TWI484397B - Sputtered bridging structure for touch panel and method for the same - Google Patents

Description

Sputtered touch panel bridge structure and manufacturing method thereof

The invention relates to a touch panel, in particular to a sputter-type touch panel bridging structure.

Touch input methods of touch panels (Touch Panels) currently used in commercially available notebook computers, tablet computers, smart phones, and various liquid crystal display screens, including resistive, capacitive, optical, and electromagnetic induction Inductive and capacitive, wherein the resistive and capacitive type touches the surface of the panel with a finger or an inductive pen, and the capacitance value changes inside the panel subjected to the touched position, thereby detecting The position of the panel surface that is touched to achieve the purpose of touch sensing.

Moreover, the capacitive touch panel currently used includes a substrate on which a plurality of first sensing pads, a second sensing pad, a two-layer bridging line, and an insulating layer are formed. When the user touches the other surface of the substrate, the touched finger will be sensed by the first sensing pad and the second sensing pad to achieve the purpose of touch.

The plurality of first sensing pads, the second sensing pads, the two-layer bridge wires and the insulating layer on the touch panel are fabricated by using techniques such as printing, exposure, development, etching, etc., so that the first sensing pads are And the second sensing pad can be fabricated on the same surface of the substrate. However, when printing, exposure, development, etching, etc. are used to complete the touch panel, The working hours and procedures of the fee are numerous, and when the cross section of the casing of the substrate or the touch panel or the cross section of the edge of the casing is stepped or irregular, the technology is finished by printing, exposure, development, etching, etc. The method comprises the steps of: fabricating a plurality of first sensing pads, second sensing pads, two-layer bridging wires and an insulating layer of the touch panel.

Therefore, the main purpose of the present invention is to solve the conventional defect. The present invention utilizes sputtering and dispensing or coating to complete a plurality of first sensing pads, second sensing pads, and second-layer bridges on the touch panel. The manufacture of the wire and the insulating layer makes the touch panel easier to manufacture, and the plurality of first sensing pads and the second sensing pads on the touch panel can be sputtered and dispensed or coated. The two-layer bridge wire and the insulating layer are formed on the substrate or the cross section of the casing or the edge of the casing is stepped, flat or irregular.

In order to achieve the above object, the present invention provides a method for fabricating a sputter-type touch panel bridging structure, comprising: providing a substrate; forming a first electrode layer on the substrate by a first sputtering process, the first electrode The layer includes a plurality of first sensing pads, a second sensing pad, and a first bridge wire. The first bridge wires are electrically connected to the first sensing pads; and the dispensing process is performed on the first bridge wires. Forming a plurality of insulating mats, wherein the insulating mats form an insulating layer; and forming a plurality of second bridging lines on the insulating mats by a second sputtering process, the second bridging lines electrically connecting the plurality of a second sensing pad, and a second electrode layer is formed by the second bridge wires, and the insulating pads are used to isolate the first bridge wires and the first Electrical contact of the two bridge lines.

Wherein, the substrate is made of glass fiber, glass or plastic material which is transparent or opaque, and the substrate has a stepped shape, a flat shape or an irregular shape.

The first sensing pads and the second sensing pads are arranged in a staggered array.

The first electrode layer is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, and the anti-oxidation layer is a stainless steel material.

Wherein, the insulating layer is a white hot plastic.

Wherein, the insulating pad is semi-spherical or curved.

The second electrode layer is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, and the anti-oxidation layer is a stainless steel material.

In order to achieve the above object, the present invention further provides a sputter-type touch panel bridging structure, comprising: a substrate; a first electrode layer is disposed on the substrate, the first electrode layer includes a plurality of first The first pad is electrically connected to the first sensing pads; the insulating layer is composed of a plurality of insulating pads, and the insulating pads are disposed on the sensing pads, the second sensing pads, and the first bridge wires. The first bridge wire is formed by a semi-spherical ball or a curved arc; a second electrode layer is composed of a plurality of second bridge wires and is disposed on the insulating pads, and the second bridge wire is electrically connected to the second sensing pads. The insulating pads are used to isolate electrical contact between the first bridging lines and the second bridging lines.

Wherein, the substrate is made of glass fiber, glass or plastic material which is transparent or opaque, and the substrate has a stepped shape, a flat shape or an irregular shape.

The first sensing pads and the second sensing pads are arranged in a staggered array.

The first electrode layer is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, and the anti-oxidation layer is a stainless steel material.

Wherein, the insulating layer is a white hot plastic.

The second electrode layer is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, and the anti-oxidation layer is a stainless steel material.

In order to achieve the above object, the present invention further provides a method for fabricating a sputter-type touch panel bridging structure, comprising: preparing a substrate; forming a first electrode layer on the substrate by a first sputtering process, the first The electrode layer includes a plurality of first sensing pads, a second sensing pad, and a first bridge wire. The first bridge wires are electrically connected to the first sensing pads; Forming a plurality of insulating strips on the sensing pads and the first bridge wires, and forming an insulating layer by using the insulating strips; and forming a plurality of second bridging lines on the insulating strips by a second sputtering process, The second bridge wires are electrically connected to the second sensing pads, and the second bridge wires are formed into a second electrode layer, and the insulating wires are used to isolate the first bridge wires and the second wires. Electrical contact of the bridge line.

Wherein, the substrate is made of glass fiber, glass or plastic which is transparent or opaque. The substrate has a stepped shape, a flat shape or an irregular shape.

The first sensing pads and the second sensing pads are arranged in a staggered array.

The first electrode layer is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, and the anti-oxidation layer is a stainless steel material.

Wherein, the insulating layer is a white hot plastic.

The second electrode layer is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, and the anti-oxidation layer is a stainless steel material.

In order to achieve the above object, the present invention further provides a sputter-type touch panel bridging structure, comprising: a substrate; a first electrode layer is disposed on the substrate, the first electrode layer includes a plurality of first a sensing pad, a second sensing pad and a first bridge wire, the first bridge wire is electrically connected to the first sensing pads; an insulating layer is composed of a plurality of insulating strips, wherein the insulating strips are disposed on the a first sensing pad and the first bridge wires; a second electrode layer is formed by the plurality of second bridge wires and disposed on the insulating strips, wherein the second bridge wires are electrically connected to the second sensing lines The pads are electrically insulated from the second bridge wires by the insulating pads to isolate electrical contact between the first bridge wires.

Wherein, the substrate is made of glass fiber, glass or plastic material which is transparent or opaque, and the substrate has a stepped shape, a flat shape or an irregular shape.

The first sensing pads and the second sensing pads are arranged in a staggered array.

The first electrode layer is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, and the anti-oxidation layer is a stainless steel material.

Wherein, the insulating layer is a white hot plastic.

The second electrode layer is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, and the anti-oxidation layer is a stainless steel material.

100~106‧‧‧Steps

200~206‧‧‧Steps

1‧‧‧Substrate

2‧‧‧First electrode layer

21‧‧‧First sensing pad

22‧‧‧Second sensing pad

23‧‧‧First bridge line

3, 3a‧‧‧ insulation

31‧‧‧Insulation mat

31a‧‧‧Insulation strip

4‧‧‧Second electrode layer

41‧‧‧Second bridge line

The first figure is a schematic diagram of the manufacturing process of the touch panel bridge of the present invention.

The second figure is a schematic diagram of the structure of the touch panel bridge of the first figure.

The third figure is a schematic cross-sectional view of the second figure at position 3-3.

The fourth figure is a schematic diagram of the manufacturing process of another touch panel bridge structure of the present invention.

The fifth figure is a schematic diagram of the structure of the touch panel bridge of the fourth figure.

Figure 6 is a cross-sectional view of the fifth figure at 6-6.

The technical content and detailed description of the present invention are as follows: Referring to the first and second figures, the manufacturing process of the touch panel bridging structure of the present invention and the schematic structure of the touch panel bridging structure of the first figure are shown. As shown in the figure, in the method for fabricating a sputter-type touch panel bridging structure of the present invention, first, in step 100, a substrate 1 is provided, which is made of glass fiber, glass or plastic material which is transparent or opaque. The substrate 1 is formed, and the substrate (or the casing) 1 has a stepped shape, a flat shape, or an irregular shape.

Step 102, sputtering a metal material on the substrate 1 by using a first sputtering process, A first electrode layer 2 is formed after the first sputtering, and the first electrode layer 2 includes a plurality of first sensing pads 21, a second sensing pad 22, and a first bridge line 23. The first sensing pads 21 and the second sensing pads 22 are arranged in a staggered array, and the first sensing pads 21 are electrically connected to the first sensing pads 21 along the X-axis. The first electrode layer 2 is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, and the oxidation resistant layer is a stainless steel material.

Step 104, after the sputtering of the first electrode layer 2 is completed, a white thermal plastic is spotted on the first bridge wires 23 by a dispensing process to form a plurality of insulating pads 31, and the insulating pads 31 form an insulating layer. 3. In the figure, the insulating mat 31 is semi-spherical or curved.

Step 106, after the dispensing process is completed, the second sputtering process sputters the metal material on the insulating pads 31 to form a plurality of second bridge wires 41, and the second bridge wires 41 are electrically along the Y-axis. Connecting the second sensing pads 22, and forming a second electrode layer 4 by the second bridge wires 41, and insulating the first bridge wires 23 and the second bridge wires with the insulating pads 31. 41 electrical contact. The second electrode layer 4 is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, and the oxidation resistant layer is a stainless steel material.

Please refer to the second and third figures, which are schematic cross-sectional views of the touch panel bridging structure and the second drawing of the present invention at positions 3-3. As shown in the figure, the sputter-type touch panel bridging structure of the present invention comprises: a substrate 1, a first electrode layer 2, an insulating layer 3 and a second electrode layer 4.

The substrate 1 is a substrate 1 made of glass fiber, glass or plastic material which is transparent or opaque, and the substrate (or the casing) 1 has a stepped shape, a flat shape or no Regular form.

The first electrode layer 2 is sputtered on the substrate 1 by a sputtering process. The first electrode layer 2 after sputtering includes a plurality of first sensing pads 21 and second sensing pads 22 . And the first bridge line 23. The first sensing pads 21 and the second sensing pads 22 are arranged in a staggered array, and the first sensing pads 21 are electrically connected to the first sensing pads 21 along the X-axis.

The insulating layer 3 is formed by applying a white thermoplastic to the first bridge wires 23 through a dispensing process to form a plurality of semi-spherical balls or curved insulating pads 31.

The second electrode layer 4 is sputtered on the insulating pads 31 to form a second bridge line 41. The second bridge line 41 is electrically connected to the second bridge lines along the Y-axis. The sensing pads 22 are electrically insulated from the electrical connection between the first bridge wires 23 and the second bridge wires 41.

Since the first electrode layer 2, the second electrode layer 4, and the insulating layer 3 are sputtered and dispensed, the touch panel is easier to manufacture, and the manufacturing cost is greatly reduced. In particular, when the cross section of the substrate 1 or the casing is stepped, the metal material and the colloid cannot be fabricated on the substrate 1 or the casing to form the first electrode layer 2, and the second by the techniques of printing, exposure, development, etching, or the like. The electrode layer 4 and the insulating layer 3 must be fabricated by a sputtering and dispensing process.

Please refer to the fourth and fifth figures, which are another schematic diagram of the manufacturing process of the touch panel bridge structure of the present invention and the structure of the touch panel bridge of the fourth figure. As shown in the figure, in the method for manufacturing a sputter-type touch panel bridging structure of the present invention, first, in step 200, a substrate 1 is provided, which is a glass fiber, glass or plastic which is transparent or opaque. a substrate 1 made of a material, and the substrate (or the casing) 1 has a stepped shape, a flat shape, or Irregular.

Step 202, sputtering a metal material on the substrate 1 by a first sputtering process, and forming a first electrode layer 2 after the first sputtering, the first electrode layer 2 includes a plurality of first senses The pad 21, the second sensing pad 22 and the first bridge wire 23. The first sensing pads 21 and the second sensing pads 22 are arranged in a staggered array, and the first sensing pads 21 are electrically connected to the first sensing pads 21 along the X-axis. The first electrode layer 2 is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, and the oxidation resistant layer is a stainless steel material.

Step 204, after the sputtering of the first electrode layer 2 is completed, the white thermoplastic is drawn into strips by a glue coating process to form a plurality of the first sensing pads 21 and the first bridge wires 23. The insulating strip 31a is composed of the insulating strips 31a to form an insulating layer 3a.

Step 206, after the gluing process is completed, the second sputtering process sputters the metal material on the insulating strips 31a to form a plurality of second bridging lines 41, and the second bridging lines 41 are electrically along the Y-axis. Connecting the second sensing pads 22, and forming a second electrode layer 4 by the second bridge wires 41, and insulating the first bridge wires 23 and the second bridge wires with the insulating pads 31. 41 electrical contact. The second electrode layer 4 is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, and the oxidation resistant layer is a stainless steel material.

Please refer to the fifth and sixth figures, which are schematic cross-sectional views of the touch panel bridging structure of the present invention and the fifth figure at positions 6-6. As shown in the figure, the sputter-type touch panel bridging structure of the present invention comprises: a substrate 1, a first electrode layer 2, an insulating layer 3 and a second electrode layer 4.

The substrate 1 is made of glass fiber, glass or plastic material which is transparent or opaque. The substrate 1 is formed, and the substrate (or the casing) 1 has a stepped shape, a flat shape, or an irregular shape.

The first electrode layer 2 is sputtered on the substrate 1 by a sputtering process. The first electrode layer 2 after sputtering includes a plurality of first sensing pads 21 and second sensing pads 22 . And the first bridge line 23. The first sensing pads 21 and the second sensing pads 22 are arranged in a staggered array, and the first sensing pads 21 are electrically connected to the first sensing pads 21 along the X-axis.

The insulating layer 3 is composed of a plurality of insulating strips 13a. The insulating strips 31a are disposed on the first sensing pads 21 and the first bridge wires 23.

The second electrode layer 4 is sputtered with a metal material on the insulating strips 31a to form a second bridge wire 41. The second bridge wire 41 is electrically connected to the second sense along the Y-axis. The pads 22 are electrically insulated from the electrical connection between the first bridge wires 23 and the second bridge wires 41.

Since the first electrode layer 2, the second electrode layer 4, and the insulating layer 3 are sputtered and dispensed, the touch panel is easier to manufacture, and the manufacturing cost is greatly reduced. In particular, when the cross section of the substrate 1 or the casing is stepped, the metal material may not be formed on the substrate 1 or the casing by the techniques of printing, exposure, development, etching, etc. to form the first electrode layer 2 and the second electrode layer. 4 and the insulating layer 3 must be made by sputtering and dispensing processes.

The above are only the preferred embodiments of the present invention and are not intended to limit the scope of the present invention. That is, the equivalent changes and modifications made by the scope of the patent application of the present invention are covered by the scope of the invention.

100~106‧‧‧Steps

Claims (21)

A method for fabricating a sputter-type touch panel bridging structure comprises: a) preparing a substrate; b) forming a first electrode layer on the substrate by a first sputtering process, the first electrode layer comprising a plurality of first sensing pads, a second sensing pad, and a first bridge wire, wherein the first bridge wires are electrically connected to the first sensing pads; c), and the dispensing process is performed on the first bridge wires Forming a plurality of insulating mats, wherein the insulating mats form an insulating layer; and d) forming a plurality of second bridging lines on the insulating mats by a second sputtering process, the second bridging lines being electrically connected The second sensing pads comprise a second electrode layer with the second bridge wires, and the insulating pads are used to isolate electrical contact between the first bridge wires and the second bridge wires. The method for manufacturing a touch panel bridging structure according to the first aspect of the invention, wherein the substrate is a glass fiber, a glass or a plastic material that is transparent or opaque, and the substrate has a stepped shape and a flat shape. Or irregular. The method for fabricating a touch panel bridging structure according to claim 2, wherein the first sensing pads and the second sensing pads are arranged in a staggered array. The method for fabricating a touch panel bridging structure according to claim 3, wherein the first electrode layer is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, wherein the anti-oxidation layer is stainless steel material. The method for fabricating a touch panel bridging structure according to claim 4, wherein the insulating layer is a white hot plastic. The method for manufacturing a touch panel bridging structure according to claim 5, wherein the insulating pad is semi-spherical or curved. The method for fabricating a touch panel bridging structure according to claim 6, wherein the second electrode layer is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, wherein the anti-oxidation layer is stainless steel material. A sputter-type touch panel bridging structure includes: a substrate; a first electrode layer is disposed on the substrate, the first electrode layer includes a plurality of first sensing pads, second sensing pads, and a first bridge line electrically connected to the first sensing pads, the first electrode layer being composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer; an insulating layer, The utility model is composed of a plurality of insulating pads, wherein the insulating pads are disposed on the first bridge wires to form a semi-spherical ball or a curved arc shape; and a second electrode layer is formed by the plurality of second bridge wires and disposed on the insulating pads, The second bridge wire is electrically connected to the second sensing pads, and the insulating pads are used to isolate electrical contact between the first bridge wires and the second bridge wires, and the second electrode layer is made of a copper metal And forming an anti-oxidation layer covering the copper metal layer; wherein the first sensing pads and the second sensing pads are arranged in a staggered array. The touch panel bridging structure according to claim 8, wherein the substrate is made of glass fiber, glass or plastic which is transparent or opaque, and the substrate has a stepped shape, a flat shape or no Regular form. The touch panel bridging structure of claim 9, wherein the first electrode layer is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, the anti-oxidation layer is a stainless steel material. . The touch panel bridging structure according to claim 10, wherein the insulation The layer is white hot plastic. A method for fabricating a sputter-type touch panel bridging structure comprises: a) preparing a substrate; b) forming a first electrode layer on the substrate by a first sputtering process, the first electrode layer comprising a plurality of first sensing pads, a second sensing pad, and a first bridge wire, wherein the first bridge wires are electrically connected to the first sensing pads; c), the coating process is spanned to the first senses Forming a plurality of insulating strips on the measuring pads and the first bridge wires, and forming an insulating layer by using the insulating strips; and d) forming a plurality of second bridging lines on the insulating strips by a second sputtering process The second bridge wires are electrically connected to the second sensing pads, and the second bridge wires form a second electrode layer, and the insulating wires are used to isolate the first bridge wires and the Electrical contact of the second bridge line. The method for manufacturing a touch panel bridging structure according to claim 12, wherein the substrate is a glass fiber, a glass or a plastic material that is transparent or opaque, and the substrate has a stepped shape and a flat shape. Or irregular. The method for fabricating a touch panel bridging structure according to claim 13 , wherein the first sensing pads and the second sensing pads are arranged in a staggered array. The method for fabricating a touch panel bridging structure according to claim 14, wherein the first electrode layer is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, wherein the anti-oxidation layer is stainless steel material. The method for fabricating a touch panel bridging structure according to claim 15, wherein the insulating layer is a white hot plastic. The method for fabricating a touch panel bridging structure according to claim 16, wherein the second electrode layer is composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer, wherein the anti-oxidation layer is stainless steel material. A sputter-type touch panel bridging structure includes: a substrate; a first electrode layer is disposed on the substrate, the first electrode layer includes a plurality of first sensing pads, second sensing pads, and a first bridge line electrically connected to the first sensing pads, the first electrode layer being composed of a copper metal layer and an anti-oxidation layer covering the copper metal layer; an insulating layer, The utility model is composed of a plurality of insulating strips disposed on the first sensing pads and the first bridge wires; a second electrode layer is composed of a plurality of second bridge wires and disposed on the insulating strips The second bridge wire is electrically connected to the second sensing pads, and the insulating strips are used to isolate electrical contact between the first bridge wires and the second bridge wires. The second electrode layer is separated by a The copper metal layer and the anti-oxidation layer covering the copper metal layer are formed; wherein the first sensing pads and the second sensing pads are arranged in a staggered array. The touch panel bridging structure according to claim 18, wherein the substrate is a glass fiber, glass or plastic material that is transparent or opaque, and the substrate has a stepped shape, a flat shape or no Regular form. The touch panel bridging structure according to claim 19, wherein the anti-oxidation layer is made of stainless steel. The touch panel bridging structure according to claim 20, wherein the insulating layer is a white hot plastic.