TWI475184B - Method of assembling thermal module - Google Patents

Description

Thermal module combination method

The invention relates to a heat sink module combining method, in particular to a heat sink module combining method capable of improving assembly efficiency.

With the advancement of technology, the number of transistors per unit area of electronic components is increasing, causing an increase in the amount of heat generated during operation. On the other hand, the operating frequency of electronic components is also getting higher and higher. The heat caused by the on/off switching of the transistor is also the cause of the increase in the heat generated by the electronic components. If this heat is not properly handled, it will cause The reduction in the speed of the wafer operation, even severely affects the life of the wafer; to enhance the heat dissipation effect of the electronic components, the heat is dissipated into the environment by natural or forced convection via the fins of the heat sink.

Because the heat pipe can transfer a large amount of heat over a small cross-sectional area and temperature difference, and can operate without additional power supply, without the need for power supply and space utilization economy, Heat pipe has become one of the most widely used heat transfer components in electronic heat dissipation products.

The most commonly used heat dissipation method is to install a heat-dissipating device on the heating element, in particular, a heat sink having a heat pipe structure, which is made of a material having a high thermal conductivity and is passed through a heat pipe. The working fluid and capillary structure are arranged to make the heat sink have high thermal conductivity and the structure has the advantage of light weight, which can reduce the weight, cost and system complexity of the heat sink.

In a conventional heat pipe heat sink structure, a plurality of heat dissipating fins and at least one heat pipe are included. The heat dissipating fins have a plurality of holes, and the combination of the heat dissipating fins and the heat pipes is most commonly used to directly penetrate the heat pipes one by one. The holes are configured to join the heat dissipating fins to the heat pipe. However, the method is complicated, complicated in operation, and inefficient in assembly.

As described above, the conventional disadvantages have the following disadvantages: 1. The assembly efficiency is slow; 2. The process is complicated.

Therefore, how to solve the above problems and problems in the past, that is, the inventors of this case and the relevant manufacturers engaged in this industry are eager to study the direction of improvement.

Therefore, in order to effectively solve the above problems, the main object of the present invention is to provide a heat sink module combining method capable of greatly improving assembly efficiency.

A secondary object of the present invention is to provide a heat sink module bonding method that can reduce the manufacturing process.

In order to achieve the above object, the present invention provides a method for combining a heat dissipation module, comprising the steps of: providing a first heat dissipating component and a second heat dissipating component; and correspondingly combining the portions of the first and second heat dissipating components; And driving the first heat dissipating component and the second heat dissipating component to be combined by means of driving.

Through the method of combining the heat module of the present invention, the first heat dissipating component and the second heat dissipating component are combined with each other by means of a driving method to achieve a substantially improved assembly. In addition to efficiency, it also simplifies the production process.

The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

1A and 1B are a perspective view and a flow chart of a first embodiment of a method for combining a heat dissipation module according to the present invention. As shown in the figure, a method for combining a heat dissipation module includes the following steps:

S1: providing a first heat dissipating component and a second heat dissipating component; providing a first heat dissipating component 1 and a second heat dissipating component 2, wherein the second heat dissipating component 2 is a heat sink and a heat dissipating fin set Either the second heat dissipating component 2 has a plurality of heat dissipating fins 20, and a first hole 201 and a first recess 202 are preliminarily provided corresponding to the heat dissipating fins 20, and the first heat dissipating component 1 The first heat dissipation element 1 has two ends corresponding to the first hole 201 and the first groove 202 of the second heat dissipation element 2; the first hole is respectively formed by a heat pipe and is bent in a U shape. The periphery of 201 is further provided with a convex portion 203.

S2: Corresponding the portions of the first and second heat dissipating components to be combined with each other, and driving the first heat dissipating component and the second heat dissipating component to be coupled by driving.

Then, the portions of the first and second heat dissipating components 1 and 2 to be combined are corresponding to each other, and the first and second heat dissipating components 1 and 2 are driven by the first heat dissipating component 1 and the second heat dissipating component 2 in a driving manner. The close connection between the two.

The first heat dissipating component 1 is received in a driving device 3, and the striking The first heat dissipating component 1 is pushed out (or pushed out) from the inside of the driving device 3 by any one of a spring force and a gas pressure and a hydraulic pressure and a bursting force to drive the first heat dissipating component. The first hole 201 and the first groove 202 of the second heat dissipating component 2 are respectively coupled to the second heat dissipating component 2 at both ends.

The first heat dissipating component 1 disposed in the driving device 3 is used to quickly pass the first heat dissipating component 1 from the inside of the driving device 3 by means of a driving method. Pushing out to improve the efficiency of assembling the first heat dissipating component 1 and the second heat dissipating component 2; in addition, the manufacturing process of the heat dissipating module can be simplified.

2 is a perspective view of a second embodiment of a method for combining a heat dissipation module according to the present invention. This embodiment is identical to the flow of the steps of the first embodiment, and therefore will not be described herein again. The difference between the first embodiment and the first embodiment is that the second heat dissipating component 2 is a heat sink, and a recess 204 is preset on one side, and the first heat dissipating component 1 is a heat conducting substrate. The driving device 3 is coupled to the groove 204 of the second heat dissipating component 2 through the force of the spring force and the air pressure and the hydraulic pressure and the blasting force to achieve the assembly. Efficiency; in addition, it simplifies the manufacturing process of the thermal module.

Continuing to refer to FIG. 3 , which is a perspective view of a third embodiment of a method for combining a heat dissipation module according to the present invention. This embodiment is identical to the flow of the steps of the first embodiment, and therefore will not be described herein again. The difference between the embodiment and the foregoing first embodiment is that there is a third heat dissipating component 4, which is a heat conducting substrate, and A slot portion 40 is disposed in advance, and the second heat dissipating component 2 is a heat sink and a heat sink fin set, and a hole 205 is defined in advance corresponding to the second heat dissipating component 2, the first heat dissipation The component 1 is a heat pipe and is bent in a U shape in advance; after the second heat dissipating component 2 and the third heat dissipating component 4 are combined, the first heat dissipating component is driven by any force of the driving manner. 1 is pushed out from the inside of the driving device 3, and the hole 205 of the second heat dissipating component 2 and the groove portion 40 of the third heat dissipating component 4 are combined to improve assembly efficiency.

Finally, please refer to FIG. 4 and refer to FIG. 1A , which is a flow chart of the steps of the fourth embodiment of the method for combining the heat dissipation module of the present invention. This embodiment is identical to the flow of the steps of the first embodiment. Therefore, the difference between the embodiment and the foregoing first embodiment is the step S2: the parts to be combined of the first and second heat dissipating components are corresponding to each other, and are driven by the driving method. The step of combining the first heat dissipating component and the second heat dissipating component further comprises a step S3 of fixing the first heat dissipating component and the second heat dissipating component by soldering.

In the step S3, the first heat dissipating component and the second heat dissipating component are fixed by soldering.

Finally, the first heat dissipating component 1 and the second heat dissipating component 2 can be more fixed by soldering.

After the step of bonding the first heat dissipating component 1 and the second heat dissipating component 2 to each other by a driving method, the first heat dissipating component 1 is soldered The second heat dissipating component 2 is driven to be more rigid to improve the efficiency of assembling the first heat dissipating component 1 and the second heat dissipating component 2; in addition, the manufacturing process of the heat dissipating module can be simplified.

As described above, the present invention has the following advantages as compared with the prior art: 1. improving assembly efficiency; 2. reducing process.

The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.

1‧‧‧First heat dissipating component

2‧‧‧Second heat dissipating component

20‧‧‧ Heat sink fins

201‧‧‧ first hole

202‧‧‧First groove

203‧‧‧ convex

204‧‧‧ Groove

205‧‧‧ hole

3‧‧‧Injection device

4‧‧‧ Third heat dissipating component

40‧‧‧Slots

1A is a perspective view of a first embodiment of a method for combining a heat dissipation module of the present invention; FIG. 1B is a flow chart of a first embodiment of a method for combining a heat dissipation module of the present invention; 3 is a perspective view of a second embodiment of a method for combining a heat dissipation module; FIG. 3 is a perspective view of a third embodiment of a method for combining a heat dissipation module of the present invention; Flow chart of the steps of the embodiment.

1‧‧‧First heat dissipating component

2‧‧‧Second heat dissipating component

20‧‧‧ Heat sink fins

201‧‧‧ first hole

202‧‧‧First groove

203‧‧‧ convex

3‧‧‧Injection device

Claims (10)

A heat dissipating module combining method includes the following steps: providing a first heat dissipating component and a heat dissipating fin set, wherein the first heat dissipating component is received in a driving device; and the first heat dissipating component and the heat dissipating The portions of the fin group to be combined correspond to each other, and the first heat dissipating component is coupled to the heat dissipating fin group by a driving device by a driving device, and the driving manner is transmitted through a spring force or a gas pressure or a hydraulic pressure. Or burst force any of the forces. The heat dissipation module assembly method of claim 1, wherein the heat dissipation fin set has a plurality of heat dissipation fins, and a first hole and a first groove are preliminarily provided corresponding to the heat dissipation fins. The first heat dissipating component is a heat pipe, and the heat pipe is combined with the heat dissipating fin set. The method of claim 2, wherein the heat pipe is pre-bent in a U-shape, and the two ends of the heat pipe respectively correspond to the first hole of the heat dissipation fin set and the first groove. The heat dissipation module assembly method of claim 1, wherein a side of the heat dissipation fin set is pre-arranged with a groove, and the first heat dissipation component is a heat conductive substrate. The method of claim 3, wherein the periphery of the first hole is further provided with a convex portion. The method of assembling a heat dissipation module according to claim 3, wherein the heat pipe is pushed out from the inside of the driving device by the driving device to drive the heat pipe The first hole and the first groove of the heat dissipation fin set are respectively coupled to the heat dissipation fin set at both ends. The method of claim 4, wherein the heat-conducting substrate is pushed out from the inside of the driving device by the driving device to drive the heat-conducting substrate and the groove of the heat-dissipating fin group. Combine. The method of claim 1, wherein the method further includes a substrate, and a slot portion is disposed in advance, and a hole is formed in the corresponding portion of the heat dissipation fin group, and the first heat dissipation component is It is a heat pipe and is bent in a U shape. The method of claim 2, wherein the heat pipe is pushed out from the inside of the driving device by using the driving device, and the heat dissipating fin group is respectively disposed at two ends of the heat pipe. The hole and the groove portion of the substrate are combined. The method of assembling a heat dissipation module according to claim 1, wherein the first heat dissipating component and the heat dissipation fin set are fixed by soldering.