cylinder
temperature
disposed
rotating shaft
optical component
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TW97147324A
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Chinese (zh)
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TW201021926A (en
Inventor
Shao Kai Pei
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Hon Hai Prec Ind Co Ltd
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Priority to TW97147324A priority Critical patent/TWI415692B/en
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Publication of TWI415692B publication Critical patent/TWI415692B/en

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Abstract

A device for removing glue used in the process of manufacturing optics articles. The optical articles are located on a carrier. The device comprises a first tube and a second tube located in the first tube. The first tube is used to produce a first temperature circumfluence for processing the optical articles. The second tube is used to produce a second temperature circumfluence for processing the optical articles. A rotating shaft is located on the sidewall of the second tube to rotate the carrier between the first tube and the second tube. The present invention also provides a method of removing glue.

Description

解膠裝置和解膠方法 Dissolution device and degumming method

本發明涉及光學元件加工領域,尤其涉及光學元件進行解膠之裝置和方法。 The invention relates to the field of optical component processing, and in particular to an apparatus and method for disassembling an optical component.

隨著光電行業之快速發展,光學鏡片被設計成各種形狀以滿足不同產品之需要。光學鏡片加工技術也得到迅速發展,人們可通過不同之加工方式得到所需要之光學鏡片(請參閱《光學鏡面之精密加工》,製造技術與機床,1998年第6期)。 With the rapid development of the optoelectronic industry, optical lenses are designed in various shapes to meet the needs of different products. Optical lens processing technology has also been rapidly developed, and people can obtain the required optical lenses through different processing methods (see "Precision Machining of Optical Mirrors", Manufacturing Technology and Machine Tools, No. 6 (1998).

於很多應用場合中,通常需要把光學鏡片加工成圓形,例如相機之鏡片、眼鏡之鏡片、放大鏡及望遠鏡之鏡片等。目前之滾圓技術,就是把最初成型之方形光學鏡片進行滾圓處理,使光學鏡片具有圓形邊緣以滿足光學應用。 In many applications, it is often necessary to process the optical lens into a circular shape, such as a lens for a camera, a lens for a lens, a lens for a magnifying glass, and a telescope. The current spheronization technique is to round the initially formed square optical lens so that the optical lens has a rounded edge to meet the optical application.

於光學鏡片之滾圓過程中,為了提高滾圓效率及大規模生產需要,通常用紫外線硬化樹脂等黏結膠把複數個待滾圓之光學鏡片黏附於一起進行滾圓。目前我們以熱水將滾圓後之玻璃解膠並清洗,但常常無法有效地將殘膠去,導致生產良率偏低。 In the spheronization process of the optical lens, in order to improve the spheronization efficiency and the need for mass production, a plurality of optical lenses to be spheronized are usually adhered together by a bonding adhesive such as an ultraviolet curing resin to perform spheronization. At present, we degumming and cleaning the glass after the rounding with hot water, but often it is not effective to remove the residual glue, resulting in low production yield.

有鑒於此,有必要提供一種能夠有效地去除光學元件表面之殘膠之裝置和方法。 In view of the above, it is necessary to provide an apparatus and method capable of effectively removing the residue of the surface of the optical element.

一種解膠裝置,用於光學元件加工過程之解膠過程,該光學元件固定於承載件上,該解膠裝置包括第一筒狀物和第二筒狀物,該第二筒狀物位於該第一筒狀物內部,該第一筒狀物於第一溫度下對光學元件進行處理,該第二筒狀物於第二溫度下對光學元件進行處理,該第二筒狀物上之側壁上設有之轉軸,該轉軸用於使該承載件於第一筒狀物和第二筒狀物之間相轉動。 A debonding device for a dissolving process of an optical component processing process, the optical component being fixed to a carrier, the debonding device comprising a first cylinder and a second cylinder, wherein the second cylinder is located Inside the first cylinder, the first cylinder processes the optical element at a first temperature, the second cylinder processes the optical element at a second temperature, and the sidewall on the second cylinder A rotating shaft is disposed on the rotating shaft for rotating the carrier between the first cylindrical body and the second cylindrical body.

一種對光學元件解膠之方法,其包括如下步驟:將加工後之光學元件於第一溫度下進行處理;將第一溫度下處理後之光學元件進行第二溫度處理;將第二溫度處理後之光學元件進行清洗,除去其表面殘膠。 A method for debonding an optical component, comprising the steps of: processing the processed optical component at a first temperature; performing a second temperature treatment on the optical component processed at the first temperature; and processing the second temperature The optical components are cleaned to remove surface residue.

相比於先前技術,本實施例之解膠裝置和解膠方法中於兩種溫度下處理,較高溫度使得光學元件表面之膠微粒軟化,相鄰膠微粒之間會形成水層;較低溫度使得水層凝固成冰,由於水於凝固過程中體積發生變化,使得原來與光學元件接觸之膠微由於水層之膨脹而與光學元件分開,從而使得光學元件表面之殘膠有效之去除,提高瞭解膠之效率,從而改善了光學元件之外觀不良。 Compared with the prior art, the dissolving device and the dissolving method of the present embodiment are processed at two temperatures, and the higher temperature causes the rubber particles on the surface of the optical element to soften, and a water layer is formed between adjacent rubber particles; The water layer is solidified into ice. Due to the change of the volume of the water during the solidification process, the glue which is in contact with the optical element is separated from the optical element due to the expansion of the water layer, so that the residual glue on the surface of the optical element is effectively removed and improved. Knowing the efficiency of the glue improves the appearance of the optical components.

10‧‧‧解膠裝置 10‧‧‧Degumming device

11‧‧‧第一筒狀物 11‧‧‧First tube

12‧‧‧第二筒狀物 12‧‧‧Second tube

111‧‧‧入水口 111‧‧‧ water inlet

112‧‧‧出水口 112‧‧‧Water outlet

122‧‧‧開口 122‧‧‧ openings

4‧‧‧噴霧頭 4‧‧‧ spray head

8‧‧‧絕熱單元 8‧‧‧Insulation unit

9、19‧‧‧載座 9, 19‧‧‧ seats

15‧‧‧不銹鋼 15‧‧‧Stainless steel

141‧‧‧第一軟木塞 141‧‧‧First cork

16‧‧‧銀薄膜 16‧‧‧Stained silver film

142‧‧‧第二軟木塞 142‧‧‧Second cork

143‧‧‧第三軟木塞 143‧‧‧ third cork

171、191‧‧‧轉軸 171, 191‧‧ ‧ shaft

144‧‧‧凹槽 144‧‧‧ Groove

123‧‧‧孔 123‧‧‧ hole

124‧‧‧第二通孔 124‧‧‧Second through hole

22‧‧‧螺栓 22‧‧‧ bolt

21‧‧‧支臂 21‧‧‧ Arm

23‧‧‧螺絲 23‧‧‧ screws

172、193‧‧‧第二轉軸 172, 193‧‧‧ second shaft

192‧‧‧圓孔 192‧‧‧ round hole

圖1係本發明實施例解膠裝置之縱向剖面示意圖,其包括絕 熱單元、第一筒狀物和載座。 1 is a longitudinal cross-sectional view of a dissolving device according to an embodiment of the present invention, which includes Thermal unit, first barrel and carrier.

圖2係本發明實施例解膠裝置之橫向截面示意圖。 2 is a schematic transverse cross-sectional view of a dissolving device according to an embodiment of the present invention.

圖3係圖1中絕熱單元之結構放大示意圖。 FIG. 3 is an enlarged schematic view showing the structure of the heat insulating unit of FIG. 1.

圖4係圖1中載座固定於第一筒狀物上之示意圖。 Figure 4 is a schematic view showing the carrier of Figure 1 being fixed to the first cylinder.

圖5係本發明第二實施例中載座固定於第一筒狀物上之示意圖。 Figure 5 is a schematic view showing the mounting of the carrier on the first cylinder in the second embodiment of the present invention.

下面將結合附圖,對本發明作進一步之詳細說明。 The invention will be further described in detail below with reference to the accompanying drawings.

請參閱圖1、圖2,本發明實施例提供之對光學元件進行解膠之解膠裝置10,其包括同軸設置之第一筒狀物11和第二筒狀物12。 Referring to FIG. 1 and FIG. 2 , a debonding device 10 for disassembling an optical component according to an embodiment of the present invention includes a first cylindrical body 11 and a second tubular body 12 disposed coaxially.

第一筒狀物11用於對光學元件進行熱水處理,熱水容納於第二筒狀物12和第一筒狀物11所限定之空間內。第一筒狀物11設置有入水口111和出水口112。本實施例中,入水口111設置於第一筒狀物11之頂部,出水口112均設置於第一筒狀物11之底部,從而保證熱水與第一筒狀物11內之光學元件充分接觸,並且能夠保證與光學元件接觸之熱水產生流動,提高熱水解膠之效率。 The first cylinder 11 is used for hot water treatment of the optical element, and the hot water is accommodated in the space defined by the second cylinder 12 and the first cylinder 11. The first cylinder 11 is provided with a water inlet 111 and a water outlet 112. In this embodiment, the water inlet 111 is disposed at the top of the first cylinder 11, and the water outlet 112 is disposed at the bottom of the first cylinder 11, thereby ensuring that the hot water and the optical components in the first cylinder 11 are sufficient. Contact, and can ensure the flow of hot water in contact with the optical element, improving the efficiency of the thermal hydrolysis gel.

當然,也可只設置入水口111,其同時兼有入水口和出水口之功能。 Of course, it is also possible to provide only the water inlet 111, which also has the functions of the water inlet and the water outlet.

第二筒狀物12用於對光學元件進行冷凍解膠處理。第二筒狀 物12之頂端設置有噴霧頭4,其與外界液化氣體儲存裝置相連,以向第二筒狀物12內噴射霧狀之液化氣體,從而使第二筒狀物12內之溫度降低至較低溫度。 The second barrel 12 is used to freeze and debond the optical element. Second cylinder The top of the object 12 is provided with a spray head 4 connected to an external liquefied gas storage device to spray a mist of liquefied gas into the second cylinder 12, thereby lowering the temperature in the second cylinder 12 to a lower temperature. temperature.

當然,也可於第一筒狀物11上設置噴霧頭4對光學元件進行冷凍處理,於第二筒狀物12設置入水口111和出水口112對光學元件進行熱水回流處理。 Of course, the optical element may be subjected to a freezing treatment by providing the spray head 4 on the first tubular body 11, and the water inlet 111 and the water outlet 112 may be provided in the second cylindrical body 12 to perform hot water reflow treatment on the optical element.

第二筒狀物12之筒壁上開設有複數開口122(如圖4),開口122處設置有絕熱單元8,開口122中之絕熱單元8可360度轉動。光學元件通超載座9固定於開口122中之絕熱單元8上,進而固定於第二筒狀物12上。絕熱單元8可防止於冷凍處理中,外部之熱量輻射到第二筒狀物12內從而使第二筒狀物12內之溫度升高。 A plurality of openings 122 (such as FIG. 4) are opened in the wall of the second tubular body 12. The heat insulating unit 8 is disposed at the opening 122, and the heat insulating unit 8 in the opening 122 can be rotated 360 degrees. The optical component is fixed to the heat insulating unit 8 in the opening 122 through the overload carrier 9, and is fixed to the second cylinder 12. The heat insulating unit 8 prevents the external heat from being radiated into the second cylinder 12 during the freezing process to raise the temperature inside the second cylinder 12.

當然,也可於除開口122之外之位置設置絕熱單元8。 Of course, the heat insulating unit 8 can also be provided at a position other than the opening 122.

如圖3所示,絕熱單元8為由不銹鋼15和第一軟木塞141圍成之真空結構,不銹鋼15和第一軟木塞141均為中空結構,第一軟木塞141位於不銹鋼15之中空結構中,第一軟木塞141之表面鍍有銀薄膜16以反射熱輻射。第一軟木塞141之中空結構被第二軟木塞142和第三軟木塞143堵住以使中空結構形成真空空間,第二軟木塞142設置有第一轉軸171,第三軟木塞143設置有一個凹槽144。 As shown in FIG. 3, the heat insulating unit 8 is a vacuum structure surrounded by a stainless steel 15 and a first cork 141. The stainless steel 15 and the first cork 141 are both hollow structures, and the first cork 141 is located in the hollow structure of the stainless steel 15. The surface of the first cork 141 is plated with a silver film 16 to reflect heat radiation. The hollow structure of the first cork 141 is blocked by the second cork 142 and the third cork 143 to form a vacuum space, the second cork 142 is provided with a first rotating shaft 171, and the third cork 143 is provided with a Groove 144.

如圖4所示,第二筒狀物12之開口122上設置第一通孔123和第二通孔124,第一通孔123和第二通孔124中心之連線平行 第二筒狀物12之中心軸。絕熱單元8之不銹鋼15上設置有兩個螺栓22,載座9之兩端分別設置有兩個支臂21,螺栓22卡設於支臂21之間,螺絲23旋合於螺栓22上以將載座9固定於絕熱單元8上,一個第二轉軸171可伸進凹槽144內,轉動第二轉軸172可使得絕熱單元8轉動,從而帶動載座9轉動。 As shown in FIG. 4, the first through hole 123 and the second through hole 124 are disposed in the opening 122 of the second barrel 12, and the lines connecting the centers of the first through hole 123 and the second through hole 124 are parallel. The central axis of the second barrel 12. The stainless steel 15 of the heat insulating unit 8 is provided with two bolts 22, and two ends of the carrier 9 are respectively provided with two arms 21, the bolts 22 are clamped between the arms 21, and the screws 23 are screwed onto the bolts 22 to The carrier 9 is fixed to the heat insulating unit 8, and a second rotating shaft 171 can extend into the recess 144. Rotating the second rotating shaft 172 can rotate the heat insulating unit 8 to drive the carrier 9 to rotate.

當然,也可於載座9之兩端分別設置一個支臂21,螺栓22穿過支臂21。 Of course, an arm 21 can also be provided at each end of the carrier 9 , and the bolt 22 passes through the arm 21 .

於對光學元件進行解膠時,先將螺栓22卡設於支臂21之間,然後將螺絲23旋於螺栓22上,從而使載座9固定於絕熱單元8上,將光學元件放置於載座9上,再將第一轉軸171伸進第二通孔124內,然後將第二轉軸172伸進第一通孔123並伸入絕熱單元8之凹槽144中,從而可使得絕熱單元8固定於第二筒狀物12上,從入水口122向第一筒狀物11內注入熱水(大約50℃至70℃,優選60℃),由出水口112流出,光學元件於熱水回流中浸泡一段時間(一般15至25小時,優選20小時)。於實際操作中,可根據實際情況調節水流之速度、熱水之溫度和熱水回流時間。達到回流處理時間後,入水口122停止進水,並將第一筒狀物11內之熱水經出水口112排出。通過熱水回流處理,使得光學元件表面之膠微粒軟化,相鄰膠微粒之間會形成水層。 When disassembling the optical component, the bolt 22 is firstly clamped between the arms 21, and then the screw 23 is screwed onto the bolt 22, so that the carrier 9 is fixed on the heat insulating unit 8, and the optical component is placed on the carrier. On the seat 9, the first rotating shaft 171 is inserted into the second through hole 124, and then the second rotating shaft 172 is inserted into the first through hole 123 and protrudes into the groove 144 of the heat insulating unit 8, so that the heat insulating unit 8 can be made. It is fixed on the second tube 12, and injects hot water (about 50 ° C to 70 ° C, preferably 60 ° C) into the first tube 11 from the water inlet 122, flows out from the water outlet 112, and the optical element is reflowed in the hot water. Immerse for a period of time (typically 15 to 25 hours, preferably 20 hours). In actual operation, the speed of the water flow, the temperature of the hot water and the hot water return time can be adjusted according to actual conditions. After the reflux treatment time is reached, the water inlet 122 stops the water inflow, and the hot water in the first cylinder 11 is discharged through the water outlet 112. By the hot water reflow treatment, the rubber particles on the surface of the optical element are softened, and an aqueous layer is formed between the adjacent rubber particles.

熱水處理後,轉動旋第二轉軸172,使載座9翻轉180度進入第二筒狀物12內,通過噴霧頭4向第二筒狀物12內噴灑霧化液化氣體,使得第二筒狀物12內之溫度降低,使光學元件冷 凍處理一定時間(一般為15至25小時,優選20小時)。於本實施例中,液化氣體為氮氣,第二筒狀物12內之溫度為-50℃至-30℃,優選-40℃。經過冷凍處理後,水層凝固成冰,由於水於凝固過程中體積發生變化,使得原來與光學元件接觸之膠微由於水層之膨脹而與光學元件分開。 After the hot water treatment, the second rotating shaft 172 is rotated, the carrier 9 is turned 180 degrees into the second cylindrical body 12, and the atomized liquefied gas is sprayed into the second cylindrical body 12 through the spray head 4, so that the second cylinder The temperature inside the object 12 is lowered to make the optical element cold The treatment is carried out for a certain period of time (generally 15 to 25 hours, preferably 20 hours). In the present embodiment, the liquefied gas is nitrogen, and the temperature in the second cylinder 12 is -50 ° C to -30 ° C, preferably -40 ° C. After the freezing treatment, the water layer solidifies into ice, and the volume of the glue that is in contact with the optical element is separated from the optical element due to the expansion of the water layer due to the change in volume during the solidification process.

最後,將經冷凍處理之光學元件進行清洗,由於經過了冷凍處理,所以,表面之膠微粒容易被除去。 Finally, the frozen optical element is cleaned, and since the freezing process is performed, the surface rubber particles are easily removed.

下表中之資料為熱水解膠、熱水回流加冷凍解膠之實驗對比,實驗參數為:於60℃熱水中浸泡20小時,然後於-40℃下冷凍處理20小時。 The data in the table below is the experimental comparison of hot hydrolyzed rubber, hot water reflux and freeze degumming. The experimental parameters are: soaking in hot water at 60 ° C for 20 hours, then freezing at -40 ° C for 20 hours.

由於本實施例之解膠方法中引入了冷凍過程,通過實驗驗證,未引入冷凍過程只採用熱水回流進行解膠之解膠過程,產品之平均良率為65%,採用熱水回流並引入冷凍過程後,產品之平均良率可達到85%,使得產品之平均良率提高了20%。使得光學元件表面之殘膠有效之去除,提高瞭解膠之效率,從而改善了光學元件之外觀不良。另外,由於光學元件可直 接通過旋轉由熱水處理進入冷凍處理,使得整個解膠過程連續。 Since the freezing process is introduced in the degumming method of the embodiment, it is verified by experiments that the degumming process is only performed by hot water reflow without introducing the freezing process, and the average yield of the product is 65%, which is introduced by hot water reflow. After the freezing process, the average yield of the product can reach 85%, which increases the average yield of the product by 20%. The adhesive residue on the surface of the optical component is effectively removed, and the efficiency of understanding the glue is improved, thereby improving the appearance defect of the optical component. In addition, since the optical components can be straight The process is followed by a hot water treatment into the freezing process, so that the entire degumming process is continuous.

如圖5所示,第二實施例與第一實施例之區別在於:沒有絕熱單元,載座19直接固定於第二筒狀物12上。於完成熱水處理後,需要放掉熱水,因此可不需要絕熱單元。 As shown in FIG. 5, the second embodiment differs from the first embodiment in that there is no heat insulating unit, and the carrier 19 is directly fixed to the second cylinder 12. After the hot water treatment is completed, the hot water needs to be drained, so that the heat insulation unit is not required.

載座19之一端設置有第一轉軸191,與轉軸191相對之一端設置有圓孔192,一個第二轉軸193可伸進圓孔192中。固定載座19時,第一轉軸191伸進第二通孔124內,然後將第二轉軸193伸進第一筒孔123並伸入圓孔192中從而使載座19固定於第二筒狀物12上。 One end of the carrier 19 is provided with a first rotating shaft 191, and one end opposite to the rotating shaft 191 is provided with a circular hole 192, and a second rotating shaft 193 can be inserted into the circular hole 192. When the carrier 19 is fixed, the first rotating shaft 191 protrudes into the second through hole 124, and then the second rotating shaft 193 is inserted into the first cylindrical hole 123 and protrudes into the circular hole 192 to fix the carrier 19 to the second cylindrical shape. On the object 12.

綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士爰依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。 In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.

10‧‧‧解膠裝置 10‧‧‧Degumming device

11‧‧‧第一筒狀物 11‧‧‧First tube

12‧‧‧第二筒狀物 12‧‧‧Second tube

111‧‧‧入水口 111‧‧‧ water inlet

112‧‧‧出水口 112‧‧‧Water outlet

4‧‧‧噴霧頭 4‧‧‧ spray head

8‧‧‧絕熱單元 8‧‧‧Insulation unit

9‧‧‧載座 9‧‧‧Seat

Claims (11)

一種解膠裝置,用於光學元件加工過程之解膠過程,該光學元件固定於承載件上,其改進在於:該解膠裝置包括第一筒狀物和第二筒狀物,該第二筒狀物位於該第一筒狀物內部,該第一筒狀物於第一溫度下對光學元件進行處理,該第二筒狀物於第二溫度下對光學元件進行處理,該第二筒狀物上之側壁上設有之轉軸,該轉軸用於使該承載件於第一筒狀物和第二筒狀物之間相轉動。 A debonding device for a dissolving process of an optical component processing process, the optical component being fixed to a carrier, the improvement being that the debonding device comprises a first cylinder and a second cylinder, the second cylinder The first cylinder is disposed inside the first cylinder, the first cylinder processes the optical element at a first temperature, and the second cylinder processes the optical element at a second temperature, the second cylinder A rotating shaft is disposed on the side wall of the object, and the rotating shaft is configured to rotate the carrier between the first cylindrical body and the second cylindrical body. 如申請專利範圍第1項所述之解膠裝置,其中:該第一筒狀物設置有入水口和出水口,該入水口設置於該第一筒狀物之頂部,該出水口設置於該第一筒狀物之底部。 The disintegration device of claim 1, wherein the first tube is provided with a water inlet and a water outlet, the water inlet is disposed at the top of the first tube, and the water outlet is disposed at the The bottom of the first cylinder. 如申請專利範圍第2項所述之解膠裝置,其中:該第二筒狀物內設置有噴霧頭,該噴霧頭用於向該第二筒狀物內噴灑液化氣體以降低該第二筒狀物內之溫度。 The degreasing device of claim 2, wherein: the second cylinder is provided with a spray head for spraying liquefied gas into the second cylinder to lower the second cylinder The temperature inside the object. 如申請專利範圍第1項所述之解膠裝置,其中:該第二筒狀物設置有入水口和出水口,該入水口和出水口設置於該第二筒狀物之頂部。 The disintegration device of claim 1, wherein the second cylinder is provided with a water inlet and a water outlet, and the water inlet and the water outlet are disposed at the top of the second cylinder. 如申請專利範圍第4項所述之解膠裝置,其中:該第一筒狀物內設置有噴霧頭,該噴霧頭用於向該第一筒狀物內噴灑液化氣體以降低該第一筒狀物內之溫度。 The degreasing device of claim 4, wherein: the first cylinder is provided with a spray head for spraying liquefied gas into the first cylinder to lower the first cylinder The temperature inside the object. 如申請專利範圍第1至5項任一項所述之解膠裝置,其中:該第一筒狀物和第二筒狀物為同軸設置之圓筒。 The de-glipping device according to any one of claims 1 to 5, wherein the first cylindrical body and the second cylindrical body are coaxially disposed cylinders. 如申請專利範圍第6項所述之解膠裝置,其中:該第二筒狀物之筒壁上開設有複數開口,該開口內設置絕熱單元,該轉軸設置於該絕熱單元上。 The disintegration device of claim 6, wherein: a plurality of openings are formed in the wall of the second cylinder, and a heat insulating unit is disposed in the opening, and the rotating shaft is disposed on the heat insulating unit. 如申請專利範圍第7項所述之解膠裝置,其中:該開口之壁上相對設置有第一孔和第二孔,該絕熱單元設置有旋轉軸,該旋轉軸於該第二孔內轉動,該轉軸伸進第一孔中並抵靠於該絕熱單元上。 The disintegration device of claim 7, wherein the wall of the opening is oppositely disposed with a first hole and a second hole, the heat insulating unit is provided with a rotating shaft, and the rotating shaft rotates in the second hole The shaft extends into the first hole and abuts against the heat insulating unit. 如申請專利範圍第8項所述之解膠裝置,其中:該絕熱單元設置有凹槽,該轉軸伸進該凹槽抵靠於該絕熱單元上。 The debonding device of claim 8, wherein the heat insulating unit is provided with a groove, and the rotating shaft extends into the groove to abut against the heat insulating unit. 一種利用申請專利範圍第1項所述之解膠裝置對光學元件解膠之方法,其包括如下步驟:將加工後之光學元件放置於第一筒狀物內於第一溫度下進行處理;將於第一溫度處理後之之光學元件旋轉至第二筒狀物內進行第二溫度之處理;將於第二溫度下處理後之光學元件進行清洗,除去其表面殘膠。 A method for dissolving an optical component by using the debonding device according to claim 1 of the patent application, comprising the steps of: placing the processed optical component in a first cylinder at a first temperature; The optical component after the first temperature treatment is rotated into the second cylinder for the second temperature treatment; the optical component treated at the second temperature is cleaned to remove the surface residue. 如申請專利範圍第10項所述之對光學元件解膠之方法,其中,該第一溫度為50℃至70℃、處理之時間為15至25小時,該第二溫度為-50℃至-30℃、處理之時間為15至25小時。 The method for de-bonding an optical component according to claim 10, wherein the first temperature is 50 ° C to 70 ° C, the treatment time is 15 to 25 hours, and the second temperature is -50 ° C to - The treatment time is 30 to 25 hours at 30 °C.
TW97147324A 2008-12-05 2008-12-05 Device and method for removing glue TWI415692B (en)

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CN1904652A (en) * 2005-07-27 2007-01-31 富士能佐野株式会社 Binder stripping method, optical element manufacturing method, prism manufacturing method and prism manufactured by the same
TW200710461A (en) * 2005-09-09 2007-03-16 Hon Hai Prec Ind Co Ltd Medical treatment system of radio frequency identification
CN100352877C (en) * 2003-03-31 2007-12-05 日东电工株式会社 Heat-peelable double-sided pressure-sensitive adhesive sheet, method for treating adherend, and electronic component

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1149190A (en) * 1994-06-21 1997-05-07 德克萨斯仪器股份有限公司 Method of unsticking components of micro-mechanical devices
US6619854B2 (en) * 2001-01-31 2003-09-16 Teradyne, Inc. Techniques for cleaning an optical interface of an optical connection system
JP2002292347A (en) * 2001-03-30 2002-10-08 Sumitomo Bakelite Co Ltd Method and apparatus for cleaning and drying optical plastic film
CN100352877C (en) * 2003-03-31 2007-12-05 日东电工株式会社 Heat-peelable double-sided pressure-sensitive adhesive sheet, method for treating adherend, and electronic component
CN1904652A (en) * 2005-07-27 2007-01-31 富士能佐野株式会社 Binder stripping method, optical element manufacturing method, prism manufacturing method and prism manufactured by the same
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