TWI408358B - Defect correction device - Google Patents
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- TWI408358B TWI408358B TW096123476A TW96123476A TWI408358B TW I408358 B TWI408358 B TW I408358B TW 096123476 A TW096123476 A TW 096123476A TW 96123476 A TW96123476 A TW 96123476A TW I408358 B TWI408358 B TW I408358B
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
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- G01N21/956—Inspecting patterns on the surface of objects
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
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- G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
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Abstract
Description
本發明係有關於一種對基板上的缺陷,藉由照射雷射光修正缺陷之缺陷修正裝置。本發明係於2006年7月3日於日本提出,並依據日本申請案第2006-183111號,主張優先權,在此,援用此內容。The present invention relates to a defect correcting device for correcting defects on a substrate by correcting defects by irradiating laser light. The present invention is filed in Japan on July 3, 2006, and claims priority based on Japanese Patent Application No. 2006-183111, the disclosure of which is incorporated herein.
在製造液晶顯示裝置等平面顯示器(FPD)及半導體晶圓之光學微影製造程序中,一般是使用藉由雷射光修正大型玻璃基板及半導體基板等發生於基板上的陷之缺陷修正裝置(例如:參考日本公開公報第2001-91919號公報)。習知缺陷修正裝置中,係藉由檢查裝置檢查以製造程序製造之基板,並將缺陷部的影像資料進行影像處理,自動判斷基板上的缺陷是不會對接續製造程序造成影響之模擬缺陷、或必須修正的真正缺陷,再依據該判斷結果修正缺陷。但,前述缺陷檢查裝置,無法避免因為缺陷的種類、大小、位置等的判定基準設定條件而錯誤判斷,在缺陷分類的判定精準度是有限的。在此,操作者係使用顯微鏡等的微觀檢查裝置,詳細觀察以巨觀檢查檢查出之缺陷,再從以巨觀檢查時所檢查出的缺陷中,進行選擇欲修正之缺陷。In manufacturing an optical lithography manufacturing program for a flat panel display (FPD) such as a liquid crystal display device or a semiconductor wafer, a defect correction device for correcting a large glass substrate, a semiconductor substrate, or the like on a substrate by laser light is generally used (for example, : Refer to Japanese Laid-Open Patent Publication No. 2001-91919. In the conventional defect correction device, the substrate manufactured by the manufacturing process is inspected by the inspection device, and the image data of the defect portion is image-processed, and the defect on the substrate is automatically determined to be a simulation defect that does not affect the connection manufacturing process, Or the real defect that must be corrected, and then correct the defect based on the judgment result. However, the defect inspection device cannot be erroneously determined due to the determination criterion setting conditions such as the type, size, and position of the defect, and the accuracy of the determination of the defect classification is limited. Here, the operator uses a microscopic inspection apparatus such as a microscope to observe in detail the defects detected by the giant inspection, and then selects defects to be corrected from the defects detected by the giant inspection.
習知,操作者查核全部的缺陷,判斷是否修正該缺陷,在修正的情形下,係操作缺陷修正裝置,並對缺陷位置照射雷射光來修正缺陷。查核各缺陷時,載置有基板的平台會朝XY方向移動,並使作為是否修正的判段對象之全部缺陷移動至顯微鏡的觀察位置,以進行觀察。由於操作者經常在缺陷修正裝置前進行該作業,必須非常注意缺陷修正裝置的操作及缺陷觀察,故操作者負擔大。又,缺陷修正裝置的維持時間,係與欲處理的缺陷數目有關,並依順序反覆進行查核、判斷是否有修正必要性及缺陷的修正,是沒有效率的。Conventionally, the operator checks all defects and judges whether or not the defect is corrected. In the case of correction, the defect correction device is operated, and the defect position is irradiated with laser light to correct the defect. When each defect is checked, the stage on which the substrate is placed moves in the XY direction, and all the defects of the judgment target which is the correction are moved to the observation position of the microscope for observation. Since the operator often performs the work before the defect correction device, it is necessary to pay great attention to the operation of the defect correction device and the observation of the defect, so that the operator is burdened. Further, the maintenance time of the defect correction device is related to the number of defects to be processed, and is checked in order, and it is inefficient to check whether or not there is correction necessity and correction of defects.
本發明係有鑒於上述問題點所構成者,目的在於提供一種可減輕操作者的負擔,且可有效率地修正缺陷之缺陷修正裝置。The present invention has been made in view of the above problems, and it is an object of the invention to provide a defect correction device capable of reducing the burden on an operator and efficiently correcting defects.
本發明係用以解決前述課題而製成者,係一種用以修正基板上缺陷之缺陷修正裝置,並包含有:攝影部,依據在修正程序前的檢查程序檢查出之前述基板的檢查資料的缺陷位置資訊,攝影作為查核對象之缺陷;顯示部,縮小並一覽顯示藉前述攝影部所攝影之各缺陷查核檢查影像;缺陷選擇部,自藉前述顯示部一覽顯示之前述查核檢查影像,選擇欲修正之缺陷;缺陷修正部,修正藉前述缺陷選擇部選擇之前述缺陷;及控制部,控制前述攝影部、前述顯示部及前述缺陷修正部。The present invention is directed to a defect correcting device for correcting a defect on a substrate, and includes: a photographing unit that checks an inspection material of the substrate according to an inspection program before a correction program. Defect location information, photography is a defect of the object to be checked; the display unit reduces and displays a list of the inspection images detected by the photographing unit; and the defect selection unit selects the inspection image from the list of the display units. The defect is corrected; the defect correcting unit corrects the defect selected by the defect selecting unit; and the control unit controls the image capturing unit, the display unit, and the defect correcting unit.
又,本發明缺陷修正裝置,其中前述控制部,係依據 前述檢查資料的缺陷位置資訊,在前述缺陷修正部的缺陷修正前,以攝影部攝影作為查核對象之全部缺陷,並以影像處理部將該查核檢查影像生成縮小影像,再使該縮小影像與前述缺陷資料相關並儲存於記憶部,並依據開始修正的指令,自前述記憶部讀出查核檢查影像縮小影像,並在前述顯示部進行一覽顯示之控制。Moreover, the defect correction device of the present invention, wherein the control unit is based on In the defect position information of the inspection data, before the defect correction by the defect correction unit, all the defects of the inspection target are taken by the image capturing unit, and the image processing unit generates the reduced image by the image of the inspection image, and the reduced image and the The defect data is associated with and stored in the memory unit, and the image of the inspection image reduction image is read from the memory unit in accordance with the instruction to start the correction, and the display is displayed on the display unit.
又,本發明之缺陷修正裝置,其中前述控制部,係對前述攝影部,攝影藉前述缺陷修正部修正之前述缺陷在修正後的影像,同時對前述顯示部,縮小以前述攝影部攝影之修正後影像,再進行與前述查核缺陷影像有關並顯示之控制。Further, in the defect correction device of the present invention, the control unit corrects the image of the defect corrected by the defect correction unit to the image capturing unit, and reduces the correction of the image capturing unit to the display unit. After the image, the control related to the above-mentioned check defect image is displayed.
又,本發明之缺陷修正裝置,其中前述控制部,係對前述攝影部,攝影藉前述缺陷修正部進行修正之前述缺陷在修正前後的影像,同時對前述顯示部,縮小修正前與修正後的影像,再進行與前述查核缺陷影像有關並顯示之控制。Further, in the defect correction device of the present invention, the control unit detects the image before and after the correction of the defect corrected by the defect correction unit, and corrects the corrected portion and the corrected portion of the display unit. The image is then subjected to control related to the above-mentioned check defect image and displayed.
又,本發明之缺陷修正裝置,其中前述控制部,係自外部裝置取得在檢查程序檢查出之前述基板的檢查資料,並依據該檢查資料,選擇作為修正必要的查核對象之缺陷,再依據所選擇之查核對象的缺陷位置資訊,藉由前述攝影部攝影被選擇作為查核對象之各缺陷。Further, in the defect correction device of the present invention, the control unit acquires inspection data of the substrate inspected by the inspection program from the external device, and selects a defect to be checked as a correction based on the inspection data, and then according to the The defect position information of the selected object to be checked is selected as the defect of the object to be checked by the photographing of the photographing unit.
又,本發明之缺陷修正裝置,其中前述控制部,係依據前述查核資料的缺陷位置資訊,在前述缺陷修正部缺陷修正前,以攝影部攝影作為查核對象之全部缺陷,將該查 核檢查影像與業已縮小之縮小查核檢查影像儲存於記憶部,並藉由指定放大在前述顯示部縮小並一覽顯示之查核檢查影像,再自前述記憶部讀出前述縮小處理前的查核檢查影像並放大顯示。Further, in the defect correction device of the present invention, the control unit detects all defects of the object to be inspected by the imaging unit before the defect correction unit is corrected based on the defect position information of the check data. The nuclear inspection image and the reduced inspection image are stored in the memory unit, and the inspection image is reduced and displayed in the display portion by a specified enlargement, and the inspection image before the reduction processing is read from the memory portion. Zoom in to display.
藉由本發明,可減輕操作者的負擔,且可獲得有效率地修正缺陷之效果。According to the present invention, the burden on the operator can be reduced, and the effect of efficiently correcting the defect can be obtained.
第1圖係顯示本發明一實施型態之缺陷修正裝置構造之流程圖。Fig. 1 is a flow chart showing the construction of a defect correcting device according to an embodiment of the present invention.
第2圖係顯示本發明之缺陷修正裝置動作之流程圖。Fig. 2 is a flow chart showing the operation of the defect correcting device of the present invention.
第3圖係顯示本發明之缺陷修正裝置畫面所顯示之顯示例之參考圖。Fig. 3 is a view showing a display example of a display example displayed on the screen of the defect correction device of the present invention.
以下,參考圖示,說明用以實施本發明之最佳型態。第1圖係顯示本發明實施型態之缺陷修正裝置之流程圖。基板1係作為修正對象之FPD用玻璃基板及半導體晶圓基板等。平台2,包含有在用以支撐基板1的同時,可使基板1在相互正交的X方向及Y方向移動之二次元移動機構。照明光源3為缺陷觀察用光源。來自照明光源3的光,會透過透鏡12,藉分光器13反射,再透過對物物鏡14,照射至基板1。至少由該等照明光源3、物鏡12、分光器13、對物物鏡14,構成藉照明光源3與對物物鏡14放大檢視缺陷之查核檢查 部。Hereinafter, the best mode for carrying out the invention will be described with reference to the drawings. Fig. 1 is a flow chart showing a defect correcting device of an embodiment of the present invention. The substrate 1 is a glass substrate for FPD and a semiconductor wafer substrate to be corrected. The stage 2 includes a secondary moving mechanism that can move the substrate 1 in the X direction and the Y direction orthogonal to each other while supporting the substrate 1. The illumination light source 3 is a light source for defect observation. Light from the illumination source 3 is transmitted through the lens 12, reflected by the beam splitter 13, and transmitted through the objective lens 14 to the substrate 1. At least the illumination source 3, the objective lens 12, the beam splitter 13, and the objective objective lens 14 are configured to check the inspection defects by the illumination source 3 and the objective lens 14. unit.
雷射光源4,係輸出用以修正缺陷之雷射光。來自雷射光源4的雷射光會藉鏡8反射,並透過物鏡9及分光器11、13,再透過對物物鏡14照射至基板1上的缺陷。至少由該等雷射光源4、鏡8、光分器11、13、對物物鏡14,藉由雷射光源4與對物物鏡14,構成缺陷修正部。攝影機5係包含有例如CCD(Charge Coupled Device)等的攝影元件之攝影裝置,並生成依據被攝體(基板1)的光像之影像信號。來自基板1表面所反射之照明光源3的光,會透過對物物鏡14、分光器13、11及透鏡10,入射至攝影機5的受光面。The laser light source 4 outputs laser light for correcting defects. The laser light from the laser source 4 is reflected by the mirror 8, passes through the objective lens 9 and the beamsplitters 11, 13 and is then transmitted through the objective lens 14 to the defects on the substrate 1. At least the laser light source 4, the mirror 8, the optical splitters 11, 13 and the objective objective lens 14 constitute a defect correcting portion by the laser light source 4 and the objective objective lens 14. The camera 5 includes an imaging device such as a photographic element such as a CCD (Charge Coupled Device), and generates a video signal according to an optical image of the subject (substrate 1). The light from the illumination light source 3 reflected on the surface of the substrate 1 passes through the objective lens 14, the spectroscopes 13, 11 and the lens 10, and enters the light receiving surface of the camera 5.
控制裝置6具有可控制缺陷修正裝置整體的機能,並包含有:雷射控制部61、影像處理部62、平台控制部63、操作部64、主控制部65及記憶部66。又,控制裝置6雖未圖示,但包含有外部裝置(用以顯示例如位於修正程序前之上游側的檢查程序檢測出之檢查結果)及用以通訊之通訊介面等構造。The control device 6 has a function of controlling the entire defect correction device, and includes a laser control unit 61, an image processing unit 62, a platform control unit 63, an operation unit 64, a main control unit 65, and a memory unit 66. Further, although not shown, the control device 6 includes an external device (for displaying, for example, an inspection result detected by an inspection program on the upstream side before the correction program) and a communication interface for communication.
控制裝置6,其中雷射控制部61係藉由控制施加於雷射光源4之電壓等,進行雷射光源4的on‧off控制、及on時所輸出之雷射光的能量控制等。影像處理部62,藉由將自攝影機5所輸出之缺陷影像信號加以間隔等,生成業已縮小之縮圖影像資料。平台控制部63可控制平台2的驅動。The control device 6 is configured such that the laser control unit 61 controls the on‧off control of the laser light source 4 and the energy control of the laser light outputted at the time by controlling the voltage applied to the laser light source 4 or the like. The video processing unit 62 generates thumbnail image data that has been reduced by spacing the defective video signals output from the camera 5. The platform control section 63 can control the driving of the platform 2.
操作部64,包含藉操作者操作之鍵盤或滑鼠等,生成依據操作結果之信號。主控制部65,係進行用以控制包含上述構造之控制裝置6整體的演算或資料輸入/輸出控制 等。記憶部66為儲存各缺陷之檢查資料或縮圖影像資料等之半導體記憶體或硬碟機等。顯示器7為用以顯示縮圖影像及缺陷資料等之CRT(Cathode Ray Tube)顯示器或液晶顯示器等顯示裝置。The operation unit 64 includes a keyboard or a mouse operated by an operator to generate a signal according to the operation result. The main control unit 65 performs calculation or data input/output control for controlling the entire control device 6 including the above configuration. Wait. The memory unit 66 is a semiconductor memory or a hard disk drive that stores inspection data or thumbnail image data of each defect. The display 7 is a display device such as a CRT (Cathode Ray Tube) display or a liquid crystal display for displaying thumbnail images, defect data, and the like.
接著,說明本實施型態之缺陷修正裝置的動作。第2圖係用以顯示缺陷修正裝置的動作之流程圖。缺陷修正裝置的控制裝置6,透過未圖示之通訊迴路,自檢查資料伺服器,藉由修正程序,取得以上游側的檢查程序檢測出的基板整體的檢查資料(缺陷清單、缺陷資料),並儲存於記憶部66(步驟S201)。該檢查資料中,包含有:用以顯示缺陷位置之座標(位置資訊)、缺陷大小及缺陷種類之資料等。操作者操作操作部64指示查核檢查,則操作部64會對主控制部65輸出依據操作者指示之信號。主控制部65一旦檢測出該信號,則會對控制裝置6各部輸出動作指示。Next, the operation of the defect correction device of this embodiment will be described. Fig. 2 is a flow chart for showing the operation of the defect correcting device. The control device 6 of the defect correction device acquires the inspection data (defect list, defect data) of the entire substrate detected by the upstream inspection program by the correction program from the inspection data server through a communication circuit (not shown). And stored in the memory unit 66 (step S201). The inspection data includes: coordinates (position information) for displaying the position of the defect, information on the size of the defect, and the type of the defect. When the operator operates the operation unit 64 to instruct the check check, the operation unit 64 outputs a signal in accordance with the operator's instruction to the main control unit 65. When the main control unit 65 detects the signal, it outputs an operation instruction to each unit of the control device 6.
主控制部65是從記憶部66讀出基板1的檢查資料,再依據缺陷的大小及位置等資料,分類成不需修正之擬似缺陷與必須修正之真正缺陷,並從藉檢查資料所顯示之缺陷中,選擇作為必須修正的查核對象之缺陷。主控制部65,可將所選擇的缺陷其中1個缺陷座標通知平台控制部63,同時指示平台2的移動。接收指示之平台控制部63會驅動平台2,再依據業已通知之缺陷座標,控制移動量。平台2,可將基板1移動至所選擇之缺陷進入對物物鏡14的視野領域的位置(步驟S202)。The main control unit 65 reads the inspection data of the substrate 1 from the storage unit 66, and classifies the pseudo-defects and the real defects that must be corrected without correction according to the size and position of the defects, and displays them from the inspection materials. Among the defects, the defect is selected as the object to be corrected. The main control unit 65 can notify the platform control unit 63 of one of the selected defects and simultaneously instruct the movement of the platform 2. The platform control unit 63 that receives the instruction drives the platform 2, and controls the amount of movement based on the defective coordinates that have been notified. The platform 2 can move the substrate 1 to a position where the selected defect enters the field of view of the objective lens 14 (step S202).
來自照明光源3的光可藉基板1反射,並如前所述,入 射至攝影機5的受光面。攝影機5,係攝影以對物物鏡14放大至預定倍率之缺陷,生成該查核檢查影像信號,再輸出至控制裝置6。輸入至控制裝置6之查核檢查影像會輸入至影像處理部62。影像處理部62,係依據查核檢查影像信號生成縮圖影像資料,再輸出至主控制部65。主控制部65使查核檢查影像之縮圖影像資料與缺陷資料相關並儲存於記憶部66(步驟S203)。Light from the illumination source 3 can be reflected by the substrate 1, and as described above, The light is incident on the light receiving surface of the camera 5. The camera 5 is configured to capture the defect of the objective lens 14 to a predetermined magnification, generate the check image signal, and output it to the control device 6. The check inspection image input to the control device 6 is input to the image processing unit 62. The video processing unit 62 generates thumbnail image data based on the check image signal, and outputs the thumbnail image data to the main control unit 65. The main control unit 65 correlates the thumbnail image data of the check inspection image with the defect data and stores it in the storage unit 66 (step S203).
接著,主控制部65判定是否有尚未進行上述影像保存之查核對象缺陷(步驟S204)。若仍殘存有查核對象缺陷時,處理會回到步驟S202,並反覆進行上述處理。另一方面,在選擇作為查核對象之全缺陷的縮圖影像資料已保存於記憶部66的情形下,結束核查動作,處理會前進至下一個步驟S205。如上所述,依據在前檢查程序檢測出之查核對象缺陷之位置資訊,攝影全部缺陷,且自動地進行用以保存查核檢查對象之查核動作。Next, the main control unit 65 determines whether or not there is a check target defect in which the above-described video storage has not been performed (step S204). If the check object defect remains, the process returns to step S202 and the above process is repeated. On the other hand, when the thumbnail image data for selecting the full defect as the object to be checked has been stored in the storage unit 66, the verification operation is ended, and the process proceeds to the next step S205. As described above, all the defects are photographed based on the position information of the check object defect detected by the previous inspection program, and the check operation for storing the check object is automatically performed.
在修正開始指示出現的情形下,主控制部65,會從記憶部66讀出全部查核對象缺陷之縮圖影像資料(或者,亦可為一部分縮圖影像資料),再輸出至顯示器7。顯示器7,係依據所輸入之縮圖影像資料,例如第3圖所示,以一覽形式顯示(步驟S205)各缺陷的查核檢查影像308,以作為縮小影像之縮圖影像。操作者可以目視確認前述一覽顯示之查核檢查影像的縮圖影像,並在操作操作部64滑鼠的同時,在顯示作為修正對象缺陷之查核檢查影像移動並選擇游標300。此時,操作者可從查核檢查影像,選擇必須修正的複 數缺陷。操作部64,係使依據操作者操作之信號輸出至主控制部65。主控制部65可依據該信號,選擇修正對象的缺陷(步驟S206)。When the correction start instruction occurs, the main control unit 65 reads out the thumbnail image data of all the target defects (or a part of the thumbnail image data) from the storage unit 66, and outputs the thumbnail image data to the display 7. The display 7, based on the input thumbnail image data, for example, as shown in FIG. 3, displays (step S205) the check image 308 of each defect as a thumbnail image of the reduced image. The operator can visually confirm the thumbnail image of the check inspection image displayed in the list, and while the operation operation unit 64 is squeaking, display the check image movement as the correction target defect and select the cursor 300. At this point, the operator can check the image from the check and select the complex that must be corrected. Number of defects. The operation unit 64 outputs a signal according to the operator's operation to the main control unit 65. The main control unit 65 can select a defect to be corrected based on the signal (step S206).
接著,主控制部65,係在將所選擇缺陷的其中1個缺陷座標通知平台控制部63的同時,指示平台2的移動。接收指示之平台控制部63會驅動平台2,並依據業已通知之缺陷座標,控制移動量。平台2,將基板1移動至所選擇的缺陷進入對物物鏡14的視野領域之位置(步驟S207)。接著,主控制部65,會將相對缺陷之雷射照射位置、形狀指示於雷射控制部61。接收指示之雷射控制部61,可控制雷射光源4所形成之雷射輸出。來自雷射光源4的雷射光,會照射在基板1的缺陷上,進行預定的缺陷修正(步驟S208)。Next, the main control unit 65 notifies the platform control unit 63 of one of the defective coordinates of the selected defect, and instructs the movement of the stage 2. The platform control unit 63 that receives the instruction drives the platform 2 and controls the amount of movement based on the defective coordinates that have been notified. The platform 2 moves the substrate 1 to a position where the selected defect enters the field of view of the objective lens 14 (step S207). Next, the main control unit 65 indicates the laser irradiation position and shape of the relative defect to the laser control unit 61. The laser control unit 61 that receives the instruction can control the laser output formed by the laser light source 4. The laser light from the laser light source 4 is irradiated onto the defect of the substrate 1 to perform predetermined defect correction (step S208).
接著,主控制部65,係用以判定是否有尚未進行上述缺陷修正之修正對象的缺陷(步驟S209)。仍殘存有修正對象缺陷的情形下,處理會回到步驟S207,並反覆進行上述處理。另一方面,相對於作為修正對象所選擇之全缺陷之雷射光照射結束時,一連串的動作會結束。Next, the main control unit 65 determines whether or not there is a defect to be corrected by the defect correction (step S209). In the case where the correction target defect remains, the process returns to step S207 and the above processing is repeated. On the other hand, when the laser light irradiation with respect to the full defect selected as the correction target is completed, a series of operations ends.
如前所述,習知係以顯微鏡1個1個查核各缺陷,由於每次都需進行缺陷修正必要性的判斷,操作者經常在缺陷修正裝置前進行該作業,因而操作者的負擔會增加。相對於此,藉由本實施型態,依據在上游側的檢查裝置檢測出之各缺陷座標資料,自動進行各缺陷的查核動作,並以該查核動作攝影之缺陷的縮圖影像於顯示器7上一覽顯示,由於操作者可依據該顯示,一次選擇修正對象的缺陷,故可 減輕操作者操作的負擔。As described above, it is conventional to check each defect by one microscope, and since it is necessary to judge the necessity of defect correction every time, the operator often performs the operation before the defect correction device, and thus the burden on the operator increases. . On the other hand, according to the present embodiment, the check operation of each defect is automatically performed based on the respective defective coordinate data detected by the upstream inspection device, and the thumbnail image of the defect captured by the check operation is displayed on the display 7. Display, because the operator can select the defect of the correction object at one time according to the display, so Reduce the burden on the operator's operation.
又,依據缺陷修正裝置在前檢查程序檢測出之缺陷座標資料,自動查核缺陷並進行攝影時,由於操作者不需站在缺陷修正裝置前,可在查核動作期間操作其他裝置,且可有效率地進行作業。當然,由於操作者1人也可操作複數台缺陷修正裝置,故可有效率地進行缺陷修正。Moreover, according to the defect coordinate data detected by the defect correction device in the pre-inspection program, when the defect is automatically checked and photographed, the operator can operate other devices during the checking operation because the operator does not need to stand in front of the defect correction device, and can be efficient. Work on the ground. Of course, since the operator can operate the plurality of defect correction devices, the defect correction can be performed efficiently.
又,藉由於顯示器7一覽顯示以查核攝影之各缺陷縮圖影像,操作者可在視覺上掌握缺陷數、缺陷的樣子及傾向等。在製造程序中,希望可縮短缺陷修正所需的時間(修正處理時間),如上所述,操作者可藉由掌握缺陷數、缺陷的樣子及傾向等,考慮修正處理時間來有效率地選擇修正對象的缺陷。例如,必須將修正處理時間縮短到最短時間的情形下,操作者可僅選擇必要最低限、之後的製造程序中會成為問題點之重要缺陷,又,在時間充裕的情形下,亦可也選擇重要缺陷以外的缺陷。Further, the operator can visually grasp the number of defects, the appearance of the defect, the tendency, and the like by the display of the display 7 in a list to check the thumbnail images of each of the defects. In the manufacturing process, it is desirable to shorten the time required for the defect correction (correction processing time). As described above, the operator can efficiently select the correction by considering the correction processing time by grasping the number of defects, the appearance of the defect, and the tendency. The defect of the object. For example, in the case where the correction processing time must be shortened to the shortest time, the operator can select only the necessary minimum limit, and the subsequent manufacturing process becomes an important defect of the problem point, and in the case of ample time, it is also possible to select Defects other than important defects.
另,步驟S208中,亦可生成以攝影機5,將照射雷射光並修正缺陷前後之基板1進行攝影之修正前影像與修正後影像的縮圖影像。此情形下,雷射控制部61,係將雷射光源4的雷射輸出設定成off。攝影機5會攝影雷射照射前後的基板1表面,並生成影像信號,再輸出至控制裝置6。控制裝置6的影像處理部62,係依據影像信號生成缺陷前後的縮圖影像資料,再輸出至主控制部65。主控制部65,係將其縮圖影像資料儲存於記憶部66,作為與雷射照射前縮圖影像資料相關之雷射照射後的縮圖影像資料。Further, in step S208, a thumbnail image of the pre-corrected image and the corrected image which are irradiated with the laser light and corrected for the substrate 1 before and after the defect may be generated by the camera 5. In this case, the laser control unit 61 sets the laser output of the laser light source 4 to off. The camera 5 photographs the surface of the substrate 1 before and after the laser irradiation, generates a video signal, and outputs it to the control device 6. The video processing unit 62 of the control device 6 generates thumbnail image data before and after the defect based on the video signal, and outputs the thumbnail image data to the main control unit 65. The main control unit 65 stores the thumbnail image data in the storage unit 66 as the thumbnail image data after the laser irradiation related to the laser image data before the laser irradiation.
主控制部65,係在例如對修正對象的全缺陷照射雷射光後,從記憶部66讀出照射雷射光後的縮圖影像資料,再輸出顯示器7。顯示器7,係依據該縮圖影像資料,將修正後影像後的縮圖影像310,且如第3圖所示,以一覽形式與修正前影像的縮圖影像312一起顯示。藉此,操作者可目視修正後影像,並確認是否已正確修正。在有必須再度修正的缺陷的情形下,亦可將該缺陷再登錄為修正對象,並再度反覆進行前述處理。The main control unit 65, for example, irradiates the laser beam with the full-defect correction target, and then reads out the thumbnail image data irradiated with the laser light from the storage unit 66, and outputs the thumbnail image data. The display 7 displays the thumbnail image 310 after the corrected image according to the thumbnail image data, and as shown in FIG. 3, is displayed in a list with the thumbnail image 312 of the corrected image. Thereby, the operator can visually correct the corrected image and confirm whether it has been correctly corrected. In the case where there is a defect that must be corrected again, the defect may be re-registered as the correction target, and the above processing is repeated again.
接著,說明顯示於顯示器7之畫面例。第3圖係表示顯示畫面之一例。修復開始按鈕301,係用以輸入對所選擇缺陷之雷射修正開始的按鈕。操作者可例如操作滑鼠,使游標300與修復開始按鈕301合併,點擊滑鼠,即開始第2圖中步驟S206以後的處理。修復中斷按鈕302,係用以輸入雷射修正中斷之按鈕。與上述相同,當操作者使游標300對準修復中斷按鈕302並點擊滑鼠後,即中斷雷射光的照射。Next, an example of a screen displayed on the display 7 will be described. Fig. 3 is a view showing an example of a display screen. The repair start button 301 is for inputting a button for starting the laser correction of the selected defect. The operator can, for example, operate the mouse, merge the cursor 300 with the repair start button 301, and click the mouse to start the processing from step S206 onward in FIG. The repair interrupt button 302 is a button for inputting a laser correction interrupt. As described above, when the operator aligns the cursor 300 with the repair interrupt button 302 and clicks the mouse, the illumination of the laser light is interrupted.
追加按鈕303,係用以將修正對象的缺陷登錄(追加)於缺陷修正裝置之按鈕。選擇刪除按鈕304,係從作為修正對象的缺陷登錄於缺陷修正裝置之缺陷中,解除任意缺陷的登錄之按鈕。全刪除按鈕305與選擇刪除按鈕304具有相同機能,係用以解除作為修正對象的缺陷登錄於缺陷修正裝置之全缺陷登錄之按鈕。結束按鈕306係用以結束全動作之按鈕。The additional button 303 is a button for registering (adding) a defect to be corrected to the defect correction device. When the delete button 304 is selected, the button for registering an arbitrary defect is released from the defect of the defect correction device from the defect to be corrected. The full delete button 305 has the same function as the selection delete button 304, and is a button for canceling the full defect registration of the defect correction device by the defect to be corrected. The end button 306 is a button for ending the full action.
查核檢查影像欄307,係在查核動作時藉由攝影機5,顯示業已攝影處理對象的缺陷之查核檢查影像之領域。第3 圖中,一覽顯示業已縮小查核檢查影像之縮圖影像308a~308e。操作者操作缺陷選擇部之滑鼠,使游標300對準縮圖影像308a~308e之任一者並點選滑鼠,且使游標300對準追加按鈕303,再點擊滑鼠,使已指定之查核檢查影像308c所顯示之修正對象的缺陷登錄於缺陷修正裝置,再以顏色及粗線等強調表示已登錄之縮圖影像的框。第3圖中,登錄框以粗線強調表示之縮圖影像308a、308c及308d,作為修正對象。The check image field 307 is used to check the field of the image of the defect that has been photographed by the camera 5 during the check operation. Third In the figure, a thumbnail image 308a to 308e in which the inspection image has been reduced is displayed in a list. The operator operates the mouse of the defect selection unit to align the cursor 300 with any of the thumbnail images 308a to 308e and clicks the mouse, and causes the cursor 300 to be aligned with the additional button 303, and then clicks the mouse to make the specified The defect of the correction target displayed by the inspection inspection image 308c is registered in the defect correction device, and the frame indicating the registered thumbnail image is highlighted with a color and a thick line. In Fig. 3, the registration frame is highlighted by thick lines, and thumbnail images 308a, 308c, and 308d are highlighted.
點擊修復開始按鈕301時,對於顯示成以查核檢查影像欄307選擇之縮圖影像之缺陷,進行缺陷修正。在選擇查核檢查影像308a~308e之際,操作者亦可藉由使游標300對準在顯示器7一覽顯示之查核檢查影像的縮圖影像並點擊滑鼠,選擇1個查核檢查影像,且操作者亦可拖曳滑鼠來選擇複數查核檢查影像。When the repair start button 301 is clicked, the defect correction is performed on the defect displayed as the thumbnail image selected by the check image field 307. When the check images 308a to 308e are selected, the operator can also select one check image by aligning the cursor 300 with the thumbnail image of the check image displayed on the display of the display 7 and click the mouse, and the operator You can also drag the mouse to select multiple check images.
修正前影像欄309,係在對作為修正對象登錄之缺陷照射雷射光前,將以攝影機5攝影之缺陷修正前的縮圖影像與查核檢查影像308對應顯示之領域。第3圖中,顯示與縮圖影像308a、308c及308d對應之縮圖310a、310c及310d。修正後影像欄311,係使作為修正對象登錄之缺陷在修正後(照射雷射光後)的縮圖影像與查核檢查影像或修正前影像對應顯示之領域。第3圖中,顯示與縮圖310a、310c及310d對應之修正後的縮圖312a、312c及312d。The pre-correction image field 309 is a field in which the thumbnail image before the defect correction by the camera 5 is displayed in correspondence with the check image 308 before the laser light to be registered as the correction target is irradiated with the laser beam. In Fig. 3, thumbnails 310a, 310c, and 310d corresponding to thumbnail images 308a, 308c, and 308d are displayed. The corrected image field 311 is a field in which the thumbnail image registered as the correction target is displayed corresponding to the thumbnail image after the correction (after irradiating the laser light) and the image to be checked or corrected. In Fig. 3, corrected thumbnails 312a, 312c, and 312d corresponding to thumbnails 310a, 310c, and 310d are displayed.
缺陷列表欄313,係顯示與顯示於查核檢查影像欄307之各縮圖對應之缺陷資料(座標或大小等)領域。對應於作為 修正對象登錄之縮圖之缺陷資料,可以不同顏色表示對應於例如未登錄的縮圖之缺陷資料。The defect list column 313 displays fields of defect data (coordinates, sizes, etc.) corresponding to the respective thumbnails displayed in the check image field 307. Corresponding to The defect data of the thumbnail of the object registration is corrected, and the defect data corresponding to, for example, the unregistered thumbnail image can be expressed in different colors.
另,縮圖影像中的缺陷縮小至難以看見時,操作者亦可使游標300對準查核檢查影像欄307上任意縮圖影像,並雙點擊等指定放大,即可從記憶部66讀出與該縮圖對應之縮小處理前的查核檢查影像。或者,操作者亦可使游標300對準查核檢查影像欄307上的縮圖,並雙點擊,即可以攝影機5再度攝影顯示於該縮圖影像之缺陷,來顯示缺陷之查核檢查影像。In addition, when the defect in the thumbnail image is reduced to be difficult to see, the operator can also align the cursor 300 with any thumbnail image on the check image field 307, and double-click or the like to specify the enlargement, and can read out from the memory unit 66. The thumbnail map corresponds to the check image before the reduction processing. Alternatively, the operator can also align the cursor 300 with the thumbnail image on the check image field 307, and double click, that is, the camera 5 can again display the defect of the thumbnail image to display the defect check image.
再度顯示缺陷影像時,主控制部65係檢測出自操作部64輸出之信號,並依據該信號,判斷哪個缺陷已被選為再度攝影對象。主控制部65依據儲存於記憶部66之檢查資料,識別該缺陷的座標,並將該座標通知平台控制部63,同時指示平台2的移動。接收指示之平台控制部63會驅動平台2,並依據已通知之缺陷座標,控制移動量。平台2會將基板1移動至所選擇之缺陷進入對物物鏡14的視野領域的位置。When the defective image is displayed again, the main control unit 65 detects the signal output from the operation unit 64, and based on the signal, determines which defect has been selected as the re-imaging target. The main control unit 65 identifies the coordinates of the defect based on the inspection data stored in the storage unit 66, and notifies the platform control unit 63 of the coordinates, and simultaneously instructs the movement of the platform 2. The platform control unit 63 that receives the instruction drives the platform 2 and controls the amount of movement based on the notified defective coordinates. The platform 2 moves the substrate 1 to a position where the selected defect enters the field of view of the objective lens 14.
攝影機5,係攝影基板1表面、生成影像訊號後,再輸出至控制裝置6。控制裝置6的影像處理部62,會將依據影像信號之影像資料輸出至主控制部65。主控制部65將該影像資料輸出至顯示器7。顯示器7會依據該影像資料,顯示基板1的表面影像。藉此,操作者可再度確認最新攝影之查核檢查影像內的缺陷。The camera 5 is a surface of the photographic substrate 1 and generates an image signal, and is then output to the control device 6. The image processing unit 62 of the control device 6 outputs the image data based on the image signal to the main control unit 65. The main control unit 65 outputs the image data to the display 7. The display 7 displays the surface image of the substrate 1 based on the image data. Thereby, the operator can reconfirm the defects in the latest inspection image of the inspection.
以上,已參考圖式詳細敘述本發明的實施型態,但具 體構造不限於該等實施型態,亦包含不脫離本發明要旨之範圍的設計變更等。例如,在上述實施型態中,雖設定使支撐基板1之平台2移動,但亦可使具有對物物鏡14之光學系統在基板1上進行XY方向移動,亦可使具有平台2與對物物鏡14之檢查頭部在X方向與Y方向分別朝單軸方向相對移動。又,對物物鏡14,亦可以與基板1觀察用及雷射照射用相同倍率,亦可為不同倍率。又,亦可一起記錄藉由攝影機5攝影之縮小前的原影像資料與縮圖影像資料。Hereinabove, the embodiment of the present invention has been described in detail with reference to the drawings, but with The body structure is not limited to the embodiments, and design changes and the like are also included without departing from the scope of the invention. For example, in the above embodiment, although the stage 2 of the support substrate 1 is set to move, the optical system having the objective lens 14 may be moved in the XY direction on the substrate 1, or the stage 2 and the object may be provided. The inspection head of the objective lens 14 relatively moves in the uniaxial direction in the X direction and the Y direction, respectively. Further, the objective lens 14 may have the same magnification as that for the substrate 1 for observation and laser irradiation, or may have different magnifications. Moreover, the original image data and the thumbnail image data before the reduction by the camera 5 can also be recorded together.
1‧‧‧基板1‧‧‧Substrate
2‧‧‧平台2‧‧‧ platform
3‧‧‧照明光源3‧‧‧Light source
4‧‧‧雷射光源4‧‧‧Laser light source
5‧‧‧攝影機5‧‧‧ camera
6‧‧‧控制裝置6‧‧‧Control device
61‧‧‧雷射控制部61‧‧‧Laser Control Department
62‧‧‧影像處理部62‧‧‧Image Processing Department
63‧‧‧平台控制部63‧‧‧ Platform Control Department
64‧‧‧操作部64‧‧‧Operation Department
65‧‧‧主控制部65‧‧‧Main Control Department
66‧‧‧記憶部66‧‧‧Memory Department
7‧‧‧顯示器7‧‧‧ display
8‧‧‧鏡8‧‧ ‧ mirror
9‧‧‧物鏡9‧‧‧ Objective lens
10、12‧‧‧透鏡10,12‧‧ lens
11、13‧‧‧分光器11, 13‧‧ ‧ splitter
14‧‧‧對物物鏡14‧‧‧object objective
300‧‧‧游標300‧‧‧ cursor
301‧‧‧修復開始301‧‧‧Repair begins
302‧‧‧中斷按鈕302‧‧‧ interrupt button
303‧‧‧追加按鈕303‧‧‧Add button
304‧‧‧選擇刪除按鈕304‧‧‧Select delete button
305‧‧‧全刪除按鈕305‧‧‧Delete button
306‧‧‧結束按鈕306‧‧‧End button
307‧‧‧查核檢查影像欄307‧‧Check the image field
308‧‧‧查核檢查影像308‧‧Check the inspection image
308a~308e‧‧‧縮圖影像308a~308e‧‧‧ thumbnail image
309‧‧‧修正前影像欄309‧‧‧Revised image bar
310‧‧‧縮圖影像310‧‧‧ thumbnail image
310a、310c、310d、312a、312c、 312d‧‧‧縮圖310a, 310c, 310d, 312a, 312c, 312d‧‧‧ thumbnail
311‧‧‧修正後影像欄311‧‧‧Fixed image bar
313‧‧‧缺陷列表欄313‧‧‧Defect list column
第1圖係顯示本發明一實施型態之缺陷修正裝置構造之流程圖。Fig. 1 is a flow chart showing the construction of a defect correcting device according to an embodiment of the present invention.
第2圖係顯示本發明之缺陷修正裝置動作之流程圖。Fig. 2 is a flow chart showing the operation of the defect correcting device of the present invention.
第3圖係顯示本發明之缺陷修正裝置畫面所顯示之顯示例之參考圖。Fig. 3 is a view showing a display example of a display example displayed on the screen of the defect correction device of the present invention.
1‧‧‧基板1‧‧‧Substrate
2‧‧‧平台2‧‧‧ platform
3‧‧‧照明光源3‧‧‧Light source
4‧‧‧雷射光源4‧‧‧Laser light source
5‧‧‧攝影機5‧‧‧ camera
6‧‧‧控制裝置6‧‧‧Control device
7‧‧‧顯示器7‧‧‧ display
8‧‧‧鏡8‧‧ ‧ mirror
9‧‧‧物鏡9‧‧‧ Objective lens
10、12‧‧‧透鏡10,12‧‧ lens
11、13‧‧‧分光器11, 13‧‧ ‧ splitter
14‧‧‧對物物鏡14‧‧‧object objective
61‧‧‧雷射控制部61‧‧‧Laser Control Department
62‧‧‧影像處理部62‧‧‧Image Processing Department
63‧‧‧平台控制部63‧‧‧ Platform Control Department
64‧‧‧操作部64‧‧‧Operation Department
65‧‧‧主控制部65‧‧‧Main Control Department
66‧‧‧記憶部66‧‧‧Memory Department
Claims (11)
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| CN (1) | CN101101857B (en) |
| TW (1) | TWI408358B (en) |
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| JP5495875B2 (en) * | 2010-03-18 | 2014-05-21 | オリンパス株式会社 | Laser processing method and laser processing apparatus |
| CN105127420A (en) * | 2015-05-04 | 2015-12-09 | 航星利华(北京)科技有限公司 | Method for repairing metal parts through diffuse printing lasers |
| US10831177B2 (en) * | 2017-06-23 | 2020-11-10 | General Electric Company | Systems and methods for automated welding |
| CN108672943A (en) * | 2018-07-18 | 2018-10-19 | 大族激光科技产业集团股份有限公司 | A kind of method of laser repairing shell defect |
| CN109848545B (en) * | 2019-01-08 | 2021-06-22 | 北京科迈启元科技有限公司 | Laser processing method integrating object abnormal region identification and thermal action |
| JP7281942B2 (en) * | 2019-03-29 | 2023-05-26 | Juki株式会社 | Inspection device and inspection method |
| CN116930207B (en) * | 2023-07-24 | 2024-04-12 | 上海感图网络科技有限公司 | Display method for synchronously enlarging the visual field of display area and real-time area |
| CN117011258B (en) * | 2023-07-31 | 2025-10-17 | 上海感图网络科技有限公司 | Circuit board defect image verification display method, device, equipment and storage medium |
| CN116967615B (en) * | 2023-07-31 | 2024-04-12 | 上海感图网络科技有限公司 | Circuit board reinspection marking method, device, equipment and storage medium |
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| JP2002042640A (en) * | 2000-07-27 | 2002-02-08 | Mitsubishi Electric Corp | Rib for plasma display panel substrate, manufacturing method thereof, plasma display panel substrate, plasma display panel, plasma display device, and photosensitive resist paste material |
| US20060133661A1 (en) * | 2004-12-17 | 2006-06-22 | Hitachi High-Technologies Corporation | Pattern inspection apparatus |
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| US5982920A (en) * | 1997-01-08 | 1999-11-09 | Lockheed Martin Energy Research Corp. Oak Ridge National Laboratory | Automated defect spatial signature analysis for semiconductor manufacturing process |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2002042640A (en) * | 2000-07-27 | 2002-02-08 | Mitsubishi Electric Corp | Rib for plasma display panel substrate, manufacturing method thereof, plasma display panel substrate, plasma display panel, plasma display device, and photosensitive resist paste material |
| US20060133661A1 (en) * | 2004-12-17 | 2006-06-22 | Hitachi High-Technologies Corporation | Pattern inspection apparatus |
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| CN101101857B (en) | 2012-05-09 |
| CN101101857A (en) | 2008-01-09 |
| KR20080003718A (en) | 2008-01-08 |
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