TWI402363B - Antibiotic alloy material composition - Google Patents
Antibiotic alloy material composition Download PDFInfo
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- TWI402363B TWI402363B TW97151436A TW97151436A TWI402363B TW I402363 B TWI402363 B TW I402363B TW 97151436 A TW97151436 A TW 97151436A TW 97151436 A TW97151436 A TW 97151436A TW I402363 B TWI402363 B TW I402363B
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- 239000000956 alloy Substances 0.000 title claims description 88
- 239000000203 mixture Substances 0.000 title claims description 8
- 230000003115 biocidal effect Effects 0.000 title 1
- 230000000844 anti-bacterial effect Effects 0.000 claims description 191
- 229910045601 alloy Inorganic materials 0.000 claims description 87
- 229910052751 metal Inorganic materials 0.000 claims description 75
- 238000000576 coating method Methods 0.000 claims description 56
- 239000011248 coating agent Substances 0.000 claims description 53
- 239000008199 coating composition Substances 0.000 claims description 53
- 239000002184 metal Substances 0.000 claims description 50
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 46
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 38
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 24
- 229910052742 iron Inorganic materials 0.000 claims description 23
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052804 chromium Inorganic materials 0.000 claims description 21
- 239000011651 chromium Substances 0.000 claims description 21
- 229910017052 cobalt Inorganic materials 0.000 claims description 21
- 239000010941 cobalt Substances 0.000 claims description 21
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 21
- 229910052759 nickel Inorganic materials 0.000 claims description 19
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 17
- 229910052760 oxygen Inorganic materials 0.000 claims description 17
- 239000001301 oxygen Substances 0.000 claims description 17
- 229910052757 nitrogen Inorganic materials 0.000 claims description 13
- 229910052709 silver Inorganic materials 0.000 claims description 13
- 239000004332 silver Substances 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 12
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 11
- 229910052796 boron Inorganic materials 0.000 claims description 11
- 229910052720 vanadium Inorganic materials 0.000 claims description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- 239000010936 titanium Substances 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 229910052755 nonmetal Inorganic materials 0.000 claims description 7
- 239000013078 crystal Substances 0.000 claims description 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims 1
- 239000010408 film Substances 0.000 description 42
- 238000000034 method Methods 0.000 description 36
- 150000004767 nitrides Chemical class 0.000 description 33
- 239000010935 stainless steel Substances 0.000 description 23
- 229910001220 stainless steel Inorganic materials 0.000 description 23
- 239000000758 substrate Substances 0.000 description 23
- 238000002844 melting Methods 0.000 description 16
- 230000008018 melting Effects 0.000 description 16
- 238000004544 sputter deposition Methods 0.000 description 15
- 229910044991 metal oxide Inorganic materials 0.000 description 14
- 150000004706 metal oxides Chemical class 0.000 description 14
- 241000588724 Escherichia coli Species 0.000 description 11
- 241000588747 Klebsiella pneumoniae Species 0.000 description 11
- 241000589517 Pseudomonas aeruginosa Species 0.000 description 11
- 241000191967 Staphylococcus aureus Species 0.000 description 11
- 238000009501 film coating Methods 0.000 description 11
- 239000010409 thin film Substances 0.000 description 11
- 238000001755 magnetron sputter deposition Methods 0.000 description 10
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 10
- 238000004458 analytical method Methods 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 7
- 239000013077 target material Substances 0.000 description 7
- 238000002441 X-ray diffraction Methods 0.000 description 6
- 239000012535 impurity Substances 0.000 description 3
- 229910001092 metal group alloy Inorganic materials 0.000 description 3
- 238000003723 Smelting Methods 0.000 description 2
- 238000007545 Vickers hardness test Methods 0.000 description 2
- 230000000845 anti-microbial effect Effects 0.000 description 2
- 239000004599 antimicrobial Substances 0.000 description 2
- 230000003385 bacteriostatic effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 241000282414 Homo sapiens Species 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 238000010314 arc-melting process Methods 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
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- Physical Vapour Deposition (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Description
本發明係有關於一種合金鍍膜，特別是一種抗菌性合金鍍膜組成物。 The present invention relates to an alloy coating film, and more particularly to an antimicrobial alloy coating film composition.
隨著經濟發展及生活品質的提高，人類在清潔衛生方面的意識也隨之高漲。日常生活中所使用的器材，例如廚房用具、衛生設備等，其衛生要求逐漸提高，特別是對於衛生要求相當高的醫療用品。而於各種清潔衛生的項目中，抗菌率已成為清潔衛生的重要指標項目之一。因此，具有抗菌功能之器材儼然已成為目前生活的需求之一。 With the development of the economy and the improvement of the quality of life, the awareness of human beings in terms of sanitation has also increased. The hygiene requirements of equipment used in daily life, such as kitchen utensils and sanitary equipment, are gradually increasing, especially for medical supplies with relatively high hygiene requirements. In various sanitation projects, antibacterial rate has become one of the important indicators of sanitation. Therefore, equipment with antibacterial function has become one of the needs of current life.
以目前市面上具有抗菌功能之用品而言，一般係於用品的表面上塗附一層具有抗菌性的材料，例如為無機化合物；有機化合物或者是天然性的抗菌劑等。然而，此種具有抗菌性的材料，其附著力不佳，因此，當此等用品經過多次刷洗、日曬、磨擦、更甚至是加熱烘乾等，用品表面上的抗菌性材料會逐漸脫落，可想而知，其抗菌能力亦大幅下降更甚至是完全消失。如此一來，便喪失了抗菌的功能。 In the case of articles having antibacterial function on the market, a surface having an antibacterial property such as an inorganic compound, an organic compound or a natural antibacterial agent is generally applied to the surface of the article. However, such an antibacterial material has poor adhesion, and therefore, when such articles are subjected to multiple brushing, sun drying, rubbing, or even heat drying, the antibacterial material on the surface of the product gradually falls off. It is conceivable that its antibacterial ability has also dropped significantly or even completely disappeared. As a result, the antibacterial function is lost.
是以，倘若能發展出一種能同時兼具高抗菌率以及長期維持抗菌性之材料，實屬目前相關領域的技術人員亟欲克服的問題。 Therefore, if a material capable of simultaneously having a high antibacterial rate and maintaining antibacterial properties for a long period of time can be developed, it is a problem that the technicians in the related fields are currently trying to overcome.
鑒於以上的問題，本發明提供一種抗菌性合金鍍膜組成物，藉以同時兼具高抗菌率以及長期維持抗菌性之要求。 In view of the above problems, the present invention provides an antibacterial alloy coating composition which simultaneously has a high antibacterial rate and a requirement for maintaining antibacterial properties for a long period of time.
本發明所揭露之一種抗菌性合金鍍膜組成物，係應用於一器材表面上，以於器材表面上鍍製一抗菌合金鍍膜，此抗菌性合金鍍膜組成物係包含有一抗菌材料以及一合金，且合金係由至少四種以上之金屬元素以及至少一非金屬 元素所組成。其中，抗菌材料之材質可例如為銅或銀，且抗菌材料之原子百分比含量約佔總含量之1.7%~26.8%。上述之金屬元素係選自於鐵、鈷、鉻、鎳、鋁、釩以及鈦所組成之群組之一，非金屬元素係選自於硼、氧以及氮所組成之群組之一。其次，前述合金之原子百分比含量約佔總含量之73.2%~98.3%。 An antibacterial alloy coating composition disclosed in the present invention is applied to a surface of a device for plating an antibacterial alloy coating on the surface of the device, the antibacterial alloy coating composition comprising an antibacterial material and an alloy, and The alloy is composed of at least four metal elements and at least one non-metal The composition of the elements. The material of the antibacterial material may be, for example, copper or silver, and the atomic percentage of the antibacterial material is about 1.7% to 26.8% of the total content. The above metal element is selected from the group consisting of iron, cobalt, chromium, nickel, aluminum, vanadium and titanium, and the non-metal element is selected from the group consisting of boron, oxygen and nitrogen. Secondly, the atomic percentage of the aforementioned alloy accounts for about 73.2% to 98.3% of the total content.
因此，本發明所揭露的抗菌性合金鍍膜組成物，確實具有優異的抗菌效果，其抗菌率皆高達5.2，且其抑菌率亦高達99.6%以上，再者，本發明之抗菌性合金鍍膜組成物所製備而成的抗菌合金鍍膜，其硬度也可高達約10 Gpa以上。由此可得知，利用本發明之特殊配方的抗菌性合金鍍膜組成物，將其鍍附於衛生或醫療器材上，不僅會提高此等器材之硬度，更能大幅提高其表面的抗菌效果，進而能提昇器材之應用性。 Therefore, the antibacterial alloy coating composition disclosed by the present invention has an excellent antibacterial effect, and the antibacterial rate thereof is as high as 5.2, and the antibacterial rate thereof is also as high as 99.6% or more. Furthermore, the antibacterial alloy coating film composition of the present invention is composed. The antibacterial alloy coating prepared by the material can also have a hardness of about 10 GPa or more. Therefore, it can be known that the antibacterial alloy coating composition of the special formulation of the present invention is plated on sanitary or medical equipment, which not only improves the hardness of the equipment, but also greatly improves the antibacterial effect of the surface. In turn, the applicability of the equipment can be improved.
以上之關於本發明內容之說明及以下之實施方式之說明係用以示範與解釋本發明之原理，並且提供本發明之專利申請範圍更進一步之解釋。 The above description of the present invention and the following description of the embodiments of the present invention are intended to illustrate and explain the principles of the invention.
第1圖，係為本發明第一實施例中之抗菌性合金鍍膜的X光繞射圖。 Fig. 1 is an X-ray diffraction pattern of an antibacterial alloy plating film in the first embodiment of the present invention.
第2圖，係為本發明第二實施例中之抗菌性合金屬氧化物鍍膜的X光繞射圖。 Fig. 2 is an X-ray diffraction pattern of the antibacterial metal oxide coating film in the second embodiment of the present invention.
第3圖，係為本發明第三實施例中之抗菌性合金屬氮化物鍍膜的X光繞射圖。 Fig. 3 is an X-ray diffraction pattern of the antibacterial metal nitride coating film in the third embodiment of the present invention.
本發明之抗菌性合金鍍膜組成物，係應用於一器材表面上，以於器材表面上鍍製一抗菌合金鍍膜。而於器材表面上鍍製一抗菌合金鍍 膜之方法，係先利用例如為真空電弧熔煉法、或高週波熔煉法等方法來熔煉或合成一靶材，隨後再將此靶材以例如為真空濺鍍製程、或者是真空電弧離子鍍膜製程等鍍膜製程來進行，但並不侷限於此。而所述之器材可以例如為一餐具、刀具、衛生器材、或醫療器材等，且此器材之材質可以為金屬、陶瓷、塑膠或玻璃材質等，但並不侷限於此。茲以真空電弧熔煉法與真空濺鍍製程為例說明，而所所選用的器材係為一不鏽鋼基板。 The antibacterial alloy coating composition of the invention is applied to the surface of a device to plate an antibacterial alloy coating on the surface of the device. And plating an antibacterial alloy plating on the surface of the equipment The method of film is first smelting or synthesizing a target by using, for example, a vacuum arc melting method or a high-frequency melting method, and then the target is, for example, a vacuum sputtering process or a vacuum arc ion plating process. The coating process is carried out, but is not limited thereto. The device may be, for example, a tableware, a knife, a sanitary device, or a medical device, and the material of the device may be metal, ceramic, plastic or glass, but is not limited thereto. The vacuum arc melting method and the vacuum sputtering process are exemplified, and the selected equipment is a stainless steel substrate.
再者，本發明所揭露之抗菌性合金鍍膜組成物，係包含有一抗菌材料以及一合金，且合金係由至少四種以上之金屬元素以及至少一非金屬元素所組成。其中，抗菌材料之材質可例如為銅或銀，且抗菌材料之原子百分比含量約佔總含量之1.7%~26.8%。金屬元素係選自於鐵、鈷、鉻、鎳、鋁、釩以及鈦所組成之群組之一，而非金屬元素係選自於硼、氧以及氮所組成之群組之一。其次，前述金屬合金之之原子百分比含量佔總含量之73.2%~98.3%，金屬元素之原子百分比含量佔總含量之65.2%~98%，而非金屬元素之原子百分比含量佔總含量之0.3%~16.7%。 Furthermore, the antibacterial alloy coating composition disclosed in the present invention comprises an antibacterial material and an alloy, and the alloy is composed of at least four metal elements and at least one non-metal element. The material of the antibacterial material may be, for example, copper or silver, and the atomic percentage of the antibacterial material is about 1.7% to 26.8% of the total content. The metal element is selected from the group consisting of iron, cobalt, chromium, nickel, aluminum, vanadium, and titanium, and the non-metal element is selected from the group consisting of boron, oxygen, and nitrogen. Secondly, the atomic percentage of the aforementioned metal alloy accounts for 73.2% to 98.3% of the total content, the atomic percentage of the metal element accounts for 65.2% to 98% of the total content, and the atomic percentage of the non-metallic element accounts for 0.3% of the total content. ~16.7%.
以下將以各個不同的實施例來詳細說明本發明之抗菌性合金鍍膜組成物，並且分別探討此等實施例中之抗菌性合金鍍膜組成物鍍膜於器材表面上時，其鍍膜特性及抗菌效果為何。其中，如表一中所示，表一係代表各個不同的實施例中之抗菌性合金鍍膜組成物，且係分別選用不同材料抗菌材料以及合金，並以不同混合比例而組成。 Hereinafter, the antibacterial alloy coating composition of the present invention will be described in detail in various embodiments, and the coating properties and antibacterial effects of the antibacterial alloy coating composition coating on the surface of the device in each of the examples will be separately examined. . Wherein, as shown in Table 1, Table 1 represents the antibacterial alloy coating composition in each of the different embodiments, and the different materials of the antibacterial material and the alloy are respectively selected and composed in different mixing ratios.
於實施例一中，抗菌性合金鍍膜組成物中之抗菌材料係選用銅，而合金中的金屬元素係由鋁、鈷、鉻、鐵以及鎳等五種金屬元素所組成。其中，如上表一所示，銅的原子百分比成分為16.6%，而鐵、鈷、鉻、鎳以及鋁的原子百分比成分依序為16.6%、16.6%、16.6%、16.6%以及16.6%。此外，如表一所示，此實施例中更包含少量的非金屬元素，例如0.4%的氧。 In the first embodiment, the antibacterial material in the antibacterial alloy coating composition is copper, and the metal element in the alloy is composed of five metal elements such as aluminum, cobalt, chromium, iron and nickel. Among them, as shown in Table 1 above, the atomic percentage component of copper is 16.6%, and the atomic percentage components of iron, cobalt, chromium, nickel, and aluminum are 16.6%, 16.6%, 16.6%, 16.6%, and 16.6%, respectively. Further, as shown in Table 1, this embodiment further contains a small amount of a non-metallic element such as 0.4% oxygen.
首先，先依前述比例配置好一抗菌性合金鍍膜組成物。其後，再以真空電弧熔煉法來進行製備一靶材。在進行真空電弧熔煉法之前，先將欲進行鍍膜的不鏽鋼基板進行清洗製程，以移除不鏽鋼基板表面上的雜質。接著，將配置完成的抗菌性合金鍍膜組成物，放置於水冷銅模中溶解凝固，並且經多次反覆重熔，使此等成分混合均勻，最後再凝固成一圓餅狀的鑄錠。將此圓餅狀的鑄錠研磨平坦而形成一靶材。換言之，此靶材為抗菌性合金鍍膜組成物的靶材。其後，將此靶材置放於射頻磁控濺鍍機上，並且進行一真空濺鍍製程，以於一不鏽鋼基板的表面上進行薄膜鍍膜製程。其中，進行薄膜鍍膜製程的操作條件係在1x10-4壓力、200℃溫度下，且鍍膜時間約為20分鐘。如此一來，便可以於不鏽鋼基板的表面上形成一抗菌性合金鍍膜。其中，抗菌性合金鍍膜之厚度為10奈米~2000奈米。 First, an antibacterial alloy coating composition is first disposed in accordance with the foregoing ratio. Thereafter, a target is prepared by vacuum arc melting. Prior to the vacuum arc melting process, the stainless steel substrate to be coated is subjected to a cleaning process to remove impurities on the surface of the stainless steel substrate. Next, the disposed antibacterial alloy coating composition is placed in a water-cooled copper mold to be dissolved and solidified, and repeatedly remelted by a plurality of times to uniformly mix the components, and finally solidified into a round ingot. This round cake-shaped ingot is ground to form a target. In other words, the target is a target of an antimicrobial alloy coating composition. Thereafter, the target is placed on a radio frequency magnetron sputtering machine, and a vacuum sputtering process is performed to perform a thin film coating process on the surface of a stainless steel substrate. Among them, the operating conditions for the thin film coating process are at a pressure of 1 x 10 -4 and a temperature of 200 ° C, and the coating time is about 20 minutes. In this way, an antibacterial alloy plating film can be formed on the surface of the stainless steel substrate. Among them, the thickness of the antibacterial alloy coating is 10 nm to 2000 nm.
接著，對不鏽鋼基板的表面上的抗菌性合金鍍膜進行一鍍膜特性分析，其結果如第1圖所示。第1圖，係為本發明第一實施例中之抗菌性合金鍍膜的X光繞射圖。由其分析結果可得之，此抗菌性合金鍍膜係屬於面心立方(face-centered cubic；FCC)晶體結構，且其粒徑大小約為100 nm。其次，再以鉛筆刮痕硬度測試來試驗此抗菌性合金鍍膜之硬度大小，由測試由果可得知，實施例一中所製備的的抗菌性合金鍍膜，其硬度為 8.6Gpa。 Next, a coating property analysis was performed on the antibacterial alloy plating film on the surface of the stainless steel substrate, and the results are shown in Fig. 1. Fig. 1 is an X-ray diffraction pattern of an antibacterial alloy plating film in the first embodiment of the present invention. According to the analysis results, the antibacterial alloy coating belongs to a face-centered cubic (FCC) crystal structure and has a particle size of about 100 nm. Next, the hardness of the antibacterial alloy coating film was tested by a pencil scratch hardness test. It can be known from the test that the antibacterial alloy coating film prepared in the first embodiment has a hardness of 8.6Gpa.
再者，對抗菌性合金鍍膜進行抗菌試驗。表二為本發明第一實施例中所製備得的抗菌性合金鍍膜之抗菌分析值。由表二之抗菌試驗結果可得知，抗菌性合金鍍膜之金黃葡萄球菌、大腸桿菌、克氏肺炎桿菌以及綠膿桿菌等，其抗菌率皆高達5.2，且其抑菌率亦高達99.999%以上。因此，本發明之抗菌性合金鍍膜組成物，其鍍膜於器材表面上確實具有相當高的抗菌效果。 Furthermore, an antibacterial alloy coating film was subjected to an antibacterial test. Table 2 shows the antibacterial analysis values of the antibacterial alloy coating film prepared in the first embodiment of the present invention. According to the antibacterial test results in Table 2, the antibacterial alloy coatings of Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae and Pseudomonas aeruginosa have antibacterial rates as high as 5.2, and their antibacterial rate is as high as 99.999% or more. . Therefore, the antibacterial alloy coating composition of the present invention does have a relatively high antibacterial effect on the surface of the device.
於實施例二中，抗菌性合金鍍膜組成物中之抗菌材料係選用銅，而合金中的金屬元素係由鐵、鈷、鉻、鎳以及鋁等五種金屬元素所組成。其中，如上表一所示，銅的原子百分比成分為15.8%，而鐵、鈷、鉻、鎳以及鋁的原子百分比成分依序為15.9%、15.9%、16.0%、17.2%以及14.2%。此外，如表一所示，此實施例中更包含少量的非金屬元素，例如氧，詳言之，實施例二與實施例一之差異，僅在於在進行真空濺鍍製程時，係通入不同分壓之氧氣以形成一抗菌性合金屬氧化物鍍膜，詳細說明如下。 In the second embodiment, the antibacterial material in the antibacterial alloy coating composition is copper, and the metal element in the alloy is composed of five metal elements such as iron, cobalt, chromium, nickel and aluminum. Among them, as shown in Table 1 above, the atomic percentage component of copper is 15.8%, and the atomic percentage components of iron, cobalt, chromium, nickel, and aluminum are 15.9%, 15.9%, 16.0%, 17.2%, and 14.2%, respectively. In addition, as shown in Table 1, this embodiment further includes a small amount of non-metal elements, such as oxygen. In detail, the difference between the second embodiment and the first embodiment is only when the vacuum sputtering process is performed. Different partial pressures of oxygen are used to form an antibacterial metal oxide coating, as described in detail below.
先依前述比例配置好一抗菌性合金鍍膜組成物。其後，再以真空電弧熔煉法來進行製備一靶材，並且在進行真空電弧熔煉法之前，先清洗欲進行鍍膜的不鏽鋼基板，以移除不鏽鋼基板表面上的雜質。隨後，便可將配置完成的抗菌性合金鍍膜組成物製備成一靶材，詳細之真空電弧 熔煉法如實施例一所述，故不在此多加贅述。其後，將此靶材置放於射頻磁控濺鍍機上，並且於分壓為5%之氧氣下進行一真空濺鍍製程，以於一不鏽鋼基板的表面上進行薄膜鍍膜製程。其中，進行薄膜鍍膜製程的操作條件係在5%之氧氣分壓、200℃溫度下，且鍍膜時間約為30分鐘。如此一來，便可以於不鏽鋼基板的表面上形成一抗菌性合金屬氧化物鍍膜。 First, an antibacterial alloy coating composition is disposed in accordance with the foregoing ratio. Thereafter, a target is prepared by vacuum arc melting, and the stainless steel substrate to be coated is cleaned before the vacuum arc melting method to remove impurities on the surface of the stainless steel substrate. Subsequently, the configured antibacterial alloy coating composition can be prepared into a target, and the detailed vacuum arc The smelting method is as described in the first embodiment, so it will not be repeated here. Thereafter, the target was placed on a radio frequency magnetron sputtering machine, and a vacuum sputtering process was performed under a partial pressure of 5% oxygen to perform a thin film coating process on the surface of a stainless steel substrate. Among them, the operating conditions for the thin film coating process are 5% oxygen partial pressure, 200 ° C temperature, and the coating time is about 30 minutes. In this way, an antibacterial metal oxide plating film can be formed on the surface of the stainless steel substrate.
接著，對不鏽鋼基板的表面上的抗菌性合金屬氧化物鍍膜進行一鍍膜特性分析，其結果如第2圖所示。第2圖，係為本發明第二實施例中之抗菌性合金屬氧化物鍍膜的X光繞射圖。由其分析結果可得之，此抗菌性合金屬氧化物鍍膜係包含晶體結構並且含有部分的非晶質結構。其次，再以鉛筆刮痕硬度測試來試驗此抗菌性合金屬氧化物鍍膜之硬度大小，由測試結果可得知，實施例二中所製備的的抗菌性合金屬氧化物鍍膜，其硬度為8 H。 Next, a coating property analysis was performed on the antibacterial metal oxide plating film on the surface of the stainless steel substrate, and the results are shown in Fig. 2 . Fig. 2 is an X-ray diffraction pattern of the antibacterial metal oxide coating film in the second embodiment of the present invention. As a result of the analysis, the antibacterial metal oxide coating film contains a crystal structure and contains a part of an amorphous structure. Next, the hardness of the antibacterial metal oxide coating film was tested by a pencil scratch hardness test. From the test results, the antibacterial metal oxide coating film prepared in the second embodiment has a hardness of 8 H.
再者，對抗菌性合金屬氧化物鍍膜進行抗菌試驗。表三為本發明第二實施例中所製備得的抗菌性合金屬氧化物鍍膜之抗菌分析值。由表三之抗菌試驗結果可得知，抗菌性合金屬氧化物鍍膜之金黃葡萄球菌、大腸桿菌、克氏肺炎桿菌以及綠膿桿菌等，其抗菌率皆高達5.0，且其抑菌率亦高達99.999%以上。因此，本發明之抗菌性合金屬氧化物鍍膜組成物，其鍍膜於器材表面上確實具有相當高的抗菌效果。 Furthermore, an antibacterial test was carried out on the antibacterial metal oxide coating film. Table 3 shows the antibacterial analysis values of the antibacterial metal oxide coating film prepared in the second embodiment of the present invention. From the antibacterial test results in Table 3, it can be known that the antibacterial metal oxide coating of Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae and Pseudomonas aeruginosa has an antibacterial rate of up to 5.0, and the antibacterial rate is also high. More than 99.999%. Therefore, the antibacterial metal oxide coating composition of the present invention does have a relatively high antibacterial effect on the surface of the device.
於實施例三中，抗菌性合金鍍膜組成物中之抗菌材料係選用銅，而合金中的金屬元素係由鐵、鈷、鉻、鎳以及鋁等五種金屬元素所組成。其中，如上表一所示，銅的原子百分比成分為15.7%，而鐵、鈷、鉻、鎳以及鋁的原子百分比成分依序為15.9%、16.1%、15.6%、17.6%以及14.3%。此外，如表一所示，此實施例中更包含少量的氧與氮等非金屬元素。 In the third embodiment, the antibacterial material in the antibacterial alloy coating composition is copper, and the metal element in the alloy is composed of five metal elements such as iron, cobalt, chromium, nickel and aluminum. Among them, as shown in Table 1 above, the atomic percentage component of copper is 15.7%, and the atomic percentage components of iron, cobalt, chromium, nickel, and aluminum are 15.9%, 16.1%, 15.6%, 17.6%, and 14.3%, respectively. Further, as shown in Table 1, this embodiment further contains a small amount of non-metal elements such as oxygen and nitrogen.
其次，實施例三與實施例一之差異，僅在於在進行真空濺鍍製程時，係通入不同分壓之氮氣，以形成一抗菌性合金屬氮化物鍍膜，詳細說明如下。先依前述比例配置好一抗菌性合金鍍膜組成物。其後，再以真空電弧熔煉法來進行製備一靶材，並且在進行真空電弧熔煉法之前，先清洗欲進行鍍膜的不鏽鋼基板，以移除不鏽鋼基板表面上的雜質。隨後，便可將配置完成的抗菌性合金鍍膜組成物製備成一靶材，詳細之真空電弧熔煉法如實施例一所述，故不在此多加贅述。其後，將此靶材置放於射頻磁控濺鍍機上，並且於分壓為4.7%之氮氣下，進行一真空濺鍍製程，以於一不鏽鋼基板的表面上進行薄膜鍍膜製程。如此一來，便可以於不鏽鋼基板的表面上形成一抗菌性合金屬氮化物鍍膜。 Next, the difference between the third embodiment and the first embodiment is that only the nitrogen gas of different partial pressures is introduced during the vacuum sputtering process to form an antibacterial metal nitride coating film, which is described in detail below. First, an antibacterial alloy coating composition is disposed in accordance with the foregoing ratio. Thereafter, a target is prepared by vacuum arc melting, and the stainless steel substrate to be coated is cleaned before the vacuum arc melting method to remove impurities on the surface of the stainless steel substrate. Subsequently, the disposed antibacterial alloy coating composition can be prepared into a target. The detailed vacuum arc melting method is as described in the first embodiment, and thus will not be further described herein. Thereafter, the target was placed on a radio frequency magnetron sputtering machine, and a vacuum sputtering process was performed under a partial pressure of 4.7% nitrogen to perform a thin film coating process on the surface of a stainless steel substrate. In this way, an antibacterial metal nitride plating film can be formed on the surface of the stainless steel substrate.
接著，對不鏽鋼基板的表面上的抗菌性合金屬氮化物鍍膜進行一鍍膜特性分析，其結果如第3圖所示。第3圖，係為本發明第三實施例中之抗菌性合金屬氮化物鍍膜的X光繞射圖。由其分析結果可得之，此抗菌性合金屬氮化物鍍膜係包含FCC晶體結構以及非晶質結構。其次，再以維氏硬度測試來試驗此抗菌性合金屬氮化物鍍膜之硬度大小，由測試結果可得知，實施例三中所製備的的抗菌性合金屬氧化物鍍膜，其硬度為14 GPa。 Next, a coating property analysis was performed on the antibacterial metal nitride plating film on the surface of the stainless steel substrate, and the results are shown in Fig. 3. Fig. 3 is an X-ray diffraction pattern of the antibacterial metal nitride coating film in the third embodiment of the present invention. As a result of the analysis, the antibacterial metal nitride coating film includes an FCC crystal structure and an amorphous structure. Next, the hardness of the antibacterial metal nitride coating film was tested by the Vickers hardness test. From the test results, the antibacterial metal oxide coating film prepared in the third embodiment has a hardness of 14 GPa. .
再者，對抗菌性合金屬氮化物鍍膜進行抗菌試驗。由表四之抗菌試驗結果可得知，抗菌性合金屬氮化物鍍膜之金黃葡萄球菌、大腸桿菌、克氏肺炎桿菌以及綠膿桿菌等，其抗菌率皆高達5.0以上，且其抑菌率亦高達99.999%以上。因此，本發明之抗菌性合金屬氮化物鍍膜組成物，其鍍膜於器材表面上確實具有相當高的抗菌效果。 Furthermore, an antibacterial metal nitride coating film was subjected to an antibacterial test. From the antibacterial test results in Table 4, it can be known that the antibacterial metal nitride coating of Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae and Pseudomonas aeruginosa has an antibacterial rate of more than 5.0, and the antibacterial rate is also Up to 99.999% or more. Therefore, the antibacterial metal nitride coating composition of the present invention does have a relatively high antibacterial effect on the surface of the device.
於實施例四中，抗菌性合金鍍膜組成物中之抗菌材料係選用銅與銀， 而合金中的金屬元素係由鐵、鈷、鉻、鎳、鋁以及鈦等六種金屬元素所組成。其中，如上表一所示，銅與銀的原子百分比成分為0.5%及1.2%，而鐵、鈷、鉻、鎳、鋁以及鈦的原子百分比成分依序為35.4%、21.1%、19.8%、19.3%、1.2%以及1.2%。此外，此實施例中更包含少量的氧(0.2%)與氮(0.1%)等非金屬元素。 In the fourth embodiment, the antibacterial material in the antibacterial alloy coating composition is made of copper and silver. The metal elements in the alloy are composed of six metal elements such as iron, cobalt, chromium, nickel, aluminum and titanium. Wherein, as shown in Table 1 above, the atomic percentage components of copper and silver are 0.5% and 1.2%, and the atomic percentage components of iron, cobalt, chromium, nickel, aluminum and titanium are 35.4%, 21.1%, 19.8%, respectively. 19.3%, 1.2% and 1.2%. Further, this embodiment further contains a small amount of a non-metallic element such as oxygen (0.2%) and nitrogen (0.1%).
依前述比例配置好一抗菌性合金鍍膜組成物，配置完成後再依如實施例一中所述之真空電弧熔煉法製備成一靶材，接著，將此靶材置放於射頻磁控濺鍍機上，進行一真空濺鍍製程，以於一不鏽鋼基板的表面上進行薄膜鍍膜製程。詳細的製備方法步驟如實施例一所述，故不在此多加贅述。 An antibacterial alloy coating composition is disposed according to the above ratio, and after the configuration is completed, a target material is prepared by vacuum arc melting as described in the first embodiment, and then the target is placed on a radio frequency magnetron sputtering machine. A vacuum sputtering process is performed to perform a thin film coating process on the surface of a stainless steel substrate. The detailed preparation method steps are as described in the first embodiment, so they are not described here.
接著，再以維氏硬度測試來試驗此抗菌性合金屬氮化物鍍膜之硬度大小，由測試結果可得知，實施例四中所製備的的抗菌性合金屬氧化物鍍膜，其硬度為10 Gpa。再者，對抗菌性合金屬氮化物鍍膜進行抗菌試驗，抗菌試驗結果可得知，抗菌性合金屬氮化物鍍膜之金黃葡萄球菌、大腸桿菌、克氏肺炎桿菌以及綠膿桿菌等，其抗菌率皆高達5.0以上，且其抑菌率亦高達98.6%以上。因此，本發明之抗菌性合金屬氮化物鍍膜組成物，其鍍膜於器材表面上確實具有相當高的抗菌效果。 Then, the hardness of the antibacterial metal nitride coating film was tested by a Vickers hardness test. From the test results, the antibacterial metal oxide coating film prepared in the fourth embodiment has a hardness of 10 Gpa. . Furthermore, the antibacterial metal nitride coating film is subjected to an antibacterial test, and the antibacterial test results show that the antibacterial rate of the antibacterial metal nitride coated film of Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae and Pseudomonas aeruginosa has an antibacterial rate. Both are up to 5.0 or more, and their bacteriostatic rate is as high as 98.6%. Therefore, the antibacterial metal nitride coating composition of the present invention does have a relatively high antibacterial effect on the surface of the device.
於實施例五中，抗菌性合金鍍膜組成物中之抗菌材料係選用銅與銀，而合金中的金屬元素係由鐵、鈷、鉻、鎳以及鈦等五種金屬元素所組成。其中，如上表一所示，銅與銀的原子百分比成分為6.5%及9.5%，而鐵、鈷、鉻、鎳以及鈦的原子百分比成分依序為34.5%、10.1%、14.2%、14.3%以及10.5%。此外，此實施例中更包含少量的氧(0.3%)與氮(0.1%)等非金屬元素。 In the fifth embodiment, the antibacterial material in the antibacterial alloy coating composition is copper and silver, and the metal element in the alloy is composed of five metal elements such as iron, cobalt, chromium, nickel and titanium. Wherein, as shown in Table 1 above, the atomic percentage components of copper and silver are 6.5% and 9.5%, and the atomic percentage components of iron, cobalt, chromium, nickel and titanium are 34.5%, 10.1%, 14.2%, and 14.3%, respectively. And 10.5%. Further, this embodiment further contains a small amount of non-metallic elements such as oxygen (0.3%) and nitrogen (0.1%).
依前述比例配置好一抗菌性合金鍍膜組成物，配置完成後再依如實施例一中所述之真空電弧熔煉法製備成一靶材，接著，將此靶材置放於射頻磁控濺鍍機上，並且進行一真空濺鍍製程，以於一不鏽鋼基板的表面上進行薄膜鍍膜製程。詳細的製備方法步驟如實施例一所述，故不在此多加贅述。 An antibacterial alloy coating composition is disposed according to the above ratio, and after the configuration is completed, a target material is prepared by vacuum arc melting as described in the first embodiment, and then the target is placed on a radio frequency magnetron sputtering machine. And a vacuum sputtering process is performed to perform a thin film coating process on the surface of a stainless steel substrate. The detailed preparation method steps are as described in the first embodiment, so they are not described here.
再者，對抗菌性合金屬氮化物鍍膜進行抗菌試驗，由抗菌試 驗結果可得知，抗菌性合金屬氮化物鍍膜之金黃葡萄球菌、大腸桿菌、克氏肺炎桿菌以及綠膿桿菌等，其抑菌率亦高達99.6%以上。因此，本發明之抗菌性合金屬氮化物鍍膜組成物，其鍍膜於器材表面上確實具有相當高的抗菌效果。 Furthermore, the antibacterial metal nitride coating film is subjected to an antibacterial test by an antibacterial test. The results of the test showed that the antibacterial and metal nitride coated Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae and Pseudomonas aeruginosa had a bacteriostasis rate of 99.6% or more. Therefore, the antibacterial metal nitride coating composition of the present invention does have a relatively high antibacterial effect on the surface of the device.
於實施例六中，抗菌性合金鍍膜組成物中之抗菌材料係選用銅，而合金中的金屬元素係由鐵、鈷、鉻、鎳、鋁以及釩等七種金屬元素所組成，而非金屬元素則選用硼。其中，如上表一所示，銅的原子百分比成分為10.2%，而鐵、鈷、鉻、鎳、鋁、釩以及硼的原子百分比成分依序為21.1%、0.5%、27.7%、28.4%、5.6%、0.5%以及5.6%。此外，此實施例中更包含少量的氧(0.2%)與氮(0.2%)等非金屬元素。 In the sixth embodiment, the antibacterial material in the antibacterial alloy coating composition is copper, and the metal element in the alloy is composed of seven metal elements such as iron, cobalt, chromium, nickel, aluminum and vanadium, and not metal. The element is boron. Wherein, as shown in Table 1 above, the atomic percentage component of copper is 10.2%, and the atomic percentage components of iron, cobalt, chromium, nickel, aluminum, vanadium and boron are sequentially 21.1%, 0.5%, 27.7%, 28.4%, 5.6%, 0.5%, and 5.6%. Further, this embodiment further contains a small amount of non-metallic elements such as oxygen (0.2%) and nitrogen (0.2%).
依前述比例配置好一抗菌性合金鍍膜組成物，配置完成後再依如實施例一中所述之真空電弧熔煉法製備成一靶材，接著，將此靶材置放於射頻磁控濺鍍機上進行一真空濺鍍製程，以於一不鏽鋼基板的表面上進行薄膜鍍膜製程。詳細的製備方法步驟如實施例一所述，故不在此多加贅述。 An antibacterial alloy coating composition is disposed according to the above ratio, and after the configuration is completed, a target material is prepared by vacuum arc melting as described in the first embodiment, and then the target is placed on a radio frequency magnetron sputtering machine. A vacuum sputtering process is performed to perform a thin film coating process on the surface of a stainless steel substrate. The detailed preparation method steps are as described in the first embodiment, so they are not described here.
再者，對抗菌性合金屬氮化物鍍膜進行抗菌試驗，由抗菌試驗結果可得知，抗菌性合金屬氮化物鍍膜之金黃葡萄球菌、大腸桿菌、克氏肺炎桿菌以及綠膿桿菌等，且其抑菌率亦高達99.99%以上。因此，本發明之抗菌性合金屬氮化物鍍膜組成物，其鍍膜於器材表面上確實具有相當高的抗菌效果。 Furthermore, the antibacterial metal nitride coating film is subjected to an antibacterial test, and it is known from the antibacterial test results that the antibacterial metal nitride coated film is Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae, and Pseudomonas aeruginosa, and the like The inhibition rate is also as high as 99.99%. Therefore, the antibacterial metal nitride coating composition of the present invention does have a relatively high antibacterial effect on the surface of the device.
於實施例七中，抗菌性合金鍍膜組成物中之抗菌材料係選用銅與銀，而合金中的金屬元素係由鐵、鈷、鉻、鎳、鋁以及釩等七種金屬元素所組成，而非金屬元素則係選用硼。其中，如上表一所示，銅與銀的原子百分比成分為2.3%及13.9%，而鐵、鈷、鉻、鎳、鋁、釩以及硼的原子百分比成分依序為33.5%、6.7%、0.6%、16.7%、6.9%、8.9%以及10.2%。此外，此實施例中更包含少量的氧(0.2%)與氮(0.1%)等非金屬元素。 In the seventh embodiment, the antibacterial material in the antibacterial alloy coating composition is copper and silver, and the metal element in the alloy is composed of seven metal elements such as iron, cobalt, chromium, nickel, aluminum and vanadium. Non-metallic elements are selected from boron. Among them, as shown in Table 1 above, the atomic percentage components of copper and silver are 2.3% and 13.9%, while the atomic percentage components of iron, cobalt, chromium, nickel, aluminum, vanadium and boron are 33.5%, 6.7%, and 0.6, respectively. %, 16.7%, 6.9%, 8.9%, and 10.2%. Further, this embodiment further contains a small amount of a non-metallic element such as oxygen (0.2%) and nitrogen (0.1%).
依前述比例配置好一抗菌性合金鍍膜組成物，配置完成後再依如實施例一中所述之真空電弧熔煉法製備成一靶材，接著，將此靶材置放於射頻磁控濺鍍機上進行一真空濺鍍製程，以於一不鏽鋼基板的表面上進行薄膜鍍膜製程。詳細的製備方法步驟如實施例一所述，故不在此多加贅述。 An antibacterial alloy coating composition is disposed according to the above ratio, and after the configuration is completed, a target material is prepared by vacuum arc melting as described in the first embodiment, and then the target is placed on a radio frequency magnetron sputtering machine. A vacuum sputtering process is performed to perform a thin film coating process on the surface of a stainless steel substrate. The detailed preparation method steps are as described in the first embodiment, so they are not described here.
再者，對抗菌性合金屬氮化物鍍膜進行抗菌試驗。由結果得知，抗菌性合金屬氮化物鍍膜之金黃葡萄球菌、大腸桿菌、克氏肺炎桿菌以及綠膿桿菌等，且其抑菌率亦高達99.2%以上。因此，本發明之抗菌性合金屬氮化物鍍膜組成物，其鍍膜於器材表面上確實具有相當高的抗菌效果。 Furthermore, an antibacterial metal nitride coating film was subjected to an antibacterial test. From the results, it was found that the antibacterial metal nitride coated with Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae, and Pseudomonas aeruginosa, and the bacteriostatic rate was as high as 99.2% or more. Therefore, the antibacterial metal nitride coating composition of the present invention does have a relatively high antibacterial effect on the surface of the device.
於實施例八中，抗菌性合金鍍膜組成物中之抗菌材料係選用銅，而合金中的金屬合金係由鐵、鈷、鉻、鎳、鋁以及釩等七種金屬元素所組成，而非金屬元素則係選用硼。其中，如上表一所示，銅的原子百分比成分為5.4%，而鐵、鈷、鉻、鎳、鋁、釩以及硼的原子百分比成分依序為18.7%、1.2%、25.4%、0.7%、16.5%、15.4%以及16.4%。此外，此實施例中更包含少量的氧(0.2%)與氮(0.1%)等非金屬元素。 In the eighth embodiment, the antibacterial material in the antibacterial alloy coating composition is copper, and the metal alloy in the alloy is composed of seven metal elements such as iron, cobalt, chromium, nickel, aluminum and vanadium, and not metal. The element is boron. Wherein, as shown in Table 1 above, the atomic percentage component of copper is 5.4%, and the atomic percentage components of iron, cobalt, chromium, nickel, aluminum, vanadium and boron are 18.7%, 1.2%, 25.4%, 0.7%, respectively. 16.5%, 15.4%, and 16.4%. Further, this embodiment further contains a small amount of a non-metallic element such as oxygen (0.2%) and nitrogen (0.1%).
依前述比例配置好一抗菌性合金鍍膜組成物，配置完成後再依如實施例一中所述之真空電弧熔煉法製備成一靶材，接著，將此靶材置放於射頻磁控濺鍍機上進行一真空濺鍍製程，以於一不鏽鋼基板的表面上進行薄膜鍍膜製程。詳細的製備方法步驟如實施例一所述，故不在此多加贅述。 An antibacterial alloy coating composition is disposed according to the above ratio, and after the configuration is completed, a target material is prepared by vacuum arc melting as described in the first embodiment, and then the target is placed on a radio frequency magnetron sputtering machine. A vacuum sputtering process is performed to perform a thin film coating process on the surface of a stainless steel substrate. The detailed preparation method steps are as described in the first embodiment, so they are not described here.
再者，對抗菌性合金屬氮化物鍍膜進行抗菌試驗，由結果可得知，抗菌性合金屬氮化物鍍膜之金黃葡萄球菌、大腸桿菌、克氏肺炎桿菌以及綠膿桿菌等其抑菌率亦高達99.9%以上。因此，本發明之抗菌性合金屬氮化物鍍膜組成物，其鍍膜於器材表面上確實具有相當高的抗菌效果。 Furthermore, the antibacterial metal nitride coating film was subjected to an antibacterial test, and as a result, it was found that the antibacterial activity of the metal nitride-coated Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae, and Pseudomonas aeruginosa was also inhibited. Up to 99.9% or more. Therefore, the antibacterial metal nitride coating composition of the present invention does have a relatively high antibacterial effect on the surface of the device.
於實施例九中，抗菌性合金鍍膜組成物中之抗菌材料係選用銅與銀，而合金中的金屬合金係由鐵、鋁、釩以及鈦等五種金屬元素所組成，而非 金屬元素則係選用硼。其中，如上表一所示，銅與銀的原子百分比成分為25.6%及0.6%，而鐵、鋁、釩、鈦以及硼的原子百分比成分依序為34.4%、22.5%、1.5%、14.5%以及0.6%。此外，此實施例中更包含少量的氧(0.2%)與氮(0.1%)等非金屬元素。 In the ninth embodiment, the antibacterial material in the antibacterial alloy coating composition is copper and silver, and the metal alloy in the alloy is composed of five metal elements such as iron, aluminum, vanadium and titanium, instead of The metal element is boron. Wherein, as shown in Table 1 above, the atomic percentage components of copper and silver are 25.6% and 0.6%, and the atomic percentage components of iron, aluminum, vanadium, titanium and boron are sequentially 34.4%, 22.5%, 1.5%, 14.5%. And 0.6%. Further, this embodiment further contains a small amount of a non-metallic element such as oxygen (0.2%) and nitrogen (0.1%).
依前述比例配置好一抗菌性合金鍍膜組成物，配置完成後再依如實施例一中所述之真空電弧熔煉法製備成一靶材，接著，將此靶材置放於射頻磁控濺鍍機上進行一真空濺鍍製程，以於一不鏽鋼基板的表面上進行薄膜鍍膜製程。詳細的製備方法步驟如實施例一所述，故不在此多加贅述。 An antibacterial alloy coating composition is disposed according to the above ratio, and after the configuration is completed, a target material is prepared by vacuum arc melting as described in the first embodiment, and then the target is placed on a radio frequency magnetron sputtering machine. A vacuum sputtering process is performed to perform a thin film coating process on the surface of a stainless steel substrate. The detailed preparation method steps are as described in the first embodiment, so they are not described here.
再者，對抗菌性合金屬氮化物鍍膜進行抗菌試驗，抗菌性合金屬氮化物鍍膜之金黃葡萄球菌、大腸桿菌、克氏肺炎桿菌以及綠膿桿菌等其抑菌率亦高達99.999%以上。因此，本發明之抗菌性合金屬氮化物鍍膜組成物，其鍍膜於器材表面上確實具有相當高的抗菌效果。 Furthermore, the antibacterial metal nitride coating film was subjected to an antibacterial test, and the antibacterial rate of the metal nitride-coated Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae, and Pseudomonas aeruginosa was as high as 99.999% or more. Therefore, the antibacterial metal nitride coating composition of the present invention does have a relatively high antibacterial effect on the surface of the device.
於實施例十中，抗菌性合金鍍膜組成物中之抗菌材料係選用銅與銀，而合金中的金屬元素係由鐵、鈷、鉻以及鋁等四種金屬元素所組成，且合金更包含例如氧與氮等非金屬元素。其中，如上表一所示，銅與銀的原子百分比成分為24.5%及2.3%，而鐵、鈷、鉻以及鋁的原子百分比成分依序為20.5%、5.6%、7.5%以及31.6%。 In the tenth embodiment, the antibacterial material in the antibacterial alloy coating composition is copper and silver, and the metal element in the alloy is composed of four metal elements such as iron, cobalt, chromium and aluminum, and the alloy further comprises, for example. Non-metallic elements such as oxygen and nitrogen. Among them, as shown in Table 1 above, the atomic percentage components of copper and silver are 24.5% and 2.3%, and the atomic percentage components of iron, cobalt, chromium and aluminum are 20.5%, 5.6%, 7.5% and 31.6%, respectively.
依前述比例配置好一抗菌性合金鍍膜組成物，配置完成後再依如實施例一中所述之真空電弧熔煉法製備成一靶材，接著，將此靶材置放於射頻磁控濺鍍機上，並且於分壓為7.9%之氧氣以及0.1%之氮氣下，進行一真空濺鍍製程，以於一不鏽鋼基板的表面上進行薄膜鍍膜製程。詳細的製備方法步驟如實施例一所述，故不在此多加贅述。 An antibacterial alloy coating composition is disposed according to the above ratio, and after the configuration is completed, a target material is prepared by vacuum arc melting as described in the first embodiment, and then the target is placed on a radio frequency magnetron sputtering machine. A vacuum sputtering process was performed on a surface of a stainless steel substrate by performing a vacuum sputtering process under a partial pressure of 7.9% oxygen and 0.1% nitrogen. The detailed preparation method steps are as described in the first embodiment, so they are not described here.
接著，對抗菌性合金屬氮化物鍍膜進行抗菌試驗。抗菌性合金屬氮化物鍍膜之金黃葡萄球菌、大腸桿菌、克氏肺炎桿菌以及綠膿桿菌等其抑菌率亦高達99.999%以上。因此，本發明之抗菌性合金屬氮化物鍍膜組成物，其鍍膜於器材表面上確實具有相當高的抗菌效果。 Next, an antibacterial metal nitride coating film was subjected to an antibacterial test. The antibacterial and metal nitride coatings of Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae and Pseudomonas aeruginosa are also up to 99.999%. Therefore, the antibacterial metal nitride coating composition of the present invention does have a relatively high antibacterial effect on the surface of the device.
由上述之試驗結果可得知，利用本發明之抗菌性合金鍍膜組 成物所製備而成的抗菌合金鍍膜，抗菌試驗結果可得知，抗菌性合金屬鍍膜之金黃葡萄球菌、大腸桿菌、克氏肺炎桿菌以及綠膿桿菌等，其抗菌率皆高達5.2，且其抑菌率亦高達99.6%以上。因此，本發明之抗菌性合金屬氮化物鍍膜組成物，其鍍膜於器材表面上確實具有相當高的抗菌效果。再者，本發明之抗菌性合金鍍膜組成物所製備而成的抗菌合金鍍膜，且其硬度也可高達10Gpa以上。因此，可利用本發明之特殊配方的抗菌提高改變此等器材之硬度，更能大幅提高其表面的抗菌效果，進而能提昇器材之應用性。 It can be known from the above test results that the antibacterial alloy coating group of the present invention is utilized. The antibacterial alloy coating prepared by the product has antibacterial test results, and the antibacterial rate of the antibacterial metal coating of Staphylococcus aureus, Escherichia coli, Klebsiella pneumoniae and Pseudomonas aeruginosa is up to 5.2, and its antibacterial rate is as high as 5.2. The inhibition rate is also as high as 99.6%. Therefore, the antibacterial metal nitride coating composition of the present invention does have a relatively high antibacterial effect on the surface of the device. Furthermore, the antibacterial alloy coating film prepared by the antibacterial alloy coating composition of the present invention has a hardness of up to 10 GPa or more. Therefore, the antibacterial property of the special formulation of the present invention can be used to change the hardness of the devices, and the antibacterial effect of the surface can be greatly improved, thereby improving the applicability of the device.
雖然本發明之實施例揭露如上所述，然並非用以限定本發明，任何熟習相關技藝者，在不脫離本發明之精神和範圍內，舉凡依本發明申請範圍所述之形狀、構造、特徵及精神當可做些許之變更，因此本發明之專利保護範圍須視本說明書所附之申請專利範圍所界定者為準。 Although the embodiments of the present invention are disclosed above, it is not intended to limit the present invention, and those skilled in the art, regardless of the spirit and scope of the present invention, the shapes, structures, and features described in the scope of the present application. And the spirit of the invention is subject to change. Therefore, the scope of patent protection of the present invention is subject to the scope of the patent application attached to the specification.
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