[go: up one dir, main page]

TWI414888B - 感光性聚合體組成物、圖案的製造方法及電子零件 - Google Patents

感光性聚合體組成物、圖案的製造方法及電子零件 Download PDF

Info

Publication number
TWI414888B
TWI414888B TW100102038A TW100102038A TWI414888B TW I414888 B TWI414888 B TW I414888B TW 100102038 A TW100102038 A TW 100102038A TW 100102038 A TW100102038 A TW 100102038A TW I414888 B TWI414888 B TW I414888B
Authority
TW
Taiwan
Prior art keywords
component
weight
group
polymer composition
organic group
Prior art date
Application number
TW100102038A
Other languages
English (en)
Chinese (zh)
Other versions
TW201135357A (en
Inventor
小野敬司
峯岸知典
大江匡之
小谷真志
紺野□
Original Assignee
日立化成杜邦微系統股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成杜邦微系統股份有限公司 filed Critical 日立化成杜邦微系統股份有限公司
Publication of TW201135357A publication Critical patent/TW201135357A/zh
Application granted granted Critical
Publication of TWI414888B publication Critical patent/TWI414888B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H10P14/683—
    • H10P76/20—

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Polyamides (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW100102038A 2010-01-22 2011-01-20 感光性聚合體組成物、圖案的製造方法及電子零件 TWI414888B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010011827 2010-01-22
JP2010151128 2010-07-01

Publications (2)

Publication Number Publication Date
TW201135357A TW201135357A (en) 2011-10-16
TWI414888B true TWI414888B (zh) 2013-11-11

Family

ID=44306697

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100102038A TWI414888B (zh) 2010-01-22 2011-01-20 感光性聚合體組成物、圖案的製造方法及電子零件

Country Status (5)

Country Link
JP (1) JP5146610B2 (ja)
KR (1) KR101452604B1 (ja)
CN (1) CN102713756B (ja)
TW (1) TWI414888B (ja)
WO (1) WO2011089894A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6195445B2 (ja) * 2012-02-27 2017-09-13 東京応化工業株式会社 ポジ型ホトレジスト組成物、ホトレジスト積層体、ホトレジストパターンの製造方法、及び接続端子の製造方法
TWI484293B (zh) 2012-11-07 2015-05-11 Chi Mei Corp 感光性樹脂組成物及其應用
CN109313387B (zh) * 2016-06-15 2021-11-26 东丽株式会社 感光性树脂组合物
CN115885217A (zh) * 2020-06-10 2023-03-31 信越化学工业株式会社 负型抗蚀剂膜层叠体及图案形成方法
KR102650282B1 (ko) * 2021-02-04 2024-03-22 주식회사 엘지화학 폴리이미드 수지 및 이를 포함하는 포지티브형 감광성 수지 조성물
CN115128898B (zh) * 2021-03-25 2024-06-11 北京鼎材科技有限公司 一种感光树脂组合物及其应用

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008145579A (ja) * 2006-12-07 2008-06-26 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜およびそれを用いた半導体装置、表示体装置。

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08286366A (ja) * 1995-04-18 1996-11-01 Fuji Photo Film Co Ltd 感光材料
JP3514167B2 (ja) * 1998-05-14 2004-03-31 東レ株式会社 感光性耐熱性樹脂前駆体組成物
JP2004347617A (ja) * 2003-04-11 2004-12-09 Clariant Internatl Ltd 感光性樹脂組成物用基板密着性向上剤及びそれを含有する感光性樹脂組成物
KR101183395B1 (ko) * 2005-11-30 2012-09-14 스미토모 베이클리트 컴퍼니 리미티드 포지티브형 감광성 수지 조성물 및 그것을 이용한 반도체장치 및 표시장치
JP2008039872A (ja) * 2006-08-02 2008-02-21 Toray Ind Inc 焼成用感光性組成物及びそれを用いたディスプレイ部材
JP4858079B2 (ja) * 2006-10-25 2012-01-18 住友ベークライト株式会社 ポジ型感光性樹脂組成物
JP2009163159A (ja) * 2008-01-10 2009-07-23 Toray Ind Inc 直描型水なし平版印刷版原版
JP5136079B2 (ja) * 2008-01-23 2013-02-06 日立化成デュポンマイクロシステムズ株式会社 低温硬化用のポジ型感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品
JP5169446B2 (ja) * 2008-04-28 2013-03-27 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、該樹脂組成物を用いたポリベンゾオキサゾール膜、パターン硬化膜の製造方法及び電子部品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008145579A (ja) * 2006-12-07 2008-06-26 Sumitomo Bakelite Co Ltd ポジ型感光性樹脂組成物、硬化膜、保護膜、絶縁膜およびそれを用いた半導体装置、表示体装置。

Also Published As

Publication number Publication date
WO2011089894A1 (ja) 2011-07-28
KR101452604B1 (ko) 2014-10-22
TW201135357A (en) 2011-10-16
CN102713756B (zh) 2014-10-15
CN102713756A (zh) 2012-10-03
KR20120102123A (ko) 2012-09-17
JP5146610B2 (ja) 2013-02-20
JPWO2011089894A1 (ja) 2013-05-23

Similar Documents

Publication Publication Date Title
TWI460539B (zh) 感光性樹脂組成物、使用該樹脂組成物的圖案硬化膜的製造方法、層間絕緣層、表面保護膜及電子零件
TWI414888B (zh) 感光性聚合體組成物、圖案的製造方法及電子零件
CN102713753A (zh) 正型感光性树脂组合物、图形固化膜的制造方法以及电子部件
JP2004170611A (ja) ポジ型感光性樹脂組成物、レリーフパターンの製造方法及び電子部品
JP2000305268A (ja) 感光性重合体組成物、レリーフパターンの製造法及び電子部品
JP5625549B2 (ja) 感光性重合体組成物、パターンの製造方法及び電子部品
CN102854745B (zh) 感光性树脂组合物、图案制造方法及电子部件
TWI414887B (zh) 感光性聚合體組成物、圖案的製造方法及電子零件
JP4466092B2 (ja) ポジ型感光性樹脂組成物、パターンの製造法及び電子部品
JP2006227063A (ja) ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
TWI708994B (zh) 正型感光性樹脂組成物、圖案硬化膜的製造方法、硬化物、層間絕緣膜、覆蓋塗層、表面保護膜及電子零件
CN107430334B (zh) 正型感光性树脂组合物、图案固化膜的制造方法、图案固化膜和电子部件
JP2011141323A (ja) 感光性重合体組成物、パターンの製造方法及び電子部品
CN104570608A (zh) 正型光敏树脂组合物、使用其制备的光敏树脂膜以及显示装置
JP4487177B2 (ja) ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
JP2005173528A (ja) ポジ型感光性樹脂組成物、レリーフパターンの製造方法及び電子部品
JP5381742B2 (ja) ポジ型感光性樹脂組成物、パターン硬化膜の製造方法及び電子部品
JP2008033158A (ja) ポジ型感光性樹脂組成物、パターン硬化膜の製造方法および電子部品
JP2006030413A (ja) マイクロ波硬化用ポジ型感光性樹脂組成物、及びこれを用いた電子部品
WO2019064540A1 (ja) 感光性樹脂組成物、パターン硬化物の製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜、及び電子部品
TW201638657A (zh) 正型感光性樹脂組成物、圖案硬化膜的製造方法、層間絕緣膜、面塗層、表面保護膜及電子零件