TWI475951B - Heat dissipation unit - Google Patents

Description

Cooling unit

The present invention relates to a heat dissipating unit, and more particularly to a heat dissipating unit having different filling materials.

Generally, electronic devices generate heat during use, so it is usually necessary to provide a heat dissipating unit to dissipate heat energy to prevent the electronic device from being damaged due to overheating. A common heat dissipating unit uses a heat pipe to transfer heat energy. The heat pipe has a filling material that can undergo phase change, and the heat transfer efficiency of the heat pipe can be increased by phase change. However, when the thermal energy generated by the electronic device exceeds the upper limit of the filling material, the filling material will no longer undergo a phase change, which will result in a significant decrease in the heat transfer efficiency of the heat pipe. In view of this, how to design a heat dissipation unit to solve the above problems has become an important issue.

An embodiment of the present invention provides a heat dissipating unit including a heat sink, a heat conducting member and a heat pipe, wherein the heat conducting member is connected to a heat source, and the heat pipe is connected to the heat conducting member and the heat sink, wherein the heat pipe comprises a pipe body and two filling materials. The tube body is formed with a first cavity and a second cavity. The two filling materials are respectively filled in the first cavity and the second cavity. When the heat conductive component transfers heat energy from the heat source to the heat pipe, the filling is filled. The material undergoes different phase changes that allow thermal energy to pass through the heat pipe to the heat sink.

In one embodiment, the filler material comprises a first material and a second material, wherein the first material is converted from a liquid state to a gaseous state during heat absorption, and is placed When it is hot, it changes from a gaseous state to a liquid state, and when the second material absorbs heat, it changes from a solid state to a liquid state, and when it is exothermic, it changes from a liquid state to a solid state.

In one embodiment, the first material has a boiling point between 25 ° C and 45 ° C.

In one embodiment, the second material has a melting point between 40 ° C and 60 ° C.

In one embodiment, the first cavity is located between the heat conductive member and the second cavity, and the first material and the second material are respectively disposed in the first and second cavity bodies.

In one embodiment, the first cavity is located between the heat conductive member and the second cavity, and the first material and the second material are respectively disposed in the second cavity and the first cavity.

In an embodiment, the first cavity surrounds the second cavity.

In an embodiment, a portion of the aforementioned second cavity protrudes from the first cavity.

In one embodiment, the first cavity is adjacent to the heat conductive member, the second cavity is located between the heat sink and the first cavity, and the heat sink surrounds the second cavity.

In an embodiment, the heat source comprises an electronic component, and the heat conductive component comprises a metal material.

First, referring to FIG. 1 , a heat dissipating unit 1 according to an embodiment of the present invention is disposed inside an electronic device for dissipating heat from an electronic component E in the electronic device. The electronic device is, for example, a notebook computer, a tablet computer or a mobile communication device, and the electronic component E can be, for example, a display card or a central device. processor. The heat dissipating unit 1 of the present invention mainly includes a heat sink 10, a heat conducting member 11 and a heat pipe 12. The heat conducting member 11 is, for example, a member made of a metal material, and is fixed to the electronic component E. The heat pipe 12 connects the heat conducting member 11 and the heat sink 10, When the electronic component E operates, a large amount of thermal energy is generated. At this time, the electronic component E can be regarded as a heat source, and the heat conductive member 11 can transfer the heat energy generated by the electronic component E to the heat pipe 12, and then transfer the heat energy to the left side via the heat pipe 12 (-X axis). The direction is transmitted to the heat sink 10, and finally the heat energy is dissipated by the heat sink 10.

Next, please refer to FIGS. 2A and 2B, wherein FIG. 2A is a cross-sectional view taken along line A-A in FIG. 1, and FIG. 2B is a cross-sectional view taken along line B-B in FIG. As shown in FIG. 2A, the heat pipe 12 in the embodiment mainly includes a pipe body 121 and two kinds of filling materials, wherein the pipe body 121 is formed with a first end S1, a second end S2, and a first closed cavity. The body 122 and the second cavity 123, wherein the first end S1 is adjacent to the electronic component E, the second end S2 is adjacent to the heat sink 10, the second cavity 123 is located above the first cavity 122, and the first cavity 122 Located between the heat conductive member 11 and the second cavity 123.

The foregoing two kinds of filling materials include a first material M1 and a second material M2. In the embodiment, the first material M1 may be a non-toxic liquid material having a boiling point between 25 ° C and 45 ° C, and has a low Surface tension; the second material M2 may be a solid thermal interface material having a melting point between 40 ° C and 60 ° C and having a high specific heat property. As shown, the first material M1 is disposed in the first cavity 122, and the second material M2 is disposed in the second cavity 123, wherein the heat pipe 12 transfers heat energy from the heat conductive member 11 to the left side (-X-axis direction). When the radiator 10 is reached, the first in the heat pipe 12 A material M1 and a second material M2 will respectively undergo different phase changes, thereby helping the heat pipe 12 to transfer thermal energy.

In more detail, the first material M1 is liquid at normal temperature, and when the electronic component E transfers thermal energy to the vicinity of the first end S1 of the heat pipe 12, the first material M1 in the first cavity 122 can absorb thermal energy and The liquid state is converted into a gaseous state; when the gaseous first material M1 approaches the second end S2 of the heat pipe 12, heat energy can be released to the heat sink 10 and converted from a gaseous state to a liquid state. As such, the first material M1 can create a cyclic convection within the first cavity 122 to effectively bring thermal energy to the heat sink 10.

As shown in FIG. 2A, the second material M2 is disposed in the second cavity 123 above the first material M1, wherein the second material M2 is solid at normal temperature, wherein the heat energy absorbed by the first material M1 can be transferred to the first Two materials M2. Since the first material M1 can generate cyclic convection in the first cavity 122, the thermal energy can be uniformly transferred to the second material M2, and the second material M2 is converted from the solid state to the liquid state; it should be understood that the second material in the liquid state M2 will flow to the second end S2 of the heat pipe 12, thereby releasing thermal energy to the heat sink 10 and returning from the liquid state to the solid state. In the present embodiment, the second material M2 acts as a heat storage, and can store or release a large amount of thermal energy by the phase change characteristic between the solid-liquid state, thereby helping the heat dissipation unit 1 to transfer heat energy more efficiently and dissipate heat.

Referring to FIG. 3A and FIG. 3B together, in another embodiment of the present invention, the first material M1 is disposed in the second cavity 123, and the second material M2 is disposed in the first cavity 122. The difference from the foregoing embodiment is that the thermal energy generated by the electronic component E is first transmitted to the second material M2 in the first chamber 122 through the heat conducting member 11, and then the second material M2 transfers the heat energy. The first material M1 to the top. Since the second material M2 has high specific heat property, a large amount of heat energy can be absorbed in the process of converting from a solid state to a liquid state, so that the first material M1 can be completely converted into a gaseous state due to absorption of excessive heat, resulting in a large decrease in heat transfer efficiency. occur.

Referring to FIG. 4A and FIG. 4B together, in another embodiment of the present invention, the first cavity 122 surrounds the second cavity 123 (as shown in FIG. 4B), wherein the first material M1 is disposed on the first In a cavity 122, the second material M2 is disposed in the second cavity 123, so that the first material M1 can accelerate the heat exchange of the second material M2 therein by convection, thereby increasing the overall heat energy of the heat pipe 12. Delivery efficiency.

Referring to FIG. 5A, FIG. 5B, in another embodiment of the present invention, the first material M1 may be disposed in the second cavity 123, and the second material M2 may be disposed in the first cavity 122, wherein The first cavity 122 surrounds the second cavity 123 (as shown in Figure 5B). In particular, a portion of the second cavity 123 on the left side (the −X-axis direction) of the heat pipe 12 protrudes from the first cavity 122 surrounding the heat pipe 12, thereby increasing the contact area between the heat pipe 12 and the heat sink 10, thereby Thermal energy is transferred to the heat sink 10 more efficiently.

Please also refer to Figures 6A and 6B, wherein Figure 6B is a cross-sectional view taken along line C-C in Figure 6A. In another embodiment of the present invention, the heat pipe 12 is substantially in a rectangular structure and disposed above the electronic component E and the heat conductive member 11 (as shown in FIG. 6B), wherein the first cavity 122 is adjacent to the heat conductive member 11 The second cavity 123 surrounds the first cavity 122 and is located between the heat sink 10 and the first cavity 122. The heat sink 10 has an annular structure and surrounds the outside of the second cavity 123.

In this embodiment, the first material M1 and the second material M2 are respectively provided. Placed in the second cavity 123 and the first cavity 122, when the electronic component E transfers thermal energy to the first cavity 122 of the heat pipe 12, the second material M2 in the first cavity 122 can absorb thermal energy and be solid Turning into a liquid state, heat energy can be transferred to the first material M1 in the surrounding second cavity 123, wherein the first material M1 can absorb thermal energy and generate convection, thereby rapidly and uniformly transferring heat energy to the heat dissipation around the outside. 10.

In summary, the present invention provides a heat dissipating unit that can be disposed inside an electronic device for dissipating heat from an electronic component in the electronic device. The heat dissipating unit mainly comprises a heat sink, a heat conducting member and a heat pipe. The heat pipe mainly comprises a pipe body and two kinds of filling materials are accommodated in the pipe body, and the two filling materials can absorb heat and undergo different phase changes. Help the heat pipe to transfer heat. When the electronic component operates and generates a large amount of thermal energy, the heat conductive member can transfer the thermal energy generated by the electronic component to the heat pipe, and then transfer the heat energy to the heat sink through the filling material in the heat pipe.

Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. Those skilled in the art having the ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

1‧‧‧heating unit

10‧‧‧ radiator

11‧‧‧ Thermally conductive components

12‧‧‧ Heat pipe

121‧‧‧ tube body

122‧‧‧First cavity

123‧‧‧Second cavity

E‧‧‧Electronic components

M1‧‧‧ first material

M2‧‧‧ second material

S1‧‧‧ first end

S2‧‧‧ second end

1 is a schematic view showing a heat dissipating unit and an electronic component according to an embodiment of the present invention; FIG. 2A is a cross-sectional view taken along line AA of FIG. 1; FIG. 2B is a cross-sectional view taken along line BB of FIG. 1; FIG. 3B is a cross-sectional view showing a heat pipe in FIG. 3A, and FIG. 4A is a schematic view showing a heat dissipating unit and an electronic component according to another embodiment of the present invention; FIG. 4B is a schematic view showing a heat dissipating unit and an electronic component according to another embodiment of the present invention; FIG. 5A is a cross-sectional view showing a heat dissipating unit and an electronic component according to another embodiment of the present invention; FIG. 5B is a cross-sectional view showing the heat pipe in FIG. 5A; and FIG. 6A is a cross-sectional view showing the heat pipe in FIG. A schematic diagram of a heat dissipating unit and an electronic component of an embodiment; and a 6B drawing showing a cross-sectional view taken along line CC of FIG. 6A.

1‧‧‧heating unit

10‧‧‧ radiator

11‧‧‧ Thermally conductive components

12‧‧‧ Heat pipe

121‧‧‧ tube body

122‧‧‧First cavity

123‧‧‧Second cavity

E‧‧‧Electronic components

M1‧‧‧ first material

M2‧‧‧ second material

S1‧‧‧ first end

S2‧‧‧ second end

Claims (6)

A heat dissipating unit comprises: a heat sink; a heat conducting member connected to a heat source; a heat pipe connecting the heat conducting member and the heat sink, wherein the heat pipe comprises: a tube body formed with a closed first cavity and a a second cavity, wherein a portion of the second cavity protrudes from the first cavity; and two filler materials are respectively filled in the first cavity and the second cavity; wherein when the thermally conductive member is to be When thermal energy from the heat source is transferred to the heat pipe, the filler materials undergo different phase changes, and heat energy is transferred to the heat sink via the heat pipe. A heat dissipating unit comprises: a heat sink; a heat conducting member connected to a heat source; a heat pipe connecting the heat conducting member and the heat sink, wherein the heat pipe comprises: a tube body formed with a closed first cavity and a a second cavity, wherein the first cavity is adjacent to the heat conducting member, the second cavity is located between the heat sink and the first cavity, and the heat sink surrounds the second cavity; and two filling materials Filling the first cavity and the second cavity respectively; wherein when the heat conductive member transfers thermal energy from the heat source to the heat pipe, the filler materials undergo different phase changes, so that the heat energy passes through the heat The tube is delivered to the heat sink. The heat dissipating unit of claim 1 or 2, wherein the filling material comprises a first material and a second material, wherein the first material changes from a liquid state to a gaseous state while absorbing heat, and is in a gaseous state when exothermic. The liquid is converted to a liquid state when the second material absorbs heat, and is converted from a solid state to a liquid state upon heat absorption, and is converted from a liquid state to a solid state upon exotherm. The heat dissipating unit of claim 3, wherein the first material has a boiling point between 25 ° C and 45 ° C. The heat dissipating unit according to claim 3, wherein the second material has a melting point of between 40 ° C and 60 ° C. The heat dissipating unit of claim 3, wherein the first material and the second material are respectively disposed in the second cavity and the first cavity.