TWI482163B - Method and apparatus of changing device identification codes of a memory integrated circuit device - Google Patents
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Description
本技術係關於一積體電路裝置的可程式化識別碼。 This technology relates to a programmable identification code for an integrated circuit device.
每一個記憶裝置具有一識別碼以代表一記憶體的型態、密度、製造商、或甚至其他需要被系統了解的重要參數。通常而言,這些識別碼是由反熔絲所儲存而且是不可改變的。假如此記憶裝置由另一供應者或是其他型態所取代的話,此系統或是控制器或許會因為期待被取代之舊記憶體的識別碼而造成失效。如此會對使用另一個不同的供應者及/或其他型態來取代目前的記憶體產生障礙。舉例而言,將系統或是控制器更新其硬體或是軟體使其具有新的識別能力是一件非常耗費金錢和時間的事。 Each memory device has an identification code to represent the type, density, manufacturer, or even other important parameters that need to be understood by the system. In general, these identification codes are stored by the anti-fuse and are immutable. If the memory device is replaced by another provider or other type, the system or controller may fail due to the identification of the old memory that is expected to be replaced. This creates an obstacle to using another different provider and/or other types to replace the current memory. For example, it is very costly and time consuming to update a system or controller to its hardware or software to have new recognition capabilities.
本技術係揭露一種積體電路記憶裝置。此積體電路記憶裝置包含一積體電路基板、複數個應用記憶胞於該積體電路基板上、複數個裝置識別非揮發記憶胞於該積體電路基板上、複數個裝置識別選擇非揮發記憶胞於該積體電路基板上以及控制電路。 The present technology discloses an integrated circuit memory device. The integrated circuit memory device includes an integrated circuit substrate, a plurality of application memory cells on the integrated circuit substrate, a plurality of devices identifying non-volatile memory cells on the integrated circuit substrate, and a plurality of devices identifying non-volatile memory. The cell is on the integrated circuit substrate and the control circuit.
此控制電路,其(i)進行該複數個識別非揮發記憶胞之複數個裝置識別碼的操作,該複數個裝置識別碼包括複數個識別該積體電路記憶裝置型態的位元,(ii)進行該複數個識別選擇非揮發記憶胞之選擇資料的程式化、抹除及讀取操作,該選擇資料自該複數個裝置識別碼中作出區別。 The control circuit (i) performing the plurality of operations of identifying a plurality of device identification codes of the non-volatile memory cells, the plurality of device identification codes including a plurality of bits identifying the memory device type of the integrated circuit, (ii) Performing a plurality of stylization, erasing, and reading operations for identifying selection data of the non-volatile memory cells, the selection data being distinguished from the plurality of device identification codes.
在一實施例中,該控制電路,響應一裝置識別碼讀取指令,而自該複數個識別非揮發記憶胞讀取一裝置識別碼,該裝置識別碼藉由該數個識別選擇非揮發記憶胞之該選擇資料自該複數個識別非揮發記憶胞中的其他裝置識別碼作出區別。 In one embodiment, the control circuit reads a device identification code from the plurality of identified non-volatile memory cells in response to a device identification code reading command, and the device identification code selects non-volatile memory by the plurality of identifications. The selection data of the cells is distinguished from the other device identification codes in the plurality of non-volatile memory cells.
在一實施例中,該積體電路記憶裝置的型態藉由該複數個裝置識別碼的一裝置識別碼分辨,該複數個裝置識別碼包括該積體電路記憶裝置的一製造商識別碼。 In one embodiment, the type of the integrated circuit memory device is resolved by a device identification code of the plurality of device identification codes, the plurality of device identification codes including a manufacturer identification code of the integrated circuit memory device.
在一實施例中,該積體電路記憶裝置的型態藉由該複數個裝置識別碼的一裝置識別碼分辨,該複數個裝置識別碼包括該積體電路記憶裝置的製造資料。 In one embodiment, the type of the integrated circuit memory device is resolved by a device identification code of the plurality of device identification codes, the plurality of device identification codes including manufacturing data of the integrated circuit memory device.
在一實施例中,該積體電路記憶裝置的型態藉由該複數個裝置識別碼的一裝置識別碼分辨,該複數個裝置識別碼包括該積體電路記憶裝置的產品規格資料。 In one embodiment, the type of the integrated circuit memory device is resolved by a device identification code of the plurality of device identification codes, the plurality of device identification codes including product specification data of the integrated circuit memory device.
本技術之另一目的為提供一種於一應用中取代一積體電路記憶裝置的方法,包含:提供一個組態為與具有一第一記憶裝置識別碼的一第一積體電路記憶裝置型態相容的系統;提供一個不具有第一記憶裝置識別碼的第二積體電路記憶裝置型態;組態該第二積體電路記憶裝置型態具有該至少部分的該第一記憶裝置識別碼;以及將該第二積體電路記憶裝置型態與該系統整合。 Another object of the present technology is to provide a method for replacing an integrated circuit memory device in an application, comprising: providing a first integrated circuit memory device configuration configured to have a first memory device identification code a compatible system; providing a second integrated circuit memory device type having no first memory device identification code; configuring the second integrated circuit memory device type having the at least portion of the first memory device identification code And integrating the second integrated circuit memory device type with the system.
在一實施例中,該組態包括:程式化該第二積體電路記憶裝置型態中的複數個裝置識別非揮發記憶胞具有該至少部分的該第一記憶裝置識別碼,如此讀取該第二積體電路記憶裝置型態中的裝置識別碼操作時,自該複數個裝置識別非揮發記憶胞讀取該至少部分的該第一記憶裝置識別碼。 In one embodiment, the configuring includes: programming a plurality of devices in the second integrated circuit memory device type to identify the non-volatile memory cell having the at least portion of the first memory device identification code, and thus reading the When the device identification code in the second integrated circuit memory device mode is operated, the at least part of the first memory device identification code is read from the plurality of devices identifying the non-volatile memory cells.
在一實施例中,該組態包括:程式化該第二積體電路記憶裝置型態中的複數個裝置識別選擇非揮發記憶胞具有選擇資料以自該第二積體電路記憶裝置型態中的複數個記憶裝置識別碼內區分出該至少部分的該第一記憶裝置識別碼,如此讀取該第二積體電路記憶裝置型態中的裝置識別碼操作時,自該複數個裝置識別非揮發記憶胞讀取該至少部分的該第一記憶裝置識別碼。 In one embodiment, the configuring includes: staging the plurality of devices in the second integrated circuit memory device type to identify the non-volatile memory cells having the selected data from the second integrated circuit memory device type The at least part of the first memory device identification code is distinguished by the plurality of memory device identification codes, and when the device identification code operation in the second integrated circuit memory device type is read, the plurality of devices are identified from the plurality of devices The volatilized memory cell reads the at least a portion of the first memory device identification code.
在一實施例中,該組態包括:程式化該第二積體電路記憶裝置型態中的複數個裝置識別非揮發記憶胞具有該至少部分的該第一記憶裝置識別碼,如此讀取該第二積體電路記憶裝置型態中的裝置識別碼操作時,自該複數個裝置識別非揮發記憶胞回應該至少部分的該第一記憶裝置識別碼至該系統。 In one embodiment, the configuring includes: programming a plurality of devices in the second integrated circuit memory device type to identify the non-volatile memory cell having the at least portion of the first memory device identification code, and thus reading the When the device identification code in the second integrated circuit memory device mode operates, the plurality of devices are identified from the plurality of devices to recover at least a portion of the first memory device identification code to the system.
在一實施例中,該組態包括:程式化該第二積體電路記憶裝置型態中的複數個裝置識別選擇非揮發記憶胞具有選擇資料以自該第二積體電路記憶裝置型態中的複數個記憶裝置識別碼內區分出該至少部分的該第一記憶裝置識別碼,如此讀取該第二積體電路記憶裝置型態中的裝置識別碼操作時,自該複數個裝置識別非揮發記憶胞回應該至少部分的該第一記憶裝置識別碼至該系統。 In one embodiment, the configuring includes: staging the plurality of devices in the second integrated circuit memory device type to identify the non-volatile memory cells having the selected data from the second integrated circuit memory device type The at least part of the first memory device identification code is distinguished by the plurality of memory device identification codes, and when the device identification code operation in the second integrated circuit memory device type is read, the plurality of devices are identified from the plurality of devices The volatile memory cell should have at least a portion of the first memory device identification code to the system.
在一實施例中,於該組態之前,該第二積體電路記憶裝置型態中的該記憶裝置識別碼讀取操作無法回應該至少部分的該第一記憶裝置識別碼。 In an embodiment, prior to the configuration, the memory device identification code read operation in the second integrated circuit memory device type cannot respond to at least a portion of the first memory device identification code.
在一實施例中,於該組態之前,沒有該第一記憶裝置識別碼的該第二積體電路記憶裝置型態無法與該系統相容。 In an embodiment, prior to the configuration, the second integrated circuit memory device type without the first memory device identification code is not compatible with the system.
在一實施例中,於該組態之後,該第二積體電路記憶裝置型態中的該記憶裝置識別碼讀取操作可以回應該至少部分的該第一記憶裝置識別碼。 In an embodiment, after the configuration, the memory device identification code read operation in the second integrated circuit memory device type may correspond to at least a portion of the first memory device identification code.
在一實施例中,於該組態之後,沒有該第一記憶裝置識別碼的該第二積體電路記憶裝置型態可以與該系統相容。 In an embodiment, after the configuration, the second integrated circuit memory device type without the first memory device identification code can be compatible with the system.
在一實施例中,該第一裝置識別碼包括該積體電路記憶裝置的一製造商識別碼。 In one embodiment, the first device identification code comprises a manufacturer identification code of the integrated circuit memory device.
在一實施例中,該第一裝置識別碼包括該積體電路記憶裝置的製造資料。 In an embodiment, the first device identification code comprises manufacturing data of the integrated circuit memory device.
在一實施例中,該第一裝置識別碼包括該積體電路記憶裝置的產品規格資料。 In an embodiment, the first device identification code includes product specification data of the integrated circuit memory device.
本技術之再一目的為提供一種製造一積體電路記憶裝置的方法,包含:提供一積體電路基板;提供複數個應用記憶胞於該積體電路基板上;提供複數個裝置識別非揮發記憶胞於該積體電路基板上;提供複數個裝置識別選擇非揮發記憶胞於該積體電路基板上;以及提供控制電路,其(i)進行該複數個識別非揮發記憶胞之複數個裝置識別碼的操作,該複數個裝置識別碼包括複數個識別該積體電路記憶裝置型態的位元,(ii)進行該複數個識別選擇非揮發記憶胞之選擇資料的程式化、抹除及讀取操作,該選擇資料自該複數個裝置識別碼中作出區別。 A further object of the present technology is to provide a method for manufacturing an integrated circuit memory device, comprising: providing an integrated circuit substrate; providing a plurality of application memory cells on the integrated circuit substrate; and providing a plurality of devices for identifying non-volatile memory Generating on the integrated circuit substrate; providing a plurality of devices for identifying and selecting non-volatile memory cells on the integrated circuit substrate; and providing a control circuit for (i) performing a plurality of device identifications for identifying the plurality of non-volatile memory cells The operation of the code, the plurality of device identification codes comprising a plurality of bits identifying the type of the integrated circuit memory device, and (ii) performing the stylization, erasing and reading of the selection data of the plurality of selected non-volatile memory cells In the operation, the selection data is distinguished from the plurality of device identification codes.
在一實施例中,該控制電路,響應一裝置識別碼讀取指令,而自該複數個識別非揮發記憶胞讀取一裝置識別碼,該裝置識別碼藉由該數個識別選擇非揮發記憶胞之該選擇資料自該複數個識別非揮發記憶胞中的其他裝置識別碼作出區別。 In one embodiment, the control circuit reads a device identification code from the plurality of identified non-volatile memory cells in response to a device identification code reading command, and the device identification code selects non-volatile memory by the plurality of identifications. The selection data of the cells is distinguished from the other device identification codes in the plurality of non-volatile memory cells.
在一實施例中,該積體電路記憶裝置的型態藉由該複數個裝置識別碼的一裝置識別碼分辨,該複數個裝置識別碼包括該積體電路記憶裝置的一製造商識別碼。 In one embodiment, the type of the integrated circuit memory device is resolved by a device identification code of the plurality of device identification codes, the plurality of device identification codes including a manufacturer identification code of the integrated circuit memory device.
在一實施例中,該積體電路記憶裝置的型態藉由該複數個 裝置識別碼的一裝置識別碼分辨,該複數個裝置識別碼包括該積體電路記憶裝置的製造資料。 In an embodiment, the type of the integrated circuit memory device is by the plurality of A device identification code of the device identification code is resolved, and the plurality of device identification codes include manufacturing materials of the integrated circuit memory device.
在一實施例中,該積體電路記憶裝置的型態藉由該複數個裝置識別碼的一裝置識別碼分辨,該複數個裝置識別碼包括該積體電路記憶裝置的產品規格資料。 In one embodiment, the type of the integrated circuit memory device is resolved by a device identification code of the plurality of device identification codes, the plurality of device identification codes including product specification data of the integrated circuit memory device.
在不同的實施例中,這些記憶胞可以是非揮發及/或揮發的。 In various embodiments, these memory cells can be non-volatile and/or volatile.
一非揮發記憶胞(例如快閃記憶裝置)可以在即使是沒有電源時依舊不會使所儲存的資料遺失。不同的實施例中使用非揮發記憶胞來儲存識別碼,且可以藉由程式化或抹除如此的陣列資料加以更新。在此情況下,記憶體識別碼是可程式化的且可以針對預期不同記憶體識別碼的不同系統加以靈活地調整。否則,不同的系統就會需要破獲性及昂貴的改變才能為不同記憶裝置的安置一個所需新的識別碼。 A non-volatile memory cell (such as a flash memory device) can still not lose stored data even when there is no power source. Non-volatile memory cells are used in different embodiments to store the identification code and can be updated by stylizing or erasing such array data. In this case, the memory identification code is programmable and can be flexibly adjusted for different systems that expect different memory identification codes. Otherwise, different systems will require cracking and expensive changes to place a new identification code for the different memory devices.
第1A及第1B圖顯示一個典型的記憶體識別碼電路之實施。在第1A圖中,一識別記憶胞重複地出現於一陣列結構中,且資料是以位元組模式或是字元模式輸出。識別記憶胞之更詳細的示意圖顯示於第1B圖中,且包括依賴一金屬層的連接與通過N型金氧半電晶體拉下輸出位元線BL至地的電晶體,或是替代地通過P型金氧半電晶體微弱拉高輸出位元線BL保持在供應電壓(Vdd)。因此,一記憶裝置的識別碼可以藉由修改此記憶裝置的金屬層而改變。然而,如此的實施方式是較沒有彈性的,因為其需要對不同的記憶裝置識別碼改變金屬層的光罩,而且需要在製造時就必須決定此記憶裝置的識別碼(所以無法於製造後修改此記憶裝置的識別碼)。 Figures 1A and 1B show the implementation of a typical memory identification circuit. In Fig. 1A, an identification memory cell is repeatedly present in an array structure, and the data is output in a byte mode or a character mode. A more detailed schematic diagram of identifying memory cells is shown in FIG. 1B and includes a connection that depends on a metal layer and a transistor that pulls the output bit line BL to ground through an N-type MOS transistor, or alternatively The P-type MOS transistor is slightly pulled high and the output bit line BL is maintained at the supply voltage (Vdd). Therefore, the identification code of a memory device can be changed by modifying the metal layer of the memory device. However, such an embodiment is less flexible because it requires changing the mask of the metal layer to different memory device identification codes, and it is necessary to determine the identification code of the memory device at the time of manufacture (so it cannot be modified after manufacture). The identification code of this memory device).
第2A及第2B圖分別顯示許多不同實施例的示意圖及流程圖。在第2A圖中,每一個記憶裝置識別碼位元具有與串聯的拉下NMOS電晶體連接,而對此串列中一特定位元位置的每一個NMOS電晶體是由不同記憶裝置識別碼選擇之相同特定位元位置所選擇。此NMOS電晶體的上方列讀取記憶裝置識別碼ID0所有的位元位置,而且此NMOS電晶體的下方列讀取記憶裝置識別碼ID1所有的位元位置。舉例而言,此串聯NMOS電晶體的最左者對應輸出記憶裝置識別碼位元位置7,且在此串列之內,此較高的NMOS電晶體代表記憶裝置識別碼ID0的位元位置7,且此較低的NMOS電晶體代表另一記憶裝置識別碼ID1的位元位置7。介於較高的NMOS電晶體與較低的NMOS電晶體之間的點在不同實施例中代表,此電路可以客製化為具有一特定數目的記憶裝置識別碼,例如一不同數目的列。此外,此電路也可以客製化為在每一個記憶裝置識別碼內具有一特定數目的位元位置,例如一不同數目的行。 Figures 2A and 2B show schematic and flow diagrams of many different embodiments, respectively. In Figure 2A, each memory device identification code bit has a connection to a series of pull-down NMOS transistors, and each NMOS transistor of a particular bit position in the series is selected by a different memory device identification code. The same specific bit position is selected. The upper column of the NMOS transistor reads all the bit positions of the memory device identification code ID0, and the lower column of the NMOS transistor reads all the bit positions of the memory device identification code ID1. For example, the leftmost one of the series NMOS transistors corresponds to the output memory device identification code bit position 7, and within the series, the higher NMOS transistor represents the bit position 7 of the memory device identification code ID0. And the lower NMOS transistor represents the bit position 7 of the other memory device identification code ID1. The point between the higher NMOS transistor and the lower NMOS transistor is represented in different embodiments, and the circuit can be customized to have a specific number of memory device identification codes, such as a different number of columns. In addition, the circuitry can be customized to have a particular number of bit locations within each memory device identification code, such as a different number of rows.
不同記憶裝置識別碼選擇係儲存在一非揮發記憶體且在電源啟動讀取時提取進入暫存器中。對一特定位元位置而言,假如任何記憶裝置識別碼(例如記憶裝置識別碼ID0或ID1)是邏輯高準位時,則此位元位置的拉下電晶體路徑是開啟的。在此情況下,此積體電路可以根據一個或多個儲存於一個或多個非揮發記憶胞中的記憶裝置識別碼選擇位元來輸出多重記憶裝置識別碼所選取之一者。第2B圖顯示提取記憶裝置識別選擇碼過程的流程圖,且之後在電源啟動讀取時提取由記憶裝置識別選擇碼所選取的記憶裝置識別碼。在電源啟動讀取的步驟11之後,步驟13自非揮發記憶胞提取記憶裝置識別選擇碼。在步驟15,使用此記憶裝置識別選擇碼來選取多重記憶裝置識別碼之一。然後,在步驟17,將所選取之記憶裝置識別選擇碼輸出。 Different memory device identification code selections are stored in a non-volatile memory and are extracted into the scratchpad when the power source initiates a read. For a particular bit position, if any memory device identification code (e.g., memory device identification code ID0 or ID1) is a logic high level, the pull-down transistor path for that bit position is turned on. In this case, the integrated circuit may output one of the multiple memory device identification codes based on one or more memory device identification code bits stored in one or more non-volatile memory cells. Fig. 2B is a flow chart showing the process of extracting the memory device identification selection code, and then extracting the memory device identification code selected by the memory device identification selection code when the power source starts reading. After step 11 of the power-on read, step 13 extracts the memory device identification code from the non-volatile memory cell. In step 15, one of the multiple memory device identification codes is selected using the memory device identification code. Then, in step 17, the selected memory device identification selection code is output.
第3A及第3B圖顯示其他實施例的示意圖。第3A圖是記憶裝置識別碼暫存器陣列結構。不同記憶裝置識別碼的暫存器是由不同的致能信號(EN#)來致能,且輸出至資料匯流排ID0~ID7,而其他記憶裝置識別碼的暫存器由於沒有接收此致能信號仍保持關閉。第3B圖顯示一範例單元識別暫存器的示意圖,其具有一"Lpad(提取)"信號以將讀取自非揮發記憶胞的記憶裝置識別碼栓鎖且此致能信號"EN"設定此栓鎖啟動。因為記憶裝置識別碼儲存並從非揮發記憶胞中提取,此記憶裝置識別碼可以藉由程式化或抹除此記憶胞來修改。 Figures 3A and 3B show schematic diagrams of other embodiments. Figure 3A is a memory device identification code register array structure. The registers of different memory device identification codes are enabled by different enable signals (EN#) and output to the data bus bars ID0~ID7, while the other memory device identification code registers are not receiving the enable signal. Still remain closed. Figure 3B shows a schematic diagram of an example unit identification register having an "Lpad" signal to latch the memory device identifier read from the non-volatile memory cell and the enable signal "EN" to set the pin The lock starts. Since the memory device identification code is stored and extracted from the non-volatile memory cells, the memory device identification code can be modified by stylizing or erasing the memory cell.
第4圖顯示如何提取及更新記憶裝置識別碼選取位元的流程圖。在步驟21,發出一即將被程式化之記憶裝置識別選擇碼。此程式化記憶裝置識別選擇碼的操作在步驟23開始。在步驟25的驗證程序,會決定程式化成功或失敗。假如判斷是程式化失敗,則會在步驟27決定是否已達到最大的程式化嘗試次數。假如尚未達到最大的程式化嘗試次數,則重新回到步驟23再次進行程式化操作。假如已經達到最大的程式化嘗試次數,則在步驟29決定程式化操作失敗。假如在步驟25判斷是程式化成功,則此演算法會繼續前進至步驟31進行電源開啟讀取。此記憶裝置識別選擇碼會在步驟33提取進入非揮發記憶胞。具有記憶裝置識別選擇碼之後,在步驟35會選取一記憶裝置識別碼。由記憶裝置識別選擇碼所識別之此記憶裝置識別碼然後在步驟37輸出。 Figure 4 shows a flow chart of how to extract and update the memory device identification code selection bit. At step 21, a memory device to be programmed is issued to identify the selection code. The operation of the stylized memory device to identify the selection code begins in step 23. The verification procedure in step 25 determines whether the stylization succeeds or fails. If the determination is that the stylization failed, then in step 27 it is determined whether the maximum number of stylized attempts has been reached. If the maximum number of stylized attempts has not been reached, go back to step 23 and program again. If the maximum number of stylized attempts has been reached, then in step 29 it is determined that the stylization operation failed. If it is determined in step 25 that the programming is successful, then the algorithm proceeds to step 31 for power-on reading. The memory device identification selection code is extracted into the non-volatile memory cell at step 33. After having the memory device identification selection code, a memory device identification code is selected in step 35. The memory device identification code identified by the memory device identification code is then output at step 37.
第5圖顯示如何重新提取及更新記憶裝置識別碼選取位元的流程圖。在步驟41,發出一即將被程式化之記憶裝置識別選擇碼。此程式化記憶裝置識別選擇碼的操作在步驟43開始。在步驟45的驗證程序,會決定程式化成功或失敗。假如判斷是程式化失敗,則會在步驟47決定是否已達到最大的程式化嘗試次數。假如尚未達到最大的程式化嘗試次數,則重新 回到步驟43再次進行程式化操作。假如已經達到最大的程式化嘗試次數,則在步驟49決定程式化操作失敗。假如在步驟45判斷是程式化成功,則此演算法會繼續前進至步驟51進行電源開啟讀取。此記憶裝置識別選擇碼會在步驟53提取進入非揮發記憶胞。此記憶裝置識別碼然後在步驟55輸出。 Figure 5 shows a flow chart of how to re-extract and update the memory device identification bits. At step 41, a memory device to be programmed is issued to identify the selection code. The operation of the stylized memory device to identify the selection code begins in step 43. The verification procedure in step 45 determines whether the stylization succeeds or fails. If the determination is that the stylization failed, then in step 47 it is determined if the maximum number of stylized attempts has been reached. If the maximum number of stylized attempts has not been reached, then re Go back to step 43 and perform the stylization again. If the maximum number of stylized attempts has been reached, then in step 49 it is determined that the stylization operation failed. If it is determined in step 45 that the programming is successful, then the algorithm proceeds to step 51 for power-on reading. The memory device identification selection code is extracted into the non-volatile memory cell at step 53. This memory device identification code is then output at step 55.
第6圖顯示一範例的可變記憶裝置識別選擇碼及可變記憶裝置識別碼的應用。在步驟61提供一個組態為與具有第一記憶裝置識別碼的第一積體電路記憶裝置型態相容的系統。此相容性的範例為,此系統探詢第一積體電路記憶裝置型態,且在自第一積體電路記憶裝置型態接收第一記憶裝置識別碼之後,此系統會進行正常的操作。在步驟63提供一個不具有第一記憶裝置識別碼的第二積體電路記憶裝置型態。在此時,因為第二積體電路記憶裝置型態並不具有第一記憶裝置識別碼,此系統並沒有組態為與第二積體電路記憶裝置型態相容。雖然是缺乏相容性,此系統或許仍可以與第二積體電路記憶裝置型態搭配。舉例而言,此系統可以組態為中斷正常操作,假如系統探詢第二積體電路記憶裝置型態時並未如預期般得到第一記憶裝置識別碼的話。沒有目前所描述技術的話,如此的系統就必須修改及更新以接受與第二積體電路記憶裝置型態相關的不同記憶裝置識別碼。在步驟65,此第二積體電路記憶裝置型態被組態為至少具有一部分的第一記憶裝置識別碼,最少是具有系統所預期繼續正常操作的第一記憶裝置識別碼部分。如此的組態稱為更新第二積體電路記憶裝置型態之可變記憶裝置識別選擇碼及/或可變記憶裝置識別碼。在步驟67,此第二積體電路記憶裝置型態與系統整合。如此的整合可以在第二積體電路記憶裝置型態的組態之前或之後發生。 Figure 6 shows an exemplary variable memory device identification selection code and variable memory device identification code application. At step 61 a system is provided that is configured to be compatible with the first integrated circuit memory device type having the first memory device identification code. An example of such compatibility is that the system interrogates the first integrated circuit memory device type and the system performs normal operation after receiving the first memory device identification code from the first integrated circuit memory device type. At step 63, a second integrated circuit memory device type having no first memory device identification code is provided. At this time, since the second integrated circuit memory device type does not have the first memory device identification code, the system is not configured to be compatible with the second integrated circuit memory device type. Although lack of compatibility, the system may still be compatible with the second integrated circuit memory device type. For example, the system can be configured to interrupt normal operation if the first memory device identification code is not obtained as expected when the system interrogates the second integrated circuit memory device type. Without the presently described techniques, such systems must be modified and updated to accept different memory device identification codes associated with the second integrated circuit memory device type. At step 65, the second integrated circuit memory device type is configured to have at least a portion of the first memory device identification code, at least the first memory device identification code portion with the system expected to continue normal operation. Such a configuration is referred to as updating the variable memory device identification selection code and/or the variable memory device identification code of the second integrated circuit memory device type. At step 67, the second integrated circuit memory device type is integrated with the system. Such integration can occur before or after the configuration of the second integrated circuit memory device type.
第7圖顯示根據本發明一實施例之積體電路的簡化示意圖。其中積體電路750包括使用具有應用資料之非揮發記憶胞 700、具有裝置識別碼之非揮發記憶胞752以及具有選擇資料之非揮發記憶胞754,利用此處所描述的方式實施於一個或多個記憶陣列中。一列解碼器701與沿著記憶陣列列方向安排之複數條字元線702耦接。行解碼器703與沿著記憶陣列行方向安排之複數條位元線704耦接以對自陣列的記憶胞進行讀取及程式化資料的操作。位址係由匯流排705提供給行解碼器703和列解碼器701。方塊706中的感測放大器與資料輸入結構經由資料匯流排707與行解碼器703耦接。資料由積體電路750上的輸入/輸出埠提供給資料輸入線711,或者由積體電路750其他內部/外部的資料源,輸入至方塊706中的資料輸入結構。在本實施例中所使用的控制器係使用了偏壓調整狀態機構709,並控制了由電壓供應源或是方塊708產生或提供之偏壓調整供應電壓的應用,例如讀取、抹除、程式化、抹除驗證和程式化驗證電壓。該控制器可利用特殊目的邏輯電路而應用,如熟習該項技藝者所熟知。在替代實施例中,該控制器包括了通用目的處理器,其可使於同一積體電路,以執行一電腦程式而控制裝置的操作。在又一實施例中,該控制器係由特殊目的邏輯電路與通用目的處理器組合而成。 Figure 7 shows a simplified schematic of an integrated circuit in accordance with an embodiment of the present invention. The integrated circuit 750 includes using a non-volatile memory cell with application data. 700. Non-volatile memory cells 752 having device identification codes and non-volatile memory cells 754 having selected data are implemented in one or more memory arrays in the manner described herein. A column of decoders 701 is coupled to a plurality of word lines 702 arranged along the direction of the memory array column. Row decoder 703 is coupled to a plurality of bit lines 704 arranged along the row direction of the memory array to read and program data from the memory cells of the array. The address is provided by bus bar 705 to row decoder 703 and column decoder 701. The sense amplifier and data input structure in block 706 is coupled to row decoder 703 via data bus 707. The data is supplied to the data input line 711 by the input/output port on the integrated circuit 750, or is input to the data input structure in block 706 by other internal/external data sources of the integrated circuit 750. The controller used in this embodiment uses a bias adjustment state mechanism 709 and controls the application of bias voltage adjustment supply voltage generated or provided by the voltage supply source or block 708, such as reading, erasing, Stylize, erase verification, and stylize verification voltages. The controller can be utilized with special purpose logic circuitry as is well known to those skilled in the art. In an alternate embodiment, the controller includes a general purpose processor that can be used in the same integrated circuit to execute a computer program to control the operation of the device. In yet another embodiment, the controller is a combination of special purpose logic circuitry and a general purpose processor.
不同實施例使用不同形式的記憶裝置參數例如識別碼、型態、密度、規格等等。 Different embodiments use different forms of memory device parameters such as identification codes, patterns, densities, specifications, and the like.
根據本發明實施例之此可程式化識別碼方法和裝置並不侷限於在記憶體應用,且可以應用於其他提供具有彈性內容資料的電路。 The programmable identification code method and apparatus according to an embodiment of the present invention is not limited to use in a memory application, and can be applied to other circuits that provide flexible content material.
除了非揮發記憶體之外,本發明也可以使用於熔絲或是金屬層選取連接型態的裝置中。儲存元件可以是任何型態的媒介例如是記憶胞、熔絲或是金屬層選取連接等。 In addition to non-volatile memory, the invention can also be used in fuse or metal layer selective connection devices. The storage element can be any type of medium such as a memory cell, a fuse or a metal layer connection.
雖然本發明係已參照實施例來加以描述,然本發明創作並未受限於其詳細描述內容。替換方式及修改樣式係已於先前描 述中所建議,且其他替換方式及修改樣式將為熟習此項技藝之人士所思及。特別是,所有具有實質上相同於本發明之構件結合而達成與本發明實質上相同結果者,皆不脫離本發明之精神範疇。因此,所有此等替換方式及修改樣式係意欲落在本發明於隨附申請專利範圍及其均等物所界定的範疇之中。 Although the present invention has been described with reference to the embodiments, the present invention is not limited by the detailed description thereof. Replacement and modification styles have been previously described It is suggested in the description, and other alternatives and modifications will be considered by those skilled in the art. In particular, all combinations of components that are substantially identical to the invention can achieve substantially the same results as the present invention without departing from the spirit of the invention. Therefore, all such alternatives and modifications are intended to be within the scope of the invention as defined by the appended claims and their equivalents.
750‧‧‧積體電路 750‧‧‧ integrated circuit
700‧‧‧具有應用資料之非揮發記憶胞 700‧‧‧Non-volatile memory cells with applied data
752‧‧‧具有裝置識別碼之非揮發記憶胞 752‧‧‧ Non-volatile memory cells with device identification code
754‧‧‧具有選擇資料之非揮發記憶胞 754‧‧‧Non-volatile memory cells with selected data
701‧‧‧列解碼器 701‧‧‧ column decoder
702‧‧‧字元線 702‧‧‧ character line
703‧‧‧行解碼器 703‧‧‧ line decoder
704‧‧‧位元線 704‧‧‧ bit line
705、707‧‧‧匯流排 705, 707‧‧ ‧ busbar
706‧‧‧感測放大器/資料輸入結構 706‧‧‧Sense Amplifier/Data Entry Structure
709‧‧‧程式化、抹除及讀取調整偏壓狀態機構 709‧‧‧Stylized, erased and read adjustment bias state mechanism
708‧‧‧偏壓調整供應電壓 708‧‧‧ bias adjustment supply voltage
711‧‧‧資料輸入線 711‧‧‧ data input line
715‧‧‧資料輸出線 715‧‧‧ data output line
本發明係由申請專利範圍所界定。這些和其它目的,特徵,和實施例,會在下列實施方式的章節中搭配圖式被描述,其中:第1A及1B圖顯示一個典型的記憶體識別碼電路之實施。 The invention is defined by the scope of the patent application. These and other objects, features, and embodiments will be described in conjunction with the drawings in the sections of the following embodiments, wherein: Figures 1A and 1B show an implementation of a typical memory identification circuit.
第2A和2B圖分別顯示一記憶體識別碼電路的多個實施例之示意圖及流程圖。 Figures 2A and 2B show a schematic diagram and a flow chart, respectively, of various embodiments of a memory identification code circuit.
第3A及3B圖係顯示一記憶體識別碼電路的其它實施例之示意圖說明。 3A and 3B are schematic illustrations showing other embodiments of a memory identification code circuit.
第4圖顯示如何提取及更新記憶裝置識別碼選取位元的流程圖。 Figure 4 shows a flow chart of how to extract and update the memory device identification code selection bit.
第5圖顯示如何重新提取及更新記憶裝置識別碼選取位元的流程圖。 Figure 5 shows a flow chart of how to re-extract and update the memory device identification bits.
第6圖顯示一範例的可變記憶裝置識別選擇碼及可變記憶裝置識別碼的應用。 Figure 6 shows an exemplary variable memory device identification selection code and variable memory device identification code application.
第7圖顯示根據本發明一實施例之積體電路的簡化示意圖。 Figure 7 shows a simplified schematic of an integrated circuit in accordance with an embodiment of the present invention.
Claims (14)
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| TW100108577A TWI482163B (en) | 2011-03-14 | 2011-03-14 | Method and apparatus of changing device identification codes of a memory integrated circuit device |
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| TW100108577A TWI482163B (en) | 2011-03-14 | 2011-03-14 | Method and apparatus of changing device identification codes of a memory integrated circuit device |
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| TW201237877A TW201237877A (en) | 2012-09-16 |
| TWI482163B true TWI482163B (en) | 2015-04-21 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7471535B2 (en) * | 2002-05-29 | 2008-12-30 | Micron Technology, Inc. | Programable identification circuitry |
| US7546498B1 (en) * | 2006-06-02 | 2009-06-09 | Lattice Semiconductor Corporation | Programmable logic devices with custom identification systems and methods |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7471535B2 (en) * | 2002-05-29 | 2008-12-30 | Micron Technology, Inc. | Programable identification circuitry |
| US7546498B1 (en) * | 2006-06-02 | 2009-06-09 | Lattice Semiconductor Corporation | Programmable logic devices with custom identification systems and methods |
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| TW201237877A (en) | 2012-09-16 |
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