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TWI492683B - - Google Patents

Info

Publication number
TWI492683B
TWI492683B TW099120021A TW99120021A TWI492683B TW I492683 B TWI492683 B TW I492683B TW 099120021 A TW099120021 A TW 099120021A TW 99120021 A TW99120021 A TW 99120021A TW I492683 B TWI492683 B TW I492683B
Authority
TW
Taiwan
Application number
TW099120021A
Other versions
TW201201641A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW099120021A priority Critical patent/TW201201641A/zh
Priority to US13/118,667 priority patent/US20110313252A1/en
Priority to DE102011050895A priority patent/DE102011050895A1/de
Publication of TW201201641A publication Critical patent/TW201201641A/zh
Application granted granted Critical
Publication of TWI492683B publication Critical patent/TWI492683B/zh

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00064—Constructional details of the endoscope body
    • A61B1/00071—Insertion part of the endoscope body
    • A61B1/0008—Insertion part of the endoscope body characterised by distal tip features
    • A61B1/00097—Sensors
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00064—Constructional details of the endoscope body
    • A61B1/00105—Constructional details of the endoscope body characterised by modular construction
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
    • A61B1/051—Details of CCD assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Surgery (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biophysics (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Endoscopes (AREA)
TW099120021A 2010-06-18 2010-06-18 Micro sensor TW201201641A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW099120021A TW201201641A (en) 2010-06-18 2010-06-18 Micro sensor
US13/118,667 US20110313252A1 (en) 2010-06-18 2011-05-31 Micro sensing apparatus
DE102011050895A DE102011050895A1 (de) 2010-06-18 2011-06-07 Mikrosensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099120021A TW201201641A (en) 2010-06-18 2010-06-18 Micro sensor

Publications (2)

Publication Number Publication Date
TW201201641A TW201201641A (en) 2012-01-01
TWI492683B true TWI492683B (zh) 2015-07-11

Family

ID=45091362

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099120021A TW201201641A (en) 2010-06-18 2010-06-18 Micro sensor

Country Status (3)

Country Link
US (1) US20110313252A1 (zh)
DE (1) DE102011050895A1 (zh)
TW (1) TW201201641A (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH705951B1 (de) * 2011-12-23 2017-12-15 Awaiba Consultadoria Desenvolvimento E Comércio De Componentes Microelectrónicos Unipessoal Lda Optische Sensoranordnung und Verfahren zur Herstellung sowie Verwendung derselben.
DE102012207580A1 (de) * 2012-05-08 2013-11-14 Olympus Winter & Ibe Gmbh Chirurgisches Instrument mit Durchkontaktierung
DE102013214278A1 (de) 2013-07-22 2015-01-22 Digital Endoscopy Gmbh Abdichtungsbauteil für einen endoskopstecker
DE102013220908B4 (de) 2013-10-15 2015-09-24 Continental Automotive Gmbh Sensorelement
DE102013222042A1 (de) 2013-10-30 2015-04-30 Digital Endoscopy Gmbh Auslenkbewegungsübertragungseinrichtung, Endoskopdeflectingsteuerung und Endoskop
DE102013222041A1 (de) 2013-10-30 2015-04-30 Digital Endoscopy Gmbh Auslenkbewegungsübertragungseinrichtung, Endoskopdeflectingsteuerung und Endoskop
DE102013222039A1 (de) 2013-10-30 2015-04-30 Digital Endoscopy Gmbh An ein Mutterendoskop anbringbares Sekundärendoskop und Kombination aus Mutterendoskop und Sekundärendoskop
DE102013224683A1 (de) 2013-12-02 2015-06-03 Digital Endoscopy Gmbh Endoskopkopf und endoskop
DE102013226591A1 (de) 2013-12-19 2015-06-25 Digital Endoscopy Gmbh Vorrichtung und verfahren zum herstellen eines länglichen hohlprofilelements, längliches hohlprofilelement und eine abwinkelungseinheit für ein endoskop
DE102014201208A1 (de) 2014-01-23 2015-07-23 Digital Endoscopy Gmbh Fluidblock für ein endoskopbedienteil und endoskop
DE102014201286B4 (de) 2014-01-24 2019-12-24 Digital Endoscopy Gmbh Verfahren und vorrichtung zur nachführung der grundfrequenz eines stimmsignals in echtzeit
EP3231347B1 (en) * 2014-12-09 2020-04-29 Olympus Corporation Endoscope
EP3184028A4 (en) * 2015-06-03 2018-05-16 Olympus Corporation Connector for endoscope
DE102015113016B4 (de) 2015-08-07 2018-03-29 Digital Endoscopy Gmbh Endoskopkopf
DE102017201634B3 (de) 2017-02-01 2018-06-14 Leoni Kabel Gmbh Strangförmiges Element sowie Verfahren zur Herstellung eines strangförmigen Elements
TWI733074B (zh) * 2019-01-09 2021-07-11 榮晶生物科技股份有限公司 微型電子裝置及其電路基板
CN115209780B (zh) * 2020-03-10 2025-10-21 奥林巴斯株式会社 内窥镜、内窥镜的前端框部件及内窥镜的插入部
TWI747606B (zh) * 2020-11-11 2021-11-21 群光電子股份有限公司 內視鏡裝置
US11963667B2 (en) 2021-11-26 2024-04-23 Altek Biotechnology Corporation Endoscopic image capturing assembly and endoscopic device therewith

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070182842A1 (en) * 2004-05-31 2007-08-09 Medigus Ltd. Reusable miniature camera head
TWI302195B (en) * 2005-11-22 2008-10-21 Matsushita Electric Works Ltd Infrared detector and process for fabricating the same
TW200911050A (en) * 2007-08-20 2009-03-01 Ind Tech Res Inst Flexible electronic substrate structures and fabrication methods for flexible electronic devices
US20100114144A1 (en) * 2008-10-30 2010-05-06 Albrecht Thomas E Intra-gastric satiety creation device with data handling devices and methods

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4639772A (en) * 1984-02-07 1987-01-27 Circon Corporation Focusable video camera for use with endoscopes
JP2746171B2 (ja) * 1995-02-21 1998-04-28 日本電気株式会社 固体撮像装置及びその製造方法
TW382180B (en) * 1996-07-15 2000-02-11 Sony Corp Camera lens
US6766950B2 (en) * 1997-12-16 2004-07-27 Donald R. Hall Modular architecture sensing and computing platform
DE19924189C2 (de) * 1999-05-27 2001-04-26 Storz Karl Gmbh & Co Kg Bildaufnehmermodul sowie Verfahren zum Zusammenbauen eines derartigen Bildaufnehmermoduls
CN102016709B (zh) * 2008-04-30 2014-04-09 日本电产三协株式会社 带抖动修正功能的光学单元及摄影用光学装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070182842A1 (en) * 2004-05-31 2007-08-09 Medigus Ltd. Reusable miniature camera head
EP1765146B1 (en) * 2004-05-31 2009-04-29 Medigus Ltd. A reusable miniature camera head
TWI302195B (en) * 2005-11-22 2008-10-21 Matsushita Electric Works Ltd Infrared detector and process for fabricating the same
TW200911050A (en) * 2007-08-20 2009-03-01 Ind Tech Res Inst Flexible electronic substrate structures and fabrication methods for flexible electronic devices
US20100114144A1 (en) * 2008-10-30 2010-05-06 Albrecht Thomas E Intra-gastric satiety creation device with data handling devices and methods

Also Published As

Publication number Publication date
TW201201641A (en) 2012-01-01
US20110313252A1 (en) 2011-12-22
DE102011050895A1 (de) 2011-12-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees