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TWI496211B - - Google Patents

Info

Publication number
TWI496211B
TWI496211B TW101127194A TW101127194A TWI496211B TW I496211 B TWI496211 B TW I496211B TW 101127194 A TW101127194 A TW 101127194A TW 101127194 A TW101127194 A TW 101127194A TW I496211 B TWI496211 B TW I496211B
Authority
TW
Taiwan
Application number
TW101127194A
Other languages
Chinese (zh)
Other versions
TW201405655A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW101127194A priority Critical patent/TW201405655A/en
Publication of TW201405655A publication Critical patent/TW201405655A/en
Application granted granted Critical
Publication of TWI496211B publication Critical patent/TWI496211B/zh

Links

TW101127194A 2012-07-27 2012-07-27 Gas etching device with multiple chambers TW201405655A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101127194A TW201405655A (en) 2012-07-27 2012-07-27 Gas etching device with multiple chambers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101127194A TW201405655A (en) 2012-07-27 2012-07-27 Gas etching device with multiple chambers

Publications (2)

Publication Number Publication Date
TW201405655A TW201405655A (en) 2014-02-01
TWI496211B true TWI496211B (en) 2015-08-11

Family

ID=50550108

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101127194A TW201405655A (en) 2012-07-27 2012-07-27 Gas etching device with multiple chambers

Country Status (1)

Country Link
TW (1) TW201405655A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170219104A1 (en) * 2016-02-02 2017-08-03 Micron Technology, Inc. Three-way valve and method for using the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200725728A (en) * 2005-12-22 2007-07-01 United Microelectronics Corp Etching apparatus and etching method
US7279431B2 (en) * 2003-06-18 2007-10-09 Semitool, Inc. Vapor phase etching MEMS devices
US20080135517A1 (en) * 2006-12-11 2008-06-12 Tokyo Electron Limited Method and apparatus for ashing a substrate using carbon dioxide
TW201126603A (en) * 2009-05-01 2011-08-01 Tokyo Electron Ltd Plasma process apparatus and plasma process method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7279431B2 (en) * 2003-06-18 2007-10-09 Semitool, Inc. Vapor phase etching MEMS devices
TW200725728A (en) * 2005-12-22 2007-07-01 United Microelectronics Corp Etching apparatus and etching method
US20080135517A1 (en) * 2006-12-11 2008-06-12 Tokyo Electron Limited Method and apparatus for ashing a substrate using carbon dioxide
TW201126603A (en) * 2009-05-01 2011-08-01 Tokyo Electron Ltd Plasma process apparatus and plasma process method

Also Published As

Publication number Publication date
TW201405655A (en) 2014-02-01

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