TWI494560B - Grain selection method and bad crystal map generation method - Google Patents

Description

Grain selection method and bad crystal map generation method

The present invention relates to a method for selecting a crystal grain, and more particularly to a method for crystal grain selection of a light emitting diode (LED) die and a method for generating a bad crystal map.

The current common processes for LED dies include the following steps: probing, automated optical inspection (AOI), sorting, manual visual inspection, and bad crystal removal.

Spot measurement refers to testing the photoelectric characteristics of LED dies. Automated optical inspection is the use of automated optical inspection machines to observe the appearance of the grain is damaged. Sorting is based on the results obtained by spot testing and automated optical inspection to transfer good grains (ie, grains with a lower degree of appearance damage) to a sorting page according to optical properties, which is, for example, viscous. Blue film. The manual visual inspection is to observe by hand and microscope one by one whether the appearance of all the crystal grains on the sorting carrier is damaged. Bad crystal picking is to manually pick out damaged grains according to the human judgment of manual visual inspection.

It is worth noting that the appearance of the grains may be subject to varying degrees of damage during any process prior to manual visual inspection. Therefore, in the step of manual visual inspection, it is judged that the crystal grain is damaged according to human judgment. However, when the grain damage is completely dependent on human judgment, it is difficult to have a uniform standard for grain damage. Therefore, manual visual inspection seriously affects the uniformity of grain selection.

The present invention provides a grain selection method to eliminate the uncertainty of the determination of the degree of damage to the appearance of crystal grains by human judgment.

The present invention provides a method of generating a bad crystal map as a reference for picking out bad crystals (i.e., damaged grains).

The die selection method of the present invention includes the following steps. Multiple grains were spotted to measure the photoelectric properties of these grains. These grains having similar photoelectric properties are transferred to a sorting carrier. These grains on the sorting carrier are observed by an automated optical inspection device to produce an observation, wherein the observations include the location of the grains on the sorting carrier and whether the grains are damaged. A bad crystal map is depicted in accordance with the observations, wherein the bad crystal map has at least one bad crystal mark to indicate the location of the damaged person in the grains. According to the bad crystal mark of the bad crystal map, those who have damaged in the crystal grains are picked up.

The bad crystal map generating method of the present invention includes the following steps. Observing a plurality of grains on a sorting carrier by an automated optical inspection device to produce an observation, wherein the observations include the positions of the grains and whether the grains are damaged hurt. A bad crystal map is depicted in accordance with the observations, wherein the bad crystal map has at least one bad crystal mark to indicate the location of the damaged person in the grains.

Based on the above, in the present invention, the step of machine observation is moved to the step of sorting to replace the conventional manual visual inspection step, so that the uncertainty of the determination of the grain damage by human judgment can be eliminated, thereby increasing the grain size. Consistency of damage determination, while eliminating the time cost of manual visual inspection. Further, in the present invention, the step of depicting a bad crystal map is added, and the bad crystal map is applied as a reference when picking up bad crystals (damaged crystal grains).

The above described features and advantages of the invention will be apparent from the following description.

100‧‧‧ sorting carrier

100a‧‧‧ frame

100b‧‧‧Blue film

102‧‧‧ grain

102a‧‧‧First grain

108‧‧‧Carrier locating markers

200‧‧‧bad crystal map

201‧‧‧First Crystal Mark

202‧‧‧bad crystal mark

204‧‧‧ Direction Mark

206‧‧‧ barcode marking

208‧‧‧Map location marker

S110~S150‧‧‧Steps

1 is a flow chart of a die selection method in accordance with an embodiment of the present invention.

2 illustrates a sorting carrier used in the die selection method of FIG. 1 and crystal grains thereon.

3 is a diagram showing a bad crystal map used in the die selection method of FIG. 1.

4 illustrates the sorting carrier of FIGS. 2 and 3 and the grain and the bad crystal map thereon overlap each other.

FIG. 5 illustrates another sorting carrier used in the grain selection method of FIG. 1 and crystal grains thereon.

FIG. 6 illustrates another bad crystal map used in the die selection method of FIG. 1.

FIG. 7 illustrates the sorting carrier of FIGS. 5 and 6 and the crystal grains and the bad crystal map thereon overlap each other.

The grain selection method of this embodiment includes the following steps: spotting, sorting, machine observation, bad die map depiction, and bad crystal picking. It should be noted that in the present embodiment, the step of machine observation is moved to the step of sorting to replace the conventional manual visual inspection step, so that the uncertainty of the determination of the grain damage by human judgment can be eliminated. In addition, the steps of depicting bad crystal maps have been added, while the bad crystal maps have been used as a reference for picking out bad crystals (damaged grains).

Specifically, referring to FIG. 1, in the die selection method of the present embodiment, first, as shown in step S110, a plurality of crystal grains (for example, LED dies) are spot-measured to measure photoelectric characteristics of the crystal grains. Next, as shown in step S120, the crystal grains having similar photoelectric characteristics are transferred to a sorting carrier. In the present embodiment, as shown in FIG. 2, the sorting carrier 100 is, for example, a viscous blue film, and these crystal grains 102 are adhered to the sorting carrier 100.

As shown in step S130, the grains 102 on the sorting carrier 100 are observed by an automated optical inspection (AOI) apparatus to produce an observation. The results of the observations include the location of the grains 102 on the sorting carrier 100 and whether the grains 102 are damaged. Thereafter, as shown in step S140, a bad crystal map is drawn in accordance with the observation result. As shown in FIG. 3, the bad crystal map 200 has a plurality of bad crystal indicia 202 to indicate the locations of the damaged ones of the crystal grains 102. In this embodiment, the bad crystal map 200 It can be depicted in accordance with the observations by an internal modeling group of the same automated optical inspection device or other electronic device.

As shown in step S150, the damaged ones of the crystal grains 102 are picked up according to the bad crystal mark 202 of the bad crystal map 200. The method of picking up the die 102 can be either manual picking or machine picking. In the present embodiment, as shown in FIG. 4, the bad crystal map 200 and the sorting carrier 100 may be overlapped to align the bad crystal markings 202 to the damaged crystal grains 102. During the alignment process, the first crystal grain 102a of the uppermost left corner of the sorting carrier 100 may be overlapped with the first crystal mark 201 of the uppermost left corner of the bad crystal map 200 to achieve correct positioning. Next, the die 102 aligned with the bad crystal mark 202 is removed. It should be noted that when the first die 102a is also classified as a bad crystal (damaged grain), the properties (eg, pattern or color) of the first crystal mark 201 may be the same as or similar to those of the bad crystal mark 202. Lee removed in the next steps.

Referring to FIG. 4, in order to overlap the bad crystal map 200 and the sorting carrier 100, the bad crystal map 200 may be projected on the sorting carrier 100 by image display by a display device such as a flat panel display, a touch panel display or a projector. on. Therefore, when the bad crystal is manually removed, the human eye can see the bad crystal map 200 projected thereon through the translucent sorting carrier 100. When the touch flat panel display is selected to project the bad crystal map 200, the manual direct touch can be used to replace the next bad crystal map 200 corresponding to the other sorting carrier 100 to increase the picking speed of the bad crystal.

Referring to FIG. 4, in order to overlap the bad crystal map 200 and the sorting carrier 100, the bad crystal map 200 may be outputted on a paper by a printing device, and then the bad crystal map 200 and the sorting carrier 100 are overlapped to remove the bad crystal. Marker 202 is aligned to its corresponding damage Die 102. When the bad crystal is manually picked, the human eye can see the bad crystal map 200 overlapping with it through the translucent sorting carrier 100. Therefore, when the bad crystal is manually removed, the bad crystal map 200 below it can be seen through the translucent sorting carrier 100.

Referring to FIG. 2 and FIG. 3 again, in order to ensure correct alignment in the direction, in addition to superimposing the first die 102a on the first crystal mark 201, the bad crystal map 200 may further have a direction mark 204, which may correspond to The orientation of the die 102 on the carrier 100 is selected. For example, as shown in the enlarged portion of FIG. 2, the shape of the electrode 102a of the die 102 is directional, so that the direction mark 204 of the bad crystal map 200 can be set parallel to the direction of the electrode 102a of the die 102.

Referring to FIG. 3, in order to ensure that the observation corresponds to the correct sorting carrier 100 and the die 102 thereon, the bad crystal map 200 may further have a code mark 206 to correspond to the crystal grains 102 on the sorting carrier 100. The number.

Referring to FIG. 5 and FIG. 6, in another embodiment, the sorting carrier 100 may have a plurality of carrier positioning marks 108, and the bad crystal map 200 has a plurality of map positioning marks 208, and the map positioning marks 208 correspond to the vectors. Positioning marker 108. These carrier alignment marks 108 can be disposed on the diagonal of the sorting carrier 100, and these map positioning marks 208 can be disposed on the diagonal of the bad crystal map 200. Thus, as shown in FIG. 7, when the bad crystal map 200 is overlaid on the sorting carrier 100, by aligning the map positioning marks 208 with the carrier positioning marks 108, respectively, this can align the bad crystal marks 202 to their corresponding positions. There are damaged grains 102. In this embodiment, the carrier positioning marks 108 may be pre-formed on the sorting carrier 100 by printing using a printing module added to the AOI device after being subjected to automated optical inspection (AOI). Above, but the invention is not limited thereto.

Referring to FIG. 5 again, in the embodiment, the sorting carrier 100 may include a frame 100a and a blue film 100b. The blue film 100b is placed on the frame 100a, and the die 102 is adhered to the blue film 100b. These carrier positioning marks 108 can be located in the housing 100a. When the frame 100a is transparent or translucent, the map positioning marks 208 can be seen through the frame 100a to align the map positioning marks 208 with the carrier positioning marks 108, respectively, to align the bad crystal marks 202 to their positions. Corresponding to the damaged die 102.

In summary, in the present invention, the step of machine observation is moved to the step of sorting to replace the conventional manual visual inspection step, so that the uncertainty of the determination of the grain damage by human judgment can be eliminated, thereby improving Consistency in grain damage determination, while eliminating the time cost of manual visual inspection. Further, in the present invention, the step of depicting a bad crystal map is added, and the bad crystal map is applied as a reference when picking up bad crystals (damaged crystal grains).

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

S110~S150‧‧‧Steps

Claims (13)

A method for selecting a grain, comprising: spotting a plurality of crystal grains to measure photoelectric characteristics of the crystal grains; transferring the crystal grains having similar photoelectric characteristics to a sorting carrier; and using an automated optical detecting device Observing the crystal grains on the sorting carrier to produce an observation result, wherein the observation result includes a position of the crystal grains on the sorting carrier and whether the crystal grains are damaged; according to the observation result a bad crystal map, wherein the bad crystal map has at least one bad crystal mark, and the position of the damaged person in the crystal grains is marked by an image display device; and the bad crystal mark according to the bad crystal map Pick up those damaged in the grains. The grain selection method according to claim 1, wherein in the step of depicting the bad crystal map, a dirty crystal map is drawn according to the observation result by the automated optical detecting device or an electronic device. The grain selection method of claim 1, wherein the bad crystal map has a direction mark to correspond to a direction of the grains on the sorting carrier. The grain selection method of claim 1, wherein the bad crystal map has a code mark corresponding to the number of the crystal grains on the sorting carrier. The grain selection method according to claim 1, wherein the sorting carrier has a plurality of carrier positioning marks, and the bad crystal map has a plurality of map positioning targets And the map location markers correspond to the carrier location markers. The method for selecting a grain according to claim 1, wherein the step of removing the damaged one of the crystal grains according to the bad crystal map comprises: overlapping the bad crystal map and the sorting carrier to make the bad The crystal mark is aligned to the grain to which it corresponds to damage; and the grain to which the bad crystal mark is aligned is removed. The method for selecting a grain according to claim 6, wherein the step of overlapping the bad crystal map and the sorting carrier comprises: projecting the bad crystal map on the sorting carrier by image display by the display device . The method of selecting a die according to claim 1, wherein the display device is a flat display, a touch flat display or a projector. A method for generating a bad crystal map, comprising: observing a plurality of crystal grains on a sorting carrier by an automated optical detecting device to generate an observation result, wherein the observation result includes positions of the crystal grains and the Whether the crystal grain is damaged; and drawing a bad crystal map according to the observation result, wherein the bad crystal map has at least one bad crystal mark, and the position of the damaged person in the crystal grains is marked by an image display device by a display device. The method for generating a bad crystal map according to claim 9, wherein in the step of depicting the bad crystal map, a dirty crystal map is drawn according to the observation result by the automated optical detecting device or an electronic device. The method of generating a bad crystal map according to claim 9, wherein the bad crystal map has a direction mark to correspond to a direction of the crystal grains on the sorting carrier. The method of generating a bad crystal map according to claim 9, wherein the bad crystal map has a code mark corresponding to the number of the crystal grains on the sorting carrier. The method for generating a bad crystal map according to claim 9, wherein the sorting carrier has a plurality of carrier positioning marks, the bad crystal map having a plurality of map positioning marks, and the map positioning marks corresponding to the vectors Position the tag.