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TWI484664B - Method for spreading fluorescent particles - Google Patents

Method for spreading fluorescent particles Download PDF

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Publication number
TWI484664B
TWI484664B TW101133114A TW101133114A TWI484664B TW I484664 B TWI484664 B TW I484664B TW 101133114 A TW101133114 A TW 101133114A TW 101133114 A TW101133114 A TW 101133114A TW I484664 B TWI484664 B TW I484664B
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liquid
phosphor particles
light
coating
phosphor
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TW101133114A
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Chinese (zh)
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TW201411885A (en
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Chien Chung Huang
Chih Ming Wu
Yi Hsun Chen
Yu Hsiag Cheng
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Brightek Optoelectronic Co Ltd
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Description

螢光粉粒子之塗佈方法 Fluorescent powder coating method

本發明係有關於一種螢光粉塗佈方法,尤指一種發光元件之螢光粉粒子塗佈方法。 The present invention relates to a method for coating a phosphor powder, and more particularly to a method for coating a phosphor powder of a light-emitting element.

配合參閱第一圖,為習知之螢光粉塗佈方法之流程圖。首先,如步驟S100,提供一容器200(如第二圖所示),並於該容器200內注入一液體202,該液體202必須大於一預定高度。 Referring to the first figure, it is a flow chart of a conventional phosphor coating method. First, as in step S100, a container 200 (as shown in the second figure) is provided, and a liquid 202 is injected into the container 200, the liquid 202 having to be greater than a predetermined height.

之後,如步驟S102,設置一螢光粉204於該液體202中,並利用攪拌裝置(未圖示)以使該螢光粉204均勻地分佈於該液體202中。 Thereafter, in step S102, a phosphor powder 204 is disposed in the liquid 202, and a stirring device (not shown) is used to uniformly distribute the phosphor powder 204 in the liquid 202.

步驟S104,將設置有至少一發光晶粒206的基板208置入該液體202中,其中該基板208的高度必須小於該液體202之該預定高度。 Step S104, placing a substrate 208 provided with at least one illuminating die 206 into the liquid 202, wherein the height of the substrate 208 must be less than the predetermined height of the liquid 202.

步驟S106,待該螢光粉204沉降於發光晶粒206表面後,利用一液體排除裝置210移除該液體202(如第三圖所示);其中該液體排除裝置210可例如為排水管或小型抽水機。 Step S106, after the phosphor powder 204 settles on the surface of the light-emitting die 206, the liquid 202 is removed by a liquid removing device 210 (as shown in the third figure); wherein the liquid removing device 210 can be, for example, a drain pipe or Small pump.

然而,於排除該液體時202,該液體202會帶動部分沉降於該發光晶粒206表面的螢光粉204,如此一來,將使得位於該發光晶粒206上之螢光粉204的均勻度下降,導致由發光晶粒206發出並通 過螢光粉204的光線產生不均勻的情形。 However, when the liquid is removed 202, the liquid 202 will drive the phosphor powder 204 partially settled on the surface of the illuminating crystal grain 206, so that the uniformity of the phosphor powder 204 on the illuminating crystal grain 206 will be made. Falling, causing the light-emitting die 206 to pass through The light passing through the phosphor 204 produces unevenness.

鑒於先前技術所述,本發明之一目的,在於提供一種螢光粉粒子之塗佈方法。 In view of the prior art, it is an object of the present invention to provide a method of coating phosphor particles.

為達本發明之一目的,本發明提供一種螢光粉粒子之塗佈方法,該螢光粉粒子之塗佈方法係包含以下步驟:首先,將複數螢光粉粒子設置於一液體中,並使該等螢光粉粒子位於該液體表面;之後,將至少一發光元件與該液體及該等螢光粉粒子接觸,以使該液體及該等螢光粉粒子附著於該發光元件上。 In order to achieve the object of the present invention, the present invention provides a method for coating phosphor powder particles, the method for coating the phosphor powder particles comprising the steps of: firstly, setting a plurality of phosphor particles in a liquid, and The phosphor particles are placed on the surface of the liquid; and then at least one of the light-emitting elements is brought into contact with the liquid and the phosphor particles so that the liquid and the phosphor particles are attached to the light-emitting element.

綜合以上所述,本發明提供之螢光粉粒子塗佈製程可以使螢光粉粒子均勻地附著於發光元件上,藉以提高光色穩定度及光色的均勻度,進而提升產品產出及良率。 In summary, the phosphor powder coating process provided by the present invention can uniformly deposit the phosphor particles on the light-emitting element, thereby improving the light color stability and the uniformity of the light color, thereby improving product output and good quality. rate.

200‧‧‧容器 200‧‧‧ container

202、42‧‧‧液體 202, 42‧‧‧ liquid

204‧‧‧螢光粉 204‧‧‧Fluorescent powder

206‧‧‧發光晶粒 206‧‧‧Lighting grain

208、70‧‧‧基板 208, 70‧‧‧ substrate

40‧‧‧螢光粉粒子 40‧‧‧Fluorescent powder particles

50‧‧‧發光元件 50‧‧‧Lighting elements

60‧‧‧透光膜 60‧‧‧Transparent film

72‧‧‧電路層 72‧‧‧ circuit layer

80‧‧‧焊線 80‧‧‧welding line

S100~S106‧‧‧螢光粉塗佈流程 S100~S106‧‧‧Fluorescent powder coating process

S300~S306‧‧‧螢光粉粒子塗佈流程 S300~S306‧‧‧Flame powder coating process

第一圖為習知之螢光粉塗佈方法之流程圖。 The first figure is a flow chart of a conventional phosphor coating method.

第二圖及第三圖為對應第一圖之螢光粉塗佈方法之製作流程示意圖。 The second and third figures are schematic diagrams showing the manufacturing process of the phosphor powder coating method corresponding to the first figure.

第四圖為本發明之螢光粉粒子之塗佈方法之流程圖。 The fourth figure is a flow chart of the method for coating the phosphor particles of the present invention.

第五圖為本發明之螢光粉粒子之塗佈方法之一示意圖。 The fifth figure is a schematic view of a coating method of the phosphor powder particles of the present invention.

第六圖為利用第五圖所示之螢光粉粒子之塗佈方法製得之一具有螢光粉的發光元件。 Fig. 6 is a view showing a light-emitting element having a phosphor powder by a coating method of phosphor particles shown in Fig. 5.

第七圖為利用第五圖所示之螢光粉粒子之塗佈方法製得之另一具有螢光粉粒子的發光元件。 The seventh drawing is another light-emitting element having phosphor powder particles obtained by the coating method of the phosphor particles shown in FIG.

第八圖為為本發明之螢光粉粒子之塗佈方法之另一示意圖。 Fig. 8 is another schematic view showing a method of coating the phosphor particles of the present invention.

第九圖為利用第八圖所示之螢光粉粒子之塗佈方法製得之一具有螢光粉粒子的發光元件。 The ninth drawing shows a light-emitting element having phosphor particles as a method of coating the phosphor particles shown in the eighth embodiment.

第十圖為利用第八圖所示之螢光粉粒子之塗佈方法製得之另一具有螢光粉粒子的發光元件。 Fig. 10 is a view showing another light-emitting element having phosphor particles as obtained by the coating method of the phosphor particles shown in the eighth embodiment.

配合參閱第四圖,為本發明螢光粉粒子之塗佈方法之流程圖。該螢光粉粒子之塗佈方法主要用以使螢光粉粒子附著於發光元件上,該等螢光粉粒子係供與發光元件發出的部分光線發生波長轉換並產生一波長轉換光線。該發光元件可例如(但不限定於)發光二極體(light emitting diode,LED)晶粒。 Referring to the fourth figure, a flow chart of the method for coating the phosphor powder particles of the present invention is shown. The method for coating the phosphor particles is mainly for attaching the phosphor particles to the light-emitting elements, and the phosphor particles are wavelength-converted with a portion of the light emitted from the light-emitting elements to generate a wavelength-converted light. The light emitting element can be, for example, but not limited to, a light emitting diode (LED) die.

該螢光粉粒子之塗佈方法包含以下步驟: The coating method of the phosphor powder particles comprises the following steps:

步驟S300:將複數螢光粉粒子40設置於一液體42中,並使該等螢光粉粒子40位於該液體42的表面,如第五圖所示。該等螢光粉粒子40係不溶或難溶於該液體40中,該等螢光粉粒子40係通過液體42的表面張力及各該螢光粉粒子40分子間的凡德瓦力使具有一定厚度層懸浮於液體40表面如此一來,該等螢光粉粒子40就可以存在於該液體42中,並位在該液體42的表面。該液體42可以為純液體或混合液體,該液體42較佳地為不具黏滯性的液體,如:純水;或者,該液體42也可以為具有黏滯性的液體,如環氧樹脂(epoxy)或矽樹脂(silicone resin)。 Step S300: The plurality of phosphor particles 40 are placed in a liquid 42, and the phosphor particles 40 are placed on the surface of the liquid 42, as shown in FIG. The phosphor particles 40 are insoluble or poorly soluble in the liquid 40, and the phosphor particles 40 are fixed by the surface tension of the liquid 42 and the van der Waals force between the molecules of the phosphor particles 40. The thickness layer is suspended on the surface of the liquid 40 such that the phosphor particles 40 can be present in the liquid 42 and on the surface of the liquid 42. The liquid 42 may be a pure liquid or a mixed liquid, and the liquid 42 is preferably a non-viscous liquid such as pure water; or the liquid 42 may be a viscous liquid such as an epoxy resin ( Epoxy) or silicone resin.

步驟S302,將至少一發光元件50與該液體42及該等螢光粉粒子40接觸,以使該等螢光粉粒子40及該液體42附著於該發光元件50上 ,且較佳地,該等螢光粉粒子40及該液體42係附著於該發光元件50的光發射路徑上。 Step S302, contacting at least one light-emitting element 50 with the liquid 42 and the phosphor particles 40 to attach the phosphor particles 40 and the liquid 42 to the light-emitting element 50. Preferably, the phosphor particles 40 and the liquid 42 are attached to the light emission path of the light-emitting element 50.

如第五圖所示,為本發明之螢光粉塗佈方法之一示意圖。複數個發光元件50係設置於一透光膜60(如:藍膜)上,並經由擴晶製程以拉開相鄰二發光元件50之間的距離。隨後,將設置有該等發光元件50之該透光膜60a倒置,使該等發光元件50面對於液體42及該等螢光粉粒子40。之後,使該等發光元件50接觸該液體42及該等螢光粉粒子40,以使該等螢光粉粒子40及該液體42可以附著於該等發光元件50上。 As shown in the fifth figure, it is a schematic diagram of a method for coating a phosphor powder of the present invention. A plurality of light emitting elements 50 are disposed on a light transmissive film 60 (eg, a blue film) and are opened by a crystal expanding process to open a distance between adjacent two light emitting elements 50. Subsequently, the light-transmissive film 60a provided with the light-emitting elements 50 is inverted, and the light-emitting elements 50 face the liquid 42 and the phosphor particles 40. Thereafter, the light-emitting elements 50 are brought into contact with the liquid 42 and the phosphor particles 40 such that the phosphor particles 40 and the liquid 42 can adhere to the light-emitting elements 50.

當該液體42為不具黏滯性的液體時,則經由烘乾以移除該液體42,使該等螢光粉粒子40凝結於該等發光元件50上(步驟S304);而當該液體42為具黏滯性的液體時,則使該液體42固化,且該等螢光粉粒子40位於經固化的液體42中(步驟S306)。 When the liquid 42 is a non-viscous liquid, the liquid 42 is removed by drying to condense the phosphor particles 40 on the light-emitting elements 50 (step S304); and when the liquid 42 When it is a viscous liquid, the liquid 42 is solidified, and the phosphor particles 40 are located in the solidified liquid 42 (step S306).

最後,位於該等發光元件50上之螢光粉粒子40可如第六圖及第七圖所示,其中,第六圖及第七圖的差異主要在於該等螢光粉粒子40附著於該等發光元件50上的位置,造成此差異的因素在於該等發光元件50浸入該等螢光粉粒子40及該液體42中的深度不同。當該等發光元件50僅上表面接觸該等螢光粉粒子40及該液體42,則最後形成之螢光粉粒子40也僅附著於該等發光元件50的上表面;而當將該等發光元件50連同該透光膜60浸入該等螢光粉粒子40及該液體42中時,則最後形成之螢光粉粒子40則同時包覆該等發光元件50及該膜光膜60設置有該等發光源元件50之表面。 Finally, the phosphor particles 40 on the light-emitting elements 50 can be as shown in the sixth and seventh figures, wherein the difference between the sixth and seventh figures is mainly that the phosphor particles 40 are attached to the The position on the light-emitting element 50 causes a difference in the depth at which the light-emitting elements 50 are immersed in the phosphor particles 40 and the liquid 42. When only the upper surface of the light-emitting elements 50 contacts the phosphor particles 40 and the liquid 42, the finally formed phosphor particles 40 are only attached to the upper surface of the light-emitting elements 50; When the element 50 and the light-transmissive film 60 are immersed in the phosphor particles 40 and the liquid 42, the finally formed phosphor particles 40 simultaneously cover the light-emitting elements 50 and the film light film 60 is provided. The surface of the light source element 50 is equal.

在此要說明的是,設置於該透光膜60上之該等發光元件50也可以 在完成擴晶製程之前即先塗佈該等螢光粉粒子40,使該等螢光粉粒子40附著於該等發光元件50上,之後,再將完成螢光粉粒子塗佈後之發光元件50進行擴晶製程,而其完成圖係如第六圖所示。 It should be noted that the light-emitting elements 50 disposed on the transparent film 60 may also be The phosphor particles 40 are applied before the completion of the crystal expansion process, and the phosphor particles 40 are attached to the light-emitting elements 50, and then the light-emitting elements after the completion of the application of the phosphor particles are completed. 50 is used for the crystal expansion process, and the completed pattern is as shown in the sixth figure.

配合參閱第八圖,為本發明之螢光粉塗佈方法之另一示意圖。至少一發光元件50係通過固晶製程以設置於一基板60b上,該基板70上具有一電路層72,該發光元件50係通過至少一焊線80以與該電路層72形成電性連接。之後,使該發光元件50面對該等螢光粉粒子50,並將該發光元件50浸入該等螢光粉粒子40及該液體42中一預定高度,使該等螢光粉粒子40附著於該發光元件50上。 Referring to the eighth figure, another schematic diagram of the phosphor powder coating method of the present invention is shown. The at least one light-emitting element 50 is disposed on a substrate 60b by a die bonding process. The substrate 70 has a circuit layer 72. The light-emitting element 50 is electrically connected to the circuit layer 72 through at least one bonding wire 80. Thereafter, the light-emitting element 50 faces the phosphor particles 50, and the light-emitting element 50 is immersed in the phosphor particles 40 and the liquid 42 at a predetermined height, so that the phosphor particles 40 are attached to the phosphor particles 40. On the light-emitting element 50.

當該液體42為不具黏滯性的液體時,則經由烘乾以移除該液體42,使該等螢光粉粒子40凝結於該發光元件50上(步驟S304);而當該液體42為具黏滯性的液體時,則使該液體42固化,且該等螢光粉粒子40位於經固化的液體42中(步驟S306)。 When the liquid 42 is a non-viscous liquid, the liquid 42 is removed by drying to condense the phosphor particles 40 on the light-emitting element 50 (step S304); and when the liquid 42 is In the case of a viscous liquid, the liquid 42 is solidified and the phosphor particles 40 are located in the solidified liquid 42 (step S306).

其中,依據該發光元件50浸入該等螢光粉粒子40及該液體42中的深度不同,則附著於該等發光元件50上之該等螢光粉粒子40的型態也有所不同,可分別如第九圖及第十圖所示。於第九圖中,該等螢光粉40僅附著於該等發光元件50的上表面、該焊線80及該基板70的上表面;於第十圖中,該等螢光粉粒子40同時包覆該等發光元件50、該焊線80及該基板70。 However, depending on the depth at which the light-emitting element 50 is immersed in the phosphor particles 40 and the liquid 42, the types of the phosphor particles 40 adhering to the light-emitting elements 50 may be different. As shown in the ninth and tenth figures. In the ninth figure, the phosphors 40 are attached only to the upper surface of the light-emitting elements 50, the bonding wires 80, and the upper surface of the substrate 70. In the tenth figure, the phosphor particles 40 are simultaneously The light-emitting elements 50, the bonding wires 80, and the substrate 70 are covered.

綜合以上所述,本發明提供之螢光粉塗佈製程可以使螢光粉粒子40均勻地附著於發光元件50上,藉以提高光色穩定度及光色的均勻度,進而提升產品產出及良率。 In summary, the phosphor coating process provided by the present invention can uniformly deposit the phosphor particles 40 on the light-emitting element 50, thereby improving the light color stability and the uniformity of the light color, thereby improving product output and Yield.

然以上所述者,僅為本發明之較佳實施例,當不能限定本發明實 施之範圍,即凡依本發明申請專利範圍所作之均等變化與修飾等,皆應仍屬本發明之專利涵蓋範圍意圖保護之範疇。 However, the above description is only a preferred embodiment of the present invention, and the present invention cannot be limited. The scope of the application, that is, the equivalent changes and modifications of the scope of the patent application of the present invention, should remain within the scope of the patent protection scope of the present invention.

S300~S306‧‧‧螢光粉粒子塗佈流程 S300~S306‧‧‧Flame powder coating process

Claims (9)

一種螢光粉粒子之塗佈方法,包含:a)將複數螢光粉粒子設置於一液體中,並使該等螢光粉粒子懸浮於該液體表面,其中該等螢光粉粒子是藉由液體的表面張力及各該螢光粉粒子之分子間的凡德瓦力使具有一定厚度地懸浮於該液體表面;以及b)將至少一發光元件面對該液體及該等螢光粉粒子,並與該液體及該等螢光粉粒子接觸,以使該液體及該等螢光粉粒子附著於該發光元件上。 A method for coating phosphor particles, comprising: a) disposing a plurality of phosphor particles in a liquid, and suspending the phosphor particles on the surface of the liquid, wherein the phosphor particles are The surface tension of the liquid and the intrinsic van der Waals force of each of the phosphor particles are suspended in the liquid surface with a certain thickness; and b) the at least one illuminating element faces the liquid and the phosphor particles, And contacting the liquid and the phosphor particles to adhere the liquid and the phosphor particles to the light-emitting element. 如申請專利範圍第1項所述之螢光粉粒子之塗佈方法,其中該液體為具有黏滯性之液體。 The method of coating a phosphor powder according to claim 1, wherein the liquid is a viscous liquid. 如申請專利範圍第2項所述之螢光粉粒子之塗佈方法,於步驟b之後,更包含一步驟c:使該液體固化。 The method for coating phosphor particles according to claim 2, after step b, further comprises a step c: curing the liquid. 如申請專利範圍第1項所述之螢光粉粒子之塗佈方法,其中該液體為不具有黏滯性之液體。 The method of coating a phosphor powder according to claim 1, wherein the liquid is a liquid having no viscosity. 如申請專利範圍第4項所述之螢光粉粒子之塗佈方法,於步驟b之後,更包含一步驟d:移除該液體,使該等螢光粉粒子凝結並附著於該發光元件上。 The method for coating the phosphor particles according to claim 4, after step b, further comprising a step d: removing the liquid, causing the phosphor particles to coagulate and adhere to the light-emitting element. . 如申請專利範圍第1項所述之螢光粉粒子之塗佈方法,其中該等螢光粉粒子附著於該發光元件的上表面。 The method for coating phosphor particles according to claim 1, wherein the phosphor particles are attached to an upper surface of the light-emitting element. 如申請專利範圍第3項或第5項所述之螢光粉粒子之塗佈方法,其中該等螢光粉粒子包覆該發光元件。 The method for coating phosphor particles according to claim 3, wherein the phosphor particles coat the light-emitting element. 如申請專利範圍第1項所述之螢光粉粒子之塗佈方法,其中該等螢光粉粒子係不溶或難溶於該液體中。 The method for coating phosphor particles according to claim 1, wherein the phosphor particles are insoluble or poorly soluble in the liquid. 如申請專利範圍第1項所述之螢光粉粒子之塗佈方法,其中該液體為純液體或混合液體。 The method of coating a phosphor powder according to claim 1, wherein the liquid is a pure liquid or a mixed liquid.
TW101133114A 2012-09-11 2012-09-11 Method for spreading fluorescent particles TWI484664B (en)

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TWI613011B (en) * 2016-09-30 2018-02-01 漢邦普淨節能科技有限公司 Fluorescent powder coating device and coating method
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TW201121664A (en) * 2009-12-24 2011-07-01 Wei-Han Lee Method for coating fluorescence material and substrate manufactured by the same
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TW201236210A (en) * 2011-01-31 2012-09-01 Cree Inc Conformally coated light emitting devices and methods for providing the same

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