TWI479699B - Method for manufacturing led package - Google Patents

Description

Method for manufacturing light emitting diode package structure

The invention relates to a light emitting diode package structure and a method of manufacturing the same.

In the prior light-emitting diode packaging process, after the light-emitting diode chip is disposed on the pedestal, the liquid packaging material is injected into the reflective cup by injection or the like, filling the entire reflective cup and covering the light-emitting diode wafer, and then The liquid encapsulating material is cured by heating to form an encapsulation layer. However, since the reflective cup space is too large, it is easy to use too much fluorescent powder in the encapsulating material filled therein, but the fluorescent powder that can be excited in the reflective cup is limited, which causes waste of the fluorescent powder, resulting in an increase in cost. In addition, too much phosphor powder will block the LED chip, resulting in low luminous efficiency.

In view of the above, it is necessary to provide a light emitting diode package structure and a method of manufacturing the same that can save the use of phosphor powder.

A light-emitting diode package structure includes a package base, and a receiving cup is formed on the package base, and the first electrode and the second electrode are respectively exposed on the bottom of the receiving cup. The LED package structure further includes a package module disposed in the receiving cup and a transparent encapsulation layer filled in the receiving cup and covering the package module. The package module includes a substrate, a light emitting diode chip disposed on the substrate, and a phosphor powder layer covering the light emitting diode chip. The substrate has a first conductive layer and a second conductive layer, and the light emitting diode chip is electrically connected to the first conductive layer and the second conductive layer, A conductive layer and a second conductive layer are electrically connected to the first electrode and the second electrode on the package base, respectively.

A manufacturing method of a light emitting diode package structure, comprising the steps of: providing a substrate having a plurality of conductive layers; and step 2, disposing a plurality of light emitting diode chips on the substrate, The plurality of light emitting diode chips are respectively electrically connected to the plurality of conductive layers on the substrate; in step 3, the plurality of light emitting diode chips are coated with the phosphor powder layer; and in step 4, the substrate is cut to form a plurality of package body molds. The package module includes a light-emitting diode chip and two conductive layers electrically connected to the light-emitting diode chip. In step 5, a package base is provided, and a receiving cup is formed on the package base. The bottom of the receiving cup is respectively exposed with a first electrode and a second electrode, and the packaged module is disposed in the receiving cup, and the two conductive layers are electrically connected to the first electrode and the second electrode, respectively. Step 6, filling the transparent encapsulation layer in the receiving cup of the package base to form a light emitting diode package structure.

In the above-mentioned LED package structure and manufacturing method, a package module is separately manufactured, and then a package module having a light-emitting diode chip and a phosphor layer is disposed in a receiving cup of the package base. Compared with the conventional packaging method in which the fluorescent material is filled in the accommodating cup after the illuminating diode is disposed in the accommodating cup, the use of the luminescent powder can be saved.

10, 20‧‧‧Lighting diode package structure

100‧‧‧Package base

110‧‧‧ top surface

120‧‧‧ bottom

130‧‧‧容杯

140‧‧‧First electrode

150‧‧‧second electrode

200, 400‧‧‧ package module

210, 410‧‧‧ substrate

211, 412‧‧‧ first conductive layer

212,411‧‧‧Insulation

213, 413‧‧‧ second conductive layer

220‧‧‧Light Diode Wafer

230‧‧‧Fluorescent powder layer

300‧‧‧Transparent encapsulation layer

420‧‧‧Metal wire

FIG. 1 is a schematic diagram of a package structure of a light emitting diode according to a first embodiment of the present invention.

2 is a flow chart showing a method of manufacturing a light emitting diode package structure according to a first embodiment of the present invention.

FIG. 3 is a schematic diagram of a package structure of a light emitting diode according to a second embodiment of the present invention.

4 is a flow chart showing a method of manufacturing a light emitting diode package structure according to a second embodiment of the present invention.

The invention will be further described in detail below with reference to the accompanying drawings.

Embodiment 1

Referring to FIG. 1 , a light emitting diode package structure 10 according to a first embodiment of the present invention includes a package base 100 , a package module 200 disposed on the package base 100 , and a package module 200 . Transparent encapsulation layer 300.

The package base 100 includes a top surface 110 and a bottom surface 120. A receiving cup 130 is formed from the top surface 110 along the bottom surface 120. The accommodating cup 130 is configured to provide a accommodating space of the package module 200 and the transparent encapsulating layer 300 and set a light field of the illuminating diode package structure 10. The inner surface of the accommodating cup 130 is an inclined surface. The top surface 110 extends toward the bottom surface 120 and is inclined inward in the radial direction, so that the entire receiving cup 130 is wide and narrow, and has a funnel shape. Preferably, the inner surface of the receiving cup 130 is also coated with a reflective material. The package base 100 is further provided with a first electrode 140 and a second electrode 150 spaced apart from each other. One end of the first electrode 140 and the second electrode 150 are respectively exposed at the bottom of the receiving cup 130 for the package body. The modules 200 are connected, and the other ends extend to both sides of the package base 100 for connection with external circuits.

The package module 200 includes a substrate 210, a light emitting diode chip 220 disposed on the substrate 210, and a phosphor layer 230 covering the LED chip 220. Said The substrate 210 is composed of a first conductive layer 211, an insulating layer 212, and a second conductive layer 213. The first conductive layer 211 and the second conductive layer 213 extend from a top surface of the substrate 210 to a bottom surface of the substrate 210. The insulating layer 212 connects the first conductive layer 211 and the second conductive layer 213. In the embodiment, the insulating layer 312 may be made of a polymer material, a ceramic material or a plastic material, and the first conductive layer 211 and the second conductive layer 213 are made of a metal material. The LED wafer 220 is flip-chip mounted on the substrate 210 and electrically connected to the first conductive layer 211 and the second conductive layer 213. The phosphor layer 230 covers the surface of the substrate 210 and the LED array 220, the thickness of which is slightly larger than the thickness of the LED wafer 220. The phosphor layer 230 is made of a sealant resin mixed with a phosphor powder, and the phosphor powder may be selected from one or a combination of yttrium aluminum garnet, yttrium aluminum garnet and silicate.

The package module 200 is disposed in the receiving cup 130 of the package base 100, and the first conductive layer 211 and the second conductive layer 213 are respectively soldered or eutectic with the first on the package base 100. The electrode 140 and the second electrode 150 are electrically connected. When the package module 200 is disposed in the receiving cup 130 of the package base 100, since the size of the package module 200 is smaller than that of the receiving cup 130, the sidewall and the surface of the phosphor layer 230 are accommodated. The inner surface of the cup 130 is spaced apart by a certain distance, and the phosphor layer 230 is only coated in the vicinity of the light-emitting diode wafer 220 at the bottom of the receiving cup 130.

The transparent encapsulating layer 300 is a piece of adhesive resin filled in the receiving cup 130 of the package base 100 and covering the package module 200 for protecting the package module 200 from dust, moisture and the like. .

Referring to FIG. 2, a method for fabricating a light emitting diode package structure according to a first embodiment of the present invention includes the following steps:

In the first step, a substrate 210 is provided. The substrate 210 has a plurality of conductive layers 210a. The plurality of conductive layers 210a are connected by an insulating layer 210b. The plurality of conductive layers 210a are separated from the base. The top surface of the board 210 extends to the bottom surface of the substrate 210. In the present embodiment, the insulating layer 210b may be made of a polymer material, a ceramic or a plastic material, and the conductive layer 210a is made of a metal material.

In step 2, the plurality of LED chips 220 are respectively flip-chip mounted on the substrate 210. The plurality of LED chips 220 are electrically connected to the plurality of conductive layers 210a on the substrate 210.

In step three, a phosphor layer 230 covers the entire surface of the substrate 210 and the plurality of LED chips 220. The phosphor powder layer 230 is made of a sealant resin mixed with a phosphor powder, and the phosphor powder may be selected from one or a combination of yttrium aluminum garnet, yttrium aluminum garnet and bismuth citrate. .

Step 4, cutting the substrate 210, and forming a plurality of package modules 200, wherein each of the package modules 200 includes a light-emitting diode chip 220, and two conductive wires respectively electrically connected to the light-emitting diode wafer 220. The layer 210a and the phosphor layer 230 covering the LED array 220.

In step 5, a package base 100 is provided. The package base 100 defines a receiving cup 130. The package base 100 is further provided with a first electrode 140 and a second electrode 150 spaced apart from each other. The first electrode 140 is disposed. And one end of the second electrode 150 is respectively exposed at the bottom of the accommodating cup 130, and the other end extends to the outside of the package package base 100, and the packaged package module 200 is disposed in the accommodating cup 130, and the two The conductive layer 210a is electrically connected to the first electrode 140 and the second electrode 150 by soldering or eutectic, respectively. The inner surface of the receiving cup 130 is an inclined surface which is inclined from the top surface toward the bottom surface and radially inward, so that the entire receiving cup 130 is wide and narrow, and has a funnel shape. Preferably, the inner surface of the receiving cup 130 is also coated with a reflective material.

In step six, the transparent encapsulation layer 300 is filled in the receiving cup 130 of the package base 100 to form a light emitting diode package structure 10.

The manufacturing method of the LED package structure 10 and the LED package structure 10 is that the package module 200 is separately fabricated, and the LED chip 220 and the phosphor layer 230 are disposed on the substrate 210, and then The substrate 210 carrying the light-emitting diode wafer 220 and the phosphor layer 230 is further disposed in the receiving cup 130 of the package base 100. When the package module 200 is disposed in the accommodating cup 130, the phosphor layer 230 is only wrapped in the vicinity of the illuminating diode chip 220 at the bottom of the accommodating cup 130, and the thickness thereof is slightly larger than that of the illuminating diode chip. The thickness of 220, therefore, can save the use of phosphor powder compared to the conventional packaging structure in which the entire receiving cup 130 is filled with the fluorescent material. In addition, by combining the plurality of LED chips 220 with a phosphor layer 230 and then dividing into a plurality of package modules 200, the prior art needs to be separately packaged in each of the LED packages. Injecting the phosphor layer separately is more simplified in terms of process.

Embodiment 2

Referring to FIG. 3, a second embodiment of the present invention provides a light emitting diode package structure 20 that differs from the light emitting diode package structure 10 of the first embodiment in that the substrate 410 of the package module 400 includes an insulating layer. 411 and a first conductive layer 412 and a second conductive layer 413 formed on the insulating layer 411 at intervals. The LED wafer 220 is flip-chip mounted on the substrate 410 and electrically connected to the first conductive layer 412 and the second conductive layer 413. The phosphor layer 230 forms a surface of the substrate 410, covers the LED array 220, and the first conductive layer 412 and the second conductive layer 413 are exposed from both ends of the phosphor layer 230, respectively. The insulating layer 411 of the package module 400 is fixed on the bottom surface of the receiving cup 130 of the package base 100 by soldering or bonding, and the first conductive layer 412 and the second layer The conductive layer 413 is connected to the first electrode 140 and the second electrode 150 on the package base 100 by metal wires 420, respectively.

Referring to FIG. 4, a second embodiment of the present invention provides a method for manufacturing a light emitting diode package structure, which includes the following steps:

In step 1, a substrate 410 is provided. The substrate 410 includes an insulating layer 410a and a plurality of mutually spaced conductive layers 410b formed on the insulating layer 410a.

In the second step, the plurality of LED chips 220 are respectively flipped on the substrate 410. The plurality of LED chips 220 are electrically connected to the plurality of conductive layers 410a on the substrate 410.

In step three, each of the light-emitting diode chips 220 is covered by the phosphor powder layer 230, and the phosphor powder layers 230 are spaced apart from each other to expose one end of the conductive layer 410a. The phosphor powder layer 230 is made of a sealant resin mixed with a phosphor powder, and the phosphor powder may be selected from one or a combination of yttrium aluminum garnet, yttrium aluminum garnet and bismuth citrate. .

Step 4: cutting the substrate 410 to form a plurality of package modules 400. Each package module 400 includes a light emitting diode chip 220, two conductive layers 410b electrically connected to the LED substrate 220, and a cover. The phosphor layer 230 of the LED wafer 220.

In step 5, a package base 100 is provided. The package base 100 defines a receiving cup 130. The package base 100 is further provided with a first electrode 140 and a second electrode 150 spaced apart from each other. The first electrode 140 is disposed. And one end of the second electrode 150 is respectively exposed at the bottom of the accommodating cup 130, and the other end is respectively extended outside the package package base 100, and the packaged package module 400 is disposed in the accommodating cup 130, and the package body is molded. The insulating layer 410a of the group 400 is fixed on the bottom surface of the receiving cup 130 by welding or bonding. . The inner surface of the receiving cup 130 is an inclined surface which is inclined from the top surface toward the bottom surface and radially inward, so that the entire receiving cup 130 is wide and narrow, and has a funnel shape. Preferably, the inner surface of the receiving cup 130 is also coated with a reflective material.

In step six, the two conductive layers 410b are respectively connected to the first electrode 140 and the second electrode 150 on the package base 100 by using the metal wires 420.

Step 7: filling the transparent encapsulation layer 300 in the receiving cup 130 of the package base 100 to form a light emitting diode package structure 20.

Compared with the prior art, the LED package structure and the manufacturing method of the present invention separately manufacture a package module, and then package the package module having the LED chip and the phosphor layer in the package. In the accommodating cup of the susceptor, compared with the conventional packaging method in which the luminescent cup is filled in the accommodating cup and the fluorescent material is filled in the accommodating cup, the use of the luminescent powder can be saved.

In addition, those skilled in the art can make other changes in the spirit of the present invention. Of course, the changes made in accordance with the spirit of the present invention should be included in the scope of the present invention.

10‧‧‧Light emitting diode package structure

100‧‧‧Package base

110‧‧‧ top surface

120‧‧‧ bottom

130‧‧‧容杯

140‧‧‧First electrode

150‧‧‧second electrode

200‧‧‧ package module

210‧‧‧Substrate

211‧‧‧First conductive layer

212‧‧‧Insulation

213‧‧‧Second conductive layer

220‧‧‧Light Diode Wafer

230‧‧‧Fluorescent powder layer

300‧‧‧Transparent encapsulation layer

Claims (2)

A manufacturing method of a light emitting diode package structure, comprising the following steps: Step 1: providing a substrate having an insulating layer and a plurality of conductive layers formed in the insulating layer and spaced apart from each other, the conductive layer only a side surface is exposed on the surface of the insulating layer; in step 2, a plurality of light emitting diode wafers are disposed on the substrate, and the plurality of light emitting diode wafers are electrically connected to the plurality of conductive layers on the substrate respectively; 3. The plurality of light emitting diode chips are coated with the phosphor powder layer, and the conductive layer is exposed outside the phosphor powder layer; in step 4, the substrate is cut to form a plurality of package modules, each package body The module comprises a light-emitting diode chip and two conductive layers electrically connected to the light-emitting diode chip; in step 5, a package base is provided, and a receiving cup is formed on the package base, and the bottom of the receiving cup is formed The first electrode and the second electrode are respectively exposed, and the packaged module is disposed in the receiving cup, and the portions of the two conductive layers exposed outside the phosphor layer are electrically connected to the first electrode and the second electrode, respectively. Sexual connection; step 6, in the seal Receiving the base of the cup filled with a transparent encapsulation layer, forming a light-emitting diode package structure. The method for manufacturing a light emitting diode package structure according to claim 1, wherein the insulating layer of the packaged module is fixed on the bottom surface of the receiving cup by soldering or bonding, and the conductive layer is used. The metal wire is connected to the first electrode and the second electrode on the package base.