TWI489003B - Processing chamber with heated chamber liner - Google Patents

Description

Processing chamber with heated chamber liner

Embodiments of the present invention generally relate to a semiconductor processing chamber, and more particularly to a gasket assembly for a semiconductor processing chamber.

Semiconductor processing involves several different chemical and physical processes whereby a tiny integrated circuit is created on the substrate. The material layer constituting the integrated circuit is formed by chemical vapor deposition, physical vapor deposition, epitaxial growth, or the like. Some of the material layers are patterned using a photoresist mask and wet or dry etching techniques. The substrate used to form the integrated circuit can be germanium, gallium arsenide, indium phosphide, glass, or other suitable material.

In the fabrication of integrated circuits, the plasma process is typically used for the deposition or etching of multiple layers of material. The plasma process offers more advantages over the thermal process. For example, plasma assisted chemical vapor deposition (PECVD) allows the deposition process to be carried out at lower temperatures and higher deposition rates relative to similar thermal processes. Therefore, PECVD is advantageous for the fabrication of integrated circuits having a rigorous thermal budget, such as for the fabrication of very large or very large integrated circuits (VLSI or ULSI) components.

A problem encountered in the plasma process is the non-uniform temperature distribution within the process chamber during processing. In some systems, two opposing electrode systems are disposed in the processing chamber and define a processing region in a central region of the processing chamber. The oppositely disposed electrodes are used to maintain a plasma in the processing area. The plasma provides free energy and thermal energy for processing the substrate disposed in the chamber. Plasma and Thermal energy is generally concentrated in the central region of the processing chamber, so a temperature gradient is formed in the center and side regions (e.g., sidewalls) of the processing chamber.

In a processing system having an adjacent processing chamber or other external heat source for heating one of the chambers (or the sides) and more than the other, the temperature change is more severe. For example, in a processing chamber body, it has two plasma processing regions separated by a common inner wall, the inner wall is heated by plasma from two regions, and the outer wall is only one of them. The plasma is heated whereby an unbalanced thermal load is created, thereby making the outer wall cooler than the inner wall. This low temperature may cause the process gas or precursor to condense on the wall surface having a lower temperature, thereby causing the generation of particles and causing contamination of the deposited film.

The generation of particles in the chamber also accumulates in the pumping port and eventually blocks the suction port, so the process needs to be interrupted to clean the suction port. In addition, particles in the chamber can jeopardize the chamber seal, thereby causing thermal energy loss and worsening the temperature uniformity of the chamber walls.

Accordingly, there is a need for an improved method and apparatus that enhances temperature uniformity along the boundaries of a processing zone.

Embodiments of the present invention provide a heater gasket assembly suitable for use in a plasma processing chamber. In some embodiments, a pad assembly for a processing chamber includes: a heating element embedded in a body; a flange extending outwardly from an outer diameter of the body, and having an upper surface on one of the flanges a sealing surface; and at least one contact pad extending from the upper surface of the flange to a super The height of the surface that has been sealed.

In some embodiments, a gasket assembly for a processing chamber includes: a ceramic body having an inner diameter surface, the inner diameter surface defining a portion of a pumping chamber; and a suction hole system for threading The body is fluidly coupled to the pumping chamber through the inner diameter surface; a heating element is embedded in the body; a flange extends outwardly from an outer diameter of the body and has an upper surface, the upper surface of the flange One portion has a sealing surface; at least one contact pad extends from the upper surface of the flange to a height exceeding the sealing surface; at least one thermal choke is defined in the flange; a recess is formed in the upper surface and located Between the sealing surface and the contact pads. Contact pads, chokes, and recesses promote control of the temperature of the gasket assembly.

In other embodiments, a gasket assembly for a processing chamber includes an annular ceramic heater gasket having at least one embedded heater. The heater pad has a contact pad and the contact pad is configured to minimize contact area between the heater pad and the processing chamber; an annular ceramic suction pad is disposed adjacent to the heater pad and Located on a radially inner side of the heater gasket, the suction gasket has a plurality of suction ports disposed therein, the suction ports being configured to allow gas to enter a boundary defined between the suction gasket and the heater gasket a pumping chamber; an intermediate gasket disposed adjacent to the heater gasket and located radially inward of the heater gasket and adjacent to the suction gasket and located below the suction cushion; a tubular sleeve coupled To the intermediate liner, the sleeve has a substrate passageway disposed therein to allow the substrate to pass through the liner assembly.

The pad assembly of the present invention advantageously minimizes heat transfer between the chamber body and the pad assembly. In some embodiments, the pad assembly can be configured to compensate for non-uniform heating of the pad assembly whereby the temperature of the pad assembly can be maintained with a uniform or non-uniform distribution.

Embodiments of the present invention are generally described below with reference to a plasma assisted chemical vapor deposition (PECVD) system. PECVD system is applicable to a benefit of the present invention include PRODUCER ^® SE CVD system or DXZ ^® CVD system, both of which are commercially available from Applied Materials, Inc. of Santa Clara, California (Applied Materials, Inc.). PRODUCER ^® SE CVD system (e.g., 200mm or 300mm) having two isolated processing regions is provided, which can be used for depositing a carbon-doped silicon oxide, and other materials, and is described in U.S. Patent No. 5,855,681 and second No. 6,495,233. The DXZ ^® CVD chamber is disclosed in U.S. Patent No. 6,364,954. While the exemplary embodiment includes two processing regions, it is also contemplated that the present invention is also beneficial to systems having a single processing region. It is also contemplated that the present invention is beneficial to other plasma chambers, including etch chambers, ion implant chambers, plasma processing chambers, and strip chambers. It is also contemplated that the present invention is beneficial to plasma processing chambers from other manufacturers.

"FIG. 1" is a partial cross-sectional view of a PECVD system 100 having an embodiment of a chamber liner assembly 127 of the present invention. The PECVD system 100 generally includes a chamber body 102 having a sidewall 112, a bottom wall 116, and an inner wall 101 to define a pair of processing regions 120A-B. The various processing regions 120A-B are similarly configured, so for the sake of brevity, only the components in the processing region 120B are described herein.

The pedestal 128 is disposed in the processing area 120B and is formed through Channel 122 of bottom wall 116 in system 100. The pedestal 128 is adapted to support a substrate (not shown) above its upper surface. The pedestal 128 can include a heating element, such as a resistive element, to heat and control the substrate temperature at a desired process temperature. Alternatively, the pedestal 128 can be heated by a remote heating element, such as a light assembly.

The pedestal 128 is coupled to the drive system 103 by a shaft 126 whereby the height of the console mount 128 in the processing zone 120B. The shadow ring 106 can be disposed about the pedestal 128, and at a desired height of the pedestal 128, the shadow ring 106 can engage the substrate.

The rod 130 passes through a passage 124 formed in the bottom wall 116 and serves to activate the substrate lift pin 161 that is threaded through the pedestal 128. The substrate lift pin 161 can selectively space the substrate from the pedestal 128 to facilitate replacement of the substrate by a robot arm (not shown), and the robot arm transmits the substrate into and out of the processing region 120B through the substrate transfer port 160. .

The chamber cover 104 is coupled to the top end portion of the chamber body 102. The chamber cover 104 houses more of the gas distribution system 108 disposed therein. Gas distribution system 108 includes a gas inlet passage 140 that delivers reactants and cleaning gases to treatment zone 120B through jet head assembly 142. The air jet head assembly 142 includes an annular base plate 148, and the plate 148 has a baffle 144 disposed between it and the face plate 146. An RF (radio frequency) source 165 is coupled to the jet head assembly 142. The RF source 165 supplies power to the jet head assembly 142 to facilitate the generation of plasma between the face plate 146 of the jet head assembly 142 and the heated pedestal 128. In an embodiment, the RF source 165 can be a high frequency radio frequency (HFRF) power source, such as a 13.56 MHz RF generator. In another embodiment, the RF source 165 can include an HFRF power source and a low frequency A radio frequency (LFRF) power source, such as a 300 kHz RF generator. Alternatively, the RF source can be coupled to other portions of the process chamber 100 (eg, pedestal 128) to facilitate plasma generation. A dielectric isolator 158 is disposed between the chamber cover 104 and the jet head assembly 142 to prevent RF power from being conducted to the chamber cover 104.

Optionally, a cooling passage 147 is formed in the annular base plate 148 of the gas distribution system 108 to cool the annular base plate 148 during operation. A heat transfer fluid (e.g., water or the like) can be circulated through the cooling passage 147 whereby the base plate 148 can be maintained at a predetermined temperature.

The chamber liner assembly 127 is disposed within the processing region 120B and is in close proximity to the inner wall 101 and sidewalls 112 of the chamber body 102 to prevent the inner wall 101 and sidewalls 112 from being exposed to the harsh processing environment in the processing region 120B. The pad assembly 127 includes a peripheral pumping chamber 125 coupled to the pumping system 164, and the pumping system 164 is configured to exhaust exhaust gases and by-products from the processing region 120B and control the processing region 120B. pressure. A plurality of exhaust ports 131 may be formed in the chamber liner assembly 127. The vent 131 is configured to allow airflow from the processing zone 120B to flow into the surrounding plenum 125 in a manner that facilitates processing in the deposition system 100.

"Picture 2" is a partial cross-sectional view of the spacer assembly 127 of "Fig. 1". The pad assembly 127 slides into the inner wall 101 and the side walls 112 of the chamber body 102, whereby the processing region 120B is confined within the pad assembly 127. The pad assembly 127 can be quickly removed from the chamber body 102, thereby facilitating replacement of the pad assembly 127 after several processing cycles. The pad assembly 127 is typically disposed in the pad assembly 127 or the chamber body 102 A seal (eg, an O-ring) within the gland 290 is intimately attached to the chamber body 102.

In an embodiment, the cushion assembly 127 can include a single integrated body to facilitate installation and removal of the cushion assembly 127 from the chamber body 102. In another embodiment, the cushion assembly 127 can include a series of separate liners that can be stacked or abutted together to reduce thermal expansion during use and/or to facilitate the cushion assembly 127 Install and remove.

In the embodiment shown in FIG. 2, the pad assembly 127 includes a heater pad 202, a suction pad 204, an upper middle pad 206, a lower middle pad 208, and a bottom pad 210. The pads 202, 204, 206, 208 are typically made of ceramic or other suitable material. In one embodiment, the pads 202, 204, 206, 208 can each be spaced apart and configured to allow relative movement therebetween, thereby adapting to possible mismatches caused by thermal expansion during processing, Therefore, the prevention component is cracked or damaged. The pads 202, 204, 206, 208 are optionally interlocked in a manner that provides enhanced mechanical strength, ease of operation, and/or maintain orientation.

The bottom liner 210 can be made of ceramic or aluminum and is generally configured to cover the bottom wall 116 of the chamber body 102. In an embodiment, the bottom liner 210 is generally dished.

Upper central liner 206 and lower central liner 208 are generally annular. The upper middle liner 206 includes slits, slits or slits to allow the sleeve coupled to the heater liner 202 to extend into the substrate transfer port 160 as will be further described below.

Heater gasket 202 includes one or more heaters 212. Heater 212 It can be a conduit for a heat transfer fluid to flow through the liner 202, or a resistive heating element. In the embodiment shown in FIG. 2, heater 212 is a resistive heating element coupled to power supply system 214.

As shown in a partial top view of heater pad 202 of "FIG. 3", heater wire 304 exits heater pad 202 by projection 302 (extending from the periphery of heater pad 202). The wire 304 can include a connector 306 that facilitates rapid coupling/decoupling from the power supply system 214 when the pad assembly 127 is removed/replaced. The power supply system 214 is adapted to controllably heat the chamber liner 202, thereby allowing the chamber liner 202 to be maintained within a predetermined temperature range during plasma processing.

The heater 212 can be configured such that one region of the liner 202 has a higher heating capacity relative to another region, whereby one region of the liner 202 is heated to a greater extent relative to the other region. The difference in heat conducted from heater 212 to pad 202 can be used to compensate for uneven heating or cooling by other sources, such that pad 202 has a uniform temperature profile or produces a non-uniform pad temperature profile. In other embodiments, the heater 212 controls the temperature of the heater liner 202 to be between about 100 ° C and about 200 ° C, but a higher liner can be used when using a seal made of a suitable high temperature material. Pad temperature.

4A and 4B are a top view and a cross-sectional view showing another embodiment of the spacer 202. In the embodiment shown in Figures 4A and 4B, the heater 212 of the gasket 202 is constructed of a plurality of heating elements 402 (e.g., cartridge heaters). The heating element 402 can be disposed about the liner 202, such as in a hole 404 formed in the liner 202. Each heating element 402 can be independently controlled to produce a predetermined Pad temperature distribution. In another embodiment, the spacing or heat capacity of the heating elements 402 can be selected to produce a predetermined pad temperature profile. For example, the region of the heater liner 202 located above the suction holes of the suction liner 204 (shown below at 564 of FIG. 5) may have a higher density of heating elements 402 to compensate for passage through the holes. The increased heat transfer caused by the high flow rate (compared to other areas of the liner 202).

Referring to "Fig. 2", heater pad 202 also includes a plurality of features that are configured to reduce heat transfer between pad assembly 127 and chamber body 102. In one embodiment, the heater liner 202 has an upper sealing surface 216 and the heater liner 202 is maintained spaced from the chamber lid 104 by an upper contact pad 230. The upper contact pad 230 extends from the upper surface 218 of the heater pad 202 to a height that allows for compression of a seal (not shown) disposed between the surface 216 of the pad 202 and the chamber cover 104. There is no substantial chamber cover contact with the liner in the sealed area (ie, surface 216). A recess 220 is formed in the upper surface 218 to enhance thermal isolation of the gasket 202 from the chamber cover 104. The upper contact pad 230 minimizes the contact area between the chamber cover 104 and the chamber liner 202, while the recess 220 maximizes the heat transfer gap therebetween, thereby allowing the chamber cover 104 and the liner 202 to be The heat transfer between them is reduced.

In an embodiment, the upper surface 218 of the heater liner 202 is provided with 18 cylindrical contact pads 230. It is also contemplated that different numbers, diameters, shapes, and distributions of contact pads 230 can be configured differently for specific process requirements and chamber design configurations.

An alignment feature is disposed between the liner 202 and the chamber body 102. In an embodiment, the alignment features can be formed as a single component or as a plurality of components disposed on the lower surface 224 of the heater pad 202 and arranged in a polar array. Alternatively, the alignment features may be formed in a portion of the chamber body 102 with the upper portion of the portion spaced from the heater liner 202. In the embodiment shown in FIG. 2, the alignment features include a hole 222 and a mating insert 226. The insert 226 can be in the form of a pin and extends between the chamber body 102 and the heater liner 202 to maintain the components in a predetermined orientation. The pin (eg, insert 226) can extend from at least one of the chamber body 102 or the heater liner 202 and can be made of a material having a lower heat transfer rate than the liner 202.

The heater liner 202 includes a body 240 having a pumping chamber 125 defined by its inner diameter. The upper outer flange 242 extends outwardly from the top of the body 240. A thermal choke 244 is formed in the flange 242 to be located inside the contact pad 230, thereby minimizing heat flow from the body 240 to the contact pad 230. The choke 244 reduces the contact area of the contact pad 230 and serves to minimize heat loss to the chamber body and simultaneously protect the seals disposed in the gland 290 (eg, O-rings, not shown) It is not affected by high temperatures (which may damage the O-ring or the integrity of the seal).

In one embodiment, the thermal choke 244 is an annular groove formed in the flange 242. In another embodiment, the thermal choke 244 is a plurality of trench segments formed in the flange 242, such as: 7 trench segments. The mesh flange material that couples the partial flange 242 on either side of the thermal choke 244 is selected to control the flow rate of heat through the choke 244, partially implemented In this example, the material can be selected such that heat passes through the region of the choke 244 at different angular positions along the heater pad 202 at different rates, thereby enhancing control of the temperature profile of the pad 202.

The upper inner flange 246 extends inwardly from the body 240 through the plenum 125. The lower inner flange 248 extends inwardly from the body 240 below the pumping chamber 125. The skirt 250 extends downwardly from the flange 248. In an embodiment, at least one flange 246, 248 supports the air extraction cushion 204 thereon.

The suction cushion 204 includes a body 252 having an exhaust port 131 disposed therein, a tapered upper inner portion 254, an upper outer lip 256, and a lower inner lip 258. The tapered upper inner portion 254 is configured to maintain a gap between the pad assembly 127 and the excitation panel 146. The upper outer lip 256 is staggered with the upper inner flange 246 of the heater pad 202, wherein the lower inner lip 258 is configured to support the shadow ring 106 when the pedestal 128 is moved to a position below the transfer port 160. .

FIG. 5 is a cross-sectional view of another portion of the pad assembly 127 showing the pumping path defined by the pumping chamber 125 of the pad assembly 127 to the air extraction port 502 formed in the chamber body 102. The heater liner 202 and/or the suction liner 204 of the gasket assembly 127 are configured to engage the inlet gasket 510, which provides a gasket for passage extending between the pumping chamber 125 and the suction port 502. The inlet liner 510 generally includes an insert 512 and a tubular 514.

The insert 512 includes a tapered and/or tapered outer diameter 516 that facilitates insertion of the insert 512 into a substantially horizontal passage 504 that is threaded through the chamber body 102 and that can be breached into the suction port 502. The tube 514 includes a cut-out 522 to receive the end of the insert 512 whereby The insert 512 and the internal passages 518, 520 of the tubular 514 form a linear conduit at the opening of the suction port 502. The tube 514 also includes a protrusion 562, and the protrusion 562 extends to the chamber exhaust port 564, and the chamber exhaust port 564 is disposed through the air suction pad 204 and is in fluid communication with the pumping chamber 125 defined therein. .

The inlet gasket 510 is disposed prior to the remaining liner assembly 127. First, the insert 512 is disposed in the horizontal channel 504. The tubular 514 is then mounted on the insert 512 whereby the aperture 522 engages the insert 512 and the channels 518, 520 are aligned. The upper middle liner 206 and the lower middle liner 208 are then installed to maintain the inlet liner 510 in position. Heater pad 202 and suction pad 204 can then be placed over upper central pad 206.

"Figs. 6A and 6B" are a bottom view and a side view of an embodiment of the heater pad 202. The heater liner 202 includes a slit 600 to allow the substrate to pass through the chamber liner assembly 127. The slit 600 is generally positioned opposite the projection 302 of the heater pad 202 and perpendicular to the chamber vent 564 in the suction pad 204. The outer diameter 604 of the heater liner 202 adjacent the slit 600 includes two mounting pads 602. Mounting pad 602 facilitates coupling of tubular sleeve 606 to heater liner 202 (as shown in the bottom view of heater liner 202 and sleeve 606 of Figure 6C). The heater gasket 202 and the sleeve 606 can be coupled by any suitable means, for example, by fasteners 610 that extend through a clearance hole 612 that is threaded through the heater gasket 202, and The threaded holes 614 in the tube 606 are engaged. When mated, the substrate channel 616 of the sleeve 606 (shown in phantom) is aligned with the slit 600 of the liner 202 to facilitate transport of the substrate through the liner assembly 127. Generally, before installing the heater gasket 202, the casing The 606 first slides into the substrate transfer port 160.

Accordingly, the present invention provides a heated chamber liner assembly. The heated chamber liner assembly provides thermal energy to heat the central processing zone and is substantially isolated from the thermal effects of the chamber wall and the chamber cover, thereby allowing a predetermined temperature profile of the chamber liner assembly to be achieved.

However, the present invention has been described above by way of a preferred embodiment, and is not intended to limit the present invention. Any modification and refinement made by those skilled in the art without departing from the spirit and scope of the present invention should still belong to the technology of the present invention. category.

100‧‧‧System/Processing Room

101‧‧‧ inner wall

102‧‧‧ chamber body

103‧‧‧Drive system

104‧‧‧Case cover

106‧‧‧ shadow ring

108‧‧‧Gas distribution system

112‧‧‧ side wall

116‧‧‧ bottom wall

120A-B‧‧‧Processing area

124‧‧‧ channel

125‧‧‧ pumping room

126‧‧‧ shaft

127‧‧‧Cushion assembly

128‧‧‧ pedestal

130‧‧‧ rod

131‧‧‧Exhaust port

140‧‧‧ channel

142‧‧‧Air jet head assembly

144‧‧‧Baffle

146‧‧‧ panel

147‧‧‧Cooling channel

148‧‧‧ tablet

158‧‧‧Isolator

160‧‧‧Transportation port

161‧‧‧Promotion

164‧‧‧Exhaust system

165‧‧‧RF source/RF source

202,204,206,208,210‧‧‧ pads

212‧‧‧heater

214‧‧‧Power supply system

216‧‧‧ surface

218‧‧‧ surface

220‧‧‧ recess

222‧‧‧ hole

224‧‧‧ surface

226‧‧‧ inserts

230‧‧‧Contact pads

240‧‧‧ Subject

242‧‧‧Flange

244‧‧‧Current

246‧‧‧Flange

248‧‧‧Flange

250‧‧‧ skirt

252‧‧‧ Subject

254‧‧‧ upper internal part

256‧‧‧ lip

258‧‧‧ lip

290‧‧‧seal sleeve

302‧‧‧ protruding parts

304‧‧‧ wire

306‧‧‧Connector

402‧‧‧ heating element

404‧‧‧ hole

502‧‧‧Exhaust port

504‧‧‧ channel

510‧‧‧ cushion

512‧‧‧ inserts

514‧‧‧ tubular

516‧‧‧ outside diameter

518‧‧‧ channel

520‧‧‧ channel

522‧‧‧Opening

562‧‧‧Protruding

564‧‧‧Exhaust hole/chamber exhaust

600‧‧‧slit

602‧‧‧ mounting mat

604‧‧‧ outside diameter

606‧‧‧ casing

610‧‧‧fasteners

612‧‧‧ clearance holes

614‧‧‧Threaded holes

616‧‧‧ channel

For a more detailed description of the above described features of the invention, reference should be made to

1 is a cross-sectional view of a PECVD system in accordance with an embodiment of the present invention; and FIG. 2 is a partial cross-sectional view of the pad assembly of FIG. 1 having a heater pad; FIG. 2 is a partial top view and a cross-sectional view showing another embodiment of the heater gasket; and FIG. 5 is a cross-sectional view showing another embodiment of the heater gasket; Another partial cross-sectional view of an embodiment; FIGS. 6A-6B illustrate a bottom view and a cross-sectional view of one embodiment of the upper middle liner; FIG. 6C is a bottom view showing the substrate transfer port sleeve coupled to the middle liner above the 6A-6B.

It is to be understood that the specific embodiments of the invention are not to be construed as limiting the scope of the invention. .

For the sake of understanding, the same component symbols in the drawings denote the same components. The components employed in one embodiment may be applied to other embodiments without particular detail.

102‧‧‧ chamber body

104‧‧‧Case cover

106‧‧‧ shadow ring

112‧‧‧ side wall

120B‧‧‧Processing area

125‧‧‧ pumping room

127‧‧‧Cushion assembly

128‧‧‧ pedestal

131‧‧‧Exhaust port

146‧‧‧ panel

158‧‧‧Isolator

202,204,206,208,210‧‧‧ pads

212‧‧‧heater

216‧‧‧ surface

218‧‧‧ surface

220‧‧‧ recess

222‧‧‧ hole

224‧‧‧ surface

226‧‧‧ inserts

230‧‧‧Contact pads

240‧‧‧ Subject

242‧‧‧Flange

244‧‧‧Current

246‧‧‧Flange

248‧‧‧Flange

250‧‧‧ skirt

252‧‧‧ Subject

254‧‧‧ upper internal part

256‧‧‧ lip

258‧‧‧ lip

290‧‧‧seal sleeve

Claims (26)

A pad assembly for a processing chamber, comprising: a pad body removably disposed in an inner sidewall of the processing chamber; a heater embedded in the pad body; a flange, Extending outwardly from an outer diameter of one of the pad bodies, a portion of the upper surface of the flange having a sealing surface; and at least one contact pad extending from the upper surface of the flange to a higher seal The height of the surface, wherein the pad body, the flange and the at least one contact pad integrally form a single heating pad. The pad assembly of claim 1, further comprising: at least one thermal choke defined in the flange. The gasket assembly of claim 2, wherein the thermal choke further comprises: at least one groove formed in the flange and located inside the contact pad. The pad assembly of claim 1, further comprising: a plurality of thermal chokes formed in the flange. The pad assembly of claim 1, wherein the flange further comprises: a recess formed in the upper surface between the sealing surface and the contact pad. The pad assembly of claim 1, wherein the heater further comprises: at least one resistive element. The pad assembly of claim 1, wherein the heater is configured to provide a higher heat capacity along a first surrounding portion of the pad body relative to a second surrounding portion (heating capacity) ). The pad assembly of claim 1, wherein the heater further comprises: a plurality of resistance heating elements. The pad assembly of claim 8, wherein the resistance heating elements are arranged in a polar array. The pad assembly of claim 8, wherein the resistance heating elements are densely disposed in one region relative to the other. The pad assembly of claim 1, further comprising: at least one pad extending from a lower surface of the pad body and configured to maintain a lining of the pad body relative to a chamber body The pad support surfaces are in a spaced relationship. The pad assembly of claim 1, wherein an inner diameter surface of the pad body defines a portion of a pumping cavity. The pad assembly of claim 12, further comprising: a suction hole threaded through the pad body and fluidly coupled to the pumping chamber through the inner diameter surface (fluidly Coupling). The pad assembly of claim 1, further comprising: a suction pad forming an internal boundary of the pumping chamber. The gasket assembly of claim 14, wherein the air suction cushion further comprises: a plurality of air suction ports that are disposed through the air suction cushion, and the air suction ports are fluid with the air suction chamber Coupling. The pad assembly of claim 1, wherein the pad body further comprises: The substrate is inserted through the substrate inlet of the pad body. The pad assembly of claim 1, further comprising: a tubular sleeve coupled to the pad body and aligned with the substrate inlet. A gasket assembly for a processing chamber, comprising: a ceramic liner body removably disposed in an interior sidewall of the processing chamber and having an inner diameter surface defining a pumping a portion of the plenum; a venting hole is bored through the body of the lining and is fluidly coupled to the plenum through the inner diameter surface; a heater is embedded in the lining body; a flange extending outwardly from an outer diameter of one of the gasket main bodies, a portion of the upper surface of the flange having a sealing surface; at least one contact pad extending from the upper surface of the flange to a higher level a height of the sealing surface, wherein the gasket body, the flange and the at least one contact pad integrally form a single heating pad; at least one thermal choke is defined in the flange; and a recess, Formed in the upper surface between the sealing surface and the contact pad. A pad assembly for a processing chamber, comprising: An annular ceramic heater gasket having at least one heater embedded therein, the heater gasket having a flange extending outwardly from an outer diameter of the heater gasket and from one of the flanges a contact pad extending from the surface, the flange integrally forming a single heater pad with the contact pad and configured to minimize contact area with the processing chamber; an annular ceramic suction pad, Provided adjacent to the heater gasket and located radially inward of the heater gasket, the air suction gasket has a plurality of suction ports disposed therein, the air suction ports being configured to allow gas to enter An air venting chamber between the air venting gasket and the heater gasket; and a tubular sleeve coupled to the heater gasket, the sleeve having a substrate passage disposed therein. The pad assembly of claim 19, wherein the heater pad further comprises: at least one thermal choke. The gasket assembly of claim 19, wherein the heater gasket further comprises: at least one electric resistance heater capable of asymmetrically heating the heater gasket. The pad assembly of claim 19, wherein the air cushion further comprises an upper outer lip, the upper outer lip and the heating The inner flange above one of the pads is staggered. A pad assembly for a processing chamber, comprising: a pad body; a flange extending outwardly from an outer diameter of one of the pad bodies, a portion of an upper surface of the flange having a sealing surface; And a plurality of contact pads extending from the upper surface of the flange to a height above the sealing surface, wherein the pad body, the flange and the contact pads integrally form a single pad. The pad assembly of claim 23, wherein the contact pads are cylindrical contact pads. A processing chamber comprising: a chamber body having a plurality of side walls, a bottom wall, and a chamber cover coupled to a top end portion of the chamber body, and defining one or more treatments in the chamber body a pad assembly comprising: a pad body removably disposed within a sidewall of the processing chamber; a heater embedded in the pad body; a flange formed by the pad One of the outer diameters of the body extends outwardly, and a portion of the upper surface of the flange forms a sealing surface, wherein a concave shape Formed in the upper surface of the flange; and a plurality of contact pads extending from the upper surface of the flange to a height above the sealing surface, wherein each of the plurality of contact pads contacts the A portion of the chamber cover, and the pad body, the flange and the plurality of contact pads integrally form a single heating pad. The process chamber of claim 25, wherein the plurality of contact pads are cylindrical contact pads.