TWI402161B - Lamination process and thin film structure - Google Patents
Lamination process and thin film structure Download PDFInfo
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- TWI402161B TWI402161B TW99140200A TW99140200A TWI402161B TW I402161 B TWI402161 B TW I402161B TW 99140200 A TW99140200 A TW 99140200A TW 99140200 A TW99140200 A TW 99140200A TW I402161 B TWI402161 B TW I402161B
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- 238000000034 method Methods 0.000 title claims description 37
- 238000003475 lamination Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 claims description 92
- 238000005096 rolling process Methods 0.000 claims description 56
- 239000003292 glue Substances 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 27
- 238000000576 coating method Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 7
- 230000001154 acute effect Effects 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 description 7
- 238000001179 sorption measurement Methods 0.000 description 5
- 238000011109 contamination Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
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- Adhesives Or Adhesive Processes (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
本發明是有關於一種貼合程序以及薄膜結構。This invention relates to a bonding procedure and film structure.
一般來說，顯示面板或是觸控面板在製作完成之後，都會在面板上貼附一層保護膜。而傳統保護膜的貼附方式是在面板之表面塗佈一層膠材之後，直接將保護膜放置在膠材上。接著再以滾輪將保護膜壓平以使保護膜貼附於面板上。Generally, after the display panel or the touch panel is completed, a protective film is attached to the panel. The traditional protective film is attached by applying a layer of glue on the surface of the panel and directly placing the protective film on the glue. The protective film is then flattened with a roller to attach the protective film to the panel.
但是，傳統貼合方法所存在的問題是，在滾輪滾壓的過程之中，膠材容易溢出而污染到滾輪或是機台。另外，在滾壓過程之中通常會加熱，而此加熱溫度往往會造成膠材產生內縮或是外擴，而導致保護膜的貼附不平整。另外，在滾壓過程之中，滾輪的滾壓也經常使保護膜產生皺折。However, the problem with the conventional fitting method is that during the rolling process of the roller, the rubber material easily overflows and contaminates the roller or the machine table. In addition, it is usually heated during the rolling process, and the heating temperature tends to cause the rubber material to shrink or expand, resulting in uneven adhesion of the protective film. In addition, during the rolling process, the rolling of the roller often causes the protective film to wrinkle.
本發明提供一種貼合程序與以此貼合程序製出的薄膜結構，其可以避免傳統貼合程序所存在的貼合不平整以及膠材污染機台等等問題。The present invention provides a bonding process and a film structure produced by the bonding process, which can avoid the problems of unevenness of the bonding of the conventional bonding process and contamination of the machine by the glue.
本發明提出一種貼合程序，其包括提供第一承載台以及第二承載台。將軟性薄膜設置在第一承載台上。將基板設置在第二承載台上，並且於基板上塗佈膠材。將第一承載台翻轉至第二承載台上方。將加壓滾輪壓著在軟性薄膜上，以使軟性薄膜與基板上之膠材接觸。以第一方向移動第二承載台並且以第二方向滾動加壓滾輪，以使軟性薄膜貼合於基板上，其中第一方向與第二方向相反，且第二承載台的移動速度與加壓滾輪的滾動速度相同。The present invention provides a fitting procedure that includes providing a first carrier and a second carrier. The flexible film is placed on the first stage. The substrate is placed on the second stage and the glue is coated on the substrate. The first carrier is flipped over to the second carrier. The pressure roller is pressed against the flexible film to bring the flexible film into contact with the glue on the substrate. Moving the second stage in the first direction and rolling the pressure roller in the second direction to adhere the flexible film to the substrate, wherein the first direction is opposite to the second direction, and the moving speed and pressure of the second stage The scroll speed of the scroll wheel is the same.
本發明提出一種薄膜結構，其包括基板、軟性薄膜以及膠材。軟性薄膜位於基板上。膠材位於基板與軟性薄膜之間，其中軟性薄膜具有滾壓區與非滾壓區，而滾壓區之膠材厚度會小於非滾壓區之膠材厚度。The present invention provides a film structure comprising a substrate, a flexible film, and a glue. The flexible film is on the substrate. The rubber material is located between the substrate and the soft film, wherein the soft film has a rolling zone and a non-rolling zone, and the thickness of the rubber in the rolling zone is smaller than the thickness of the rubber in the non-rolling zone.
基於上述，本發明使用特殊的接合程序將軟性薄膜貼合在基板上，可以解決傳統貼合程序所存在的貼合不平整以及膠材污染機台等等問題。Based on the above, the present invention uses a special bonding process to attach a flexible film to a substrate, which can solve the problems of unevenness of the conventional bonding process and contamination of the machine by the glue.
為讓本發明之上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.
圖1A至圖1G是根據本發明一實施例之貼合程序的示意圖。請參照圖1A，本實施例之貼合程序首先提供第一承載台100以及第二承載台200。接著，將軟性薄膜110設置在第一承載台100上，另外將基板220設置在第二承載台上200。軟性薄膜110包括有機聚合物材料，且基板220例如是玻璃基板、矽基板或是其他硬質基板。在此，軟性薄膜110是透過工具(例如是口字形叉具)而放置在第一承載台100之表面上。而基板220則是透過機械手臂放置於自第二承載台200伸出的頂針202上。1A through 1G are schematic views of a bonding procedure in accordance with an embodiment of the present invention. Referring to FIG. 1A, the bonding procedure of the present embodiment first provides a first carrier 100 and a second carrier 200. Next, the flexible film 110 is placed on the first stage 100, and the substrate 220 is additionally placed on the second stage 200. The flexible film 110 includes an organic polymer material, and the substrate 220 is, for example, a glass substrate, a germanium substrate, or other hard substrate. Here, the flexible film 110 is placed on the surface of the first stage 100 through a tool (for example, a chevron). The substrate 220 is placed on the ejector pin 202 extending from the second stage 200 through a robot arm.
根據本實施例，第一承載台100以及第二承載台200分別為加熱承載台。特別是，在貼合程序之中，第一承載台100以及第二承載台200的加熱溫度相同，如此可使第一承載台100上之軟性薄膜110以及第二承載台上200之基板220的溫度相同。According to this embodiment, the first carrier 100 and the second carrier 200 are respectively heating stations. In particular, in the bonding process, the heating temperatures of the first carrier 100 and the second carrier 200 are the same, so that the flexible film 110 on the first carrier 100 and the substrate 220 on the second carrier 200 can be The temperature is the same.
此外，在第一承載台100與第二承載台200上方更包括設置有加壓滾輪300，其後續是用來對軟性薄膜110進行滾壓程序。在此，加壓滾輪300為加熱式加壓滾輪，且所述加壓滾輪300的加熱溫度與第一承載台100以及第二承載台200的加熱溫度相同。舉例而言，第一承載台100、第二承載台200以及加壓滾輪300的加熱溫度例如是攝氏80度～90度，但本發明不限於此。上述溫度主要是根據軟性薄膜110以及基板220之材質選用而定，且所述溫度也與後續所使用的膠材成分有關。In addition, a pressure roller 300 is further disposed above the first stage 100 and the second stage 200, and is subsequently used to perform a rolling process on the flexible film 110. Here, the pressure roller 300 is a heated pressure roller, and the heating temperature of the pressure roller 300 is the same as the heating temperature of the first stage 100 and the second stage 200. For example, the heating temperatures of the first stage 100, the second stage 200, and the pressure roller 300 are, for example, 80 degrees Celsius to 90 degrees Celsius, but the present invention is not limited thereto. The above temperature is mainly determined according to the materials of the flexible film 110 and the substrate 220, and the temperature is also related to the composition of the subsequently used rubber.
另外，根據本實施例，第一承載台100以及第二承載台200分別為真空承載台，以使軟性薄膜110與基板220可分別被真空吸附在第一承載台100以及第二承載台200上，如圖1B所示，軟性薄膜110因為第一承載台100之真空吸附作用而固定在第一承載台100上，而第二承載台200之頂針202降下之後，基板220也會因為第二承載台200之真空吸附作用而固定在第二承載台200上。In addition, according to the embodiment, the first carrier 100 and the second carrier 200 are respectively vacuum carrying platforms, so that the flexible film 110 and the substrate 220 can be vacuum-adsorbed on the first carrier 100 and the second carrier 200, respectively. As shown in FIG. 1B, the flexible film 110 is fixed on the first stage 100 due to the vacuum adsorption of the first stage 100, and after the ejector pin 202 of the second stage 200 is lowered, the substrate 220 is also because of the second carrier. The vacuum absorption of the stage 200 is fixed to the second stage 200.
值得一提的是，本實施例可在將基板220放置到第二承載台200之前就先在基板220上塗佈膠材400，因此放置在第二承載台200上之基板220表面覆蓋有一層膠材400。根據其他實施例，膠材也可以在後續步驟才塗佈至基板220上。所述膠材400例如是熱溶膠。因此，透過第一承載台100、第二承載台200以及加壓滾輪300的加熱溫度可使得膠材400融化成液體狀態。It should be noted that, in this embodiment, the adhesive material 400 may be coated on the substrate 220 before the substrate 220 is placed on the second loading stage 200. Therefore, the surface of the substrate 220 placed on the second loading stage 200 is covered with a layer. Rubber material 400. According to other embodiments, the glue may also be applied to the substrate 220 at a subsequent step. The glue 400 is, for example, a hot melt. Therefore, the heating temperature of the first stage 100, the second stage 200, and the pressure roller 300 can cause the glue 400 to melt into a liquid state.
有關膠材400之塗佈進一步說明如下，再請參照圖3A，本實施例中，基板220具有塗佈區222，且膠材400是全面性地塗佈於基板220之塗佈區222。根據本發明之另一實施例，膠材400是局部地塗佈在基板220之塗佈區222內，而膠材400是在經過後續的滾壓程序之後才全面地覆蓋於基板220之塗佈區222內。無論是上述何種塗佈方式，膠材400塗佈的區域(塗佈區222)的面積是小於基板220的面積或是尺寸。The coating of the adhesive material 400 is further described below. Referring to FIG. 3A again, in the embodiment, the substrate 220 has a coating area 222, and the glue material 400 is applied to the coating area 222 of the substrate 220 in a comprehensive manner. According to another embodiment of the present invention, the glue 400 is partially coated in the coating zone 222 of the substrate 220, and the glue 400 is completely coated on the substrate 220 after a subsequent rolling process. Within area 222. Regardless of the coating method described above, the area of the coating area (coating area 222) to which the adhesive material 400 is applied is smaller than the area or size of the substrate 220.
請回到圖1B，在使軟性薄膜110與基板220分別固定在第一承載台100以及第二承載台200上之後，接著，可進一步進行一對位程序。如圖1C所示，為了確保軟性薄膜110與基板220分別準確地放置在第一承載台100以及第二承載台200之特定位置，本實施例更進一步進行對位補償程序，以使軟性薄膜110與第一承載台100對位，且使基板220與第二承載台200對位。上述之對位補償程序例如可採用影像處理裝置104(例如是CCD)來檢查軟性薄膜110與第一承載台100之間的對位誤差，並且採用影像處理裝置204(例如是CCD)來檢查基板220與第二承載台200之間的對位誤差。之後，便可直接藉由調整第一承載台100以及第二承載台200之間的相對位置來進行對位 補償。舉例來說，可藉由調整第二承載台200的X方向、Y方向以及R(角度)方向的位置來進行位置補償。Referring back to FIG. 1B, after the flexible film 110 and the substrate 220 are respectively fixed to the first stage 100 and the second stage 200, a one-way program can be further performed. As shown in FIG. 1C, in order to ensure that the flexible film 110 and the substrate 220 are accurately placed at specific positions of the first stage 100 and the second stage 200, the embodiment further performs a registration compensation process to make the flexible film 110. The first carrier 100 is aligned and the substrate 220 is aligned with the second carrier 200. The above-mentioned alignment compensation program may use, for example, an image processing device 104 (for example, a CCD) to check a registration error between the flexible film 110 and the first stage 100, and an image processing device 204 (for example, a CCD) to inspect the substrate. The alignment error between 220 and the second carrier 200. After that, the alignment can be directly performed by adjusting the relative position between the first stage 100 and the second stage 200. make up. For example, position compensation can be performed by adjusting the positions of the second stage 200 in the X direction, the Y direction, and the R (angle) direction.
之後，請參照圖1D，將第一承載台100翻轉至第二承載台200上方。根據本實施例，將第一承載台100翻轉至第二承載台200上方之方法例如是將第一承載台100原地翻轉180度，以使第一承載台100上之軟性薄膜110面向下方。另外，將第二承載台200往左邊移動，使得第二承載台200位於第一承載台100的下方，如圖1E所示，但本發明僅以將第二承載台200往左邊移動來說明第二承載台200位於第一承載台100之下方，但不以此為限，也可將第一承載台100移動至第二承載台200上方，以視各機台或是其他因素而設計調整。在本實施例中，此步驟是為將軟性薄膜110可位於基板220與膠材400之上方，以利進行後續之貼合步驟。在第一承載台100翻轉至第二承載台200上方之後，可進行對位補償，也就是將先前所計算出的對位誤差進行補償。舉例來說，此時，可藉由調整第二承載台200的X方向、Y方向以及R(角度)方向的位置來進行位置補償，以使第一承載台100上之軟性薄膜110與第二承載台200上的基板220精確對位。Thereafter, referring to FIG. 1D, the first stage 100 is flipped over the second stage 200. According to the present embodiment, the method of inverting the first stage 100 above the second stage 200 is, for example, flipping the first stage 100 180 degrees in situ so that the flexible film 110 on the first stage 100 faces downward. In addition, the second carrier 200 is moved to the left, so that the second carrier 200 is located below the first carrier 100, as shown in FIG. 1E, but the present invention only illustrates moving the second carrier 200 to the left. The second loading platform 200 is located below the first loading platform 100, but not limited thereto. The first loading platform 100 can also be moved above the second loading platform 200 to be designed and adjusted according to each machine or other factors. In this embodiment, the step is to place the flexible film 110 above the substrate 220 and the glue 400 to facilitate the subsequent bonding step. After the first carrier 100 is flipped over the second carrier 200, the alignment compensation can be performed, that is, the previously calculated alignment error is compensated. For example, at this time, the position compensation can be performed by adjusting the positions of the X-direction, the Y-direction, and the R (angle) direction of the second stage 200 to make the flexible film 110 and the second film on the first stage 100 The substrate 220 on the carrier 200 is accurately aligned.
根據本實施例，在將第一承載台100翻轉至第二承載台200上之後，第二承載台200與第一承載台100之間具有銳角夾角θ。換言之，第一承載台100與第二承載台200是彼此相對向但兩者不平行設置。第二承載台100與第一承載台200之間的銳角夾角可根據機台的狀態、薄膜的尺寸或是其他因素而加以調整。According to the present embodiment, after the first stage 100 is inverted onto the second stage 200, the second stage 200 and the first stage 100 have an acute angle θ. In other words, the first stage 100 and the second stage 200 are opposite to each other but are not disposed in parallel. The acute angle between the second stage 100 and the first stage 200 can be adjusted according to the state of the machine, the size of the film, or other factors.
接著，將加壓滾輪300壓著在軟性薄膜110上，以使軟性薄膜110之一端與基板220上之膠材400接觸，如圖1F所示。加壓滾輪300是壓著在一部份的軟性薄膜110上，使得軟性薄膜110之一端與基板220上之膠材400接觸。Next, the pressure roller 300 is pressed against the flexible film 110 such that one end of the flexible film 110 is in contact with the glue 400 on the substrate 220, as shown in FIG. 1F. The pressure roller 300 is pressed against a portion of the flexible film 110 such that one end of the flexible film 110 is in contact with the glue 400 on the substrate 220.
接著，請同時參照圖1F以及圖2，以第一方向214移動第二承載台200並且以第二方向302滾動加壓滾輪300，以使軟性薄膜110逐漸地貼合於基板220上。特別是，上述第一方向204與第二方向302相反，且第二承載台200的移動速度與加壓滾輪300的滾動速度相同。根據一實施例，上述之加壓滾輪300為雙驅動加壓滾輪。所謂雙驅動加壓滾輪指的是加壓滾輪300具有雙邊(左右)施力機制。而且在加壓滾輪300上還設置有壓力檢測計，以檢測加壓滾輪300左右驅動下兩側的壓力大小。如此一來，可以在滾壓過程之中同時進行壓力補償，以使左右壓力平均或一致。同時，在本實施例中，加壓滾輪300為一主動式滾輪，換句話說，加壓滾輪300受到驅動而其滾輪可自行滾動，而非需於第二承載台200上施力才可發生滾輪滾動，但不以此為限，於不同機台上的設計選擇，也可使用被動式之滾輪。Next, referring to FIG. 1F and FIG. 2 simultaneously, the second stage 200 is moved in the first direction 214 and the pressure roller 300 is rolled in the second direction 302 so that the flexible film 110 is gradually attached to the substrate 220. In particular, the first direction 204 is opposite to the second direction 302, and the moving speed of the second stage 200 is the same as the rolling speed of the pressure roller 300. According to an embodiment, the pressure roller 300 described above is a dual drive pressure roller. The so-called double-drive pressurized roller means that the pressure roller 300 has a bilateral (left and right) force applying mechanism. Further, a pressure detector is further disposed on the pressure roller 300 to detect the pressure of the two sides of the pressure roller 300 driven to the left and right. In this way, pressure compensation can be performed simultaneously during the rolling process so that the left and right pressures are averaged or consistent. Meanwhile, in the present embodiment, the pressure roller 300 is an active roller. In other words, the pressure roller 300 is driven and the roller can roll by itself, instead of applying force on the second carrier 200, the roller can be rolled. However, it is not limited to this. The design of different machines can also use passive rollers.
值得一提的是，本實施例之第一承載台100為分段式真空承載台(如圖2A與圖2B所示)，第一承載台100具有多段真空吸附裝置101。因此，當第二承載台200以第一方向214移動時，藉由第一承載台100之多段真空吸附裝置101的分段真空調節，可使軟性薄膜110隨著第二承載台200的移動而逐漸脫離第一承載台100進而貼合於基板220上。另外，在上述之滾壓程序過程之中，可進一步利用夾持裝置250將軟性薄膜110之一端夾於第二承載台200上，以避免軟性薄膜110在加壓滾輪300的滾壓過程之中產生滑動。更詳細來說，如圖2A所示，當在第一承載台100翻轉至第二承載台200上方之後，夾持裝置250此時是朝向上方。接著，當要進行滾壓程序之前，可將夾持裝置往下扳動，如圖2B所示，以固定住軟性薄膜110之一端。但不以此為限，夾持裝置250也可在未進行固定作用時是朝向外側，經由轉向而再進行固定作用。然，在本實施例中，為了使軟性薄膜110之一端可以順利地被固定於第二承載台200上，因此，將軟性薄膜110設置在第一承載台100時，會將軟性薄膜110之一端預留部分面積，如圖2A所示，使其預留部分112凸出於第一承載台100且不貼附於第一承載台100，以利於後續夾持機構250夾持步驟之進行。It is worth mentioning that the first carrying platform 100 of the embodiment is a segmented vacuum carrying platform (as shown in FIGS. 2A and 2B), and the first loading platform 100 has a multi-stage vacuum adsorption device 101. Therefore, when the second stage 200 moves in the first direction 214, the soft film 110 can be moved along with the movement of the second stage 200 by the segmental vacuum adjustment of the plurality of vacuum adsorption devices 101 of the first stage 100. Gradually detached from the first stage 100 and attached to the substrate 220. In addition, during the rolling process described above, one end of the flexible film 110 may be further clamped to the second stage 200 by the clamping device 250 to prevent the soft film 110 from being rolled during the rolling process of the pressure roller 300. Produces a slip. In more detail, as shown in FIG. 2A, after the first stage 100 is flipped over the second stage 200, the clamping device 250 is now facing upward. Next, before the rolling process is to be performed, the holding device can be pulled downward, as shown in Fig. 2B, to fix one end of the flexible film 110. However, not limited thereto, the holding device 250 may be oriented toward the outside when not being fixed, and may be further fixed by steering. However, in this embodiment, in order to allow one end of the flexible film 110 to be smoothly fixed to the second stage 200, when the flexible film 110 is disposed on the first stage 100, one end of the flexible film 110 is provided. A portion of the area is reserved, as shown in FIG. 2A, such that the reserved portion 112 protrudes from the first stage 100 and is not attached to the first stage 100 to facilitate the clamping step of the subsequent clamping mechanism 250.
在持續圖1F所示之移動第二承載台200以及滾動加壓滾輪300，直到軟性薄膜110完全脫離第一承載台100而完全貼附在基板220上之後，如圖1G所示，第二承載台200之頂針202再度升起，以使基板220離開第二承載台200之表面。接著，機械手臂將取走貼附有軟性薄膜110之基板220。根據本實施例，上述貼附有軟性薄膜110之基板220可接著進一步進行紫外光照射，以使軟性薄膜110與基板220之間的膠材固化。After the second loading stage 200 and the rolling pressure roller 300 are continued as shown in FIG. 1F, after the flexible film 110 is completely detached from the first stage 100 and completely attached to the substrate 220, as shown in FIG. 1G, the second carrier The ejector pin 202 of the table 200 is raised again to move the substrate 220 away from the surface of the second stage 200. Next, the robot arm will remove the substrate 220 to which the flexible film 110 is attached. According to the embodiment, the substrate 220 to which the flexible film 110 is attached may be further irradiated with ultraviolet light to cure the glue between the flexible film 110 and the substrate 220.
值得一提的是，在上述將軟性薄膜110貼合在基板220上之後，如圖3B所示，實際上基板220的尺寸大於軟性薄膜110的尺寸，更進一步來說，在本實施例中，軟性薄膜110之邊緣與基板220的邊緣相距5 mm～15mm(即D1等於5 mm～15mm)。而由圖3B可知，軟性薄膜110的尺寸實際上也小於膠材400塗佈的面積。It is to be noted that, after the flexible film 110 is attached to the substrate 220 as described above, as shown in FIG. 3B, the size of the substrate 220 is actually larger than the size of the flexible film 110. Further, in the present embodiment, The edge of the flexible film 110 is 5 mm to 15 mm from the edge of the substrate 220 (i.e., D1 is equal to 5 mm to 15 mm). As can be seen from FIG. 3B, the size of the flexible film 110 is actually smaller than the area coated by the glue 400.
另外，如圖3C所示，在將軟性薄膜110貼合在基板220上之滾壓程序之過程中，加壓滾輪300的滾壓區310的範圍小於軟性薄膜110貼附於基板220上的範圍，也就是加壓滾輪300之滾壓區310的範圍小於軟性薄膜110的尺寸。更進一步來說，在本實施例中，加壓滾輪300之滾壓區310的邊緣與軟性薄膜110之邊緣相距2 mm～5mm(即D2等於2 mm~5mm)。In addition, as shown in FIG. 3C, in the rolling process of bonding the flexible film 110 to the substrate 220, the range of the rolling zone 310 of the pressure roller 300 is smaller than the range in which the flexible film 110 is attached to the substrate 220. That is, the range of the rolling zone 310 of the pressure roller 300 is smaller than the size of the flexible film 110. Furthermore, in the present embodiment, the edge of the rolling zone 310 of the pressure roller 300 is spaced from the edge of the flexible film 110 by 2 mm to 5 mm (i.e., D2 is equal to 2 mm to 5 mm).
承上所述，由於本實施例膠材400塗佈的面積小於基板220的尺寸，因此，膠材400在滾壓過程之中，基板220具有能夠容納溢膠的空間，使得膠材400可以溢到基板220上而降低污染到承載台100、200的機會。另外，因為軟性薄膜110的尺寸小於基板220的尺寸且加壓滾輪300的滾壓區310的範圍小於軟性薄膜110的尺寸，因此膠材400不但不會污染到承載台100、200，也不會污染到加壓滾輪300。另外，因為軟性薄膜110的尺寸小於基板220的尺寸且加壓滾輪300的滾壓區310的範圍小於軟性薄膜110的尺寸，因此在滾壓的過程之中或之後，膠材400也不會有內縮以及外擴的問題產生。As described above, since the area coated by the rubber material 400 of the embodiment is smaller than the size of the substrate 220, the substrate 400 has a space capable of accommodating the glue during the rolling process, so that the rubber material 400 can overflow. The substrate 220 is placed to reduce the chance of contamination to the stage 100, 200. In addition, since the size of the flexible film 110 is smaller than the size of the substrate 220 and the range of the rolling zone 310 of the pressure roller 300 is smaller than the size of the flexible film 110, the rubber material 400 does not contaminate the carrier 100, 200, nor Contaminated to the pressure roller 300. In addition, since the size of the flexible film 110 is smaller than the size of the substrate 220 and the range of the rolling zone 310 of the pressure roller 300 is smaller than the size of the flexible film 110, the rubber material 400 does not have during or after the rolling process. The problems of indentation and expansion have arisen.
由上述貼合程序所形成的薄膜結構如圖4所示，其包括基板220、軟性薄膜110以及膠材400。軟性薄膜110位於基板220上，而膠材400位於基板220與軟性薄膜110之間，其中軟性薄膜110具有滾壓區310與非滾壓區320。上述滾壓區310指的是在滾壓程序之中加壓滾輪接觸的範圍，而非滾壓區320則是滾壓程序之中加壓滾輪不會接觸滾壓的範圍。本實施例中，由於在滾壓程序中加壓滾輪不會全面滾壓軟性薄膜110以及膠材400所在之處。因此，在上述滾壓程序之後，位於滾壓區310之膠材400的厚度T1會小於位於非滾壓區320之膠材400的厚度T2。The film structure formed by the above bonding process is as shown in FIG. 4, and includes a substrate 220, a flexible film 110, and a glue 400. The flexible film 110 is located on the substrate 220, and the glue 400 is located between the substrate 220 and the flexible film 110. The flexible film 110 has a rolling zone 310 and a non-rolling zone 320. The above-described rolling zone 310 refers to the range in which the pressure roller contacts during the rolling process, and the non-rolling zone 320 is the range in which the pressing roller does not contact the rolling in the rolling process. In this embodiment, since the pressure roller does not fully roll the flexible film 110 and the location of the glue 400 in the rolling process. Therefore, after the above-described rolling process, the thickness T1 of the rubber material 400 located in the rolling zone 310 may be smaller than the thickness T2 of the rubber material 400 located in the non-rolling zone 320.
更進一步來說，上述膠材400塗佈的範圍大於軟性薄膜110的尺寸，且膠材400塗佈的範圍小於基板220的尺寸。然，在本實施例中，滾壓區310的邊緣與軟性薄膜100之邊緣相距2 mm～5mm，而基板220的尺寸大於軟性薄膜110的尺寸，且軟性薄膜110之邊緣與基板220的邊緣相距5 mm～15mm(如圖3B以及圖3C所示)。Furthermore, the range in which the above-mentioned rubber material 400 is applied is larger than the size of the flexible film 110, and the range in which the rubber material 400 is coated is smaller than the size of the substrate 220. However, in this embodiment, the edge of the rolling zone 310 is spaced from the edge of the flexible film 100 by 2 mm to 5 mm, and the size of the substrate 220 is larger than the size of the flexible film 110, and the edge of the flexible film 110 is spaced from the edge of the substrate 220. 5 mm to 15 mm (as shown in Fig. 3B and Fig. 3C).
非滾壓區320一般又稱為無效區，其在後續會以切割程序切除，而所保留下來的滾壓區310通常又可稱為有效區。由於非滾壓區320(無效區)在後續程序會加以切除，因此即使該處的膠材400厚度較厚，也不影響滾壓區310(有效區)內之軟性薄膜的平整度。The non-rolling zone 320 is also commonly referred to as an inactive zone, which is subsequently cut by a cutting procedure, and the remaining rolling zone 310 is often referred to as an active zone. Since the non-rolling zone 320 (invalid zone) is removed in a subsequent procedure, even if the thickness of the rubber material 400 there is thick, the flatness of the soft film in the rolling zone 310 (effective zone) is not affected.
綜上所述，本發明使用特殊的接合程序將軟性薄膜貼合在基板上，可以解決傳統貼合程序所存在的貼合不平整以及膠材污染機台等等問題。另外，因為膠材塗佈區的面積小於基板的尺寸，因此若膠材在滾壓過程之中若發生溢膠之狀況，其所溢出的膠材仍保持滯留於基板上，而不會污染到承載台。此外，因為軟性薄膜的尺寸小於基板的尺寸且加壓滾輪的滾壓區的範圍小於軟性薄膜的尺寸，因此膠材不但不會污染到承載台，也不會污染到加壓滾輪，而且膠材也不會有內縮以及外擴的問題產生。In summary, the present invention uses a special bonding procedure to attach a flexible film to a substrate, which can solve the problems of unevenness of the conventional bonding process and contamination of the machine by the glue. In addition, since the area of the coating area of the rubber material is smaller than the size of the substrate, if the glue material is in a state of overflow during the rolling process, the glue material overflowing remains on the substrate without being contaminated. Carrying platform. In addition, since the size of the flexible film is smaller than the size of the substrate and the range of the rolling zone of the pressure roller is smaller than the size of the soft film, the rubber material not only does not contaminate the loading table, but also does not contaminate the pressure roller, and the rubber material There will be no problems with retraction and expansion.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.
100．．．第一承載台100. . . First carrier
101．．．多段真空吸附裝置101. . . Multi-stage vacuum adsorption device
104．．．影像處理裝置104. . . Image processing device
110．．．軟性薄膜110. . . Soft film
112．．．預留部分112. . . Reserved part
200．．．第二承載台200. . . Second carrier
202．．．頂針202. . . thimble
204．．．影像處理裝置204. . . Image processing device
214．．．移動方向214. . . Direction of movement
220．．．基板220. . . Substrate
222．．．塗佈區222. . . Coating zone
250．．．夾持裝置250. . . Clamping device
300．．．加壓滾輪300. . . Pressurized roller
302．．．滾動方向302. . . Rolling direction
310．．．滾壓區310. . . Rolling zone
320．．．非滾壓區320. . . Non-rolling zone
400．．．膠材400. . . Plastic material
D1、D2．．．距離D1, D2. . . distance
T1、T2．．．厚度T1, T2. . . thickness
圖1A至圖1G是根據本發明一實施例之貼合程序的示意圖。1A through 1G are schematic views of a bonding procedure in accordance with an embodiment of the present invention.
圖2A與圖2B是圖1E步驟之詳細圖示。2A and 2B are detailed illustrations of the steps of Fig. 1E.
圖3A至圖3C是將軟性薄膜接合於基板上的上視圖。3A to 3C are top views of a flexible film bonded to a substrate.
圖4是根據本發明一實施例之薄膜結構的剖面示意圖。4 is a cross-sectional view of a film structure in accordance with an embodiment of the present invention.
100．．．第一承載台100. . . First carrier
101．．．多段真空吸附裝置101. . . Multi-stage vacuum adsorption device
110．．．軟性薄膜110. . . Soft film
200．．．第二承載台200. . . Second carrier
220．．．基板220. . . Substrate
250．．．夾持裝置250. . . Clamping device
300．．．加壓滾輪300. . . Pressurized roller
400．．．膠材400. . . Plastic material
Claims (17)
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| KR101335272B1 (en) * | 2013-05-21 | 2013-11-29 | 주식회사 에스아이 플렉스 | Subsidiary for fpcb laminated attaching method |
| CN103745953A (en) * | 2013-12-31 | 2014-04-23 | 深圳市华星光电技术有限公司 | Manufacturing method of flexible OLED (organic light emitting diode) panel |
| CN104530342B (en) * | 2015-01-09 | 2017-08-08 | 京东方科技集团股份有限公司 | Diazo resin, photoetching compositions and its compound method |
| CN105513500B (en) | 2016-02-04 | 2018-07-10 | 京东方科技集团股份有限公司 | The notacoria attaching method and device of a kind of flexible base board |
| CN105690971B (en) * | 2016-02-04 | 2017-11-07 | 京东方科技集团股份有限公司 | A kind of applying method of notacoria |
| CN108673869A (en) * | 2018-06-13 | 2018-10-19 | 珠海凯蒂亚智能设备制造有限公司 | A kind of film attaching device |
| CN108943677B (en) * | 2018-06-13 | 2020-10-23 | 珠海凯蒂亚智能设备制造有限公司 | Film attaching method |
| CN109830617A (en) * | 2019-01-14 | 2019-05-31 | 深圳市华星光电半导体显示技术有限公司 | Abutted equipment |
| CN110712361B (en) * | 2019-07-12 | 2025-02-11 | 厦门京嘉光电科技有限公司 | Film splicing equipment and film splicing method |
| TWI707776B (en) * | 2019-12-30 | 2020-10-21 | 輝能科技股份有限公司 | Air-floating thin film bonding apparatus and its air-floating roller |
| CN111900106B (en) * | 2020-06-30 | 2022-03-08 | 中国电子科技集团公司第五十五研究所 | Large-area flexible substrate InP HBT device and preparation method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN102173171A (en) | 2011-09-07 |
| CN102173171B (en) | 2013-08-21 |
| TW201221341A (en) | 2012-06-01 |
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