TWI413709B - Method for electroplating aurum onto connector and device for electroplating aurum - Google Patents
Method for electroplating aurum onto connector and device for electroplating aurum Download PDFInfo
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- TWI413709B TWI413709B TW100100218A TW100100218A TWI413709B TW I413709 B TWI413709 B TW I413709B TW 100100218 A TW100100218 A TW 100100218A TW 100100218 A TW100100218 A TW 100100218A TW I413709 B TWI413709 B TW I413709B
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- connector
- gold
- plating
- plating solution
- adsorption
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 75
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000009713 electroplating Methods 0.000 title claims abstract description 9
- -1 aurum ions Chemical class 0.000 claims abstract description 24
- 239000007788 liquid Substances 0.000 claims abstract description 3
- 238000007747 plating Methods 0.000 claims description 136
- 229910052737 gold Inorganic materials 0.000 claims description 87
- 239000010931 gold Substances 0.000 claims description 86
- 238000001179 sorption measurement Methods 0.000 claims description 58
- 150000001875 compounds Chemical class 0.000 claims description 10
- 238000005507 spraying Methods 0.000 claims description 7
- 239000004744 fabric Substances 0.000 claims description 5
- 230000007423 decrease Effects 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 150000002344 gold compounds Chemical class 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- UUWCBFKLGFQDME-UHFFFAOYSA-N platinum titanium Chemical compound [Ti].[Pt] UUWCBFKLGFQDME-UHFFFAOYSA-N 0.000 description 1
- XTFKWYDMKGAZKK-UHFFFAOYSA-N potassium;gold(1+);dicyanide Chemical compound [K+].[Au+].N#[C-].N#[C-] XTFKWYDMKGAZKK-UHFFFAOYSA-N 0.000 description 1
- NRTDAKURTMLAFN-UHFFFAOYSA-N potassium;gold(3+);tetracyanide Chemical compound [K+].[Au+3].N#[C-].N#[C-].N#[C-].N#[C-] NRTDAKURTMLAFN-UHFFFAOYSA-N 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
本發明係關係一種連接器之鍍金方法及其鍍金裝置，特別是一種僅在連接器之接觸點鍍金之連接器之鍍金方法及其鍍金裝置。The present invention relates to a gold plating method for a connector and a gold plating device thereof, and more particularly to a gold plating method of a connector for gold plating only at a contact point of a connector and a gold plating device thereof.
連接器(connector)係用以將兩個或更多電子組件連接在一起，或將電子組件連接至電氣設備。譬如將積體電路(IC或晶片)透過連接器電性連接至一印刷電路板。連接器亦可提供可重複分離及裝設電子組件連接至另一電子組件之作用，當電子組件故障或是須升級時，使用者或操作人員僅須拆下電子組件進行更換，而不用更換全部電子組件。A connector is used to connect two or more electronic components together or to connect an electronic component to an electrical device. For example, an integrated circuit (IC or wafer) is electrically connected to a printed circuit board through a connector. The connector can also provide repetitive separation and installation of electronic components to connect to another electronic component. When the electronic component fails or needs to be upgraded, the user or the operator only needs to remove the electronic component for replacement without replacing all Electronic components.
如圖1所示，連接器2a之一面包括複數凸緣(flange)21a，各凸緣包括接觸點(tip)211a，藉由接觸點211a與電子組件之金屬墊(圖未示)接觸產生電性連接，連接器2a之另一面則可與另一電子組件(圖未示)電性連接，藉以將電子組件與另一電子組件產生電性連接。凸緣21a之材質雖已選用金屬(如不鏽鋼或銅等)，但為了避免金屬氧化及提供更高之導電效能，會在凸緣21a上鍍金，然而凸緣21a真正與電子組件產生電性接觸的功能性區域只有接觸點211a，接觸點211a以外之無功能性區域亦會鍍金，此將造成成本增加，金價近年來日益高漲，此製造成本亦會不斷上升。As shown in FIG. 1, one side of the connector 2a includes a plurality of flanges 21a, and each of the flanges includes a tip 211a. The contact point 211a is electrically contacted with a metal pad (not shown) of the electronic component to generate electricity. The other side of the connector 2a can be electrically connected to another electronic component (not shown) to electrically connect the electronic component with another electronic component. Although the material of the flange 21a has been selected from metal (such as stainless steel or copper), in order to avoid metal oxidation and provide higher electrical conductivity, gold is plated on the flange 21a, but the flange 21a is in electrical contact with the electronic component. The functional area is only the contact point 211a, and the non-functional area other than the contact point 211a is also gold-plated, which will increase the cost, and the gold price is increasing in recent years, and the manufacturing cost will also rise.
目前以電路板方式製作之連接器，其選擇性鍍金製程皆需透過覆膜、曝光、顯影、鍍金及去膜等製程，耗時極長，且亦在無功能性區域鍍金，造成成本增加。At present, the selective gold plating process of the connector made by the circuit board requires a process such as lamination, exposure, development, gold plating and film removal, which takes a long time and is also gold-plated in a non-functional area, resulting in an increase in cost.
因此，有必要提供一種連接器之鍍金方法及其鍍金裝置，以改善上述所存在的問題。Therefore, it is necessary to provide a gold plating method for a connector and a gold plating device thereof to improve the above problems.
本發明之主要目的係在提供一種可降低鍍金成本之連接器之鍍金方法及其鍍金裝置。The main object of the present invention is to provide a gold plating method and a gold plating apparatus for a connector which can reduce the cost of gold plating.
本發明之連接器之鍍金裝置係用於對連接器進行鍍金處理，其中連接器包括複數凸緣，各凸緣包括接觸點。連接器之鍍金裝置包括電鍍槽、陽極板、供電裝置、吸附元件及電鍍液提供裝置。電鍍槽用以容納電鍍液，電鍍液包括含金化合物。陽極板係設置於電鍍槽中。供電裝置之一端係與陽極板連接，另一端則與連接器連接，其中連接器係作為陰極，供電裝置用以提供電流，經由陽極板使含金化合物於解離出金離子。The gold plating apparatus of the connector of the present invention is for gold plating a connector, wherein the connector includes a plurality of flanges, each flange including a contact point. The gold plating device of the connector includes a plating tank, an anode plate, a power supply device, an adsorption member, and a plating solution supply device. The plating bath is for containing a plating solution, and the plating solution includes a gold-containing compound. The anode plate is disposed in the plating bath. One end of the power supply device is connected to the anode plate, and the other end is connected to the connector, wherein the connector is used as a cathode, and the power supply device is used to supply current, and the gold-containing compound is dissociated from the gold ions via the anode plate.
吸附元件可由一驅動裝置帶動而轉動，且部分吸附元件浸入電鍍槽中，以吸收電鍍液，藉由吸附元件的轉動，使得吸附元件可全部被電鍍液沾濕。或者吸附元件也可不被驅動裝置帶動而轉動，僅部分吸附元件浸入電鍍槽，而部分被電鍍液沾溼。又，吸附元件用以吸附金離子並與接觸點接觸。The adsorption element can be rotated by a driving device, and a part of the adsorption element is immersed in the plating tank to absorb the plating solution, and the adsorption element can be completely wetted by the plating solution by the rotation of the adsorption element. Alternatively, the adsorbing element may be rotated without being driven by the driving device, and only part of the adsorbing element is immersed in the plating tank, and part of it is wetted by the plating solution. Further, the adsorption element is for adsorbing gold ions and contacting the contact points.
電鍍液提供裝置用以收集部分電鍍液，其乃藉由幫浦透過管路以抽取電鍍槽中之電鍍液。而電鍍液提供裝置包括至少一噴嘴，用以將部分電鍍液噴灑至吸附元件與凸緣接觸點之接觸面。The plating solution supply device collects a part of the plating solution, which is used to pump the plating solution in the plating tank by the pump through the pipeline. The plating solution supply device includes at least one nozzle for spraying a portion of the plating solution to the contact surface of the adsorption member and the flange contact point.
本發明之連接器之鍍金方法包括下列步驟：提供電鍍液；提供吸附元件；使吸附元件浸入電鍍液以使吸附元件吸附金離子；電鍍液提供裝置之噴嘴噴灑電鍍液至吸附元件與接觸點之接觸面；及移動連接器以使連接器之接觸點接觸吸附元件；藉此使金離子在接觸點上還原為金原子。The gold plating method of the connector of the present invention comprises the steps of: providing a plating solution; providing an adsorption element; immersing the adsorption element in the plating solution to adsorb the gold ions by the adsorption element; and spraying the plating solution to the adsorption element and the contact point by the nozzle of the plating solution supply device; Contacting the surface; and moving the connector such that the contact point of the connector contacts the adsorbing element; thereby causing the gold ions to be reduced to gold atoms at the point of contact.
為讓本發明之上述和其他目的、特徵和優點能更明顯易懂，下文特舉出較佳實施例，並配合所附圖式，作詳細說明如下。The above and other objects, features, and advantages of the present invention will become more apparent from the description of the appended claims.
請參考圖2及圖3，關於依據本發明之一實施例之連接器之鍍金裝置之示意圖。Please refer to FIG. 2 and FIG. 3 for a schematic diagram of a gold plating apparatus for a connector according to an embodiment of the present invention.
如圖2所示，本發明之連接器之鍍金裝置係用於對連接器1進行鍍金處理，其中連接器包括複數凸緣(flange)21、複數導電通孔22及導電層23，其中各凸緣21包括接觸點(tip)211，凸緣21係與導電層23電性連接。須注意的是，凸緣21之材質係金屬，譬如銅、銅合金、鈦、鈦合金或不鏽鋼等。凸緣21係略呈彎曲狀，因此凸緣21具有支撐性，但本發明不以此為限。須注意的是，凸緣21之外形不以圖2所示為限；舉例來說，凸緣之外形亦可為圓墊狀，其接觸點即為圓墊狀之中心點。As shown in FIG. 2, the gold plating device of the connector of the present invention is used for gold plating the connector 1, wherein the connector includes a plurality of flanges 21, a plurality of conductive vias 22 and a conductive layer 23, wherein each of the bumps The rim 21 includes a contact 211 that is electrically connected to the conductive layer 23. It should be noted that the material of the flange 21 is a metal such as copper, copper alloy, titanium, titanium alloy or stainless steel. The flange 21 is slightly curved, so the flange 21 has supportability, but the invention is not limited thereto. It should be noted that the outer shape of the flange 21 is not limited to that shown in FIG. 2; for example, the outer shape of the flange may also be a circular pad shape, and the contact point thereof is a center point of the circular pad shape.
連接器之鍍金裝置1包括電鍍槽10、陽極板20、供電裝置30、吸附元件40、電鍍液提供裝置50與驅動裝置60。電鍍槽10用以容納電鍍液81，電鍍液81包括含金化合物；在本發明之一實施例中，電鍍液81包括氰化金鉀(KAu(CN)2 )及光澤劑等添加劑，但含金化合物不以氰化金鉀為限。陽極板20係設置於電鍍槽中，以做為電鍍時之陽極。在本發明之一實施例中，陽極板20係白金鈦網，但本發明不以此為限。供電裝置30之一端係與陽極板20連接，供電裝置30之另一端係與連接器2連接，其中連接器2係作為陰極，供電裝置30用以提供電流，使電鍍液81中之含金化合物進行解離出金離子；在本發明之一實施例中，供電裝置30係整流器。The gold plating apparatus 1 of the connector includes a plating tank 10, an anode plate 20, a power supply device 30, an adsorption member 40, a plating solution supply device 50, and a driving device 60. The plating bath 10 is for accommodating the plating solution 81. The plating solution 81 includes a gold-containing compound. In one embodiment of the present invention, the plating solution 81 includes an additive such as potassium gold cyanide (KAu(CN) 2 ) and a gloss agent, but includes Gold compounds are not limited to gold potassium cyanide. The anode plate 20 is disposed in the plating bath as an anode during electroplating. In an embodiment of the invention, the anode plate 20 is a platinum titanium mesh, but the invention is not limited thereto. One end of the power supply device 30 is connected to the anode plate 20, and the other end of the power supply device 30 is connected to the connector 2, wherein the connector 2 serves as a cathode, and the power supply device 30 supplies current to the gold-containing compound in the plating solution 81. Dissociation of gold ions is performed; in one embodiment of the invention, the power supply device 30 is a rectifier.
在本發明之一實施例中，吸附元件40之材質係布料，凡任何具有吸附液體之布料皆可，但本發明不以此為限。舉例來說，吸附元件40亦可為金屬有機合成物。驅動裝置60係可驅動吸附元件40進行轉動，在本發明之一實施例中，驅動裝置60係由滾輪所組成，吸附元件40藉由驅動裝置60之帶動，可依序部份浸入電鍍槽10，以吸附含金離子之電鍍液81。須注意的是，因吸附元件40係部份持續浸入電鍍槽10中而保持濕潤狀態，且電鍍液81具有導電性，故當供電裝置30供電時，吸附元件40亦可具有陽極之作用。In an embodiment of the present invention, the material of the adsorbing element 40 is a cloth, and any fabric having an adsorbing liquid may be used, but the invention is not limited thereto. For example, the adsorption element 40 can also be a metal organic composition. The driving device 60 can drive the adsorption component 40 to rotate. In an embodiment of the invention, the driving device 60 is composed of a roller, and the adsorption component 40 is driven by the driving device 60 to be partially immersed in the plating tank 10 . To adsorb the plating solution 81 containing gold ions. It should be noted that since the adsorption element 40 portion is continuously immersed in the plating bath 10 to maintain a wet state, and the plating solution 81 has electrical conductivity, the adsorption element 40 may also function as an anode when the power supply device 30 is powered.
當連接器2進行鍍金時，只須將接觸點221與吸附元件40接觸，吸附元件40所吸附之金離子即可還原為金原子至接觸點221上，完成鍍金處理。如圖4所示，藉由本發明之連接器之鍍金裝置1，可將原本複雜的選擇性鍍金製程縮短為單一鍍金製程，除可降低工時外，亦可僅在接觸點221上鍍金，而不用如先前技術中，須在整片凸緣21上鍍金，可大幅降低製造成本。須注意的是，在本發明之一實施例中雖以驅動裝置60驅動吸附元件40進行轉動，但本發明不以此為限；本發明亦可使吸附元件40不轉動，僅移動連接器2而使接觸點221與吸附元件40接觸。When the connector 2 is gold-plated, the contact point 221 only needs to be in contact with the adsorption element 40, and the gold ions adsorbed by the adsorption element 40 can be reduced to gold atoms to the contact point 221 to complete the gold plating treatment. As shown in FIG. 4, by the gold plating device 1 of the connector of the present invention, the original complicated gold plating process can be shortened to a single gold plating process, and in addition to reducing the working time, only the contact point 221 can be plated with gold. It is not necessary to plate gold on the entire flange 21 as in the prior art, which can greatly reduce the manufacturing cost. It should be noted that, in an embodiment of the present invention, the driving device 60 drives the adsorption component 40 to rotate, but the invention is not limited thereto; the invention can also make the adsorption component 40 not rotate, and only move the connector 2 The contact point 221 is brought into contact with the adsorption element 40.
如圖2及圖3所示，為了避免當接觸點221數量較多或是在接觸點221面積較大時，造成吸附元件40所吸附之金離子量不夠而無法均勻鍍到接觸點221上，故電鍍液提供裝置50係設置在吸附元件40與接觸點221接觸面之下方。電鍍液提供裝置50用以容納部份電鍍液81，電鍍液提供裝置50內之電鍍液81可經由管路92透過幫浦91由電鍍槽10內進行吸取。電鍍液提供裝置50包括複數噴嘴51，當進行鍍金處理時，噴嘴51可抽取電鍍液81(譬如亦可透過幫浦91吸取)並噴灑至吸附元件40，因吸附元件40亦具有陽極之功能，故電鍍液81之含金化合物亦會解離出金離子，保持吸附元件40上之金離子濃度一定，確保各接觸點221上鍍金之品質。惟須注意的是，電鍍液提供裝置50設置之位置並不以圖2所示為限。As shown in FIG. 2 and FIG. 3, in order to avoid that when the number of contact points 221 is large or the area of the contact points 221 is large, the amount of gold ions adsorbed by the adsorption element 40 is insufficient and cannot be uniformly plated on the contact points 221, Therefore, the plating solution supply device 50 is disposed below the contact surface of the adsorption member 40 and the contact point 221. The plating solution supply device 50 is for accommodating a portion of the plating solution 81, and the plating solution 81 in the plating solution supply device 50 can be sucked from the plating tank 10 through the pipe 91 via the pipe 92. The plating solution supply device 50 includes a plurality of nozzles 51. When performing the gold plating process, the nozzles 51 can extract the plating solution 81 (for example, can also be sucked through the pump 91) and spray it onto the adsorption member 40, since the adsorption member 40 also has the function of an anode. Therefore, the gold-containing compound of the plating solution 81 also dissociates the gold ions, keeping the concentration of the gold ions on the adsorption element 40 constant, and ensuring the gold plating quality at each contact point 221. It should be noted that the position at which the plating solution supply device 50 is disposed is not limited to that shown in FIG.
本發明另提供一種連接器之鍍金方法，用於連接器之鍍金處理，以下即以圖2及圖3所示的本發明之連接器之鍍金裝置1為例，詳細說明本發明之連接器之鍍金方法之各個步驟，但須注意的是，只要能達成本發明之目的，本發明之方法並不以應用在圖2及圖3所示的連接器之鍍金裝置1為限。The present invention further provides a gold plating method for a connector for gold plating of a connector. Hereinafter, the gold plating device 1 of the connector of the present invention shown in FIG. 2 and FIG. 3 is taken as an example to explain in detail the connector of the present invention. Each step of the gold plating method, but it should be noted that the method of the present invention is not limited to the gold plating apparatus 1 of the connector shown in Figs. 2 and 3 as long as the object of the present invention can be attained.
如圖5所示，本發明首先進行步驟S71：提供電鍍液。As shown in Fig. 5, the present invention first proceeds to step S71: providing a plating solution.
如圖2所示，在本發明之一實施例中，電鍍液81包括含金化合物及金離子，電鍍液81係設置於電鍍槽10內，關於含金化合物及金離子之產生方式，已在上述實施例說明，故在此不再贅述。As shown in FIG. 2, in one embodiment of the present invention, the plating solution 81 includes a gold-containing compound and gold ions, and the plating solution 81 is disposed in the plating bath 10. The manner in which the gold-containing compound and the gold ion are generated has been The above embodiments are described, and thus are not described herein again.
接著進行步驟S72：提供吸附元件。Next, step S72 is performed: providing an adsorption element.
在本發明之一實施例中，吸附元件40之材質係布料，但本發明不以此為限。In an embodiment of the invention, the material of the adsorption element 40 is a cloth, but the invention is not limited thereto.
接著進行步驟S73：使吸附元件浸入電鍍液以使吸附元件吸附含金離子之電鍍液。Next, in step S73, the adsorption element is immersed in the plating solution to cause the adsorption element to adsorb the plating solution containing gold ions.
如圖2所示，在本發明之一實施例中，驅動裝置60係可驅動吸附元件40進行轉動，使吸附元件40轉動並浸入電鍍槽10內，以吸附含金離子之電鍍液。須注意的是，驅動裝置60並非本發明之必要元件，吸附元件40亦可不轉動，保持靜止狀態。As shown in FIG. 2, in an embodiment of the present invention, the driving device 60 can drive the adsorption member 40 to rotate, and the adsorption member 40 is rotated and immersed in the plating tank 10 to adsorb the plating solution containing gold ions. It should be noted that the driving device 60 is not an essential component of the present invention, and the adsorption member 40 may not rotate and remain in a stationary state.
接著進行步驟S74：噴灑電鍍液至吸附元件與接觸點之接觸面。Next, step S74 is performed: spraying the plating solution to the contact surface of the adsorption element and the contact point.
其中步驟S74更包括步驟S741及步驟S742。Step S74 further includes step S741 and step S742.
步驟S741：提供電鍍液提供裝置。Step S741: providing a plating solution supply device.
關於電鍍液提供裝置50之說明，已在上述實施例說明，故在此不再贅述。The description of the plating solution supply device 50 has been described in the above embodiments, and therefore will not be described herein.
步驟S742：以噴嘴噴灑部分電鍍液至吸附元件與接觸點之接觸面。Step S742: spraying a part of the plating solution with the nozzle to the contact surface of the adsorption element and the contact point.
如圖3所示，步驟S742係以電鍍液提供裝置50之噴嘴51噴灑電鍍液81至吸附元件40，電鍍液81之含金化合物亦會解離出金離子，保持吸附元件40上之金離子濃度一定，確保接觸點221上鍍金之品質。As shown in FIG. 3, in step S742, the plating solution 81 is sprayed to the adsorption element 40 by the nozzle 51 of the plating solution supply device 50, and the gold-containing compound of the plating solution 81 also dissociates the gold ions to maintain the gold ion concentration on the adsorption element 40. Certainly, ensure the quality of the gold plating on the contact point 221.
最後進行步驟S75：移動連接器以使連接器之接觸點接觸吸附元件。Finally, step S75 is performed: moving the connector to bring the contact point of the connector into contact with the adsorption element.
在本發明之一實施例中，移動連接器2以使連接器2之接觸點211與吸附元件40接觸，由於吸附元件40可視為陽極，接觸點211視為陰極，故金離子可還原為金原子至接觸點211上。In an embodiment of the invention, the connector 2 is moved such that the contact point 211 of the connector 2 is in contact with the adsorption element 40. Since the adsorption element 40 can be regarded as an anode and the contact point 211 is regarded as a cathode, the gold ions can be reduced to gold. The atom is on the contact point 211.
綜上所陳，本發明無論就目的、手段及功效，在在均顯示其迥異於習知技術之特徵，懇請 貴審查委員明察，早日賜准專利，俾嘉惠社會，實感德便。惟應注意的是，上述諸多實施例僅係為了便於說明而舉例而已，本發明所主張之權利範圍自應以申請專利範圍所述為準，而非僅限於上述實施例。To sum up, the present invention, regardless of its purpose, means and efficacy, shows its distinctive features of the prior art. You are requested to review the examination and express the patent as soon as possible. It should be noted that the various embodiments described above are merely illustrative for ease of explanation, and the scope of the invention is intended to be limited by the scope of the claims.
1．．．連接器之鍍金裝置1. . . Connector gold plating device
10．．．電鍍槽10. . . Plating tank
20．．．陽極板20. . . Anode plate
22．．．導電通孔twenty two. . . Conductive through hole
23．．．導電層twenty three. . . Conductive layer
30．．．供電裝置30. . . Power supply unit
40．．．吸附元件40. . . Adsorption element
50．．．電鍍液提供裝置50. . . Plating solution supply device
51．．．噴嘴51. . . nozzle
60．．．驅動裝置60. . . Drive unit
2、2a．．．連接器2, 2a. . . Connector
21、21a．．．凸緣21, 21a. . . Flange
211、211a．．．接觸點211, 211a. . . Contact point
81．．．電鍍液81. . . Plating solution
91．．．幫浦91. . . Pump
92．．．管路92. . . Pipeline
圖1係關於先前技術之連接器之示意圖。Figure 1 is a schematic illustration of a prior art connector.
圖2係關於本發明之連接器之鍍金裝置之一實施例之側面示意圖。Figure 2 is a side elevational view of one embodiment of a gold plated device for a connector of the present invention.
圖3係關於圖2之連接器、吸附元件及電鍍液提供裝置相接處之放大示意圖。Fig. 3 is an enlarged schematic view showing the connection of the connector, the adsorbing element and the plating solution supply device of Fig. 2.
圖4係關於本發明製作出之連接器之接觸點之示意圖。Figure 4 is a schematic illustration of the contact points of the connector made in accordance with the present invention.
圖5係關於本發明之連接器之鍍金方法之一實施例之步驟流程圖。Figure 5 is a flow chart showing the steps of an embodiment of the gold plating method of the connector of the present invention.
1．．．連接器之鍍金裝置1. . . Connector gold plating device
10．．．電鍍槽10. . . Plating tank
20．．．陽極板20. . . Anode plate
22．．．導電通孔twenty two. . . Conductive through hole
23．．．導電層twenty three. . . Conductive layer
30．．．供電裝置30. . . Power supply unit
40．．．吸附元件40. . . Adsorption element
50．．．電鍍液提供裝置50. . . Plating solution supply device
51．．．噴嘴51. . . nozzle
60．．．驅動裝置60. . . Drive unit
2．．．連接器2. . . Connector
21．．．凸緣twenty one. . . Flange
81．．．電鍍液81. . . Plating solution
91．．．幫浦91. . . Pump
92．．．管路92. . . Pipeline
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100100218A TWI413709B (en) | 2011-01-04 | 2011-01-04 | Method for electroplating aurum onto connector and device for electroplating aurum |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100100218A TWI413709B (en) | 2011-01-04 | 2011-01-04 | Method for electroplating aurum onto connector and device for electroplating aurum |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201229326A TW201229326A (en) | 2012-07-16 |
| TWI413709B true TWI413709B (en) | 2013-11-01 |
Family
ID=46933898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100100218A TWI413709B (en) | 2011-01-04 | 2011-01-04 | Method for electroplating aurum onto connector and device for electroplating aurum |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI413709B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103668406B (en) * | 2012-09-17 | 2016-05-11 | 郑振华 | Spray-suction electroplating tank |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4001093A (en) * | 1975-08-06 | 1977-01-04 | Bell Telephone Laboratories, Incorporated | Method of electroplating precious metals in localized areas |
| US20030150738A1 (en) * | 2003-03-10 | 2003-08-14 | Modular Components National, Inc. | High efficiency plating apparatus and method |
| US6706329B1 (en) * | 2002-11-21 | 2004-03-16 | Ming-Ho Chien | Local nickel plating for aluminum alloy radiator |
-
2011
- 2011-01-04 TW TW100100218A patent/TWI413709B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4001093A (en) * | 1975-08-06 | 1977-01-04 | Bell Telephone Laboratories, Incorporated | Method of electroplating precious metals in localized areas |
| US6706329B1 (en) * | 2002-11-21 | 2004-03-16 | Ming-Ho Chien | Local nickel plating for aluminum alloy radiator |
| US20030150738A1 (en) * | 2003-03-10 | 2003-08-14 | Modular Components National, Inc. | High efficiency plating apparatus and method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201229326A (en) | 2012-07-16 |
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