TWI494811B - Touch display and method for making touch display thereof - Google Patents

Description

Touch panel and touch panel manufacturing method

The present invention relates to a touch panel and a method for fabricating the touch panel. Specifically, the present invention relates to a reinforcing structure capable of increasing the protective effect of the decorative layer and enhancing the conductivity of the touch panel, a reinforcing manufacturing method thereof, and the like. The touch device of the reinforcing structure.

With the rapid development of science and technology, various forms of consumer electronic products, including palm-sized computers, handheld game consoles, and smart phones, are becoming more and more diversified, and the product life cycle is becoming shorter and shorter, and the folding design is also adopted. It is the mainstream of the market, and almost all of the electronic products in the folding design use a flexible printed circuit board as a circuit transmission device for folding. Because of its flexibility, light weight and thin thickness, it is particularly suitable for use. A consumer electronics product that is light, thin, and has a variable design and a movable structure.

According to the current industry manufacturers in the rear-end liquid crystal module (LCM) structural design, the backlight module (BLM) is the main core part of the product, and in the process of transportation or assembly, the product parts are often damaged due to careless operation. The situation happened. For example, as shown in the first figure, at the joint 12 (dotted line) between the conventional touch panel 10 and the flexible circuit board 11, a plurality of metal traces are disposed on the decorative layer 13 of the touch panel 10. 14. Electrically connected to the flexible circuit board 11 through an anisotropic conductive film (ACF). However, at the joint 12, the flexible circuit board 11 is often broken due to unavoidable bending and pulling. In turn, the damage and damage of the touch panel 10 are caused. Especially in this case, the joint 12 often has the effect of shearing or tearing, which causes the product to fail due to the disconnection, resulting in difficulty in product maintenance. The cost of disrupting and after-sales service has increased.

In order to improve this situation, please refer to FIG. 2A, which is a schematic cross-sectional view of a joint between a conventional touch panel and a flexible circuit board. As shown in the figure, the conventional technology generally fills a protective layer 23 on the decorative layer 21 between the metal traces 22 on the substrate 20 and covers a portion of each of the metal traces 22, thereby protecting the decorative layer of the touch panel. 21, thereby enhancing the joint strength of the joint. However, the protective layer 23 covering the metal traces 22 has poor adhesion, and is likely to cause damage to the upper protective layer 23; on the other hand, the conductive area of the metal traces 22 of the joints in contact with the conductive adhesive layer 24 is also made. Shrink, which in turn affects the electrical conductivity of the product. Moreover, when the metal traces 22 and the flexible circuit board 25 are thermally pressed by the conductive adhesive layer 24, the glue overflow phenomenon is often generated, which is disadvantageous for the electrical connection between the touch panel and the flexible circuit board 25. As shown in Figure B.

Therefore, in terms of demand, an ideal touch panel reinforcement structure, a touch panel reinforcement manufacturing method and a touch device thereof are designed to enhance the bonding between the touch panel and the flexible circuit board and the touch panel. The strength and enhance the conductivity of the product has become an urgent issue in the market.

In view of the above-mentioned problems of the prior art, the object of the present invention is to provide a touch panel and a method for manufacturing the touch panel, so as to solve the problem that the current touch panel and the flexible circuit board are broken due to assembly pulling or bending. The problem.

According to an aspect of the present invention, a touch panel includes: a substrate; a decorative layer formed on the substrate; and a metal wiring layer having a plurality of metal traces spaced apart from the decorative layer; A protective layer is formed on the decorative layer between the metal traces and does not cover an upper surface of each of the metal traces.

In the touch panel of the present invention, a flexible circuit board is further disposed on the metal wiring layer.

In the touch panel of the present invention, a conductive adhesive layer is further disposed between the flexible circuit board and the metal wiring layer and the protective layer.

In the touch panel of the present invention, a gap remains between a side surface of each of the metal traces and the protective layer.

In the touch panel of the present invention, the conductive adhesive layer is made of an anisotropic conductive paste.

In the touch panel of the present invention, the protective layer is formed on the decorative layer not provided with each of the metal traces.

According to another aspect of the present invention, a method for manufacturing a touch panel includes: providing a substrate; forming a decorative layer on the substrate; and providing a metal trace layer on the decorative layer, the metal trace layer having a plurality of a strip of metal traces disposed on the decorative layer; forming a protective layer on the decorative layer between the metal traces and not covering an upper surface of each of the metal traces; and providing a flexible circuit board On the metal trace layer and the protective layer

In the method of the present invention, a flexible circuit board is disposed on the metal wiring layer.

In the method of the present invention, a gap remains between a side surface of each of the metal traces and the protective layer.

In the method of the present invention, the protective layer is formed on the decorative layer not provided with each of the metal traces.

According to the above, the touch panel and the touch panel manufacturing method of the present invention have the following advantages: the protective layer on the decorative layer formed between the metal traces is used to enhance the protective effect of the decorative layer. And because the protective layer does not cover the upper surface of each metal trace, the contact area of the metal trace and the conductive paste is made larger, thereby improving the electrical conductivity of the subsequently connected flexible circuit board. Therefore, the design of the present invention can increase the possibility of the user purchasing the above product.

The foregoing aspects and other aspects of the present invention are based on the following non-limiting The detailed description of the specific embodiments and the accompanying drawings will be more apparent.

10‧‧‧Touch panel

11‧‧‧Soft circuit board

12‧‧‧ joints

13‧‧‧Decorative layer

14‧‧‧Metal routing

20‧‧‧Substrate

21‧‧‧Decorative layer

22‧‧‧Metal routing

23‧‧‧Protective layer

24‧‧‧ Conductive adhesive layer

25‧‧‧Soft circuit board

3‧‧‧ reinforcing structure

30‧‧‧ glass substrate

31‧‧‧Decorative layer

32‧‧‧Metal wiring layer

321‧‧‧Metal routing

33‧‧‧Protective layer

4‧‧‧Structural structure

40‧‧‧ glass substrate

41‧‧‧Decorative layer

42‧‧‧Metal wiring layer

421‧‧‧Metal routing

43‧‧‧Protective layer

44‧‧‧Electrical adhesive layer

45‧‧‧Soft circuit board

46‧‧‧ gap

501-504‧‧‧Steps

601-606‧‧‧Steps

The first figure is a schematic diagram of the interconnection between a conventional touch panel and a flexible circuit board.

The second A is a schematic cross-sectional view of a joint between a conventional touch panel and a flexible circuit board.

The second B diagram is a top view of the conductive adhesive layer overflowing between the conventional touch panel and the flexible circuit board.

The third figure is a schematic cross-sectional view of a reinforcing structure of the touch panel of the first embodiment of the present invention.

The fourth figure is a schematic cross-sectional view of a reinforcing structure of the touch panel of the second embodiment of the present invention.

Fifth Embodiment A flowchart of a method of reinforcing a touch panel of the present invention will be described in accordance with a first embodiment of the present invention.

Fig. 6 is a flow chart showing a method of reinforcing the touch panel of the present invention in accordance with a second embodiment of the present invention.

The technical features, contents, and advantages of the present invention, as well as the advantages thereof, can be understood by the present inventors, and the present invention will be described in detail with reference to the accompanying drawings. The subject matter is only for the purpose of illustration and supplementary instructions. It is not necessarily the true proportion and precise configuration after the implementation of the invention. Therefore, the proportion and configuration relationship of the attached drawings should not be solved. The scope of the present invention in its actual implementation is read and limited.

Please refer to the third drawing, which is a schematic cross-sectional view of a reinforcing structure of the touch panel according to the first embodiment of the present invention, for explaining the basic implementation method of the reinforcing structure of the present invention and its corresponding structure. As shown in the figure, in the present embodiment, the reinforcing structure 3 of the touch panel of the present invention comprises a glass substrate 30, a decorative layer 31, a metal wiring layer 32 and a protective layer 33. The glass substrate 30 is preferably a sensing substrate having an indium tin oxide (ITO) 33 or an OGS (One Glass Solution) touch panel. However, the actual implementation is not limited thereto. This aspect. The decorative layer 31 may be a black matrix (BM) layer, such as but not limited to being formed on the glass substrate 30 by exposure, development, coating or sputtering to form an invisible inner side of the touch panel. The area is used to increase the contrast of the image, and prevent the thin film transistor from generating leakage current and shielding oblique light leakage, avoiding color purity reduction, and increasing the value and decoration of the electronic product. At the junction between the touch panel and a flexible circuit board, a metal wiring layer 32 is disposed on the decorative layer 31. The metal wiring layer 32 has a plurality of metal traces 321 , and the metal traces 321 are spaced apart. It is disposed on the decorative layer 31. It is to be noted that the protective layer 33 is formed on the decorative layer 31 between the metal traces 321 , and the protective layer 33 does not cover the upper surface of each of the metal traces 321 . In addition, the protective layer 33 provided by the present invention can protect the decorative layer 31 of the joint from being peeled off or damaged in the subsequent process of pressing the flexible circuit board, thereby strengthening the strength of the joint of the touch panel. .

In addition, in addition to adding the protective layer 33 between the metal traces 321 at the joint to protect the decorative layer 31 at the joint, the protective layer 33 may be added in a region other than the metal traces 321 . The decorative layer 31 is peeled off or subjected to scratching and abrasion during the manufacturing process, thereby enhancing the protective effect of the decorative layer 31. Preferably, the material of the protective layer 33 can be a photoresist material and an ink; however, in practice, it is not limited to such an aspect. .

Please refer to the fourth figure, which is a schematic cross-sectional view of a reinforcing structure of a touch panel according to a second embodiment of the present invention, which is used to illustrate the supplement of the present invention. The basic implementation method of the strong structure and its corresponding structure. As shown in the figure, in the present embodiment, the reinforcing structure 4 of the touch panel of the present invention comprises a glass substrate 40, a decorative layer 41, a metal wiring layer 42, a protective layer 43, a conductive adhesive layer 44, and A flexible circuit board 45. Compared with the first embodiment, the difference is that in the second embodiment, in order to electrically connect the touch panel and the flexible circuit board 45, the conductive adhesive layer 44 (the material of which may be anisotropic conductive adhesive) is coated. The metal wiring layer 42 and the protective layer 43 are disposed on the metal wiring layer 42 and then the flexible circuit board 45 is electrically connected to the metal wiring layer 42 through the conductive bonding layer 44. It is worth mentioning that, in order to avoid the situation in which the conductive adhesive layer 44 overflows during the hot pressing process, a gap 46 is left between the side surface of each of the metal traces 42 and the protective layer 43 (in the fourth figure). Where the dotted line is circled), the overflow of the conductive adhesive will help to facilitate the debinding of the conductive adhesive layer 44 during the pressing process, thereby improving the appearance and function of the product due to the leakage of the conductive adhesive of the prior art. Disadvantages.

According to the above description, in a preferred embodiment, the present invention further provides a touch device, which may include a touch panel. The reinforcing structure of the touch panel manufactured by the present invention may be disposed on the touch panel (not shown) ).

Although the concept of the reinforcing manufacturing method of the touch panel of the present invention has been simultaneously described in the process of explaining the reinforcing structure of the touch panel of the present invention, for the sake of clarity, the following detailed description of the flowchart is further illustrated. .

Referring to FIG. 5, a flow chart of a method for manufacturing a touch panel of the present invention will be described in accordance with a first embodiment of the present invention. As shown in the figure, the reinforcing manufacturing method of the touch panel may include the following steps. In step 501, a glass substrate is provided, which may be a sensing substrate formed with an indium tin oxide (ITO) or an OGS (One Glass Solution) touch panel; Not limited to this aspect. In step 502, a decorative layer may be formed on the glass substrate by, for example, but not limited to, exposure development, coating, or sputtering, thereby forming an invisible area on the inner side of the touch panel. In step 503, a metal wiring layer is disposed on the decorative layer, and the metal wiring layer has a plurality of metal traces, and each of the metal traces is spaced apart from the decorative layer. In order to protect the decorative layer on which the metal trace is not provided, in the step 504: forming a protective layer on the decorative layer between the metal traces, and the protective layer does not cover an upper surface of each of the metal traces. In some preferred embodiments, the protective layer A gap is left between each of the metal traces. In addition, in order to provide a better protective effect of the decorative layer on other regions of the glass substrate, the protective layer may be formed on any decorative layer not provided with each of the metal traces, and the material of the protective layer may be, for example, but not Limited to a photoresist material, an ink, the decorative layer may comprise a black matrix (BM) layer. In this way, the joint between the touch panel and the flexible circuit board can be strengthened by the above steps to improve the yield of the product.

Referring to a sixth embodiment, a flow chart of a method for manufacturing a touch panel of the present invention will be described in accordance with a second embodiment of the present invention. Compared with the first embodiment, the difference is that the manufacturing method of the second embodiment includes the first four steps of the first embodiment, and further includes step 605: providing a conductive adhesive layer on the metal trace layer and the protection On the floor. In step 606, a flexible circuit board is disposed on the conductive adhesive layer, so that each of the metal traces can be electrically connected to the flexible circuit board via the conductive adhesive layer. In this way, through the above-mentioned multi-layer covering configuration, the decorative layer can be prevented from being peeled off or damaged in the process of pressing with the flexible circuit board, and the decorative layer can be reduced in puncture or crushing after the pressing process is completed. possibility. It should be noted that in some preferred embodiments, it is considered that during the process of pressing the flexible circuit board and the touch panel, the phenomenon of overflow of the conductive adhesive often occurs, so that the present invention allows the protective layer to be formed. A gap is left between the protective layer and one side surface of each of the metal traces to facilitate the discharge of the conductive adhesive layer in the press-bonding process. Moreover, when the gap between each of the metal traces and the protective layer is filled with conductive paste, the electronic product of the design also has better current conductivity.

The detailed implementation of each step described above has been described in detail in the foregoing description of the reinforcing structure of the touch panel, and will not be described herein.

In summary, the touch panel reinforcing structure and the touch panel reinforcing manufacturing method and the touch device thereof have at least the following advantages: 1) enhancing the connection strength between the flexible circuit board and the touch panel; 2) Reserved clearance Improve the overflow phenomenon of the conductive adhesive; 3) Form a protective layer on the decorative layer without the metal trace, which will avoid puncture or crushing of the decorative layer before or during assembly of the flexible circuit board to provide a decorative layer. Good protection effect.

The preferred embodiment of the touch panel reinforcing structure, the touch panel reinforcing manufacturing method and the touch device thereof has been described above with reference to the drawings and drawings. All of the features disclosed in this specification may be combined with other methods, and each of the features disclosed in the specification may be selectively replaced with the same, equal or similar purpose features, and thus, in addition to the particularly salient features All of the features disclosed in this specification are only one example of equal or similar features. After the description of the preferred embodiment of the present invention, it should be understood by those skilled in the art that the present invention is a novel, progressive, and practical invention, and has profound development value. The present invention has been modified by those skilled in the art and is intended to be modified as described in the appended claims.

3‧‧‧protective mirror

30‧‧‧ glass substrate

31‧‧‧Decorative layer

32‧‧‧Metal wiring layer

321‧‧‧Metal routing

33‧‧‧Protective layer

Claims (8)

A touch panel includes: a substrate; a decorative layer formed on the substrate; a metal wiring layer having a plurality of metal traces spaced apart from the decorative layer; a protective layer formed in each The decorative layer between the metal traces does not cover an upper surface of each of the metal traces; a flexible circuit board is disposed on the metal trace layer; and a conductive adhesive layer is disposed on the layer A flexible circuit board and the metal wiring layer and the protective layer. The touch panel of claim 1, wherein a gap is left between one side surface of each of the metal traces and the protective layer. The touch panel of claim 1, wherein the conductive adhesive layer is made of an anisotropic conductive paste. The touch panel of claim 1, wherein the protective layer is formed on the decorative layer not provided with each of the metal traces. A method for manufacturing a touch panel, comprising: providing a substrate; forming a decorative layer on the substrate; and providing a metal wiring layer on the decorative layer, the metal wiring layer having a plurality of spacers disposed on the decorative layer a metal trace; and forming a protective layer on the decorative layer between the metal traces and not covering an upper surface of each of the metal traces. The method of claim 5, further comprising providing a flexible circuit board on the metal trace layer. The method of claim 5, wherein a gap remains between a side surface of each of the metal traces and the protective layer. The method of claim 5, wherein the protective layer is formed on the decorative layer not provided with each of the metal traces.