TWI414429B - Anti-overflow device and method for adhering substrates - Google Patents

Abstract

An anti-overflow device includes a frame and at least a glue curing element. The frame has a side wall disposed along a closed track, wherein the side wall has at least a gap. The glue curing element is disposed on an outer surface of the side wall. The anti-overflow device can minimize overflow of glue. Furthermore, a method for adhering substrates using the anti-overflow device is also provided.

Description

Anti-overflow device and substrate bonding method using same

The present invention relates to an anti-overflow device, and more particularly to an anti-overflow device for a substrate bonding process and a substrate bonding method using the anti-overflow device.

In recent years, with the advancement of flat display technology and the advantages of light weight, thin thickness and power saving of flat panel displays, flat panel displays have gradually replaced traditional cathode ray tube (CRT) displays. At present, common flat panel displays include a liquid crystal display (LCD), a plasma display panel (PDP), an electrophoretic display (EPD), and the like. The display panel of the flat display may be attached with a substrate, and the substrate may be a protective plate or an optical plate capable of providing a stereoscopic display function, such as a lenticular lens plate.

FIG. 1 is a schematic view showing the occurrence of overflow during the substrate bonding process in the prior art. Referring to FIG. 1 , in the prior art, when the substrate 50 is to be attached to the display panel 60 , the glue 70 is usually applied on the display panel 60 , and then the substrate 50 is stacked on the display panel 60 . Thereafter, the substrate 50 is pressed to press the substrate 50 and the display panel 60. Then, the colloid curing process is performed to cure the colloid 70, so that the substrate 50 and the display panel 60 can be bonded through the colloid 70.

However, when the substrate 50 is pressed, since the colloid 70 flows, it is likely to cause a situation in which the substrate 50 and the display panel 60 are overflowed.

The invention provides an anti-overflow device for improving the occurrence of overflow of glue when the substrate is pasted.

The present invention further provides a substrate bonding method to improve the situation of overflow.

In order to achieve the above advantages, the present invention provides an anti-overflow device suitable for colloids. The two substrates are bonded together, and the frame body and the at least one colloidal curing member are included. The frame has side walls disposed along a closed track, wherein the side walls have at least one notch. The side wall has an inner surface surrounding the edge of the two substrates, and the inner surface is adapted to fit the edge of the two substrates to prevent the colloid from overflowing when the two substrates are pressed together, so that the colloid only overflows from the gap. The colloidal solidified member is disposed on an outer surface of the side wall opposite the inner surface and surrounds the side wall.

In an embodiment of the invention, the material of the sidewall is transparent material.

In an embodiment of the invention, the material of the sidewall is composed of polymethyl methacrylate (PMMA), polycarbonate (PC), or a combination thereof.

In an embodiment of the invention, the at least one colloidal cured member comprises an ultraviolet lamp, a heating member or a combination thereof.

In an embodiment of the invention, the heating element comprises an infrared lamp.

In an embodiment of the invention, the frame body further includes a bottom portion, and the side wall connects the bottom portion and surrounds the bottom portion.

In order to achieve the above advantages, the present invention further provides a substrate bonding method suitable for bonding two substrates. The substrate bonding method comprises the following steps: First, the above-mentioned anti-overflow device is provided. Next, the substrate is placed in the casing, and a colloid is applied between the substrates. After that, the substrate is pressed. The colloid is then cured by at least one colloidal cure.

In an embodiment of the invention, the substrate bonding method further comprises taking out the bonded substrate, and then performing a colloid curing process to further cure the colloid.

In an embodiment of the invention, at least one of the two substrates is connected to the circuit board, and the circuit board protrudes outside the frame via the gap of the side wall.

In an embodiment of the invention, the colloid comprises ultraviolet glue, heat curing glue or a combination thereof.

In the anti-overflow device of the present invention, the side wall of the frame allows the colloid to be only from the side The gap in the wall overflows, so it can improve the situation of overflowing. In addition, the colloid-cured member disposed on the outer surface of the side wall can cure the colloid at the edge of the substrate after the substrate is pressed, so that the occurrence of overflow of the glue after the substrate is taken out can be prevented. Further, since the substrate bonding method of the present invention uses this anti-overflow device, it is possible to improve the situation of overflow.

The above and other objects, features and advantages of the present invention will become more <RTIgt;

2 is a schematic view of an anti-overflow device according to an embodiment of the present invention. Referring to FIG. 2, the anti-overflow device 100 of the present embodiment includes a frame body 110 and at least one colloid-curing member 120. In the embodiment, a plurality of colloid-cured members 120 are taken as an example. The frame 110 has side walls 112 disposed along the closed trajectory 102. In the present embodiment, the closed trajectory 102 is, for example, a rectangular closed trajectory. In addition, the side wall 112 has at least one notch 113, and in the present embodiment, a notch 113 is taken as an example. Additionally, the colloidal cure member 120 is disposed on the outer surface 114 of the sidewall 112.

In the above-mentioned anti-overflow device 100, the material of the side wall 112 is, for example, a transparent material such as polymethyl methacrylate, polycarbonate or a combination thereof, but is not limited thereto. The material of the side wall 112 may be selected from a material that can easily remove the colloid adhered to the side wall 112, and the material selected for the side wall 112 is such that the colloidal curing member 120 can cure the colloid located in the frame 110 via the side wall 112. Further, the side wall 112 may be composed of a plurality of transparent plates. Additionally, the frame 110 can further include a bottom portion 116 that connects the bottom portion 116 and surrounds the bottom portion 116. It should be noted that in other embodiments, the frame 110 may not include the bottom portion 116.

The above-mentioned colloidal curing member 120 can be an ultraviolet lamp, a heating member or a combination thereof, wherein the heating member can be an infrared lamp, but not limited thereto. Further, the colloidal curing member 120 surrounds the side wall 112 of the frame 110.

Hereinafter, the substrate bonding method according to an embodiment of the present invention will be described with reference to the drawings. law.

3A-3D are flow charts of a substrate bonding method according to an embodiment of the invention. Referring to FIG. 3A , the substrate bonding method of the embodiment is suitable for bonding the two substrates 210 and 220 . The two substrates 210 and 220 referred to herein may be a glass substrate and a glass substrate, a display panel and a protection panel, a display panel, and an optical plate (such as a lenticular lens plate) capable of providing a stereoscopic display function, a display panel and a touch panel or a touch panel. Board and protection board, etc., but not limited to this. That is, the substrate bonding method of the present embodiment does not limit the types of the substrates 210 and 220. In addition, in the substrate bonding method of the present embodiment, the substrates 210 and 220 are bonded by the colloid 230. The colloid 230 is, for example, an ultraviolet glue, a heat curing glue, or a combination thereof. In addition, at least one of the substrates 210 and 220 is connected to the circuit board. In the embodiment, the circuit boards 212 and 222 are respectively connected to the substrates 210 and 220.

Referring to FIG. 3B, the substrate bonding method of the embodiment includes the following steps: First, the above-mentioned anti-overflow device 100 is provided. Next, the substrates 210 and 220 are placed in the housing 110, and a colloid 230 is applied between the substrates 210 and 220. In more detail, the substrates 210 and 220 are surrounded by the sidewall 112 of the frame 110, and there is only a slight gap between the substrates 210 and 220 and the sidewall 112 of the frame 110, or the substrates 210 and 220 are in contact with the frame. Side wall 112 of 110. Further, the circuit boards 212 and 222 connected to the substrates 210 and 220 protrude out of the housing 110 via the notches 113 of the side walls 112. In addition, in the embodiment, the substrate 220 may be stacked on the substrate 210, and then the stacked substrates 210 and 220 are placed in the frame 110. Alternatively, the substrate 210 is first placed in the housing 110, and then the substrate 220 is stacked on the substrate 210.

Thereafter, as shown in FIG. 3C, the substrates 210, 220 are pressed. Specifically, a pressure F may be applied to the substrate 220 by the pressing member to press the substrates 210, 220. Although the colloid between the substrates 210, 220 is pressed when the substrates 210, 220 are pressed 230 will flow, but the side wall 112 of the frame 110 prevents the colloid 230 from overflowing, so the colloid 230 will only overflow from the notch 113 of the side wall 112. In this way, it is possible to prevent the glue from overflowing around the substrates 210 and 220.

Then, the colloid 230 is cured by the colloidal curing member 120. In more detail, when the colloid 230 is an ultraviolet glue, the colloidal curing member 120 may be an ultraviolet lamp. When the colloid 230 is a heat curing adhesive, the colloidal curing member 120 may be a heating member such as an infrared lamp. When the selected colloid 230 is cured by ultraviolet light or heat, the colloidal curing member 120 may include an ultraviolet lamp and a heating member.

Since the substrate bonding method of the present embodiment cures the colloid 230 by the colloidal curing member 120, after the substrates 210 and 220 are taken out from the housing 110 (as shown in FIG. 3D), no overflow occurs.

It should be noted that since the above-mentioned colloidal curing member 120 can only be used for preliminarily curing the colloids 230 located at the edges of the substrates 210 and 220, after the substrates 210 and 220 are taken out from the housing 110, a colloid curing process can be further performed to further The colloid 230 is cured. That is, the portion of the colloid 230 that has not been cured is cured by the colloidal curing process.

In summary, the anti-overflow device and the substrate bonding method of the present invention have at least the following advantages:

1. The side wall of the frame allows the colloid to not overflow from the periphery of the substrate, but only overflows from the gap of the side wall, so that the overflow can be improved.

2. After the substrate is pressed, the colloid cured on the outer surface of the side wall can be used to cure the colloid at the edge of the substrate, so that it is possible to prevent the glue from overflowing after the substrate is taken out of the frame.

Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and it is intended to be a part of the invention. Retouching, therefore the invention The scope of protection is subject to the definition of the scope of the patent application.

50, 210, 220‧‧‧ substrates

60‧‧‧ display panel

70, 230‧‧ ‧ colloid

100‧‧‧Anti-overflow device

102‧‧‧Closed track

110‧‧‧ frame

112‧‧‧ side wall

113‧‧‧ gap

114‧‧‧ outer surface

116‧‧‧ bottom

120‧‧‧colloid hardened parts

212, 222‧‧‧ circuit board

FIG. 1 is a schematic view showing the occurrence of overflow during the substrate bonding process in the prior art.

2 is a schematic view of an anti-overflow device according to an embodiment of the present invention.

3A-3D are flow charts of a substrate bonding method according to an embodiment of the invention.

100. . . Anti-overflow device

102. . . Closed track

110. . . framework

112. . . Side wall

113. . . gap

114. . . The outer surface

116. . . bottom

120. . . Colloidal curing member

Claims (10)

An anti-overflow device suitable for bonding two substrates with a gel, comprising: a frame having a side wall disposed along a closed track, wherein the side wall has at least one notch, the side wall having an inner surface surrounding the edge of the two substrates The inner surface is adapted to fit the edge of the two substrates to prevent the colloid from overflowing when the two substrates are pressed, so that the colloid only overflows from the gap; and at least one colloid-cured member disposed on the side wall and the inner surface The at least one colloidal solidifying member surrounds the side wall. The anti-overflow device of claim 1, wherein the side wall is made of a transparent material. The anti-overflow device of claim 1, wherein the material of the sidewall comprises polymethyl methacrylate, polycarbonate or a combination thereof. The anti-overflow device of claim 1, wherein the at least one colloidal cured member comprises an ultraviolet lamp, a heating member or a combination thereof. The anti-overflow device of claim 4, wherein the heating member comprises an infrared lamp. The anti-overflow device of claim 1, wherein the frame further comprises a bottom portion, the side wall connecting the bottom portion and surrounding the bottom portion. A substrate bonding method is suitable for laminating two substrates. The substrate bonding method comprises: providing an anti-overflow device, the anti-overflow device comprising a frame body and at least one colloidal curing member, wherein the frame body has a frame along the a side wall of the closed track, the side wall having at least one notch, the side wall having an inner surface surrounding the edge of the two substrates, the inner surface being adapted to fit the edge of the two substrates to prevent the colloid from overflowing when the two substrates are pressed The colloid cured member is disposed only on the outer surface of the side wall opposite to the inner surface; the substrate is placed in the frame, and a glue is applied between the substrates Pressing the substrates; and curing the colloid by the at least one colloidal cured member. The substrate bonding method of claim 7, further comprising: removing the bonded substrates; and performing a colloid curing process to further cure the colloid. The substrate bonding method of claim 7, wherein at least one of the substrates is connected to a circuit board, and the circuit board protrudes outside the frame via the notch of the side wall. The substrate bonding method of claim 7, wherein the colloid comprises an ultraviolet glue, a heat curing glue or a combination thereof.