TWI412095B - Solder ball presses - Google Patents

Abstract

PURPOSE: A soldering ball printer is provided to prevent an interruption of a work due to an over and shortage of the soldering ball by uniformly supplying the soldering ball to a mask. CONSTITUTION: A soldering ball retention unit(60) is installed to a soldering ball supplying table(61). A soldering ball supplying unit(62) supplies the soldering ball to a mask surface about the soldering ball retention unit. The soldering ball retention unit is rotated toward the soldering ball supplying table. The soldering ball retention unit is moved to the vertical direction. The soldering ball supplying table is moved to the longitudinal direction of the soldering ball supplying unit. The soldering ball supplying table supplies the soldering ball to the soldering ball supplying unit. The soldering ball supplying unit is installed on a cover(64). An installing frame(69) is installed on the cover for installing the soldering ball supplying unit and a soldering ball charging member(63).

Description

Solder ball printing machine

The present invention relates to a printing apparatus for forming solder on an electrode of a semiconductor substrate by a printing method, and more particularly to a solder ball printing machine that performs printing using a solder ball.

In the conventional solder ball printing machine, as described in Patent Document 1, there is a solder ball supply unit that supplies a solder ball to the mask surface, and a solder ball that is supplied to the mask surface is provided in the mask. A printing device having a configuration in which the upper opening portion is pushed onto the substrate surface while the plurality of linear members provided in the vibrating jig are pressed against the mask surface to move in the horizontal direction.

Further, as described in Patent Document 2, when the pressing head is horizontally moved and the solder ball is sprinkled into the opening of the mask, a specific amount of welding is disclosed from the measuring portion provided at the upper portion of the pressing head. The ball is supplied to the rotating lever handle of the pressing head, and the solder ball is supplied to the mask surface from the rotating lever.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-101502

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2008-142775

In the configuration of Patent Document 1, when the mask is placed on the table, the solder ball supply device is provided at the entrance of the cover side, and the solder ball is supplied to the mask surface from the supply device. Move the mask on the workbench move. Accordingly, the solder balls can be uniformly dispersed and disposed on the mask surface. after that. The vibrating jig is horizontally moved to supply a solder ball to the opening of the mask. In this manner, when the solder balls are dispersedly disposed on the mask, the solder balls scattered and disposed may be biased due to fluctuations in the moving side of the mask or vibrations when the mask is stopped. Further, since the solder ball is supplied before the mask is placed in the printing machine, each time the printing is performed, the mask must be moved, and the production time is prolonged.

Furthermore, as described in the literature 2, the solder balls are supplied to the mask surface from the shank of the rotating rod, and the solder balls are not necessarily uniformly dispersed in order to disperse the solder balls on the mask surface as the pressing head rotates. In the case of printing defects, there is a need to have a repair project.

Accordingly, an object of the present invention is to provide a solder ball printing machine which can solve the above problems and which is capable of miniaturizing the device and which is excellent in printing solder balls.

In order to achieve the above object, a workpiece such as a printed circuit board or a wafer in which a flux is printed in advance is fixed to a printing table, and the electrode pattern of the workpiece is aligned with the electrode pattern of the mask, and the positioning and printing table is recognized by the upper and lower two-view cameras, and printing is performed. The workpiece on the stage rises into contact with the mask, and the solder ball is supplied to the mask surface from the solder ball supply head on the electrode pattern or the electrode pad of the workpiece, and the solder ball printing machine that performs transfer and printing through the mask is characterized. The solder ball supply head is configured by a solder ball storage portion provided with a storage solder ball, and a solder ball supply portion for supplying a specific amount of solder balls to the mask surface under the solder ball storage portion, and sandwiching The solder ball supply unit presses the solder ball into the opening of the mask surface in the moving direction of the solder ball supply head, and is formed by a plurality of wires of a semi-helical shape on the side in contact with the mask surface in order to scrape the excess solder ball. Solder ball filling member.

According to the above configuration, the solder ball can be uniformly supplied to the mask, and the supply of the solder ball can be obtained only by the solder ball remaining portion of the solder ball storage portion being exchanged with the solder ball storage portion or externally supplied to the solder ball storage portion. There is no need to interrupt the operation due to insufficient solder balls. Further, since the solder ball filling member composed of the semi-spiral wire is disposed between the solder ball supply portions, it is possible to apply a rotational force to the solder balls in the space of the half spiral, to uniformly disperse the solder balls, and to open the solder mask. The department can also smoothly fill the effect.

The invention is illustrated using the following figures. Fig. 1 shows an example of a solder ball supply head for a solder ball printer of the present invention.

The solder ball supply head 3 is provided with a supply head drive motor 4 for moving the supply head in the vertical direction on the supply head moving table 2. The supply head moving table 2 is moved in the horizontal direction by a motor 2g provided on the apparatus main body side and a horizontal direction moving mechanism constituted by the ball screw 2b. A solder ball supply stage 61 on which the solder ball storage unit 60 is mounted is provided in the supply head moving table 2. The solder ball supply portion 62 configured to supply the solder ball to the mask surface is located on the lower side with respect to the solder ball storage portion 60. The solder ball storage portion 60 is mounted to be rotatable to the solder ball supply table 61. Further, the solder ball storage portion 60 can be moved up and down. When the solder ball 24 is supplied to the solder ball supply portion 62, the solder ball 24 is moved downward (on the solder ball supply portion side) to cause the solder ball to be self-contained from the container constituting the solder ball storage portion 60. Shake off inside (injector). In addition, the solder ball supply stage 61 can supply the solder ball 24 to the solder ball supply part 62 while moving the container while moving in the longitudinal direction of the solder ball supply part 62. The details of the solder ball storage portion will be described later.

The solder ball supply unit 62 is attached to the cover 64, and an opening portion is provided corresponding to the longitudinal direction of the solder ball supply unit 62 so that the solder ball 24 can be supplied to the upper portion of the solder ball supply unit 62 corresponding to the cover 64. A mounting frame 69 for mounting the solder ball supply portion 62 and the solder ball filling member 63 is provided on the cover 64. Further, a vibration machine 5 that horizontally vibrates the ball filling member 63 or the ball supply unit 62 is provided.

Further, the cover 64 is attached to the vibration frame 70, and a slider 67 is provided on the upper portion of the vibration frame 70. The slider 67 is provided on the linear guide 67R, and the linear guide 67R is provided in the supply head mounting frame 71, and the supply head mounting frame 71 is provided on the upper portion of the vibration frame. A cam 66 is provided at one end of the vibration frame 70, and is rotationally driven by a cam drive motor 68 provided in the supply head mounting frame, thereby becoming a horizontal direction at a frequency lower than the frequency of the previously described vibration machine. (The direction of the linear guide) Shakes the configuration of the vibration frame 70. In this way, by providing two different vibration means, the selection range of the vibration frequency for supplying the solder ball from the solder ball supply portion to the mask surface is widened. The supply head mounting frame 71 is movable up and down by the motor 4 belonging to the supply head driving means. Further, here, it is described that the feed head mounting frame 71 is driven up and down by the motor 4, but a pneumatic cylinder may be used instead of the motor 4.

Fig. 2 shows a schematic configuration of a solder ball printing machine for printing solder balls. Fig. 2(a) shows a state in which the positioning of the mask and the substrate is performed, and Fig. 2(b) shows a state in which the solder balls are printed on the substrate.

The solder ball printing machine 1 is provided with a printing table 10 including a driving unit 11 so as to be movable up and down. The substrate 21 is placed on the printing table 10, and the camera 15 is used on the surface of the mask 20 and the surface of the substrate 21, and the XY table of the horizontal movement mechanism provided on the lower side of the printing table 10 (not shown) is driven to perform positioning. Thereafter, the camera 15 for positioning is retracted, and as shown in FIG. 2(b), the printing table 10 is raised, and the surface of the mask 20 provided on the upper portion of the table is brought into contact with the surface of the substrate 21 to drive the supply head. The upper and lower drive mechanism 4 moves the solder ball supply head 3 up and down to bring the solder ball filling member 63 into contact with the mask surface. Then, the ball screw 2b is rotated by driving the supply head driving portion 2g, and the solder ball supply head 3 is moved in the horizontal direction (arrow direction). When the solder ball supply head 3 moves, the solder ball supply portion 62 vibrates in the horizontal direction (the feed head moving direction) by the vibrator 65, and the cam 66 also drives the cam shaft drive motor 68 to rotate, thereby being horizontally oriented. The ball 24 is shaken out of the solder ball supply portion 62. Further, although the vibration of the solder ball is simultaneously driven to drive the vibrator and the cam, the solder ball may be swung out by either of the driving. At the same time as the solder ball is shaken, the solder ball filling member 63 is provided in the moving direction of the solder ball supply head 3 by sandwiching the solder ball supply portion 62, and the solder ball is filled in the opening portion provided in the mask 20. . Further, in the present apparatus, a cleaning mechanism 45 for cleaning the back surface of the mask is provided in the camera moving frame, and similarly to the camera 15, the mask cleaning is performed while moving in the horizontal direction.

Fig. 3 is a plan view showing the solder ball supply portion and the solder ball filling member. Fig. 3(a) is a plan view showing the device before the solder ball filling member 63 is mounted, and Fig. 3(b) is an enlarged view showing a portion B of (a). The solder ball filling member 63 is formed as two mounting portions 63P (the width of the mounting portion is about 5 mm) which are disposed in parallel and have a specific interval (about 35 mm in this embodiment) as shown in the drawing, and in the above-described mounting portion 63P A plurality of wires 63L (thickness 0.1 mm) having a specific angle (about 5 to 35 degrees) are formed at a specific interval 63S (about 0.1 mm). The wire is formed by etching a steel plate having a thickness of 0.1 mm. Further, the wire of the present embodiment is provided in the two mounting portions 63P provided with the gap in a state where the axis is shifted. The angle of the wire is preferably about 10 degrees. The mounting portion 63P is formed in a direction perpendicular to the direction in which the solder ball supply head 3 travels in the longitudinal direction. That is, it is the length of the width of the solder ball supply head. The solder ball filling member 63 is attached to the housing of the filling member mounting frame 69 and the solder ball supply portion 62. That is, it is a shape in which the upper half of the spiral coil is cut and mounted in the lower direction of the solder ball supply head during mounting. Therefore, when the welding ball supply head 3 is brought into contact with the mask side by the supply of the specific pressing force by the supply head driving means, most of the wires having a specific angle with respect to the traveling direction of the supply head with the contact portion of the mask are simultaneously moved.

Fig. 4 is a schematic view showing the state of filling of the solder balls. In Fig. 4, the solder 22 is printed on the electrode portion on the substrate 21. Then, on the back side of the vicinity of the opening of the mask 20, minute projections 20a are provided to form a non-contact flux or the like. Even if the microprotrusions 20a are replaced, a slight step of the film or the like may be provided. Further, as shown in Fig. 4, the solder ball filling member 63 provided in the solder ball supply head 3 is formed by the wire 63L in the vertical direction. The spiral (semicircular) space, by which the solder ball 24 generates a rotational force in response to the traveling direction of the supply head, thereby dispersing the solder ball 24 and supplying a mask opening portion. A solder ball. Further, the solder ball supply portion 62 is also provided with a wire material which is formed by the same method as the solder ball filling member 63, and has a line spacing which is set to be smaller than the applicable ball diameter by about 5 μm.

Fig. 5 shows the state in which the solder balls are in the moving direction when the solder ball supply head is moved.

By forming the solder ball filling member 63 on the surface side facing the mask surface of the solder ball supply portion 62, as shown in Fig. 5, when the solder ball supply head 3 moves on the mask surface, the moving direction is required. The solder balls 24 are assembled, and an appropriate amount of solder balls are supplied to the mask surface by the action of the horizontal vibration damper 65, and are pushed into the mask opening surface by the solder ball filling member located behind the traveling direction. . Further, as shown in Fig. 5, in the oblique direction of the wire 63L, the wire 63L of the solder ball filling member 63 is inclined in the opposite direction with respect to the wire of the solder ball supply portion 62.

Further, as an example of a method of producing a wire for a solder ball filling member or a solder ball supply portion, as described above, a steel plate having a thickness of 0.05 to 0.1 mm is machined into a specific outer shape, and then the wire portion is left to be etched and the wire is etched. The gap between the parts.

Fig. 6 is a view showing a configuration for supplying a solder ball from a solder ball storage portion to a solder ball supply portion.

A solder ball supply stage 61 is provided in the supply head moving table 2. The solder ball supply stage 61 is configured to move by a ball screw 77 connected to a shaft of the stepping motor 76 attached to the supply head moving table 2. The solder ball supply unit 61 is provided with a solder ball storage portion 60 formed by an injector or the like to be rotatable. Usually solder ball storage The 60-type solder ball discharge port is horizontal, and when the solder ball is supplied to the solder ball supply unit 62, the solder ball storage portion 60 is rotated by the rotary brake 78, and the discharge port faces downward as shown in the drawing. Further, the solder ball storage portion 60 can be lowered by the cylinder 75 so as to be close to the opening of the cover provided on the upper portion of the solder ball supply portion 62. In this way, by configuring the supply of the solder balls from the injector to the solder ball supply unit 62, the solder ball storage unit 60 can be operated in accordance with the amount of solder balls in the solder ball supply unit 62 to replenish the solder balls.

Next, a series of actions of solder ball printing will be described.

First, the substrate 21 on which the flux is printed on the electrode portion is carried into the solder ball printer and placed on the printing table 10. In the printing table 10, a plurality of suction ports for supplying a negative pressure are provided, and by supplying a negative pressure, the substrate 21 is kept not moved on the printing table surface.

Next, the positioning mark provided on the surface of the substrate 21 and the positioning mark provided on the mark 20 are photographed using a camera for positioning. The photographed data is sent to a control unit (not shown), where image processing is performed to obtain a positional shift amount. According to the result, the printing table is moved to the direction of the correction offset by the horizontal direction moving mechanism (not shown).

When the positioning is completed, the printing table 10 is raised to bring the printing surface of the substrate 21 into contact with the back surface of the mask 20.

Next, the solder ball supply head 3 is horizontally moved to the printing start position and lowered to the mask surface. Next, the amount of the solder balls in the solder ball supply unit 62 is checked, and when the amount required for printing is not performed, the solder ball storage unit 60 is operated to supply the required amount of solder balls to the solder ball supply unit 62.

Thereafter, the vibrator 65 and the camshaft drive motor 68 are driven to supply the solder balls accommodated in the solder ball supply unit 62 to the mask surface.

While the solder ball supply head 3 is moved in the horizontal direction, the solder ball is pushed into the opening of the mask by the solder ball filling member (the spring action of the coil-shaped wire), and the solder adhered to the substrate.

When the solder ball supply head 3 finishes moving on the mask surface, the solder ball supply head 3 is raised to be spaced apart from the mask 20 surface, and then the solder ball supply head 3 is returned to the original position.

Next, the printing table 10 is lowered to separate the masks from the printing table.

The state of printing of the printed substrate was photographed by a camera to investigate whether or not there was a defect.

If there is a defect, the substrate is transported to the repairing unit where the defective portion is repaired.

After the defect is repaired, it is transported to the reflow part to melt and fix the solder ball.

Although the printing process of the solder ball is generally described above, the repair unit or the reflow unit is different from the above-described device, and therefore will not be described in detail.

In this project, by using the solder ball supply head of the present invention, it is possible to reliably supply the solder balls having the small diameter from the mask opening to the flux.

1. . . Solder ball printing machine

2. . . Supply head moving frame

3. . . Solder ball supply head

4. . . Supply head up and down drive mechanism

10. . . Printing station

11. . . Printing table rising mechanism

15. . . camera

20. . . Screen

twenty one. . . Substrate

twenty four. . . Solder ball

45. . . Cleaning mechanism

60. . . Solder ball storage

62. . . Solder ball supply

63. . . Solder ball filling member

65. . . Damper

66. . . Cam

Fig. 1 is a view showing an example of a solder ball supply head for a solder ball printer of the present invention.

Fig. 2 is a view showing a schematic configuration of a solder ball printing machine for printing solder balls.

Fig. 3 is a plan view showing the solder ball supply portion and the solder ball filling member.

Figure 4 is a schematic view of the filling condition of the solder balls.

Fig. 5 is a view showing a state in which the welding balls are in the moving direction of the welding ball supply portion when the solder ball supply head is moved.

Fig. 6 is a view showing a configuration for supplying a solder ball from a solder ball storage portion to a solder ball supply portion.

2. . . Supply head moving frame

3. . . Solder ball supply head

4. . . Supply head up and down drive mechanism

twenty four. . . Solder ball

60. . . Solder ball storage

61. . . Solder ball supply station

62. . . Solder ball supply

63. . . Solder ball filling member

64. . . cover

65. . . Damper

66. . . Cam

67. . . Slider

67R. . . Linear Guides

68. . . Camshaft drive motor

69. . . Installation box

70. . . Vibrating frame

71. . . Supply head mounting frame

Claims (5)

A solder ball printing machine fixes a workpiece printed with flux in advance on a printing table, and uses the upper and lower two-view cameras to identify and position the printing table, so that the electrode pattern of the workpiece is consistent with the electrode pattern of the mask, and the workpiece on the printing table rises to Contacting the mask, and feeding a solder ball from the solder ball supply head to the mask surface on the electrode pattern or the electrode pad of the workpiece, and performing transfer and printing through the mask, the solder ball printing machine is characterized in that: the solder ball supply head The solder ball storage portion provided with the storage solder balls and the solder ball supply portion for supplying a specific amount of solder balls to the mask surface under the solder ball storage portion, and the movement of the solder ball supply head The direction is obtained by dispersing the solder balls supplied from the solder ball supply portion in the opening portion of the mask surface, and in order to scrape the excess solder balls, the solder balls formed by the plurality of semi-spiral wires on the side in contact with the mask surface The filling member further includes a driving unit that moves the head to the solder ball supply head in the vertical direction, and a rotating mechanism that supplies the solder ball to the solder ball supply head. The solder ball printing machine according to the first aspect of the invention, wherein the solder ball supply head is provided with a horizontal direction oscillating member that oscillates the solder ball filling member in a moving direction of the solder ball supply head. The solder ball printing machine according to claim 1, further comprising: a supply head vertical drive mechanism for moving the solder ball supply head up and down, and the supply head upper and lower drive mechanism is provided in the solder ball supply head The solder ball filling member pushes the pressing force on the mask surface, thereby making the structure The wire of the above-described solder ball filling member is contacted at a specific angle with respect to the moving direction of the solder ball supply head. The solder ball printing machine according to the first aspect of the invention, wherein the solder ball filling member is made of a steel plate having a thickness of 0.05 to 0.1 mm, spaced apart by 0.1 mm to 0.3 mm, and having a width of 0.1 mm and about 5 to 35 In addition to the filling member mounting portion, etching is performed to form a plurality of wires at a time, and is provided in a filling member mounting portion in a semi-helical shape. The solder ball printing machine according to the fourth aspect of the invention, wherein the solder ball supply unit provided in the solder ball supply head is provided with a tilt in a direction opposite to an oblique direction of the wire of the solder ball filling member. Wire.