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TWI486585B - Capacitive moisture detection device - Google Patents

Capacitive moisture detection device Download PDF

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TWI486585B
TWI486585B TW101141790A TW101141790A TWI486585B TW I486585 B TWI486585 B TW I486585B TW 101141790 A TW101141790 A TW 101141790A TW 101141790 A TW101141790 A TW 101141790A TW I486585 B TWI486585 B TW I486585B
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electrode
detecting device
output
moisture
sensor
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TW101141790A
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TW201403062A (en
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Koichi Nakano
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Hokuto Electronics Inc
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Description

電容式水分檢測裝置Capacitive moisture detecting device 發明領域Field of invention

本發明是有關於一種檢測電容對應周圍環境之水分比例或狀態之變化以輸出檢測信號之電容式水分檢測裝置。本發明之水分檢測裝置可利用作為檢測冷卻器結霜狀態之結霜感應器、對應土之乾燥狀態來檢測是否需要灑水之灑水感應器、或液面感應器。The present invention relates to a capacitive moisture detecting device for detecting a change in a ratio or state of moisture of a surrounding environment to output a detection signal. The moisture detecting device of the present invention can detect a sprinkling sensor or a liquid level sensor that is required to be sprinkled by using a frosting sensor that detects a frosting state of the cooler and a dry state corresponding to the soil.

發明背景Background of the invention

以往冰箱或冷凍庫等冷凍冷藏裝置中,有水分冷卻成為霜而附著於冷卻器之問題,為解決此問題已經有提出了多種除霜方法。Conventionally, in a refrigerating and freezing apparatus such as a refrigerator or a freezer, there is a problem that moisture is cooled and adhered to a cooler, and various defrosting methods have been proposed to solve this problem.

例如,使用計時器,在適當之時間間隔後驅動加熱器,以加熱冷卻器等來進行除霜。然而,在此狀況下為確實進行除霜,而有過度驅動浪費電力之問題。For example, using a timer, the heater is driven after an appropriate time interval to heat the cooler or the like for defrosting. However, in this case, there is a problem that defrosting is actually performed, and there is excessive driving to waste power.

因此,已有提出藉由感應器來檢測冷卻器是否有結霜,在有結霜時啟動加熱器來除霜之方案。Therefore, it has been proposed to detect whether the cooler has frost by means of an inductor, and to start the heater to defrost when there is frost.

例如,已有提出設置由金屬棒構成且面對冷卻器之電界感應器,檢測結霜所造成之電容變化之方案(專利文獻1)。專利文獻1中記載,對電界感應器施加交流信號以發 射電波。在電界感應器之發射電波範圍內若有結霜則電容將有變化,因此可藉由檢測電容之變化來檢測出結霜狀態。For example, it has been proposed to provide an electrical boundary sensor composed of a metal bar and facing a cooler to detect a change in capacitance caused by frosting (Patent Document 1). Patent Document 1 describes that an alternating current signal is applied to an electrical boundary sensor to emit Radio waves. If there is frost within the range of the transmitted wave of the electrical sensor, the capacitance will change, so the frosting state can be detected by detecting the change in capacitance.

【先行技術文獻】[First technical literature] 【專利文獻】[Patent Literature]

【專利文獻1】日本發明專利公開2010-91171號[Patent Document 1] Japanese Invention Patent Publication No. 2010-91171

發明概要Summary of invention

然而,在專利文獻1所揭露之檢測方法下,電界感應器所發射電波將到達包含周邊開放空間之寬廣領域,其電波發射範圍甚廣。因此,多種之因素會影響其檢測精度,而有難以提高檢測精度之問題。However, under the detection method disclosed in Patent Document 1, the electric wave emitted by the electric boundary sensor will reach a wide area including the peripheral open space, and its radio wave emission range is wide. Therefore, various factors affect the detection accuracy, and it is difficult to improve the detection accuracy.

對此,專利文獻1之檢測方法中,是在與電界感應器之電極相同之環境中設置偽裝電極,利用偽裝電極之輸出來對電界感應器之輸出變動進行環境變化修正。因此,須要偽裝電極及其控制電路,而有全體之構成複雜化之問題。On the other hand, in the detection method of Patent Document 1, a dummy electrode is provided in the same environment as the electrode of the electric boundary sensor, and the output change of the electric boundary sensor is corrected by the output of the camouflage electrode. Therefore, it is necessary to disguise the electrode and its control circuit, and there is a problem that the overall configuration is complicated.

本發明有鑑於上述問題,以提供一種不需設置偽裝電極仍可以充分的精度來檢出結霜狀態等、且構造簡單之電容式水分檢測裝置為目的。In view of the above problems, the present invention has an object of providing a capacitive moisture detecting device which is capable of detecting a frosting state with sufficient accuracy without providing a dummy electrode.

本發明之一實施形態之裝置,是一種電容式水分檢測裝置,係檢測因應周圍環境之水分比例或狀態之電容之變化而輸出檢測信號者,包含有:電容感應器,係具有相互呈相對向配置之第1電極與第2電極,且電容因應前述 第1電極與前述第2電極間之水分比例或狀態而變化者;驅動部,係對前述電容感應器施加交流信號者;及判定部,係因應來自前述電容感應器之輸出電壓之大小,進行二元化並輸出導通或截止之檢測信號者。An apparatus according to an embodiment of the present invention is a capacitive moisture detecting device that detects a change in capacitance in response to a change in a ratio of a moisture content of a surrounding environment or a state, and includes: a capacitive sensor having a mutual orientation Configuring the first electrode and the second electrode, and the capacitance is in accordance with the foregoing The ratio of the water content or the state between the first electrode and the second electrode is changed; the driving unit is an alternating current signal to the capacitance sensor; and the determining unit is based on the magnitude of the output voltage from the capacitance sensor. Binary and output the detection signal that is turned on or off.

前述電容感應器可連接於前述驅動部之輸出與前述判定部之輸入之間,亦可連接於前述驅動部之輸出與接地線之間。The capacitance sensor may be connected between an output of the driving unit and an input of the determining unit, or may be connected between an output of the driving unit and a ground line.

前述判定部可藉由比較來自前述電容感應器之輸出電壓與預先設定之閾值,來進行前述二元化。The determining unit may perform the binarization by comparing an output voltage from the capacitance sensor with a predetermined threshold.

藉由本發明,可提供一種不設置偽裝電極仍可以充分的精度來檢出結霜狀態等、且構造簡單之電容式水分檢測裝置。According to the present invention, it is possible to provide a capacitive moisture detecting device which is capable of detecting a frosting state with sufficient accuracy without providing a dummy electrode and having a simple structure.

1、1B、1D‧‧‧結霜狀態檢測裝置(電容式水分檢測裝置)1, 1B, 1D‧‧‧ frost condition detection device (capacitive moisture detection device)

11、11B、11C、11D‧‧‧驅動部11, 11B, 11C, 11D‧‧‧ drive department

12、12B、12C、12D‧‧‧判定部12, 12B, 12C, 12D‧‧‧Decision Department

13‧‧‧結霜感應器(電容感應器)13‧‧‧Frost sensor (capacitive sensor)

13C、13D‧‧‧水分感應器(電容感應器)13C, 13D‧‧‧ moisture sensor (capacitive sensor)

1C‧‧‧檢測裝置(電容式水分檢測裝置)1C‧‧‧Detection device (capacitive moisture detection device)

21,21C、21D‧‧‧基板21, 21C, 21D‧‧‧ substrates

22、22C‧‧‧第1圖形電極(第1電極)22, 22C‧‧‧1st pattern electrode (1st electrode)

22Da、b‧‧‧第1電極22Da, b‧‧‧ first electrode

23、23C‧‧‧第2圖形電極(第2電極)23, 23C‧‧‧2nd graphic electrode (2nd electrode)

23D‧‧‧第2電極23D‧‧‧2nd electrode

31、32‧‧‧電極棒(第1電極、第2電極)31, 32‧‧‧electrode rod (first electrode, second electrode)

31B、32B‧‧‧電線(第1電極、第2電極)31B, 32B‧‧‧ wires (first electrode, second electrode)

31C、32C‧‧‧電線(第1電極、第2電極)31C, 32C‧‧‧ wires (first electrode, second electrode)

32、30B、30C‧‧‧水分感應器(電容感應器)32, 30B, 30C‧‧‧ moisture sensor (capacitive sensor)

C1‧‧‧電容器C1‧‧‧ capacitor

C2‧‧‧電容器(電容零件)C2‧‧‧ capacitor (capacitor parts)

C3‧‧‧電容器(第2電容零件)C3‧‧‧ capacitor (second capacitor part)

Cs‧‧‧電容Cs‧‧‧ capacitor

D2‧‧‧二極體D2‧‧‧ diode

GS‧‧‧訊號產生部GS‧‧‧Signal Generation Department

HA‧‧‧梳齒HA‧‧‧ comb teeth

IF、IF B‧‧‧輸入介面部IF, IF B‧‧‧ input face

KD、KDB、KDC、KDD‧‧‧二元化部KD, KDB, KDC, KDD‧‧‧Dualization Department

RKP‧‧‧冷卻管RKP‧‧‧ Cooling tube

Q3‧‧‧NOT電路(第1NOT電路)Q3‧‧‧NOT circuit (1st NOT circuit)

Q4‧‧‧NOT電路(第2NOT電路)Q4‧‧‧NOT circuit (2nd NOT circuit)

Q6‧‧‧NOT電路(修正部)Q6‧‧‧NOT circuit (correction department)

R1‧‧‧電阻器R1‧‧‧Resistors

R10‧‧‧電阻(回饋電阻)R10‧‧‧resistance (feedback resistor)

R2‧‧‧電阻器(電阻零件)R2‧‧‧Resistors (resistance parts)

R3‧‧‧電阻(第2電阻零件)R3‧‧‧resistance (second resistance part)

RK‧‧‧冷凍機RK‧‧‧Freezer

RP‧‧‧冷卻器RP‧‧‧cooler

Rs‧‧‧電阻值Rs‧‧‧ resistance value

S1‧‧‧輸出電壓S1‧‧‧ output voltage

S1a‧‧‧交流訊號S1a‧‧‧ exchange signal

S1b‧‧‧輸出電壓S1b‧‧‧ output voltage

S1c‧‧‧輸出電壓S1c‧‧‧ output voltage

S2、S2a、S2b‧‧‧檢測訊號S2, S2a, S2b‧‧‧ detection signals

SYD‧‧‧修正部SYD‧‧‧Amendment

th‧‧‧閾值Th‧‧‧ threshold

th1、th1a、th1b‧‧‧閾值(第1閾值)Thr1, th1a, th1b‧‧‧ threshold (first threshold)

th2‧‧‧閾值(第2閾值)Th2‧‧‧ threshold (second threshold)

Zs‧‧‧電阻Zs‧‧‧ resistance

第1圖係顯示第1實施形態之結霜狀態檢測裝置構成之 圖。Fig. 1 is a view showing the configuration of a frosting state detecting device according to the first embodiment. Figure.

第2圖係顯示第1實施形態中使用之結霜感應器外型之正面圖。Fig. 2 is a front elevational view showing the appearance of the frost sensor used in the first embodiment.

第3圖係顯示結霜狀態檢測裝置之具體電路之一例之圖。Fig. 3 is a view showing an example of a specific circuit of the frosting state detecting device.

第4圖係顯示第2實施形態之結霜狀態檢測裝置之電路例之圖。Fig. 4 is a view showing an example of a circuit of the frosting state detecting device of the second embodiment.

第5圖(A)~(C)係顯示第3實施形態之電容型檢測裝置 之外型之圖。Fig. 5 (A) to (C) show a capacitance type detecting device of a third embodiment A diagram of the appearance.

第6圖係顯示第3實施形態之電容型檢測裝置之電路例之圖。Fig. 6 is a view showing an example of a circuit of a capacitance detecting device according to a third embodiment.

第7圖係顯示檢測地面水分之水分感應器之例之圖。Fig. 7 is a view showing an example of a moisture sensor for detecting surface moisture.

第8圖係顯示將電容型檢測裝置使用作為液面感應器時之設置例之圖。Fig. 8 is a view showing an example of the arrangement when the capacitance type detecting device is used as a liquid level sensor.

第9圖(A)、(B)係顯示水分感應器之其他例之圖。Fig. 9 (A) and (B) are views showing other examples of the moisture sensor.

第10圖係顯示第4實施形態之結霜狀態檢測裝置之構成之圖。Fig. 10 is a view showing the configuration of the frosting state detecting device of the fourth embodiment.

第11圖係顯示第4實施形態中使用之結霜感應器之外型之正面圖。Fig. 11 is a front elevational view showing the appearance of the frost sensor used in the fourth embodiment.

第12圖係放大顯示第4實施形態之結霜感應器與冷卻管之一部分之圖。Fig. 12 is a view showing, in an enlarged manner, a part of the frost sensor and the cooling pipe of the fourth embodiment.

第13圖係顯示第4實施形態之結霜狀態檢測裝置之具體電路之一例之圖。Fig. 13 is a view showing an example of a specific circuit of the frosting state detecting device of the fourth embodiment.

第14圖係顯示實現NOT電路之電路例之圖。Fig. 14 is a view showing an example of a circuit for realizing a NOT circuit.

第15圖(A)~(C)係顯示結霜狀態檢測裝置之各部之波形例之圖。Fig. 15 (A) to (C) are diagrams showing examples of waveforms of respective portions of the frosting state detecting device.

第16圖(A)~(C)係顯示檢測出結霜狀態之狀況之圖。Fig. 16 (A) to (C) show the state in which the frosting state is detected.

第17圖係顯示修正部之動作狀態之圖。Fig. 17 is a view showing the operation state of the correction unit.

第18圖係顯示水分之狀態與冷凍機之運轉狀態間之關係例之圖。Fig. 18 is a view showing an example of the relationship between the state of moisture and the operating state of the refrigerator.

第19圖係用以說明冷凍機之運轉狀態變化之圖。Fig. 19 is a view for explaining changes in the operating state of the refrigerator.

較佳實施例之詳細說明Detailed description of the preferred embodiment 〔第1實施形態〕[First Embodiment]

首先,說明將本發明之電容式水分檢測裝置實施為結霜狀態檢測裝置之第1實施形態。First, a first embodiment in which the capacitive moisture detecting device of the present invention is implemented as a frosting state detecting device will be described.

第1圖中,結霜狀態檢測裝置1是由驅動部11、判定部12、及結霜感應器13等所構成。第2圖顯示結霜感應器13之外型。In the first drawing, the frosting state detecting device 1 is composed of a driving unit 11, a determining unit 12, a frost sensor 13, and the like. Fig. 2 shows the appearance of the frost sensor 13.

此等第1圖及第2圖中,驅動部11是對結霜感應器13施加交流訊號之電路。交流訊號使用正弦波、矩形波、三角波等。交流訊號之頻率以使用長波帶或中波帶之頻率。例如可使用50kHz~1MHz左右、或例如57kHz、400kHz、此等附近之頻率或其他頻率。In the first and second figures, the drive unit 11 is a circuit that applies an alternating current signal to the frost sensor 13. The sine wave, rectangular wave, triangular wave, etc. are used for the alternating signal. The frequency of the alternating signal to use the frequency of the long or medium band. For example, a frequency of about 50 kHz to 1 MHz, or for example, 57 kHz, 400 kHz, or the like, or other frequencies can be used.

判定部12配合結霜感應器13之輸出電壓S1之大小進行二元化,輸出顯示是否為結霜狀態之檢測訊號S2。The determination unit 12 performs binarization in accordance with the magnitude of the output voltage S1 of the frost sensor 13, and outputs a detection signal S2 indicating whether or not the frosting state is present.

也就是說,判定部12在基於因冷卻器RP之結霜 造成之後述結霜感應器13之第1圖形電極22與第2圖形電極23間之電阻值增大且電容減少所產生之交流訊號之輸出電壓S1比閾值更大時,輸出顯示為結霜狀態之檢測訊號S2。That is, the determination section 12 is based on frosting due to the cooler RP When the resistance value between the first pattern electrode 22 and the second pattern electrode 23 of the frosting sensor 13 described later increases and the output voltage S1 of the alternating current signal generated by the capacitance decrease is larger than the threshold value, the output is displayed as a frosting state. The detection signal S2.

結霜感應器13具有在基板21之表面上形成相互面對之圖形之第1圖形電極22及第2圖形電極23。結霜感應器13安裝於冷卻器RP之表面。The frosting sensor 13 has a first pattern electrode 22 and a second pattern electrode 23 which form a pattern facing each other on the surface of the substrate 21. The frosting sensor 13 is mounted on the surface of the cooler RP.

基板21是由玻璃環氧樹脂或陶瓷等所構成之板狀物。在基板21一側之表面上形成有由銅等金屬材料所形 成之第1圖形電極22及第2圖形電極23。又,基板21也可使用在膜狀絕緣體之表面上有由銅箔等所形成之圖形之軟性基板(FPC)。The substrate 21 is a plate made of glass epoxy resin, ceramics or the like. Formed on the surface of the substrate 21 side by a metal material such as copper The first pattern electrode 22 and the second pattern electrode 23 are formed. Further, as the substrate 21, a flexible substrate (FPC) having a pattern formed of a copper foil or the like on the surface of the film-like insulator may be used.

如第2圖所示,第1圖形電極22及第2圖形電極23皆為梳狀,形成為各自之梳齒HA相互面對之圖形。As shown in Fig. 2, the first pattern electrode 22 and the second pattern electrode 23 are comb-like, and are formed in a pattern in which the respective comb teeth HA face each other.

第2圖所示之實施形態中,第1圖形電極22及第2圖形電極23皆有3個梳齒HA,成為一者之梳齒HA之間有另一者之梳齒HA進入之狀態。藉此,第1圖形電極22之梳齒HA與第2圖形電極23之梳齒HA之間形成間隙(gap)GP。In the embodiment shown in Fig. 2, each of the first pattern electrode 22 and the second pattern electrode 23 has three comb teeth HA, and one of the comb teeth HA has a state in which the other comb tooth HA enters. Thereby, a gap GP is formed between the comb teeth HA of the first pattern electrode 22 and the comb teeth HA of the second pattern electrode 23.

結霜感應器13之尺寸可舉例如下。基板21例如可以是一邊為數公釐或數公分之矩形。例如縱1公分左右,橫2公分左右。也可以是非矩形之圓形、橢圓形、多角形等。第1圖形電極22之梳齒HA與第2圖形電極23之梳齒HA之間隙GP,例如是數十微米(μm)或數百微米左右。The size of the frosting sensor 13 can be exemplified as follows. The substrate 21 may be, for example, a rectangle having a side of several millimeters or a few centimeters. For example, about 1 cm in length and about 2 cm in width. It may also be a non-rectangular circle, an ellipse, a polygon, or the like. The gap GP between the comb teeth HA of the first pattern electrode 22 and the comb teeth HA of the second pattern electrode 23 is, for example, several tens of micrometers (μm) or several hundreds of micrometers.

結霜感應器13中,第1圖形電極22與第2圖形電極23間之電阻值Rs之初期值為數十M Ω以上,但若附著水滴則會降低數十k Ω左右。若附著之水滴凍結成為冰或霜,則會上升數百k Ω左右。In the frosting sensor 13, the initial value of the resistance value Rs between the first pattern electrode 22 and the second pattern electrode 23 is several tens of megameters or more, but if water droplets are attached, it is reduced by several tens of k Ω. If the attached water droplets freeze into ice or frost, it will rise by several hundred k Ω.

又,第1圖形電極22與第2圖形電極23間之電容Cs之初期值為十pF或數十pF,若附著水滴則會增加其80倍左右。若附著之水滴凍結為冰或霜,則電容Cs會降低到其為水時之1/20左右。Further, the initial value of the capacitance Cs between the first pattern electrode 22 and the second pattern electrode 23 is ten pF or several tens of pF, and if water droplets are attached, it is increased by about 80 times. If the attached water droplet freezes into ice or frost, the capacitance Cs will decrease to about 1/20 of that when it is water.

如此,結霜感應器13中,電阻值Rs及電容Cs會因為表面有附著水滴之場合與未附著之場合、水滴凍結之場 而大幅變化。由於在水滴凍結時電阻值Rs增大而電容Cs減少,因此對於交流訊號之電阻Zs(=Rs+1/j ω Cs)會大幅增加。Thus, in the frosting sensor 13, the resistance value Rs and the capacitance Cs may be due to the occasion where the surface has water droplets attached thereto and the case where the water droplets are not attached, and the water droplets are frozen. And drastic changes. Since the resistance value Rs increases while the water droplet freezes and the capacitance Cs decreases, the resistance Zs (=Rs+1/j ω Cs) for the alternating current signal is greatly increased.

又,梳齒HA之個數、形狀、長度、梳齒HA間之間隙GP之大小等,可選擇許多種。若將梳齒HA之個數及長度增大,則電阻值Rs降低,電容Cs増大。若將梳齒HA間之間隙GP減小,則電阻值Rs降低,電容Cs増大。Further, a plurality of types of the comb teeth HA, the shape, the length, and the size of the gap GP between the comb teeth HA can be selected. When the number and length of the comb teeth HA are increased, the resistance value Rs is lowered and the capacitance Cs is increased. When the gap GP between the comb teeth HA is reduced, the resistance value Rs is lowered and the capacitance Cs is increased.

本實施形態中,是利用如此水滴之凍結所造成之結霜感應器13之電阻Zs之變化,來檢出有無結霜狀態。In the present embodiment, the presence or absence of the frosting state is detected by the change in the resistance Zs of the frosting sensor 13 caused by the freezing of the water droplets.

如第1圖所示,結霜感應器13是安裝為靠近或接觸冷卻器RP之狀態。例如,可使用螺絲等,直接或透過間隔件螺合於冷卻器RP上。或者,使用接著劑等直接貼附於冷卻器RP之冷卻管。或者,使用雙面膠帶貼付於冷卻器RP之表面。As shown in Fig. 1, the frosting sensor 13 is mounted in a state of being close to or in contact with the cooler RP. For example, it can be screwed to the cooler RP directly or through a spacer using a screw or the like. Alternatively, a cooling pipe directly attached to the cooler RP using an adhesive or the like is used. Alternatively, the double sided tape is applied to the surface of the cooler RP.

藉此,結霜感應器13中之第1圖形電極22與第2圖形電極23間之大氣之狀態及大氣中含有的水分之狀態將配合冷卻器RP之結霜狀態或凍結狀態改變,而電阻Zs會因此變化。Thereby, the state of the atmosphere between the first pattern electrode 22 and the second pattern electrode 23 in the frosting sensor 13 and the state of the moisture contained in the atmosphere are changed in accordance with the frosting state or the frozen state of the cooler RP, and the resistance is changed. Zs will change accordingly.

又,由於結霜感應器13是安裝為靠近冷卻器RP,因此將設置於大氣環境中。也就是,在本本實施形態中,結霜感應器13是檢測有無因冷卻器RP之冷卻効果所造成之大氣中之水分凍結而改變為霜狀,而不是收納於特定之容器等中之水是否凍結。Further, since the frosting sensor 13 is mounted close to the cooler RP, it will be installed in an atmospheric environment. In other words, in the present embodiment, the frost sensor 13 detects whether or not the moisture in the atmosphere due to the cooling effect of the cooler RP freezes and changes to a frost shape, instead of whether the water contained in a specific container or the like is water. freeze.

因此,結霜感應器13可安裝為其溫度接近冷卻器RP之表面溫度。藉由令結霜感應器13之溫度與冷卻器RP之 表面溫度為同一程度,可使冷卻器RP附近之大氣中中水蒸氣成為水滴附著於結霜感應器13之間隙GP,若溫度降至冰點以下,則水滴會凍結為霜狀。Therefore, the frosting sensor 13 can be installed with its surface temperature close to the surface temperature of the cooler RP. By letting the temperature of the frosting sensor 13 and the cooler RP When the surface temperature is the same, the water vapor in the atmosphere near the cooler RP can be made to adhere to the gap GP of the frost sensor 13 when the water droplets fall, and if the temperature falls below the freezing point, the water droplets will freeze to a frosty shape.

接著,說明驅動部11及判定部12之具體電路例。Next, a specific circuit example of the drive unit 11 and the determination unit 12 will be described.

第3圖中,驅動部11是由NOT電路Q1、Q2、電阻器R1、R2、及電容器C1等所構成。藉由NOT電路Q1、Q2、電阻器R1、及電容器C1來構成產生交流訊號之訊號產生部GS。且為訊號產生部GS之輸出側串聯連接電阻器R2之狀態。In Fig. 3, the drive unit 11 is composed of NOT circuits Q1 and Q2, resistors R1 and R2, and a capacitor C1. The signal generating unit GS that generates the alternating current signal is configured by the NOT circuits Q1 and Q2, the resistor R1, and the capacitor C1. Further, the state of the resistor R2 is connected in series to the output side of the signal generating portion GS.

藉由電阻器R2與結霜感應器13之電阻Zs來構成具頻率選擇性之分壓電路。電阻器R2之值是設定為由結霜所引起之輸出電壓S1之變化相對於驅動部11所輸出之交流訊號之頻率增大。因此,電阻器R2之電阻值是配合結霜感應器13之電阻Zs來設定。例如,數十K ω或數百k Ω左右,例如100k Ω左右。A frequency selective voltage dividing circuit is formed by the resistor R2 and the resistance Zs of the frosting inductor 13. The value of the resistor R2 is set such that the change in the output voltage S1 caused by the frost increases with respect to the frequency of the alternating current signal output from the driving portion 11. Therefore, the resistance value of the resistor R2 is set in accordance with the resistance Zs of the frosting inductor 13. For example, tens of K ω or hundreds of k Ω, for example, about 100k Ω.

判定部12是由NOT電路(二元化電路)Q3、NOT電路Q4~Q5、電阻器R3~R8、電容器C2、C3、二極體D1、發光二極體LEDa、LEDb等所構成。藉由相互串聯連接之電阻器R3及電容器C2來構成輸入介面部IF。藉由NOT電路Q3、電阻器R4~R6、電容器C3、二極體D1等來構成二元化部KD。二元化部KD連接輸入介面部IF之輸出側。The determination unit 12 is composed of a NOT circuit (binary circuit) Q3, NOT circuits Q4 to Q5, resistors R3 to R8, capacitors C2 and C3, a diode D1, a light-emitting diode LEDa, and an LEDb. The input dielectric surface IF is constituted by a resistor R3 and a capacitor C2 which are connected in series to each other. The binarization unit KD is configured by the NOT circuit Q3, the resistors R4 to R6, the capacitor C3, the diode D1, and the like. The binary unit KD is connected to the output side of the input interface IF.

二元化部KD在輸入之輸出電壓S1之大小超過閾值th時,其輸出成為低水準(L)。在輸入之輸出電壓S1不超過閾值th時,維持其輸出於高水準(H)。閾值th之大小是由 電阻器R4、R5之電阻值來調整。也就是說,藉由選擇電阻器R4、R5之各種電阻值,可使電源電壓受2個電阻器R4、R5分壓為各種電壓,設定各種閾值th。When the magnitude of the input output voltage S1 exceeds the threshold value th, the binary unit KD has a low level (L). When the input output voltage S1 does not exceed the threshold th, its output is maintained at a high level (H). The size of the threshold th is determined by The resistance values of the resistors R4 and R5 are adjusted. In other words, by selecting various resistance values of the resistors R4 and R5, the power supply voltage can be divided into various voltages by the two resistors R4 and R5, and various threshold values th can be set.

又,輸出電壓S1之大小與輸出之L、H(或導通、截止)間之關係也可以是相反。Further, the relationship between the magnitude of the output voltage S1 and the output L, H (or on, off) may be reversed.

又,藉由NOT電路Q4、Q5、電阻器R7、R8、發光二極體LEDa、b等來構成顯示輸出部HS。若檢測到結霜狀態,則發光二極體LEDa點亮,而在非結霜狀態時發光二極體LEDb點亮。Further, the display output unit HS is configured by the NOT circuits Q4 and Q5, the resistors R7 and R8, the light-emitting diodes LEDa and b, and the like. When the frosting state is detected, the light-emitting diode LEDa is turned on, and in the non-frosting state, the light-emitting diode LEDb is turned on.

並由判定部12分別輸出顯示為結霜狀態之檢測訊號S2a及顯示為非結霜狀態之檢測訊號S2b。The determination unit 12 outputs a detection signal S2a displayed as a frosting state and a detection signal S2b displayed as a non-fool state.

結霜狀態檢測裝置1之判定部12對結霜感應器13之輸出電壓S1執行數位性處理以進行二元化。The determination unit 12 of the frosting state detecting device 1 performs digital processing on the output voltage S1 of the frost sensor 13 to perform binarization.

又,結霜狀態檢測裝置1雖然也設置有電源電路等,但圖示中省略。也可以由外部來供應電源。Further, although the frosting state detecting device 1 is also provided with a power supply circuit or the like, it is omitted in the drawings. It is also possible to supply power from the outside.

於驅動部11之輸出側,以絶縁電線DSa連接結霜感應器13一側之端子Ta。結霜感應器13另一側之端子Tb是以絶縁電線DSb連接結霜狀態檢測裝置1中之接地線GL。On the output side of the drive unit 11, the terminal Ta on the side of the frost sensor 13 is connected to the absolute electric wire DSa. The terminal Tb on the other side of the frosting sensor 13 is connected to the ground line GL in the frosting state detecting device 1 by the absolute electric wire DSb.

又,第1圖中雖然是顯示驅動部11、判定部12及結霜感應器13為分離,但也可以是一體化的構造。也就是說,也可將驅動部11及判定部12與結霜感應器13組合成一體。此時,例如基板21此用雙面基板或多層基板,利用設有圖形電極之面以外之面來設置驅動部11及判定部12即可。用於驅動部11及判定部12之電子零件例如以模覆蓋, 並設置用以輸出檢測訊號S2a、b及連接電源電路(電源裝置)之連接件即可。Further, in the first drawing, the display drive unit 11, the determination unit 12, and the frost sensor 13 are separated, but they may have an integrated structure. In other words, the drive unit 11 and the determination unit 12 may be combined with the frost sensor 13 as a unit. In this case, for example, the substrate 21 may be a double-sided substrate or a multilayer substrate, and the driving portion 11 and the determining portion 12 may be provided by a surface other than the surface on which the pattern electrode is provided. The electronic components for the driving portion 11 and the determining portion 12 are covered, for example, by a mold. And a connection member for outputting the detection signals S2a, b and connecting the power supply circuit (power supply device).

接著說明結霜狀態檢測裝置1之動作。Next, the operation of the frosting state detecting device 1 will be described.

結霜感應器13之電阻Zs隨結霜狀態變化。結霜感應器13受驅動部11施加交流訊號,則結霜感應器13之輸出電壓S1對應結霜感應器13之電阻Zs而變化。輸出電壓S1之大小若超過閾值th,則輸出顯示為結霜狀態之檢測訊號S2a。The resistance Zs of the frosting sensor 13 varies with the frosting state. When the frosting sensor 13 is applied with an alternating current signal by the driving unit 11, the output voltage S1 of the frosting sensor 13 changes in accordance with the resistance Zs of the frosting sensor 13. When the magnitude of the output voltage S1 exceeds the threshold value th, the detection signal S2a indicating the frosting state is output.

如此,可根據檢測訊號S2a啟動除霜加熱器使其通電,令其進行除霜動作。若因除霜加熱器啟動而冷卻器RP之霜溶解成為水滴,則結霜感應器13之電阻Zs降低而輸出電壓S1也因此降低。當輸出電壓S1之大小成為閾值以下時,輸出顯示為非結霜狀態之檢測訊號S2b。In this way, the defrosting heater can be activated according to the detection signal S2a to energize it to perform the defrosting operation. When the defrosting heater is activated and the frost of the cooler RP is dissolved into water droplets, the electric resistance Zs of the frosting sensor 13 is lowered and the output voltage S1 is also lowered. When the magnitude of the output voltage S1 is equal to or less than the threshold value, the detection signal S2b showing the non-frosting state is output.

如此,可藉由根據檢測訊號S2a、S2b,來控制圖未示之除霜加熱器之開關,來有效率地進行冷卻器RP之除霜。Thus, the defrosting of the cooler RP can be efficiently performed by controlling the switches of the defrosting heater (not shown) based on the detection signals S2a, S2b.

又,檢測為結霜狀態之閾值th與檢測為非結霜狀態之閾值th值,可以是同一值,也可以是相異值。若令閾值th為相異之值,則可使檢測有遲滯(hysteresis)。又,關於用於除霜之除霜加熱器等之控制方法,可參考上上述專利文獻1等。Further, the threshold value th detected as the frosting state and the threshold value th value detected as the non-fondening state may be the same value or may be different values. If the threshold th is made to be a different value, hysteresis can be detected. Further, regarding the control method of the defrosting heater or the like for defrosting, the above Patent Document 1 and the like can be referred to.

於本實施形態中之結霜感應器13,是令第1圖形電極22及第2圖形電極23在基板21上相面對之構成,由於實現電阻Zs之空間為閉空間,因此不易受周圍物體之有無或 移動、空氣流動、周圍溫度等環境因素影響,可提高檢測精度。因此,不須使用偽裝電極等來修正環境變化所造成之輸出變動,可以簡單的構成來確實地運作。In the frosting sensor 13 of the present embodiment, the first pattern electrode 22 and the second pattern electrode 23 face each other on the substrate 21. Since the space for realizing the resistance Zs is a closed space, it is less susceptible to surrounding objects. Whether or not The influence of environmental factors such as movement, air flow, and ambient temperature can improve the detection accuracy. Therefore, it is not necessary to use a camouflage electrode or the like to correct the output variation caused by environmental changes, and it is possible to operate reliably with a simple configuration.

如此,本實施形態之結霜狀態檢測裝置1不須設置偽裝電極仍可以充分之精度來檢測結霜狀態,構成簡單。As described above, the frosting state detecting device 1 of the present embodiment can detect the frosting state with sufficient accuracy without providing a dummy electrode, and the configuration is simple.

〔第2實施形態〕[Second Embodiment]

接著說明將本發明之電容式水分檢測裝置之其他實施形態,即實施作為結霜狀態檢測裝置之第2實施形態。Next, another embodiment of the capacitive moisture detecting device of the present invention, which is a second embodiment of the frosting state detecting device, will be described.

第4圖顯示第2實施形態之結霜狀態檢測裝置1B之具體電路例。Fig. 4 is a view showing a specific circuit example of the frosting state detecting device 1B of the second embodiment.

第4圖中結霜狀態檢測裝置1B是由驅動部11B、判定部12B、及結霜感應器13等所構成。The frosting state detecting device 1B in Fig. 4 is composed of a driving unit 11B, a determining unit 12B, a frosting sensor 13, and the like.

又,第2實施形態之結霜狀態檢測裝置1B中,全體構成、結霜感應器13之外型等與第1圖及第2圖所示之第1實施形態之結霜狀態檢測裝置1相同。又,驅動部11B及結霜感應器13與第3圖所示之驅動部11及結霜感應器13相同。關於相同的部分,將省略或簡略化其說明。In the frosting state detecting device 1B of the second embodiment, the overall configuration and the frost sensor 13 are the same as those of the frosting state detecting device 1 of the first embodiment shown in Figs. 1 and 2 . Further, the drive unit 11B and the frost sensor 13 are the same as the drive unit 11 and the frost sensor 13 shown in FIG. Regarding the same portions, the description thereof will be omitted or simplified.

判定部12B由NOT電路Q11~Q14、電阻器R11~R14、電容器C2、C11、二極體D2、及發光二極體LEDa所構成。The determination unit 12B is composed of NOT circuits Q11 to Q14, resistors R11 to R14, capacitors C2 and C11, a diode D2, and a light-emitting diode LEDa.

藉由NOT電路Q11、Q12、電阻器R11~R13、電容器C11、及二極體D2等來構成二元化部KDB。又,藉由NOT電路Q13、Q14、電阻器R14、發光二極體LEDa等來構成顯示輸出部HSB。當檢測為結霜狀態時,發光二極體LEDa 將點亮。判定部12B分別輸出顯示為結霜狀態之檢測訊號S2a及顯示為非結霜狀態之檢測訊號S2b。The binarization unit KDB is configured by the NOT circuits Q11 and Q12, the resistors R11 to R13, the capacitor C11, the diode D2, and the like. Further, the display output unit HSB is configured by the NOT circuits Q13 and Q14, the resistor R14, the light-emitting diode LEDa, and the like. Light-emitting diode LEDa when detected as frosting Will light up. The determination unit 12B outputs a detection signal S2a displayed in a frosting state and a detection signal S2b displayed in a non-fondening state.

結霜狀態檢測裝置1B之判定部12B對結霜感應器13之輸出電壓S1執行類比式處理以執行二元化。The determining unit 12B of the frosting state detecting device 1B performs analogy processing on the output voltage S1 of the frosting sensor 13 to perform binarization.

〔第3實施形態〕[Third embodiment]

接著說明將本發明之電容式水分檢測裝置實施作為一般之檢測裝置,以檢測水分之第3實施形態。Next, a third embodiment in which the capacitive moisture detecting device of the present invention is used as a general detecting device to detect moisture will be described.

第5圖及第6圖分別顯示第3實施形態之檢測裝置1C之外型及檢測裝置1C之具體的電路例。第5圖(A)、(B)、(C)是檢測裝置1C之正面圖、左側圖、及背面圖。Fig. 5 and Fig. 6 show specific circuit examples of the detection device 1C and the detection device 1C of the third embodiment, respectively. 5(A), (B), and (C) are a front view, a left side view, and a rear view of the detecting device 1C.

如第5圖所示,檢測裝置1C為全體大致一體化成直方體形狀之構造。As shown in Fig. 5, the detecting device 1C has a structure in which the entire body is substantially integrated into a rectangular parallelepiped shape.

如第6圖所示,檢測裝置1C由驅動部11C、判定部12C、及水分感應器(電容感應器)13C等所構成。驅動部11C及判定部12C之電路與第3圖所示之驅動部11及判定部12相同,故對具相同機能之零件賦予相同符號。As shown in Fig. 6, the detecting device 1C is composed of a driving unit 11C, a determining unit 12C, a moisture sensor (capacitance sensor) 13C, and the like. The circuits of the drive unit 11C and the determination unit 12C are the same as those of the drive unit 11 and the determination unit 12 shown in FIG. 3, and therefore, the same reference numerals are given to components having the same functions.

也就是,檢測裝置1C在多層基板之長方形狀基板21C之一側之表面形成用於水分感應器13C之第1圖形電極22C及第2圖形電極23C,各自之2個端子Ta、Tb設置為相互靠近。In other words, the detecting device 1C forms the first pattern electrode 22C and the second pattern electrode 23C for the moisture sensor 13C on the surface on one side of the rectangular substrate 21C of the multilayer substrate, and the two terminals Ta and Tb are set to each other. near.

基板21C之另一側之表面安裝有用於驅動部11C及判定部12C之電子零件,對於圖形配線進行焊接等來形成各電路。驅動部11C及判定部12C之電子零件等受模MD覆蓋,模MD之一部分可從外部看見發光二極體LEDa、b。又, 基板21C不受模MD覆蓋之部分安裝有用於輸出檢測訊號S2a、b及連接電源電路之連接器CN1。On the other surface of the substrate 21C, electronic components for the driving portion 11C and the determining portion 12C are mounted, and the pattern wiring is welded or the like to form each circuit. The electronic components of the drive unit 11C and the determination unit 12C are covered by the mold MD, and the light-emitting diodes LEDa and b can be seen from the outside in one part of the mold MD. also, The portion of the substrate 21C that is not covered by the mode MD is provided with a connector CN1 for outputting the detection signals S2a, b and connecting the power supply circuit.

基板21C設有驅動部11C之輸出端子T11及判定部12C之輸入端子T12,此等端子T11、T12與水分感應器13C之端子Ta、Tb等,是在模MD之內部配線連接。藉此,水分感應器13C是如第6圖所示,是串聯連接驅動部11C之輸出端子T11與判定部12C之輸入端子T12。The substrate 21C is provided with an output terminal T11 of the driving portion 11C and an input terminal T12 of the determining portion 12C. These terminals T11 and T12 and the terminals Ta and Tb of the moisture sensor 13C are connected to each other inside the mold MD. Thereby, as shown in FIG. 6, the moisture sensor 13C connects the output terminal T11 of the drive unit 11C and the input terminal T12 of the determination unit 12C in series.

又,可以電線相互連接2個端子T11、T12與水分感應器13C一側之端子Ta,並令水分感應器13C之另一側之端子Tb連接設於基板21C之接地線(接地端子)GL。此時,水分感應器13C是並聯連接驅動部11C之輸出端子T11及判定部12C之輸入端子T12。Moreover, the two terminals T11 and T12 and the terminal Ta on the moisture sensor 13C side can be connected to each other by the electric wires, and the other terminal Tb of the moisture sensor 13C can be connected to the ground line (ground terminal) GL of the substrate 21C. At this time, the moisture sensor 13C is connected in parallel to the output terminal T11 of the drive unit 11C and the input terminal T12 of the determination unit 12C.

如此,檢測裝置1C在模MD覆蓋基板21C前之狀態,是選擇水分感應器13C以串聯或並聯中任一者連接驅動部11C之輸出端子T11及判定部12C之輸入端子T12。In this manner, the detecting device 1C is in a state before the mold MD covers the substrate 21C, and the selective moisture sensor 13C connects the output terminal T11 of the driving unit 11C and the input terminal T12 of the determining unit 12C in either series or in parallel.

判定部12C中用於二元化之閾值th之大小,可藉由選定電阻器R4、R5之電阻值來調整。為使其容易調整,此等電阻器R4、R5之任一者或兩者可使用可變電阻器。The magnitude of the threshold th for binarization in the determining unit 12C can be adjusted by selecting the resistance values of the resistors R4 and R5. To make it easy to adjust, a variable resistor can be used for either or both of these resistors R4, R5.

接著,說明檢測裝置1C之動作。Next, the operation of the detecting device 1C will be described.

水分感應器13C之電阻Zs(電阻值Rs及電容Cs)隨周圍環境之水分之比例或狀態而變化。例如,當檢測裝置1C用於結霜狀態之檢測時,電阻Zs隨結霜狀態而變化。當為非結霜狀態時,水分感應器13C之電阻Zs低,而來自驅動部11C之交流訊號S1a將幾乎不減弱地成為輸出電壓S1b,輸 入至判定部12C。若成為結霜狀態,水分感應器13C之電阻Zs增高,來自驅動部11C之交流訊號S1a將大幅減弱成為輸出電壓S1b,對判定部12C之輸入降低。判定部12C輸入至之訊號(輸出電壓S1b)之變動由閾值th檢測出,藉此來檢測有無結霜狀態。The resistance Zs (resistance value Rs and capacitance Cs) of the moisture sensor 13C varies depending on the ratio or state of moisture of the surrounding environment. For example, when the detecting device 1C is used for detecting the frosting state, the resistance Zs changes with the frosting state. When it is in the non-frosting state, the resistance Zs of the moisture sensor 13C is low, and the alternating current signal S1a from the driving portion 11C becomes the output voltage S1b with little attenuation, and the input The process proceeds to the determination unit 12C. When the frosting state is reached, the electric resistance Zs of the moisture sensor 13C is increased, and the alternating current signal S1a from the driving unit 11C is greatly reduced to the output voltage S1b, and the input to the determining unit 12C is lowered. The fluctuation of the signal (output voltage S1b) input from the determination unit 12C is detected by the threshold value th, thereby detecting the presence or absence of the frosting state.

也就是,當輸出電壓S1之大小為閾值th以下時,輸出顯示為結霜狀態之檢測訊號S2a。That is, when the magnitude of the output voltage S1 is equal to or less than the threshold value th, the detection signal S2a showing the frosting state is output.

如此,藉由本實施形態之檢測裝置1C,不須設置偽裝電極仍可以充分之精度來檢測結霜狀態,構成簡單。As described above, with the detecting device 1C of the present embodiment, it is possible to detect the frosting state with sufficient accuracy without providing a dummy electrode, and the configuration is simple.

〔電容式水分檢測裝置之其他實施形態〕[Other Embodiments of Capacitive Moisture Detection Device]

以上所述之檢測裝置1C,不只可檢測結霜狀態,也可運作為檢測周圍環境之水分比例或狀態之電容式水分檢測裝置。The detecting device 1C described above can operate not only the frosting state but also the capacitive moisture detecting device for detecting the moisture ratio or state of the surrounding environment.

也就是,檢測裝置1C可藉由對閾值th之各種設定,而使用於例如灑水感應器、漏液感應器、凍結感應器、液面感應器、或製冰感應器等。That is, the detecting device 1C can be used for, for example, a sprinkler sensor, a liquid leakage sensor, a freeze sensor, a liquid level sensor, or an ice sensor, by various settings of the threshold value th.

〔灑水感應器〕[sprinkling sensor]

檢測裝置1C用於灑水感應器時,將檢測裝置1C埋於田地等地中。水分感應器13C接觸土,水分感應器13C之電阻Zs(特別是電容Cs)會對應土中水分之量變化。When the detecting device 1C is used for the water sprinkling sensor, the detecting device 1C is buried in a field or the like. The moisture sensor 13C contacts the soil, and the resistance Zs (especially the capacitance Cs) of the moisture sensor 13C changes corresponding to the amount of moisture in the soil.

也就是,土之相對介電係數ε例如在乾燥時為4左右,在水分為1%、2%、5%時分別為76、87、94左右,水分所造成土的相對介電係數ε之變化甚大。因此,可藉檢測裝置1C檢測土之乾燥狀態,在成為乾燥狀態時例如啟 動灑水裝置以進行灑水即可。That is, the relative dielectric constant ε of the soil is, for example, about 4 when dry, and about 76, 87, and 94 when the moisture is 1%, 2%, and 5%, respectively, and the relative dielectric constant ε of the soil caused by moisture. It has changed a lot. Therefore, the dry state of the soil can be detected by the detecting device 1C, and when it is in a dry state, for example, The sprinkler can be sprinkled to sprinkle water.

又,當檢測裝置1C使用為灑水感應器時,亦可以不將檢測裝置1C埋於地中,而改將専用之水分感應器(電容感應器)30埋於地中。Further, when the detecting device 1C is used as a water sprinkling sensor, the detecting device 1C may not be buried in the ground, and the moisture sensor (capacitor sensor) 30 for use may be buried in the ground.

也就是,如第7圖所示,2支電極棒31、32是以相互平行之狀態、以適當之間隔隔開地打入地面ZM,以將其一部分或全部埋沒於土中。以2支電極棒31、32作為水分感應器30。以此電極棒31、32之端子Ta,、Tb取代前述之水分感應器13C之端子Ta、Tb分別連接檢測裝置1C之端子T11、T12。此時,水分感應器30是串聯連接。That is, as shown in Fig. 7, the two electrode rods 31, 32 are inserted into the ground ZM at a proper interval in parallel with each other to partially or completely bury the soil in the soil. Two electrode rods 31 and 32 are used as the moisture sensor 30. The terminals Ta and Tb of the electrode rods 31 and 32 are connected to the terminals T11 and T12 of the detecting device 1C in place of the terminals Ta and Tb of the moisture sensor 13C described above. At this time, the moisture sensors 30 are connected in series.

又,在檢測裝置1C之端子T11、T12相互連接之狀態,將該等端子T11、T12連接水分感應器30之一端子Ta,並將水分感應器30之另一端子Tb連接接地線GL。此時水分感應器30是並聯連接。Further, in a state where the terminals T11 and T12 of the detecting device 1C are connected to each other, the terminals T11 and T12 are connected to one terminal Ta of the moisture sensor 30, and the other terminal Tb of the moisture sensor 30 is connected to the ground line GL. At this time, the moisture sensors 30 are connected in parallel.

此時亦可以將水分感應器30透過電容器(capacitor/c導通densor)連接檢測裝置1C,以除去電壓中不必要之直流成分。即,此時端子Ta、Tb與端子T11、T12或接地線GL之間插入電容器。At this time, the moisture sensor 30 may be connected to the detecting device 1C through a capacitor (capacitor/c conduction densor) to remove unnecessary DC components in the voltage. That is, at this time, a capacitor is inserted between the terminals Ta and Tb and the terminals T11 and T12 or the ground line GL.

又,電極棒31、32可使用銅、鋁合金、或鐵等金龍材料,亦可使用其他導電性材料所構成之棒狀者。又,雖然在將電極棒31、32打入地面ZM時設置容易,但亦可改將電極棒31、32埋入地面ZM挖掘後之土中。此時電極棒31、32可以是鉛直姿勢、水平姿勢或傾銷姿勢等。Further, as the electrode rods 31 and 32, a gold dragon material such as copper, an aluminum alloy, or iron may be used, or a rod formed of another conductive material may be used. Further, although it is easy to install the electrode rods 31 and 32 when they are driven into the ground ZM, the electrode rods 31 and 32 may be buried in the soil after the excavation of the ground ZM. At this time, the electrode rods 31, 32 may be in a vertical posture, a horizontal posture, or a dumping posture.

使用如此之水分感應器30時,電極棒31、32間之 電容Cs會隨著地面ZM中水分之量而變化。藉由以閾值th來檢測出此電容Cs之變化,可檢測出土之乾燥狀態。When such a moisture sensor 30 is used, between the electrode rods 31, 32 The capacitance Cs will vary with the amount of moisture in the ground ZM. By detecting the change in the capacitance Cs by the threshold value th, the dry state of the soil can be detected.

〔漏水感應器〕[water leakage sensor]

當使用檢測裝置1C做為漏水感應器時,將檢測裝置1C安裝於建築物之地面等。當無漏水時,水分感應器13C之周邊為空気或地面之材質(例如塑膠),因此相對介電係數ε小,電容Cs例如是0.1pF左右。當因漏水造成水分感應器13C被水浸濕,則相對介電係數ε成為80左右,而電容Cs將增大例如數pF左右,故可以閾值th來檢測出此變化。When the detecting device 1C is used as the water leakage sensor, the detecting device 1C is attached to the floor or the like of a building. When there is no water leakage, the periphery of the moisture sensor 13C is empty or ground material (for example, plastic), so the relative dielectric constant ε is small, and the capacitance Cs is, for example, about 0.1 pF. When the moisture sensor 13C is wetted by water due to water leakage, the relative dielectric constant ε is about 80, and the capacitance Cs is increased by, for example, a few pF. Therefore, the change can be detected by the threshold value th.

〔凍結感應器〕[freeze sensor]

當使用檢測裝置1C作為凍結感應器時,將檢測裝置1C配置於高速道路等之路面上。也就是,配置為檢測裝置1C之水分感應器13C之表面為與路面相同之狀態。當水分感應器13C之表面有水分凍結時,電容Cs將因此而降低1/20左右,故可以閾值th來檢測出此變化。在表面凍結為雪泥狀時也可以檢測出來。When the detecting device 1C is used as the freezing sensor, the detecting device 1C is placed on a road surface such as an expressway. That is, the surface of the moisture sensor 13C configured as the detecting device 1C is in the same state as the road surface. When the surface of the moisture sensor 13C freezes, the capacitance Cs is thus reduced by about 1/20, so that the threshold value th can be detected. It can also be detected when the surface freezes into a slush.

〔液面感應器〕[liquid level sensor]

當使用檢測裝置1C作為時,如第8圖所示,將檢測裝置1C安裝於收容液體LQ之塑膠製容器YK1等之外周面。由於容器YK1之厚度夠薄,因此當容器YK1內之液面HM到達檢測裝置1C之位置時,電容Cs變化為増大,而可以閾值th來檢測出此變化。When the detecting device 1C is used, as shown in Fig. 8, the detecting device 1C is attached to the outer peripheral surface of the plastic container YK1 or the like in which the liquid LQ is accommodated. Since the thickness of the container YK1 is thin enough, when the liquid level HM in the container YK1 reaches the position of the detecting device 1C, the capacitance Cs changes to be large, and the threshold value th can be detected to detect the change.

又,在使用檢測裝置1C作為液面感應器時,如第9圖所示,亦可使用専用之水分感應器(電容感應 器)30B、30C來取代水分感應器13C。Further, when the detecting device 1C is used as the liquid level sensor, as shown in Fig. 9, a moisture sensor for use (capacitive sensing) can also be used. Instead of the moisture sensor 13C, 30B, 30C.

也就是說,如第9圖(A)所示,將2條電線31B、32B以相互平行之狀態、以適當之間隔隔開地捲繞於容器YK2之外周面,以此作為水分感應器30B。將電線31B、32B之端子Ta、Tb分別連接檢測裝置1C之端子T11、T12或接地線GL。電線31B、32B可以是單線或絞線,其截面可以是圓形狀或平板狀(即帶狀)。電線31B、32B宜是絕緣電線。In other words, as shown in Fig. 9(A), the two electric wires 31B and 32B are wound around the outer circumferential surface of the container YK2 at a proper interval in parallel with each other, thereby serving as the moisture sensor 30B. . The terminals Ta and Tb of the electric wires 31B and 32B are respectively connected to the terminals T11 and T12 of the detecting device 1C or the ground line GL. The electric wires 31B, 32B may be single wires or stranded wires, and the cross section may be a circular shape or a flat plate shape (ie, a belt shape). The electric wires 31B, 32B are preferably insulated wires.

當容器YK2內之液面HM到達水分感應器30B之位置時,電容Cs變化為増大,而可以檢測出此變化。When the liquid level HM in the container YK2 reaches the position of the moisture sensor 30B, the capacitance Cs changes to be large, and this change can be detected.

又,如第9圖(B)所示,是於容器YK3之外周面,將2條電線31C、32C以夾著收容於容器內部之液体LQ且互相呈相對向之狀態,半周捲繞該容器之外周面,以此作為水分感應器30C。當容器YK3內之液面HM到達水分感應器30C之位置時,電容Cs變化為増大,而可以檢測出此變化。Further, as shown in Fig. 9(B), the two electric wires 31C and 32C are placed on the outer peripheral surface of the container YK3 so as to be opposed to each other with the liquid LQ accommodated in the inside of the container, and the container is wound halfway. The outer peripheral surface is used as the moisture sensor 30C. When the liquid level HM in the container YK3 reaches the position of the moisture sensor 30C, the capacitance Cs changes to be large, and this change can be detected.

又,當將檢測裝置1C應用於此等各種感應器時,亦可在相對介電係數ε或電容Cs之變化量接近零時,檢測出其各自之環境狀態有變化。也就是說,在相對介電係數ε或電容Cs有變化且其變化量夠小時,判斷為環境狀態有。例如,判斷為成為乾燥狀態、或判斷為製冰完畢、或已凍結、或判斷為液面已到達預定之位置。Further, when the detecting device 1C is applied to these various sensors, it is also possible to detect that the respective environmental states have changed when the relative dielectric constant ε or the amount of change in the capacitance Cs approaches zero. That is to say, when the relative dielectric constant ε or the capacitance Cs changes and the amount of change is small enough, it is determined that there is an environmental state. For example, it is determined that it is in a dry state, or it is determined that the ice making is completed, or has been frozen, or it is determined that the liquid level has reached the predetermined position.

〔第4實施形態〕[Fourth embodiment]

接著,說明將本發明之電容式水分檢測裝置使用作為其他形態之結霜狀態檢測裝置之第4實施形態。Next, a fourth embodiment in which the capacitive moisture detecting device of the present invention is used as a frosting state detecting device of another embodiment will be described.

第10圖顯示第4實施形態之結霜狀態檢測裝置 1D之構成,第11圖顯示用於結霜狀態檢測裝置1D之結霜感應器13D之外型,第12圖擴大顯示第10圖之一部分。又,第13圖顯示結霜狀態檢測裝置1D之具體之電路之一例,第14圖顯示實現NOT電路之電路例。又,第15圖顯示結霜狀態檢測裝置1D之各部之波形之例。Fig. 10 is a view showing the frosting state detecting device of the fourth embodiment; In the configuration of 1D, Fig. 11 shows the appearance of the frost sensor 13D for the frosting state detecting device 1D, and Fig. 12 shows an enlarged portion of Fig. 10. Further, Fig. 13 shows an example of a specific circuit of the frosting state detecting device 1D, and Fig. 14 shows an example of a circuit for realizing the NOT circuit. Further, Fig. 15 shows an example of the waveform of each part of the frosting state detecting device 1D.

第10圖中結霜狀態檢測裝置1D除了水分感應器13D之表面外受模覆蓋,其構造為全體一體化成為大致直方體之形狀。In the figure 10, the frosting state detecting device 1D is covered with a mold except for the surface of the moisture sensor 13D, and its structure is integrated into a substantially rectangular shape.

結霜狀態檢測裝置1D是藉由圖未示之帶或熱收縮管安裝在設於冷凍機RK之冷卻管RKP上。結霜狀態檢測裝置1D以電線連接冷凍機RK之控制部RKC,藉此接受控制部RKC供應電源、或對控制部RKC之控制輸入端子TS輸出用於控制之檢測訊號S2a。The frosting state detecting device 1D is attached to a cooling pipe RKP provided in the refrigerator RK by a belt (not shown) or a heat shrinkable tube. The frosting state detecting device 1D is connected to the control unit RKC of the refrigerator RK by electric wires, thereby receiving the power supply from the control unit RKC or outputting the detection signal S2a for control to the control input terminal TS of the control unit RKC.

如第13圖所示,結霜狀態檢測裝置1D是由驅動部11D、判定部12D、及水分感應器(電容感應器)13D等所構成。判定部12D設有輸入介面部IF、二元化部KDD、及修正部SYD。As shown in Fig. 13, the frosting state detecting device 1D is composed of a driving unit 11D, a determining unit 12D, a moisture sensor (capacitance sensor) 13D, and the like. The determination unit 12D is provided with an input interface surface IF, a binary unit KDD, and a correction unit SYD.

又,第4實施形態之結霜狀態檢測裝置1D中,關於其構成及機能與以上所述之第1及第2實施形態之結霜狀態檢測裝置1、1B、及第3實施形態之檢測裝置1C存在有同樣之部分。對於同樣之部分,有些將在此省略說明以簡略化。又,關於同樣之部分,在以下有更詳細之說明,以下之說明也適用於結霜狀態檢測裝置1、1B及檢測裝置1C同樣之部分。Further, in the frosting state detecting device 1D of the fourth embodiment, the configuration and function of the frosting state detecting devices 1 and 1B according to the first and second embodiments described above and the detecting device of the third embodiment 1C has the same part. For the same part, some will be omitted here for simplification. Further, the same portions will be described in more detail below, and the following description is also applicable to the same portions of the frosting state detecting devices 1, 1B and the detecting device 1C.

如第10圖~第12圖所示,水分感應器13D具有於基板21D之表面形成圖形之第1電極22Da、b、及第2電極23D、及接地電極24a、b。As shown in FIGS. 10 to 12, the moisture sensor 13D has the first electrodes 22Da and b and the second electrode 23D and the ground electrodes 24a and b which form a pattern on the surface of the substrate 21D.

也就是說,此等電極22Da、b、23D、24a、b,皆形成長方形狀之圖形,配置為相互之間設有間隙GP、GPG。第2電極23D配置於基板21D之中央部。第1電極22Da、b配置於第2電極23D之兩側且與第2電極23D之間設有間隙GP之狀態、且配置為相互靠近之側之邊部間之距離比冷卻管RKP之外徑更小。That is to say, the electrodes 22Da, b, 23D, 24a, and b are formed in a rectangular pattern, and are disposed with gaps GP and GPG therebetween. The second electrode 23D is disposed at a central portion of the substrate 21D. The first electrodes 22Da and b are disposed on both sides of the second electrode 23D and are provided with a gap GP between the second electrode 23D and the side between the sides closer to each other than the outer diameter of the cooling tube RKP. smaller.

水分感應器13D之尺寸可舉例如下。基板21D例如是縱20~30毫米左右、横10~15毫米左右之矩形。第2電極23D之寬度例如是數毫米,更具體舉例則是3毫米左右。第1電極22Da、b之寬度分別例如是數毫米、更具體舉例則是2~3毫米。接地電極24a、b之寬度分別例如是數毫米、更具體舉例則是2~3毫米左右。The size of the moisture sensor 13D can be exemplified as follows. The substrate 21D is, for example, a rectangle having a length of about 20 to 30 mm and a width of about 10 to 15 mm. The width of the second electrode 23D is, for example, several millimeters, and more specifically, about 3 millimeters. The widths of the first electrodes 22Da, b are, for example, several millimeters, and more specifically, two to three millimeters. The widths of the ground electrodes 24a, b are, for example, several millimeters, and more specifically, about 2 to 3 millimeters.

又,第2電極23D與第1電極22Da、b間之2個間隙GP,分別是例如十分之一及十分之數毫米,更具體的舉例則是0.1毫米左右。電極22Da、b與接地電極24a、b間之2個間隙GPG分別是例如一或數毫米,更具體地舉例則是1毫米左右。Further, the two gaps GP between the second electrode 23D and the first electrodes 22Da and b are, for example, one tenth and tenths of a millimeter, and more specifically, about 0.1 millimeters. The two gaps GPG between the electrodes 22Da, b and the ground electrodes 24a, b are, for example, one or several millimeters, and more specifically, about 1 millimeter.

水分感應器13D安裝於冷卻管RKP,以使橫亙第2電極23D之一部分、第1電極22Da、b之一部分、間隙GP、及冷卻管RKP之外周面可附著水分。The moisture sensor 13D is attached to the cooling pipe RKP so that moisture can adhere to one of the second electrode 23D, one of the first electrodes 22Da and b, the gap GP, and the outer surface of the cooling pipe RKP.

具體來說,如第10圖~第12圖所示,固定為第2 電極23D之寬度方向之中央部接觸冷卻管RKP之表面之狀態。Specifically, as shown in Figures 10 to 12, it is fixed as the second The central portion of the electrode 23D in the width direction contacts the surface of the cooling tube RKP.

當冷卻管RKP因冷凍機RK之運轉而冷卻時,如第12圖所示,冷卻管RKP之表面附著水分(水滴)MZ。水分MZ進入間隙GP,降低第1電極22Da與第2電極23D間之電阻Zs。When the cooling pipe RKP is cooled by the operation of the refrigerator RK, as shown in Fig. 12, moisture (water droplets) MZ adheres to the surface of the cooling pipe RKP. The moisture MZ enters the gap GP, and the electric resistance Zs between the first electrode 22Da and the second electrode 23D is lowered.

又,在冷凍機RK最初開始運轉之時點,很有可能冷卻管RKP之表面是未附著水分MZ而成為乾燥狀態。Further, at the time when the refrigerator RK is initially started to operate, there is a possibility that the surface of the cooling pipe RKP is in a dry state without adhering moisture MZ.

如此,水分感應器13D之電阻Zs將隨著間隙GP、GPG中是有水分MZ之狀態、即水滴狀態(結露狀態),還是結霜狀態,又或者是乾燥狀態而變化。又,於此等混合之狀態時,又隨著其比例、水分MZ之量等而變化。又,結霜狀態可以說是凍結狀態或部分之凍結狀態。As described above, the electric resistance Zs of the moisture sensor 13D changes depending on whether there is a state of moisture MZ in the gaps GP and GPG, that is, a state of water droplets (dew condensation state), a frosting state, or a dry state. Moreover, in the state of this mixing, it changes with the ratio, the amount of moisture MZ, and the like. Moreover, the frosting state can be said to be a frozen state or a partially frozen state.

又,水滴狀態、凍結狀態、及乾燥狀態時之相對介電係數ε分別是80、4.2、1左右。Further, the relative dielectric constant ε in the water drop state, the frozen state, and the dry state is about 80, 4.2, and 1, respectively.

冷凍機RK之控制部RKC根據來自結霜狀態檢測裝置1D之檢測訊號S2a,控制冷卻裝置之導通/截止,即冷卻裝置之運轉或停止。當由水分感應器13D檢測出水滴狀態時,檢測訊號S2a成為截止,即L,此時冷卻裝置將運轉。又,當由水分感應器13D檢測出結霜狀態時,檢測訊號S2a成為導通,即H,此時冷卻裝置將停止。The control unit RKC of the refrigerator RK controls the on/off of the cooling device, that is, the operation or the stop of the cooling device, based on the detection signal S2a from the frosting state detecting device 1D. When the state of the water droplet is detected by the moisture sensor 13D, the detection signal S2a is turned off, that is, L, and the cooling device is operated at this time. Further, when the frost state is detected by the moisture sensor 13D, the detection signal S2a is turned on, that is, H, and the cooling device is stopped.

由於冷凍機RK必須在初期之乾燥狀態也啟動(運轉),因此在乾燥狀態下檢測訊號S2a成為截止,即L。為了檢測出乾燥狀態以將檢測訊號S2a強制地設為截止,在 本實施形態之結霜狀態檢測裝置1D設有修正部SYD。詳細將後述。Since the refrigerator RK must be started (operated) in the initial dry state, the detection signal S2a becomes OFF in the dry state, that is, L. In order to detect the dry state to forcibly set the detection signal S2a to cut off, The frosting state detecting device 1D of the present embodiment is provided with a correction unit SYD. The details will be described later.

如第13圖所示,結霜狀態檢測裝置1D安裝有檢測訊號S2a、b之輸出、及用以連接電源電路之正側(VDD)及負側(接地線GL)之連接器CN1D。接地線GL也是對於檢測訊號S2a、b之接地線。As shown in Fig. 13, the frosting state detecting device 1D is provided with an output of the detection signals S2a, b, and a connector CN1D for connecting the positive side (VDD) and the negative side (ground line GL) of the power supply circuit. The ground line GL is also the ground line for the detection signals S2a, b.

結霜狀態檢測裝置1D中,使用單電源作為電源電路。不過,也可以使用由正電源(+VDD)與負電源(-VDD)之2系統所構成之雙電源。此時,將結霜狀態檢測裝置1D之正側(VDD)連接電源電路之正電源(+VDD),並將結霜狀態檢測裝置1D之接地線GL對應電源電路之電壓,連接電源電路之接地線GL或負電源(-VDD)即可。In the frosting state detecting device 1D, a single power source is used as the power source circuit. However, it is also possible to use a dual power supply consisting of two systems of a positive power supply (+VDD) and a negative power supply (-VDD). At this time, the positive side (VDD) of the frosting state detecting device 1D is connected to the positive power source (+VDD) of the power supply circuit, and the ground line GL of the frosting state detecting device 1D is connected to the voltage of the power supply circuit, and is connected to the ground of the power supply circuit. Line GL or negative power (-VDD) is sufficient.

至於驅動部11D,其構成與機能都與以上所述之驅動部11相同。形成於驅動部11D之訊號產生部GSD與以上所述之訊號產生部GS相同。訊號產生部GSD之輸出側有接電阻器R2串聯連接。As for the drive unit 11D, the configuration and function are the same as those of the drive unit 11 described above. The signal generating unit GSD formed in the driving unit 11D is the same as the signal generating unit GS described above. The output side of the signal generating unit GSD is connected in series with a resistor R2.

訊號產生部GSD之輸出電壓S0如第15圖(A)所示,是在接地線GL之電位之0伏特與施加至正側之電壓VDD間導通/截止之矩形波。As shown in Fig. 15(A), the output voltage S0 of the signal generating portion GSD is a rectangular wave which is turned on/off between 0 volts of the potential of the ground line GL and the voltage VDD applied to the positive side.

驅動部11D之輸出電壓S1,是電壓S0由電阻器R2與水分感應器13D之電阻Zs分壓而成,如第15圖(B)所示,比輸出電壓S0低。The output voltage S1 of the driving unit 11D is formed by dividing the voltage S0 by the resistor Z2 and the resistance Zs of the moisture sensor 13D, and is lower than the output voltage S0 as shown in Fig. 15(B).

也就是,在水以水滴狀態附著於水分感應器13D時,因電阻降低因此電壓之降低量增大,故輸出電壓S1如 虛線所示是相對較低之電壓。That is, when the water adheres to the moisture sensor 13D in the state of water droplets, the amount of decrease in voltage is increased due to a decrease in electric resistance, so the output voltage S1 is as The dotted line shows a relatively low voltage.

當附著於水分感應器13D之水凍結成為結霜狀態時,因電阻Zs增高使故電壓之降低量減少,故輸出電壓S1如一點鏈線所示,是相對較高之電壓。When the water adhering to the moisture sensor 13D freezes to a frosted state, the amount of decrease in voltage is reduced by the increase in the resistance Zs. Therefore, the output voltage S1 is a relatively high voltage as indicated by a one-dot chain line.

當水分感應器13D上水滴與霜皆未附著時,即水分感應器13D周邊為只有空気之乾燥狀態時,因電阻Zs為最大故電壓幾乎無降低量低,故輸出電壓S1為如實線所示之最高電壓。When the water sensor and the frost are not attached to the moisture sensor 13D, that is, when the periphery of the moisture sensor 13D is in a dry state in which only the space is dry, since the resistance Zs is maximum, the voltage is hardly reduced, so the output voltage S1 is as shown by the solid line. The highest voltage.

又,輸出電壓S1之高低(大小),是配合乾燥狀態、結霜狀態、水滴狀態、及水分之量等,來取各種數值。Further, the height (size) of the output voltage S1 is various values in combination with a dry state, a frosting state, a water drop state, and a moisture amount.

因此,水滴狀態與結霜狀態可依第15圖(B)所示之閾值th1來判別。另外,如後述,閾值th1可以設定為2個閾值th1a、th1b,而隨著狀態之變化方向不同來選擇使用閾值th1a或th1b之任一者。藉此,在二元化時將被賦予遲滯。Therefore, the water drop state and the frosting state can be determined based on the threshold value th1 shown in Fig. 15(B). Further, as will be described later, the threshold value th1 may be set to two threshold values th1a and th1b, and any one of the threshold values th1a or th1b may be selected depending on the direction in which the state changes. Thereby, hysteresis will be given during the binarization.

又,結霜狀態檢測裝置1D中,此等閾值th1、th1a、th1b是相對於以下說明之電壓S1c來設定,其於二元化中之意義是同樣的。Further, in the frosting state detecting device 1D, the threshold values th1, th1a, and th1b are set with respect to the voltage S1c described below, and the meaning is the same in the binarization.

又,結霜狀態與乾燥狀態,可以由第15圖(B)所示之閾值th2來判別。Further, the frosting state and the dry state can be determined by the threshold value th2 shown in Fig. 15(B).

又,結霜狀態檢測裝置1D中,閾值th2是相對於將輸出電壓S1分圧後之電壓來設定,其於二元化中之意義是同樣的。Further, in the frosting state detecting device 1D, the threshold value th2 is set with respect to the voltage obtained by dividing the output voltage S1, and the meaning in the binarization is the same.

驅動部11D之輸出電壓S1,即水分感應器13D之輸出電壓S1,是透過由電阻器R3及電容器C2所構成之輸入 介面部IF來輸入二元化部KDD。輸入介面部IF之輸出側之電壓S1c由於直流部分被電容器C2除去,因此如第15圖(C)所示,是以基準電壓(偏壓)Va為中心上下振動之正負訊號。The output voltage S1 of the driving portion 11D, that is, the output voltage S1 of the moisture sensor 13D, is transmitted through the input composed of the resistor R3 and the capacitor C2. The face IF is used to input the binarization unit KDD. Since the voltage S1c on the output side of the input dielectric portion IF is removed by the capacitor C2, as shown in Fig. 15(C), the positive and negative signals are vibrated up and down with the reference voltage (bias) Va as the center.

也就是說,實際上輸入二元化部KDD之電壓S1c之最大振幅比水分感應器13D之輸出電壓S1小,且在將基準電壓(偏壓)Va定為0伏特時正方向或負方向之最大值為其1/2。That is, the maximum amplitude of the voltage S1c of the input binarization unit KDD is actually smaller than the output voltage S1 of the moisture sensor 13D, and the positive or negative direction is obtained when the reference voltage (bias) Va is set to 0 volt. The maximum value is 1/2.

第16圖顯示於二元化部KDD中,根據來自輸入介面部IF之輸出電壓S1c進行二元化,輸出檢測訊號S2a之狀況。特別是,第16圖(B)與第16圖(C)分別顯示檢測訊號S2a從L轉變為H時之狀況,與檢測訊號S2a從H轉變為L時之狀況。Fig. 16 shows the state in which the detection signal S2a is outputted in accordance with the output voltage S1c from the input dielectric portion IF in the binary unit KDD. In particular, Fig. 16(B) and Fig. 16(C) show the state when the detection signal S2a is changed from L to H, and the state when the detection signal S2a is changed from H to L, respectively.

第16圖(A)(B)(C)中,閾值TH是二元化部KDD之邏輯電路中用來作邏輯判定之閾值。也就是,當輸出電壓S1c為閾值TH以下時,輸入將處理為L,而檢測訊號S2a成為截止。當輸出電壓S1c超過閾值TH時輸入將處理為H,而檢測訊號S2a成為導通。In Fig. 16(A)(B)(C), the threshold TH is a threshold used for logical decision in the logic circuit of the binarization unit KDD. That is, when the output voltage S1c is equal to or less than the threshold TH, the input will be processed as L, and the detection signal S2a will be turned off. When the output voltage S1c exceeds the threshold TH, the input will be processed as H, and the detection signal S2a will be turned on.

又,輸出電壓S1c中之基準電壓(偏壓)Va設定為適當之值,該值係比閾值TH更低而可判別水滴狀態或結霜狀態之值。Further, the reference voltage (bias) Va in the output voltage S1c is set to an appropriate value which is lower than the threshold TH to discriminate the value of the water drop state or the frosting state.

閾值TH與基準電壓(偏壓)Va之差(TH-Va)是用於比較輸出電壓S1c以進行二元化之閾值th1。也就是,差(TH-Va)是本發明中「閾值」及「第1閾值」之例。The difference (TH-Va) between the threshold TH and the reference voltage (bias) Va is a threshold value th1 for comparing the output voltage S1c for binarization. That is, the difference (TH-Va) is an example of the "threshold value" and the "first threshold value" in the present invention.

又,閾值TH是用於將來自水分感應器13D之輸出 電壓S1二元化之閾值這點,就是本發明中「閾值」及「第1閾值」之例。不過,閾值TH本身與閾值th2之大小之關係,並不直接對應本發明中的「第1閾值」。Also, the threshold TH is for output from the moisture sensor 13D The threshold value of the voltage S1 binarization is an example of the "threshold value" and the "first threshold value" in the present invention. However, the relationship between the threshold TH itself and the magnitude of the threshold value th2 does not directly correspond to the "first threshold value" in the present invention.

藉由適當地設定偏壓Va,可以適當地設定閾值th1之值。The value of the threshold value th1 can be appropriately set by appropriately setting the bias voltage Va.

因此,如第16圖(A)之左側所示,當由水分感應器13D檢測出結霜狀態時,也就是輸出電壓S1c比閾值th1更高時,由於輸出電壓S1c之一部分超過閾值TH因此二元化部KDD之輸入成為H,檢測訊號S2a成為導通。Therefore, as shown on the left side of Fig. 16(A), when the frosting state is detected by the moisture sensor 13D, that is, when the output voltage S1c is higher than the threshold value th1, since one of the output voltages S1c exceeds the threshold TH, The input of the KDD of the elementizing unit becomes H, and the detection signal S2a becomes conductive.

又,如第16圖(A)之右側所示,當由水分感應器13D檢測出水滴狀態時,也就是輸出電壓S1c比閾值th1更低時,由於輸出電壓S1c不超過閾值TH因此輸入成為L,檢測訊號S2a成為截止。Further, as shown on the right side of Fig. 16(A), when the water droplet state is detected by the moisture sensor 13D, that is, when the output voltage S1c is lower than the threshold value th1, since the output voltage S1c does not exceed the threshold value TH, the input becomes L. The detection signal S2a becomes the cutoff.

又,於二元化部KDD中,在檢測訊號S2a成為導通時,由電容器C3設有適當之時定數之集成電路,以暫時維持其狀態。因此,本實施形態中注意二元化時輸出電壓S1c之最大值即可。Further, in the binary unit KDD, when the detection signal S2a is turned on, the capacitor C3 is provided with an appropriate number of integrated circuits to temporarily maintain the state. Therefore, in the present embodiment, the maximum value of the output voltage S1c at the time of binarization may be noted.

又,如第16圖(B)所示,檢測訊號S2a為截止時,也就是水分感應器13D檢測出水滴狀態時,將相對較低之電壓Vaa設定為偏壓Va。藉此,閾值TH與偏壓Vaa之差(TH-Vaa)相對地增大,而可設定相對較大之閾值th1a。Further, as shown in Fig. 16(B), when the detection signal S2a is off, that is, when the moisture sensor 13D detects the state of water droplets, the relatively low voltage Vaa is set to the bias voltage Va. Thereby, the difference (TH-Vaa) between the threshold TH and the bias voltage Vaa is relatively increased, and a relatively large threshold value th1a can be set.

當來自輸入介面部IF之輸出電壓S1c超過閾值th1a時,檢測出從水滴狀態往結霜狀態移行,輸出檢測訊號S2a。When the output voltage S1c from the input dielectric surface IF exceeds the threshold value th1a, it is detected that the transition from the water drop state to the frosting state is detected, and the detection signal S2a is output.

又,如第16圖(B)所示,檢測訊號S2a為導通時,也就是水分感應器13D檢測出結霜狀態時,將相對較高之電壓Vab設定為偏壓Va。藉此,閾值TH與偏壓Vab之差(TH-Vab)相對地減小,而可設定相對較小之閾值th1b。Further, as shown in Fig. 16(B), when the detection signal S2a is turned on, that is, when the moisture sensor 13D detects the frosting state, the relatively high voltage Vab is set to the bias voltage Va. Thereby, the difference (TH-Vab) between the threshold TH and the bias voltage Vab is relatively decreased, and a relatively small threshold value th1b can be set.

當來自輸入介面部IF之輸出電壓S1c成為閾值th1b以下時,檢測出從結霜狀態往水滴狀態移行,檢測訊號S2a成截止。When the output voltage S1c from the input dielectric surface IF becomes equal to or less than the threshold value th1b, it is detected that the transition from the frosting state to the water droplet state is detected, and the detection signal S2a is turned off.

第17圖顯示修正部SYD中,配合水分感應器13D輸出電壓S1判別是乾燥狀態,並在乾燥狀態時將檢測訊號S2a設為截止之狀態。又,本實施形態之修正部SYD是由NOT電路Q6所構成。Fig. 17 shows a state in which the correction unit SYD is determined to be in a dry state by the output voltage S1 of the moisture sensor 13D, and the detection signal S2a is turned off in the dry state. Further, the correction unit SYD of the present embodiment is constituted by the NOT circuit Q6.

第17圖中,輸入修正部SYD之電壓S1d是將來自水分感應器13D之輸出電壓S1以後述之電阻器R11與電阻器R12分壓而成之電壓。In Fig. 17, the voltage S1d input to the correction unit SYD is a voltage obtained by dividing the resistor R11 and the resistor R12 which will be described later from the output voltage S1 of the moisture sensor 13D.

閾值TH2是修正部SYD之邏輯電路中用來作邏輯判定之閾值。也就是,當輸出電壓S1d為閾值TH2以下時,輸入將處理為L,而修正部SYD之輸出維持於H。當電壓S1d超過閾值TH2時,輸入將處理為H,而修正部SYD之輸出成為L。當修正部SYD輸出成為L,則輸入介面部IF之輸出電壓S1c將成為大約0伏特。The threshold TH2 is a threshold used for logical determination in the logic circuit of the correction unit SYD. That is, when the output voltage S1d is equal to or less than the threshold TH2, the input will be processed as L, and the output of the correction unit SYD will be maintained at H. When the voltage S1d exceeds the threshold TH2, the input will be processed as H, and the output of the correction unit SYD will be L. When the output of the correction unit SYD becomes L, the output voltage S1c of the input interface IF will become approximately 0 volts.

在此,閾值TH2是用於判別是乾燥狀態或結霜狀態之閾值th2。在此意義下,閾值TH2是本發明中「第2閾值」之例。不過,閾值TH2本身在與閾值th1之大小關係上不直接對應本發明中之「第2閾值」。Here, the threshold TH2 is a threshold value th2 for discriminating whether it is a dry state or a frosting state. In this sense, the threshold TH2 is an example of the "second threshold" in the present invention. However, the threshold value TH2 itself does not directly correspond to the "second threshold value" in the present invention in relation to the magnitude of the threshold value th1.

因此,如第17圖之左側所示,由水分感應器13D檢測出乾燥狀態時,也就是電壓S1d比閾值TH2更高時,由於電壓S1d之一部分超出閾值TH2,因此修正部SYD之輸出成為L。藉此,電壓S1c成為大約0伏特,比任一閾值th1a、b都更小,而檢測訊號S2a被強制地設為截止。Therefore, as shown on the left side of Fig. 17, when the dry state is detected by the moisture sensor 13D, that is, when the voltage S1d is higher than the threshold TH2, since one of the voltages S1d exceeds the threshold TH2, the output of the correction unit SYD becomes L. . Thereby, the voltage S1c becomes about 0 volts, which is smaller than any of the thresholds th1a, b, and the detection signal S2a is forcibly turned off.

又,如第17圖之右側所示,當由水分感應器13D檢測出結霜狀態時,也就是電壓S1d比閾值TH2更低時,由於電壓S1d不超過閾值TH2,因此修正部SYD之輸出維持在H。如此,修正部SYD不影響電壓S1c,而在二元化部KDD進行對應電壓S1c之判別。Further, as shown on the right side of Fig. 17, when the frost state is detected by the moisture sensor 13D, that is, when the voltage S1d is lower than the threshold TH2, since the voltage S1d does not exceed the threshold TH2, the output of the correction portion SYD is maintained. At H. In this manner, the correction unit SYD does not affect the voltage S1c, but the discrimination unit KDD determines the corresponding voltage S1c.

二元化部KDD將輸入之電壓S1c與閾值th1比較以進行二元化,輸出檢測訊號。The binary unit KDD compares the input voltage S1c with the threshold value th1 to perform binarization, and outputs a detection signal.

也就是,二元化部KDD在來自輸入介面部IF之輸出電壓S1c大於閾值th1時,將代表第1電極22Da、b與第2電極23D間之水分凍結而變化為霜狀之結霜狀態檢測訊號輸出作為檢測訊號S2a。In other words, when the output voltage S1c from the input dielectric surface IF is larger than the threshold value th1, the binary unit KDD freezes the water between the first electrodes 22Da and b and the second electrode 23D and changes to a frosty state. The signal is output as the detection signal S2a.

又,當來自水分感應器13D之輸出電壓S1大於閾值th2時,不輸出檢測訊號S2a,以表示第1電極22Da、b與第2電極23D間是無水分之乾燥狀態。也就是,在乾燥狀態時強制地將檢測訊號S2a設為截止,而修正部SYD就是為了此修正而設置。When the output voltage S1 from the moisture sensor 13D is larger than the threshold value th2, the detection signal S2a is not outputted, indicating that the first electrode 22Da, b and the second electrode 23D are in a dry state without moisture. That is, the detection signal S2a is forcibly turned off in the dry state, and the correction portion SYD is provided for this correction.

也就是,修正部SYD將來自水分感應器13D之輸出電壓S1大於閾值th2時將賴自輸入介面部IF之輸出電壓S1c降至閾值th1以下,藉此修正為檢測訊號S2a不會輸出。In other words, when the output voltage S1 from the moisture sensor 13D is larger than the threshold value th2, the correction unit SYD reduces the output voltage S1c from the input interface surface IF to the threshold value th1 or less, thereby correcting that the detection signal S2a is not output.

又,閾值th2比閾值th1大,即th2>th1。Further, the threshold value th2 is larger than the threshold value th1, that is, th2>th1.

以下參考第13圖~第18圖,詳細說明判定部12D之構成及動作。The configuration and operation of the determination unit 12D will be described in detail below with reference to Figs. 13 to 18 .

第13圖中,二元化部KDD是由NOT電路Q3~Q5、電阻器R4、R5、R6、R10、電容器C3、二極體D1等所構成。二元化部KDD是連接輸入介面部IF之輸出側。In Fig. 13, the binarization unit KDD is composed of NOT circuits Q3 to Q5, resistors R4, R5, R6, and R10, a capacitor C3, a diode D1, and the like. The binarization unit KDD is an output side that connects the input interface face IF.

又,修正部SYD是由NOT電路Q6、電阻器R11~R13、電容器C4、二極體D2等所構成。二元化部KDD可視為與輸入介面部IF並聯連接。Further, the correction unit SYD is constituted by the NOT circuit Q6, the resistors R11 to R13, the capacitor C4, the diode D2, and the like. The binarization unit KDD can be regarded as being connected in parallel with the input media face IF.

又,NOT電路Q1~Q6皆是由CMOS(Complementary Metal Oxide Semiconductor)之NOT電路元件所構成。Further, each of the NOT circuits Q1 to Q6 is constituted by a NOT circuit element of a CMOS (Complementary Metal Oxide Semiconductor).

也就是,如第14圖所示,NOT電路Q1~Q6皆是將p通道(p channel)與n通道(n channel)之MOSFET配置為互補形之閘門構造之邏輯反轉(logic inversi導通)電路元件所構成。當輸入閘門IN為L(低水準)時之輸出成為H(高水準),當輸入閘門IN為H時閘門OUT成為L。第2實施形態中利用之NOT電路Q11~Q14也與此相同。That is, as shown in FIG. 14, the NOT circuits Q1 to Q6 are logic inversi conduction circuits in which the p-channel and n-channel MOSFETs are configured in a complementary gate structure. Component composition. When the input gate IN is L (low level), the output becomes H (high level), and when the input gate IN is H, the gate OUT becomes L. The NOT circuits Q11 to Q14 used in the second embodiment are also the same.

如此之NOT電路元件,例如可利用市售型號為14068B之積體電路元件。型號為14068B之積體電路元件是將6個NOT電路元件收容於1個包裝者,可以1個積體電路元件提供結霜狀態檢測裝置1D所必須之全部NOT電路Q1~Q6。As such a NOT circuit element, for example, an integrated circuit element of a commercially available model number 14068B can be used. In the integrated circuit device of the type 14068B, six NOT circuit elements are housed in one package, and all of the NOT circuits Q1 to Q6 necessary for the frost state detecting device 1D can be provided by one integrated circuit element.

如此之NOT電路Q3中,邏輯反轉之閾值TH是電 源之電壓VDD之2分之1附近。也就是,當輸入閘門IN之電壓超出VDD/2時輸出成為L,當輸入閘門IN之電壓成為VDD/2以下時輸出成為H。In such a NOT circuit Q3, the threshold TH of the logic inversion is electric The source voltage is near 1/2 of the voltage VDD. That is, the output becomes L when the voltage of the input gate IN exceeds VDD/2, and becomes H when the voltage of the input gate IN becomes VDD/2 or less.

在此,若對NOT電路Q3之輸入閘門IN施加偏壓Va,則來自輸入介面部IF之輸出電壓S1c超出此等閾值TH與偏壓Va之差(TH-Va)時輸出成為L,當輸出電壓S1c成為差(TH-Va)以下時輸出成為H。也就是,差(TH-Va)成為閾值th1。Here, when the bias voltage Va is applied to the input gate IN of the NOT circuit Q3, the output voltage S1c from the input dielectric surface IF exceeds the difference (TH-Va) between the threshold TH and the bias voltage Va, and the output becomes L, when the output is When the voltage S1c becomes equal to or less than (TH-Va), the output becomes H. That is, the difference (TH-Va) becomes the threshold value th1.

因此,藉由變更偏壓Va之值,可變更閾值th1。也就是,偏壓Va設為比閾值TH低之電壓時(Va<TH),降低偏壓Va則差(TH-Va)會增大而閾值th1升高,增大偏壓Va則差(TH-Va)減小而閾值th1降低。Therefore, the threshold value th1 can be changed by changing the value of the bias voltage Va. That is, when the bias voltage Va is set to a voltage lower than the threshold TH (Va<TH), the difference (TH-Va) is increased and the threshold value th1 is increased, and the bias voltage Va is increased (TH). -Va) decreases while the threshold th1 decreases.

本實施形態中,NOT電路Q3之輸出為H時,將偏壓Va設為相對較小之電壓Vaa,將輸出由H切換為L時所使用之閾值th1a設定為較高;NOT電路Q3之輸出為L時,將偏壓Va設為比電壓Vaa更大之電壓Vab(Vab>Vaa),將輸出由H切換為L時所使用之閾值th1b設定為較低。也就是,th1a>th1b(參見第15圖、第18圖)。In the present embodiment, when the output of the NOT circuit Q3 is H, the bias voltage Va is set to a relatively small voltage Vaa, and the threshold value th1a used when the output is switched from H to L is set to be high; the output of the NOT circuit Q3 is set. In the case of L, the bias voltage Va is set to a voltage Vab (Vab > Vaa) larger than the voltage Vaa, and the threshold value th1b used when the output is switched from H to L is set to be low. That is, th1a>th1b (see Fig. 15 and Fig. 18).

如此,設定用以將H切換為L之閾值th1a,及用以將L切換為H之閾值th1b等2個閾值th1a、b。In this manner, the threshold value th1a for switching H to L and the two threshold values th1a and b for switching L to the threshold value th1 of H are set.

第13圖所示之二元化部KDD中,由於設定有2個閾值th1a、b,由NOT電路Q4之輸出側往NOT電路Q3之輸入側,有由電阻器R10所造成之正回饋。電阻器R10是為了在由NOT電路Q3進行二元化時,輸出狀態配合變化偏壓Va以 賦予閾值th1遲滯之回饋電阻。In the binarization unit KDD shown in Fig. 13, since two threshold values th1a and b are set, positive feedback is caused by the resistor R10 from the output side of the NOT circuit Q4 to the input side of the NOT circuit Q3. The resistor R10 is for outputting a state in accordance with the change bias voltage Va when binarization is performed by the NOT circuit Q3. A feedback resistor that gives a threshold value of th1 hysteresis.

也就是,NOT電路Q4之輸出電壓是由2個電阻器R10、R5分壓後加算至NOT電路Q3之輸入側加算。NOT電路Q3之輸入側受到施加經由電阻器R4之電源之電壓VDD,2個電阻器R4、R5由分壓後之電壓與電阻器R10所回饋之電壓之和成為NOT電路Q3之偏壓Va。That is, the output voltage of the NOT circuit Q4 is divided by the two resistors R10 and R5 and added to the input side of the NOT circuit Q3. The input side of the NOT circuit Q3 is subjected to a voltage VDD to which a power supply via the resistor R4 is applied, and the sum of the voltages divided by the two resistors R4 and R5 and the voltage fed back by the resistor R10 becomes the bias voltage Va of the NOT circuit Q3.

NOT電路Q4之輸出為H時,NOT電路Q3之輸入側受到相對較高之偏壓Vab,NOT電路Q4之輸出為L時,NOT電路Q3之輸入側受到相對較低之偏壓Vaa。When the output of the NOT circuit Q4 is H, the input side of the NOT circuit Q3 is subjected to a relatively high bias voltage Vab, and when the output of the NOT circuit Q4 is L, the input side of the NOT circuit Q3 is subjected to a relatively low bias voltage Vaa.

因此,例如NOT電路Q3之輸出為H時,也就是NOT電路Q4之輸出為L,而檢測訊號S2a未輸出時(非結霜狀態時),由輸入介面部IF輸入至NOT電路Q3之輸出電壓S1c為比閾值th1a更低之狀態,因輸出電壓S1c超出閾值th1a而將NOT電路Q3之輸出由H切換成L。此時,偏壓Va升高而成為偏壓Vab,閾值th1降低成為閾值th1b。Therefore, for example, when the output of the NOT circuit Q3 is H, that is, the output of the NOT circuit Q4 is L, and when the detection signal S2a is not output (when not in the frosting state), the output voltage is input from the input dielectric portion IF to the NOT circuit Q3. S1c is in a state lower than the threshold value th1a, and the output of the NOT circuit Q3 is switched from H to L because the output voltage S1c exceeds the threshold value th1a. At this time, the bias voltage Va rises to become the bias voltage Vab, and the threshold value th1 decreases to the threshold value th1b.

而當NOT電路Q3之輸出為L時,也就是NOT電路Q4之輸出為H、有輸出檢測訊號S2a輸出時(為結霜狀態時),由輸入介面部IF輸入至NOT電路Q3之輸出電壓S1c為比閾值th1b更高之狀態,因輸出電壓S1c降至閾值th1b以下使NOT電路Q3之輸出由L切換為H。此時,偏壓Va降低成為偏壓Vaa,閾值th1升高成為閾值th1a。When the output of the NOT circuit Q3 is L, that is, when the output of the NOT circuit Q4 is H, when the output detection signal S2a is output (in the frost state), the output voltage S1c is input from the input interface IF to the NOT circuit Q3. In a state higher than the threshold value th1b, the output of the NOT circuit Q3 is switched from L to H because the output voltage S1c falls below the threshold value th1b. At this time, the bias voltage Va is lowered to the bias voltage Vaa, and the threshold value th1 is increased to the threshold value th1a.

又,如以上所述,NOT電路Q3之輸出側,也就是NOT電路Q4之輸入側與接地線GL之間連接有集成用之電容器C3,積蓄輸入至NOT電路Q4之電荷使短時間中激烈 之電壓變化不會發生。電容器C3之容量例如是0.001μF~0.1μf左右,具體舉例則是0.01μf左右。電容器C3是本發明中「第2容量元件」之例。Further, as described above, the output side of the NOT circuit Q3, that is, the capacitor C3 for integration is connected between the input side of the NOT circuit Q4 and the ground line GL, and the charge input to the NOT circuit Q4 is accumulated to be intense in a short time. The voltage change does not occur. The capacity of the capacitor C3 is, for example, about 0.001 μF to 0.1 μf, and specific example is about 0.01 μf. The capacitor C3 is an example of the "second capacity element" in the present invention.

接著說明修正部SYD之動作。Next, the operation of the correction unit SYD will be described.

修正部SYD如以上所述,來自水分感應器13D之輸出電壓S1由電阻器R11與電阻器R12分壓後作為電壓S1d輸入至NOT電路Q6。電阻器R11、R12之值是設定為在電壓S1d比閾值TH2更大時,也就是電壓S1比閾值th2更大時,可使NOT電路Q6之輸出為L之值。As described above, the correction unit SYD divides the output voltage S1 from the moisture sensor 13D by the resistor R11 and the resistor R12, and then inputs it to the NOT circuit Q6 as the voltage S1d. The values of the resistors R11 and R12 are set such that when the voltage S1d is larger than the threshold TH2, that is, when the voltage S1 is larger than the threshold value th2, the output of the NOT circuit Q6 can be set to L.

當NOT電路Q6之輸出成為L,NOT電路Q3之輸入側之電位透過電阻器R13及二極體D2連接接地線GL,而NOT電路Q3之輸入側之電位降低至閾值th1b以下。結果,造成NOT電路Q3之輸出成為H,NOT電路Q4之輸出成為L。When the output of the NOT circuit Q6 is L, the potential on the input side of the NOT circuit Q3 is connected to the ground line GL through the resistor R13 and the diode D2, and the potential on the input side of the NOT circuit Q3 is lowered to the threshold value th1b or less. As a result, the output of the NOT circuit Q3 becomes H, and the output of the NOT circuit Q4 becomes L.

又,電容器C4調整NOT電路Q3在輸入側之位相,或抑制電位之激烈變化以使動作穩定化。Further, the capacitor C4 adjusts the phase of the NOT circuit Q3 on the input side or suppresses a drastic change in potential to stabilize the operation.

如此,修正部SYD在來自水分感應器13D之輸出電壓S1為閾值th2時,將來自輸入介面部IF之輸出電壓S1c降低至閾值th1b以下,以使檢測訊號S2a不會輸出,也就是將檢測訊號S2a修正為截止。In this manner, when the output voltage S1 from the moisture sensor 13D is the threshold value th2, the correction unit SYD lowers the output voltage S1c from the input interface IF to below the threshold value th1b, so that the detection signal S2a is not output, that is, the detection signal is detected. S2a is corrected to cutoff.

第18圖中,於時刻t1時令冷凍機RK之電源為導通。時刻t1於,冷卻管RKP之周邊為乾燥狀態,水分感應器13D檢測出乾燥狀態輸出比閾值th2更高之電壓S1。此時,修正部SYD之輸出成為L,輸入至二元化部KDD之電壓S1c成為0伏特,將檢測訊號S2a強制地設為截止。因此,冷凍 機RK之冷卻裝置開始運轉,冷卻管RKP將冷卻。In Fig. 18, the power of the refrigerator RK is turned on at time t1. At time t1, the periphery of the cooling pipe RKP is in a dry state, and the moisture sensor 13D detects that the dry state outputs a voltage S1 higher than the threshold value th2. At this time, the output of the correction unit SYD is L, the voltage S1c input to the binarization unit KDD is 0 volt, and the detection signal S2a is forcibly turned off. Therefore, freezing The cooling device of the machine RK starts to operate, and the cooling pipe RKP will be cooled.

此時,因NOT電路Q3之輸入側為L,故設定相對較低之偏壓Vaa,因此閾值th1a被設定為相對較高。At this time, since the input side of the NOT circuit Q3 is L, the relatively low bias voltage Vaa is set, so the threshold value th1a is set to be relatively high.

又,由於因冷凍機RK之運轉會發生結露,因此於時刻t2水分感應器13D之輸出電壓S1會降至比閾值th2更低,NOT電路Q6之輸出成為H。不過,由於此時會因結露造成輸出電壓S1激烈地下降,且有電容器C3、C4之提供之集成効果,因此NOT電路Q4之輸出不會成為H。Further, since dew condensation occurs due to the operation of the refrigerator RK, the output voltage S1 of the moisture sensor 13D falls below the threshold value th2 at time t2, and the output of the NOT circuit Q6 becomes H. However, since the output voltage S1 is drastically lowered due to condensation at this time, and the integration effect of the capacitors C3 and C4 is provided, the output of the NOT circuit Q4 does not become H.

而由於結露之水滴逐漸凍結,電壓S1c將逐漸增大,於時刻t3超過閾值th1a,則檢測為結霜狀態,檢測訊號S2a成為導通。On the other hand, since the dew condensation water gradually freezes, the voltage S1c gradually increases, and when the threshold value th1a is exceeded at time t3, the frosting state is detected, and the detection signal S2a is turned on.

當檢測訊號S2a成為導通,冷凍機RK之冷卻裝置停止運轉,冷卻管RKP之溫度將逐漸上升。When the detection signal S2a is turned on, the cooling device of the refrigerator RK is stopped, and the temperature of the cooling pipe RKP is gradually increased.

此時,由於NOT電路Q3之輸入側為H,因此設定較高之偏壓Vab,並藉此設定相對較低之閾值th1b。At this time, since the input side of the NOT circuit Q3 is H, the higher bias voltage Vab is set, and thereby the relatively lower threshold value th1b is set.

隨著溫度上昇,霜融解而逐漸回到水滴狀態時,電壓S1c逐漸減小,在時刻t4時成為閾值th1b以下,則檢測出為水滴狀態,而檢測訊號S2a成為截止。藉此,冷凍機RK之冷卻裝置之運轉將再度開始。As the temperature rises and the frost melts and gradually returns to the water drop state, the voltage S1c gradually decreases, and when the threshold value th1b or less is reached at time t4, the water droplet state is detected, and the detection signal S2a is turned off. Thereby, the operation of the cooling device of the freezer RK will start again.

也就是說,如第19圖所示,本實施形態之冷凍機RK是重覆從乾燥狀態啟動,經由水滴狀態後成為結霜狀態時停止運轉,在成為水滴狀態時再開始運轉之循環。In other words, as shown in Fig. 19, the refrigerator RK of the present embodiment is a cycle in which the refrigerator RK is restarted from the dry state, the operation is stopped when the water is in a frosted state, and the operation is resumed when the water droplets are in a state of water droplets.

如此,藉由本實施形態之結霜狀態檢測裝置1D,可檢測出冷凍機RK中之結霜狀態、或檢測出從結霜狀 態移行至水滴狀態,而可隨之適當地切換冷卻裝置之運轉與停止。As described above, the frosting state detecting device 1D of the present embodiment can detect the frosting state in the refrigerator RK or detect the frosting state. The state shifts to the state of water droplets, and the operation and stop of the cooling device can be appropriately switched accordingly.

而且,因為在從水滴狀態往結霜狀態移行時,與從結霜狀態往水滴狀態移行時用於檢測之閾值th為相異之值,因此可更適當地切換冷卻裝置之運轉與停止。Further, since the threshold value th for detection when moving from the water droplet state to the frosting state is different from the threshold value for detecting from the frosting state to the water droplet state, the operation and the stop of the cooling device can be more appropriately switched.

又,在冷凍機RK初期啟動(運轉)時即使是乾燥狀態也強制地將檢測訊號S2a設為截止,以圓滑地啟動冷卻裝置。Further, when the refrigerator RK is initially started (operated), the detection signal S2a is forcibly turned off even in the dry state, and the cooling device is smoothly started.

本實施形態之結霜狀態檢測裝置1D可以由具NOT電路Q1~Q6之1個積體電路元件、少量之電阻及電容器等電子零件來構成,可藉由將該等電子零件裝入構成水分感應器13D之基板21D來製作。因此,可將結霜狀態檢測裝置1D小型且輕量化,而便宜地製作,且容易安裝至冷凍機RK。而且,與冷凍機RK之控制部RKC可以3條電線來接続,其安裝及維護也都容易。The frosting state detecting device 1D of the present embodiment can be constituted by one integrated circuit element having the NOT circuits Q1 to Q6, a small number of electronic components such as a resistor and a capacitor, and can be incorporated into the moisture sensing by the electronic components. The substrate 21D of the device 13D is fabricated. Therefore, the frosting state detecting device 1D can be made compact and lightweight, can be manufactured inexpensively, and can be easily attached to the refrigerator RK. Moreover, the control unit RKC of the freezer RK can be connected by three wires, and it is easy to install and maintain.

如此,藉由本實施形態,不須如以往設置偽裝電極仍可以充分之精度來檢測結霜狀態,可提供構成簡單之結霜狀態檢測裝置1D。As described above, according to the present embodiment, it is possible to detect the frosting state with sufficient accuracy without providing the camouflage electrode as in the related art, and it is possible to provide the frosting state detecting device 1D having a simple configuration.

以上所述之實施形態之冷凍機RK雖然配合結霜狀態檢測裝置1D之檢測訊號S2a來開關冷卻裝置,亦可藉由控制驅動冷卻裝置之逆變馬達之轉速,以增大或降低冷卻能力。The refrigerator RK of the above-described embodiment can switch the cooling device in conjunction with the detection signal S2a of the frosting state detecting device 1D, and can increase or decrease the cooling capacity by controlling the rotation speed of the inverter motor that drives the cooling device.

又,結霜狀態檢測裝置1D亦可以不依檢測訊號S2a控制冷卻裝置,而例如設置除霜用之除霜加熱器,控制 為在檢測到結霜狀態時啟動除霜加熱器。Further, the frosting state detecting device 1D may control the cooling device without depending on the detection signal S2a, and for example, may provide a defrosting heater for defrosting, and control The defrost heater is activated when a frosting condition is detected.

又,結霜狀態檢測裝置1D中,亦可設置發光二極體等之顯示輸出部,以顯示檢測訊號S2a之開(導通)或關(截止)。Further, in the frosting state detecting device 1D, a display output portion such as a light emitting diode may be provided to display the ON (ON) or OFF (OFF) of the detection signal S2a.

又,如以上所述,判定部12D中,蠆對應來自水分感應器13D之輸出電壓S1之大小進行二元化以輸出檢測訊號時,使用與輸出電壓S1有關之各種電壓S1c、S1d、及各種閾值th1、th1a,th1b、TH、TH2。該等是本發明中「來自電容感應器之輸出電壓」或「閾值」「第1閾值」「第2閾值」之例。但是,亦可對應電路及元件等,使用以上所述之例以外之電壓或閾值。Further, as described above, in the determination unit 12D, when the output voltage S1 from the moisture sensor 13D is binarized to output a detection signal, various voltages S1c, S1d, and various types related to the output voltage S1 are used. Thresholds th1, th1a, th1b, TH, TH2. These are examples of "output voltage from a capacitive sensor" or "threshold value", "first threshold value" and "second threshold value" in the present invention. However, voltages or thresholds other than those described above may be used in accordance with circuits, components, and the like.

又,以上所述之NOT電路Q3是本發明中「第1NOT電路」之例。又,NOT電路Q6是本發明中「第2NOT電路」之例。Further, the NOT circuit Q3 described above is an example of the "first NOT circuit" in the present invention. Further, the NOT circuit Q6 is an example of the "second NOT circuit" in the present invention.

以上所述之各種實施形態中,結霜感應器13、13B或水分感應器13C、13D,可安裝於冷卻器RP、冷卻管RKP、其他之管、冷卻用扇、冷蔵庫等之壁面,或其他處所。In the various embodiments described above, the frost sensors 13 and 13B or the moisture sensors 13C and 13D can be attached to the wall of the cooler RP, the cooling pipe RKP, other pipes, the cooling fan, the cold storage, or the like, or the like. Premises.

亦可使用比較器(比較電路)來取代上述之NOT電路Q3。此時,比較輸入至判定部12、12B、12C、12D之電壓S1、S1b、S1c與電阻器R4、R5等所設定之閾值th、th1、th1a、th1b等即可。由於電壓S1、S1b、S1c是交流訊號,因此超出閾值th之直流電壓成分(邁流)會出現於比較器之輸出側。將其平滑化後二元化即可。為取得對應交流訊號之 電壓S1、S1b、S1c大小之二元化訊號,亦可利用其他各種檢測或檢波方式。A comparator (comparison circuit) can also be used instead of the NOT circuit Q3 described above. At this time, the voltages S1, S1b, and S1c input to the determination units 12, 12B, 12C, and 12D and the thresholds th, th1, th1a, and th1b set by the resistors R4 and R5 may be compared. Since the voltages S1, S1b, and S1c are alternating current signals, a DC voltage component (current flow) exceeding the threshold th appears on the output side of the comparator. It can be smoothed and then binarized. In order to obtain the corresponding communication signal The binary signals of the sizes S1, S1b, and S1c can also be used in various other detection or detection methods.

此外,輸入介面部IF,IFB、二元化部KD、KDB、KDC、KDD、顯示輸出部HS、HSB、HSC、驅動部11、11C、11D、判定部12、12B、12C、12D、結霜感應器13、水分感應器13C、13D、30、30B、30C、結霜狀態檢測裝置1、1B、1D、或檢測裝置1C之各部或全體之構成、構造、電路、形狀、尺寸、個數、材質、配置、頻率、波形,可依本發明之主旨適當改變。Further, the input interface IF, IFB, binary unit KD, KDB, KDC, KDD, display output unit HS, HSB, HSC, drive units 11, 11C, 11D, determination units 12, 12B, 12C, 12D, frosting Configuration, structure, circuit, shape, size, number, and number of each or all of the inductors 13, the moisture sensors 13C, 13D, 30, 30B, and 30C, the frosting state detecting devices 1, 1B, and 1D, or the detecting device 1C The material, configuration, frequency, and waveform can be appropriately changed in accordance with the gist of the present invention.

11C‧‧‧驅動部11C‧‧‧Drive Department

12C‧‧‧判定部12C‧‧‧Decision Department

13C‧‧‧水分感應器13C‧‧‧Moisture sensor

1C‧‧‧檢測裝置1C‧‧‧Detection device

21C‧‧‧基板21C‧‧‧Substrate

22C‧‧‧第1圖形電極22C‧‧‧1st graphic electrode

23C‧‧‧第2圖形電極23C‧‧‧2nd graphic electrode

C1、C3‧‧‧電容器C1, C3‧‧‧ capacitor

CN1‧‧‧連接器CN1‧‧‧Connector

D1‧‧‧二極體D1‧‧‧ diode

GL‧‧‧接地線GL‧‧‧ grounding wire

HSC‧‧‧輸出部HSC‧‧‧Output Department

KDC‧‧‧二元化部KDC‧‧‧Dualization Department

LEDa、LEDb‧‧‧發光二極體LEDa, LEDb‧‧‧Lighting diode

Q1、Q2、Q3、Q4、Q5‧‧‧NOT電路Q1, Q2, Q3, Q4, Q5‧‧‧NOT circuits

R1、R4、R5、R6、R7、R8‧‧‧電阻器R1, R4, R5, R6, R7, R8‧‧‧ resistors

S1a‧‧‧交流訊號S1a‧‧‧ exchange signal

S1b‧‧‧輸出電壓S1b‧‧‧ output voltage

S2a、S2b‧‧‧檢測訊號S2a, S2b‧‧‧ detection signals

T11‧‧‧輸出端子T11‧‧‧ output terminal

T12‧‧‧輸入端子T12‧‧‧ input terminal

Ta、Tb‧‧‧端子Ta, Tb‧‧‧ terminals

+VDD‧‧‧正電源+VDD‧‧‧ positive power supply

-VDD‧‧‧負電源-VDD‧‧‧Negative power supply

Claims (15)

一種電容式水分檢測裝置,係檢測因應周圍環境之水分比例或狀態之電容之變化而輸出檢測信號者,包含有:電容感應器,係具有相互呈相對向配置之第1電極與第2電極,且電容因應前述第1電極與前述第2電極間之水分比例或狀態而變化者;驅動部,係對前述電容感應器施加交流信號者;及判定部,係因應來自前述電容感應器之輸出電壓之大小,進行二元化並輸出導通或截止之檢測信號者,且前述判定部具有:輸入介面部,係由連接前述電容感應器之輸出側且相互串聯連接之第1電阻零件及電容零件所構成者;二元化部,係連接於前述輸入介面部之輸出側,在來自前述輸入介面部之輸出電壓大於第1閾值時,輸出代表前述第1電極與前述第2電極間之水分凍結而變化為霜狀之結霜狀態檢測訊號作為前述檢測訊號;及修正部,在來自前述電容感應器之輸出電壓大於比前述第1閾值更大之第2閾值時,將來自前述輸入介面部之輸出電壓降低至前述第1閾值以下。 A capacitive moisture detecting device that detects a change in capacitance in response to a change in the ratio of moisture in a surrounding environment or a state, and includes a capacitive sensor having first and second electrodes arranged to face each other. And the capacitance varies depending on the ratio or state of moisture between the first electrode and the second electrode; the driving unit applies an alternating current signal to the capacitance sensor; and the determining unit is based on an output voltage from the capacitance sensor. The size is doubled and the detection signal of the on or off is outputted, and the determination unit has an input interface surface, and is a first resistance part and a capacitor part connected in series to each other and connected to the output side of the capacitance sensor. a duality unit connected to the output side of the input interface surface, and outputting a water freeze between the first electrode and the second electrode when an output voltage from the input interface surface is greater than a first threshold a frost-like frosting state detection signal as the detection signal; and a correction portion at the output from the capacitive sensor To reduce the pressure is greater than the first threshold value or less than the first threshold value of the second larger threshold value, from the output voltage of the input interface section. 如請求項1之電容式水分檢測裝置,其中前述電容感應器係連接於前述驅動部之輸出與接地線之間,前述判定部是藉由比較來自前述電容感應器之輸出電壓與預先設定之閾值,來進行前述二元化。 The capacitive moisture detecting device of claim 1, wherein the capacitance sensor is connected between an output of the driving portion and a ground line, wherein the determining portion compares an output voltage from the capacitance sensor with a preset threshold To perform the aforementioned binarization. 如請求項2之電容式水分檢測裝置,其中前述判定部在來自前述電容感應器之輸出電壓大於第1閾值時,輸出代表前述第1電極與前述第2電極間之水分凍結而變化為霜狀之結霜狀態檢測訊號作為前述檢測訊號,且在來自前述電容感應器之輸出電壓大於比前述第1閾值更大之第2閾值時,不輸出前述結霜狀態檢測訊號,以表示前述第1電極與前述第2電極間無水分而乾燥。 The capacitance type moisture detecting device according to claim 2, wherein the determination unit outputs a frost indicating that the moisture between the first electrode and the second electrode is frozen when the output voltage from the capacitance sensor is greater than a first threshold The frosting state detection signal is the detection signal, and when the output voltage from the capacitance sensor is greater than a second threshold greater than the first threshold, the frosting state detection signal is not outputted to indicate the first electrode It is dried without moisture between the second electrode. 如請求項1之電容式水分檢測裝置,其中前述電容感應器係連接於前述驅動部之輸出與前述判定部之輸入之間,前述判定部是藉由比較來自前述電容感應器之輸出電壓與預先設定之閾值,來進行前述二元化。 The capacitive moisture detecting device of claim 1, wherein the capacitance sensor is connected between an output of the driving portion and an input of the determining portion, wherein the determining portion compares an output voltage from the capacitance sensor with a predetermined The threshold is set to perform the aforementioned binarization. 如請求項4之電容式水分檢測裝置,其中前述判定部在來自前述電容感應器之輸出電壓小於第1閾值時,輸出代表前述第1電極與前述第2電極間之水分凍結而變化為霜狀之結霜狀態檢測訊號作為前述檢測訊號,且,在來自前述電容感應器之輸出電壓小於比前述第1閾值更小之第2閾值時,不輸出前述結霜狀態檢測訊號,以表示前述第1電極與前述第2電極間無水分而乾燥。 The capacitance type moisture detecting device according to claim 4, wherein the determination unit outputs a frost indicating that the water between the first electrode and the second electrode is frozen when the output voltage from the capacitance sensor is less than the first threshold. The frosting state detection signal is the detection signal, and when the output voltage from the capacitance sensor is smaller than a second threshold smaller than the first threshold, the frosting state detection signal is not outputted to indicate the first The electrode and the second electrode are dried without moisture. 如請求項2之電容式水分檢測裝置,其中前述驅動部具有:產生前述交流訊號之訊號產生部、及連接前述訊號產生部之輸出側之電阻零件。 The capacitive moisture detecting device according to claim 2, wherein the driving unit includes: a signal generating unit that generates the alternating current signal; and a resistance component that connects the output side of the signal generating unit. 如請求項1之電容式水分檢測裝置,其中前述二元化部包含:CMOS之第1NOT電路,係輸入來自前述輸入介面部之輸出電壓,藉由前述第1閾值進行前述二元化者;集成用之第2電容零件,係連接前述第1NOT電路之輸出側;CMOS之第2NOT電路,係輸入前述第2電容零件之端子電壓,並將輸入之電壓反轉輸出前述檢測訊號;反饋電阻,係連接於前述第2NOT電路之輸出側與前述第1NOT電路之輸入側間,以在前述二元化時賦予遲滯者。 The capacitive moisture detecting device according to claim 1, wherein the binarization unit includes: a first NOT circuit of the CMOS, wherein an output voltage from the input interface is input, and the binary is performed by the first threshold; and the integration is performed. The second capacitor component is connected to the output side of the first NOT circuit; the second NOT circuit of the CMOS inputs the terminal voltage of the second capacitor component, and the input voltage is inverted to output the detection signal; the feedback resistor is The output side of the second NOT circuit is connected to the input side of the first NOT circuit to provide a hysteresis during the binarization. 如請求項7之電容式水分檢測裝置,其中前述修正部具有:CMOS之第3NOT電路,係輸入來自前述電容感應器之輸出電壓,在輸入之電壓大於前述第2閾值時輸出成為L;及二極體,係逆向連接於前述第3NOT電路之輸出側與前述第1NOT電路之輸入側間。 The capacitance type moisture detecting device according to claim 7, wherein the correction unit includes: a third NOT circuit of the CMOS, wherein an output voltage from the capacitance sensor is input, and when the input voltage is greater than the second threshold, the output is L; and The pole body is connected in reverse between the output side of the third NOT circuit and the input side of the first NOT circuit. 如請求項1之電容式水分檢測裝置,其中前述電容感應器係安裝為前述第1電極與前述第2電極於基板之表面形成圖形,且前述第2電極接觸冷卻管之外周面之狀態,且可檢測是否有因前述冷卻管之冷卻効果所造成之大氣中之水分凍結而變化為霜狀之結霜狀態者。 The capacitive moisture detecting device according to claim 1, wherein the capacitance sensor is mounted such that the first electrode and the second electrode form a pattern on a surface of the substrate, and the second electrode contacts a peripheral surface of the cooling tube, and It is possible to detect whether or not there is a frosty state in which the moisture in the atmosphere due to the cooling effect of the cooling tube is frozen. 如請求項9之電容式水分檢測裝置,其中 前述第2電極於前述基板之表面形成長方形狀之圖形,前述第1電極係於前述第2電極之兩側與前述第2電極之間設有間隙之狀態下,且以相互靠近側之邊部間之距離比前述冷卻管之外徑更小之方式,在前述基板之表面形成長方形狀之圖形,前述電容感應器安裝於冷卻管,以使得水分之附著可遍佈在前述第2電極之一部分、前述第1電極之一部分、前述間隙、及前述冷卻管之外周面。 A capacitive moisture detecting device according to claim 9, wherein The second electrode has a rectangular pattern on the surface of the substrate, and the first electrode is in a state in which a gap is provided between both sides of the second electrode and the second electrode, and the side portions are close to each other. a rectangular pattern is formed on the surface of the substrate so that the distance between the two is smaller than the outer diameter of the cooling tube, and the capacitance sensor is attached to the cooling tube so that moisture adheres to one of the second electrodes. One of the first electrode, the gap, and the outer circumferential surface of the cooling tube. 如請求項1之電容式水分檢測裝置,其中,前述驅動部之輸出端子及前述判定部之輸入端子設於基板上,分別連接前述第1電極及前述第2電極之2個端子是相互接近地設於前述基板上,前述輸出端子、前述輸入端子、及前述2個端子,是藉由於前述基板上配線連接,而可選擇將電容感應器串聯或並聯連接前述驅動部之輸出端子及前述判定部之輸入端子。 The capacitive moisture detecting device according to claim 1, wherein an output terminal of the driving unit and an input terminal of the determining unit are provided on a substrate, and two terminals connecting the first electrode and the second electrode are adjacent to each other The output terminal, the input terminal, and the two terminals are connected to the output terminal of the driving unit and the determining unit by connecting the capacitive inductor in series or in parallel by the wiring connection on the substrate. Input terminal. 如請求項2或4之電容式水分檢測裝置,其中前述第1電極及前述第2電極是以相互平行之狀態、以適當之間隔隔開地埋沒於土中之2支電極棒,而前述電容感應器是檢測前述土中之水分之狀態。 The capacitive moisture detecting device according to claim 2 or 4, wherein the first electrode and the second electrode are two electrode rods which are buried in the soil at a proper interval in parallel with each other, and the capacitor The sensor is a state of detecting moisture in the aforementioned soil. 如請求項2或4之電容式水分檢測裝置,其中前述第1電極及前述第2電極是以相互平行之狀態、以適當之間隔 隔開地捲繞於容器之外周面,而前述電容感應器是檢測前述容器內之液體之液位。 The capacitive moisture detecting device according to claim 2 or 4, wherein the first electrode and the second electrode are in parallel with each other at an appropriate interval The outer circumference of the container is wound apart, and the capacitance sensor detects the liquid level of the liquid in the container. 如請求項2或4之電容式水分檢測裝置,其中前述第1電極及前述第2電極,是以夾著收容於容器內液體且互相呈相對向之狀態,捲繞該容器之外周面半周,而前述電容感應器是檢測前述容器內之液體之液位。 The capacitive moisture detecting device according to claim 2 or 4, wherein the first electrode and the second electrode are wound in a state of being opposed to each other while being in a state of being opposed to each other, and are wound around the outer circumference of the container for half a week. The aforementioned capacitive sensor is for detecting the liquid level of the liquid in the container. 一種冷凍機,係具有申請專利範圍第1項至第12項中任一項記載之電容式水分檢測裝置。 A refrigerator type moisture detecting device according to any one of claims 1 to 12.
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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106062545A (en) * 2014-02-27 2016-10-26 3M创新有限公司 Sub-ambient temperature vapor sensor and method of use
JP5931111B2 (en) 2014-03-31 2016-06-08 ミネベア株式会社 Detection device
KR102558042B1 (en) * 2015-05-14 2023-07-20 사아티 에스.피.에이. Intelligent filter structure for electrical appliances, especially for drying/wash-drying machines, a method for manufacturing a filter structure, and a method for detecting partial or total clogging of a filter structure and residual moisture value in real time to optimize the operating cycle of the product
TWM556069U (en) * 2017-07-05 2018-03-01 光寶科技股份有限公司 Lamp planting composite system
CN107402243A (en) * 2017-08-16 2017-11-28 济南大学 A kind of method of capacitance type sensor measurement plant water content
WO2019107165A1 (en) * 2017-11-30 2019-06-06 東レ株式会社 Circuit, detector, wireless communication device, moisture sensing system, diaper, notification system, and circuit manufacturing method
CN109901634A (en) * 2017-12-08 2019-06-18 光宝电子(广州)有限公司 Temperature-adjusting device and method
TWI645438B (en) * 2017-12-14 2018-12-21 廣泰隆實業有限公司 Automatic underwater starting device
DE102017222845A1 (en) 2017-12-15 2019-06-19 Robert Bosch Gmbh Sensor device for detecting electrically conductive media, method for operating the sensor device
KR102464233B1 (en) * 2018-11-09 2022-11-08 광둥 미디어 화이트 홈 어플라이언스 테크놀로지 이노베이션 센터 컴퍼니 리미티드 Movable powertrain
CN113226136B (en) * 2018-12-21 2023-08-11 易希提卫生与保健公司 Detect the fill status of the consumable dispenser
CN111854888B (en) * 2020-07-25 2021-07-02 珠海格力电器股份有限公司 Water level detection method and device, storage medium and kettle
CN114234538B (en) * 2021-12-20 2023-03-10 苏州热立方新能源有限公司 Frost layer recognition device, using method and probe automatic defrosting system
CN119985227B (en) * 2025-03-12 2025-11-14 天津大学 An adhesive force measurement device and method based on lever balance method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4523142A (en) * 1981-07-01 1985-06-11 Murata Manufacturing Co., Ltd. Apparatus for sensing dew and frost
CN1746743A (en) * 2004-09-07 2006-03-15 安捷伦科技有限公司 Using Multiple Light Sensors to Adjust Direct-On Backlighting for Displays
TW200741200A (en) * 2006-03-06 2007-11-01 Toplas Engineering Co Ltd Humidity sensor
TW201132974A (en) * 2010-03-26 2011-10-01 Ou Ji Sen Entpr Co Ltd Soil humidity sensing device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59166849A (en) * 1983-03-14 1984-09-20 Nippon Soken Inc Device for monitoring sticking condition of moisture
JPS62113054A (en) * 1985-11-12 1987-05-23 Zaou Seiki Kenkyusho:Kk Moisture measuring apparatus
JPS62179650A (en) * 1986-01-31 1987-08-06 Toyota Motor Corp Rain drop detector
JPH0443284U (en) * 1990-08-15 1992-04-13
JPH06180336A (en) * 1992-12-14 1994-06-28 Nippondenso Co Ltd Capacitance type physical quantity detecting device
JP3552997B2 (en) * 2000-07-04 2004-08-11 花王株式会社 Excretion detection device
EP1637875A1 (en) * 2004-09-17 2006-03-22 Fondazione Torino Wireless A multi-frequency capacitive measurement device and a method of operating the same
JP4794010B2 (en) * 2008-01-16 2011-10-12 三菱自動車工業株式会社 Touch sensor device, control method, touch panel device, and program
JP5078829B2 (en) * 2008-10-07 2012-11-21 三菱電機株式会社 refrigerator
CN201514223U (en) * 2009-09-23 2010-06-23 珠海格力电器股份有限公司 Frost detection device and heat pump type air conditioner
JP2011232050A (en) * 2010-04-23 2011-11-17 Asmo Co Ltd Water droplet detection device
JP5171987B2 (en) * 2011-04-28 2013-03-27 北斗電子工業株式会社 Frosting state detection device
CN202075261U (en) * 2011-04-29 2011-12-14 嘉应学院 Medium frequency type soil moisture sensor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4523142A (en) * 1981-07-01 1985-06-11 Murata Manufacturing Co., Ltd. Apparatus for sensing dew and frost
CN1746743A (en) * 2004-09-07 2006-03-15 安捷伦科技有限公司 Using Multiple Light Sensors to Adjust Direct-On Backlighting for Displays
TW200741200A (en) * 2006-03-06 2007-11-01 Toplas Engineering Co Ltd Humidity sensor
TW201132974A (en) * 2010-03-26 2011-10-01 Ou Ji Sen Entpr Co Ltd Soil humidity sensing device

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