TWI495136B - Solar cell and method of manufacturing same - Google Patents
Solar cell and method of manufacturing same Download PDFInfo
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- TWI495136B TWI495136B TW100126088A TW100126088A TWI495136B TW I495136 B TWI495136 B TW I495136B TW 100126088 A TW100126088 A TW 100126088A TW 100126088 A TW100126088 A TW 100126088A TW I495136 B TWI495136 B TW I495136B
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- H—ELECTRICITY
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/30—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells
- H10F19/31—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising thin-film photovoltaic cells having multiple laterally adjacent thin-film photovoltaic cells deposited on the same substrate
- H10F19/33—Patterning processes to connect the photovoltaic cells, e.g. laser cutting of conductive or active layers
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- H—ELECTRICITY
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- H—ELECTRICITY
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- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
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- H—ELECTRICITY
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- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
- H10F77/219—Arrangements for electrodes of back-contact photovoltaic cells
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Description
本發明係關於一種太陽能電池及其製造方法。The present invention relates to a solar cell and a method of manufacturing the same.
太陽能電池係為一種設備,用以利用半導體特性轉換光能為電能。A solar cell is a device that converts light energy into electrical energy using semiconductor characteristics.
太陽能電池具有PN接面結構,其中正(P)型半導體接合負(N)型半導體。當太陽光入射到具有這種結構的太陽能電池上時,入射的太陽光線所保留的能量於半導體中產生電洞與電子,此時,PN接面中產生的電場令電洞(+)向p型半導體方向移動,令電子(-)向N型半導體方向移動,由此產生電位充電,從而引發電流。The solar cell has a PN junction structure in which a positive (P) type semiconductor is bonded to a negative (N) type semiconductor. When sunlight is incident on a solar cell having such a structure, the energy retained by the incident solar rays generates holes and electrons in the semiconductor. At this time, the electric field generated in the PN junction causes the hole (+) to p. The direction of the semiconductor shifts, causing the electrons (-) to move toward the N-type semiconductor, thereby generating potential charging, thereby inducing a current.
這種太陽能電場被劃分為基板型太陽能電池與薄膜型太陽能電池。Such a solar electric field is classified into a substrate type solar cell and a thin film type solar cell.
基板型太陽能電池係為一種針對基板使用材料例如矽製造的太陽能電池,薄膜型太陽能電池係為一種針對基板使用材料例如玻璃以薄膜的形式形成半導體所製造的太陽能電池。The substrate type solar cell is a solar cell manufactured by using a material such as ruthenium for a substrate, and the thin film type solar cell is a solar cell manufactured by forming a semiconductor in the form of a film for a substrate using a material such as glass.
與薄膜型太陽能電池相比,基板型太陽能電池表現出略微優秀的效率,但是缺點在於在處理方面厚度最小化受限,以及由於使用的昂貴的半導體基板增加了製造成本。The substrate type solar cell exhibits slightly superior efficiency as compared with the thin film type solar cell, but has disadvantages in that thickness is minimized in terms of handling, and manufacturing cost is increased due to the use of an expensive semiconductor substrate.
與基板型太陽能電池相比,薄膜型太陽能電池表現出略低的效率,但是可被製造為很小的厚度,使用低廉的材料,由此降低製造成本,以及適合大批量生產。Thin film type solar cells exhibit a slightly lower efficiency than substrate type solar cells, but can be manufactured to a small thickness, use inexpensive materials, thereby reducing manufacturing costs, and being suitable for mass production.
薄膜型太陽能電池係透過以下步驟被製造,於基板例如玻璃上形成前電極(front electrode),於該前電極上形成半導體層,以及於該半導體層上形成背電極(back electrode)。因為前電極形成光接收面,光線入射於其上,所以透明導電材料例如氧化鋅(ZnO)用於前電極。由於透明導電材料的電阻的緣故,隨著基板尺寸的增加,缺點在於電能損耗也隨之增加。The thin film type solar cell is manufactured by forming a front electrode on a substrate such as glass, forming a semiconductor layer on the front electrode, and forming a back electrode on the semiconductor layer. Since the front electrode forms a light receiving face on which light is incident, a transparent conductive material such as zinc oxide (ZnO) is used for the front electrode. Due to the resistance of the transparent conductive material, as the size of the substrate increases, the disadvantage is that the power loss also increases.
因此,薄膜型太陽能電池一般被設計為複數個單位電池串列連接之結構,以最小化透明導電材料之電阻所導致的電能損耗。Therefore, a thin film type solar cell is generally designed as a structure in which a plurality of unit cells are connected in series to minimize power loss caused by resistance of a transparent conductive material.
「第1a圖」、「第1b圖」、「第1c圖」、「第1d圖」、「第1e圖」以及「第1f圖」所示係為具有複數個單位電池串列連接之結構之習用薄膜太陽能電池之製造方法之剖面圖。"1a", "1b", "1c", "1d", "1e", and "1f" are structures with a plurality of unit cell strings connected. A cross-sectional view of a method of manufacturing a conventional thin film solar cell.
請參考「第1a圖」,前電極20形成於基板10上。Referring to "FIG. 1a", the front electrode 20 is formed on the substrate 10.
請參考「第1b圖」,為了劃分前電極20為複數個單位前電極,藉由雷射刻劃製程(P1)清除前電極20之預定區域以形成第一溝槽(t1)。Referring to FIG. 1b, in order to divide the front electrode 20 into a plurality of unit front electrodes, a predetermined region of the front electrode 20 is removed by a laser scribing process (P1) to form a first trench (t1).
請參考「第1c圖」,半導體層30形成於包含前電極20之基板10之整個表面上方。Referring to "FIG. 1c", the semiconductor layer 30 is formed over the entire surface of the substrate 10 including the front electrode 20.
請參考「第1d圖」,為了劃分半導體層30為複數個單位半導體層,藉由雷射刻劃製程(P2)清除半導體層30之預定區域以形成第二溝槽(t2)。Referring to FIG. 1d, in order to divide the semiconductor layer 30 into a plurality of unit semiconductor layers, a predetermined region of the semiconductor layer 30 is removed by a laser scribing process (P2) to form a second trench (t2).
請參考「第1e圖」,背電極50形成於半導體層30上。Referring to "FIG. 1e", the back electrode 50 is formed on the semiconductor layer 30.
請參考「第1f圖」,藉由雷射刻劃製程(P1)清除背電極50與半導體層30之預定區域以形成第三溝槽(t3)。因此,可獲得具有複數個單位電池串列連接之結構之薄膜型太陽能電池。Referring to FIG. 1f, a predetermined region of the back electrode 50 and the semiconductor layer 30 is removed by a laser scribing process (P1) to form a third trench (t3). Therefore, a thin film type solar cell having a structure in which a plurality of unit cells are connected in series can be obtained.
這種薄膜型太陽能電池被分類為表板型(superstrate-type)太陽能電池以及基板型太陽能電池,其中表板型太陽能電池中太陽光直接地入射於例如玻璃的透明基板上,基板型太陽能電池中使用低透明度的撓性基板(flexible substrate),太陽光入射通過基板上層壓的透明導電層。Such a thin film type solar cell is classified into a superstrate-type solar cell and a substrate type solar cell, in which sunlight in a surface type solar cell is directly incident on a transparent substrate such as glass, in a substrate type solar cell Using a flexible substrate of low transparency, sunlight is incident through the transparent conductive layer laminated on the substrate.
「第2圖」所示係為習用表板型太陽能電池之雷射刻劃方法之示意圖。「第3圖」所示係為習用基板型太陽能電池之雷射刻劃方法之示意圖。The "Fig. 2" is a schematic diagram of a laser scribing method for a conventional solar panel. The "Fig. 3" is a schematic diagram of a laser scribing method for a conventional substrate type solar cell.
請參考「第2圖」,因為表板型太陽能電池使用雷射可通過之透明玻璃作為基板60,雷射通過基板60並且可清除基板60下方出現的透明導電層61。如圖所示,被清除的透明導電層61之微粒向基板60下分散,不會保留在透明導電層61上。Please refer to "Fig. 2" because the surface type solar cell uses a transparent glass through which the laser can pass, and the laser passes through the substrate 60 and the transparent conductive layer 61 appearing under the substrate 60 can be removed. As shown, the particles of the removed transparent conductive layer 61 are dispersed under the substrate 60 and do not remain on the transparent conductive layer 61.
其間,請參考「第3圖」,基板型太陽能電池使用具有低透光率之撓性基板70,由於雷射無法通過基板70,所以需要膜表面之處理。In the meantime, please refer to "Fig. 3". The substrate type solar cell uses the flexible substrate 70 having a low light transmittance. Since the laser cannot pass through the substrate 70, the treatment of the film surface is required.
背電極71與抗擴散層72依照此順序被層壓於基板70之上的狀態中,雷射被照射以清除背電極71與抗擴散層72。為此原因,雷射刻劃期間產生的微粒以殘留物的形式出現在抗擴散層72上或者被雷射之高能量所融解與清除而層壓於抗擴散層72的邊緣上,形成毛邊(毛邊)73。The back electrode 71 and the anti-diffusion layer 72 are laminated in a state above the substrate 70 in this order, and the laser is irradiated to remove the back electrode 71 and the anti-diffusion layer 72. For this reason, particles generated during laser scoring appear as residuals on the anti-diffusion layer 72 or are melted and removed by the high energy of the laser to be laminated on the edge of the anti-diffusion layer 72 to form a burr ( Burr)73.
「第4圖」所示係為習用基板型太陽能電池中雷射刻劃所產生的毛邊的示意圖。「第5圖」所示係為習用基板型太陽能電池中出現的毛邊所導致的問題的示意圖。The "Fig. 4" is a schematic view showing the burrs generated by laser scribing in a conventional substrate type solar cell. The "figure 5" is a schematic diagram showing the problem caused by the burrs occurring in the conventional substrate type solar cell.
請參考「第4圖」,基板型太陽能電池中P1雷射刻劃所產生的微粒被層壓於抗擴散層72之邊緣上,形成毛邊73。毛邊73具有幾百奈米(nm)之高度。Referring to "Fig. 4", particles generated by P1 laser scribing in a substrate type solar cell are laminated on the edge of the diffusion resistant layer 72 to form a burr 73. The burrs 73 have a height of several hundred nanometers (nm).
請參考「第5圖」,基板70上層壓的背電極71與抗擴散層72接受P1雷射刻劃,產生毛邊73。Referring to FIG. 5, the back electrode 71 and the anti-diffusion layer 72 laminated on the substrate 70 are subjected to P1 laser scribing to generate a burr 73.
P1雷射刻劃期間產生的毛邊73通過抗擴散層72上後續製程所形成的半導體層74,以及接觸前電極75。毛邊73接觸前電極75,導致前電極75接觸背電極71,由此干擾太陽能電池之絕緣以及導致太陽能電池之效率之劣化。在嚴重的情況下,毛邊73的缺陷在於妨礙太陽能電池正常作業。The burr 73 generated during the P1 laser scribing passes through the semiconductor layer 74 formed by the subsequent process on the anti-diffusion layer 72, and contacts the front electrode 75. The burr 73 contacts the front electrode 75, causing the front electrode 75 to contact the back electrode 71, thereby interfering with the insulation of the solar cell and causing deterioration of the efficiency of the solar cell. In severe cases, the burr 73 has the drawback of hindering the normal operation of the solar cell.
因此,本發明提供一種太陽能電池及其製造方法,實質上避免習知技術之限制與缺陷所導致的一或多個問題。Accordingly, the present invention provides a solar cell and method of fabricating the same that substantially obviate one or more of the problems caused by the limitations and disadvantages of the prior art.
本發明之目的在於提供一種太陽能電池以及太陽能電池之製造方法,以避免雷射刻劃期間產生的毛邊所導致的絕緣與效率之劣化。It is an object of the present invention to provide a solar cell and a method of manufacturing the same that avoids degradation of insulation and efficiency caused by burrs generated during laser scribing.
為了獲得本發明的這些目的和其他特徵,現對本發明作具體化和概括性的描述,本發明提供一種太陽能電池之製造方法,包含:於基板上形成背電極;於背電極上形成抗擴散層;完成首次雷射刻劃以劃分背電極為複數個單位背電極;沿首次雷射刻劃所形成的第一線之一側完成二次雷射刻劃,這樣二次雷射刻劃之處理區域與第一線重疊以清除首次雷射刻劃所產生的毛邊;以及沿第一線之另一側完成三次雷射刻劃,這樣三次雷射刻劃之處理區域與第一線重疊以清除毛邊。The present invention provides a method for fabricating a solar cell comprising: forming a back electrode on a substrate; forming an anti-diffusion layer on the back electrode in order to obtain the object and other features of the present invention. The first laser scribe is performed to divide the back electrode into a plurality of unit back electrodes; the second laser scribe is performed along one side of the first line formed by the first laser scribe, so that the second laser scribe is processed The area overlaps the first line to remove the burrs generated by the first laser scoring; and three laser scribings are performed along the other side of the first line such that the processing area of the three laser scoring overlaps the first line to clear Burst.
二次雷射刻劃與三次雷射刻劃同時或依序被完成。The second laser scribe is completed simultaneously or sequentially with three laser scribes.
假設二次雷射刻劃形成的線被定義為第二線,三次雷射刻劃形成的線被定義為第三線,則第二線與第三線的寬度係為第一線的寬度的1/2或更少。It is assumed that the line formed by the second laser scribe is defined as the second line, and the line formed by the three-shot laser scribe is defined as the third line, and the width of the second line and the third line is 1/ of the width of the first line. 2 or less.
第二線及第三線的寬度可能與該第一線的寬度重疊大約10微米(μm)或更多。The width of the second and third lines may overlap the width of the first line by about 10 micrometers (μm) or more.
第一線具有大約50至大約60微米之寬度,第二線與第三線具有大約20至大約30微米之寬度。The first line has a width of from about 50 to about 60 microns and the second line and the third line have a width of from about 20 to about 30 microns.
與首次雷射刻劃相比,二次雷射刻劃與三次雷射刻劃係依照低頻以及低功率被執行。Compared to the first laser scoring, the second laser scoring and the three laser scoring are performed in accordance with low frequency and low power.
基板係為從鋁箔、SUS箔以及半透明膜中選擇的撓性基板。The substrate is a flexible substrate selected from aluminum foil, SUS foil, and translucent film.
背電極係選自銀、鋁、銀+鋁、銀+鎂、銀+錳、銀+銻、銀+鋅、銀+鉬、銀+鎳、銀+銅以及銀+鋁+鋅組成的群組。The back electrode is selected from the group consisting of silver, aluminum, silver + aluminum, silver + magnesium, silver + manganese, silver + germanium, silver + zinc, silver + molybdenum, silver + nickel, silver + copper, and silver + aluminum + zinc. .
抗擴散層包含氧化鋅、摻硼氧化鋅(ZnO:B)、摻鋁氧化鋅(ZnO:Al)、鍺(Ge)、三氧化二鋁(Al2O3)或二氧化矽(SiO2)任意其一。The anti-diffusion layer contains any one of zinc oxide, boron-doped zinc oxide (ZnO: B), aluminum-doped zinc oxide (ZnO: Al), germanium (Ge), aluminum oxide (Al 2 O 3 ) or germanium dioxide (SiO 2 ).
依照另一方面,本發明提供之一種太陽能電池之製造方法包含:於基板上形成背電極;完成首次雷射刻劃以劃分背電極為複數個單位背電極;沿首次雷射刻劃所形成的第一線之一側完成二次雷射刻劃,這樣二次雷射刻劃之處理區域與第一線重疊,以清除首次雷射刻劃所產生的毛邊;以及沿第一線之另一側完成三次雷射刻劃,這樣三次雷射刻劃之處理區域與第一線重疊以清除毛邊。According to another aspect, a method for fabricating a solar cell according to the present invention includes: forming a back electrode on a substrate; completing a first laser scribe to divide the back electrode into a plurality of unit back electrodes; forming along the first laser scribe One side of the first line completes the second laser scribe, such that the treated area of the second laser scribe is overlapped with the first line to remove the burrs generated by the first laser scribe; and the other along the first line Three laser scribes are completed on the side, so that the processing area of the three laser scribes overlaps with the first line to remove the burrs.
依照另一方面,本發明提供之一種太陽能電池之製造方法包含:於基板上形成背電極;於背電極上形成抗擴散層;完成首次雷射刻劃以劃分背電極為複數個單位背電極;以及沿首次雷射刻劃形成的第一線之兩側完成二次雷射刻劃,這樣二次雷射刻劃之處理區域與第一線重疊,以清除首次雷射刻劃所產生的毛邊。According to another aspect, a method for fabricating a solar cell according to the present invention includes: forming a back electrode on a substrate; forming an anti-diffusion layer on the back electrode; completing a first laser scribe to divide the back electrode into a plurality of unit back electrodes; And performing secondary laser scribing on both sides of the first line formed along the first laser scoring, such that the processing area of the second laser scoring overlaps with the first line to remove the burrs generated by the first laser scribing .
完成二次雷射刻劃之區域之面積大於完成首次雷射刻劃之區域之面積。The area of the area where the second laser marking is completed is larger than the area of the area where the first laser marking is completed.
依照再一方面,本發明提供之一種太陽能電池包含:基板;背電極與抗擴散層,係透過基板上的第一溝槽被間隔;半導體層,係透過抗擴散層上的第二溝槽(t2)被間隔;以及前電極,係透過半導體層上的第三溝槽被間隔,其中鄰接第一溝槽之抗擴散層之邊緣包含低於抗擴散層之頂部之階梯。According to still another aspect, a solar cell according to the present invention includes: a substrate; a back electrode and an anti-diffusion layer are separated by a first trench on the substrate; and a semiconductor layer is transmitted through the second trench on the anti-diffusion layer ( T2) is spaced; and the front electrode is spaced through the third trench on the semiconductor layer, wherein the edge of the anti-diffusion layer adjacent to the first trench comprises a step lower than the top of the anti-diffusion layer.
階梯之寬度係為第一溝槽之寬度之1/4或更少。The width of the step is 1/4 or less of the width of the first groove.
可以理解的是,如上所述的本發明之概括說明和隨後所述的本發明之詳細說明均是具有代表性和解釋性的說明,並且是為了進一步揭示本發明之申請專利範圍。It is to be understood that the foregoing general description of the invention and the claims
以下將結合圖式部份描述本發明的較佳實施方式之配置與作用。當各圖式中用參考標號表示元件時,應該注意到雖然相同元件出現在不同圖式中,但是相同元件係由相同或類似的參考標號被表示。The configuration and function of the preferred embodiment of the present invention will be described in conjunction with the drawings. When the elements are denoted by reference numerals in the drawings, it should be noted that although the same elements are present in different drawings, the same elements are denoted by the same or similar reference numerals.
「第6a圖」、「第6b圖」、「第6c圖」、「第6d圖」、「第6e圖」、「第6f圖」、「第6g圖」、「第6h圖」、「第6i圖」以及「第6j圖」所示係為本發明一個實施例之太陽能電池之製造製程之示意圖。"6a", "6b", "6c", "6d", "6e", "6f", "6g", "6h", " 6i" and "6j" are schematic views showing a manufacturing process of a solar cell according to an embodiment of the present invention.
撓性太陽能電池係於低透光率之撓性基板上層壓電極層與半導體層而形成,撓性基板重量輕、可折疊並且可攜帶,由此撓性太陽能電池可以裝備天窗(sunroof)、遮陽板(sun visor)、遮帘等。撓性太陽能電池中,太陽光未入射到撓性基板上,而是入射於撓性基板上層壓的透明導電層上。這種太陽能電池也被稱為〞基板型太陽能電池〞The flexible solar cell is formed by laminating an electrode layer and a semiconductor layer on a flexible substrate having low light transmittance, and the flexible substrate is light, foldable, and portable, whereby the flexible solar cell can be equipped with a sunroof and a sunshade. Board (sun visor), blinds, etc. In a flexible solar cell, sunlight is not incident on the flexible substrate, but is incident on the transparent conductive layer laminated on the flexible substrate. This type of solar cell is also called a germanium substrate type solar cell.
在製造撓性太陽能電池時,使用雷射之圖案化製程係為相當重要的因素。撓型太陽能電池使用具有低透光率之撓性基板,因為雷射無法通過撓性基板,由此需要膜表面處理。雷射刻劃期間產生的微粒可能以殘餘物的形式出現,或者層壓於藉由雷射之高能量所融解或清除的電極層之邊緣上,產生毛邊。毛邊阻礙太陽能電池之絕緣,由此導致太陽能電池之效率之劣化以及妨礙太陽能電池之正常作業。因此,本發明提供一種太陽能電池之製造方法以有效地清除毛邊。The use of laser patterned processes is a very important factor in the manufacture of flexible solar cells. The flexible solar cell uses a flexible substrate having a low light transmittance because the laser cannot pass through the flexible substrate, thereby requiring film surface treatment. Particles generated during laser scoring may appear as residues or may be laminated to the edges of the electrode layer that is melted or removed by the high energy of the laser, producing burrs. The burrs hinder the insulation of the solar cells, thereby causing deterioration of the efficiency of the solar cells and hindering the normal operation of the solar cells. Accordingly, the present invention provides a method of manufacturing a solar cell to effectively remove burrs.
請參考「第6a圖」,背電極121與抗擴散層122係形成於撓性基板110(或基板)上。撓性基板110係指由具有撓性與低透光率之材料所製造的基板,因此不會透射雷射。撓性基板110由例如金屬或塑膠等材料製造,比如為鋁箔(aluminum foils)、SUS箔(SUS foils)、半透明膜等。Referring to "FIG. 6a", the back electrode 121 and the anti-diffusion layer 122 are formed on the flexible substrate 110 (or substrate). The flexible substrate 110 refers to a substrate made of a material having flexibility and low light transmittance, and thus does not transmit laser light. The flexible substrate 110 is made of a material such as metal or plastic, and is, for example, aluminum foils, SUS foils, translucent films, or the like.
背電極121係使用金屬或透明導電材料(transparent conductive material;TCO)形成於撓性基板110上,金屬例如為銀、鋁、銀+鋁、銀+鎂、銀+錳、銀+銻、銀+鋅、銀+鉬、銀+鎳、銀+銅或銀+鋁+鋅,透明導電材料例如為氧化銦錫(ITO)、氟摻雜氧化錫(fluorine doped tin oxide;FTO)、氧化鋅、摻硼氧化鋅(ZnO:B)、摻鋁氧化鋅(ZnO:Al)、Ag、二氧化錫(SnO2)、摻氟二氧化錫(SnO2:F)、氧化鋅:三氧化二鎵(ZnO:Ga2O3)、氧化鋅:三氧化二鋁(ZnO:Al2O3)或者二氧化錫:三氧化二銻(SnO2:Sb2O3)。The back electrode 121 is formed on the flexible substrate 110 using a metal or a transparent conductive material (TCO), such as silver, aluminum, silver + aluminum, silver + magnesium, silver + manganese, silver + germanium, silver + Zinc, silver + molybdenum, silver + nickel, silver + copper or silver + aluminum + zinc, transparent conductive materials such as indium tin oxide (ITO), fluorine doped tin oxide (FTO), zinc oxide, doped Zinc boride (ZnO: B), aluminum-doped zinc oxide (ZnO: Al), Ag, tin dioxide (SnO2), fluorine-doped tin dioxide (SnO2: F), zinc oxide: gallium trioxide (ZnO: Ga2O3) Zinc oxide: aluminum oxide (ZnO: Al2O3) or tin dioxide: antimony trioxide (SnO2: Sb2O3).
抗擴散層122避免背電極121之材料被擴散至背電極121上排列的半導體層150內,以及有助於提高太陽能電池的效率。抗擴散層122係由導電材料例如氧化鋅、摻硼氧化鋅(ZnO:B)、摻鋁氧化鋅(ZnO:Al)、鍺(Ge)、三氧化二鋁(Al2O3)或者二氧化矽(SiO2)製造。也可以省略抗擴散層122。The anti-diffusion layer 122 prevents the material of the back electrode 121 from being diffused into the semiconductor layer 150 arranged on the back electrode 121, and contributes to an improvement in the efficiency of the solar cell. The anti-diffusion layer 122 is made of a conductive material such as zinc oxide, boron-doped zinc oxide (ZnO: B), aluminum-doped zinc oxide (ZnO: Al), germanium (Ge), aluminum oxide (Al 2 O 3 ) or cerium oxide (SiO 2 ). ) Manufacturing. The anti-diffusion layer 122 may also be omitted.
接下來,完成首次雷射刻劃以劃分背電極121為複數個單位背電極。雷射刻劃不需要遮罩以劃分背電極121為複數個單位背電極,由此在薄膜型太陽能電池之製造製程中具有經濟優勢。Next, the first laser scribe is completed to divide the back electrode 121 into a plurality of unit back electrodes. The laser scribing does not require a mask to divide the back electrode 121 into a plurality of unit back electrodes, thereby having an economic advantage in the manufacturing process of the thin film type solar cell.
撓性基板110係由不會透射雷射光之材料而製造。為此原因,透過直接地照射雷射至背電極121與抗擴散層122,執行首次雷射刻劃。The flexible substrate 110 is fabricated from a material that does not transmit laser light. For this reason, the first laser scoring is performed by directly irradiating the laser to the back electrode 121 and the anti-diffusion layer 122.
請參考「第6b圖」,第一溝槽t1形成於首次雷射刻劃所清除的區域中。首次雷射刻劃所清除的背電極121與抗擴散層122之微粒以殘餘物的形式出現在抗擴散層122上,或者被雷射的高能量融解以及層壓於第一溝槽t1兩側上出現的抗擴散層122之邊緣上,產生毛邊125。Please refer to "Fig. 6b", the first trench t1 is formed in the area cleared by the first laser scribing. The particles of the back electrode 121 and the anti-diffusion layer 122 removed by the first laser scoring appear as a residue on the anti-diffusion layer 122, or are melted by the high energy of the laser and laminated on both sides of the first trench t1. On the edge of the anti-diffusion layer 122 appearing thereon, a burr 125 is produced.
毛邊125具有幾百奈米之高度。請參考「第5圖」,毛邊73穿透半導體層74以及接觸前電極75,由此干擾太陽能電池之絕緣以及導致太陽能電池之效率之降低。The burrs 125 have a height of several hundred nanometers. Referring to "figure 5", the burr 73 penetrates the semiconductor layer 74 and contacts the front electrode 75, thereby interfering with the insulation of the solar cell and causing a decrease in the efficiency of the solar cell.
請參考「第6c圖」,完成二次雷射刻劃以清除第一溝槽t1一側上排列的毛邊125。二次雷射刻劃可以使用與首次雷射刻劃相同的雷射設備被執行。Please refer to "Fig. 6c" to complete the second laser scribing to remove the burrs 125 arranged on the side of the first trench t1. The second laser scribe can be performed using the same laser device as the first laser scribe.
請參考「第6d圖」,第一溝槽t1一側上出現的毛邊125透過二次雷射刻劃被清除。此時,抗擴散層122之邊緣之部份被清除,被清除的區域形成階梯126。Referring to "Fig. 6d", the burrs 125 appearing on the side of the first trench t1 are removed by the second laser scribe. At this time, a portion of the edge of the anti-diffusion layer 122 is removed, and the cleared region forms a step 126.
請參考「第6e圖」,三次雷射刻劃被完成以清除第一溝槽t1另一側上出現的毛邊125。三次雷射刻劃可以與二次雷射刻劃同時完成。三次雷射刻劃(三次laser scribing)可以使用與首次雷射刻劃相同的雷射設備被執行。Referring to "Fig. 6e", three laser scribings are completed to clear the burrs 125 appearing on the other side of the first trench t1. Three laser scribes can be completed simultaneously with the second laser scribe. Three laser scorings (three times laser scribing) can be performed using the same laser device as the first laser scoring.
請參考「第6f圖」,第一溝槽t1另一側上排列的毛邊125透過三次雷射刻劃被清除。此時,抗擴散層122之邊緣之部份被清除,被清除的區域形成階梯126。Referring to "Fig. 6f", the burrs 125 arranged on the other side of the first trench t1 are removed by three laser scribes. At this time, a portion of the edge of the anti-diffusion layer 122 is removed, and the cleared region forms a step 126.
請參考「第6g圖」,半導體層130形成於抗擴散層122上。半導體層130被形成從而具有NIP結構,其中n型半導體層、i型半導體層以及p型半導體層依照此順序被層壓。Referring to FIG. 6g, the semiconductor layer 130 is formed on the anti-diffusion layer 122. The semiconductor layer 130 is formed to have a NIP structure in which an n-type semiconductor layer, an i-type semiconductor layer, and a p-type semiconductor layer are laminated in this order.
請參考「第6h圖」,P2雷射刻劃被完成以劃分半導體層130為複數個單位半導體層。第二溝槽(t2)係透過P2雷射刻劃被形成。Referring to "Fig. 6h", the P2 laser scribe is completed to divide the semiconductor layer 130 into a plurality of unit semiconductor layers. The second trench (t2) is formed by P2 laser scribing.
請參考「第6i圖」,前電極140形成於包含第二溝槽t2之半導體層130上。前電極140包含太陽光入射於其上的表面,前電極140係由例如氧化鋅、摻硼氧化鋅(ZnO:B)、摻鋁氧化鋅(ZnO:Al)、二氧化錫(SnO2)、摻氟二氧化錫(SnO2:F)或氧化銦錫(Indium Tin Oxide;ITO)之透明導電材料製成。Referring to FIG. 6i, the front electrode 140 is formed on the semiconductor layer 130 including the second trench t2. The front electrode 140 includes a surface on which sunlight is incident, and the front electrode 140 is made of, for example, zinc oxide, boron-doped zinc oxide (ZnO: B), aluminum-doped zinc oxide (ZnO: Al), tin dioxide (SnO 2 ), or It is made of a transparent conductive material of fluorine tin dioxide (SnO2:F) or indium tin oxide (ITO).
請參考「第6j圖」,雷射刻劃被完成以劃分前電極140為複數個單位前電極。第三溝槽t3係透過P3雷射刻劃被形成。因此,太陽能電池具有複數個單位電池串列連接之結構。Referring to "Fig. 6j", the laser scribing is completed to divide the front electrode 140 into a plurality of unit front electrodes. The third trench t3 is formed by P3 laser scribing. Therefore, the solar cell has a structure in which a plurality of unit cells are connected in series.
如上所述,藉由雷射刻劃清除撓性基板110上排列的背電極121與抗擴散層122以形成第一溝槽t1之製程(此製程被稱為〞P1雷射刻劃〞)中,雷射的高能量所融解的微粒被層壓於抗擴散層122之邊緣上,產生毛邊125。在處理特別重要之材料之雷射刻劃製程中,毛邊125很嚴重。毛邊125應該被清除以絕緣太陽能電池。在習用情況下,毛邊125係透過額外的清洗製程被清除。As described above, the process of removing the back electrode 121 and the anti-diffusion layer 122 arranged on the flexible substrate 110 to form the first trench t1 by laser scribing (this process is referred to as 〞P1 laser scribe 〞) The high energy melted particles of the laser are laminated on the edges of the anti-diffusion layer 122 to produce a burr 125. In the laser scribing process for processing particularly important materials, the burrs 125 are severe. The burrs 125 should be removed to insulate the solar cells. In the conventional case, the burr 125 is removed through an additional cleaning process.
依照太陽能電池之準備方法,P1雷射刻劃期間產生的毛邊125可透過額外的二次與三次雷射刻劃製程使用首次雷射刻劃製程中使用的雷射而未使用任何其他的設備被清除。因此,可方便地解決毛邊125所導致的太陽能電池之絕緣與效率劣化之問題。According to the preparation method of the solar cell, the burr 125 generated during the P1 laser scribing process can be used by the additional second and third laser scribing processes using the laser used in the first laser scribing process without using any other equipment. Clear. Therefore, the problem of deterioration of insulation and efficiency of the solar cell caused by the burr 125 can be easily solved.
本發明之方法不需要額外的濕清洗製程以清除毛邊(副產品),由此減少了其中涉及的時間與成本。此外,對水敏感的撓性基板在濕清洗製程以後需要單獨的乾燥製程,但是本發明之方法省略了乾燥(drying)製程,由此減少了太陽能電池製造中涉及的時間與成本。The method of the present invention does not require an additional wet cleaning process to remove burrs (by-products), thereby reducing the time and cost involved therein. In addition, the water sensitive flexible substrate requires a separate drying process after the wet cleaning process, but the method of the present invention omits the drying process, thereby reducing the time and cost involved in solar cell fabrication.
P1雷射刻劃期間所產生的毛邊125透過一系列雷射處理被清除之實施例被應用以清除P1雷射刻劃期間所產生的毛邊及P2雷射刻劃期間所產生的毛邊,以及P3雷射刻劃期間所產生的毛邊,其中P2雷射刻劃被完成以劃分半導體層130為複數個單位半導體層,P3雷射刻劃被完成以劃分前電極140為複數個單位前電極140。The embodiment in which the burr 125 generated during the P1 laser scribing is removed by a series of laser processes is applied to remove the burrs generated during the P1 laser scribing and the burrs generated during the P2 laser scoring, and P3 The burrs generated during the laser scribing, wherein the P2 laser scribing is completed to divide the semiconductor layer 130 into a plurality of unit semiconductor layers, and the P3 laser scribing is completed to divide the front electrode 140 into a plurality of unit front electrodes 140.
「第7圖」所示係為本發明一個實施例之太陽能電池之製造方法中雷射刻劃之完成製程之示意圖。Fig. 7 is a schematic view showing the completion process of laser scribing in the method for manufacturing a solar cell according to an embodiment of the present invention.
請參考「第6a圖」、「第6b圖」、「第6c圖」、「第6d圖」、「第6e圖」、「第6f圖」、「第6g圖」、「第6h圖」、「第6i圖」、「第6j圖」以及「第7圖」,首先,背電極121係透過首次雷射刻劃被清除以劃分背電極121為複數個單位背電極。其上形成有抗擴散層122之背電極121試圖包含抗擴散層122(請參考「第6a圖」)。Please refer to "6a", "6b", "6c", "6d", "6e", "6f", "6g", "6h", In the "6th drawing", the "6th drawing", and the "7th drawing", first, the back electrode 121 is removed by the first laser scribe to divide the back electrode 121 into a plurality of unit back electrodes. The back electrode 121 on which the anti-diffusion layer 122 is formed is intended to include the anti-diffusion layer 122 (refer to "Fig. 6a").
第一線L1係沿著首次雷射刻劃所清除的背電極121被形成。首次雷射刻劃以高頻率以及具有大寬度之高功率被執行。第一線L1具有50至60微米(μm.)之寬度(W1)。The first line L1 is formed along the back electrode 121 which is removed by the first laser scribing. The first laser scribing is performed with high frequency and high power with a large width. The first line L1 has a width (W1) of 50 to 60 micrometers (μm.).
然後,二次雷射刻劃被完成以清除首次雷射刻劃於第一線L1兩側其一處產生的毛邊,這樣二次雷射刻劃之處理區域與第一線L1重疊。透過設置雷射的中心為第一線L1之一側而執行二次雷射刻劃。與首次雷射刻劃相比,二次雷射刻劃係依照低頻以及小寬度之低功率被執行。Then, the second laser scribing is completed to clear the burrs generated by the first laser scribing on one side of the first line L1, such that the processing area of the second laser scribing overlaps with the first line L1. The second laser scribe is performed by setting the center of the laser to one side of the first line L1. Compared to the first laser scoring, the second laser scoring is performed in accordance with low frequency and low power of small width.
第二線L2係透過二次雷射刻劃被形成。第二線L2具有20至30微米(μm.)之寬度。此時,第一線L1與第二線L2重疊區域之寬度為10至15微米,係為第二線L2之寬度W2之1/2,係為第一線L1之寬度W1之1/4或更少。The second line L2 is formed by secondary laser scribing. The second line L2 has a width of 20 to 30 micrometers (μm.). At this time, the width of the overlapping area of the first line L1 and the second line L2 is 10 to 15 μm, which is 1/2 of the width W2 of the second line L2, which is 1/4 of the width W1 of the first line L1 or less.
然後,三次雷射刻劃被完成以清除首次雷射刻劃於第一線L1兩側之另一側所產生的毛邊,這樣三次雷射刻劃之處理區域與第一線L1重疊。透過設置雷射的中心作為第一線L1之另一側而執行三次雷射刻劃。與首次雷射刻劃相比,三次雷射刻劃係依照低頻以及小寬度之低功率被執行。Then, three laser scribings are completed to clear the burrs generated by the first laser scribing on the other side of the first line L1, such that the processing area of the three laser scoring overlaps the first line L1. Three laser scribings are performed by setting the center of the laser as the other side of the first line L1. Compared to the first laser scoring, the three-shot laser scoring is performed in accordance with low frequency and low power of small width.
第三線L3係透過三次雷射刻劃被形成。第三線L3具有20至30微米之寬度。此時,第一線L1與第二線L2重疊區域之寬度為10至15微米,係為第三線L3之寬度W3之1/2。The third line L3 is formed by three laser scoring. The third line L3 has a width of 20 to 30 microns. At this time, the width of the overlapping area of the first line L1 and the second line L2 is 10 to 15 μm, which is 1/2 of the width W3 of the third line L3.
這樣,透過完成三次雷射刻劃可有效地清除毛邊,這樣三次雷射刻劃之處理區域部份地與形成的第一線L1重疊。與首次雷射刻劃相比,當以低頻以及小寬度之低功率完成二次與三次雷射刻劃時,僅僅毛邊可有效地被清除,而不會在背電極121上產生任何影響。Thus, the burrs are effectively removed by performing three laser scribes such that the processing area of the three laser scribes partially overlaps the formed first line L1. When the second and third laser scribes are performed with low frequency and low power at a low power compared to the first laser scribe, only the burrs can be effectively removed without any influence on the back electrode 121.
「第8圖」所示係為「第7圖」所示一個實施例中毛邊透過雷射刻劃被清除之狀態之示意圖。The "Fig. 8" is a schematic view showing a state in which the burr is removed by laser scribing in an embodiment shown in Fig. 7.
請參考「第4圖」,毛邊73形成於抗擴散層72上。另一方面,請參考「第8圖」,抗擴散層122完全被清除,而其邊緣形成小階梯。Referring to "Fig. 4", a burr 73 is formed on the diffusion resistant layer 72. On the other hand, please refer to "Fig. 8", the anti-diffusion layer 122 is completely removed, and its edge forms a small step.
「第9圖」所示係為本發明一個實施例之太陽能電池之剖面圖。Fig. 9 is a cross-sectional view showing a solar cell according to an embodiment of the present invention.
基板110係由具有撓性且低透射率之材料製造。基板110可以由金屬或塑膠例如鋁箔、SUS箔、半透明膜等製造。The substrate 110 is made of a material having flexibility and low transmittance. The substrate 110 may be made of metal or plastic such as aluminum foil, SUS foil, translucent film, or the like.
背電極121形成於基板110上。背電極121由金屬或者透明導電材料(TCO)形成,金屬例如為銀、鋁、銀+鋁、銀十鎂、銀+錳、銀+銻、銀+鋅、銀+鉬、銀+鎳、銀+銅或銀+鋁+鋅,透明導電材料例如為氧化銦錫(ITO)、氟摻雜氧化錫(fluorine doped tin oxide;FTO)、氧化鋅、摻硼氧化鋅(ZnO:B)、摻鋁氧化鋅(ZnO:Al)、Ag、二氧化錫(SnO2)、摻氟二氧化錫(SnO2:F)、氧化鋅:三氧化二鎵(ZnO:Ga2O3)、氧化鋅:三氧化二鋁(ZnO:Al2O3)或者二氧化錫:三氧化二銻(SnO2:Sb2O3)。The back electrode 121 is formed on the substrate 110. The back electrode 121 is formed of a metal or a transparent conductive material (TCO) such as silver, aluminum, silver + aluminum, silver ten magnesium, silver + manganese, silver + germanium, silver + zinc, silver + molybdenum, silver + nickel, silver. + copper or silver + aluminum + zinc, transparent conductive materials such as indium tin oxide (ITO), fluorine doped tin oxide (FTO), zinc oxide, boron doped zinc oxide (ZnO: B), aluminum doped Zinc oxide (ZnO: Al), Ag, tin dioxide (SnO2), fluorine-doped tin dioxide (SnO2: F), zinc oxide: gallium oxide (ZnO: Ga2O3), zinc oxide: aluminum oxide (ZnO) :Al2O3) or tin dioxide: antimony trioxide (SnO2: Sb2O3).
抗擴散層122係形成於背電極121上。抗擴散層122避免背電極121的材料被擴散到半導體層內,由此提高太陽能電池的效率。抗擴散層122係由例如氧化鋅、摻硼氧化鋅、摻鋁氧化鋅、鍺(Ge)、三氧化二鋁(Al2O3)或二氧化矽(SiO2)製造。也可以省略抗擴散層122。The anti-diffusion layer 122 is formed on the back electrode 121. The anti-diffusion layer 122 prevents the material of the back electrode 121 from being diffused into the semiconductor layer, thereby improving the efficiency of the solar cell. The anti-diffusion layer 122 is made of, for example, zinc oxide, boron-doped zinc oxide, aluminum-doped zinc oxide, germanium (Ge), aluminum oxide (Al 2 O 3 ), or hafnium oxide (SiO 2 ). The anti-diffusion layer 122 may also be omitted.
背電極121與抗擴散層122係透過第一溝槽t1被間隔。第一溝槽t1係透過P1雷射刻劃被形成。The back electrode 121 and the anti-diffusion layer 122 are spaced apart through the first trench t1. The first trench t1 is formed by P1 laser scribing.
鄰接第一溝槽t1之抗擴散層122之邊緣具有低於抗擴散層122之階梯126。階梯126係透過一系列雷射處理被形成以清除P1雷射刻劃期間產生的毛邊。階梯126之寬度係為第一溝槽t1之寬度之1/4或更少。The edge of the anti-diffusion layer 122 adjacent to the first trench t1 has a step 126 lower than the anti-diffusion layer 122. Step 126 is formed through a series of laser processes to remove burrs generated during P1 laser scoring. The width of the step 126 is 1/4 or less of the width of the first trench t1.
在未形成抗擴散層122的情況下,鄰接第一溝槽t1之背電極121之邊緣具有階梯。In the case where the anti-diffusion layer 122 is not formed, the edge of the back electrode 121 adjacent to the first trench t1 has a step.
半導體層130係形成於包含第一溝槽t1之抗擴散層122上方。半導體層130具有NIP結構,其中n型半導體層、i型半導體層以及p型半導體層依照此順序被層壓。The semiconductor layer 130 is formed over the anti-diffusion layer 122 including the first trench t1. The semiconductor layer 130 has a NIP structure in which an n-type semiconductor layer, an i-type semiconductor layer, and a p-type semiconductor layer are laminated in this order.
半導體層130係透過第二溝槽(t2)被間隔。第二溝槽(t2)係透過P2雷射刻劃被形成。The semiconductor layer 130 is spaced through the second trench (t2). The second trench (t2) is formed by P2 laser scribing.
前電極140係形成於半導體層130上方。太陽光如射於前電極140之表面上,前電極140係由氧化鋅、摻硼氧化鋅(ZnO:B)、摻鋁氧化鋅(ZnO:Al)、二氧化錫(SnO2)、摻氟二氧化錫(SnO2:F)或氧化銦錫(ITO)等透明導電材料製成。The front electrode 140 is formed over the semiconductor layer 130. The sunlight is incident on the surface of the front electrode 140, and the front electrode 140 is made of zinc oxide, boron-doped zinc oxide (ZnO: B), aluminum-doped zinc oxide (ZnO: Al), tin dioxide (SnO2), fluorine-doped It is made of a transparent conductive material such as tin oxide (SnO2:F) or indium tin oxide (ITO).
前電極140係透過第三溝槽t3被間隔。第三溝槽t3係透過P3雷射刻劃被形成。The front electrodes 140 are spaced through the third trench t3. The third trench t3 is formed by P3 laser scribing.
「第10a圖」、「第10b圖」、「第10c圖」、「第10d圖」、「第10e圖」以及「第10f圖」所示係為本發明一個實施例之太陽能電池之製造製程之示意圖。與「第6a圖」、「第6b圖」、「第6c圖」、「第6d圖」、「第6e圖」以及「第6f圖」中所示實施例中相同的元件係由相同的參考標號表示,以及省略其詳細描述。"10a", "10b", "10c", "10d", "10e" and "10f" are manufacturing processes for solar cells according to an embodiment of the present invention. Schematic diagram. The same components as in the embodiment shown in "6a", "6b", "6c", "6d", "6e", and "6f" are given the same reference. The reference numerals are given, and detailed descriptions thereof are omitted.
請參考「第10a圖」,背電極121與抗擴散層122係形成於基板110上。然後,首次雷射刻劃被完成以劃分背電極121為複數個單位背電極。Referring to FIG. 10a, the back electrode 121 and the anti-diffusion layer 122 are formed on the substrate 110. Then, the first laser scribing is completed to divide the back electrode 121 into a plurality of unit back electrodes.
請參考「第10b圖」,第一溝槽t1係形成於透過首次雷射刻劃而清除的區域中。首次雷射刻劃所清除的背電極121與抗擴散層122的微粒以殘餘物的形式出現在抗擴散層122上,或者被雷射的高能量融解且層壓於第一溝槽t1兩側上出現的抗擴散層122的邊緣上,產生毛邊125。Please refer to "Fig. 10b", the first trench t1 is formed in the region cleared by the first laser scribing. The particles of the back electrode 121 and the anti-diffusion layer 122 removed by the first laser scribing appear as a residue on the anti-diffusion layer 122, or are melted by the high energy of the laser and laminated on both sides of the first trench t1. On the edge of the anti-diffusion layer 122 appearing thereon, a burr 125 is produced.
請參考「第10c圖」,二次雷射刻劃被完成以清除第一溝槽t1一側上排列的毛邊125。此時,毛邊125下方的背電極121與抗擴散層122被清除。二次雷射刻劃係使用與首次雷射刻劃相同的雷射設備被執行。Referring to "Fig. 10c", the second laser scribing is completed to clear the burrs 125 arranged on the side of the first trench t1. At this time, the back electrode 121 and the anti-diffusion layer 122 under the burr 125 are removed. The second laser scoring is performed using the same laser device as the first laser scoring.
請參考「第10d圖」,第一溝槽t1一側排列的毛邊125以及其下方排列的背電極121與抗擴散層122藉由二次雷射刻劃被清除。Referring to "Fig. 10d", the burrs 125 arranged on the side of the first trench t1 and the back electrode 121 and the anti-diffusion layer 122 arranged therebelow are removed by secondary laser scribing.
請參考「第10e圖」,三次雷射刻劃被完成以清除第一溝槽t1另一側上出現的毛邊125。此時,毛邊125下方出現的背電極121與抗擴散層122被清除。三次雷射刻劃與二次雷射刻劃可以同時被完成。三次雷射刻劃係使用與首次雷射刻劃相同的雷射設備被執行。Referring to "Fig. 10e", three laser scribings are completed to clear the burrs 125 appearing on the other side of the first trench t1. At this time, the back electrode 121 and the anti-diffusion layer 122 appearing under the burr 125 are removed. Three laser scribes and two laser scribes can be completed simultaneously. The three-shot laser scoring is performed using the same laser device as the first laser scoring.
請參考「第10f圖」,第一溝槽t1另一側排列的毛邊125以及毛邊125下方排列的背電極121與抗擴散層122藉由三次雷射刻劃被清除。Referring to FIG. 10f, the burrs 125 arranged on the other side of the first trench t1 and the back electrode 121 and the anti-diffusion layer 122 arranged under the burrs 125 are removed by three laser scribing.
因為毛邊125係連同毛邊125下方排列的背電極121與抗擴散層122透過二次與三次雷射刻劃被清除,所以本實施例與「第6a圖」、「第6b圖」、「第6c圖」、「第6d圖」、「第6e圖」以及「第6f圖」中所示的實施例不同。Since the burr 125 is removed along with the back electrode 121 and the anti-diffusion layer 122 arranged under the burr 125 by the second and third laser lithography, this embodiment and "Fig. 6a", "6b", "6c" The embodiments shown in Fig., "6d", "6e", and "6f" are different.
「第11a圖」、「第11b圖」、「第11c圖」以及「第11d圖」係為本發明另一實施例之太陽能電池之製造製程之示意圖。與「第6a圖」、「第6b圖」、「第6c圖」、「第6d圖」、「第6e圖」以及「第6f圖」所示實施例相同的元件係由相同的參考標號表示,以及省略其詳細描述。"11a", "11b", "11c" and "11d" are schematic views of a manufacturing process of a solar cell according to another embodiment of the present invention. The same elements as those in the embodiments shown in "6a," "6b," "6c," "6d," "6e," and "6f" are denoted by the same reference numerals. And a detailed description thereof is omitted.
請參考「第11a圖」,背電極121與抗擴散層122係形成於基板110上。然後,首次雷射刻劃被完成以劃分背電極121為複數個單位背電極。Referring to FIG. 11a, the back electrode 121 and the anti-diffusion layer 122 are formed on the substrate 110. Then, the first laser scribing is completed to divide the back electrode 121 into a plurality of unit back electrodes.
請參考「第11b圖」,第一溝槽t1(或者第一線)係形成於首次雷射刻劃所清除的區域中。首次雷射刻劃所清除的背電極121與抗擴散層122的微粒以殘餘物的形式出現在抗擴散層122上,或者被雷射的高能量融解且層壓於第一溝槽t1兩側上出現的抗擴散層122的邊緣上,產生毛邊125。Please refer to "Fig. 11b", the first trench t1 (or the first line) is formed in the area cleared by the first laser scribing. The particles of the back electrode 121 and the anti-diffusion layer 122 removed by the first laser scribing appear as a residue on the anti-diffusion layer 122, or are melted by the high energy of the laser and laminated on both sides of the first trench t1. On the edge of the anti-diffusion layer 122 appearing thereon, a burr 125 is produced.
請參考「第11c圖」,二次雷射刻劃被完成以清除第一溝槽t1兩側上排列的毛邊125。此時,僅僅毛邊125被清除,毛邊125下方排列的背電極121與抗擴散層122也被清除。Referring to "Fig. 11c", the second laser scribing is completed to clear the burrs 125 arranged on both sides of the first trench t1. At this time, only the burrs 125 are removed, and the back electrode 121 and the anti-diffusion layer 122 arranged under the burrs 125 are also removed.
二次雷射刻劃係沿著首次雷射刻劃形成的第一線連續地被完成,這樣二次雷射刻劃之處理區域與第一線重疊。因此,完成二次雷射刻劃之區域的面積大於完成首次雷射刻劃之區域的面積。二次雷射刻劃係使用與首次雷射刻劃相同或不同的設備被執行。The second laser scoring is continuously performed along the first line formed by the first laser scoring, such that the treated area of the second laser scoring overlaps the first line. Therefore, the area of the area where the second laser scribe is completed is larger than the area of the area where the first laser scribe is completed. The second laser scoring is performed using the same or a different device as the first laser scoring.
請參考「第11d圖」,第一線兩側排列的毛邊125以及毛邊125下方排列的背電極121與抗擴散層122係透過二次雷射刻劃被清除。Referring to FIG. 11d, the burrs 125 arranged on both sides of the first line and the back electrode 121 and the anti-diffusion layer 122 arranged under the burrs 125 are removed by the second laser scribe.
此實施例中,首次雷射刻劃於第一線兩側出現的毛邊125係透過二次雷射刻劃被清除,因此具有簡化製程且縮短製程時間的優點。In this embodiment, the burrs 125, which are first scribed on both sides of the first line, are removed by the second laser scribe, thereby simplifying the process and shortening the process time.
「第12圖」所示係為用於製造太陽能電池之習用設備與本發明設備之對比示意圖。Fig. 12 is a schematic view showing a comparison between a conventional device for manufacturing a solar cell and the device of the present invention.
請參考「第9圖」與「第12圖」,在習用設備之配置之示意圖中,用於形成背電極121之第一濺鍍機或化學氣相沈積設備被排列於基板110上。Referring to "Fig. 9" and "Fig. 12", in the schematic view of the configuration of the conventional device, the first sputtering machine or the chemical vapor deposition apparatus for forming the back electrode 121 is arranged on the substrate 110.
用於在背電極121上形成抗擴散層122的第二濺鍍機或化學氣相沈積設備被排列於第一濺鍍機或化學氣相沈積設備附近。A second sputtering machine or chemical vapor deposition apparatus for forming the anti-diffusion layer 122 on the back electrode 121 is arranged in the vicinity of the first sputtering machine or the chemical vapor deposition apparatus.
P1處理雷射被排列於第二濺鍍機或化學氣相沈積設備附近以完成P1雷射刻劃。The P1 processed laser is arranged adjacent to a second sputtering machine or chemical vapor deposition apparatus to complete the P1 laser scoring.
用於清除P1雷射刻劃期間產生的毛邊的清洗設備被排列於P1處理雷射附近。A cleaning device for removing burrs generated during P1 laser scribing is arranged near the P1 processing laser.
用於在抗擴散層122上形成半導體層130之電漿增強化學氣相沈積(plasma enhanced chemical vapor deposition;PECVD)設備被排列在清洗設備附近以清除毛邊。電漿增強化學氣相沈積係為一種藉由離子活化(ion activation)使用電漿沈積膜之方法。A plasma enhanced chemical vapor deposition (PECVD) apparatus for forming the semiconductor layer 130 on the anti-diffusion layer 122 is arranged in the vicinity of the cleaning device to remove the burrs. Plasma enhanced chemical vapor deposition is a method of depositing a film by plasma using ion activation.
用於完成P2雷射刻劃之P2處理雷射被排列於電漿增強化學氣相沈積設備附近。用於在半導體層130上形成前電極140之第三濺鍍機或化學氣相沈積設備被排列於P2處理雷射附近。用以完成P3雷射刻劃之P3處理雷射被排列於第三濺鍍機或化學氣相沈積設備附近。The P2 processed laser used to complete the P2 laser scoring is arranged adjacent to the plasma enhanced chemical vapor deposition apparatus. A third sputtering machine or chemical vapor deposition apparatus for forming the front electrode 140 on the semiconductor layer 130 is arranged in the vicinity of the P2 processing laser. The P3 processed laser used to complete the P3 laser scoring is arranged adjacent to the third sputtering machine or chemical vapor deposition apparatus.
其間,應用本發明之設備之配置示意圖中,電漿增強化學氣相沈積設備被排列於P1處理雷射附近,由此避免了用以清除毛邊之任意清洗設備之必要性。這就是P1雷射刻劃其間產生的毛邊可使用P1處理雷射透過首次、二次與三次雷射刻劃方便地被清除之原因。In the meantime, in the configuration diagram of the apparatus to which the present invention is applied, the plasma enhanced chemical vapor deposition apparatus is arranged in the vicinity of the P1 processing laser, thereby avoiding the necessity of cleaning any cleaning equipment for removing the burrs. This is why the burrs generated during the P1 laser scoring can be easily removed by first, second and third laser scoring using the P1 processed laser.
與用以清除毛邊的習用濕清洗以及乾燥製程相比,本發明提供一種太陽能電池之製造設備,其配置相當簡單。此外,本發明能夠大大縮短製造太陽能電池所需的總製程時間,由此降低製造成本。The present invention provides a solar cell manufacturing apparatus which is relatively simple in configuration as compared with conventional wet cleaning and drying processes for removing burrs. Furthermore, the present invention can greatly shorten the total process time required to manufacture a solar cell, thereby reducing manufacturing costs.
由上述顯然可知,本發明提供一種太陽能電池及其製造方法,其中太陽能電池之絕緣與效率之劣化可藉由一系列雷射處理透過清除P1雷射刻劃期間所產生的毛邊被避免。As apparent from the above, the present invention provides a solar cell and a method of fabricating the same, wherein the deterioration of the insulation and efficiency of the solar cell can be avoided by a series of laser processes by removing the burrs generated during the P1 laser scribing.
雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。在不脫離本發明之精神和範圍內,所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.
10...基板10. . . Substrate
20...前電極20. . . Front electrode
30...半導體層30. . . Semiconductor layer
t1...第一溝槽T1. . . First groove
t2...第二溝槽T2. . . Second groove
t3...第三溝槽T3. . . Third groove
50...背電極50. . . Back electrode
60...基板60. . . Substrate
61...透明導電層61. . . Transparent conductive layer
70...基板70. . . Substrate
71‧‧‧背電極71‧‧‧ Back electrode
72‧‧‧抗擴散層72‧‧‧Anti-diffusion layer
73‧‧‧毛邊73‧‧‧Mamma
74‧‧‧半導體層74‧‧‧Semiconductor layer
75‧‧‧前電極75‧‧‧ front electrode
110‧‧‧撓性基板110‧‧‧Flexible substrate
121‧‧‧背電極121‧‧‧Back electrode
122‧‧‧抗擴散層122‧‧‧Anti-diffusion layer
125‧‧‧毛邊125‧‧‧Mamma
126‧‧‧階梯126‧‧‧ ladder
130‧‧‧半導體層130‧‧‧Semiconductor layer
140‧‧‧前電極140‧‧‧ front electrode
L1‧‧‧第一線L1‧‧‧ first line
L2‧‧‧第二線L2‧‧‧ second line
L3‧‧‧第三線L3‧‧‧ third line
W1、W2、W3‧‧‧寬度W1, W2, W3‧‧‧ width
第1a圖至第1f圖所示係為具有複數個單位電池串列連接之結構之習用薄膜型太陽能電池之製造方法之剖面圖;1a to 1f are cross-sectional views showing a method of manufacturing a conventional thin film type solar cell having a structure in which a plurality of unit cells are connected in series;
第2圖所示係為習用表板型太陽能電池之雷射刻劃方法之示意圖;Figure 2 is a schematic view showing a laser scribing method for a conventional solar panel;
第3圖所示係為習用基板型太陽能電池之雷射刻劃方法之示意圖;Figure 3 is a schematic view showing a laser scribing method for a conventional substrate type solar cell;
第4圖所示係為習用基板型太陽能電池中雷射刻劃所產生的毛邊的示意圖;Figure 4 is a schematic view showing the burrs generated by laser scribing in a conventional substrate type solar cell;
第5圖所示係為習用基板型太陽能電池中毛邊所導致的問題的示意圖;Fig. 5 is a schematic view showing a problem caused by burrs in a conventional substrate type solar cell;
第6a圖至第6j圖所示係為本發明一個實施例之太陽能電池之製造製程之示意圖;6a to 6j are schematic views showing a manufacturing process of a solar cell according to an embodiment of the present invention;
第7圖所示係為本發明一個實施例之太陽能電池之製造方法中雷射刻劃製程之示意圖;Figure 7 is a schematic view showing a laser scribing process in a method of manufacturing a solar cell according to an embodiment of the present invention;
第8圖所示係為第7圖所示之一個實施例中毛邊透過雷射刻劃被清除之狀態之示意圖;Figure 8 is a schematic view showing a state in which the burr is removed by laser scribing in an embodiment shown in Figure 7;
第9圖所示係為本發明一個實施例之太陽能電池之剖面圖;Figure 9 is a cross-sectional view showing a solar cell according to an embodiment of the present invention;
第10a圖至第10f圖所示係為本發明一個實施例之太陽能電池之製造製程之示意圖;10a to 10f are schematic views showing a manufacturing process of a solar cell according to an embodiment of the present invention;
第11a圖至第11d圖所示係為本發明另一實施例之太陽能電池之製造製程之示意圖;以及11a to 11d are schematic views showing a manufacturing process of a solar cell according to another embodiment of the present invention;
第12圖所示係為用於製造太陽能電池之習用設備與本發明之設備之對比示意圖。Figure 12 is a schematic view showing a comparison between a conventional device for manufacturing a solar cell and the device of the present invention.
t1...第一溝槽T1. . . First groove
t2...第二溝槽T2. . . Second groove
t3...第三溝槽T3. . . Third groove
110...撓性基板110. . . Flexible substrate
121...背電極121. . . Back electrode
122...抗擴散層122. . . Anti-diffusion layer
126...階梯126. . . ladder
130...半導體層130. . . Semiconductor layer
140...前電極140. . . Front electrode
Claims (14)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| KR1020110054161A KR101243877B1 (en) | 2011-06-03 | 2011-06-03 | solar cell and method for manufacturing the same |
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| TW201251097A TW201251097A (en) | 2012-12-16 |
| TWI495136B true TWI495136B (en) | 2015-08-01 |
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| KR (1) | KR101243877B1 (en) |
| TW (1) | TWI495136B (en) |
| WO (1) | WO2012165689A1 (en) |
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| KR102423108B1 (en) * | 2015-06-11 | 2022-07-22 | 주성엔지니어링(주) | Thin film type solar cell and method for manufacturing the same |
| JP7005281B2 (en) * | 2017-10-31 | 2022-01-21 | 株式会社ディスコ | Processing method of work piece |
| CN111370502A (en) * | 2018-12-25 | 2020-07-03 | 北京铂阳顶荣光伏科技有限公司 | Solar cell module and its preparation method and scribing equipment |
| CN112599637B (en) * | 2020-12-09 | 2022-05-31 | 成都晔凡科技有限公司 | Method for manufacturing solar cell piece and solar cell piece |
| CN119589129A (en) * | 2024-12-20 | 2025-03-11 | 中科羲和(广东)科技有限公司 | Laser scribing method and device with cleaning function |
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| TW201015741A (en) * | 2008-09-22 | 2010-04-16 | Ulvac Inc | Method for manufacturing solar cell |
| KR20100137651A (en) * | 2009-06-23 | 2010-12-31 | 주성엔지니어링(주) | Thin film type solar cell and manufacturing method thereof |
| WO2011040780A2 (en) * | 2009-09-30 | 2011-04-07 | 엘지이노텍주식회사 | Solar power generation apparatus and manufacturing method thereof |
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| KR101169455B1 (en) * | 2008-09-22 | 2012-07-27 | 가부시키가이샤 아루박 | Fabrication method for a solar cell |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW201015741A (en) * | 2008-09-22 | 2010-04-16 | Ulvac Inc | Method for manufacturing solar cell |
| KR20100137651A (en) * | 2009-06-23 | 2010-12-31 | 주성엔지니어링(주) | Thin film type solar cell and manufacturing method thereof |
| WO2011040780A2 (en) * | 2009-09-30 | 2011-04-07 | 엘지이노텍주식회사 | Solar power generation apparatus and manufacturing method thereof |
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| KR20120134930A (en) | 2012-12-12 |
| TW201251097A (en) | 2012-12-16 |
| KR101243877B1 (en) | 2013-03-20 |
| WO2012165689A1 (en) | 2012-12-06 |
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