TWI403678B - Optical module and lightemitting diode lamp - Google Patents
Optical module and lightemitting diode lamp Download PDFInfo
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- TWI403678B TWI403678B TW100116168A TW100116168A TWI403678B TW I403678 B TWI403678 B TW I403678B TW 100116168 A TW100116168 A TW 100116168A TW 100116168 A TW100116168 A TW 100116168A TW I403678 B TWI403678 B TW I403678B
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- 230000003287 optical effect Effects 0.000 title claims abstract description 10
- 239000000463 material Substances 0.000 claims description 17
- 238000002310 reflectometry Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 210000004508 polar body Anatomy 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
Abstract
Description
本發明是有關於一種光機模組及燈具，且特別是有關於一種可提升流明數的光機模組及發光二極體燈具。The invention relates to a optomechanical module and a luminaire, and in particular to a optomechanical module and a illuminating diode illuminator capable of improving the lumen number.
發光二極體(Light-Emitting Diode)屬於半導體元件，其發光晶片之材料主要使用Ⅲ-Ⅴ族化學元素之化合物，例如磷化鎵(GaP)或砷化鎵(GaAs)，而其發光原理是將電能轉換為光能。詳細而言，發光二極體藉由對化合物半導體施加電流，以透過電子與電洞的結合將過剩的能量以光的形式釋出。由於發光二極體的發光現象不是藉由加熱發光或放電發光，因此發光二極體的壽命長達十萬小時以上。此外，發光二極體更具有反應速度快、體積小、省電、低污染、高可靠度、適合量產等優點，所以發光二極體應用的領域十分廣泛，如大型看板、交通號誌燈、手機、掃描器、傳真機之光源以及發光二極體燈具等。Light-Emitting Diode is a semiconductor component, and the material of the light-emitting chip mainly uses a compound of a group III-V chemical element, such as gallium phosphide (GaP) or gallium arsenide (GaAs), and the principle of light emission is Convert electrical energy into light energy. In detail, the light-emitting diode releases excess energy in the form of light by applying a current to the compound semiconductor to transmit a combination of electrons and holes. Since the luminescence phenomenon of the illuminating diode does not illuminate by heating or discharging, the life of the illuminating diode is as long as 100,000 hours or more. In addition, the light-emitting diode has the advantages of fast response speed, small volume, power saving, low pollution, high reliability, and suitable for mass production, so the application field of the light-emitting diode is very wide, such as a large billboard, traffic light , light sources for mobile phones, scanners, fax machines, and light-emitting diode lamps.
然而，在目前的發光二極體燈具的設計中，設置於其內的發光二極體所發出的光，可以透過透鏡加以聚集以使光線集中於特定的範圍，但是仍然有些光損失，導致於光的利用率仍然有限，因此目前無不亟思於如何有效地提升發光二極體的亮度。However, in the current design of the light-emitting diode lamp, the light emitted by the light-emitting diode disposed therein can be concentrated through the lens to concentrate the light in a specific range, but there is still some light loss, resulting in The utilization of light is still limited, so there is no doubt about how to effectively improve the brightness of the light-emitting diode.
本發明提供一種可提升流明數的光機模組。The invention provides an optomechanical module capable of increasing the lumen number.
本發明提供一種可提升整體亮度的發光二極體燈具。The invention provides a light-emitting diode lamp which can improve the overall brightness.
為達上述或是其他目的，本發明提出一種光機模組，包括一主體、一發光二極體板、一光杯以及一透鏡，其中主體具有一容置槽，而發光二極體板配置於容置槽內。此發光二極體板包括一電路板以及多個發光二極體，其中發光二極體設置於電路板上。光杯配置於容置槽內，並位於發光二極體板上，其中光杯具有多個開孔，且發光二極體對應穿過開孔以暴露於光杯內，而透鏡配置於光杯。To achieve the above or other objects, the present invention provides a optomechanical module comprising a main body, a light emitting diode plate, a light cup and a lens, wherein the main body has a receiving groove, and the light emitting diode plate is configured. Placed in the slot. The LED board includes a circuit board and a plurality of light emitting diodes, wherein the light emitting diodes are disposed on the circuit board. The light cup is disposed in the accommodating groove and is located on the light emitting diode board, wherein the light cup has a plurality of openings, and the light emitting diodes are correspondingly passed through the opening to be exposed in the light cup, and the lens is disposed in the light cup .
在本發明之光機模組的一實施例中，上述之光杯包括一底部以及一側壁，其中開孔位於底部，而側壁環繞底部，且側壁承靠於主體之容置槽的一槽壁。底部及側壁可一體成型為光杯。In an embodiment of the optomechanical module of the present invention, the light cup comprises a bottom portion and a side wall, wherein the opening is located at the bottom, and the side wall surrounds the bottom portion, and the side wall bears against a groove wall of the accommodating groove of the main body. . The bottom and the side walls can be integrally formed into a light cup.
在本發明之光機模組的一實施例中，上述之光杯的材料為高反射率塑膠材料。In an embodiment of the optomechanical module of the present invention, the material of the light cup is a high reflectivity plastic material.
在本發明之光機模組的一實施例中，上述之光杯的底部及側壁的內表面可塗佈有一高反射率材料層或金屬層。In an embodiment of the optomechanical module of the present invention, the bottom surface of the light cup and the inner surface of the side wall may be coated with a layer of high reflectivity material or a metal layer.
為達上述或是其他目的，本發明另提出一種發光二極體燈具，包括一燈座、一光機模組以及一固定扣環。燈座具有一第一容置槽，而光機模組配置於第一容置槽內。光機模組包括一主體、一發光二極體板、一光杯以及一透鏡，其中主體具有一第二容置槽，而發光二極體板配置於第二容置槽內。此發光二極體板包括一電路板以及多個發光二極體，其中發光二極體設置於電路板上。光杯配置於第二容置槽內，並位於發光二極體板上，其中光杯具有多個開孔，且發光二極體對應穿過開孔以暴露於光杯內，而透鏡配置於光杯。固定扣環扣合於燈座，以將光機模組固定於燈座內。To achieve the above or other purposes, the present invention further provides a light-emitting diode lamp comprising a lamp holder, a light machine module and a fixed buckle. The lamp holder has a first receiving groove, and the light machine module is disposed in the first receiving groove. The optomechanical module includes a main body, a illuminating diode plate, a light cup and a lens, wherein the main body has a second accommodating groove, and the illuminating diode plate is disposed in the second accommodating groove. The LED board includes a circuit board and a plurality of light emitting diodes, wherein the light emitting diodes are disposed on the circuit board. The light cup is disposed in the second receiving groove and is located on the light emitting diode plate, wherein the light cup has a plurality of openings, and the light emitting diodes are correspondingly passed through the opening to be exposed in the light cup, and the lens is disposed on the light cup Light cup. The fixing buckle is fastened to the lamp holder to fix the optomechanical module in the lamp holder.
在本發明之發光二極體燈具的一實施例中，上述之光杯包括一底部以及一側壁，其中開孔位於底部，而側壁環繞底部，且側壁承靠於主體之容置槽的一槽壁。底部及側壁可一體成型為光杯。In an embodiment of the light-emitting diode lamp of the present invention, the light cup comprises a bottom portion and a side wall, wherein the opening is located at the bottom, and the side wall surrounds the bottom portion, and the side wall bears against a groove of the receiving groove of the main body. wall. The bottom and the side walls can be integrally formed into a light cup.
在本發明之發光二極體燈具的一實施例中，上述之光杯的材料為高反射率塑膠材料。In an embodiment of the light-emitting diode lamp of the present invention, the material of the light cup is a high reflectivity plastic material.
在本發明之發光二極體燈具的一實施例中，上述之光杯的底部及側壁的內表面塗佈有一高反射率材料層或金屬層。In an embodiment of the light-emitting diode lamp of the present invention, the inner surface of the bottom and side walls of the light cup are coated with a high-reflectivity material layer or a metal layer.
基於上述，於本發明的光機模組及使用此光機模組的發光二極體燈具中，光杯的使用可以將透鏡無法收集到發光二極體發出的光再次的收集並作導正，以增加光機模組及使用此光機模組的發光二極體燈具的發光流明數。Based on the above, in the optomechanical module of the present invention and the illuminating diode lamp using the illuminating module, the use of the optical cup can collect the light emitted by the illuminating diode and collect it again. In order to increase the luminous lumen of the optomechanical module and the illuminating diode lamp using the illuminating module.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1為本發明一實施例之光機模組的分解示意圖、圖2為圖1之光機模組組裝在一起的剖面圖，而圖3為使用圖1之光機模組的發光二極體燈具的分解示意圖。請同時參考圖1、圖2及圖3，發光二極體燈具200包括一燈座210、一光機模組100以及一固定扣環220。燈座210具有一第一容置槽212，而光機模組100配置於第一容置槽212內。光機模組100包括一主體110、一發光二極體板120、一光杯130以及一透鏡140，其中主體110具有一第二容置槽112，而發光二極體板120配置於第二容置槽112內。此發光二極體板120包括一電路板122以及多個發光二極體124，其中發光二極體124設置於電路板122上。光杯130配置於第二容置槽112內，並位於發光二極體板120上，其中光杯130具有多個開孔132，且發光二極體124對應穿過開孔132以暴露於光杯130內，而透鏡140配置於光杯130。固定扣環220承靠在光機模組100的透鏡140上，且固定扣環220暴露出透鏡本體142，並扣合於燈座210，以將光機模組100固定於燈座210內承上述，本實施例的燈座210的材質為金屬，且其更可在第一容置槽212的外圍設置有多個鰭片(未標示)，以使發光二極體燈具200具有良好的散熱功效。詳細而言，燈座210設置有用以散熱的鰭片，可以讓積聚在燈座210內的熱有效地散逸，提升散熱效果，以使發光二極體燈具200保有極佳的照明亮度。1 is an exploded perspective view of a optomechanical module according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the optomechanical module of FIG. 1 assembled, and FIG. 3 is an illuminating dipole of the optomechanical module of FIG. Schematic diagram of the decomposition of the body luminaire. Referring to FIG. 1 , FIG. 2 and FIG. 3 , the LED device 200 includes a lamp holder 210 , a light machine module 100 , and a fixed buckle 220 . The lamp holder 210 has a first accommodating groove 212, and the optomechanical module 100 is disposed in the first accommodating groove 212. The optomechanical module 100 includes a main body 110, a light emitting diode board 120, a light cup 130, and a lens 140. The main body 110 has a second accommodating groove 112, and the illuminating diode board 120 is disposed in the second. The inside of the receiving slot 112. The LED board 120 includes a circuit board 122 and a plurality of LEDs 124. The LEDs 124 are disposed on the circuit board 122. The light cup 130 is disposed in the second accommodating groove 112 and is located on the illuminating diode plate 120. The light cup 130 has a plurality of openings 132, and the light emitting diode 124 passes through the opening 132 to be exposed to the light. Inside the cup 130, the lens 140 is disposed in the light cup 130. The fixing buckle 220 bears against the lens 140 of the optomechanical module 100, and the fixing buckle 220 exposes the lens body 142 and is fastened to the socket 210 to fix the optomechanical module 100 to the socket 210. In the above, the lamp holder 210 of the present embodiment is made of metal, and a plurality of fins (not labeled) are disposed on the periphery of the first accommodating groove 212, so that the illuminating diode lamp 200 has good heat dissipation. efficacy. In detail, the socket 210 is provided with fins for dissipating heat, so that the heat accumulated in the socket 210 can be effectively dissipated, thereby improving the heat dissipation effect, so that the LED luminaire 200 maintains excellent illumination brightness.
另外，光杯130包括一底部134以及一側壁136，其中開孔132位於底部134，而側壁136環繞底部134設置，且當光杯130置放於第二容置槽112時，側壁136承靠於主體110之第二容置槽112的一槽壁114。光杯130的成型，可以依照需求而決定，例如底部134及側壁136一體成型為光杯130，或是經由組裝底部134及側壁136的方式成型光杯130。In addition, the light cup 130 includes a bottom 134 and a side wall 136, wherein the opening 132 is located at the bottom 134, and the side wall 136 is disposed around the bottom 134, and when the light cup 130 is placed in the second receiving groove 112, the side wall 136 bears A groove wall 114 of the second receiving groove 112 of the main body 110. The shaping of the light cup 130 can be determined according to requirements. For example, the bottom portion 134 and the side wall 136 are integrally formed into the light cup 130, or the light cup 130 is formed by assembling the bottom portion 134 and the side wall 136.
承上述，透鏡140包括一本體142以及多個呈圓錐狀的罩體144，其中罩體144會罩覆在發光二極體124上，且藉由罩體144的形狀可以調整發光二極體124所發出的光的路徑後，光會從本體142射出。In the above, the lens 140 includes a body 142 and a plurality of conical shells 144. The cover 144 is covered on the LEDs 124, and the LEDs 124 can be adjusted by the shape of the cover 144. After the path of the emitted light, light is emitted from the body 142.
在一般的發光二極體燈具中的設計，雖然會有透鏡罩住發光二極體，但是即使發光二極體大抵可歸類為具指向性的光源，其所發出的光在受到透鏡的形狀及材料的影響，有些光在穿過透鏡後並無法如預期的射出透鏡之外。換言之，發光二極體發出的光並無法完全地有效利用，意即，仍是有光損失。特別的是，本實施例之光機模組100中有光杯130的設置，其中光杯130的材料為高反射率塑膠材料，或是也可以在光杯130之底部134及側壁136的內表面(即朝向透鏡140的表面)塗佈有一高反射率材料層或金屬層，搭配發光二極體124是穿過光杯130的底部134的開孔132後位於光杯130內(即底部134及側壁136圍出的空間中)，使得光杯130可以將發光二極體124穿過透鏡140後所發射出來且在主體110之第一容置槽112空間內漫射的光由光杯130作反射，再從透鏡140射出。相較於一般的發光二極體的設計，本實施例的發光二極體燈具200的流明數有效的增加，亦提升了發光二極體燈具200的整體亮度。In the design of a general light-emitting diode lamp, although a lens covers the light-emitting diode, even if the light-emitting diode is largely classified as a light source having directivity, the light emitted by the light is in the shape of a lens. As a result of the material, some of the light does not exit the lens as expected after passing through the lens. In other words, the light emitted by the light-emitting diode cannot be fully utilized effectively, that is, there is still a loss of light. In particular, the optomechanical module 100 of the present embodiment has a light cup 130 disposed therein, wherein the material of the light cup 130 is a high reflectivity plastic material, or may also be within the bottom 134 and the sidewall 136 of the light cup 130. The surface (i.e., the surface facing the lens 140) is coated with a layer of high reflectivity material or metal layer. The illuminating diode 124 is placed in the light cup 130 after passing through the opening 132 of the bottom 134 of the light cup 130 (i.e., the bottom 134). And the space that the light cup 130 can emit after the light emitting diode 124 passes through the lens 140 and diffuses in the space of the first accommodating groove 112 of the main body 110 by the light cup 130. It is reflected and then emitted from the lens 140. Compared with the design of the general light-emitting diode, the effective increase of the lumen number of the light-emitting diode lamp 200 of the present embodiment also improves the overall brightness of the light-emitting diode lamp 200.
表1為本實施例之光機模組及非本實施例之光機模組的流明數比較表。Table 1 is a comparison table of lumens of the optomechanical module of the present embodiment and the optomechanical module of the present embodiment.
由表1可知，設置有光杯130之光機模組100的流明數相較於未設置有光杯130的光機模組的流明數平均提升了10個百分比左右。換言之，光杯130的設置有效地提升了光機模組100的流明數，因此可更進而提升使用此光機模組100的發光二極體燈具200的亮度。As can be seen from Table 1, the lumen number of the optomechanical module 100 provided with the light cup 130 is increased by about 10% on average compared to the lumen number of the optomechanical module not provided with the light cup 130. In other words, the arrangement of the light cup 130 effectively increases the lumens of the optomechanical module 100, thereby further improving the brightness of the illuminating diode luminaire 200 using the optomechanical module 100.
綜上所述，於本發明之光機模組及使用此光機模組的發光二極體燈具中，具有反射效果的光杯的設置可以有效地收集及利用自透鏡穿過後但未以預期角度射出透鏡之外的光線，因此可以提升光機模組的流明數，進而增進使用此光機模組的發光二極體燈具的亮度。In summary, in the illuminating device module of the present invention and the illuminating diode lamp using the illuminating device module, the setting of the reflecting cup having the reflective effect can be effectively collected and utilized after passing through the lens but not expected The angle of light exits the lens, thereby increasing the lumens of the optomechanical module and thereby increasing the brightness of the illuminating diode luminaire using the optomechanical module.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100．．．光機模組100. . . Optical module
110．．．主體110. . . main body
112．．．第二容置槽112. . . Second receiving slot
114．．．槽壁114. . . Slot wall
120．．．發光二極體板120. . . Light-emitting diode board
122．．．電路板122. . . Circuit board
124．．．發光二極體124. . . Light-emitting diode
130．．．光杯130. . . Light cup
132．．．開孔132. . . Opening
134．．．底部134. . . bottom
136．．．側壁136. . . Side wall
140．．．透鏡140. . . lens
142．．．本體142. . . Ontology
144．．．罩體144. . . Cover
200．．．發光二極體燈具200. . . Light-emitting diode lamp
210．．．燈座210. . . Lamp holder
212．．．第一容置槽212. . . First accommodating slot
220．．．固定扣環220. . . Fixed buckle
圖1為本發明一實施例之光機模組的分解示意圖。1 is an exploded perspective view of a optomechanical module according to an embodiment of the present invention.
圖2為圖1之光機模組組裝在一起的剖面圖。2 is a cross-sectional view of the optomechanical module of FIG. 1 assembled.
圖3為使用圖1之光機模組的發光二極體燈具的分解示意圖。3 is an exploded perspective view of a light-emitting diode lamp using the optomechanical module of FIG. 1.
100．．．光機模組100. . . Optical module
110．．．主體110. . . main body
112．．．第二容置槽112. . . Second receiving slot
114．．．槽壁114. . . Slot wall
120．．．發光二極體板120. . . Light-emitting diode board
122．．．電路板122. . . Circuit board
124．．．發光二極體124. . . Light-emitting diode
130．．．光杯130. . . Light cup
132．．．開孔132. . . Opening
134．．．底部134. . . bottom
136．．．側壁136. . . Side wall
140．．．透鏡140. . . lens
142．．．本體142. . . Ontology
144．．．罩體144. . . Cover
Claims (12)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100116168A TWI403678B (en) | 2011-05-09 | 2011-05-09 | Optical module and lightemitting diode lamp |
| US13/433,277 US20120287630A1 (en) | 2011-05-09 | 2012-03-28 | Optical module and light-emitting diode lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100116168A TWI403678B (en) | 2011-05-09 | 2011-05-09 | Optical module and lightemitting diode lamp |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201248078A TW201248078A (en) | 2012-12-01 |
| TWI403678B true TWI403678B (en) | 2013-08-01 |
Family
ID=47141756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100116168A TWI403678B (en) | 2011-05-09 | 2011-05-09 | Optical module and lightemitting diode lamp |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20120287630A1 (en) |
| TW (1) | TWI403678B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202598379U (en) * | 2012-03-28 | 2012-12-12 | 欧司朗股份有限公司 | Lens and illuminating device provided with the same |
| KR101627224B1 (en) * | 2014-10-28 | 2016-06-03 | 세종공업 주식회사 | Multi Function Holder and Connector having Multi Function Holder |
| US9655245B2 (en) * | 2015-02-18 | 2017-05-16 | Visual Communications Company | Surface mounted standoff light emitting diode device |
| US11867376B1 (en) * | 2023-02-16 | 2024-01-09 | Po-Yen Chen | Warning lamp structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM296951U (en) * | 2006-01-11 | 2006-09-01 | Sing Dei Entpr Co Ltd | Improved LED lamp |
| CN201547673U (en) * | 2009-09-10 | 2010-08-11 | 艾迪光电（杭州）有限公司 | Optical structure of high-efficient LED lamp |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5580156A (en) * | 1994-09-27 | 1996-12-03 | Koito Manufacturing Co., Ltd. | Marker apparatus |
| DE19755734A1 (en) * | 1997-12-15 | 1999-06-24 | Siemens Ag | Method for producing a surface-mountable optoelectronic component |
| JP3195294B2 (en) * | 1998-08-27 | 2001-08-06 | スタンレー電気株式会社 | Vehicle lighting |
| US6184628B1 (en) * | 1999-11-30 | 2001-02-06 | Douglas Ruthenberg | Multicolor led lamp bulb for underwater pool lights |
| JP3977004B2 (en) * | 2000-10-13 | 2007-09-19 | 株式会社小糸製作所 | Interior lighting |
| JP3948650B2 (en) * | 2001-10-09 | 2007-07-25 | アバゴ・テクノロジーズ・イーシービーユー・アイピー（シンガポール）プライベート・リミテッド | Light emitting diode and manufacturing method thereof |
| US6840654B2 (en) * | 2002-11-20 | 2005-01-11 | Acolyte Technologies Corp. | LED light and reflector |
| US8529085B2 (en) * | 2008-09-15 | 2013-09-10 | Led Roadway Lighting Ltd. | Light emitting diode (LED) roadway lighting fixture |
| TWI416767B (en) * | 2009-06-03 | 2013-11-21 | 國格金屬科技股份有限公司 | LED luminous module process method |
| US20110141730A1 (en) * | 2009-12-14 | 2011-06-16 | Han-Ming Lee | Lamp of replaceable LED |
| US8354745B2 (en) * | 2010-04-20 | 2013-01-15 | Intellectual Discovery Co., Ltd. | Electronic assembly |
| KR101055743B1 (en) * | 2010-06-23 | 2011-08-11 | 엘지전자 주식회사 | Lighting equipment |
| KR101062052B1 (en) * | 2010-07-02 | 2011-09-02 | 정태호 | Street lamp |
| US9470882B2 (en) * | 2011-04-25 | 2016-10-18 | Cree, Inc. | Optical arrangement for a solid-state lamp |
-
2011
- 2011-05-09 TW TW100116168A patent/TWI403678B/en not_active IP Right Cessation
-
2012
- 2012-03-28 US US13/433,277 patent/US20120287630A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM296951U (en) * | 2006-01-11 | 2006-09-01 | Sing Dei Entpr Co Ltd | Improved LED lamp |
| CN201547673U (en) * | 2009-09-10 | 2010-08-11 | 艾迪光电（杭州）有限公司 | Optical structure of high-efficient LED lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201248078A (en) | 2012-12-01 |
| US20120287630A1 (en) | 2012-11-15 |
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