TWI481682B - Followed by a resin composition, a subsequent resin molded product, and a subsequent resin laminate - Google Patents

Description

Resin resin composition, adhesive resin molded body and adhesive resin laminate

The present invention relates to an adhesive resin composition having an excellent adhesion to various adherends such as metal, glass, and plastic, an adhesive resin molded body and an adhesive resin laminate.

Conventionally, as a protective film for coating and protecting various metal plate surfaces such as a steel plate, an aluminum plate, or a metal plate which has been subjected to various surface treatments such as plating on the metal plate, for example, it is known to be metal. Laminate film (Patent Document 1). Moreover, as an adhesive resin for a glass plate, the interlayer film for laminated glass is known (patent document 2).

Patent Document 1 discloses an adhesive layer comprising a polypropylene resin modified with an unsaturated carboxylic acid, and a laminated film for a metal laminate comprising one or more extended polypropylene resin layers.

However, in Patent Document 1, as a heat sealing condition with a metal material, the temperature of the metal material side is 220 ° C in the heat sealer, and the temperature on the film side is 90 ° C. As described above, in the prior art, even when the thermocompression is performed at a high temperature, excellent adhesion is not obtained. Therefore, there is a problem that it is necessary to further improve the adhesion.

Patent Document 2 discloses an interlayer film for laminated glass containing an ethylene-vinyl acetate copolymer, an acid-modified polyolefin, and inorganic fine particles. In particular, the acid-modified polyolefin has an acid value of 10 mg KOH/g or more, and if it contains 0.01 to 5 parts by weight of the acid-modified polyolefin with respect to 100 parts by weight of the ethylene-vinyl acetate copolymer, excellent adhesion can be obtained. .

However, in the resin composition disclosed in Patent Document 2, if the content of the acid-modified polyolefin exceeds 5 parts by weight, the problem of the adhesion between the interlayer film for laminated glass and the glass sheet cannot be sufficiently obtained.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2002-192672

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-184887

According to the conventional technique, there is no adhesive composition which is excellent in adhesion to various adherends such as metal, glass, and plastic, and which is composed of a simple composition and which can be easily produced.

In view of the above-mentioned state of the art, an object of the present invention is to provide an adhesive resin composition which is excellent in adhesion to various adherends such as metal, glass, and plastic, and which is composed of a simple composition and which can be easily produced, and an adhesive resin molded article and adhesive property. Resin laminate.

In order to solve the above problems, the present invention provides an adhesive resin composition comprising an acid-modified polyolefin resin and an epoxy resin compound having two or more epoxy groups in one molecule and having 10 or more hydroxyl groups in one molecule. Essential ingredients.

It is preferable to contain a graft copolymer obtained by graft-polymerizing an acid functional group of the acid-modified polyolefin resin with a hydroxyl group of the epoxy resin compound.

The epoxy resin compound in the range of 1 to 15 parts by weight is preferably contained in 100 parts by weight of the solid content of the adhesive resin composition.

The acid-modified polyolefin resin is preferably an acid-modified polypropylene resin.

Preferably, the acid-modified polyolefin resin is melt-grafted with the epoxy resin compound.

It is preferable to further add a thermoplastic elastomer resin in a form containing 1 to 15 parts by weight of the thermoplastic elastomer resin in 100 parts by weight of the solid content of the adhesive resin composition.

Moreover, the present invention provides an adhesive resin molded body comprising a film or sheet formed of the above-mentioned adhesive resin composition.

Moreover, the present invention provides an adhesive resin laminate which is formed by laminating an adhesive resin layer formed of the above-mentioned adhesive resin composition on at least one surface of a substrate.

According to the present invention, it is possible to provide an adhesive resin composition which is excellent in adhesion to various adherends such as metal, glass, and plastic, and which can be easily produced by a simple composition, and an adhesive resin molded body and an adhesive resin laminated body. .

Hereinafter, the present invention will be described based on preferred embodiments.

The adhesive resin composition of the present invention contains an acid-modified polyolefin resin and an epoxy resin compound having two or more epoxy groups in one molecule and having 10 or more hydroxyl groups in one molecule.

[acid modified polyolefin resin]

The acid-modified polyolefin resin used in the present invention is a polyolefin-based resin modified by an unsaturated carboxylic acid or a derivative thereof, and has a carboxyl group or a carboxylic anhydride group in the polyolefin-based resin. It is preferred to carry out the polyolefin resin by an unsaturated carboxylic acid or a derivative thereof. The acid-modified method of the acid-modified polyolefin resin may, for example, be a monomer having an acid functional group and a poly-polymerization initiator in the presence of an organic peroxide or an aliphatic azo compound. The olefin resin is graft-modified by melt-kneading or the like, or a copolymer of a monomer having an acid functional group and an olefin.

Examples of the polyolefins include polyethylene, polypropylene, poly-1-butene, polyisobutylene, random copolymers of propylene and ethylene or α-olefins, and block copolymerization of propylene with ethylene or α-olefins. Things and so on. Among them, polypropylene such as homopolypropylene (all PP, propylene homopolymer), propylene-ethylene block copolymer (block PP), and propylene-ethylene random copolymer (random PP) are preferable. Resin. Very good for random PP.

Examples of the olefins in the case of copolymerization include olefin monomers such as ethylene, propylene, 1-butene, isobutylene, 1-hexene, and α-olefin.

The monomer having an acid functional group is a compound having an ethylenic double bond, a carboxylic acid group or a carboxylic anhydride group in the same molecule, and an anhydride of various unsaturated monocarboxylic acids, dicarboxylic acids, or dicarboxylic acids. Composed of.

Examples of the acid functional group-containing monomer (carboxyl group-containing monomer) having a carboxylic acid group include acrylic acid, methacrylic acid, maleic acid, nadic acid, and antibutene. Acid, itaconic acid, citraconic acid, crotonic acid, isocrotonic acid, tetrahydrofurfuric acid, internal bicyclo [2.2.1]-5-heptene-2,3-dicarboxylic acid (endic acid) And other α,β-unsaturated carboxylic acid monomers.

Examples of the acid functional group-containing monomer (the carboxylic acid anhydride group-containing monomer) having a carboxylic anhydride group include maleic anhydride, nadic anhydride, itaconic anhydride, citraconic anhydride, and nendic anhydride. Saturated dicarboxylic anhydride monomer.

In the acid-modified polyolefin resin, one type of these acid functional group-containing monomers may be used alone or in combination of two or more.

Among the monomers having an acid functional group, a monomer having a carboxylic anhydride group is more preferable, and more preferably maleic anhydride.

When a part of the acid functional group-containing monomer used in the acid reforming is not reacted, in order to suppress the adverse effect on the adhesion force, it is preferred to use the unreacted acid functional group-containing monomer as the above acid. Modified polyolefin resin.

The propylene component in the acid-modified polyolefin resin is preferably a propylene unit in a half amount from the viewpoint of heat resistance of the resin. The term "half amount" means that the propylene component is 50% by weight or more based on the acid-modified polyolefin resin. Therefore, as the acid-modified polyolefin resin, an acid-modified polypropylene resin having a propylene unit content of more than half is preferable.

[Epoxy resin compound]

The epoxy resin compound used in the present invention is a compound having two or more epoxy groups in one molecule and having 10 or more hydroxyl groups in one molecule.

The epoxy resin-based compound may, for example, be a polyhydroxyl polyether, a polyhydroxy polyester, a polyhydroxy polycarbonate, a polyhydroxypolyamine or the like having a plurality of hydroxyl groups, by a propylene group. The epoxidation is carried out to form a compound having two or more epoxy groups in one molecule. Specific examples thereof include an epoxy resin which is synthesized by reacting bisphenols with epichlorohydrin and which is a phenoxy resin and has an epoxy group at both terminals and is represented by the following general formula (1). Compound.

In the general formula (1), the substituents R and R' each independently represent, for example, a hydrogen atom or an alkyl group such as a methyl group or an ethyl group. Further, the integer p is equal to the number of hydroxyl groups (hydroxyl number) possessed in one molecule.

The phenoxy resin may, for example, be a bisphenol A (BPA) type phenoxy resin in which the substituents R and R' of the bisphenol in the general formula (1) are simultaneously CH ₃ , R, R' A bisphenol F (BPF) type phenoxy resin of the same type, a BPA/BPF copolymer type phenoxy resin copolymerized with a bisphenol A type and a bisphenol F type, and one of R and R' is CH. _{3. The} other is a bisphenol B type phenoxy resin of H or the like. Further, since the bisphenol type epoxy resin is represented by the above general formula (1) in the same manner as the phenoxy resin, a higher molecular weight and a larger number of hydroxyl groups p can be selected.

The weight average molecular weight (Mw) of the phenoxy resin or epoxy resin is preferably about 3,000 (in the case of a bisphenol A type, the number of hydroxyl groups p is about 10) or more, and about 15,000 (a case of a bisphenol A type) can be used. The hydroxyl number p is about 50), about 20,000 (in the case of the bisphenol A type, the hydroxyl number p is about 70), or the molecular weight is higher.

The upper limit of the average molecular weight of the phenoxy resin or the epoxy resin is not particularly limited, but is preferably about 80,000 (in the case of the bisphenol A type, the number of hydroxyl groups p is about 280). Further, when the average molecular weight of the phenoxy resin or the epoxy resin is determined by GPC, for example, tetrahydrofuran (THF) can be used as an eluent for GPC, and TSKgel G4000H and TSKgel G3000H (for both Tosoh shares) are used. The company's system, the product name) is obtained as a column.

The phenoxy resin may, for example, be a product name: YP-50 (Mw is 60,000 to 80,000, BPA type, hydroxyl number p is about 210 to 280), YP-50S, manufactured by Nippon Steel Chemical Co., Ltd. (Mw is 50,000~70,000, BPA type, hydroxyl number p is about 175~245), YP-55U (Mw is 40,000~45,000, BPA type, hydroxyl number p is about 140-160), YP-70 (Mw is 50,000) ~60,000, BPA/BPF copolymerization type), ZX-1356-2 (Mw is 60,000~80,000, BPA/BPF copolymerization type), FX-316 (Mw is 40,000~60,000, BPF type, etc.; 1256 grade (molecular weight about 50,000, BPA type) of phenoxy type manufactured by Mitsubishi Chemical Corporation, the same 4250 (molecular weight about 60,000, BPA/BPF copolymerization type), the same 4275 (molecular weight about 60000, BPA/BPF copolymerization type), 1255HX30, YX8100BH30, YX6954BH30, etc.; PKHB, PKHC, PKHH, PKHJ, etc. manufactured by Ba Industrial Co., Ltd.

In addition, the epoxy resin may be, for example, a product name: YD-020G (epoxy equivalent: 3,500 to 4,500, BPA type) manufactured by Nippon Steel Chemical Co., Ltd.; Molecular weight 5500, BPA type, epoxy equivalent 3000~5000), same as 1009 (average molecular weight 3800, BPA type, epoxy equivalent 2400~3300).

The adhesive resin composition of the present invention has the function of an acid functional group of the acid-modified polyolefin resin and an epoxy group or a hydroxyl group of the epoxy resin compound to have an adhesive functional group to the adherend. It has excellent adhesion to various adherends such as metal, glass, and plastic.

In the 100 parts by weight of the solid content of the adhesive resin composition, the epoxy resin compound is preferably contained in an amount of from 1 to 15 parts by weight. It has an appropriate balance between the affinity for the low polarity plastic caused by the polyolefin portion of the acid-modified polyolefin resin and the affinity for the dissimilar materials such as metal and glass caused by the above-mentioned adhesive functional group. Therefore, in addition to being bonded to a different material such as metal or glass, it has excellent adhesion when it is followed by a plastic having a low polarity such as polyolefin.

Since the acid functional group of the acid-modified polyolefin resin and the hydroxyl group of the epoxy resin compound are easily reacted by heating, it is not necessary to mix other curing agents which can react with these functional groups.

[Graft Copolymer]

In the adhesive resin composition of the present invention, a graft copolymer obtained by graft-polymerizing an acid functional group of the acid-modified polyolefin resin with a hydroxyl group of the epoxy resin compound is preferably contained. By the graft copolymer, the acid-modified polyolefin resin and the epoxy resin-based compound can be prevented from being separated by graft polymerization, and can be excellent by the multiplication of an acid functional group or a hydroxyl group. The force of the next.

The graft copolymer preferably has an epoxy group derived from the above epoxy resin compound. At this time, as the graft copolymer, an effect of improving the adhesion by an acid functional group, a hydroxyl group, and an epoxy group can be obtained.

The graft copolymer used in the present invention is preferably prepared by graft polymerization of 85 to 99% by mass of the acid-modified polyolefin resin to 1 to 15% by mass of the epoxy resin compound. Get the winner.

The graft copolymer is preferably obtained by melt-grafting the acid-modified polyolefin resin and the epoxy resin compound.

In the melt graft polymerization, the above-mentioned adhesive resin composition containing the acid-modified polyolefin resin and the epoxy resin compound is graft-polymerized in a device by melt-kneading. As the apparatus for melt-kneading, a single-screw extruder, a multi-axis extruder, a Banbury mixer, a plasto mill, a heating roll kneader, or the like can be used.

In the case of melt graft polymerization, in order to suppress decomposition of the epoxy group in the graft copolymer, it is preferred to remove volatile components such as water which can react with the epoxy group and discharge them to the outside of the apparatus.

When the acid-modified polyolefin resin has an acid anhydride group as an acid functional group, since it has high reactivity with a hydroxyl group of the epoxy resin compound, graft polymerization can be carried out under mild conditions. Preferably.

From the viewpoint of sufficiently melting the acid-modified polyolefin resin and the epoxy resin-based compound without thermal decomposition, the heating temperature at the time of melt-kneading is preferably selected from the range of 130 to 300 °C. In the case where the acid-modified polyolefin resin is a polypropylene system, it is preferably 180 to 300 °C.

Further, the kneading temperature can be measured by a method in which a thermocouple is brought into contact with an adhesive resin composition in a molten state immediately after being extruded from a device for melt-kneading.

[Thermoplastic elastomer resin]

The adhesive resin composition of the present invention may further contain a thermoplastic elastomer resin while containing the acid-modified polyolefin resin and the epoxy resin compound or the graft copolymer.

As the above thermoplastic elastomer resin, for example, styrene elastomer, styrene B Butadiene copolymer, epoxy modified styrene butadiene copolymer, olefin elastomer, polyester elastomer, styrene butadiene styrene block copolymer, styrene ethylene propylene styrene block copolymer , styrene isoprene butadiene styrene block copolymer, styrene isoprene styrene block copolymer, and the like.

When the thermoplastic elastomer resin is added, it is preferred to contain the thermoplastic elastomer resin in an amount of from 1 to 15 parts by weight based on 100 parts by weight of the solid content of the adhesive resin composition.

Under the melt-kneading conditions of the above-mentioned adhesive resin composition, if the thermoplastic elastomer resin does not react with the acid-modified polyolefin resin or the epoxy resin-based compound, it can be prepared before melt-kneading. In this case, when the mixture containing the acid-modified polyolefin resin, the epoxy resin compound, and the thermoplastic elastomer resin is melt-kneaded, the acid-modified polyolefin resin and the epoxy resin compound may be selectively selected. The reaction was carried out to obtain an adhesive resin composition containing the above graft copolymer.

[Adhesive resin layer]

The adhesive resin composition of the present invention is obtained by melt-kneading the adhesive resin composition of the present invention containing the acid-modified polyolefin resin and the epoxy resin-based compound as essential components, and extruding the formed resin composition. The method (1 step) can produce an adhesive resin layer.

In the present invention, an excellent adhesive force can be obtained by the acid functional group of the acid-modified polyolefin resin, the hydroxyl group of the epoxy resin compound, and the epoxy group. In particular, even in a lower temperature region close to the melting point (Tm) of the above-mentioned acid-modified polyolefin resin belonging to the base resin, excellent adhesion can be obtained, and low-temperature adhesion can be improved.

Further, in the melt-kneading of the above-mentioned adhesive resin composition, since the acid-modified polyolefin resin and the epoxy resin-based compound can be graft-polymerized, a preparation step of separately providing a graft copolymer is not required, and production performance is required. Excellent and can suppress damage to resin components.

The adhesive resin composition of the present invention has an excellent adhesion to various adherends such as metal, glass, and plastic, and is formed of a simple composition, whereby the adhesive resin layer can be easily produced.

In the adhesive resin composition of the present invention, a filler, a colorant, an antioxidant, an antifoaming agent, a leveling agent, a light absorbing agent, or the like may be appropriately added as another additive.

[adhesive]

Examples of the adherend that can be used in the adhesive resin composition of the present invention include various adherends such as metal, glass, and plastic. The shape of the adherend is not particularly limited, and examples thereof include a film, a sheet, a plate, a panel, a tray, a rod (rod), a case, a frame, and the like.

Examples of the metal include steel, stainless steel, aluminum, copper, nickel, chromium, or alloys thereof. Further, it is also applicable to a composite material having a metal plating layer on its surface. The substrate to be plated at this time is not particularly limited, and may be various materials such as metal, glass, and plastic.

Examples of the glass include alkali glass, alkali-free glass, and quartz glass.

Examples of the plastics include polyolefin resins such as high density polyethylene (HDPE), ultrahigh molecular weight polyethylene (UHMWPE), homopolypropylene, aligned polypropylene, and ethylene propylene copolymer resin; and nylon 6 (N6). , nylon 66 (N66), nylon 46 (N46), nylon 11 (N11), nylon 12 (N12), nylon 610 (N610), nylon 612 (N612), nylon 6/66 copolymer (N6/66), nylon Polyamide series of 6/66/610 copolymer (N6/66/610), nylon MXD6 (MXD6), nylon 6T, nylon 6/6T copolymer, nylon 66/PP copolymer, nylon 66/PPS copolymer, etc. Resin; polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyethylene isophthalate (PEI), PET/PEI copolymer, polyarylate (PAR) An aromatic polyester-based resin such as polybutylene naphthalate (PBN), liquid crystal polyester, polyoxyalkylene dimethyleneimide diacid/polybutylate terephthalate copolymer; Polyacrylonitrile (PAN), polymethacrylonitrile, acrylonitrile/styrene copolymer (AS), methacrylonitrile/styrene copolymer, methacrylonitrile/styrene/butadiene copolymer, polymethyl Acrylate based resin (for example, polymethyl propyl Polyacrylic resin such as methyl methacrylate (PMMA) or polyethyl methacrylate; vinyl acetate (EVA), polyvinyl alcohol (PVA), vinyl alcohol/ethylene copolymer (EVOH), polyvinylidene chloride (PVDC), polyvinyl chloride (PVC), vinyl chloride/vinylidene chloride copolymer, polyvinyl chloride resin such as vinylidene chloride/methyl acrylate copolymer.

[Adhesive resin molded body]

The adhesive resin molded article of the present invention is formed of the adhesive resin composition of the present invention, and has a molded body having a shape such as a film or a sheet, and can be used as an adhesive resin film or an adhesive resin sheet.

The adhesive resin molded article of the present invention can be formed into a film or a sheet by melt-kneading and extrusion molding an adhesive resin composition containing the acid-modified polyolefin resin and the epoxy resin-based compound as essential components. It is produced by a forming method of the same shape (1 step).

The adhesive resin molded article of the present invention can be laminated and heated with a adherend by, for example, the method described in the following (1) to (4), preferably by heating and pressurization. Followed by various adherends.

(1) A method in which a resin molded body is laminated on one side of a to-be-adhered body.

(2) A method of laminating different adhesive resin molded bodies on both sides of the adherend.

(3) A method of laminating different adherends on both surfaces of the adhesive resin molded body.

(4) A method in which a plurality of adhesive resin molded bodies and a plurality of adherends are alternately laminated.

[Adhesive resin laminate]

The adhesive resin laminate of the present invention is obtained by laminating at least one surface of a substrate and an adhesive resin layer composed of the adhesive resin composition of the present invention. By providing the above-mentioned adhesive resin layer on one surface or both surfaces of the substrate, the above-mentioned adhesive resin layer can be used to adhere to the adherend. As the substrate, the substrate itself does not need to have an adhesive property, and it is preferable to be bonded to the above-mentioned adhesive resin layer. Similarly to the above-mentioned examples of the adherend, various substrates such as metal, glass, and plastic can be mentioned.

The adhesive resin laminate of the present invention can be melt-kneaded and extruded by using the above-described acid-modified polyolefin resin and the above-mentioned epoxy resin-based compound as an essential component, thereby forming the above-mentioned adhesiveness. The method of the resin layer (1 step) is produced.

In the case where the substrate is composed of a thermoplastic resin, extrusion molding of the adhesive resin composition can be carried out by a co-extrusion method. In addition, it is also possible to perform adhesion by extrusion lamination. Extrusion molding of the resin composition.

In the case of the adhesive resin laminate of the present invention, the above-mentioned adhesive resin layer is provided on only one surface of the substrate, and for example, by laminating with the adherend by the method described in the above (1) or (2). And heating, preferably by heating and pressing, can be followed by various adherends.

Further, the adhesive resin laminate of the present invention has the above-mentioned adhesive resin layer on both surfaces of the substrate, and for example, by laminating with the adherend by the method exemplified in the above (1) to (4) And heating, preferably by heating and pressing, can be followed by various adherends.

[Examples]

Hereinafter, the present invention will be specifically described by way of examples.

(adhesive resin film)

The adhesive resin films of the respective examples and comparative examples were produced according to the compositions shown in Table 1. The production of the resin film is carried out by first melt-kneading the acid-modified polyolefin resin, the epoxy group-containing resin, and the elastomer resin, and then forming the film into a film having a predetermined thickness by extrusion molding. .

(Evaluation method of strength)

The adhesion strength of the heat-sealed portion of the adhesive resin film was measured at a tensile speed of 300 mm/min and a width of 15 mm for each of the adherends in accordance with JIS Z 1526.

The heat sealing conditions were performed by heating and pressurizing at a pressure of 0.2 MPa at any temperature of 140 ° C, 160 ° C, and 180 ° C for 3 seconds or 7 seconds.

The thickness of the adherend was 200 μm in the case of an aluminum plate, a copper/nickel plated plate, a glass plate, and a SUS plate. Further, the corona treatment of the nylon film was 25 μm.

When the adherend is an aluminum plate, a copper/nickel plated plate, a glass plate, or a corona-treated nylon film, the heat sealing time is set to 3 seconds. Further, when the adherend was a SUS plate (SUS: a type of stainless steel), the heat sealing time was set to 7 seconds.

Table 1 shows the composition (unit: mass%) of the film resin.

Further, the meaning of the abbreviations used in Table 1 is as follows.

"MAH-PP": Maleic anhydride modified polypropylene (ρ=0.896 g/cm ³ , Tm=140°C, MFR=7.0)

"Epoxy group-containing resin (1)": phenoxy resin "YP-55U" (bisphenol A type, weight average molecular weight 40,000 to 45,000, manufactured by Nippon Steel Chemical Co., Ltd., trade name) The number of hydroxyl groups is estimated to be 140 to 160)

"Elastomer resin": epoxy modified styrene butadiene copolymer "Epofriend AT501" (epoxy compound of styrene butadiene block copolymer, manufactured by DAICEL Chemical Industry Co., Ltd., trade name)

"Epoxy-containing resin (2)": epoxy resin "Epikote 1010" (bisphenol A type, weight average molecular weight 5,500, manufactured by Mitsubishi Chemical Corporation, trade name) (the number of hydroxyl groups in one molecule is estimated to be 17) )

"Epoxy-containing resin (3)": epoxy resin "Epikote 1001" (bisphenol A type, weight average molecular weight 900, manufactured by Mitsubishi Chemical Corporation, trade name) (the number of hydroxyl groups in one molecule is estimated to be two) )

As shown in Tables 2 to 6, according to Examples 1 to 6 of the present invention, in the adhesive resin film based on maleic anhydride-modified polypropylene as a base resin (main component), it has one molecule by use. The majority of the hydroxyl group-containing epoxy group-containing resin (1) is compared with the case where only maleic anhydride is modified with polypropylene (Comparative Example 1), or the content of the hydroxyl group having a small number of molecules in one molecule is blended. In the case of the epoxy group-containing resin (2) (Comparative Example 2), a higher bonding strength can be obtained. In particular, it is known that the degree of Tm is the same as that of the MAH-PP used, and the adhesion strength at the time of heat sealing at a lower temperature of 140 ° C or 160 ° C is improved, and the low temperature is excellent for various adherends such as metal, glass, and plastic. Follow-up.

Claims (12)

An adhesive resin composition is an acid-modified polyolefin resin, and an epoxy resin compound having two or more epoxy groups in one molecule and having 10 or more hydroxyl groups in one molecule is an essential component. The adhesive resin composition of the first aspect of the invention, which comprises a graft copolymer obtained by graft-polymerizing an acid functional group of the acid-modified polyolefin resin with a hydroxyl group of the epoxy resin compound. . The adhesive resin composition of the first or second aspect of the invention, wherein the epoxy resin compound is contained in an amount of from 1 to 15 parts by weight based on 100 parts by weight of the solid content of the adhesive resin composition. The adhesive resin composition according to claim 1 or 2, wherein the acid-modified polyolefin resin is an acid-modified polypropylene resin. The adhesive resin composition of claim 3, wherein the acid-modified polyolefin resin is an acid-modified polypropylene resin. The adhesive resin composition according to claim 1 or 2, wherein the acid-modified polyolefin resin and the epoxy resin compound are melt-grafted. The adhesive resin composition according to claim 1 or 2, wherein the thermoplastic elastomer is further added in an amount of from 1 to 15 parts by weight based on 100 parts by weight of the solid content of the adhesive resin composition. Made of body resin. The adhesive resin composition of the third aspect of the invention, wherein the thermoplastic resin is further added in an amount of from 1 to 15 parts by weight based on 100 parts by weight of the solid content of the adhesive resin composition. Made. An adhesive resin molded body comprising a film or sheet formed of the adhesive resin composition of the first or second aspect of the patent application. An adhesive resin molded body comprising a film or sheet formed of the adhesive resin composition of the third application of the patent application. An adhesive resin laminate is formed by laminating at least one side of a substrate and laminating an adhesive resin layer formed of the adhesive resin composition of the first or second aspect of the patent application. An adhesive resin laminate is formed by laminating at least one side of a substrate and laminating an adhesive resin layer formed of the adhesive resin composition of the third application of the patent application.