TWI480777B - Touch the substrate - Google Patents

Description

Touch substrate

The invention relates to a touch substrate, in particular to a touch substrate with good adhesion between components.

Referring to FIG. 1 , a schematic diagram of a touch panel 10 is applied to a touch screen 10 . Around the touch substrate is a circuit structure 10 b of the touch screen.

Referring to FIG. 2, it is a partial view of the touch substrate of FIG. 1. The conventional touch substrate includes a plate substrate 11, a transparent conductive layer 12, a plurality of metal bridge wires 13, and a plurality of patterned insulating layers 14.

The transparent conductive layer 12 includes a plurality of first sensing pads 121 formed on the surface of the plate-like substrate 11 and arranged in a matrix, and a plurality of second sensing pads arranged in a matrix and spaced apart from the first sensing pads 121 respectively. 122, and a plurality of bridging structures 123 extending longitudinally and respectively connecting two adjacent second sensing pads 122.

The metal bridge wires 13 extend laterally and respectively connect two adjacent first sensing pads 121, and the patterned insulating layers 14 are respectively sandwiched between the metal bridge wires 13 and the bridge structures 123. The bridge structure 123 is isolated from the metal bridge wires 13. The first sensing pads 121 are equivalent to the metal bridge wires 13 to form a plurality of sense lines in a row and extending in a lateral direction. The second sensing pads 122 and the bridge structures 123 become a plurality of strips. The sensing lines are arranged in a row and extending in the longitudinal direction, and the first sensing pads 121 and the second sensing pads 122 are electrically connected to the external circuit structure 10b.

The patterned insulating layer 14 is defined by the upper metal bridge line 13 and the lower bridge structure 123 as a plurality of touch capacitors arranged in an array.

When one of the touch capacitors is touched, the capacitance value of the touch capacitor changes and is transmitted through the circuit and converted into an electrical signal.

When a conventional touch substrate is combined with a liquid crystal screen to form a touch display, the plate substrate of the touch substrate is mainly attached to the surface of the color filter touch substrate of the liquid crystal screen. The outermost layer of the color filter touch substrate and the plate substrate of the touch substrate to be bonded thereto are generally glass plate-shaped substrates, and are laminated to form a double-layer glass plate substrate for supporting purposes. The disadvantage that the display is too heavy and the production cost cannot be effectively reduced.

In order to solve the above problems, the outermost layer of the color filter touch substrate using the completed liquid crystal screen is developed as a plate-shaped substrate of the touch substrate, and a transparent transparent conductive material is sequentially formed thereon. A conductive layer, a patterned insulating layer of dielectric material, and a patterned metal bridge. Among them, since the encapsulating liquid of the packaged liquid crystal screen can withstand the temperature up to 120 ° C, the conductive material, the dielectric material and the metal to be formed into the touch substrate must be a low temperature curing material. Moreover, the metal bridge wires are formed by forming a comprehensive metal layer, and then removing the unnecessary portions through the process of wet etching such as yellow lithography and immersion in an etchant to become a plurality of metal bridge wires.

However, since the structure of the transparent conductive material is looser than that of the glass, the corrosion resistance of the transparent conductive material immersed in the metal etchant (for example, an aluminum etchant, also referred to as aluminate in the industry) is lower than that of the glass. The degree of adhesion between the patterned insulating layer composed of a low-temperature curing dielectric material and the transparent conductive material as shown in FIG. 3 is significantly lower than that of the patterned insulating layer and glass composed of a low-temperature curing dielectric material as shown in FIG. The degree of adhesion between the plate-like substrates causes a phenomenon of peeling and warping at the joint edges of the patterned insulating layer and the electrode sheet or the patterned insulating layer and the bridge structure, resulting in a good touch substrate. The problem of low rates.

In order to improve this problem, the inventors of the present invention have an object of providing a touch substrate having excellent adhesion between components.

Thus, the touch substrate of the present invention comprises a plate-like substrate, a plurality of first sensing series, a plurality of second sensing series, and a plurality of patterned insulating layers.

The first sensing series is laterally arranged on the plate-like substrate and includes a plurality of metal bridge wires formed in a matrix array on the substrate, and a plurality of the second adjacent metal bridge wires are respectively laterally connected A sensing pad.

The second sensing series is longitudinally formed on the plate-shaped substrate and interlaced with the first sensing series into a grid shape, and includes a plurality of matrix arrays arranged at intervals and alternately arranged in the first senses. A second sensing pad between the pads, and a plurality of bridging structures respectively connecting the two adjacent second sensing pads in a longitudinal direction.

The patterned insulating layers are formed upwardly from the plate substrate and sandwiched between the metal bridge wires and the bridge structure to isolate the first sensing series and the second sensing series.

Furthermore, another touch substrate of the present invention comprises a plate substrate, a plurality of first sensing series, a plurality of second sensing series, and a plurality of patterned insulating layers.

The first sensing series is laterally arranged on the plate-shaped substrate, and includes a plurality of first sensing pads formed on the substrate in a matrix arrangement, and most of the two are laterally connected to each other. The first metal bridge wire of the sensing pad.

The second sensing series is longitudinally formed on the plate-shaped substrate and interlaced with the first sensing series into a grid shape, and includes a plurality of matrix arrays arranged at intervals and alternately arranged in the first a second sensing pad between the sensing pads, a plurality of bridging structures respectively longitudinally located between the two adjacent second sensing pads and spanning the first metal bridge wires, and a plurality of respectively electrically connected adjacent bridges The second metal bridge wire of the structure and the second sensing pad.

The patterned insulating layers are respectively formed from the plate-like substrate and covered with the bridge structures, and the first sensing series and the second sensing series are respectively isolated.

In addition, the touch substrate of the present invention comprises a plate-shaped substrate, a plurality of first sensing series, a plurality of second sensing series, and a plurality of patterned insulating layers.

The first sensing series is laterally arranged on the plate-shaped substrate, and includes a plurality of first sensing pads formed on the substrate in a matrix arrangement, and most of the two are laterally connected to each other. The metal bridge wiring of the sensing pad.

The second sensing series is longitudinally formed on the plate-shaped substrate and interlaced with the first sensing series into a grid shape, and includes a plurality of matrix arrays arranged at intervals and alternately arranged in the first A second sensing pad between the sensing pads, and a plurality of bridging structures respectively connecting the two adjacent second sensing pads in a longitudinal direction.

The patterned insulating layers respectively include a layer sandwiched between the bridge structures and the metal bridge wires for spacing the bridge structures from the metal bridge wires, and a plurality of layers respectively formed on the plate substrate And extending independently from the layer body to an extension of a gap between the adjacent first sensing pad and the second sensing pad.

The effect of the invention is to increase the patterned insulating layer and the plate shape by increasing the contact area between the patterned insulating layer and the plate-like substrate, and the edge of the patterned insulating layer is completely connected to the plate-shaped substrate. The adhesion between the substrates further improves the reliability of the entire touch substrate.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of FIG.

Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.

Since the relative position of the touch substrate and the circuit structure 10b is similar to the current structure when the touch substrate of the present invention is applied to the touch screen, the first, second, and third preferred embodiments described below can still be referred to FIG. A schematic view of the top view. In other words, FIG. 1 is a schematic top view of a first preferred embodiment of the touch substrate 20 applied to a touch screen 10, and surrounding the touch substrate is a circuit structure of the touch screen. 10b.

5 and FIG. 6, FIG. 5 is a partial plan view of the first preferred embodiment, and FIG. 6 is a partial cross-sectional view of the first preferred embodiment. The first preferred embodiment of the touch substrate of the present invention is electrically connected to the external circuit structure 10b (FIG. 1), and includes a plate substrate 21, a plurality of first sensing serials 22, and a plurality of second sensing strings. Line 23, and a plurality of patterned insulating layers 24.

The plate-like substrate 21 is used as a support for subsequent support. Preferably, the plate-like substrate 21 is a plate body made of glass as a main material. In the first preferred embodiment described below, a plate body made of the plate-like base material 21 as a glass will be described.

The first sensing series 22 are laterally arranged on the plate-like substrate 21 and include a plurality of metal bridge wires 221, and a plurality of first sensing pads 222 respectively connected to two adjacent metal bridge wires 221 .

The metal bridge wires 221 are formed in a matrix arrangement on the surface of the plate-like substrate 21, and the metal bridge wires 221 extend laterally and are elongated. The metal bridge wires 221 are made of a material such as aluminum or copper, but are not limited thereto, and only need to be a conductive metal material.

The first sensing pads 222 are arranged in a matrix between two laterally adjacent metal bridge wires 221, and the two sides of each of the first sensing pads 222 respectively cover a part of the surface of the metal bridge wires 221 on both sides. And a portion of the surface of the insulating layer 24 is patterned, and the two sides of the first sensing pads 222 are laterally connected to the adjacent two metal bridge wires 221, respectively. In more detail, each of the first sensing pads 222 includes a layer of body 223, and two connecting posts 224 extending from the layer body 223 to the two metal bridge wires 221 respectively located at the two sides.

The second sensing series 23 are longitudinally formed on the plate-like substrate 21 and interlaced with the first sensing series 22 in a grid shape, and include a plurality of second sensing pads 231, and a plurality of connections The bridging structure 232 of the two adjacent second sensing pads 231.

The second sensing pads 231 are arranged in a matrix and are alternately arranged in a staggered manner between the first sensing pads 222, and the second sensing pads 231 are respectively located in the longitudinal direction of the metal bridge wires 221 And the lower sides.

In the first preferred embodiment, the first sensing pads 222 and the second sensing pads 231 are diamond-shaped, but not limited to diamonds, and may also be geometric shapes such as circles, rectangles, and polygons. Just arrange in a matrix.

The bridging structures 232 extend longitudinally and are respectively connected to two second sensing pads 231 adjacent in the longitudinal direction, and are respectively crossed across the metal bridge wires 221 .

The patterned insulating layers 24 are respectively formed upward from the plate-like substrate 21 and sandwiched between the metal bridge wires 221 and the bridge structure 232 to isolate the first and second sensing series 22, 23, The patterned insulating layer 24 is correspondingly formed over the metal bridge lines 221. Each patterned insulating layer 24 forms a layered structure from a plane formed by each of the metal bridge wires 221 and the plate-like substrate 21 adjacent to the metal bridge wire 221, and the patterned insulating layer 24 is made of a dielectric material. Composition.

Preferably, when the touch substrate of the first preferred embodiment is directly formed on the surface of the touch screen, the patterned insulating layer 24 is mainly composed of a dielectric material that can be cured at a temperature not higher than 120 ° C.

In more detail, when the touch screen is applied to the first preferred embodiment, the first preferred embodiment further includes a color filter film (not shown) formed on the bottom surface of the plate substrate 21, and The plate-like substrate 21 collectively constitutes a color filter touch substrate. Wherein, the touch screen is formed by forming the color filter film on the bottom surface of the plate substrate 21 and packaging it into a conventional type screen, and forming a first surface opposite to the top surface of the plate substrate 21; The two sense serials 22, 23 and the patterned insulating layer 24. Therefore, the patterned insulating layer 24 needs to be matched with a dielectric material which can be cured at a temperature not higher than 120 ° C without damaging the package adhesive of the screen.

That is, one of the connecting posts 224 of each of the first sensing pads 222 extends from one side of the layer body 223 to the metal bridge wire 221 on the same side of the first sensing pad 222, and The metal bridge wire 221 is electrically connected; the other connection post 224 extends from the other side of the layer body 223 to the metal bridge wire 221 on the same side of the first sensing pad 222 to be bridged with the metal The wires 221 are electrically connected, and in the first preferred embodiment, the patterned insulating layers 24 are respectively extended below the first sensing pads 222, and the connecting posts 224 of the first sensing pads 222 are connected. The patterned insulating layers 24 are first passed through and then extended to the metal bridge wires 221.

The patterned insulating layers 24 are respectively sandwiched between the metal bridge wires 221 and the bridge structures 232, and the bridge structures 232 are connected to the metal bridge wires 221 by the patterned insulating layers 24. They are spaced apart, and each of the metal bridge wires 221 and the patterned insulating layer 24 and the bridge structure 232 above thereof define a touch capacitance.

Preferably, the first sensing pads 222, the second sensing pads 231, and the bridging structures 232 are transparent conductive materials, so when applied to a touch display, the image of the lower liquid crystal screen is not Obscured. More preferably, the first sensing pads 222, the second sensing pads 231, and the bridging structures 232 are transparent metal oxides while having good electrical conductivity and transparency. In the first preferred embodiment, the first sensing pads 222, the second sensing pads 231, and the bridging structures 232 are indium tin oxide.

The first metal bridges 221 and the first sensing pads 222 are laterally connected to form a row of electrical conduction paths, and the bridge structures 232 are longitudinally connected to the second sensing pads 231 to form a row of conductances. Passing the path, and the first sensing series 22 and the second sensing series 23 are interlaced into a grid shape, and the first sensing serials 22 and the second sensing serials 23 are The intersection defines a plurality of touch capacitors that are electrically connected to each other.

When one of the touch capacitors is touched, the capacitance value of the touch capacitor changes, and is converted into an electrical signal by an external circuit and transmitted.

The manufacturing process of the first preferred embodiment is to form a plurality of metal bridge wires 221 by using a yellow light lithography process and an etching process on the plate substrate 21, and sequentially forming the patterned insulating layers 24, and The first and second sensing series 22, 23 and the bridging structure 232 composed of the same transparent conductive material, although the metal bridge wiring 221 is formed, it is necessary to immerse the plate-like substrate 21 in the lithography for etching metal after the yellow lithography. The etchant is subjected to a wet etching process, but the first and second sensing series 22, 23 and the bridge structure 232 formed by the patterned insulating layer 24 and the transparent conductive material are formed after the metal bridge lines 221 are formed. The order is formed so that it is not immersed in the etchant that etches the metal. Therefore, the transparent conductive material can be prevented from being eroded by the etchant of the etched metal, and the first and second sensing series 22, 23 and the bridge structure 232 formed of the transparent conductive material can be prevented, and the patterned insulating layer 24 composed of the dielectric material can be provided. It has good adhesion and becomes a reliable touch substrate.

It is to be noted that the touch substrate of the present invention may further include a protective layer 25 formed from the substrate and covering the first sensing serials 22 and the second sensing serials. 23, and the patterned insulating layer 24, such that the first sensing series 22, the second sensing series 23, and the patterned insulating layer 24 are isolated from the outside.

Referring to FIG. 1 , FIG. 7 and FIG. 8 , FIG. 1 is a schematic top view of a second preferred embodiment of the touch substrate 20 applied to a touch screen 10 . The touch screen is surrounded by the touch screen. Circuit structure 10b. Figure 7 is a partial top plan view of the second preferred embodiment, and Figure 8 is a partial cross-sectional view of the second preferred embodiment.

The second preferred embodiment is electrically coupled to the external circuit structure 10b and includes a plate substrate 31, a plurality of first sensing series 32, a plurality of second sensing series 33, and a plurality of patterned insulating layers 34. .

The plate-like substrate 31 is used as a support for subsequent support. Preferably, the plate-like substrate 31 is made of glass as a main material.

The first sensing series 32 are formed on the plate-shaped substrate 31 in a laterally aligned manner, and include a plurality of first sensing pads 321 and a plurality of first metal connecting the two adjacent first sensing pads 321 Bridge wiring 322.

The first sensing pads 321 are formed on the surface of the plate-like substrate 31 and arranged in a matrix.

The first metal bridge wires 322 are respectively connected to two first sensing pads 321 adjacent in the lateral direction.

The second sensing series 33 are longitudinally formed on the plate-like substrate 31 and are interlaced with the first sensing series 32 in a grid shape. The second sensing series 33 includes a plurality of second sensing pads 331 arranged in a matrix and spaced apart from each other between the first sensing pads 321 . The pad 331 has a bridging structure 332 for the first metal bridge wires 322 to cross, and a plurality of second metal bridge wires 333 for electrically connecting the adjacent bridge structures 332 and the second sensing pads 331 respectively.

The second sensing pads 331 are formed on the surface of the plate-like substrate 31 and arranged in a matrix, and are arranged alternately between the first sensing pads 321 .

The bridging structures 332 extend in the same direction in the longitudinal direction and are formed on the surface of the plate-like substrate 31. The bridging structures 332 are respectively located between the two second sensing pads 331 adjacent in the longitudinal direction, and are also located in the lateral direction. Between adjacent first sensing pads 321 and spaced apart from the first sensing pads 321 and the second sensing pads 331 respectively, and the first metal bridge wires 322 are respectively crossed and placed thereon. .

The second metal bridge wires 333 are vertically spanned and electrically connected to the adjacent second sensing pads 331 and the bridge structures 332, respectively, for each second sensing series 33 to be electrically conducted. And preferably, each second metal bridge wire 333 has a layer of body 334, and a connecting post 335 extending from the layer body 334 to the nearest bridge structure 332, the longitudinally adjacent bridge structure 332 and the second sense The pads 331 are electrically connected through the second metal bridge wires 333.

In the second preferred embodiment, the first sensing pads 321 and the second sensing pads 331 are diamond-shaped, but not limited to diamonds, and may also be geometric shapes such as circles, rectangles, and polygons. Just arrange in a matrix.

Preferably, the first sensing pads 321 , the second sensing pads 331 , and the bridging structures 332 are transparent conductive materials, so when the second preferred embodiment is applied to a touch display, The image of the LCD screen under the touch substrate is not obscured. More preferably, the first sensing pads 321 , the second sensing pads 331 , and the bridging structures 332 are transparent metal oxides, and at the same time have good electrical conductivity and transparency. In the second preferred embodiment, the first sensing pads 321 , the second sensing pads 331 , and the bridging structures 332 are indium tin oxide.

The patterned insulating layers 34 are formed from the surface of the plate-like substrate 31 and covered with the bridging structures 332, such patterned insulating layers 34 and adjacent first sensing pads 321 and second sensing. The pads 331 are spaced apart from each other and are in contact with each other, and the patterned insulating layers 34 are spaced apart from the first sensing series 32 and the second sensing series 33, respectively.

The patterned insulating layer 34 is made of a dielectric material. Preferably, when the touch substrate of the second preferred embodiment is directly formed on the surface of the liquid crystal screen, the patterned insulating layer 34 is not higher than 120 ° C. The curable dielectric material is mainly composed. The second preferred embodiment further includes a color filter film (not shown) formed on the bottom surface of the plate-like substrate 31, and forms a color filter touch substrate together with the plate-like substrate 21. Wherein, the touch screen is formed by forming the color filter film on the bottom surface of the plate substrate 31 and packaging it into a conventional screen, and forming a first surface opposite to the top surface of the plate substrate 31. The second sensing series 32, 33, and the patterned insulating layer 34. Therefore, the patterned insulating layer 34 needs to be matched with a dielectric material which can be cured at a temperature not higher than 120 ° C without damaging the package adhesive of the screen.

In the second preferred embodiment, the first metal bridge wires 322 and the second metal bridge wires 333 are made of aluminum or copper, but not limited thereto, and only need to be a conductive material.

Each of the bridging structures 332, the patterned insulating layer 34 covering the bridging structure 332, and the first metal bridge line 322 disposed on the patterned insulating layer 34 form a touch capacitor.

The first metal bridge wires 322 and the first sensing pads 321 are laterally connected to form a row of electrical conduction paths, the bridge structures 332, the second metal bridge wires 333, and the second sensing The pads 331 are connected in a longitudinal direction to form a row of electrical conduction paths, and at the intersection of the first sensing series 32 and the second sensing series 33, a plurality of touch capacitors electrically connected to each other are defined.

When one of the touch capacitors is touched, the capacitance value of the touch capacitor changes, and is converted into an electrical signal by an external circuit and transmitted.

In the second preferred embodiment, the first sensing pad 321 , the second sensing pad 331 and the bridge structure 332 are formed by forming a transparent conductive material, and the patterned insulating layers 34 are sequentially formed, and the first , two metal bridge wiring 322, 333. Since the patterned insulating layers 34 are respectively formed on the surface of the plate-like substrate 31 by covering the bridging structures 332, the periphery of each of the patterned insulating layers 34 is connected to the plate-shaped substrate 31 and does not contact the same. The first sensing pad 321 and the second sensing pad 331 can prevent the etchant used for etching the metal from eroding the structure of the bridging structure 332 to cause poor adhesion between the patterned insulating layer 34 and the bridging structure 332. The resulting cracking, which in turn becomes a touch substrate with excellent reliability and yield.

It should be noted that the second preferred embodiment may further include a protective layer 35. The protective layer 35 is formed from the plate-like substrate 31 and covers the first sensing series 32, the second sensing series 33, and the patterned insulating layer 34, so that the first layer A sense serial 32, the second sense series 33, and the patterned insulating layers 34 are isolated from the outside.

Referring to FIG. 1 and FIG. 9 , FIG. 1 is a schematic top view of a touch control screen 10 according to a third preferred embodiment of the present invention. The circuit around the touch substrate is a circuit of the touch screen. Structure 10b. FIG. 9 is a partial top plan view of the third preferred embodiment. The third preferred embodiment is electrically connected to the external circuit structure 10b and includes a plate-shaped substrate 41, a plurality of first sensing series 42, and a majority. The second sensing series 43, and a plurality of patterned insulating layers 44.

The plate-like substrate 41 is used as a support for subsequent support. Preferably, the plate-like substrate 41 is made of glass as a main material.

The first sensing series 42 are respectively laterally arranged on the plate-shaped substrate 41 and include a plurality of first sensing pads 421 and a plurality of metal bridge wires 422 connecting the two adjacent first sensing pads 421.

The first sensing pads 421 are formed on the surface of the plate-like substrate 41 and arranged in a matrix.

The metal bridge wires 422 extend in a lateral direction and are respectively laterally connected to two adjacent first sensing pads 421 to form a plurality of lateral rows of first sensing series 42. The metal bridge wires 422 are made of aluminum or copper. The material is composed of, but not limited to, a metal conductive material.

The second sensing series 43 are vertically arranged on the plate-shaped substrate 41, and are staggered with the first sensing series 42 to form a grid shape, and include a plurality of second sensing pads 431. And a plurality of bridging structures 432 connecting two adjacent second sensing pads 431.

The second sensing pads 431 are formed on the surface of the plate-like substrate 41 and arranged in a matrix, and are alternately arranged between the first sensing pads 421 in a staggered manner.

The bridging structures 432 are formed on the surface of the plate-like substrate 41 in the same direction, and are respectively connected to the two adjacent second sensing pads 431, and the bridging structures 432 are respectively adjacent to the lateral direction. The first sensing pads 421 are spaced apart, and the metal bridge wires 422 located above are respectively crossed across.

In the third preferred embodiment, the first sensing pads 421 and the second sensing pads 431 are diamond-shaped, but not limited to diamonds, and may also be geometric shapes such as circles, rectangles, and polygons. Just arrange in a matrix.

Preferably, the first sensing pads 421, the second sensing pads 431, and the bridging structures 432 are transparent conductive materials, and when applied to the touch display, the images of the liquid crystal screens below are not Obscured. More preferably, the first sensing pads 421, the second sensing pads 431, and the bridging structures 432 are transparent metal oxides while having good electrical conductivity and transparency. In the third preferred embodiment, the first sensing pads 421, the second sensing pads 431, and the bridging structures 432 are indium tin oxide.

The patterned insulating layers 44 respectively include a layer 441 interposed between the bridging structures 432 and the metal bridge wires 422 for spacing the bridging structures 432 from the metal bridge wires 422, and most of them are separately formed. An extension 442 extending from the layer body 441 to the gap between the adjacent first sensing pad 421 and the second electrode is independently formed on the substrate. The patterned insulating layer 44 is formed of a dielectric material, and preferably, when the second preferred embodiment is directly formed on a surface of a touch screen (not shown), the patterned insulating layer 44 is not A dielectric material that cures above 120 ° C is mainly composed. If the third preferred embodiment further includes a color filter film (not shown) formed on the bottom surface of the plate substrate 41, a color filter touch substrate can be formed together with the plate substrate 41. The printing process of the touch screen is formed on the bottom surface of the plate-shaped substrate 41 to form the color filter film and packaged into a conventional type of screen, and then formed on the top surface opposite to the plate-shaped substrate 41. The two sense series 42, 43 and the patterned insulating layer 44. Therefore, the patterned insulating layer 44 needs to be matched with a dielectric material which can be cured at a temperature not higher than 120 ° C without damaging the package adhesive of the screen.

Preferably, when the first sensing pads 421 and the second sensing pads 431 are all diamond-shaped, the four gaps formed by the first sensing pads 421 and the second sensing pads 431 adjacent thereto are Each of the patterned insulating layers 44 includes four extending segments 442, and the extending portions 442 extend to the gaps respectively, and an angle between the long axes of the two adjacent extending segments 442 is not less than 60°.

In addition, the extensions 442 may be elongated or may be fishbone or pointed, thereby increasing the contact area with the plate-like substrate 41.

Each of the bridge structures 432, the metal bridge wires 422 that cross the bridge structure 432, and the layer 441 of the patterned insulating layer 44 sandwiched between the bridge structure 432 and the metal bridge wires 422 form a touch capacitor. .

The metal bridge wires 422 are connected to the first sensing pads 421 in a lateral direction to form a row of electrical conduction paths. The bridge structures 432 are connected to the second sensing pads 431 in a longitudinal direction to form a row of electrical conduction paths. A plurality of touch capacitors arranged in a matrix formed by the bridge structures 432 and the patterned insulating layers 44 are electrically connected to each other.

When one of the touch capacitors is touched, the capacitance value of the touch capacitor changes, and is converted into an electrical signal by an external circuit and transmitted.

The third preferred embodiment completely adheres to the surface of the plate-like substrate 41 through the extended portion 442 of the patterned insulating layer 44, and increases the contact area between the patterned insulating layer 44 and the plate-like substrate 41. Further, the patterned insulating layer 44 is more firmly attached to the plate-like substrate 41, and at the same time, the layer 441 of the patterned insulating layer 44 is prevented from being connected to the first sensing pad 421 or the bridge structure 432. The opportunity for splitting and picking up is further provided by the third preferred embodiment as a reliable touch substrate.

It should be noted that the third preferred embodiment further includes a protective layer (not shown) formed from the surface of the plate-like substrate 41 and covering the first sensing series 42 The second sensing series 43 and the patterned insulating layer 44 are such that the first sensing series 42, the second sensing series 43, and the patterned insulating layer 44 are The outside world is isolated.

In summary, the present invention solves the problem of poor adhesion between the patterned insulating layer and the loosely structured electrode sheet or patterned insulating layer and the loosely structured bridge structure, and proposes to increase the patterned insulating layer 44 and the plate shape. The contact area between the substrates 41 and the edge of the patterned insulating layer 34 are completely connected to the plate-like substrate 31, thereby improving the adhesion between the elements and obtaining a reliable touch substrate. The object of the invention is achieved.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent.

10. . . Touch screen

10b. . . Circuit configuration

twenty one. . . Plate substrate

twenty two. . . First sensing serial

221. . . Metal bridge wiring

222. . . First sensing pad

223. . . Layer

224. . . Connecting column

twenty three. . . Second sensing serial

231. . . Second sensing pad

232. . . Bridge structure

twenty four. . . Patterned insulation

25. . . The protective layer

31. . . Plate substrate

32. . . First sensing serial

321. . . First sensing pad

322. . . First metal bridge wiring

33. . . Second sensing serial

331. . . Second sensing pad

332. . . Bridge structure

333. . . Second metal bridge wiring

334. . . Layer

335. . . Connecting column

34. . . Patterned insulation

35. . . The protective layer

41. . . Plate substrate

42. . . First sensing serial

421. . . First sensing pad

422. . . Metal bridge wiring

43. . . Second sensing serial

431. . . Second sensing pad

432. . . Bridge structure

44. . . Patterned insulation

441. . . Layer

442. . . Extension

45. . . The protective layer

1 is a top plan view showing a current touch screen;

2 is a partial top plan view showing a touch substrate;

3 is an SEM image illustrating a phenomenon in which a patterned insulating layer is formed on a loose electrode sheet to easily cause warpage of the edge;

4 is an SEM image illustrating a phenomenon in which a patterned insulating layer is formed on a tightly structured glass plate-like substrate without edge warpage;

FIG. 5 is a partial top plan view showing a first preferred embodiment of the touch substrate of the present invention; FIG.

Figure 6 is a partial cross-sectional view showing the first preferred embodiment;

7 is a partial top plan view showing a second preferred embodiment of the touch substrate of the present invention;

Figure 8 is a partial cross-sectional view showing the second preferred embodiment; and

FIG. 9 is a partial top plan view showing a third preferred embodiment of the touch substrate of the present invention.

twenty one. . . Plate substrate

twenty two. . . First sensing serial

221. . . Metal bridge wiring

222. . . First sensing pad

twenty three. . . Second sensing serial

231. . . Second sensing pad

232. . . Bridge structure

twenty four. . . Patterned insulation

Claims (4)

A touch substrate comprising: a plate-shaped substrate; a plurality of first sensing series, laterally arranged on the plate-like substrate, and including a first sensing formed on the substrate in a plurality of matrix arrangements a pad, and a plurality of metal bridge wires respectively connecting the two adjacent first sensing pads laterally; a plurality of second sensing series are longitudinally formed on the plate substrate and interleaved with the first sensing series Grid-shaped, and comprising a plurality of second sensing pads arranged in a matrix and interlaced between the first sensing pads, and a plurality of bridging structures respectively connecting the two adjacent second sensing pads in a longitudinal direction; and a plurality of patterned insulating layers respectively comprising a layer sandwiched between the bridge structures and the metal bridge wires for spacing the bridge structures from the metal bridge wires, and a plurality of layers respectively formed on the plate substrate And extending independently from the layer body to an extension of a gap between the adjacent first sensing pad and the second sensing pad; wherein each patterned insulating layer has four extending segments, two adjacent extending segments The angle between the long axes is not less than 60°. The touch substrate according to claim 1, wherein the main material of the plate-shaped substrate is glass, and the patterned insulating layer has a curing temperature of not more than 120 °C. The touch substrate of claim 2, wherein the first sensing pads, the second sensing pads, and the bridge structures are transparent Conductive material. The touch substrate of claim 3, further comprising a protective layer formed from the plate substrate and covering the first sensing series and the second sensing serials And isolated from the outside world.