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TWI491582B - Method of fabricating a porous device with dual restrictive layers and structure thereof - Google Patents

Method of fabricating a porous device with dual restrictive layers and structure thereof Download PDF

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Publication number
TWI491582B
TWI491582B TW102112771A TW102112771A TWI491582B TW I491582 B TWI491582 B TW I491582B TW 102112771 A TW102112771 A TW 102112771A TW 102112771 A TW102112771 A TW 102112771A TW I491582 B TWI491582 B TW I491582B
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Taiwan
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layer
sealing layer
porous
sealing
throttle
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TW102112771A
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TW201439034A (en
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Kuo Yu Chien
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Metal Ind Res & Dev Ct
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Description

具雙微節流層之多孔質元件之製作方法及其結構Method for manufacturing porous element with double micro-throttle layer and structure thereof

本發明有關於一種多孔質元件之製作方法,特別有關於一種具雙微節流層之多孔質元件之製作方法,其中該雙微節流層由多孔質載板及封孔層形成。The present invention relates to a method for fabricating a porous element, and more particularly to a method for producing a porous element having a double micro-throttle layer, wherein the double micro-throttle layer is formed of a porous carrier plate and a sealing layer.

習知多孔質元件200,如第3圖所示,其具有一微孔結構210,該多孔質元件200主要應用於氣浮軸承領域,該多孔質元件200具有孔隙尺寸變異、滲透率變異及孔隙排列不均等問題,當工作流體通過該微孔結構210時,由於該微孔結構210之滲透率及表面流場無法控制,因此該多孔質元件200之承載力、剛性及穩定性將大幅受限而無法有效承載一承載物。The conventional porous member 200, as shown in Fig. 3, has a microporous structure 210 which is mainly used in the field of air bearing, which has pore size variation, permeability variation and porosity. The problem of uneven arrangement is that when the working fluid passes through the microporous structure 210, the permeability, rigidity and stability of the porous element 200 are greatly limited due to the uncontrollable permeability and surface flow field of the microporous structure 210. It cannot effectively carry a carrier.

本發明之主要目的在於提供一種具雙微節流層之多孔質元件之製作方法。SUMMARY OF THE INVENTION A primary object of the present invention is to provide a method of fabricating a porous element having a double micro-throttle layer.

一種具雙微節流層之多孔質元件之製作方法,其包含提供一多孔質載板,其具有複數個微孔通道及一待封孔面,各該微孔通道的一開口顯露於該待封孔面,進行一膠封製程,在該多孔質載板之該待封孔面設置一封孔層,該封孔層密封各該微孔通道之該開口,該封孔層包含有複數個待形成通孔區域,以及進行一通孔加工,在該封孔層之該些待形成通孔區域形成複數個通孔,各該通孔貫穿該封孔層且連通位於該些待形成通孔區域下方的該些微孔通道。本發明藉由具有該些微孔通道的該多孔質載板與具有該些通孔的該封孔層形成雙微節流層,當工作流體流經該些微孔通道及該些通孔時,雙微節流層所產生之節流效應及高阻尼效應能有效提升該多孔質元件本身之剛性與穩定性,並使得該多孔質元件具備最佳承載性能,此外,本發明可藉由調整該些通孔之孔徑尺寸及排列組合改變該封孔層之表面流場特性,能應用於各種超精密定位平台或超精密主軸等精密儀器。A method for fabricating a porous element having a double micro-throttle layer, comprising: providing a porous carrier plate having a plurality of microporous channels and a cavity to be sealed, wherein an opening of each of the microchannels is exposed a sealing process is performed, and a hole layer is disposed on the surface of the porous carrier to be sealed, and the sealing layer seals the opening of each of the microporous channels, and the sealing layer comprises a plurality of openings Forming a through hole region, and performing a through hole process, forming a plurality of through holes in the through hole region of the sealing layer, each through hole penetrating through the sealing layer and communicating in the through holes to be formed The microvia channels below the area. The present invention forms a double micro-throttle layer by the porous carrier plate having the microporous channels and the sealing layer having the through holes, when the working fluid flows through the microporous channels and the through holes The throttling effect and high damping effect produced by the double micro-throttle layer can effectively improve the rigidity and stability of the porous element itself, and the porous element has the best bearing performance. Moreover, the present invention can be adjusted by The aperture size and arrangement of the through holes change the surface flow field characteristics of the sealing layer, and can be applied to various ultra-precision positioning platforms or precision instruments such as ultra-precision spindles.

請參閱第1圖,其為本發明之一實施例,一種具雙微節流層之多孔質元件之製作方法,其包含提供多孔質載板之步驟A、進行膠封製程之步驟B、進行通孔加工之步驟C及進行測試之步驟D。Referring to FIG. 1 , a method for fabricating a porous element having a double micro-throttle layer according to an embodiment of the present invention includes a step A of providing a porous carrier, a step B of performing a sealing process, and performing Step C of through hole processing and step D of performing the test.

首先,請參閱第1圖之步驟A及第2A圖,提供一多孔質載板110,其具有複數個微孔通道111及一待封孔面112,各該微孔通道111具有一開口113,各該開口113分別顯露於該待封孔面112,在本實施例中,該待封孔面112亦為該多孔質載板110的表面,該多孔質載板110的透氣率不大於 10-11 ,以取得較佳之剛性與穩定性,此外,該多孔質載板110可預先進行一整平製程,以使該多孔質載板110的表面平整而形成該待封孔面112,該整平製程是以鑽石精密車削方式整平該多孔質載板110的表面,其他如研磨、飛銑、游離研磨等工藝亦可用於整平製程,在本實施例中,該多孔質載板110可選自金屬、石墨或陶瓷等多孔質材料。First, referring to step A and FIG. 2A of FIG. 1, a porous carrier plate 110 having a plurality of microporous channels 111 and a to-be-sealed surface 112, each of the micro-channels 111 having an opening 113 is provided. Each of the openings 113 is respectively exposed on the surface to be sealed 112. In the embodiment, the surface to be sealed 112 is also the surface of the porous carrier 110, and the air permeability of the porous carrier 110 is not more than 10 -11 , in order to obtain better rigidity and stability, in addition, the porous carrier plate 110 may be pre-processed in a flattening process to planarize the surface of the porous carrier plate 110 to form the to-be-sealed surface 112. The flat process is to level the surface of the porous carrier 110 by means of diamond precision turning. Other processes such as grinding, flying milling, free grinding, etc. can also be used for the leveling process. In this embodiment, the porous carrier 110 can be used. It is selected from porous materials such as metal, graphite or ceramics.

接著,請參閱第1圖之步驟B及第2B圖,進行膠封製程,在該多孔質載板110之該待封孔面112設置一封孔層120,該封孔層120之材質為一膠體,以密封各該微孔通道111之該開口113,該封孔層120包含有複數個待形成通孔區域120a,在本實施例中,膠封製程中所使用之膠體可選自於高分子環氧樹脂(epoxy),該多孔質載板110具有一第一厚度T1,該封孔層120具有一第二厚度T2,為達成透氣率不大於10-11 之功效,該第一厚度T1可介於2 mm至30 mm之間,該第二厚度T2係介於0.005 mm至0.2 mm之間。Next, referring to step B and FIG. 2B of FIG. 1 , a sealing process is performed, and a hole layer 120 is disposed on the to-be-sealed surface 112 of the porous carrier 110. The material of the sealing layer 120 is one. a colloid to seal the opening 113 of each of the microporous channels 111. The sealing layer 120 includes a plurality of through-hole regions 120a to be formed. In this embodiment, the colloid used in the sealing process may be selected from high. A molecular epoxy resin having a first thickness T1, the sealing layer 120 having a second thickness T2 for achieving an air permeability of no more than 10 -11 , the first thickness T1 It can be between 2 mm and 30 mm and the second thickness T2 is between 0.005 mm and 0.2 mm.

請參閱第2B圖,在本實施例中,該封孔層120具有一滲透層121、一密封層122及一上表面123,該滲透層121經由該待封孔面112滲入該多孔質載板110,並填充於各該微孔通道111的開口113中,而該密封層122位於該待封孔面112上方以密封該待封孔面112,在本實施例中,該滲透層121之厚度與該密封層122之厚度比例介於0.2至2之間,以便控制後續所形成之各該通孔124(請參閱第2C圖)之深寬比不大於5。Referring to FIG. 2B, in the embodiment, the sealing layer 120 has a permeation layer 121, a sealing layer 122 and an upper surface 123. The permeation layer 121 penetrates the porous carrier through the to-be-sealed surface 112. 110, and filled in the opening 113 of each of the microporous passages 111, and the sealing layer 122 is located above the to-be-sealed surface 112 to seal the to-be-sealed surface 112. In the embodiment, the thickness of the permeation layer 121 The thickness ratio of the sealing layer 122 is between 0.2 and 2, so as to control the subsequent formation of each of the through holes 124 (see FIG. 2C) to have an aspect ratio of not more than 5.

較佳地,在完成膠封製程後,可對設置有封孔層120的該多孔質載板110進行充氣測試,其用以檢測該封孔層120能否確實密封該多孔質載板110之該待封孔面112,以防止該封孔層120未完全密封該多孔質載板110之該待封孔面112的情形產生。Preferably, after the sealing process is completed, the porous carrier 110 provided with the sealing layer 120 may be subjected to an inflation test for detecting whether the sealing layer 120 can surely seal the porous carrier 110. The surface to be sealed 112 is formed to prevent the sealing layer 120 from completely sealing the to-be-sealed surface 112 of the porous carrier 110.

較佳地,在完成充氣測試後,可對該封孔層120之該上表面123進行整平製程,在本實施例中,其以鑽石車削方式整平該上表面123,以使該上表面123平整,以利後續加工製程。Preferably, after the inflation test is completed, the upper surface 123 of the sealing layer 120 may be leveled. In this embodiment, the upper surface 123 is flattened by diamond turning to make the upper surface 123 leveling to facilitate subsequent processing.

較佳地,在完成對該封孔層120進行整平製程之後,可對該多孔質載板110進行充氣測試,由於對該封孔層120進行整平製程中的加工精度不足或人為失誤將使該封孔層120之該密封層122被部份或完全移除,故可藉由充氣測試確認該密封層122是否被移除。Preferably, after the flattening process of the sealing layer 120 is completed, the porous carrier 110 may be subjected to an inflation test, because the processing precision or the human error in the leveling process of the sealing layer 120 will be insufficient. The sealing layer 122 of the sealing layer 120 is partially or completely removed, so that the sealing layer 122 can be removed by an inflation test.

請參閱第1圖之步驟C及第2C圖,在完成膠封製程後,進行通孔加工,在該封孔層120之該些待形成通孔區域120a形成複數個通孔124,各該通孔124貫穿該封孔層120且連通位於該些待形成通孔區域120a下方的該些微孔通道111,以形成一具雙微節流層之多孔質元件100,在本實施例中,各該通孔之深寬比介於0.5至5之間,此外,總合各該通孔124之開口面積與該封孔層120的該上表面123面積比值介於0.004至0.16之間,該面積比值可依多孔質元件之承載力、剛性與穩定性需求而調整,該面積比值配合各該通孔124之幾何外型、尺寸、深寬比、分佈型態…等,便可決定此多孔質元件之氣浮特性。Referring to step C and FIG. 2C of FIG. 1 , after the sealing process is completed, through hole processing is performed, and a plurality of through holes 124 are formed in the through hole regions 120 a of the sealing layer 120 to be formed. The hole 124 extends through the sealing layer 120 and communicates with the microporous channels 111 under the through-hole regions 120a to form a porous element 100 having a double micro-throttle layer. In this embodiment, each The aspect ratio of the through hole is between 0.5 and 5. In addition, the ratio of the opening area of each of the through holes 124 to the upper surface 123 of the sealing layer 120 is between 0.004 and 0.16. The ratio can be adjusted according to the bearing capacity, rigidity and stability requirements of the porous element, and the area ratio can be determined by matching the geometric shape, size, aspect ratio, distribution pattern, etc. of each of the through holes 124. The air flotation characteristics of the component.

請參閱第2B及2C圖,在本實例中,該封孔層120的該滲透層121滲入該多孔質載板110,該封孔層120的該密封層122位於該待封孔面112上方,因此在進行通孔加工製程時,各該通孔124依序貫穿該密封層122及該滲透層121,且連通位於該滲透層121下方的該些微孔通道111,通孔加工之製程可選自於雷射加工或微銑削加工,本發明可依據需求改變該些通孔124孔徑尺寸及該些通孔124的排列位置以改變該具雙微節流層之多孔質元件100表面流場。Referring to FIGS. 2B and 2C , in the present example, the permeation layer 121 of the sealing layer 120 penetrates into the porous carrier 110 , and the sealing layer 122 of the sealing layer 120 is located above the to-be-sealed surface 112 . Therefore, in the through hole processing process, each of the through holes 124 sequentially penetrates the sealing layer 122 and the permeation layer 121, and communicates with the microporous channels 111 located under the permeation layer 121, and the through hole processing process is optional. For laser processing or micro-milling, the present invention can change the aperture size of the through holes 124 and the arrangement positions of the through holes 124 to change the surface flow field of the porous element 100 having the double micro-throttle layer.

本發明藉由具有該些微孔通道111的該多孔質載板110及具有該些通孔124的該封孔層120形成雙微節流層以改善習知技術中滲透率及表面流場無法控制而導致無法有效承載的問題。The present invention forms a double micro-throttle layer by the porous carrier plate 110 having the microporous channels 111 and the sealing layer 120 having the through holes 124 to improve the permeability and surface flow field in the prior art. Control causes problems that cannot be effectively carried.

請參閱第1圖之步驟D,較佳地,在進行該通孔加工以形成複數個通孔124之步驟後,另包含有對該具雙微節流層之多孔質元件100進行功能測試之步驟,其可測試流體通過該些通孔124及該些微孔通道111之流量、進出口壓力變化、該多孔質元件100可負載承載物之承載力、靜態/動態剛性測試、流體膜厚及抗振性等。Referring to step D of FIG. 1 , preferably, after performing the through hole processing to form a plurality of through holes 124 , functional testing of the porous element 100 having the double micro throttle layer is further included. a step of testing a flow rate of the fluid through the through holes 124 and the microporous passages 111, a change in inlet and outlet pressure, a bearing capacity of the loadable member of the porous member 100, a static/dynamic rigidity test, a fluid film thickness, and Vibration resistance, etc.

請再參閱第2C圖,一種具雙微節流層之多孔質元件100包含一多孔質載板110及一封孔層120,該多孔質載板110具有複數個微孔通道111及一表面,該表面即為本發明製作方法中所定義之該待封孔面112,該封孔層120設置於該多孔質載板110之該表面,各該通孔124貫穿該封孔層120且連通該多孔質載板110之該些微孔通道111,在本實施例中,該封孔層120具有一滲透層121、一密封層122及複數個通孔124,該滲透層121滲入該多孔質載板110中,該密封層122位於該多孔質載板110之該表面上方,且各該通孔124貫穿該封孔層120之該密封層122及該滲透層121並連通位於該滲透層121下方的該些微孔通道111。Referring to FIG. 2C, a porous element 100 having a double micro-throttle layer comprises a porous carrier plate 110 and a hole layer 120 having a plurality of micro-hole channels 111 and a surface. The surface to be sealed is the surface to be sealed 112 defined in the manufacturing method of the present invention. The sealing layer 120 is disposed on the surface of the porous carrier 110, and the through holes 124 penetrate through the sealing layer 120 and communicate with each other. In the present embodiment, the sealing layer 120 has a permeation layer 121, a sealing layer 122 and a plurality of through holes 124. The permeation layer 121 penetrates into the porous layer. In the carrier 110, the sealing layer 122 is located above the surface of the porous carrier 110, and each of the through holes 124 penetrates the sealing layer 122 of the sealing layer 120 and the permeation layer 121 and communicates with the permeation layer 121. The microporous channels 111 below.

本發明藉由具有該些微孔通道111的該多孔質載板110與具有該些通孔124的該封孔層120所形成之雙微節流層所產生之節流效應及高阻尼效應能有效提升該多孔質元件100本身之抗振能力,並使得該多孔質元件100具備最佳承載力及穩定性,此外,本發明可藉由調整該些通孔124之孔徑尺寸及排列組合改變該封孔層120之表面流場分布,因此本發明能應用於各種超精密定位平台或超精密主軸等精密儀器。The throttling effect and high damping effect energy generated by the double micro-throttle layer formed by the porous carrier plate 110 having the microporous channels 111 and the sealing layer 120 having the through holes 124 The vibration resistance of the porous component 100 itself is effectively improved, and the porous component 100 has an optimum bearing capacity and stability. Further, the present invention can change the aperture size and arrangement of the through holes 124. The surface flow field distribution of the sealing layer 120, so the invention can be applied to various ultra-precision positioning platforms or precision instruments such as ultra-precision spindles.

本發明之保護範圍當視後附之申請專利範圍所界定者為準,任何熟知此項技藝者,在不脫離本發明之精神和範圍內所作之任何變化與修改,均屬於本發明之保護範圍。The scope of the present invention is defined by the scope of the appended claims, and any changes and modifications made by those skilled in the art without departing from the spirit and scope of the invention are within the scope of the present invention. .

100...具雙微節流層之多孔質元件100. . . Porous element with double micro-throttle layer

110...多孔質載板110. . . Porous carrier

111...微孔通道111. . . Microporous channel

112...待封孔面112. . . Hole to be sealed

113...開口113. . . Opening

120...封孔層120. . . Sealing layer

120a...待形成通孔區域120a. . . Through hole area to be formed

121...滲透層121. . . Permeation layer

122...密封層122. . . Sealing layer

123...上表面123. . . Upper surface

124...通孔124. . . Through hole

T1...第一厚度T1. . . First thickness

T2...第二厚度T2. . . Second thickness

200...多孔質元件200. . . Porous component

210...微孔結構210. . . Microporous structure

A...提供多孔質載板A. . . Provide porous carrier

B...進行膠封製程B. . . Sealing process

C...進行通孔加工C. . . Through hole processing

D...進行功能測試D. . . Perform functional testing

第1圖:依據本發明之一實施例,一種具雙微節流層之多孔質元件之製作流程圖。第2A-2C圖:依據本發明之一實施例,該具雙微節流層之多孔質元件之製程圖。第3圖:習知多孔質元件之示意圖。Figure 1 is a flow chart showing the fabrication of a porous element having a double micro-throttle layer in accordance with an embodiment of the present invention. 2A-2C is a process diagram of a porous element having a double micro-throttle layer in accordance with an embodiment of the present invention. Figure 3: Schematic representation of a conventional porous element.

100...具雙微節流層之多孔質元件100. . . Porous element with double micro-throttle layer

110...多孔質載板110. . . Porous carrier

111...微孔通道111. . . Microporous channel

120...封孔層120. . . Sealing layer

121...滲透層121. . . Permeation layer

122...密封層122. . . Sealing layer

123...上表面123. . . Upper surface

124...通孔124. . . Through hole

Claims (10)

一種具雙微節流層之多孔質元件之製作方法,其包含:  提供一多孔質載板,其具有複數個微孔通道及一待封孔面,各該微孔通道的一開口顯露於該待封孔面;  進行一膠封製程,在該多孔質載板之該待封孔面設置一封孔層,該封孔層之材質為一膠體,以密封各該微孔通道之該開口,該封孔層包含有複數個待形成通孔區域;以及  進行一通孔加工,在該封孔層之該些待形成通孔區域形成複數個通孔,各該通孔貫穿該封孔層,且各該通孔連通位於該些待形成通孔區域下方的該些微孔通道。A method for fabricating a porous element having a double micro-throttle layer, comprising: providing a porous carrier plate having a plurality of microporous channels and a cavity to be sealed, wherein an opening of each of the microchannels is exposed The hole to be sealed; a sealing process is performed, and a hole layer is disposed on the surface of the porous carrier to be sealed, and the material of the sealing layer is a gel to seal the opening of each microchannel The sealing layer includes a plurality of through-hole regions to be formed, and a through-hole processing is performed, and a plurality of through holes are formed in the through-hole regions of the sealing layer, and the through holes penetrate the sealing layer. And each of the through holes communicates with the microporous channels below the area of the through holes to be formed. 如申請專利範圍第1項所述之具雙微節流層之多孔質元件之製作方法,其中該封孔層具有一滲透層及一密封層,該滲透層經由該待封孔面滲入該多孔質載板中,該密封層位於該待封孔面上方,各該通孔依序貫穿該密封層及該滲透層,且連通位於該滲透層下方的該些微孔通道。The method for fabricating a porous element having a double micro-throttle layer according to claim 1, wherein the sealing layer has a permeation layer and a sealing layer, and the permeation layer penetrates the porous layer through the surface to be sealed. In the quality carrier, the sealing layer is located above the surface to be sealed, and each of the through holes sequentially penetrates the sealing layer and the permeation layer, and communicates with the microporous channels located below the permeation layer. 如申請專利範圍第2項所述之具雙微節流層之多孔質元件之製作方法,其中該滲透層的厚度與該密封層的厚度比例介於0.2至2之間。The method for fabricating a porous element having a double micro-throttle layer according to claim 2, wherein a ratio of a thickness of the permeation layer to a thickness of the sealing layer is between 0.2 and 2. 如申請專利範圍第1項所述之具雙微節流層之多孔質元件之製作方法,其中該多孔質載板具有一第一厚度,該封孔層具有一第二厚度,該第一厚度係介於2 mm至30 mm之間,該第二厚度係介於0.005 mm至0.2 mm之間。The method for fabricating a porous element having a double micro-throttle layer according to claim 1, wherein the porous carrier has a first thickness, and the sealing layer has a second thickness, the first thickness The system is between 2 mm and 30 mm and the second thickness is between 0.005 mm and 0.2 mm. 如申請專利範圍第1項所述之具雙微節流層之多孔質元件之製作方法,其中在進行該膠封製程與進行該通孔加工之步驟間,另包含有對設置有封孔層的該多孔質載板進行充氣測試之步驟。The method for fabricating a porous element having a double micro-throttle layer according to claim 1, wherein a step of performing the sealing process and the step of performing the through hole further comprises providing a sealing layer The porous carrier plate is subjected to an inflation test step. 如申請專利範圍第1項所述之具雙微節流層之多孔質元件之製作方法,其中該封孔層具有一上表面,在進行該通孔加工之前,另包含有對該封孔層之該上表面進行整平步驟。The method for fabricating a porous element having a double micro-throttle layer according to claim 1, wherein the sealing layer has an upper surface, and the sealing layer is further included before the processing of the through hole The upper surface is subjected to a leveling step. 如申請專利範圍第6項所述之具雙微節流層之多孔質元件之製作方法,其中在對該封孔層之該上表面進行整平與進行該通孔加工步驟之間,另包含有對該多孔質載板進行充氣測試之步驟。The method for fabricating a porous element having a double micro-throttle layer according to claim 6, wherein between the step of flattening the upper surface of the sealing layer and the step of performing the through hole, There is a step of performing an inflation test on the porous carrier. 一種具雙微節流層之多孔質元件,其包含:  一多孔質載板,其具有複數個微孔通道及一表面,各該微孔通道的一開口顯露於該表面;以及  一封孔層,設置於該多孔質載板之該表面,該封孔層之材質為一膠體,該封孔層具有複數個通孔,各該通孔貫穿該封孔層且連通該多孔質載板之該些微孔通道。A porous element having a double micro-throttle layer, comprising: a porous carrier plate having a plurality of microporous channels and a surface, an opening of each of the microporous channels being exposed on the surface; and a hole a layer disposed on the surface of the porous carrier, the material of the sealing layer being a gel, the sealing layer having a plurality of through holes, each of the through holes penetrating the sealing layer and communicating with the porous carrier The microporous channels. 如申請專利範圍第8項所述之具雙微節流層之多孔質元件,其中該封孔層另具有一滲透層及一密封層,該滲透層滲入該多孔質載板中,該密封層位於該多孔質載板之該表面上方,各該通孔貫穿該封孔層的該密封層及該滲透層並連通位於該滲透層下方的該些微孔通道。The porous element having a double micro-throttle layer according to claim 8, wherein the sealing layer further has a permeation layer and a sealing layer, and the permeation layer penetrates into the porous carrier plate, the sealing layer Located above the surface of the porous carrier, each of the through holes penetrates the sealing layer of the sealing layer and the permeation layer and communicates with the microporous channels located below the permeation layer. 如申請專利範圍第8項所述之具雙微節流層之多孔質元件,其中該膠體係高分子環氧樹脂。A porous element having a double micro-throttle layer according to claim 8 of the patent application, wherein the glue system is a polymer epoxy resin.
TW102112771A 2013-04-10 2013-04-10 Method of fabricating a porous device with dual restrictive layers and structure thereof TWI491582B (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006224552A (en) * 2005-02-18 2006-08-31 Dainippon Printing Co Ltd Laminate
TW201139543A (en) * 2010-04-15 2011-11-16 Ppg Ind Ohio Inc Microporous material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006224552A (en) * 2005-02-18 2006-08-31 Dainippon Printing Co Ltd Laminate
TW201139543A (en) * 2010-04-15 2011-11-16 Ppg Ind Ohio Inc Microporous material

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