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TWI475678B - Array optical element manufacturing method - Google Patents

Array optical element manufacturing method Download PDF

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Publication number
TWI475678B
TWI475678B TW102105262A TW102105262A TWI475678B TW I475678 B TWI475678 B TW I475678B TW 102105262 A TW102105262 A TW 102105262A TW 102105262 A TW102105262 A TW 102105262A TW I475678 B TWI475678 B TW I475678B
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Taiwan
Prior art keywords
shielding frame
wall
array
optical element
light shielding
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TW102105262A
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Chinese (zh)
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TW201432890A (en
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沈偉
李遠林
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峻立科技股份有限公司
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Description

陣列光學元件製造方法Array optical component manufacturing method

本發明是有關於一種陣列光學元件,特別是指一種便於製造的陣列光學元件製造方法。The present invention relates to an array optical component, and more particularly to a method of fabricating an array optical component that is easy to manufacture.

習知一種陣列式的成像裝置(例如美國專利公開第US20110122308 A1號),包含二分別具有數呈陣列排列之光學構件的透鏡晶圓,及數用於隔開每一透鏡晶圓之光學構件並分別形成數互相隔離之光學通道的遮光間隔物。此種成像裝置在製造時是利用兩套模具分別射出成形該等透鏡晶圓與該等遮光間隔物,再將該等透鏡晶圓與該等遮光間隔物組裝在一起,由於該等遮光間隔物與該等透鏡晶圓是互相分離的獨立元件,而且,該等遮光間隔物是抵接於該等透鏡晶圓,因此,除了兩者在組裝時產生的組裝公差,會影響該等透鏡晶圓在光軸向上的定位之外,該等遮光間隔物本身在光軸向上的高度公差,也會對該等透鏡晶圓在光軸向上的定位造成影響;此外,當應用於手持裝置(例如智慧型手機)時,此種成像裝置會因面積過小,而大幅提高該等遮光間隔物與該等透鏡晶圓的組裝困難度,造成此種成像裝置很難以上述的方法進行製造。An array of imaging devices (for example, US Pat. No. 20,110,122,308 A1), which comprises two lens wafers each having an array of optical members, and an optical member for separating each lens wafer. The light-shielding spacers of the optical channels that are separated from each other are respectively formed. In the manufacturing apparatus, the lens wafers and the light-shielding spacers are separately formed by using two sets of molds, and the lens wafers are assembled with the light-shielding spacers, due to the light-shielding spacers. Separate components from the lens wafers, and the light-shielding spacers abut against the lens wafers, so that the assembly tolerances generated by the assembly of the lens wafers may affect the lens wafers. In addition to the positioning in the optical axis, the height tolerance of the light-shielding spacers themselves in the optical axis also affects the positioning of the lens wafers in the optical axis; in addition, when applied to handheld devices (eg, wisdom) In the case of a type of mobile phone, such an image forming apparatus can greatly improve the assembly difficulty of the light-shielding spacers and the lens wafers due to an excessively small area, and it is difficult to manufacture such an image forming apparatus by the above method.

因此,本發明之目的,即在提供一種便於製造且可精密定位光學界面位置的陣列光學元件製造方法。Accordingly, it is an object of the present invention to provide an array optical component fabrication method that facilitates fabrication and precisely positions the optical interface.

於是本發明陣列光學元件製造方法,包含以下步驟:(A)以一第一材料成形出一遮光框,該第一材料為低透光或不透光材料,並具有一熱變形溫度,該遮光框具有一底壁、一個一體連接於該底壁並沿一光軸向延伸的周壁,及至少一個一體連接於該底壁與該周壁之間並沿該光軸向延伸的隔間壁,該底壁具有數呈陣列排列的通孔,該周壁與該隔間壁配合界定出數分別連通於該等通孔且互相隔離的光通道。(B)將該遮光框置入一成形模具的一成形模穴內。(C)將一第二材料射入該成形模穴內,成形出一與該遮光框一體連接的透鏡單元,該第二材料為光學塑膠,並具有一小於該熱變形溫度的成形溫度,該透鏡單元具有一結合於該底壁底側的基板,及數分別一體連接於該基板頂側並沿該光軸向延伸的頂定位壁,該基板具有數分別對應於該等通孔的透鏡部,該等頂定位壁內側結合於該周壁外側,其中,該遮光框在該光軸向上不凸出於該等頂定位壁。Therefore, the method for fabricating an array optical component of the present invention comprises the steps of: (A) forming a light-shielding frame by a first material, the first material being a low light transmissive or opaque material and having a heat distortion temperature, the light shielding The frame has a bottom wall, a peripheral wall integrally connected to the bottom wall and extending along an optical axis, and at least one partition wall integrally connected between the bottom wall and the peripheral wall and extending along the optical axis. The bottom wall has a plurality of through holes arranged in an array, and the peripheral wall cooperates with the partition wall to define a plurality of optical channels that are respectively connected to the through holes and are isolated from each other. (B) The light-shielding frame is placed in a forming cavity of a forming mold. (C) injecting a second material into the forming cavity to form a lens unit integrally connected to the light shielding frame, the second material being an optical plastic and having a forming temperature lower than the heat distortion temperature, The lens unit has a substrate coupled to the bottom side of the bottom wall, and a top positioning wall integrally connected to the top side of the substrate and extending along the optical axis, the substrate having a plurality of lens portions respectively corresponding to the through holes The inner side of the top positioning wall is coupled to the outer side of the peripheral wall, wherein the light shielding frame does not protrude from the top positioning wall in the optical axis.

本發明之功效在於:本發明所製造出之陣列光學元件的透鏡單元與遮光框是一體連接,簡化了兩者之間的組裝作業,而且,該透鏡單元的透鏡部與該等頂定位壁為一體式連接的構造,加上該遮光框在該光軸向上不凸出於該等頂定位壁,可讓該等頂定位壁直接且精密地控制該等透鏡部的位置。The effect of the invention is that the lens unit of the array optical element manufactured by the invention is integrally connected with the light shielding frame, which simplifies the assembly work between the two, and the lens portion of the lens unit and the top positioning wall are The integrally connected structure, in addition to the fact that the light shielding frame does not protrude from the top positioning walls in the optical axis, allows the top positioning walls to directly and precisely control the positions of the lens portions.

10‧‧‧第一材料10‧‧‧First material

20‧‧‧遮光框20‧‧‧blackout frame

21‧‧‧底壁21‧‧‧ bottom wall

211‧‧‧通孔211‧‧‧through hole

22‧‧‧周壁22‧‧‧Week wall

23‧‧‧隔間壁23‧‧‧ partition wall

24‧‧‧光通道24‧‧‧Light channel

30‧‧‧成形模具30‧‧‧Forming mould

31‧‧‧成形模穴31‧‧‧Forming cavity

40‧‧‧第二材料40‧‧‧Second material

50‧‧‧透鏡單元50‧‧‧ lens unit

51‧‧‧基板51‧‧‧Substrate

511‧‧‧透鏡部511‧‧‧Lens Department

512‧‧‧外周緣512‧‧‧ outer periphery

52‧‧‧頂定位壁52‧‧‧Top positioning wall

521‧‧‧定位平面521‧‧‧ positioning plane

53‧‧‧底定位壁53‧‧‧Bottom positioning wall

60‧‧‧陣列光學元件60‧‧‧Array optics

70‧‧‧陣列感光單元70‧‧‧Array photosensitive unit

80‧‧‧外殼80‧‧‧ Shell

100‧‧‧步驟100‧‧‧ steps

200‧‧‧步驟200‧‧‧ steps

300‧‧‧步驟300‧‧‧Steps

X‧‧‧光軸向X‧‧‧Light axis

H1‧‧‧第一高度H1‧‧‧ first height

H2‧‧‧第二高度H2‧‧‧second height

D‧‧‧光學有效徑D‧‧‧ Optical Effective Trail

本發明之其他的特徵及功效,將於參照圖式的實施方式中清楚地呈現,其中:圖1是本發明陣列光學元件製造方法一較佳實施例的流程示意圖;圖2是該較佳實施例先成形的一遮光框的立體外觀示意圖;圖3是一剖視示意圖,說明該較佳實施例先將該遮光框預置於一成形模具內,接著在該成形模具內成形出一與該遮光框一體連接的透鏡單元;圖4是該較佳實施例所製造出的一陣列光學元件的立體外觀示意圖;圖5是該陣列光學元件的剖視示意圖;及圖6是數陣列光學元件與一陣列感光單元、一外殼組裝成一鏡頭模組的組合剖視示意圖。Other features and effects of the present invention will be apparent from the following description of the drawings, wherein: FIG. 1 is a schematic flow diagram of a preferred embodiment of the method for fabricating an array optical component of the present invention; FIG. 2 is a preferred embodiment of the present invention. FIG. 3 is a schematic cross-sectional view showing a first embodiment of a light-shielding frame; FIG. 3 is a cross-sectional view showing the light-shielding frame preset in a forming mold, and then forming a shape in the forming mold. FIG. 4 is a schematic perspective view of an array of optical components manufactured by the preferred embodiment; FIG. 5 is a schematic cross-sectional view of the array optical component; and FIG. 6 is a plurality of array optical components and A schematic cross-sectional view of an array of photosensitive cells and a housing assembled into a lens module.

參閱圖1,本發明陣列光學元件製造方法之較佳實施例,包含以下步驟:步驟100:如圖1、2所示,以一第一材料10成形出一遮光框20,該第一材料10為低透光或不透光材料,並具有一熱變形溫度(Heat Deflection Temperature)。Referring to FIG. 1, a preferred embodiment of the method for fabricating an array optical device of the present invention comprises the following steps: Step 100: As shown in FIG. 1 and FIG. 2, a light shielding frame 20 is formed from a first material 10, and the first material 10 is formed. It is a low light transmissive or opaque material and has a heat deflection temperature.

在本實施例中,該第一材料10是選自於由金屬、熱塑性塑膠、熱固性塑膠及矽膠所組成之群體,較佳地,該第一材料10為液晶高分子聚合物(Liquid Crystal Polyester ,簡稱為LCP),例如材料供應商杜邦所販售之Zenite® 5130L BK010,該第一材料10的熱變形溫度介於270℃~350℃。In this embodiment, the first material 10 is selected from the group consisting of metal, thermoplastic, thermosetting plastic and silicone. Preferably, the first material 10 is a liquid crystal polymer (Liquid Crystal Polyester, Referred to as LCP), for example, Zenite ® 5130L BK010 sold by DuPont, a material supplier, has a heat distortion temperature of 270 ° C to 350 ° C.

該遮光框20具有一底壁21、一個一體連接於該底壁21並沿一光軸向X延伸的周壁22,及數一體連接於該底壁21與該周壁22之間並沿該光軸向X延伸的隔間壁23,該底壁21具有數呈陣列排列的通孔211,該周壁22與該等隔間壁23配合界定出數分別連通於該等通孔211且互相隔離的光通道24,可以理解的是,當該隔間壁23的數量為一個時,該周壁22與該隔間壁23也可配合界定出二個光通道24。The light shielding frame 20 has a bottom wall 21, a peripheral wall 22 integrally connected to the bottom wall 21 and extending along an optical axis X, and is integrally connected between the bottom wall 21 and the peripheral wall 22 along the light. a partition wall 23 extending in the axial direction X, the bottom wall 21 having a plurality of through holes 211 arranged in an array, the peripheral wall 22 cooperating with the partition walls 23 to define a plurality of communicating with the through holes 211 and being isolated from each other The light tunnel 24, it can be understood that when the number of the partition walls 23 is one, the peripheral wall 22 and the partition wall 23 can also cooperate to define two light passages 24.

在本實施例中,該遮光框20在該光軸向X上具有一第一高度H1,該遮光框20採射出(injection)成形,即利用一模具(圖未示)將該第一材料10射出成形為該遮光框20。另外,要說明的是,當該第一材料10為矽膠時,該遮光框20也可以採押出(extruding)成形,即,利用一模具(圖未示)將該第一材料10押出成形為該遮光框20。In this embodiment, the light-shielding frame 20 has a first height H1 in the optical axis X, and the light-shielding frame 20 is injection-molded, that is, the first material 10 is formed by a mold (not shown). The injection molding is formed into the light shielding frame 20. In addition, it should be noted that when the first material 10 is silicone, the light shielding frame 20 may also be extruded, that is, the first material 10 is extruded into a mold by using a mold (not shown). Shading frame 20.

步驟200:如圖1、3所示,將該遮光框20置入一成形模具30的一成形模穴31內。Step 200: As shown in FIGS. 1 and 3, the light shielding frame 20 is placed in a forming cavity 31 of a forming die 30.

可以理解的是,當該第一材料10的材質為矽膠時,由於該遮光框20會具有適當的彈性,而可便於入模,因此,該遮光框20的尺寸可具有較大的容許公差。It can be understood that when the material of the first material 10 is silicone, since the light shielding frame 20 has appropriate elasticity and can be easily inserted into the mold, the size of the light shielding frame 20 can have a large tolerance.

步驟300:如圖1、3所示,將一第二材料40射入該成形模穴31內,成形出一與該遮光框20一體連接的透鏡單 元50,該第二材料40為光學塑膠,並具有一小於該熱變形溫度的成形溫度。Step 300: As shown in FIG. 1 and FIG. 3, a second material 40 is injected into the forming cavity 31 to form a lens unit integrally connected with the light shielding frame 20. Element 50, the second material 40 is an optical plastic and has a forming temperature that is less than the heat distortion temperature.

在本實施例中,該第二材料40可為材料供應商三菱所販售之成形溫度介於75℃~95℃的PMMA(聚甲基丙烯酸甲酯)、材料供應商帝人所販售之成形溫度為115℃~125℃的PC-AD5503(聚碳酸脂)、材料供應商ZEONEX所販售之成形溫度為115℃~125℃的ZEONEX 480R,或材料供應商SABIC所販售之成形溫度為190℃~200℃的ULTEM-1010等等。In this embodiment, the second material 40 may be a PMMA (polymethyl methacrylate) having a forming temperature of 75 ° C to 95 ° C, which is sold by the material supplier Mitsubishi, and is formed by the material supplier Teijin. PC-AD5503 (polycarbonate) with a temperature of 115 ° C ~ 125 ° C, ZEONEX 480R with a forming temperature of 115 ° C ~ 125 ° C sold by the material supplier ZEONEX, or a forming temperature of 190 sold by the material supplier SABIC ULTEM-1010 from °C to 200 °C, etc.

如圖4、5所示,該透鏡單元50具有一結合於該底壁21底側的基板51、數分別一體連接於該基板51頂側並沿該光軸向X延伸的頂定位壁52,及數分別一體連接於該基板51底側並沿該光軸向X延伸的底定位壁53,其中,該遮光框20在該光軸向X上不凸出於該等頂定位壁52。As shown in FIGS. 4 and 5, the lens unit 50 has a substrate 51 coupled to the bottom side of the bottom wall 21, and a plurality of top positioning walls 52 integrally connected to the top side of the substrate 51 and extending along the optical axis X. And a bottom positioning wall 53 integrally connected to the bottom side of the substrate 51 and extending along the optical axis X, wherein the light shielding frame 20 does not protrude from the top positioning wall 52 in the optical axis X.

該基板51具有數分別對應於該等通孔211的透鏡部511,及一外周緣512,該等透鏡部511分別具有一光學有效徑(Clear Aperture,簡稱CA)D。The substrate 51 has a plurality of lens portions 511 corresponding to the through holes 211 and an outer peripheral edge 512. Each of the lens portions 511 has an optical effective aperture (CA) D.

該等頂定位壁52內側結合於該周壁22外側,該等頂定位壁52分別具有一相背於該周壁22的定位平面521,該基板51的外周緣512不超出該等頂定位壁52的定位平面521。The top positioning wall 52 is coupled to the outer side of the peripheral wall 22, and the top positioning walls 52 respectively have a positioning plane 521 opposite to the peripheral wall 22. The outer periphery 512 of the substrate 51 does not exceed the top positioning wall 52. Positioning plane 521.

在本實施例中,該等頂定位壁52在該光軸向X上分別具有一大於該第一高度H1的第二高度H2,該第一、二高度H1、H2的一差值≦50μm,而且,0.2≦該第一高度H1/ 該光學有效徑D≦2.0,可以理解的是,若此比值低於下限的0.2,會造成遮光不足的問題,若此比值高於上限的2.0,則會增加組裝後鏡頭模組的整體高度。In this embodiment, the top positioning walls 52 respectively have a second height H2 greater than the first height H1 in the optical axis X, and a difference ≦50 μm between the first and second heights H1 and H2. Moreover, 0.2≦ the first height H1/ The optical effective diameter D ≦ 2.0, it can be understood that if the ratio is lower than 0.2 of the lower limit, the problem of insufficient light shielding is caused. If the ratio is higher than the upper limit of 2.0, the overall height of the assembled lens module is increased.

藉此,利用本發明的製造方法即可製造出一由該透鏡單元50與該遮光框20一體連接而成的陣列光學元件60。在本實施例中,該陣列光學元件60的長度與寬度皆不超過3 mm,高度不超過2 mm。Thereby, an array optical element 60 in which the lens unit 50 and the light shielding frame 20 are integrally connected can be manufactured by the manufacturing method of the present invention. In this embodiment, the array optical element 60 has a length and a width of no more than 3 mm and a height of no more than 2 mm.

在組裝鏡頭模組時,即可利用本發明製造出數不同的陣列光學元件60,以與一陣列感光單元70相疊組裝於一外殼80內,要說明的是,只有組裝於最下側之陣列光學元件60的透鏡單元50才需成形出該等底定位壁53,如此,最下側之陣列光學元件60的底定位壁53會抵接於最下側的基板51與該陣列感光單元70之間,以定位最下側之陣列光學元件60的透鏡部511與該陣列感光單元70在該光軸向X上的間距,而且,兩相鄰之陣列光學元件60在下側者的頂定位壁52會抵接於兩相鄰的基板51之間,以定位該等陣列光學元件60的透鏡部511在該光軸向X上的間距,同時,該等陣列光學元件60的頂定位壁52的定位平面521也會抵接於該外殼80內側,以定位該等陣列光學元件60的透鏡部511在側向上的位置,進而精密地控制該等陣列光學元件60的透鏡部511的相對位置,符合光學性能的需求。When assembling the lens module, a plurality of different array optical elements 60 can be fabricated by the present invention to be assembled in an outer casing 80 in an overlapping manner with an array of photosensitive cells 70. It is to be noted that only the lowermost side is assembled. The bottom positioning wall 53 of the array optical element 60 of the array optical element 60 needs to be formed. Thus, the bottom positioning wall 53 of the lowermost array optical element 60 abuts the lowermost substrate 51 and the array photosensitive unit 70. Between the lens portion 511 of the array optical element 60 on the lowermost side and the spacing of the array photosensitive unit 70 in the optical axis X, and the top positioning walls of the two adjacent array optical elements 60 on the lower side. 52 will abut between two adjacent substrates 51 to position the spacing of the lens portions 511 of the array of optical elements 60 in the optical axis X, while the top positioning walls 52 of the array of optical elements 60 The positioning plane 521 also abuts against the inner side of the outer casing 80 to position the lens portion 511 of the array optical element 60 in the lateral direction, thereby precisely controlling the relative positions of the lens portions 511 of the array optical elements 60. The need for optical performance.

經由以上的說明,可再將本發明的優點歸納如下:Through the above description, the advantages of the present invention can be further summarized as follows:

一、本發明所製造出之陣列光學元件60的透鏡單元50與遮光框20是一體連接在一起,不需再進行組裝作業,相較於習知技術,本發明可簡化陣列光學元件的製造作業,而且,該陣列光學元件60除了不會產生影響該等透鏡部511在該光軸向X上之定位的組裝公差之外,更不會發生難於組裝的問題,而可適用於手持裝置(例如智慧型手機)之鏡頭小型化的需求。1. The lens unit 50 of the array optical element 60 manufactured by the present invention is integrally connected with the light shielding frame 20, and the assembly work is not required. Compared with the prior art, the invention can simplify the manufacturing operation of the array optical element. Moreover, the array optical component 60 can not be difficult to assemble except that it does not have an assembly tolerance that affects the positioning of the lens portions 511 in the optical axis X, and can be applied to a handheld device (for example, The demand for miniaturization of lenses for smart phones).

二、本發明是先將熱變形溫度較高的該第一材料10成形為該遮光框20,然後再將在較低溫成形的該第二材料40射出成形為與該遮光框20一體連接的該透鏡單元50,由於該第二材料40的成形溫度是小於該第一材料10的熱變形溫度,因此,在射出成形該透鏡單元50時,較早成形的該遮光框20完全不會產生變形的問題。In the present invention, the first material 10 having a higher heat distortion temperature is first formed into the light shielding frame 20, and then the second material 40 formed at a lower temperature is injection-molded into the optical frame 20 integrally connected thereto. In the lens unit 50, since the forming temperature of the second material 40 is smaller than the heat distortion temperature of the first material 10, when the lens unit 50 is injection molded, the earlier formed light shielding frame 20 is not deformed at all. problem.

三、本發明的透鏡單元50的頂定位壁52在該光軸向X上的第二高度H2大於該遮光框20的第一高度H1,因此,本發明只需控制該透鏡單元50的頂定位壁52在該光軸向X上的高度公差,即可在組裝鏡頭模組時有效維持該等透鏡單元50在該光軸向X上的定位,該遮光框20在該光軸向X上的高度公差,並不會對該等透鏡單元50的定位造成影響,相較於習知技術,本發明在鏡頭模組的組裝作業上更為簡便。3. The second height H2 of the top positioning wall 52 of the lens unit 50 of the present invention in the optical axis X is greater than the first height H1 of the light shielding frame 20. Therefore, the present invention only needs to control the top positioning of the lens unit 50. The height tolerance of the wall 52 in the optical axis X, that is, the position of the lens unit 50 in the optical axis X can be effectively maintained when the lens module is assembled, and the light shielding frame 20 is in the optical axis X. The height tolerance does not affect the positioning of the lens unit 50. Compared with the prior art, the present invention is simpler in assembling the lens module.

四、本發明透鏡單元50的透鏡部511與該等頂定位壁52為一體式連接的構造,兩者之間有最直接的相對距離關係,同時,該等透鏡部511與該等頂定位壁52並非互相分 離的元件,兩者之間並不會產生組裝公差的問題,也不會受其他元件之尺寸公差的影響,而且,該等頂定位壁52是一體成形於該基板51上,完全不受該遮光框20的形狀的影響,因此,本發明所製造出之陣列光學元件60利用該等頂定位壁52即可直接且精密地控制該等透鏡部511的位置,產生良好的光學性能。4. The lens portion 511 of the lens unit 50 of the present invention is integrally connected with the top positioning walls 52, and has the most direct relative distance relationship therebetween. At the same time, the lens portions 511 and the top positioning walls are the same. 52 are not divided into each other The components that are separated do not cause assembly tolerances between the two, nor are they affected by dimensional tolerances of other components. Moreover, the top positioning walls 52 are integrally formed on the substrate 51 and are completely free of the The shape of the light-shielding frame 20 is affected. Therefore, the array optical element 60 manufactured by the present invention can directly and precisely control the position of the lens portions 511 by the top positioning walls 52, resulting in good optical performance.

五、本發明所製造出之陣列光學元件60的遮光框20的第一高度H1與該等透鏡部511的光學有效徑D的比值是介於0.2~2.0之間,可有效避免該遮光框20太低所造成之遮光不足的問題,及該遮光框20太高所造成之增加整體高度的問題。5. The ratio of the first height H1 of the light-shielding frame 20 of the array optical element 60 manufactured by the present invention to the optical effective diameter D of the lens portions 511 is between 0.2 and 2.0, which can effectively avoid the light-shielding frame 20. The problem of insufficient shading caused by too low, and the problem of increasing the overall height caused by the fact that the light-shielding frame 20 is too high.

綜上所述,本發明陣列光學元件製造方法,不僅可簡化陣列光學元件的製造與鏡頭模組的組裝作業,且可精密定位該透鏡單元的透鏡部的位置,符合光學性能的需求,故確實能達成本發明之目的。In summary, the method for manufacturing an array optical element of the present invention not only simplifies the fabrication of the array optical element and the assembly operation of the lens module, but also precisely positions the lens portion of the lens unit to meet the optical performance requirement, so The object of the invention can be achieved.

惟以上所述者,僅為本發明之較佳實施例而已,當不能以此限定本發明實施之範圍,即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾,皆仍屬本發明專利涵蓋之範圍內。The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and patent specification content of the present invention, All remain within the scope of the invention patent.

100‧‧‧步驟100‧‧‧ steps

200‧‧‧步驟200‧‧‧ steps

300‧‧‧步驟300‧‧‧Steps

Claims (8)

一種陣列光學元件製造方法,包含:(A)以一第一材料成形出一遮光框,該第一材料為低透光或不透光材料,並具有一熱變形溫度,該遮光框具有一底壁、一個一體連接於該底壁並沿一光軸向延伸的周壁,及至少一個一體連接於該底壁與該周壁之間並沿該光軸向延伸的隔間壁,該底壁具有數呈陣列排列的通孔,該周壁與該隔間壁配合界定出數分別連通於該等通孔且互相隔離的光通道;(B)將該遮光框置入一成形模具的一成形模穴內;(C)將一第二材料射入該成形模穴內,成形出一與該遮光框一體連接的透鏡單元,該第二材料為光學塑膠,並具有一小於該熱變形溫度的成形溫度,該透鏡單元具有一結合於該底壁底側的基板,及數分別一體連接於該基板頂側並沿該光軸向延伸的頂定位壁,該基板具有數分別對應於該等通孔的透鏡部,該等頂定位壁內側結合於該周壁外側,該等頂定位壁分別具有一相背於該周壁的定位平面,該基板外周緣不超出該等頂定位壁的定位平面,其中,該遮光框在該光軸向上不凸出於該等頂定位壁。 A method for fabricating an array optical component, comprising: (A) forming a light-shielding frame by a first material, the first material being a low light transmissive or opaque material, and having a heat distortion temperature, the light shielding frame having a bottom a wall, a peripheral wall integrally connected to the bottom wall and extending along an optical axis, and at least one partition wall integrally connected between the bottom wall and the peripheral wall and extending along the optical axis, the bottom wall having a plurality a through hole arranged in an array, the peripheral wall and the partition wall cooperate to define a plurality of optical passages respectively connected to the through holes and separated from each other; (B) placing the light shielding frame into a forming cavity of a forming die (C) injecting a second material into the forming cavity to form a lens unit integrally connected with the light shielding frame, the second material being an optical plastic and having a forming temperature lower than the heat distortion temperature. The lens unit has a substrate coupled to a bottom side of the bottom wall, and a top positioning wall integrally connected to the top side of the substrate and extending along the optical axis, the substrate having a plurality of lenses respectively corresponding to the through holes The inner side of the top positioning wall is bonded to Each of the top positioning walls has a positioning plane opposite to the peripheral wall, and the outer periphery of the substrate does not extend beyond the positioning plane of the top positioning walls, wherein the light shielding frame does not protrude from the optical axis. Wait for the top to locate the wall. 如請求項1所述的陣列光學元件製造方法,其中,在該步驟(A)中,該遮光框在該光軸向上具有一第一高度,在該步驟(C)中,該透鏡單元的透鏡部分別具有一 光學有效徑,0.2≦該第一高度/該光學有效徑≦2.0。 The method of manufacturing an array optical element according to claim 1, wherein in the step (A), the light shielding frame has a first height in the optical axis, and in the step (C), the lens of the lens unit Each has one Optical effective diameter, 0.2 ≦ the first height / the optical effective diameter ≦ 2.0. 如請求項2所述的陣列光學元件製造方法,其中,在該步驟(C)中,該等頂定位壁在該光軸向上分別具有一大於該第一高度的第二高度,該第一、二高度的一差值≦50μm。 The method of manufacturing an array optical element according to claim 2, wherein in the step (C), the top positioning walls respectively have a second height greater than the first height in the optical axis, the first A difference of two heights ≦ 50 μm. 如請求項1所述的陣列光學元件製造方法,其中,在該步驟(C)中,該透鏡單元更具有數分別一體連接於該基板底側並沿該光軸向延伸的底定位壁。 The method of manufacturing an array optical element according to claim 1, wherein in the step (C), the lens unit further has a plurality of bottom positioning walls integrally connected to the bottom side of the substrate and extending along the optical axis. 如請求項1所述的陣列光學元件製造方法,其中,在該步驟(A)中,該第一材料是選自於由金屬、熱塑性塑膠、熱固性塑膠及矽膠所組成之群體。 The method of manufacturing an array optical element according to claim 1, wherein in the step (A), the first material is selected from the group consisting of metal, thermoplastic, thermosetting plastic, and silicone. 如請求項1所述的陣列光學元件製造方法,其中,在該步驟(A)中,該遮光框採射出成形。 The method of manufacturing an array optical element according to claim 1, wherein in the step (A), the light shielding frame is shot and formed. 如請求項1所述的陣列光學元件製造方法,其中,在該步驟(A)中,該遮光框採押出成形。 The method of manufacturing an array optical element according to claim 1, wherein in the step (A), the light-shielding frame is molded. 如請求項1所述的陣列光學元件製造方法,其中,在該步驟(C)中,一由該透鏡單元與該遮光框一體連接而成的陣列光學元件的長度與寬度皆不超過3mm,高度不超過2mm。 The method for manufacturing an array optical element according to claim 1, wherein in the step (C), an array optical element integrally formed by the lens unit and the light shielding frame has a length and a width of not more than 3 mm and a height. Not more than 2mm.
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011048220A (en) * 2009-08-28 2011-03-10 Alps Electric Co Ltd Lens member and illumination device using the same
TW201140130A (en) * 2009-10-08 2011-11-16 Sharp Kk Image pickup lens, image pickup module, method for manufacturing image pickup lens, and method for manufacturing image pickup module
US20120081801A1 (en) * 2009-06-02 2012-04-05 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Lens and method for manufacturing same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120081801A1 (en) * 2009-06-02 2012-04-05 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. Lens and method for manufacturing same
JP2011048220A (en) * 2009-08-28 2011-03-10 Alps Electric Co Ltd Lens member and illumination device using the same
TW201140130A (en) * 2009-10-08 2011-11-16 Sharp Kk Image pickup lens, image pickup module, method for manufacturing image pickup lens, and method for manufacturing image pickup module

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