TWI485360B - Apparatus and method for measuring through-pass twinning - Google Patents

Description

Apparatus and method for measuring through-pass twinning

The present invention relates to apparatus and methods for measuring through-thin twinned vias (TSVs), and more particularly to apparatus for measuring through-pass perforations or other similar perforated holes through an interferometric measurement using a digitally variable aperture. And related methods.

For a highly integrated semiconductor circuit, a fine line width has been achieved by exposure. However, the achievable line width is limited by the refractive limit.

In order to overcome this problem, a method using extreme ultraviolet light or other similar light having a wavelength shorter than visible light to reduce the refractive limit has been proposed, and a method of processing using a three-dimensional (3D) semiconductor package, in which many fully processed crystals are also proposed Circular wafers are stacked vertically to increase integration, and many methods have been proposed.

In a vertically stacked three-dimensional semiconductor package process in which many wafers are stacked, most of the individual wafer layer circuits must be electrically connected to form an electrical signal transmission and reception between a plurality of stacked wafer wafers. For the crystal For the electrical connection between the circular layers, a narrow hole called a "straight through-perforation" (hereinafter, referred to as a perforated hole) is formed in a wafer and filled with a conductive material to thereby connect The circuits of the wafer layers. In general, through-silicon via (TSV) processing can be achieved by deep etching or other similar means.

At the same time, the perforated holes must be formed to have the same depth and diameter on a wafer. If, depending on the diameter or depth, when the wafer wafer is stacked on another wafer wafer after grinding, some circuits may not be electrically connected, thereby causing a defective product. Therefore, in the three-dimensional semiconductor package process, an important procedure is to check whether the through-holes formed in the wafer have a predetermined depth and diameter.

As a method of measuring the through-twisting perforation to inspect the formation state of the through-twist perforation (that is, the perforation hole), there is a method of using an interferometer, and the wafer having the through-twisted perforation formed by cutting Part of it, and using a scanning electron microscope (SEM) to examine the wafer, as well as other methods.

Among these methods, among the methods using an interferometer, the most typical interferometer is a white light interferometer (WLI) in which light from a light source is split into two rays, so that the two rays are in a direction perpendicular to each other. Move and then combine together to form a majority of interference fringes based on the difference in optical path between the two rays.

However, the conventional method using the interferometer has a problem that if the lens that is irradiated toward the through-twisted perforation is a wide-angle lens, the incident angle of the light entering the through-twisted perforation will be greater than the through-pass.矽 The diameter of the crystal perforations, and thus the amount of light that substantially enters the through-twisted perforations, is such that it is very difficult or practically impossible to measure the through-twisted perforations.

Although the light source can be replaced to increase the intensity of light reaching the bottom of the through-twisted perforation, the light radiated toward the through-twisted perforation must be measured at most regular distances along the direction in which the through-twisted perforations are formed. Focus. Therefore, it takes a lot of time to measure the through-twisting perforations, and the amount of data formed is too large to cause a burden on the overall system.

Accordingly, some countermeasures for measuring the device for straight through twinning have been proposed to improve the accuracy of measuring the through-twisted perforation, but its development is still insufficient for urgent needs.

One aspect of the present invention provides an apparatus and method for measuring through-twisted vias (TSV) in which the formation state of the through-twist perforations (i.e., the perforated holes) can be accurately measured.

In fact, one aspect of the present invention provides an apparatus and method for measuring through-twisted perforations in which a digitally variable aperture is used to accurately measure the formation state of the through-twist perforations.

As such, one aspect of the present invention provides an apparatus and method for measuring through-twisted perforations that can have a simplified structure and enable more efficient and accurate measurements.

Moreover, one aspect of the present invention provides an apparatus and method for measuring through-twisted perforations that can improve the ease of measurement of the through-twist perforations and reduce the time taken for the measurement.

According to an embodiment of the invention, the apparatus for measuring the through-silicon via formed in a measuring object comprises: a light source, a digital variable aperture, a beam splitter and a detector, wherein the digit can be An aperture is provided on a path of light emitted from the light source, and an area illuminated by light emitted from the light source is adjusted according to an aspect ratio of the through-twist perforation; the beam splitter will pass through the digit The light of the variable aperture is separated into a plurality of rays which are respectively moved in a first direction and a second direction which are perpendicular to each other, and are reflected by the first reflection reflected from the measurement object arranged in the first direction The combined light is outputted in combination with the second reflected light reflected from one of the mirror bodies disposed in the second direction; and the detector measures the combined light according to the guided light from the optical splitter Through the through-hole perforation, the digital iris is used as an aperture, and the aperture size can be selectively changed according to the aspect ratio of the through-twist perforation without physical movement.

In a device for measuring the through-twist perforation, the digital variable aperture can be provided using a liquid crystal display (LCD).

The apparatus for measuring the through-twist perforation may further include a light quantity controller provided on a path of light split by the splitter and entering the mirror body, and selectively adjusting into the mirror The amount of light in the body.

In the apparatus for measuring the through-twist perforation, the light quantity controller can adjust the amount of light entering the lens body according to the aspect ratio of the through-twist perforation, wherein the measurement can be calculated from the measurement by using the following equation [1] The first reflected light equation reflected by the object [1]

The light quantity controller controls the amount of light entering the mirror body to be 0.5 to 2 times larger than the amount of light of the first reflected light.

In an apparatus for measuring the through-twist perforation, the light quantity controller can be provided using a liquid crystal display (LCD).

The apparatus for measuring the through-twist perforation may further include an optical system provided between the digital variable aperture and the optical splitter, and between the splitter and a detector At least one location.

According to an embodiment of the present invention, a method for measuring a through-twisted perforation formed in a measuring object, the method comprising: emitting light from a light source; using a digital variable aperture to be based on the through pass The aspect ratio of the crystal perforation is adjusted by the region illuminated by the light emitted by the light source; the light passing through the digital variable aperture is separated into a plurality of rays, which are respectively in a first direction perpendicular to each other and a second Moving in the direction and by combining the first reflected light reflected from the measuring object arranged in the first direction with the second reflected light reflected from one of the mirror bodies arranged in the second direction And outputting the combined light according to the combined light quantity, wherein the digital variable aperture is used as an aperture, and the aperture size thereof is selectively changed according to the aspect ratio of the through-twist perforation, and No physical movement is required.

10‧‧‧Light source

20‧‧‧Digital iris

22‧‧‧Light transmission area

30‧‧‧Auxiliary splitter

40‧‧‧First optical system

50‧‧ ‧ splitter

60‧‧‧Light quantity controller

70‧‧‧Mirror body

80‧‧‧Second optical system 80

90‧‧‧Detector

100‧‧‧Measurement objects

110‧‧‧through through crystal perforation

The above and/or other aspects of the present invention will be described in the following detailed description of the exemplary embodiments. 1 is a diagram showing an apparatus for measuring through-twisted through-hole (TSV) according to an embodiment of the present invention; and FIG. 2 is a diagram for illustrating a method according to an embodiment of the present invention; One of first reflected light (ie, sample light) and a second reflected light (reference light) in the apparatus for measuring the through-twist perforation; FIG. 3 is one of the embodiments according to the present invention Schematic for illustrating a digitally variable aperture in a device for measuring the through-twist perforation; FIG. 4 is a diagram illustrating a measurement in accordance with an embodiment of the present invention a light quantity controller in the device for through-twisting perforation; FIG. 5 is a diagram illustrating a calculation in a device for measuring the through-twist perforation according to an embodiment of the present invention A method of measuring the first reflected light reflected by the object; FIGS. 6 and 7 are diagrams illustrating the interference in the apparatus for measuring the through-twisted perforation according to an embodiment of the present invention Situation; and FIG. 8 is a diagram of a specific embodiment of the present invention for illustrating Apparatus for measuring the silicon through the perforations, measured through the silicon instance one perforation.

Hereinafter, most of the specific embodiments of the present invention will be described with reference to the accompanying drawings, but the invention is not limited thereto. In this description, details of functions or configurations that are known to the public for the sake of clarity are omitted.

1 is a diagram showing a display according to an embodiment of the present invention. Apparatus for measuring through-thin twinned vias (TSV); FIG. 2 is a diagram illustrating one of the first devices in the apparatus for measuring the through-twist perforation according to an embodiment of the present invention Reflected light (ie, sample light) and a second reflected light (reference light); FIG. 3 is a diagram illustrating a method for measuring the through-twisted perforation according to an embodiment of the present invention a digital variable aperture in the device; FIG. 4 is a diagram illustrating one of the light quantity controllers in the apparatus for measuring the through-twist perforation according to an embodiment of the present invention; A diagram for explaining a method of calculating the first reflected light reflected from a measuring object in an apparatus for measuring the through-twist perforation according to an embodiment of the present invention; FIG. 6 7 is a diagram for explaining an interference situation in an apparatus for measuring the through-twist perforation according to an embodiment of the present invention; and FIG. 8 is a diagram according to an embodiment of the present invention. For measuring the through-pass twin by means of a device for measuring the through-twisted perforation An example of a perforation.

Referring to FIG. 1, an apparatus for measuring the through-silicon via 110 in accordance with an embodiment of the present invention can be used to measure a three-dimensional semiconductor package processing having a plurality of measurement objects 100 (eg, wafers) vertically stacked. The through-silicone via 110 or similar perforated hole is accurately formed in the measuring object 100 as needed, and thus can be electrically connected to the measuring object 100, and the device includes a light source 10 and a digital position. The aperture 20, a beam splitter 50 and a detector 90 are provided.

The light source 10 can utilize various light sources 10 as needed and designed. For example, a light-emitting diode (LED) that emits white light can be used as the light source 10. Halogen bulbs or other similar forms of white light source can also be used as needed. It is the light source 10.

The digital variable aperture 20 is provided on a path of light emitted from the light source 10, and adjusts an area illuminated by light emitted from the light source 10. The area illuminated by the light passing through the digital variable aperture 20 may vary depending on the aspect ratio of the through-silicone via 110.

Here, the area illuminated by the light passing through the digital variable aperture 20 can be changed according to the aspect ratio of the through-silicone via 110, which can be adjusted by using the aspect ratio according to the through-twist hole 110. The range of the light of the digital variable aperture 20 (that is, the aperture size) is known. Similarly, in this embodiment of the invention, the aspect ratio of the through-silicon vias 110 means the ratio of the depth of the through-silicon vias 110 to the diameter of the through-silicon vias 110. According to the aspect ratio of the through-twisting via 110, the incident angle of the light entering the through-thinned via 110 can be calculated.

The digital variable aperture 20 can have various configurations in which an aperture value (i.e., size) can be changed without physical movement. For example, the digital variable aperture 20 can be provided using a liquid crystal display (LCD) and activates a light transmission region 22 having a change in size (diameter) according to the aspect ratio of the through-twist perforation 110 (corresponding to the aperture size ).

Therefore, the digital variable aperture 20 using the liquid crystal display can be used as an aperture obtained by activating the optical transmission area, and the size of the optical transmission area is changed by an electronic signal without depending on a motor or the like. The mechanism moves entities. Referring to FIG. 3, the digital variable aperture 20 can have different aperture values such as f/1.4, f/2, f/2.8, f/4, etc. according to the aspect ratio change of the through-twist perforation 110. That is, the light transmission area is straight path).

Similarly, the digital iris 20 can be varied to have a non-standard aperture value and the aforementioned standard aperture values. For example, the digital iris diaphragm 20 can be varied to have non-standard aperture values such as f/1.6, f/2.1, f/4.4, and the like. In the conventional mechanical aperture, the aperture can only be changed to have the existing aperture value, so that it is difficult to perform precise control, and it is difficult to have the optimum aperture value corresponding to various aspect ratios. In another aspect, in accordance with an embodiment of the present invention, the digital aperture diaphragm 20 is modified to have even such non-standard aperture values, thereby having an optimum aperture value corresponding to the different aspect ratios.

Further, in this embodiment of the invention, the shape of the aperture (that is, the shape of the light transmission region) is circular, but is not limited thereto. Alternatively, the light transmitting region may have a polygonal shape such as a quadrangle or other geometric shape.

For reference, light emitted from the light source 10 may pass through a light transmission region activated in the liquid crystal display, but is blocked in other barrier ranges of the liquid crystal display other than the light transmission region 22. Here, the activated light transmission region 22 may mean a range in which white light can pass directly, instead of representing any color in the liquid crystal display, and the blocking region may mean a range of light blocked files, such as The liquid crystal display is shown as a black range, so light does not pass through it.

Referring to Fig. 2, a beam splitter 50 is provided to split and output incident light passing through the digital variable aperture 20 into two rays which are moved in a first direction and a second direction which are perpendicular to each other. In addition, from the arrangement The first reflected light reflected by the measuring object 100 in one direction is combined with the second reflected light reflected from a mirror body 70 disposed in the second direction and output as combined light.

For reference, an auxiliary beam splitter 30 is provided between the digital iris 20 and the beam splitter 50 according to an embodiment of the present invention, and the auxiliary beam splitter in the direction toward the measuring object 100 is used. 30 changes an example of light passing through the digital variable aperture 20.

The measurement object 100 is disposed in the first direction, and the mirror body 70 is disposed in the second direction. The output light split by the beam splitter 50 can enter the measurement object 100 and the mirror body 70 and then be reflected again toward the beam splitter 50. For example, according to an embodiment of the invention, the measuring object 100 is placed in the first direction, and the mirror body 70 is placed in the second direction, but is not limited thereto. Alternatively, the mirror body can be placed in the first direction and the measuring object is placed in the second direction.

Similarly, an optical system can be provided at least one position between the digital iris 20 and the beam splitter 50 and between the beam splitter 50 and a detector 90 (described later). Further, the numerical aperture (NA) of the optical system can be appropriately adjusted according to the size of the digital variable aperture 20 (that is, the optical transmission region). A first optical system 40 is provided between the digital iris 20 and the beam splitter 50, and a second optical system is provided between the beam splitter 50 and the detector 90 (described later). An example of 80.

The first optical system 40 and the second optical system 80 can be configured in a manner that combines a plurality of general optical components, such as lenses for focusing incident light at a particular location. However, the present invention is not subject to the optical system Structure and characteristics are limited.

Similarly, a collimating lens, a filter or various similar optical elements may be provided on the path of light passing through the digital variable aperture 20 to maintain and change the light passing through the digital variable aperture 20 Characteristics. However, the invention is not limited by the features and characteristics of the optical system.

The detector 90 is provided to measure the through-twist hole 110 in accordance with the combined light directed from the beam splitter 50. A typical charge coupled device (CCD) camera can be used as the detector 90, and other detection devices can be used as needed and designed.

The detector 90 receives the combined light reflected from the mirror body 70 and the measuring object 100 and combined by the beam splitter 50, so that an interference signal can be formed. The interference signal obtained from the detector 90 can be analyzed by a predetermined analyzer, so that the through-silicone via 110 can be measured based on the interference signal.

Similarly, the apparatus for measuring the through-silicon via 110 in accordance with an embodiment of the present invention may further include a light amount controller 60 that is provided by the splitter 50 and enters the mirror. The path of the incident light of the body 70 selectively controls the amount of light entering the mirror body 70.

In order to establish an ideal according to the first reflected light (ie, sample light) reflected from the measuring object 100 and the second reflected light (ie, reference light) reflected from the mirror body 70. The interference signal must maintain the first reflected light and the second reflected light to have a similar amount of light to each other. The light amount controller 60 maintains the first reflected light and the second reflected light to have a similar amount of light to each other, thereby enabling a suitable interference signal to be generated.

That is, referring to FIG. 6, the first reflected light (that is, the sample light) reflected from the measured object has a comparison with the second reflected light (that is, the reference light). Low reflectivity. Therefore, the amount of light of the first reflected light is significantly smaller than the amount of light of the second reflected light. If the amount of light of the first reflected light is significantly smaller than the amount of light of the second reflected light (that is, the first reflected light is smaller than the second reflected light), it is difficult to distinguish between the first reflected light and the second reflected light. The constructive work between them involves destructive interference signals.

On the other hand, as shown in FIG. 7, if the amount of light of the first reflected light (that is, the sample light) is maintained to have a similarity with the amount of light of the second reflected light (that is, the reference light), It can be clearly discerned that the constructive interference between the first reflected light and the second reflected light involves a destructive interference signal.

Therefore, the light amount controller 60 maintains the first reflected light and the second reflected light to have a similar amount of light to each other, thereby generating a suitable interference signal. Preferably, the light quantity controller 60 can adjust the amount of light entering the mirror body 70 according to the aforementioned aspect ratio of the through-silicone via 110.

That is, the diameter (i.e., the aperture value) of the aforementioned light-transmitting region 22 can be changed according to the aspect ratio of the through-twisted through hole 110. Because the amount of light of the first reflected light varies in proportion to the diameter of the light transmitting region 22, it is preferable that the light amount controller 60 can control the entrance into the mirror according to the aspect ratio of the through-twisting through hole 110. The amount of light of 70. Referring to FIG. 4, the light quantity controller 60 can reduce the entering the mirror body 70 at a predetermined ratio (for example, 100:80, 100:60, and 100:40) according to the aspect ratio of the through-twisting through hole 110 (also That is, the light split by the spectroscope and entering the light of the mirror body) the amount.

As described above, the light amount controller 60 adjusts the amount of light entering the mirror body 70 according to the aspect ratio of the through-twisting through-hole 110, wherein the first reflected from the measuring object 100 can be calculated by the following equation [1] reflected light

Further, the light amount controller 60 can control the amount of light entering the mirror body 70 to have 0.5 to 2 times larger than the amount of light for calculating the first reflected light as above.

For reference, the amount of light transmitted by the first object lens (first optical system), the reflectivity of the sample (ie, the measuring object), and entering the object lens (ie, the first optical system) The amount of light can be calculated by the expression shown in Fig. 5.

In this embodiment of the invention, the amount of light is reduced only when light output from the beam splitter passes through the light amount controller, but is not limited thereto. Alternatively, the amount of light can be first controlled when the light output from the beam splitter passes through the light amount controller, and then assisted when light is reflected from the mirror body and passed again through the light amount controller.

The light quantity controller 60 can utilize various light quantity adjusters as long as the light quantity adjusters can control the amount of light entering the mirror body 70. The type and characteristics of the light amount controller 60 are not limited to this particular embodiment. For example, the light quantity adjuster 60 can be provided through a liquid crystal display (LCD). In this case, the light quantity adjuster 60 using the liquid crystal display can be adjusted by the liquid crystal display The amount of light passing through the light amount adjuster 60 is controlled by the manner in which the voltage applied by the indicator, or the manner in which certain pixels are turned off. Other methods of controlling the amount of light passing through the liquid crystal display can also be used as needed. Alternatively, a function filter (for example, a normal (ND) distribution filter) or a similar method having the ability to reduce the amount of light can be used to construct the light quantity adjuster 60, and most other optical elements can be used to construct the light quantity adjuster. 60.

Meanwhile, according to an embodiment of the present invention, the method of measuring the through-twisting through-hole 110, that is, measuring the through-twisted through-hole 110 formed in the measuring object 100, may include the following steps from the light source 10 Radiating light; using a digitally variable aperture 20, adjusting the area illuminated by the light emitted from the source 10 according to the aspect ratio of the through-pass perforation 110; separating the light passing through the digital aperture 20 Forming two rays that are respectively moved in a first direction and a second direction that are perpendicular to each other, and are arranged from the first reflected light reflected from the measuring object 100 disposed in the first direction The second reflected light reflected by the mirror body 70 in the second direction is combined to output the combined light; and the through-twisted through hole 110 is measured according to the combined light quantity. Here, the digital variable aperture 20 can be used as an aperture whose aperture size can be selectively changed according to the aspect ratio of the through-twisted via 110 without physical movement.

First, if the light source 10 emits light, the digital variable aperture 20 adjusts the area illuminated by the light emitted from the light source 10 in accordance with the aspect ratio of the through-twist perforation 110. As described above, the digital iris diaphragm 20 functions as the aperture, so that the aperture size changes according to the aspect ratio of the through-twist hole 110 without physical movement.

Then, the light passing through the digital variable aperture 20 is split into two rays by the beam splitter 50, which are moved in the first direction and the second direction perpendicular to each other, and will be in the beam splitter 50. The first reflected light reflected by the measuring object 100 disposed in the first direction and the second reflected light reflected by the mirror body 70 disposed in the second direction are combined again and output as the combined light .

Then, the detector 90 measures the through-silicon via 110 according to the combined light output from the beam splitter 50.

Meanwhile, according to an exemplary embodiment, the surface of the measuring object 100 and the through-twisting through-hole 110 may be continuously measured.

Referring to FIG. 8 , when the surface reference height of the measuring object 100 is equivalently measured, the digital variable aperture 20 can be set to a first setting condition S1, and when the through-twisting through hole 110 is equivalently measured, The digital variable aperture 20 is set to a second setting condition S2. For example, under the first setting condition S1, the complete area of the digital variable aperture 20 can be set as the light transmission area 22 without any blocking area. On the other hand, under the second setting condition S2, the size of the light transmission region 22 can be set in the digital variable aperture 20 according to the aspect ratio of a specific through-twisting via 110.

In addition, the focus can be preset before the incident light is focused on the bottom of the through-silicon via 110 (that is, when the through-silicon via 110 is first scanned) to measure the through-silicon via 110. The variable aperture 20 has an aperture characteristic corresponding to the through-twisted through hole 110 (that is, the size of the light transmission region 22), which is capable of continuously measuring the through-twist perforation 110 without changing the Any separation of the digital iris 20 setting Preparation time. If the through-silicone via 110 has a depth of 100 micrometers, and the focal length of the incident light entering the through-the-crystal via 110 reaches a depth of about 20 micrometers to 60 micrometers, the digital aperture 20 can be preset to have a corresponding The pass-through perforation 110 has an aspect ratio characteristic of one aperture.

According to an embodiment of the invention, an apparatus and method for measuring a through-twist perforation can accurately measure the formation state of the through-twist perforation (that is, the perforation hole).

In fact, in accordance with an embodiment of the present invention, a digitally variable aperture is used whereby the formation state of the through-twist perforations is measured more quickly and more accurately.

Similarly, according to an embodiment of the present invention, sufficient light can reach the inner bottom of the through-twisting perforation, and thus it is possible to avoid the unmeasurable condition caused by the insufficient amount of light inside the through-twisted perforation, and Perform more efficient and accurate measurements.

Moreover, in accordance with an embodiment of the present invention, the digital variable aperture is used so that the aperture size can be freely adjusted as desired without being limited by the aperture size.

Similarly, in accordance with an embodiment of the present invention, the digital iris diaphragm is used in place of an analog aperture using a motor or other similar mechanism, thereby simplifying the structure and allowing the aperture size to be adjusted more quickly and easily.

Moreover, in accordance with an embodiment of the present invention, there is no need to physically change the aperture according to the aspect ratio of the through-twist perforation, thereby providing an improved measurement convenience and a shorter time required for measurement.

Although some example embodiments of the invention have been shown and described, However, it will be understood by those skilled in the art that various modifications may be made in the specific embodiments without departing from the scope of the invention.

10‧‧‧Light source

20‧‧‧Digital iris

30‧‧‧Auxiliary splitter

40‧‧‧First optical system

50‧‧ ‧ splitter

60‧‧‧Light quantity controller

70‧‧‧Mirror body

80‧‧‧Second optical system

90‧‧‧Detector

100‧‧‧Measurement objects

Claims (10)

A device for measuring a through-silicon via (TSV) formed in a measuring object, the device comprising: a light source; a digital variable aperture provided by the light emitted from the light source And illuminating an area illuminated by light emitted from the light source according to an aspect ratio of the through-twist perforation; a beam splitter that passes light passing through the digital variable aperture Separating into a plurality of rays, respectively moving in a first direction and a second direction perpendicular to each other, and by arranging the first reflected light reflected from the measuring object disposed in the first direction The second reflected light reflected by one of the second directions is combined to output the combined light; and a detector that measures the combined light according to the guided light from the optical splitter Through the through-hole perforation, the digital iris is used as an aperture, and the aperture size can be selectively changed according to the aspect ratio of the through-twist perforation without physical movement. The device of claim 1, wherein the digital variable aperture is provided by a liquid crystal display (LCD). The device of claim 1, further comprising a light quantity controller, the light quantity controller being provided on a path of light split by the optical splitter and entering the mirror body, and selectively adjusting into the mirror body The amount of light. The device of claim 3, wherein the light quantity controller adjusts the amount of light entering the lens body according to the aspect ratio of the through-twist perforation (TSV), wherein the quantity can be calculated from the quantity using the following equation [1] Measuring the first reflected light reflected by the object The light quantity controller controls the amount of light entering the mirror body to be 0.5 to 2 times larger than the amount of light of the first reflected light. The device of claim 3, wherein the light quantity controller is provided using a liquid crystal display (LCD). The device of claim 1, further comprising an optical system, the optical system being provided between the digital variable aperture and the optical splitter, and at least one position between the optical splitter and a detector in. A method for measuring a through-silicon via (TSV) formed in a measuring object, the method comprising: emitting light from a light source; using a digital variable aperture to form a depth and width according to the through-twisting Comparing the area illuminated by the light emitted by the light source; separating the light passing through the digital variable aperture into a plurality of light rays, respectively moving in a first direction and a second direction perpendicular to each other, and By Outputting the combined light from a first reflected light reflected by the measuring object disposed in the first direction and a second reflected light reflected from a mirror body disposed in the second direction; And measuring the through-twisting perforation according to the combined light quantity, wherein the digital variable aperture is used as an aperture, and the aperture size can be selectively changed according to an aspect ratio of the through-twisted perforation without physical movement. The method of claim 7, further comprising using a light amount controller to adjust the amount of light entering the scope. The method of claim 8, wherein the light quantity controller adjusts the amount of light entering the lens body according to the aspect ratio of the through-twist perforation (TSV), wherein the quantity can be calculated from the quantity using the following equation [1] Measuring the first reflected light reflected by the object The light quantity controller controls the amount of light entering the mirror body to be 0.5 to 2 times larger than the amount of light of the first reflected light. The method of claim 8, wherein the digital variable aperture and the light quantity controller are provided by a liquid crystal display (LCD).