[go: up one dir, main page]

TWI479003B - Solvent-free polyfluorene stripper composition for film and release film using the same - Google Patents

Solvent-free polyfluorene stripper composition for film and release film using the same Download PDF

Info

Publication number
TWI479003B
TWI479003B TW097107297A TW97107297A TWI479003B TW I479003 B TWI479003 B TW I479003B TW 097107297 A TW097107297 A TW 097107297A TW 97107297 A TW97107297 A TW 97107297A TW I479003 B TWI479003 B TW I479003B
Authority
TW
Taiwan
Prior art keywords
component
parts
mass
group
sio
Prior art date
Application number
TW097107297A
Other languages
Chinese (zh)
Other versions
TW200848484A (en
Inventor
伊東秀行
Original Assignee
信越化學工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越化學工業股份有限公司 filed Critical 信越化學工業股份有限公司
Publication of TW200848484A publication Critical patent/TW200848484A/en
Application granted granted Critical
Publication of TWI479003B publication Critical patent/TWI479003B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/10Block- or graft-copolymers containing polysiloxane sequences
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/06Preparatory processes
    • C08G77/08Preparatory processes characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/16Applications used for films
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/02Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Silicon Polymers (AREA)

Description

用於薄膜之無溶劑聚矽氧剝離劑組成物及使用其之剝離膜Solvent-free polyfluorene stripper composition for film and release film using the same

本發明係關於一種展現對塑膠膜之優良黏著之無溶劑可固化聚矽氧剝離劑組成物,及使用該組合物之剝離膜。以此組成物之固化膜形式形成於基板膜表面之剝離膜可有利地用作薄膜感壓性黏著標籤或薄膜感壓性黏著帶。The present invention relates to a solvent-free curable polydecane oxygen stripper composition exhibiting excellent adhesion to a plastic film, and a release film using the same. The release film formed on the surface of the substrate film in the form of a cured film of the composition can be advantageously used as a film pressure-sensitive adhesive label or a film pressure-sensitive adhesive tape.

傳統上,為防止諸如塑膠膜或紙之基板與壓感性黏著材料之間的黏著或結合,已將聚矽氧組成物之固化膜塗佈於基板表面以賦予基板剝離性。Conventionally, in order to prevent adhesion or bonding between a substrate such as a plastic film or paper and a pressure-sensitive adhesive material, a cured film of a polysiloxane composition has been applied to a surface of a substrate to impart releasability to the substrate.

在此情形下,一種廣泛用於在基板表面形成聚矽氧膜之方法為將以鉑為主之化合物用作催化劑來達到含烯基之有機聚矽氧烷與有機氫聚矽氧烷之間的加成反應,藉此形成可剝離膜之方法(例如,參見專利參考案1)。In this case, a method widely used to form a polyfluorene oxide film on the surface of a substrate is to use a platinum-based compound as a catalyst to achieve an alkenyl group-containing organopolyoxane and an organic hydrogen polyoxyalkylene. The addition reaction, thereby forming a peelable film (for example, see Patent Reference 1).

在近幾年中,因為包括安全及衛生之原因,以不含有機溶劑之無溶劑剝離劑置換含有如甲苯或二甲苯的有機溶劑之以溶劑為主的聚矽氧剝離劑。In recent years, solvent-based polyoxynitride strippers containing an organic solvent such as toluene or xylene have been replaced with a solventless stripper containing no organic solvent for reasons including safety and hygiene.

已知已有多種無溶劑聚矽氧組成物(例如,參見專利參考案2及3)。然而,儘管此等組成物對紙基板展現有利黏著性,但其與塑膠基板之黏著性不佳。A variety of solvent-free polyfluorene oxide compositions are known (for example, see Patent References 2 and 3). However, although these compositions exhibit favorable adhesion to the paper substrate, their adhesion to the plastic substrate is not good.

為了解決上述問題,專利參考案4及5中所揭示之發明內容使用具有分支結構及高烯基含量之有機聚矽氧烷。然而在此等發明中,儘管與塑膠膜基板之黏著經特定改 良,但是因為有機氫聚矽氧烷交聯劑之量亦增加,所以出現剝離阻力趨於增加之問題。In order to solve the above problems, the invention disclosed in Patent References 4 and 5 uses an organic polyoxyalkylene having a branched structure and a high alkenyl content. However, in these inventions, although the adhesion to the plastic film substrate is specifically modified Good, but since the amount of the organohydrogenpolyoxyalkylene crosslinking agent also increases, there is a problem that the peeling resistance tends to increase.

[專利參考案1]JP 47-32072 A[Patent Reference 1] JP 47-32072 A

[專利參考案2]JP 50-141591A[Patent Reference 2] JP 50-141591A

[專利參考案3]JP 52-39791 A[Patent Reference 3] JP 52-39791 A

[專利參考案4]JP 06-293881 A[Patent Reference 4] JP 06-293881 A

[專利參考案5]JP 2005-231355 A[Patent Reference 5] JP 2005-231355 A

本發明考慮到上述狀況,目標為提供展現對塑膠膜基板之有利黏著性及良好剝離性的無溶劑可固化聚矽氧剝離劑組成物,以及包含此組成物之固化膜的剝離膜。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a solvent-free curable polysulfide stripper composition exhibiting favorable adhesion to a plastic film substrate and good peelability, and a release film comprising the cured film of the composition.

為了實現上述目標,本發明之發明者進行了與用作組成物主要組份的含烯基之有機聚矽氧烷有關之各種研究,且因此作出以下發現。即,當僅將所謂之MQ樹脂(一種具有分支或三維分子結構之矽氧烷樹脂)與一般所用之含烯基之直鏈二有機聚矽氧烷混合時,所得固化膜通常展現與膜基板降低程度之黏著性。然而,本發明者發現藉由使含烯基之有機聚矽氧烷與MQ樹脂在加熱下使用鹼性催化劑之反應獲得之產物展現與膜基板顯著改良程度之黏著性。認為此發現係由於如下事實:MQ樹脂併入含烯基之有機聚矽氧烷中,藉此增加固化膜之強度,且在MQ樹脂 中之矽烷醇基的縮合,減少殘餘矽烷醇基之量。此外,本發明者亦發現,此方法中因為烯基含量不需顯著增加,所以可抑制用作交聯劑之有機氫聚矽氧烷的摻合量,從而能夠防止剝離效能之任何劣化。In order to achieve the above object, the inventors of the present invention conducted various studies relating to an alkenyl group-containing organopolyoxane used as a main component of the composition, and thus made the following findings. That is, when only a so-called MQ resin (a siloxane resin having a branched or three-dimensional molecular structure) is mixed with a generally used alkenyl-containing linear diorganopolyoxyalkylene oxide, the resulting cured film is usually exhibited with a film substrate. Reduce the degree of adhesion. However, the inventors have found that a product obtained by reacting an alkenyl group-containing organopolyoxane with an MQ resin under heating using a basic catalyst exhibits a markedly improved adhesion to a film substrate. This finding is believed to be due to the fact that the MQ resin is incorporated into the alkenyl group-containing organopolyoxane, thereby increasing the strength of the cured film, and in the MQ resin. The condensation of the stanol groups in the group reduces the amount of residual stanol groups. Further, the present inventors have found that in this method, since the alkenyl content does not need to be significantly increased, the blending amount of the organohydrogenpolysiloxane used as the crosslinking agent can be suppressed, so that any deterioration of the peeling performance can be prevented.

換言之,本發明提供一種用於塑膠膜之無溶劑可固化聚矽氧剝離劑組成物,其在25℃下具有100至1,500 mPa‧s範圍內之黏度,且其係包含:(A)藉由在加熱下使用鹼性催化劑以進行以下所述之組份(A1)與組份(A2)之間的反應而獲得100質量份之產物:(A1)97至80質量份之二有機聚矽氧烷,其在各分子內含有至少兩個與矽原子鍵結之烯基,其中烯基之量係在0.01至0.05 mol/100g之範圍內,且25℃下之黏度係在100至1,500 mPa‧s範圍內,(A2)3至20質量份包含R3 SiO1/2 單元(其中R代表相同或不同之具有1至10個碳原子不含脂族不飽和鍵的單價烴基,或羥基)及SiO4/2 單元之聚有機矽氧烷,其中R3 SiO1/2 單元與SiO4/2 單元之間的莫耳比係在0.6至1.5範圍內,(其中組份(A1)與組份(A2)之合併量為100質量份),(B)0.5至10質量份之有機氫聚矽氧烷,其在各分子內含有至少三個與矽原子鍵結之氫原子,且25℃下之黏度係在5至1,000 mPa‧s範圍內, (C)有效數量之加成反應延遲劑,及(D)有效數量之以鉑族金屬為主之催化劑。In other words, the present invention provides a solventless curable polyoxynitride stripper composition for a plastic film having a viscosity in the range of 100 to 1,500 mPa‧s at 25 ° C, and comprising: (A) by A basic catalyst is used under heating to carry out a reaction between the component (A1) and the component (A2) described below to obtain 100 parts by mass of the product: (A1) 97 to 80 parts by mass of the diorganopolyoxyl An alkane containing at least two alkenyl groups bonded to a ruthenium atom in each molecule, wherein the amount of the alkenyl group is in the range of 0.01 to 0.05 mol/100 g, and the viscosity at 25 ° C is 100 to 1,500 mPa ‧ In the range of s, (A2) 3 to 20 parts by mass of R 3 SiO 1/2 units (wherein R represents the same or different monovalent hydrocarbon group having 1 to 10 carbon atoms which does not contain an aliphatic unsaturated bond, or a hydroxyl group) and a polyorganosiloxane of the SiO 4/2 unit, wherein the molar ratio between the R 3 SiO 1/2 unit and the SiO 4/2 unit is in the range of 0.6 to 1.5 (wherein the component (A1) and the component) (A2) is a combined amount of 100 parts by mass), (B) 0.5 to 10 parts by mass of an organohydrogenpolysiloxane having at least three hydrogen atoms bonded to a ruthenium atom in each molecule, and 25 Under the Department of viscosity in the range of 5 to 1,000 mPa‧s, an effective amount of (C) an addition reaction retarder, and an effective amount of (D) of platinum group metal based catalyst.

本發明亦提供一種剝離膜,其包含塑膠膜基板及形成於該塑膠膜基板之至少一個表面上之上述無溶劑可固化聚矽氧剝離劑組成物的固化膜。The present invention also provides a release film comprising a plastic film substrate and a cured film of the solvent-free curable polyoxynitride stripper composition formed on at least one surface of the plastic film substrate.

當固化時,本發明之無溶劑可固化聚矽氧剝離劑組成物產生展示高水準之強度,與膜基板之優良黏著及優越之剝離能力的薄膜。When cured, the solventless curable polyoxynitride stripper composition of the present invention produces a film that exhibits a high level of strength, excellent adhesion to the film substrate, and superior peelability.

實施本發明之最佳模式Best mode for carrying out the invention

下文提供本發明之更詳細說明。A more detailed description of the invention is provided below.

用於製備用作本發明主要組份之組份(A)的組份(A1)之有機聚矽氧烷為用於改良組成物固化性及剝離性之二有機聚矽氧烷。二有機聚矽氧烷在各分子內含有至少兩個與矽原子鍵結的烯基,其烯基含量在0.01至0.05 mol/100g[組份(A1)]範圍內,且在25℃下具有100至1,500 mPa‧s之黏度。二有機聚矽氧烷之實例包括由如下所示之通式(1)表示之化合物,其在各分子內含有至少兩個與矽原子鍵結之烯基,其係由結構式中之R2 表示。直鏈二有機聚矽氧烷為較佳。The organopolysiloxane used to prepare the component (A1) used as the component (A) of the main component of the present invention is a diorganopolysiloxane which is used for improving the curability and releasability of the composition. The diorganopolysiloxane has at least two alkenyl groups bonded to the ruthenium atom in each molecule, and has an alkenyl group content of 0.01 to 0.05 mol/100 g [component (A1)], and has a temperature at 25 ° C Viscosity of 100 to 1,500 mPa‧s. Examples of the diorganopolysiloxane include a compound represented by the following formula (1) which contains at least two alkenyl groups bonded to a ruthenium atom in each molecule, which is represented by R 2 in the formula Said. Linear diorganopolyoxyalkylene is preferred.

(R2 R1 2 SiO1/2 )2 (R1 2 SiO2/2 )a (R2 R1 SiO2/2 )b    (1)(R 2 R 1 2 SiO 1/2 ) 2 (R 1 2 SiO 2/2 ) a (R 2 R 1 SiO 2/2 ) b (1)

(其中R2 為由-(CH2 )c -CH=CH2 (其中c為0至8之整 數)表示之烯基,R1 表示相同或不同之具有1至10個碳原子不含脂族不飽和鍵的單價烴基,且a及b分別為滿足60≦a≦280且0≦b≦10之整數)。(wherein R 2 is an alkenyl group represented by -(CH 2 ) c -CH=CH 2 (wherein c is an integer of 0 to 8), and R 1 represents the same or different and has 1 to 10 carbon atoms and is free of aliphatic A monovalent hydrocarbon group of an unsaturated bond, and a and b are each an integer satisfying 60≦a≦280 and 0≦b≦10).

烯基R2 之實例包括乙烯基、烯丙基、丙烯基、己烯基、辛烯基或癸烯基。自成本及效能之觀點來看,乙烯基為較佳。Examples of the alkenyl group R 2 include a vinyl group, an allyl group, a propenyl group, a hexenyl group, an octenyl group or a nonenyl group. Vinyl is preferred from the standpoint of cost and efficacy.

具有1至10個碳原子不含脂族不飽和鍵的相同或不同之單價烴基(由結構式中之R1 表示)之實例包括諸如甲基、乙基或丙基之烷基及諸如苯基或甲苯基之芳基。就改良固化性及剝離性而言,80 mol%或更多之R1 基較佳為甲基。Examples of the same or different monovalent hydrocarbon group having 1 to 10 carbon atoms which does not contain an aliphatic unsaturated bond (represented by R 1 in the formula) include an alkyl group such as a methyl group, an ethyl group or a propyl group such as a phenyl group. Or a tolyl aryl group. In terms of improving curability and peelability, 80 mol% or more of the R 1 group is preferably a methyl group.

此外,組份(A1)之二有機聚矽氧烷內與矽原子鍵結之烯基的量為重要因素,且可藉由保證此量每100g之組份(Al)0.01至0.05mol範圍內以達到所要黏著及剝離效能。若此量超過0.05 mols,則固化膜變脆化且黏著劣化。為了確保量在此範圍內,應調整結構式(1)中之b值使其滿足0≦b≦10,且較佳0≦b≦5。Further, the amount of the alkenyl group bonded to the ruthenium atom in the component (A1) bis organopolyoxane is an important factor, and can be ensured by the amount of 0.01 to 0.05 mol per 100 g of the component (Al). In order to achieve the desired adhesion and peeling performance. If the amount exceeds 0.05 mols, the cured film becomes brittle and the adhesion is deteriorated. In order to ensure that the amount is within this range, the b value in the structural formula (1) should be adjusted so as to satisfy 0 ≦ b ≦ 10, and preferably 0 ≦ b ≦ 5.

此外,為了達到25℃下之黏度在100至1,500mPa‧s範圍內(自塗層性質之觀點來看,此表示理想黏度範圍),結構式(1)中之a值應滿足60≦a≦280,且較佳為70≦a≦250。組份(A1)可單獨使用或與兩種或兩種以上不同化合物之組合使用。In addition, in order to achieve a viscosity at 25 ° C in the range of 100 to 1,500 mPa ‧ s (this represents the ideal viscosity range from the viewpoint of coating properties), the value of a in the structural formula (1) should satisfy 60 ≦ a ≦ 280, and preferably 70 ≦ a ≦ 250. The component (A1) may be used singly or in combination of two or more different compounds.

組份(A2)為包含R3 SiO1/2 單元(其中R代表具有1至10個碳原子不含脂族不飽和鍵之相同或不同單價烴基,或羥基)及SiO4/2 單元之聚有機矽氧烷(具有分支或三維 分子結構,亦即所謂MQ樹脂),其中R3 SiO1/2 單元與SiO4/2 單元之間的莫耳比在0.6至1.5之範圍內。若R3 SiO1/2 單元與SiO4/2 單元之間的莫耳比小於0.6,則在加熱下與組份(A1)在鹼性催化劑存在下反應期間很可能變為膠凝化,而若莫耳比超過1.5,則在固化膜與膜基板之間的黏著性未能獲得改良。具有1至10個碳原子不含脂族不飽和鍵的相同或不同之單價烴基(由R表示)之實例包括諸如甲基、乙基或丙基之烷基及諸如苯基或甲苯基之芳基,儘管甲基為較佳的。Component (A2) is agglomerates comprising R 3 SiO 1/2 units (wherein R represents the same or different monovalent hydrocarbon groups having 1 to 10 carbon atoms which do not contain an aliphatic unsaturated bond, or a hydroxyl group) and SiO 4/2 units An organic siloxane (having a branched or three-dimensional molecular structure, also known as an MQ resin) wherein the molar ratio between the R 3 SiO 1/2 unit and the SiO 4/2 unit is in the range of 0.6 to 1.5. If the molar ratio between the R 3 SiO 1/2 unit and the SiO 4/2 unit is less than 0.6, it is likely to become gelled during heating under reaction with the component (A1) in the presence of a basic catalyst. If the molar ratio exceeds 1.5, the adhesion between the cured film and the film substrate is not improved. Examples of the same or different monovalent hydrocarbon groups (represented by R) having 1 to 10 carbon atoms which do not contain an aliphatic unsaturated bond include an alkyl group such as a methyl group, an ethyl group or a propyl group, and a aryl group such as a phenyl group or a tolyl group. Base, although methyl is preferred.

組份(A2)可包括與矽原子鍵結之OH基,儘管OH基含量通常小於0.2 mol/100g[組份(A2)],且較佳在0至0.15 mol/100g[組份(A2)]範圍內。若OH基含量超過0.2 mol/100g,則可能難以達到所要黏著程度。組份(A2)可單獨使用或與兩種或兩種以上不同化合物之組合使用。The component (A2) may include an OH group bonded to a ruthenium atom, although the OH group content is usually less than 0.2 mol/100 g [component (A2)], and preferably 0 to 0.15 mol/100 g [component (A2)) ] within the scope. If the OH group content exceeds 0.2 mol/100 g, it may be difficult to achieve the desired degree of adhesion. The component (A2) may be used singly or in combination with two or more different compounds.

藉由使組份(A1)與組份(A2)之混合物在加熱下使用鹼性催化劑進行反應,可獲得標靶產物(A)。The target product (A) can be obtained by reacting a mixture of the component (A1) and the component (A2) with a basic catalyst under heating.

鹼性催化劑之實例包括鹼金屬氫氧化物,諸如氫氧化鋰、氫氧化鈉及氫氧化鉀,鹼金屬烷醇鹽,諸如甲醇鈉及丁醇鉀,有機鹼金屬,諸如丁基鋰,及環狀二甲基聚矽氧烷與鹼性金屬氫氧化物預先一起反應之矽酸鹽(siliconate)。自聚有機矽氧烷內溶解度之觀點來看,氫氧化鉀之矽酸鹽尤其較佳。所用鹼性催化劑之量較佳係在每100質量份之組份(A1)與(A2)之組合0.001至2.0質量份,且甚至更佳0.002至1.0質量份範圍內。Examples of the basic catalyst include alkali metal hydroxides such as lithium hydroxide, sodium hydroxide and potassium hydroxide, alkali metal alkoxides such as sodium methoxide and potassium butoxide, organic alkali metals such as butyllithium, and rings. A dimethyl carbonate polyoxane and a basic metal hydroxide are previously reacted together with a siliconate. The potassium hydroxide of potassium hydroxide is particularly preferred from the viewpoint of solubility in the polyorganosiloxane. The amount of the basic catalyst to be used is preferably in the range of 0.001 to 2.0 parts by mass, and even more preferably 0.002 to 1.0 part by mass per 100 parts by mass of the combination of the components (A1) and (A2).

組份(A1)與組份(A2)之間反應的溫度或時間並無特定限制,儘管在彼等使用諸如甲苯或二甲苯之有機溶劑的情形下,反應可在有機溶劑之回流溫度下進行。此外,較佳自反應系統移除反應所產生之縮合水。特定反應條件之實例包括80至180℃,且較佳100至160℃範圍內之反應溫度。反應應進行足夠時間以確保反應充分地進行,且若反應溫度在80至180℃範圍內,則反應時間通常在0.5至20小時範圍內,而若反應溫度在100至160℃範圍內,則反應時間通常為1至12小時。相對於100質量份組合質量之組份(A1)及(A2)而言,組份(A1)與組份(A2)之摻合量必須在97至80質量份之組份(A1)及3至20質量份之組份(A2)的範圍內。若摻合量在此等範圍之外,則難以達到與膜基板所要程度之黏著。相對於100質量份組合質量之組份(A1)及(A2)而言,較佳之摻合量為95至82質量份之組份(A1)及5至18質量份之組份(A2)。The temperature or time of the reaction between the component (A1) and the component (A2) is not particularly limited, although in the case of using an organic solvent such as toluene or xylene, the reaction can be carried out at the reflux temperature of the organic solvent. . Further, it is preferred to remove the condensation water produced by the reaction from the reaction system. Examples of specific reaction conditions include a reaction temperature in the range of 80 to 180 ° C, and preferably 100 to 160 ° C. The reaction should be carried out for a sufficient period of time to ensure that the reaction proceeds sufficiently, and if the reaction temperature is in the range of from 80 to 180 ° C, the reaction time is usually in the range of from 0.5 to 20 hours, and if the reaction temperature is in the range of from 100 to 160 ° C, the reaction is carried out. The time is usually 1 to 12 hours. The blending amount of the component (A1) and the component (A2) must be in the range of 97 to 80 parts by mass (A1) and 3 with respect to 100 parts by mass of the combined mass components (A1) and (A2). It is within the range of 20 parts by mass of component (A2). If the blending amount is outside these ranges, it is difficult to achieve adhesion to the film substrate. The blending amount is preferably 95 to 82 parts by mass of the component (A1) and 5 to 18 parts by mass of the component (A2) with respect to 100 parts by mass of the combined mass components (A1) and (A2).

反應後,較佳係藉由將如2-氯乙醇、鹽酸、二氧化碳氣體或三甲基氯矽烷之中和劑添加至以每100質量份組份(A1)與(A2)組合的0.003至3.0質量份範圍內之量的反應混合物中以進行中和作用,且使中和作用在40至160℃之溫度下進行0.5至20小時之期間進行。在彼等使用有機溶劑之狀況下,可藉由使用習知方法在減壓下加熱從而移除有機溶劑。若需要,則可進行純化-過濾以移除中性鹽。After the reaction, it is preferred to add a neutralizing agent such as 2-chloroethanol, hydrochloric acid, carbon dioxide gas or trimethylchloromethane to 0.003 to 3.0 in a combination of 100 parts by mass of components (A1) and (A2). The amount of the reaction mixture in the range of parts by mass is neutralized, and the neutralization is carried out at a temperature of 40 to 160 ° C for 0.5 to 20 hours. In the case where they use an organic solvent, the organic solvent can be removed by heating under reduced pressure using a conventional method. If necessary, purification-filtration can be performed to remove the neutral salt.

組份(B)之有機氫聚矽氧烷在各分子內含有3或更多個(通常自3至200個),較佳4或更多個(例如4至 150個),且甚至更佳4至約100個與矽原子鍵結之氫原子(亦即SiH基)。此等SiH基經歷與組份(A)之產物中的烯基加成反應,藉此形成固化膜。組份(B)之有機氫聚矽氧烷可為直鏈、支鏈、環狀或三維樹脂狀結構,其限制條件為25℃下之黏度在5至1,000 mPa‧s範圍內。The organohydrogenpolyoxane of component (B) contains 3 or more (generally from 3 to 200), preferably 4 or more (for example 4 to 4) in each molecule. 150), and even more preferably 4 to about 100 hydrogen atoms bonded to the ruthenium atom (i.e., SiH group). These SiH groups undergo an addition reaction with an alkenyl group in the product of component (A), thereby forming a cured film. The organohydrogenpolyoxyalkylene of component (B) may be a linear, branched, cyclic or three-dimensional resinous structure, and the constraint is that the viscosity at 25 ° C is in the range of 5 to 1,000 mPa ‧ s.

有機氫聚矽氧烷之各分子內矽原子數目(或聚合程度)通常在3至300,甚至更佳3至200範圍內,且最佳為4至約100。The number of germanium atoms (or degree of polymerization) in each molecule of the organohydrogenpolyoxyalkylene is usually in the range of 3 to 300, more preferably 3 to 200, and most preferably 4 to about 100.

此類型之有機氫聚矽氧烷之特定實例包括1,3,5,7-四甲基環四矽氧烷、三(氫二甲基矽烷氧基)甲基矽烷、三(氫二甲基矽烷氧基)苯基矽烷、甲基氫環聚矽氧烷、甲基氫矽氧烷與二甲基矽氧烷之環狀共聚物、具兩個以三甲基矽烷氧基阻斷之末端的甲基氫聚矽氧烷、具兩個以三甲基矽烷氧基阻斷之末端的二甲基矽氧烷與甲基氫矽氧烷之共聚物、具兩個以二甲基氫矽烷氧基阻斷之末端的二甲基矽氧烷與甲基氫矽氧烷之共聚物、具兩個以三甲基矽烷氧基阻斷之末端的甲基氫矽氧烷與二苯基矽氧烷之共聚物、具兩個以三甲基矽烷氧基阻斷之末端的甲基氫聚矽氧烷、二苯基矽氧烷與二甲基矽氧烷之共聚物、具兩個以三甲基矽烷氧基阻斷之末端的甲基氫聚矽氧烷、甲基苯基矽氧烷與二甲基矽氧烷之共聚物、具兩個以二甲基氫矽烷氧基阻斷之末端的甲基氫聚矽氧烷、二甲基矽氧烷與二苯基矽氧烷之共聚物、具兩個以二甲基氫矽烷氧基阻斷之末端的甲基氫聚矽氧烷、二甲基矽氧烷與甲基苯基矽氧烷之共聚物、由 (CH3 )2 HSiO1/2 單元、(CH3 )3 HSiO1/2 單元及SiO4/2 單元構成之共聚物、由(CH3 )2 HSiO1/2 單元及SiO4/2 單元構成之共聚物、由(CH3 )2 HSiO1/2 單元、SiO4/2 單元及(C6 H5 )3 SiO1/2 單元構成之共聚物、上述各化合物中部分或全部甲基經諸如乙基或丙基之其他烷基或苯基取代之化合物,以及由如下所示之結構式(3)表示之化合物,儘管此為非詳盡清單。Specific examples of this type of organohydrogenpolyoxyalkylene include 1,3,5,7-tetramethylcyclotetraoxane, tris(hydrodimethyldecyloxy)methyldecane, and tris(hydrogendimethyl) a cyclic copolymer of decyloxy)phenylnonane, methylhydrocyclopolyoxyalkylene, methylhydroquinoxane and dimethyloxane, having two ends blocked by trimethyldecyloxy Methylhydrogen polyoxyalkylene, a copolymer of two dimethyl methoxyoxanes with a terminal blocked by trimethyl decyloxy group and methyl hydrooxane, having two dimethyl hydrocin a copolymer of dimethyl oxoxane and methylhydroquinoxane at the end of the oxy block, two methyl hydrazines having a terminal blocked by trimethyl decyloxy group and diphenyl hydrazine a copolymer of oxyalkylene, a copolymer of two methylhydropolysiloxanes having a terminal blocked by trimethylnonyloxyl, a mixture of diphenylphosphorane and dimethyloxane, having two a copolymer of methylhydrogenpolyoxane, methylphenyloxane and dimethyloxane at the end of the trimethyldecyloxy block, with two blocked with dimethylhydroquinoloxy Methyl hydrogen polyoxyalkylene at the end, two a copolymer of a base oxane and a diphenyl sulfoxane, a methyl hydrogen polyoxyalkylene having two ends blocked by a dimethylhydroquinoloxy group, a dimethyl methoxy alkane and a methylphenyl group. a copolymer of decane, a copolymer composed of (CH 3 ) 2 HSiO 1/2 units, (CH 3 ) 3 HSiO 1/2 units, and SiO 4/2 units, from (CH 3 ) 2 HSiO 1/2 a copolymer composed of a unit and an SiO 4/2 unit, a copolymer composed of a (CH 3 ) 2 HSiO 1/2 unit, a SiO 4/2 unit, and a (C 6 H 5 ) 3 SiO 1/2 unit, and each of the above compounds A compound in which a part or all of a methyl group is substituted with another alkyl group or a phenyl group such as an ethyl group or a propyl group, and a compound represented by the structural formula (3) shown below, although this is a non-exhaustive list.

(R3 R1 2 SiO1/2 )2 (HR1 SiO)r (R1 2 SiO)s    (3)(R 3 R 1 2 SiO 1/2 ) 2 (HR 1 SiO) r (R 1 2 SiO) s (3)

(其中H表示氫原子,R1 表示具有1至10個碳原子不含脂族不飽和鍵之相同或不同單價烴基,R3 與H或R1 相同,且r及s為滿足1≦r≦250且0≦s≦250之整數,其限制條件為8≦r+s≦250,儘管若R3 為R1 基,則r必須為3或更大)。R1 之實例包括諸如甲基、乙基或丙基之烷基及諸如苯基或甲苯基之芳基,然而自改良加成反應速率之觀點來看,甲基係較佳。組份(B)可單獨使用或與兩種或兩種以上不同化合物組合使用。(wherein H represents a hydrogen atom, and R 1 represents the same or different monovalent hydrocarbon group having 1 to 10 carbon atoms which does not contain an aliphatic unsaturated bond, R 3 is the same as H or R 1 , and r and s are 1 ≦r≦ An integer of 250 and 0 ≦ s ≦ 250, the constraint is 8 ≦ r + s ≦ 250, although if R 3 is a R 1 group, r must be 3 or more). Examples of R 1 include an alkyl group such as a methyl group, an ethyl group or a propyl group, and an aryl group such as a phenyl group or a tolyl group, however, a methyl group is preferred from the viewpoint of a modified addition reaction rate. Component (B) may be used alone or in combination with two or more different compounds.

組份(B)之摻合量通常在每100質量份之組份(A)中的0.5至10.0質量份範圍內,且較佳為1.0至8.0質量份。此外,組份(B)中之SiH基相對於組份(A)內與矽原子鍵結之烯基的莫耳比較佳在1.0至5.0範圍內。若此莫耳比太小,則不能形成有利之固化膜,而若比率太大,則剝離抗性增加,此亦為不合意的。組份之摻合量甚至更佳經調節使得此莫耳比在1.3至4.0範圍內。The blending amount of the component (B) is usually in the range of 0.5 to 10.0 parts by mass per 100 parts by mass of the component (A), and preferably 1.0 to 8.0 parts by mass. Further, the SiH group in the component (B) is preferably in the range of from 1.0 to 5.0 with respect to the molar of the alkenyl group bonded to the ruthenium atom in the component (A). If the molar ratio is too small, a favorable cured film cannot be formed, and if the ratio is too large, the peeling resistance is increased, which is also undesirable. The blending amount of the components is even more preferably adjusted so that the molar ratio is in the range of 1.3 to 4.0.

組份(C)之加成反應延遲劑為所謂之使用壽命延遲 劑,其延遲組份(D)之以鉑族金屬為主之催化劑在常溫條件下之催化活性,藉此延長本發明組成物之可用壽命時間。此加成反應延遲劑之實例包括習知化合物,諸如各種有機氮化合物、有機磷化合物、以乙炔為主之化合物、肟化合物及有機氯化合物,其可單獨使用或與兩種或兩種以上不同化合物組合使用。乙炔醇及乙炔醇之矽化產物尤其較佳。Component (C) Addition reaction retarder is the so-called lifetime delay The agent, which delays the catalytic activity of the platinum group metal-based catalyst of the component (D) under normal temperature conditions, thereby prolonging the usable life time of the composition of the present invention. Examples of the addition reaction retarder include conventional compounds such as various organic nitrogen compounds, organophosphorus compounds, acetylene-based compounds, hydrazine compounds, and organochlorine compounds, which may be used alone or in combination of two or more. The compounds are used in combination. Deuterated products of acetylene alcohol and acetylene alcohol are especially preferred.

組份(C)之摻合量僅需要為有效量,且為了在本發明組成物之固化性及使用壽命之間實現有利平衡,摻合量通常在每100質量份之組份(A)中的0.01至10質量份,且較佳0.05至5質量份範圍內。The blending amount of the component (C) is only required to be an effective amount, and in order to achieve a favorable balance between the curability and the service life of the composition of the present invention, the blending amount is usually in the component (A) per 100 parts by mass. It is in the range of 0.01 to 10 parts by mass, and preferably 0.05 to 5 parts by mass.

組份(D)之以鉑族金屬為主之催化劑為使在組份(A)內與矽原子鍵結之烯基與組份(B)內與矽原子鍵結之氫原子的加成反應加速的催化劑,且可使用已知為加成反應催化劑之以鉑族金屬為主之化合物。此等以鉑族金屬為主之催化劑之實例包括以鉑為主、以鈀為主及以銠為主之催化劑,且其中以鉑為主之催化劑係特別較佳的。此等以鉑為主之催化劑之實例包括氯鉑酸、氯鉑酸之醇溶液或醛溶液及氯鉑酸與多種烯烴或乙烯基矽氧烷中之任一者的錯合物。The platinum group metal-based catalyst of the component (D) is an addition reaction of an alkenyl group bonded to a ruthenium atom in the component (A) and a hydrogen atom bonded to a ruthenium atom in the component (B). An accelerated catalyst, and a platinum group metal-based compound known as an addition reaction catalyst can be used. Examples of such platinum group-based catalysts include platinum-based, palladium-based and rhodium-based catalysts, and platinum-based catalysts are particularly preferred. Examples of such platinum-based catalysts include chloroplatinic acid, an alcoholic or aldehyde solution of chloroplatinic acid, and a complex of chloroplatinic acid with any of a variety of olefins or vinyl siloxanes.

所添加之以鉑族金屬為主之催化劑的量僅需要為有效催化量,且自實現有利固化膜且保持經濟可行性之觀點來看,相對於組份(A)重量之鉑族金屬重量形式所報導的所添加之量通常在1至1,000 ppm範圍內,且較佳為10至 300 ppm。The amount of the platinum group metal-based catalyst added needs only to be an effective catalytic amount, and the weight of the platinum group metal relative to the weight of the component (A) from the viewpoint of realizing a favorable cured film and maintaining economic feasibility. The amount added is usually in the range of 1 to 1,000 ppm, and preferably 10 to 300 ppm.

本發明之組成物可藉由一起摻合預定量之上述組份(A)至(D)而獲得,然而除上述組份外,組成物亦可包括每100質量份之產物(A)中0至30質量份由如下所示之結構式(2)表示之組份(E)。The composition of the present invention can be obtained by blending a predetermined amount of the above components (A) to (D) together, however, in addition to the above components, the composition may also include 0 per 100 parts by mass of the product (A). Up to 30 parts by mass of the component (E) represented by the structural formula (2) shown below.

(其中p及q分別為滿足0≦p≦20及0≦q≦20之整數,其限制條件為14≦p+q≦20)。(where p and q are integers satisfying 0≦p≦20 and 0≦q≦20, respectively, and the constraint is 14≦p+q≦20).

組份(E)為雙鏈烯烴或所謂反應性稀釋劑,且不僅降低組成物黏度及改良塗層性質,而且亦改良組成物對膜基板之黏著。雙鏈烯烴在加熱固化期間展現比具有相同碳原子數之等效α-烯烴低的揮發性,且在限制條件為14≦p+q≦20下,可防止加熱固化期間產生之白色煙霧問題。Component (E) is a double-chain olefin or a so-called reactive diluent, and not only reduces the viscosity of the composition and improves the properties of the coating, but also improves the adhesion of the composition to the film substrate. The double-chain olefin exhibits a lower volatility than the equivalent α-olefin having the same number of carbon atoms during heat curing, and under the restriction condition of 14 ≦p + q ≦ 20, the white smog problem generated during heat curing can be prevented.

因為組份(E)經由與組份(B)內與矽原子鍵結之氫原子加成反應而併入固化膜內,所以在彼等使用組份(E)之狀況下,組份(B)之摻合量較佳經調節使得組份(B)內SiH基相對於組份(A)內與矽原子鍵結之烯基的莫耳比在1.5至5.0之範圍內。Since the component (E) is incorporated into the cured film by the addition reaction with the hydrogen atom bonded to the ruthenium atom in the component (B), the component (B) is used in the case where they are used in the component (E). The blending amount is preferably adjusted so that the molar ratio of the SiH group in the component (B) to the alkenyl group bonded to the ruthenium atom in the component (A) is in the range of 1.5 to 5.0.

組份(E)之摻合量較佳係在每100質量份之組份(A)中0至30質量份,甚至更佳0至25質量份範圍內且最佳為0.1至20質量份。若摻合量超過30質量份,則本發明組成物內組份之共溶性趨於劣化。The blending amount of the component (E) is preferably from 0 to 30 parts by mass, even more preferably from 0 to 25 parts by mass, and most preferably from 0.1 to 20 parts by mass per 100 parts by mass of the component (A). If the blending amount exceeds 30 parts by mass, the co-solubility of the components in the composition of the present invention tends to deteriorate.

由結構式(2)表示之雙鏈烯烴為市售的,且一實例為Idemitsu Kosan Co., Ltd所銷售之產品Linealene Dimer。The double-chain olefin represented by the structural formula (2) is commercially available, and an example is the product Linealene Dimer sold by Idemitsu Kosan Co., Ltd.

亦可添加用於賦予組成物光滑性之諸如高黏度二甲基聚矽氧烷及其類似物的其他添加劑以作為額外視情況可選之組份。可添加典型數量之該等視情況可選組份,其前提為其不損害本發明之作用。Other additives such as high viscosity dimethyl polyoxyalkylene and the like for imparting smoothness to the composition may also be added as an optional component as the case may be. A typical number of such optional components can be added without prejudice to the effects of the present invention.

在本發明聚矽氧組成物之較佳製備中,將添加有組份(E)及任何其他視情況可選用組份之組份(A)至(C)首先均勻混合在一起,且接著最後添加組份(D)。各組份可為單個材料或兩種或兩種以上不同材料之組合。然而,整體組成物在25℃下之黏度必須在100至1,500 mPa‧s範圍內。若黏度超過1,500 mPa‧s,則塗層性質劣化,使組成物難以實際應用。In the preferred preparation of the polyxanthene composition of the present invention, the components (A) to (C) to which the component (E) and any other optional components are added are first uniformly mixed together, and then finally Add component (D). Each component can be a single material or a combination of two or more different materials. However, the viscosity of the overall composition at 25 ° C must be in the range of 100 to 1,500 mPa ‧ s. If the viscosity exceeds 1,500 mPa‧s, the properties of the coating are deteriorated, making the composition difficult to practically apply.

下文呈現一個製造根據本發明第二態樣之剝離膜之方法之實例的描述。然而,本發明之剝離膜不僅限於使用如下方法製造之剝離膜,且亦可使用其他習知製造方法。A description of an example of a method of manufacturing a release film according to a second aspect of the present invention is presented below. However, the release film of the present invention is not limited to the release film produced by the following method, and other conventional production methods may be used.

用作施加本發明組成物以形成固化膜之基板的塑膠膜之實例包括由諸如聚酯、聚丙烯、聚乙烯、聚氯乙烯、聚四氟乙烯及聚醯亞胺之合成樹脂所製備的薄膜。基板膜之厚度較佳在10μm至150μm,且甚至更佳在15μm至100μm範圍內。Examples of the plastic film used as the substrate to which the composition of the present invention is applied to form a cured film include films prepared from synthetic resins such as polyester, polypropylene, polyethylene, polyvinyl chloride, polytetrafluoroethylene, and polyimine. . The thickness of the substrate film is preferably from 10 μm to 150 μm, and even more preferably in the range of from 15 μm to 100 μm.

可使用習知方法將本發明組成物施加至上述基板上,包括間接凹版(gravure-offset)三輥法或包含5至6個輥之多階輥筒法。施加至基板上之組成物之數量通常在0.01至 5.0 g/m2 範圍內,且較佳為0.1至2.0 g/m2 。組成物可施加於整個基板表面上,或可以局部方式施加於彼等需要剝離特性之位置。在施加至基板後,藉由在60至200℃,且較佳70至180℃之溫度下加熱歷時1秒至5分鐘之時期使組成物固化,因此形成本發明之剝離膜。以此方式形成於基板膜上之固化膜的厚度較佳在0.01μm至5.0μm範圍內,且甚至更佳為0.1μm至2.0μm。The composition of the present invention can be applied to the above substrate by a conventional method, including a three-roll method of indirect gravure-offset or a multi-step roll method containing 5 to 6 rolls. The amount of the composition applied to the substrate is usually in the range of 0.01 to 5.0 g/m 2 , and preferably 0.1 to 2.0 g/m 2 . The composition may be applied to the entire surface of the substrate or may be applied in a localized manner to locations where peeling properties are desired. After application to the substrate, the composition is cured by heating at a temperature of 60 to 200 ° C, and preferably 70 to 180 ° C for a period of 1 second to 5 minutes, thereby forming the release film of the present invention. The thickness of the cured film formed on the substrate film in this manner is preferably in the range of 0.01 μm to 5.0 μm, and even more preferably 0.1 μm to 2.0 μm.

[實施例][Examples]

以下為基於一系列實施例及比較實施例的本發明說明之描述,然而本發明不以任何方式受限制於下文呈現之實例。在各實施例中,份數係指“質量份”,且黏度值係指25℃下量測之值。The following is a description of the invention based on a series of examples and comparative examples, but the invention is not limited in any way to the examples presented below. In each of the examples, the number of parts means "parts by mass", and the viscosity value means a value measured at 25 °C.

黏著(初始及隨後之老化)、剝除強度及各聚矽氧組成物之殘餘黏著比係使用下文所述之方法所量測。Adhesion (initial and subsequent aging), stripping strength, and residual tack ratio of each polyoxymethylene composition were measured using the methods described below.

(黏著:初始及隨後之老化)(adhesive: initial and subsequent aging)

將預定數量之聚矽氧組成物施加至膜狀或片狀基板表面,且接著在設定為預定溫度之熱空氣乾燥器中加熱歷時預定時期,藉此產生固化膜。在固化後,立即以手指橫跨固化膜表面來回刮擦10次,且由膜是否分離以評估初始黏著,且以如下方式報導。A predetermined amount of the polyoxymethylene composition is applied to the surface of the film or sheet substrate, and then heated in a hot air drier set to a predetermined temperature for a predetermined period of time, thereby producing a cured film. Immediately after curing, the fingers were scratched back and forth 10 times across the surface of the cured film, and whether the film was separated to evaluate the initial adhesion, and was reported as follows.

未分離:ONot separated: O

分離:XSeparation: X

將固化膜樣本在大氣壓下在25℃及60%濕度下儲存20天,且接著將膜以與上文所述相同之方式用手指刮擦。使 用符號O評估未分離之薄膜。對於在20天結束前在上述類型之手指刮擦下分離的薄膜而言,老化後之黏著記錄為發生分離之天數。The cured film sample was stored under atmospheric pressure at 25 ° C and 60% humidity for 20 days, and then the film was scratched with a finger in the same manner as described above. Make The unseparated film was evaluated by the symbol O. For films that were separated under the above-mentioned type of finger scraping before the end of 20 days, the adhesion after aging was recorded as the number of days of separation.

(剝除強度)(stripping strength)

將預定量之聚矽氧組成物塗佈至膜狀基板之表面上,且接著在設定為預定溫度之熱空氣乾燥器中加熱預定時期,藉此產生固化膜。隨後,將固化膜在25℃下在分離器中老化24小時,使用濕式方法以足夠形成130μm厚之塗層之量將丙烯酸系溶劑為主之感壓性黏著劑(產品名稱:BPS-5127,由Toyo Ink Mfg. Co., Ltd.製造)塗佈至固化膜表面,且接著使結構在100℃下熱處理3分鐘。隨後,使具有與經聚矽氧組成物塗覆之膜狀基板相同之材料的表面片材與經處理表面黏合,且在25℃下進行老化歷時20小時。將所得層製品切成寬50mm之條帶,在條帶狀試樣之一個邊緣輕輕地將表面片材自剝離膜剝除,使用拉力測試器(DSC-500測試器,由Shimadzu公司製造)緊握兩個邊緣,接著將表面片材以180度之角度及0.3 m/min之剝除速率拉離且與剝離膜分離剝除。量測對達成此剝除所需之最小力(N)。A predetermined amount of the polyoxymethylene composition is applied onto the surface of the film substrate, and then heated in a hot air drier set to a predetermined temperature for a predetermined period of time, thereby producing a cured film. Subsequently, the cured film was aged in a separator at 25 ° C for 24 hours, and an acrylic solvent-based pressure-sensitive adhesive was used in a wet method to form a coating layer having a thickness of 130 μm (product name: BPS-5127) It was applied to the surface of the cured film by Toyo Ink Mfg. Co., Ltd., and then the structure was heat-treated at 100 ° C for 3 minutes. Subsequently, a surface sheet having the same material as the film-form substrate coated with the polyfluorene oxide composition was bonded to the treated surface, and aging was performed at 25 ° C for 20 hours. The obtained laminate was cut into strips having a width of 50 mm, and the surface sheet was gently peeled off from the release film at one edge of the strip-shaped sample, and a tensile tester (DSC-500 tester, manufactured by Shimadzu Corporation) was used. The two edges were gripped, and then the surface sheet was pulled away at an angle of 180 degrees and a stripping rate of 0.3 m/min and peeled off from the release film. Measure the minimum force (N) required to achieve this strip.

(殘餘黏著比)(residual adhesion ratio)

以與剝除強度量測相同之方式製備具有在基板表面上形成之聚矽氧組成物固化膜之剝離片材,使聚酯感壓性黏著條帶(產品名稱:第31B號帶,由Nitto Denko公司製造)與剝離片材表面黏合,且接著當在70℃下進行老化歷 時20小時的同時施加1.96 kPa負載。隨後,將感壓性黏著帶自剝離片材剝除,且使其與不鏽鋼片材黏合。接著輕輕地剝除感壓性黏著帶之一個邊緣,且接著緊握此邊緣且以相對於不鏽鋼片材180度角度之方向以0.3 m/minute之剝除速率剝除。量測對達成此剝除所需之最小力A (N)。此外,作為空白,亦使聚酯感壓性黏著帶與Teflon(註冊商標)片材黏合,且隨後以與上文相同之方式處理,量測自不鏽鋼片材剝除帶所需之最小力B(N)。將(A/B)×100(%)之值記述為殘餘黏著比。A release sheet having a cured film of a polysiloxane composition formed on the surface of the substrate was prepared in the same manner as the measurement of the peeling strength to make a pressure-sensitive adhesive tape of the polyester (product name: No. 31B, by Nitto Denko made) bonded to the surface of the release sheet, and then aging at 70 ° C Apply a load of 1.96 kPa at the same time for 20 hours. Subsequently, the pressure-sensitive adhesive tape was peeled off from the release sheet and bonded to the stainless steel sheet. One edge of the pressure-sensitive adhesive tape was then gently peeled off, and then the edge was gripped and peeled off at a stripping rate of 0.3 m/minute with respect to the direction of the 180-degree angle of the stainless steel sheet. Measure the minimum force A (N) required to achieve this strip. Further, as a blank, the polyester pressure-sensitive adhesive tape was also bonded to a Teflon (registered trademark) sheet, and then treated in the same manner as above, and the minimum force required for peeling the strip from the stainless steel sheet was measured. (N). The value of (A/B) × 100 (%) is described as the residual adhesion ratio.

[合成實施例1:組份(A)之製備][Synthesis Example 1: Preparation of Component (A)]

在裝配有攪拌器、溫度計、回流冷凝器及滴液漏斗之四頸燒瓶中裝入900g通式(1)之二甲基聚矽氧烷,其中R1 表示甲基,R2 表示乙烯基,a=146,b=0,乙烯基含量為0.018 mol/100g,且黏度為400 mPa‧s,亦即由如下所示作為組份(A1)之平均組成結構式(1-1)表示之二甲基聚矽氧烷, A four-necked flask equipped with a stirrer, a thermometer, a reflux condenser, and a dropping funnel was charged with 900 g of a dimethylpolyoxane of the formula (1), wherein R 1 represents a methyl group and R 2 represents a vinyl group. a = 146, b = 0, the vinyl content is 0.018 mol / 100 g, and the viscosity is 400 mPa ‧ s, that is, as shown by the average composition formula (1-1) of the component (A1) Methyl polyoxane,

及藉由使環狀二甲基聚矽氧烷與10質量%氫氧化鉀反應而預先製得之1.0g矽酸鉀,且接著在氮氣氛下將溫度升至120℃,藉此將矽酸鉀完全溶解於含乙烯基之二甲基聚矽氧烷中。將所得溶液冷卻至60℃,且接著將作為組份 (A2)包含R3 SiO1/2 單元(其中R表示甲基或羥基)及SiO4/2 單元之MQ樹脂(活性組份:100g),其R3 SiO1/2 單元/SiO4/2 單元之莫耳比為0.75且OH基含量為0.03mol/100g之143g 70%甲苯溶液添加至溶液中。接著將所得混合物之溫度再次升高,且使反應在140℃下進行6小時,同時自系統移除所產生之縮合水。隨後,將溫度冷卻至120℃,接著將1.5g 2-氯乙醇添加至經冷卻混合物中,且在120℃下中和2小時後,在減壓下進行汽提以產生有機聚矽氧烷A-i。此有機聚矽氧烷之乙烯基含量為0.016mol/100g(有機聚矽氧烷A-i),且黏度為440mPa.s。And 1.0 g of potassium citrate prepared in advance by reacting a cyclic dimethyl polysiloxane with 10% by mass of potassium hydroxide, and then raising the temperature to 120 ° C under a nitrogen atmosphere, thereby using citric acid Potassium is completely dissolved in the vinyl-containing dimethyl polyoxane. The resulting solution was cooled to 60 ° C, and then, as component (A2), an MQ resin containing R 3 SiO 1/2 unit (wherein R represents a methyl group or a hydroxyl group) and a SiO 4/2 unit (active component: 100 g) was used. 143 g of a 70% toluene solution having a molar ratio of R 3 SiO 1/2 unit/SiO 4/2 unit of 0.75 and an OH group content of 0.03 mol/100 g was added to the solution. The temperature of the resulting mixture was then raised again, and the reaction was allowed to proceed at 140 ° C for 6 hours while removing the resulting condensation water from the system. Subsequently, the temperature was cooled to 120 ° C, then 1.5 g of 2-chloroethanol was added to the cooled mixture, and after neutralizing at 120 ° C for 2 hours, stripping under reduced pressure to produce an organopolyoxane Ai . The organic polyoxyalkylene has a vinyl content of 0.016 mol/100 g (organopolyoxyalkylene Ai) and a viscosity of 440 mPa. s.

[合成實施例2:組份(A)之製備][Synthesis Example 2: Preparation of component (A)]

向燒瓶中裝入900g由上文平均組成結構式(1-1)表示的含乙烯基之二甲基聚矽氧烷作為組份(A1),包含R3 SiO1/2 單元(其中R表示甲基或羥基)及SiO4/2 單元且其中R3 SiO1/2 單元/SiO4/2 單元之莫耳比為1.15且OH基含量為0.06mol/100g之MQ樹脂(活性組份:100g)的143g 70%甲苯溶液作為組份(A2),及1.0g合成實施例1中所用之矽酸鉀。接著在氮氣氛下將所得混合物之溫度升高,且使反應在140℃下進行6小時,同時自系統移除所產生之縮合水。將因此所獲得之反應混合物之溫度冷卻至70℃,添加0.5g三甲基氯矽烷,且在70℃下中和2小時後,在減壓下進行汽提,以產生有機聚矽氧烷A-ii。此有機聚矽氧烷之乙烯基含量為0.016mol/100g(有機聚矽氧烷A-ii),且黏度為430mPa.s。The flask was charged with 900 g of a vinyl group-containing dimethylpolysiloxane represented by the above average composition formula (1-1) as a component (A1) containing R 3 SiO 1/2 unit (wherein R represents MQ resin having a methyl or hydroxy group and a SiO 4/2 unit and wherein the R 3 SiO 1/2 unit/SiO 4/2 unit has a molar ratio of 1.15 and an OH group content of 0.06 mol/100 g (active component: 100 g) 143 g of a 70% toluene solution was used as the component (A2), and 1.0 g of potassium citrate used in Synthesis Example 1. The temperature of the resulting mixture was then raised under a nitrogen atmosphere, and the reaction was allowed to proceed at 140 ° C for 6 hours while removing the resulting condensation water from the system. The temperature of the reaction mixture thus obtained was cooled to 70 ° C, 0.5 g of trimethylchloromethane was added, and after neutralizing at 70 ° C for 2 hours, stripping was carried out under reduced pressure to produce an organopolyoxane A. -ii. The organic polydecane has a vinyl content of 0.016 mol/100 g (organopolyoxyalkylene A-ii) and a viscosity of 430 mPa. s.

[合成實施例3:組份(A)之製備][Synthesis Example 3: Preparation of component (A)]

除使用850g通式(1)之二甲基聚矽氧烷,其中R1 表示甲基,R2 表示乙烯基,a=177,b=1,乙烯基含量為0.022mol/100g,且黏度為500mPa.s,亦即由平均組成結構式(1-2)表示之二甲基聚矽氧烷作為組份(A1), Except that 850 g of the dimethyl polyoxyalkylene of the formula (1) is used, wherein R 1 represents a methyl group, R 2 represents a vinyl group, a = 177, b = 1, a vinyl content of 0.022 mol / 100 g, and a viscosity of 500mPa. s, that is, a dimethylpolysiloxane represented by an average composition formula (1-2) as a component (A1),

及214g於合成實施例1中所用之MQ樹脂的相同70%甲苯溶液(活性組份:150g)作為組份(A2)之外,以與合成實施例1相同之方式製備有機聚矽氧烷A-iii。此有機聚矽氧烷之乙烯基含量為0.019mol/100g(有機聚矽氧烷A-iii),且黏度為560mPa.s。An organopolyoxane A was prepared in the same manner as in Synthesis Example 1, except that 214 g of the same 70% toluene solution (active component: 150 g) of the MQ resin used in Synthesis Example 1 was used as the component (A2). -iii. The organic polyoxane has a vinyl content of 0.019 mol/100 g (organopolyoxyalkylene A-iii) and a viscosity of 560 mPa. s.

[參考實施例1][Reference Example 1]

向含有100份之於合成實施例1中獲得之有機聚矽氧烷A-i作為組份(A)及2.2份由如下所示之平均組成結構式(3-1)表示之甲基氫聚矽氧烷作為組份(B)[SiH/(SiCH=CH2 )=2.0]100 parts of the organopolysiloxane Ai obtained in Synthesis Example 1 as component (A) and 2.2 parts of methylhydropolyoxyl represented by the average composition formula (3-1) shown below Alkane as component (B) [SiH/(SiCH=CH 2 )=2.0]

的混合物中添加0.2份之1-乙炔基-1-環己醇作為組份(C),且繼續攪拌直至獲得均勻混合物。向所獲得之混合物中添加足夠量之由結構式Pt/[H2 C=C(CH3 )2 Si]2 O表示之鉑與乙烯基矽氧烷的錯合物作為組份(D),以提供相對於有機聚矽氧烷A-i之100ppm鉑的等效物,藉此產生黏度為406mPa.s之聚矽氧組成物。To the mixture was added 0.2 part of 1-ethynyl-1-cyclohexanol as component (C), and stirring was continued until a homogeneous mixture was obtained. To the obtained mixture, a sufficient amount of a complex of platinum and vinyl siloxane represented by the structural formula Pt/[H 2 C=C(CH 3 ) 2 Si] 2 O is added as component (D), To provide an equivalent of 100 ppm of platinum relative to the organopolyoxane Ai, thereby producing a viscosity of 406 mPa.聚聚矽 oxygen composition.

隨後,使用0.4至0.5g/m2 之塗佈量將所製備之聚矽氧組成物塗佈於厚度為25μm之聚酯膜(產品名稱:Lumirror第25號,S10,由Kimoto Co.,Ltd.製造)上,且接著藉由在120℃下加熱20秒以形成固化膜。量測此固化膜之黏著,剝除強度及殘餘黏著比。此等量測之結果展示於表2中。Subsequently, the prepared polyfluorene oxide composition was applied to a polyester film having a thickness of 25 μm using a coating amount of 0.4 to 0.5 g/m 2 (product name: Lumirror No. 25, S10, by Kimoto Co., Ltd.) On the manufacturing, and then by heating at 120 ° C for 20 seconds to form a cured film. The adhesion, peeling strength and residual adhesion ratio of the cured film were measured. The results of these measurements are shown in Table 2.

[參考實施例2][Reference Example 2]

除了使用合成實施例2中獲得之100份有機聚矽氧烷A-ii作為組份(A)外,使用與參考實施例1相同之程序製備黏度為400mPa.s的聚矽氧組成物,隨後形成固化膜,且接著評估固化膜之效能。結果展示於表2中。The viscosity was determined to be 400 mPa using the same procedure as in Reference Example 1, except that 100 parts of the organopolyoxane A-ii obtained in Synthesis Example 2 was used as the component (A). The polyfluorene composition of s, followed by formation of a cured film, and then evaluation of the effectiveness of the cured film. The results are shown in Table 2.

[參考實施例3][Reference Example 3]

除了使用100份合成實施例3中獲得之有機聚矽氧烷A-iii作為組份(A),且使用2.6份由平均組成結構式(3-1)表示之甲基氫聚矽氧烷[SiH/(SiCH=CH2 )=2.0]作為組份(B)之外,使用與參考實施例1相同之程序製備黏度為505mPa.s之聚矽氧組成物,隨後形成固化膜,且接著評估固化膜之效能。結果展示於表2中。Except that 100 parts of the organopolysiloxane A-iii obtained in Synthesis Example 3 was used as the component (A), and 2.6 parts of the methylhydrogenpolysiloxane represented by the average composition formula (3-1) was used [ SiH / (SiCH = CH 2 ) = 2.0] As the component (B), the viscosity was 505 mPa using the same procedure as in Reference Example 1. The polyoxygen composition of s, followed by formation of a cured film, and then evaluation of the effectiveness of the cured film. The results are shown in Table 2.

[實施例1][Example 1]

除了使用2.8份在參考實施例1中用作組份(B)之甲基氫聚矽氧烷[SiH/(SiCH=CH2 )=2.5],且添加15份由如下所示之結構式(2-1)表示之雙鏈烯烴(Linealene Dimer A-20,由Idemitsu Kosan Co.,Ltd製造)作為組份(E)之外,使用與參考實施例1相同之程序製備黏度為220mPa.s之聚矽氧組成物,隨後形成固化膜,且接著評估該固化膜之效能。結果展示於表2中。Except that 2.8 parts of methylhydropolysiloxane (SiH/(SiCH=CH 2 )=2.5) used as the component (B) in Reference Example 1 was used, and 15 parts of the structural formula shown below were added ( 2-1) A double-chain olefin (Linealene Dimer A-20, manufactured by Idemitsu Kosan Co., Ltd.) was used as the component (E), and the viscosity was 220 mPa using the same procedure as in Reference Example 1. The polyoxygen composition of s, followed by formation of a cured film, and then evaluation of the effectiveness of the cured film. The results are shown in Table 2.

[比較實施例1至4][Comparative Examples 1 to 4]

使用表1所示之組份及摻合比,以與參考實施例1相同之方式製備比較實施例1至4之組成物。The compositions of Comparative Examples 1 to 4 were prepared in the same manner as in Reference Example 1 using the components shown in Table 1 and the blend ratio.

所用之各種組份、彼等組份每一者之摻合數量及參考實施例1至3、實施例1及比較實施例1至4之組成物每一者的黏度展示於表1中。The various components used, the blending amount of each of the components, and the viscosity of each of the compositions of Reference Examples 1 to 3, Example 1 and Comparative Examples 1 to 4 are shown in Table 1.

比較實施例3之組份(A2)為包含R3 SiO1/2 單元(其中R表示甲基、乙烯基或羥基)及SiO4/2 單元,其中R3 SiO1/2 單元/SiO4/2 單元之莫耳比為0.85,乙烯基含量為0.07mol/100g[組份(A2)],且羥基含量為0.03mol/100g[組份(A2)]之MQ樹脂的70%甲苯溶液。比較實施例4之組份(A1)為上述通式(1)之二甲基聚矽氧烷,其中R1 表示甲基,R2 表示乙烯基,a=10,b=0,乙烯基含量為0.21mol/100g[組份(Al)],黏度為10mPa.s。The component (A2) of Comparative Example 3 is a unit containing R 3 SiO 1/2 (wherein R represents a methyl group, a vinyl group or a hydroxyl group) and a SiO 4/2 unit, wherein R 3 SiO 1/2 unit / SiO 4 / The unit 2 had a molar ratio of 0.85, a vinyl content of 0.07 mol/100 g [component (A2)], and a hydroxyl group content of 0.03 mol/100 g [component (A2)] of a 70% toluene solution of MQ resin. The component (A1) of Comparative Example 4 is a dimethylpolyoxane of the above formula (1) wherein R 1 represents a methyl group, R 2 represents a vinyl group, a = 10, b = 0, and a vinyl content. It is 0.21 mol/100 g [component (Al)] and has a viscosity of 10 mPa. s.

使用比較實施例1至4之各聚矽氧組成物,使用與參考實施例1相同之程序以形成固化膜且接著評估固化膜之效能。結果展示於表2中。Using the respective polyfluorene oxide compositions of Comparative Examples 1 to 4, the same procedure as in Reference Example 1 was employed to form a cured film and then the efficacy of the cured film was evaluated. The results are shown in Table 2.

[比較實施例5][Comparative Example 5]

將56份如下所示之平均組成結構式(4)之有機聚矽氧烷,其乙烯基含量為0.57mol/100g且黏度為25mPa.s, 56 parts of the organic polyoxoxane having the average composition formula (4) shown below, having a vinyl content of 0.57 mol/100 g and a viscosity of 25 mPa. s,

34份由上述平均組成結構式(1-1)所示之在兩個分子鏈末端含有與矽原子鍵結之乙烯基的二甲基有機聚矽氧烷,10份由如下所示之平均組成結構式(5)表示之有機聚矽氧烷,其乙烯基含量為0.07mol/100g且黏度為1,000,000mPa.s, 34 parts of dimethylorganopolysiloxane having a vinyl group bonded to a ruthenium atom at the end of two molecular chains represented by the above average composition formula (1-1), 10 parts being composed of the average composition shown below The organopolysiloxane having the formula (5) has a vinyl content of 0.07 mol/100 g and a viscosity of 1,000,000 mPa. s,

39份由上述平均組成結構式(3-1)表示之甲基氫聚矽氧烷[SiH/(SiCH=CH2 )=1.8],及1.0份1-乙炔基-1-環己醇組合且接著攪拌直至獲得均勻混合物。向所得混合物中添 加足夠量之由結構式Pt/[H2 C=C(CH3 )2 Si]2 O表示之鉑與乙烯基矽氧烷的錯合物以提供相對於合併質量之由平均組成結構式(1-1)表示之二甲基有機聚矽氧烷及由平均組成結構式(5)表示之有機聚矽氧烷之100ppm鉑的等效物,藉此產生黏度為400mPa.s之聚矽氧組成物。使用此聚矽氧組成物,使用與參考實施例1相同之程序形成固化膜且接著評估該固化膜之效能。結果展示於表2中。39 parts of methylhydropolysiloxane (SiH/(SiCH=CH 2 )=1.8] represented by the above average composition formula (3-1), and 1.0 part of 1-ethynyl-1-cyclohexanol are combined and Stirring is then continued until a homogeneous mixture is obtained. To the resulting mixture, a sufficient amount of a complex of platinum and vinyl oxane represented by the structural formula Pt/[H 2 C=C(CH 3 ) 2 Si] 2 O is added to provide an average of the combined masses. The composition of the dimethylorganopolysiloxane of the formula (1-1) and the equivalent of 100 ppm of the platinum of the organopolysiloxane represented by the formula (5), thereby producing a viscosity of 400 mPa.聚聚矽 oxygen composition. Using this polyoxymethylene composition, a cured film was formed using the same procedure as in Reference Example 1 and then the efficacy of the cured film was evaluated. The results are shown in Table 2.

[表2] [Table 2]

由表2之結果,清楚的是本發明之無溶劑聚矽氧組成物產生不僅展現對塑膠膜有利的長期黏著而且亦展現良好剝離效能的固化膜。From the results of Table 2, it is clear that the solventless polyxanthene composition of the present invention produces a cured film which exhibits not only long-term adhesion to the plastic film but also good peeling performance.

Claims (4)

一種用於塑膠膜之無溶劑可固化聚矽氧剝離劑組成物,其在25℃下具有100至1,500mPa.s範圍內之黏度,且其係包含:(A)藉由在加熱下使用鹼性催化劑進行以下所述之組份(A1)與組份(A2)之間的反應所獲得之100質量份產物:(A1)97至80質量份之直鏈二有機聚矽氧烷,其在各分子內含有至少兩個與矽原子鍵結之烯基,其中烯基之量係在0.01至0.05mol/100g之範圍內,且25℃下之黏度係在100至1,500mPa.s範圍內,(A2)3至20質量份包含R3 SiO1/2 單元及SiO4/2 單元之聚有機矽氧烷,其中R代表相同或不同之具有1至10個碳原子不含脂族不飽和鍵的單價烴基,或羥基,其中R3 SiO1/2 單元與SiO4/2 單元之莫耳比係在0.6至1.5範圍內,其中該組份(A1)與該組份(A2)之合併量為100質量份,(B)0.5至10質量份之有機氫聚矽氧烷,其在各分子內含有至少三個與矽原子鍵結之氫原子,且25℃下之黏度係在5至1,000mPa.s範圍內,(C)有效量之加成反應延遲劑,(D)有效量之以鉑族金屬為主之催化劑,及(E)每100質量份之該組份(A)中有0.1至30質量份由如下式(2)表示之雙鏈烯烴: 其中p及q分別為滿足0≦p≦20及0≦q≦20之整數,其限制條件為14≦p+q≦20。A solvent-free curable polyxanthoxy stripper composition for a plastic film having a temperature of 100 to 1,500 mPa at 25 ° C. The viscosity in the range of s, and it comprises: (A) 100 parts by mass of the product obtained by the reaction between the component (A1) and the component (A2) described below by using a basic catalyst under heating. : (A1) 97 to 80 parts by mass of a linear diorganopolysiloxane having at least two alkenyl groups bonded to a ruthenium atom in each molecule, wherein the amount of the alkenyl group is 0.01 to 0.05 mol/100 g. Within the range, and the viscosity at 25 ° C is between 100 and 1,500 mPa. In the range of s, (A2) 3 to 20 parts by mass of a polyorganosiloxane containing R 3 SiO 1/2 units and SiO 4/2 units, wherein R represents the same or different from 1 to 10 carbon atoms and contains no fat. a monovalent hydrocarbon group of a group unsaturated bond, or a hydroxyl group, wherein the molar ratio of the R 3 SiO 1/2 unit to the SiO 4/2 unit is in the range of 0.6 to 1.5, wherein the component (A1) and the component (A2) The combined amount is 100 parts by mass, (B) 0.5 to 10 parts by mass of the organohydrogenpolysiloxane having at least three hydrogen atoms bonded to the ruthenium atom in each molecule, and the viscosity at 25 ° C At 5 to 1,000 mPa. Within the range of s, (C) an effective amount of an addition reaction retarder, (D) an effective amount of a platinum group metal-based catalyst, and (E) 0.1 to 100 parts per 100 parts by mass of the component (A) 30 parts by mass of the double-chain olefin represented by the following formula (2): Where p and q are integers satisfying 0≦p≦20 and 0≦q≦20, respectively, and the constraint condition is 14≦p+q≦20. 如申請專利範圍第1項之無溶劑可固化聚矽氧剝離劑組成物,其中含烯基之二有機聚矽氧烷的組份(A1)為由如下所示之通式(1)表示之直鏈二有機聚矽氧烷:(R2 R1 2 SiO1/2 )2 (R1 2 SiO2/2 )a (R2 R1 SiO2/2 )b (1)其中R2 為由-(CH2 )c -CH=CH2 表示之烯基,其中c為0至8之整數,R1 表示相同或不同之具有1至10個碳原子不含脂族不飽和鍵的單價烴基,且a及b分別為滿足60≦a≦280且0≦b≦10之整數。The solvent-free curable polydecane oxygen stripper composition according to claim 1, wherein the component (A1) of the alkenyl group-containing diorganopolysiloxane is represented by the formula (1) shown below. Linear diorganopolyoxy siloxane: (R 2 R 1 2 SiO 1/2 ) 2 (R 1 2 SiO 2/2 ) a (R 2 R 1 SiO 2/2 ) b (1) wherein R 2 is -(CH 2 ) c -CH=CH 2 represents an alkenyl group, wherein c is an integer of 0 to 8, and R 1 represents the same or different monovalent hydrocarbon group having 1 to 10 carbon atoms which does not contain an aliphatic unsaturated bond, And a and b are integers satisfying 60≦a≦280 and 0≦b≦10, respectively. 如申請專利範圍第1項之無溶劑可固化聚矽氧剝離劑組成物,其中係藉由將100質量份之該組份(A1)之直鏈二有機聚矽氧烷與該組份(A2)之聚有機矽氧烷的組合在0.001至2.0質量份之鹼性催化劑存在下,於80至180℃之溫度下反應0.5至24小時以產生反應混合物,隨後將0.005至3.0質量份之中和劑添加至獲得之反應混合物中,及在40至160℃之溫度下進行中和反應而獲得該組份(A)之產物。 The solvent-free curable polyfluorene stripper composition according to claim 1, wherein 100 parts by mass of the linear diorganopolyoxyalkylene of the component (A1) and the component (A2) are used. a combination of polyorganosiloxanes in the presence of 0.001 to 2.0 parts by mass of a basic catalyst at a temperature of 80 to 180 ° C for 0.5 to 24 hours to produce a reaction mixture, followed by neutralization of 0.005 to 3.0 parts by mass The agent is added to the obtained reaction mixture, and a neutralization reaction is carried out at a temperature of 40 to 160 ° C to obtain a product of the component (A). 一種可剝離塑膠膜,其係包含塑膠膜基板及形成於該塑膠膜基板之至少一個表面上的如申請專利範圍第1項之無溶劑可固化聚矽氧剝離劑組成物的固化膜。A peelable plastic film comprising a plastic film substrate and a cured film of the solvent-free curable polyfluorene stripper composition according to claim 1 of at least one surface of the plastic film substrate.
TW097107297A 2007-03-05 2008-03-03 Solvent-free polyfluorene stripper composition for film and release film using the same TWI479003B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007054044A JP4782046B2 (en) 2007-03-05 2007-03-05 Solvent-free silicone release agent composition for film and release film using the same

Publications (2)

Publication Number Publication Date
TW200848484A TW200848484A (en) 2008-12-16
TWI479003B true TWI479003B (en) 2015-04-01

Family

ID=39834932

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097107297A TWI479003B (en) 2007-03-05 2008-03-03 Solvent-free polyfluorene stripper composition for film and release film using the same

Country Status (4)

Country Link
JP (1) JP4782046B2 (en)
KR (1) KR101418599B1 (en)
CN (1) CN101260240B (en)
TW (1) TWI479003B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5338626B2 (en) * 2009-11-10 2013-11-13 信越化学工業株式会社 Silicone adhesive composition and adhesive film
JP5343911B2 (en) * 2010-04-09 2013-11-13 信越化学工業株式会社 Release agent composition for solvent-free silicone adhesive and release sheet
KR101707863B1 (en) * 2010-12-27 2017-02-17 미쓰비시 쥬시 가부시끼가이샤 Mold release film
JP5626238B2 (en) * 2012-02-23 2014-11-19 信越化学工業株式会社 Addition-curable silicone emulsion release composition and release film
JP2013202830A (en) * 2012-03-27 2013-10-07 Lintec Corp Release sheet
TWI599490B (en) * 2013-01-18 2017-09-21 財團法人工業技術研究院 Release layer, flexible device using the same, and manufacturing method of flexible substrate
WO2017200056A1 (en) * 2016-05-20 2017-11-23 三菱ケミカル株式会社 Mold release film
JP6803246B2 (en) * 2016-07-11 2020-12-23 信越化学工業株式会社 Silicone composition, release paper and release film
JP7026588B2 (en) * 2018-07-03 2022-02-28 信越化学工業株式会社 Silicone composition, release sheet, release film, and method for manufacturing release sheet and release film
CN109679496A (en) * 2018-12-25 2019-04-26 广东鼎立森新材料有限公司 Release silicone oil of solvent-free organic silicon and preparation method thereof
TWI749410B (en) * 2019-11-28 2021-12-11 智和股份有限公司 Device and process for quickly removing solvent from materials
EP4166614A4 (en) * 2020-07-02 2023-12-20 Fuji Polymer Industries Co., Ltd. SILICONE GEL COMPOSITION AND SILICONE GEL SHEET

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006055233A1 (en) * 2004-11-18 2006-05-26 Dow Corning Corporation Silicone release coating compositions
TW200632062A (en) * 2004-12-08 2006-09-16 Shinetsu Chemical Co Solvent-free silicone adhesive composition

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1064640A (en) * 1975-08-18 1979-10-16 Robert W. Sandford (Jr.) Polysiloxane release coating of a substrate
JPS5286985A (en) * 1976-01-16 1977-07-20 Toray Silicone Co Ltd Peelable composition
US4386135A (en) * 1982-01-11 1983-05-31 Minnesota Mining And Manufacturing Company Stable silicone-coated release liner for pressure-sensitive adhesive sheets
DE3382370D1 (en) * 1982-09-10 1991-09-12 Gen Electric METHOD FOR PRODUCING AN ANTI-ADHAESIVE DIORGANOPOLYSILOXANE COMPOSITION.
JPH06293881A (en) 1993-01-25 1994-10-21 Sekisui Chem Co Ltd Tacky tape
GB9317813D0 (en) * 1993-08-27 1993-10-13 Dow Corning Sa Silicone emulsion compositions
GB9322794D0 (en) * 1993-11-05 1993-12-22 Dow Corning Silicone release compositions
GB9322793D0 (en) * 1993-11-05 1993-12-22 Dow Corning Silicone release compositions
JPH07216307A (en) * 1994-01-28 1995-08-15 Toray Dow Corning Silicone Co Ltd Silicone composition for forming cured abherent film
US5616672A (en) * 1995-11-17 1997-04-01 General Electric Company Paper release compositions having improved release characteristics
CN1194280A (en) * 1996-12-24 1998-09-30 陶氏康宁公司 Solidifying organic silicon composition with improved adhesive property
GB9917372D0 (en) * 1999-07-23 1999-09-22 Dow Corning Silicone release coating compositions
JP4123349B2 (en) * 2002-06-24 2008-07-23 信越化学工業株式会社 Laminated article of silicone release layer and silicone adhesive layer and method for producing the same
GB0316162D0 (en) * 2003-07-10 2003-08-13 Dow Corning Silicone release coating compositions
US20050038183A1 (en) * 2003-08-14 2005-02-17 Dongchan Ahn Silicones having improved surface properties and curable silicone compositions for preparing the silicones
JP2005075959A (en) * 2003-09-01 2005-03-24 Dow Corning Toray Silicone Co Ltd Adhesive silicone elastomer sheet
JP2005231355A (en) * 2004-01-23 2005-09-02 Shin Etsu Chem Co Ltd Release film
DE102004044943A1 (en) * 2004-09-16 2006-03-23 Wacker Chemie Ag Alkenyl-containing organopolysiloxanes
JP4892922B2 (en) * 2005-10-14 2012-03-07 信越化学工業株式会社 Heavy release control agent and silicone composition for solventless release paper using the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006055233A1 (en) * 2004-11-18 2006-05-26 Dow Corning Corporation Silicone release coating compositions
TW200632062A (en) * 2004-12-08 2006-09-16 Shinetsu Chemical Co Solvent-free silicone adhesive composition

Also Published As

Publication number Publication date
KR101418599B1 (en) 2014-07-14
CN101260240A (en) 2008-09-10
CN101260240B (en) 2012-06-06
TW200848484A (en) 2008-12-16
KR20080081832A (en) 2008-09-10
JP4782046B2 (en) 2011-09-28
JP2008214497A (en) 2008-09-18

Similar Documents

Publication Publication Date Title
TWI479003B (en) Solvent-free polyfluorene stripper composition for film and release film using the same
TWI460244B (en) Addition reaction hardening type silicone oxygen adhesive composition and adhesive tape
TWI440682B (en) Solventless silicone pressure-sensitive adhesive composition
EP3875542B1 (en) Silicone emulsion composition
EP3275961B1 (en) Laminate comprising release liner based on release agent composition for silicone adhesive
CN109415567B (en) Silicone composition, release paper and release film
JPH0978032A (en) Curable silicone release agent composition and release paper
WO2020026844A1 (en) Silicone adhesive agent composition, and adhesive tape or adhesive film using same
JP5569471B2 (en) Silicone composition for release paper or release film
US11104812B2 (en) Silicone composition, release paper, and release film
JP6874831B2 (en) Silicone composition for manufacturing release paper or release film
JP4892922B2 (en) Heavy release control agent and silicone composition for solventless release paper using the same
JP6413878B2 (en) Release agent composition for silicone adhesive and release film
CN111655816A (en) Solvent-free curable silicone release agent composition and release sheet
JP6515876B2 (en) Addition reaction curable silicone pressure sensitive adhesive composition and pressure sensitive adhesive tape
JP3813467B2 (en) Curable silicone release agent composition
JPWO2018131490A1 (en) Heavy release composition for release sheet and release sheet
JP5138205B2 (en) Silicone composition for solvent-free release paper
WO2018012296A1 (en) Silicone composition, release paper and release film
JP2005231355A (en) Release film
JP6957968B2 (en) Heavy release composition for release sheet and release sheet
JP3985995B2 (en) Solvent type silicone composition for mold release agent
JP4753023B2 (en) Silicone release agent composition and method for producing adhesive paper
JP2004017288A (en) Curable silicone release agent composition and release paper using the same
JP2007308865A (en) Silicone composition for peeling

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees