TWI480935B - Techniques for glass attachment in an image sensor package - Google Patents

Description

Technique for attaching glass to an image sensor package

A continuation application of U.S. Patent Application Serial No. 12/136,033, entitled "Glass-On-Die Adhesion Method for Image Sensors", filed on June 9, 2008. Priority of the case, which is hereby incorporated by reference in its entirety in its entirety, the entire disclosure of the entire disclosure of the entire disclosure of the entire disclosure of the entire disclosure of The contents of each patent application are incorporated herein by reference.

Field of invention

The present invention generally relates to a wafer level package (WLP) method for bonding glass to a wafer substrate prior to dicing, and more particularly to packaging a complementary metal oxide semiconductor (CMOS) or charge coupled device ( A low cost method of CCD) type image sensor to protect the sensor from particulate contamination and stress damage during assembly.

Background of the invention

Particle contamination of the microlens or image sensor during assembly of the microelectronic optical module may cause the module to malfunction. The particles are as important as 90 percent of the yield loss during the camera module assembly process. The higher the resolution of the device, the more the yield loss due to the particles increases as the pixel size is smaller. For example, in a 3 million pixel sensor, the pixel size is less than 2 microns. If a particle can block more than one pixel without degrading image quality, the allowable particle size in this application is limited to 2 microns in diameter. In order to limit the number of particles of this size, it is required during the camera module assembly process. Strict particle control measurements are required to avoid yield loss. These particulate contamination measurements increase the cost of assembly operations.

The WLP method helps solve the contamination problem of the existing wafer direct packaging (COB) technology. This production improvement is achieved by protecting the active area of the sensor from contamination by using a glass layer prior to wafer cutting and placement. Since the particles falling on the top surface of the glass/lens are separated from the sensor by the thickness of the glass layer (typically 0.3 to 0.4 mm), the maximum allowable particle size can reach 25 microns in diameter without degrading image quality. . In addition, any unit that is inoperable due to particulate contamination of the glass surface can easily be recovered by focusing on it. This enables a wafer-level packaging approach to significantly increase the throughput of the camera module assembly process.

One of the currently used WLP methods (eg, Tressera's Shellcase CF) combines a wafer-sized glass plate on top of the chamber wall at the sensor side of the wafer to create an optical image above each sensor. Chamber. This step is followed by glass cutting and crystal back grinding. Finally, the wafer is cut into individual devices. Although this method shows superior to the COB method in terms of yield, it may generate high stress on the inner side of the siloxane, so that yield loss may occur.

Other WLP methods (eg, SCHOTT OPTO-WLP) also show advantages in production management. The first step in this method is to protect the sensitive active component construction by means of a glass cover. A specific adhesive wafer bonding method enables selective adhesive coverage in the bonding layer. In the next step, the combined decane-glass sandwich structure is thinned by the oxane side (back side). The next step is about etching the via into the helium The alkane side is such that the bond pads communicate to the back of the wafer, redistributing the connections to the back side of the wafer and the ball-attached contacts. The method thus requires the formation of vias/channels, multiple layers of wires/insulation materials, and many method steps that rely heavily on manual repetitive testing methods. As a result, when using this method, the lead time is very long and method instability may occur.

The present invention has been developed to eliminate the problems described in the background of the invention.

Summary of invention

The following embodiments, which are described and illustrated in conjunction with other systems, tools, and methods, are intended to be exemplary in nature and are not limited in scope. In various embodiments, one or more of the above problems may be alleviated or eliminated, while other embodiments are directed to other improvements.

A wafer level packaging method for a semiconductor image sensor device includes temporarily placing a wafer size glass plate on a glass wafer fixture; cutting the glass plate to produce a cut glass die, generally The upper system corresponds to a pattern on the processed wafer having a plurality of fabricated optical image sensors; attaching the chamber wall to the glass; aligning the glass wafer fixture with the processed wafer such that the cavity is provided The cut glass rim of the chamber wall is substantially aligned with the image sensor on the treated wafer; the chamber wall of the cut glass dies is bonded to the optical image sensor with an adhesive to produce An inductor-chamber wall-glass sandwich construction having an internal chamber; and loosening the cut glass die from the glass wafer fixture.

Temporarily placing a glass wafer onto a glass wafer fixture can be by dispensing a pattern of curable adhesive that substantially corresponds to the device wafer The image sensor pattern is done. The bonding step can include applying an adhesive to the cut glass dies, and the bonding step can include applying an adhesive to the image sensor surface. The adhesive can be a UV curable optical adhesive. The bonding step can include exposing the device-chamber wall-glass sandwich construction to UV light to cure the adhesive. The bonding step can include setting a distance between the image sensor and the cover glass.

The sensor-chamber wall-glass sandwich configuration can be cut into dies prior to loosening the configuration from the glass wafer fixture to create individual devices. The sensor-chamber wall-glass sandwich construction can also be cut into dies after the structure is released from the glass wafer fixture to create individual devices. The step of cutting the glass sheet includes an additional step of setting a push along the thickness dimension of the glass. The step of loosening the cut glass dies includes exposing the glass dies to the glass wafer fixture by exposure to UV light. The chamber wall can be attached to the glass sheet prior to cutting, and the chamber wall can also be attached to the glass sheet after cutting. The glass wafer holder can include a metal frame carrier on which a film having one of the adhesives is supported.

A wafer level packaging method for a semiconductor image sensor device includes temporarily placing a wafer size glass plate on a glass wafer fixture; cutting the glass plate to produce a cut glass die, which is generally Corresponding to a pattern on a processed wafer having a plurality of fabricated optical image sensors; attaching a chamber wall to the processed wafer; aligning the glass wafer fixture with the processed wafer such that The image sensor pattern is disposed on the processed wafer having the chamber wall substantially aligned with the cut glass dies; the cut glass dies are bonded to the optical image sensor with an adhesive a chamber wall to create a sensor-chamber wall-glass sandwich configuration having an internal chamber; and releasing the cut glass die from the glass wafer holder.

A wafer level packaging method for a semiconductor image sensor device includes temporarily placing a wafer size glass plate on a glass wafer fixture; cutting the glass plate to produce a cut glass die, which is generally Corresponding to a pattern on a processed wafer having a plurality of fabricated optical image sensors; aligning the glass wafer fixture with the processed wafer such that the cut glass grains are substantially aligned in the processed crystal a pattern of image sensors on a circle; bonding the cut glass dies to an optical image sensor with an adhesive to create a sensor-adhesive-glass sandwich construction; and releasing from the glass wafer holder The cut glass grain.

Temporarily placing the glass wafer onto the glass wafer fixture can be accomplished by dispensing a pattern of curable adhesive that substantially corresponds to the image sensor pattern on the device wafer. The bonding step can include applying an adhesive to the image sensor surface. The adhesive can be a UV curable optical adhesive. The bonding step can include exposing the device-adhesive-glass sandwich construction to UV light to cure the adhesive. The bonding procedure can include setting the distance between the image sensor and the glass cover. The sensor-adhesive-glass sandwich construction can be cut into dies prior to loosening the construction from the glass wafer fixture to create individual devices. The sensor-adhesive-glass sandwich construction can be cut into dies after the construction is released from the glass wafer fixture to create individual devices. The step of cutting the glass sheet can include an additional step of setting a push along the thickness dimension of the glass. The step of loosening the cut glass granules can include holding the glass dies The adhesive to the glass wafer fixture is exposed to UV light.

Further aspects and embodiments of the present invention will become apparent from the Detailed Description of the Drawing.

Simple illustration

The exemplary embodiments are shown in the drawings, which are intended to be illustrative and not limiting.

Figure 1A is a cross-sectional view showing an attachment step in which a wafer size glass is attached to a glass wafer holder located on a glass wafer carrier; Figure 1B shows application to the glass crystal a circular clamp to hold the adhesive pattern of the glass wafer; FIG. 2A shows that the glass wafer is cut into a predetermined shape by using a cutting device; FIG. 2B shows that one of the glass crystal grains can be cut by setting a push-out Step; Figure 2C shows a cross-sectional view of the cut glass wafer attached to the fixture; Figures 3A and 3B show a cross-sectional view of the flip glass wafer carrier, wherein the glass wafer holder and the cut glass wafer are A CMOS wafer having one of a plurality of image sensor devices is in an opposing relationship; FIG. 3A shows an embodiment in which the adhesive is applied to the image sensor; and FIG. 3B shows another embodiment in which the adhesive is applied Applied to the Cutting the glass dies; Figure 4 shows a cross-sectional view of the attached step of the turned-cut glass dies after it is aligned with the CMOS image sensor wafer; Figure 5 shows a cross-sectional view of the squeezing step, wherein The combined CMOS wafer and glass wafer are released from the glass wafer fixture; Figure 6A shows a cross-sectional view of the cutting step of an embodiment in which the glass-bonded CMOS image sensor device is on a glass wafer After the fixture is loosened, a die cutter is used for separation; FIG. 6B shows a cross-sectional view of a cut image sensor with glass bonded to the sensor; FIG. 7 is an alternative embodiment A cross-sectional view showing a portion of a wafer-sized glass attached to a UV dicing tape having a chamber wall attached to the opposite side of the glass; and FIG. 7A is a portion having an adhesive forming a chamber wall A perspective view of the glass wafer; FIG. 8 is a perspective view of the glass wafer cut by a saw blade of FIG. 7; and FIG. 9 shows a back grinding step in which one of the plurality of image sensors is crystallized Round system for crystal back grinding; Figure 10A Figure 10B shows the attachment of the cut glass to an image sensor wafer having a plurality of chamber walls using a glass support fixture; Figure 11 shows a release step in which the glass support fixture releases the cut glass; Figure 12 shows a wafer cutting step; Figure 13 is a cross-sectional view of a diced image sensor package having one of the image sensor substrates separated by a plurality of chamber walls to cover the glass.

Detailed description of the preferred embodiment

Reference will now be made to the accompanying drawings, which in the < Although the present invention is now primarily described as a method of attaching glass to an image sensor package, it should be expressly understood that the present invention is applicable to other wafer grades that require/desirable use of glass attachment. Package application. Alternatively, the material selection is not limited to glass, but any transparent material that can extend beyond the glass or that is partially reflective, such as anti-reflective, anti-static, and filter properties. As such, the following description of a method of attaching glass to an image sensor package is presented for display and illustrative purposes. In addition, the description is not intended to limit the invention to the disclosure. Therefore, the variations and modifications of the following description and the techniques and knowledge of the related art are within the scope of the invention. The embodiments described herein are further intended to explain the mode of carrying out the invention, and others skilled in the art will apply the invention to this or other embodiments, as well as the particular application or use of the invention. Various forms of correction.

The inventors have appreciated that a WLP method such as the Shellcase CF package in which the glass is cut after it is attached to the device wafer may result in device damage. This damage may be caused by mechanical stresses that are generated during wafer back grinding or cutting after the glass is attached to the device wafer. In addition, image sensors may be tired during the method of cutting glass The electrostatic discharge caused by the accumulation causes damage. Another method that can cause failure is the contamination of the electronic pad due to the glass debris generated during the glass wafer cutting step. The method proposed by the present invention aims to address these and other disadvantages.

The WLP method for a microelectronic image sensor device proposed by the present invention includes the step of attaching a thin cut glass plate to a wafer substrate at the beginning of the device packaging process. The glass cover provides support to the device during the die cutting step of wafer fabrication. In addition, the glass cover prevents particles from the surrounding environment from being embedded in the microlens or imaging device.

One embodiment of a glass attachment method relates to the application of image sensors (and microlenses) on a wafer. A glass wafer (e.g., 400 microns thick) is first temporarily placed into a glass wafer holder 12 (which may be transparent) assembled on a glass wafer carrier 14, as shown in Figure 1A. This temporary placement can be achieved by using a matrix 16 of dicing tapes that can be cured using ultra-ultraviolet light (UV), as shown in Figure 1B. This temporary placement can also be achieved using other adhesive materials. The pattern of the dicing tape conforms to the pattern of the image sensor wafer through which it can be fabricated to have a wider channel than the image sensor wafer. In other words, each of the adhesive dies has a footprint corresponding to the reduction of the image sensor dies.

The glass wafer 10 is then cut (to conform to the grain pattern on the image sensor) as shown in Figures 2A and 2C. Here, the glass pattern can be fabricated to have a narrower channel than the image sensor wafer. In other words, each of the glass dies has a footprint that is magnified by an image sensor die such that it exceeds the size of the image sensor but does not cover Electronic contact pad for image sensor devices. In addition, the edge 20 of the cover can be pushed slightly inward, as shown in Figure 2B, so that the surface bonded to the image sensor is larger than the opposite surface.

After being cleaned by the cut glass, the glass wafer carrier and the glass wafer holder holding the cut glass (shown as 22 together) are flipped and aligned so that the exposed surface of the cut glass faces the image. The wafer 24 is mirrored and mirrored by a pattern of image sensor devices on the wafer, as shown in Figures 3A and 3B. Producing a slightly enlarged cover allows this alignment step to be less sensitive to placement or alignment errors. The optical adhesive 26 is selectively applied to the image sensor wafer 24 such that it coats the individual optical image sensors and their corresponding microlenses (if applicable), leaving the surrounding uncoated electronic contacts Point, as shown in Figure 3A. The state of the method includes controlling the manner in which the adhesive is dispensed (pattern and number) and selecting an adhesive to minimize defects such as microbubbles remaining in the image sensor that can degrade image quality. In addition, since the adhesive will eventually come into contact with the external environment, the adhesive must also be resistant to heat and water.

In another embodiment, the optical adhesive 26 is applied to the cut glass rather than the image sensor/lens assembly, and then the glass die is combined with the image sensor wafer 24, as shown in FIG. 3B. Shown in . Adhesion agent 26 can be applied to the cut glass dies by one of methods such as spin coating. Since optical adhesives are relatively expensive and this method consumes more adhesive, this method can be modified to make it more economical.

The cut glass wafer is then bonded to an image sensor wafer (collectively referred to as 30) with no chambers as shown in FIG. Some adhesives The application size and bonding procedure can include the distance of the fixed glass from the image sensor surface and the creation of a glass/image sensor sandwich construction under specific parallel constraints. The optical image sensor wafer sandwich construction 30 is released from the glass wafer fixture 12 as shown in FIG. The curing of the adhesive and the release of the optical image sensor wafer sandwich construction 30 from the glass wafer holder 12 can be accomplished in the same step by judiciously selecting the UV wavelength or the particular temperature and exposure time.

The optical image sensor wafer sandwich construction 30 is then cut into grains using glass dies for support, as shown in Figure 6A. In an alternative embodiment, the cutting can be completed prior to loosening the sandwich construction from the glass wafer fixture. A representative image sensor 32 and a protective glass cover system are shown in Figure 6B. This wafer level packaging approach is believed to be an alternative to the lower cost of one of the wafer level packaging methods used in the industry today.

Alternatively, a cover glass can be attached to an image sensor via the chamber wall to create an internal chamber, as shown in Figures 7-13. As shown in Fig. 7, a glass sheet 50 is coated with a UV dicing tape 52 on one side and a plurality of chamber walls 54 attached to the other side of the glass sheet 50. The chamber walls can be cut by a LE-type anvil die, and an epoxy 56 is applied to the top surface of each chamber wall 54.

As shown in Figure 7A, the chamber walls 54 can be formed by using an adhesive film attached to the glass sheet prior to cutting.

Next, as shown in FIG. 8, the glass sheet 50 is cut into a plurality of cut glass dies 60 by a dicing saw blade 58 which are held together by a UV dicing tape 52. At the same time, as shown in Figure 9, a wafer 62 (on which A plurality of individual image sensors 64) are formed by a grinder 66 from its back side to back grind the tantalum wafer 62 to a desired thickness. Since this back grinding operation is performed on the tantalum wafer 62, it can be carried out before, during or after the step of applying the chamber wall 54 to the glass sheet 50 and cutting the glass sheet 50.

After this step, as shown in FIG. 10A, the cut glass dies 60 having the chamber walls 54 can align with the individual image sensors 64 on the ruthenium wafer 62. The cut glass die 60 is held in alignment with the tantalum wafer 62 by a glass wafer holder 70. The glass wafer holder 70 can be temporarily attached to the glass sheet 50 before, during, or after application of the chamber wall 54 and cutting it into individual glass dies 60. As shown in FIG. 10B, the glass wafer holder 70 and the tantalum wafer 62 are moved relative to one another such that the epoxy and tantalum wafer 62 on the chamber wall 54 are around the individual image sensor 64. Contact. This action bonds the chamber wall 54 to the tantalum wafer 62.

To release the glass wafer holder 70 from the assembly, a UV light source (not shown) provides UV light that causes the glass wafer holder 70 to release the cut glass die 60, as shown in FIG. The outer surface of the cut glass die 60 can now be cleaned (not shown). The tantalum wafer 62 is then slit at the outer side of the chamber wall 54 and the individual cut glass dies 60 using the same or different dicing saw blades 72, as shown in FIG. In this manner, the germanium wafer 62 is divided into individual image sensor packages 74, one of which is shown in FIG.

The foregoing description of the invention has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit the invention to the forms disclosed herein. Therefore, the variations and modifications of the above description and the related art and related art are within the scope of the present invention. The embodiments described herein are intended to be illustrative of the best mode for carrying out the present invention, and others skilled in the art will apply the invention to this or other embodiments, and Apply or use the various corrections you need. The scope of the appended claims is intended to be considered as an alternative embodiment of the scope of the invention.

10‧‧‧glass wafer

12‧‧‧Glass wafer fixture

14‧‧‧Glass Wafer Carrier

16‧‧‧Cutting Tape Matrix

20‧‧‧ cover edge

22‧‧‧Glass wafer carrier and glass wafer fixture

24‧‧‧Image Sensor Wafer

26‧‧‧Optical Adhesive

30‧‧‧Optical image sensor wafer sandwich construction

32‧‧‧Image Sensor

50‧‧‧Stainless glass

52‧‧‧UV cutting tape

54‧‧‧ chamber wall

56‧‧‧epoxy

58‧‧‧ cutting saw blade

60‧‧‧Cleaved glass grains

62‧‧‧矽 wafer

64‧‧‧Image sensor

66‧‧‧Cream

70‧‧‧Glass wafer fixture

72‧‧‧ cutting saw blade

74‧‧‧Image sensor package

Figure 1A is a cross-sectional view showing an attachment step in which a wafer size glass is attached to a glass wafer holder located on a glass wafer carrier; Figure 1B shows application to the glass crystal a circular clamp to hold the adhesive pattern of the glass wafer; FIG. 2A shows that the glass wafer is cut into a predetermined shape by using a cutting device; FIG. 2B shows that one of the glass crystal grains can be cut by setting a push-out Step; Figure 2C shows a cross-sectional view of the cut glass wafer attached to the fixture; Figures 3A and 3B show a cross-sectional view of the flip glass wafer carrier, wherein the glass wafer holder and the cut glass wafer are A CMOS wafer having one of a plurality of image sensor devices is in an opposing relationship; FIG. 3A shows an embodiment in which the adhesive is applied to the image sensor; Figure 3B shows another embodiment in which the adhesive is applied to the cut glass dies; Figure 4 shows the attachment steps of the inverted cut glass dies after they are aligned with the CMOS image sensor wafer. Figure 5 shows a cross-sectional view of a release step in which the bonded CMOS wafer and glass wafer are released from the glass wafer holder; Figure 6A shows a cross-sectional view of the cutting step of one embodiment The glass-incorporated CMOS image sensor device is separated by a die cutter after being released from the glass wafer jig; FIG. 6B shows a cross-sectional view of the cut image sensor having a glass bond To the sensor; FIG. 7 is a cross-sectional view of an alternative embodiment showing a wafer size glass attached to the UV dicing tape and having the chamber wall attached to the opposite side of the glass a part; FIG. 7A is a perspective view of a glass wafer having an adhesive forming a chamber wall; and FIG. 8 is a perspective view of the glass wafer cut by a saw blade of FIG. 7; Showing a back grinding step with One of the plurality of image sensors is subjected to crystal back grinding; FIGS. 10A and 10B show the attachment of the cut glass to the image sensor wafer having a plurality of chamber walls using a glass support jig; Figure 11 shows a release step in which the glass support fixture releases the cut glass; Figure 12 shows a wafer cutting step; Figure 13 is a cross-sectional view of a cut image sensor package having one of the image sensor substrates separated by a plurality of chamber walls to cover the glass.

10‧‧‧glass wafer

12‧‧‧Glass wafer fixture

14‧‧‧Glass Wafer Carrier

16‧‧‧Cutting Tape Matrix

Claims (49)

A wafer level packaging method for a semiconductor image sensor device, comprising: temporarily placing a glass plate of substantially one wafer size onto a glass wafer fixture; singulating the glass plate to generate a general body a singulated glass slab corresponding to a pattern on a processed wafer having a plurality of fabricated optical image sensors; attaching a plurality of chamber walls to the glass; The wafer holder is aligned with the processed wafer such that the singulated glass dies having the chamber walls are substantially aligned with the pattern of the image sensors on the processed wafer; An adhesive bonding the chamber walls of the singulated glass dies to the optical image sensors to produce a sensor-chamber wall-glass sandwich construction having an internal chamber; The glass wafer fixture releases the singulated glass dies. The method of claim 1, wherein the bonding step comprises applying an adhesive to the singulated glass granules. The method of claim 1, wherein the bonding step comprises applying an adhesive to the surface of the image sensor. The method of claim 1, wherein the adhesive used in the bonding step is a UV curable optical adhesive. The method of claim 4, wherein the bonding step comprises exposing the sensor-chamber wall-glass sandwich structure to UV light to stabilize the adhesive Chemical. The method of claim 1, wherein the combining step comprises setting a distance between the image sensors and the singulated glass dies. The method of claim 1 wherein the sensor-chamber wall-glass sandwich construction is diced into dies prior to release from the glass wafer holder to produce individual devices. The method of claim 1, wherein the sensor-chamber wall-glass sandwich construction is cut into dies after being released from the glass wafer holder to produce individual devices. The method of claim 1, wherein the step of singulating the glass sheet comprises the additional step of setting a tap along the thickness dimension of the glass. The method of claim 1, wherein the step of loosening the singulated glass granules comprises exposing the singulated glass slab to one of the glass wafer holders to expose the adhesive to UV light. The method of claim 10, wherein: the sensor-chamber wall-glass sandwich construction of the adhesive is a UV curable optical adhesive; the bonding step comprises the sensor-chamber wall-glass The sandwich structure is exposed to UV light to cure the adhesive; and the step of exposing the curable adhesive to the UV light to the monolithic glass die to the glass wafer holder and the sensor - The steps of the chamber wall-glass sandwich construction exposed to UV light occur simultaneously. The method of claim 1, wherein the chamber walls are attached to the glass sheet prior to singulation. The method of claim 1, wherein the chamber walls are attached to the singulated glass dies after singulation. The method of claim 1, wherein the glass wafer holder comprises a metal frame carrier supporting a film having an adhesive thereon. The method of claim 1, wherein the chamber walls are die cut. The method of any one of claims 1 to 15, wherein the glass sheet is temporarily disposed on the glass wafer holder by dispensing an image sensor pattern substantially corresponding to the processed wafer. A pattern of curable adhesive is achieved. The method of claim 16, wherein the pattern of the curable adhesive holding the glass sheet to the glass wafer holder is a two-dimensional matrix. The method of claim 17, wherein the step of dispensing the pattern of the curable adhesive comprises applying a dicing tape in accordance with the image sensor pattern. A wafer level packaging method for a semiconductor image sensor device, comprising: temporarily placing a glass plate of substantially one wafer size onto a glass wafer fixture; attaching a plurality of chamber walls to The glass sheet; the glass sheet is singulated to produce a singulated glass slab, each dies having a plurality of chamber walls that generally correspond to a pattern on a treated wafer, the processed wafer having a plurality of a fabricated optical image sensor; aligning the glass wafer holder with the processed wafer such that the singulated glass dies having the chamber walls are substantially associated with the processed wafer Aligning the patterns of the image sensors; Combining the chamber walls of the singulated glass dies with the optical image sensors with an adhesive to create a sensor-chamber wall-glass sandwich construction having an internal chamber; The singulated glass dies are loosened from the glass wafer fixture. The method of claim 19, wherein the chamber walls are attached to the glass sheet prior to placing the glass sheet on the glass wafer holder. The method of claim 19, wherein the chamber walls are attached to the glass sheet after the glass sheet is placed on the glass wafer holder. The method of claim 19, wherein the glass wafer holder comprises a metal frame carrier supporting a film having an adhesive thereon. The method of claim 19, wherein the chamber walls are die cut. The method of claim 19, wherein the step of releasing the singulated glass slab comprises: exposing the singulated glass slab to one of the glass wafer holders to expose the curable adhesive to UV light; The adhesive-chamber wall-glass sandwich construction of the adhesive is a UV curable optical adhesive; the bonding step includes exposing the sensor-chamber wall-glass sandwich construction to UV light to cause the adhesive Curing; and exposing the curable adhesive to the UV light to the monolithic glass dies on the glass wafer holder and exposing the sensor-chamber wall-glass sandwich structure to UV light The steps occur simultaneously. The method of any one of claims 19 to 24, wherein temporarily placing the glass sheet on the glass wafer holder is substantially corresponding by dispensing One of the image sensor patterns on the processed wafer can be achieved by curing the pattern of the adhesive. The method of claim 25, wherein the pattern of the curable adhesive holding the glass sheet to the glass wafer holder is a two-dimensional matrix. The method of claim 26, wherein the step of dispensing the pattern of the curable adhesive comprises applying a dicing tape in accordance with the image sensor pattern. A wafer level packaging method for a semiconductor image sensor device, comprising: temporarily placing a glass plate of substantially one wafer size onto a glass wafer fixture; singulating the glass plate to generate a a singulated glass die substantially corresponding to a pattern on a processed wafer having a plurality of fabricated optical image sensors; attaching a plurality of chamber walls to the processed crystal Circularly aligning the glass wafer holder with the processed wafer such that the singulated glass dies are substantially associated with the image sensors on the processed wafer having the chamber walls Pattern alignment; combining the singulated glass dies with the chamber walls associated with the optical image sensors with an adhesive to create a sensor-chamber wall having an interior chamber a glass sandwich construction; and releasing the singulated glass dies from the glass wafer fixture. The method of claim 28, wherein the glass wafer holder comprises a metal frame carrier supporting a film having an adhesive thereon. The method of claim 28, wherein the chamber walls are die cut. The method of claim 28, wherein the step of releasing the singulated glass slab comprises exposing the singulated glass slab to an adhesive of the glass wafer fixture to the UV light; the sensor The chamber wall-glass sandwich construction of the adhesive is a UV curable optical adhesive; the bonding step includes exposing the sensor-chamber wall-glass sandwich construction to UV light to cure the adhesive; And the step of exposing the curable adhesive to the UV light to the monolithic glass substrate on the glass wafer holder and exposing the sensor-chamber wall-glass sandwich structure to UV light At the same time. The method of any one of clauses 28 to 31, wherein temporarily placing the glass sheet on the glass wafer holder is by dispensing an image sensor pattern substantially corresponding to the processed wafer A pattern of curable adhesive is achieved. The method of claim 32, wherein the pattern of the curable adhesive holding the glass sheet to the glass wafer holder is a two-dimensional matrix. The method of claim 33, wherein the step of dispensing the pattern of the curable adhesive comprises applying a dicing tape in accordance with the image sensor pattern. A wafer level packaging method for a semiconductor image sensor device, comprising: temporarily placing a substantially wafer size glass plate on a glass wafer fixture; singulating the glass plate to generate a Monolithic glass grains, which are substantially Corresponding to a pattern on a processed wafer having a plurality of fabricated optical image sensors; aligning the glass wafer holder with the processed wafer such that the monocrystalline glass crystal The particles are substantially aligned with the pattern of the image sensors on the processed wafer; the singulated glass is adhered to the optical image sensor in contact with the singulated glass slab The dies are combined with the optical image sensors to produce a sensor-adhesive-glass sandwich construction; the singulated glass dies are released from the glass wafer fixture. The method of claim 35, wherein the bonding step comprises applying an adhesive to the singulated glass granules. The method of claim 35, wherein the bonding step comprises applying an adhesive to the surface of the image sensor. The method of claim 35, wherein the adhesive used in the bonding step is a UV curable optical adhesive. The method of claim 38, wherein the bonding step comprises exposing the sensor-adhesive-glass sandwich construction to UV light to cure the adhesive. The method of claim 35, wherein the combining step comprises setting a distance between the image sensors and the singulated glass dies. The method of claim 35, wherein the sensor-adhesive-glass sandwich construction is cut into dies prior to release from the glass wafer holder to produce individual devices. The method of claim 35, wherein the sensor-adhesive-glass sandwich The fabrication is cut into dies after being released from the glass wafer fixture to create individual devices. The method of claim 35, wherein the step of singulating the glass sheet comprises the step of providing a push along the thickness dimension of the glass. The method of claim 35, wherein the step of releasing the singulated glass slab comprises exposing the adhesive to the UV ray by holding the singulated glass slab to the glass wafer holder. The method of claim 44, wherein: the sensor-adhesive-glass sandwich construction of the adhesive is a UV curable optical adhesive; the bonding step comprising the sensor-adhesive-glass sandwich construction Exposing to UV light to cure the adhesive; and exposing the adhesive to the UV light by holding the glass die on the glass wafer holder and exposing the sensor-adhesive-glass sandwich construction The steps in the UV light occur simultaneously. The method of claim 35, wherein: the image sensors each comprise a microlens array formed thereon; and the adhesive and the microlenses of the image sensor and the singulated glass Grain contact. The method of any one of claims 35 to 46, wherein temporarily disposing the glass sheet to the glass wafer holder is achieved by dispensing a pattern of a curable adhesive, the pattern of the curable adhesive being substantially The image corresponds to the image sensor pattern on the processed wafer. The method of claim 47, wherein the pattern of the curable adhesive holding the glass sheet to the glass wafer holder is a two-dimensional matrix. The method of claim 48, wherein the step of dispensing the pattern of the curable adhesive comprises applying a dicing tape in accordance with the image sensor pattern.