TWI470811B - - Google Patents
Info
- Publication number
- TWI470811B TWI470811B TW100127607A TW100127607A TWI470811B TW I470811 B TWI470811 B TW I470811B TW 100127607 A TW100127607 A TW 100127607A TW 100127607 A TW100127607 A TW 100127607A TW I470811 B TWI470811 B TW I470811B
- Authority
- TW
- Taiwan
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100127607A TW201308616A (en) | 2011-08-03 | 2011-08-03 | Method of forming conductive pattern on substrate |
| CN201110310991XA CN102916073A (en) | 2011-08-03 | 2011-10-14 | Method for forming conductive pattern on substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100127607A TW201308616A (en) | 2011-08-03 | 2011-08-03 | Method of forming conductive pattern on substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201308616A TW201308616A (en) | 2013-02-16 |
| TWI470811B true TWI470811B (en) | 2015-01-21 |
Family
ID=47614377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100127607A TW201308616A (en) | 2011-08-03 | 2011-08-03 | Method of forming conductive pattern on substrate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102916073A (en) |
| TW (1) | TW201308616A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839864A (en) * | 2014-02-24 | 2014-06-04 | 合肥鑫晟光电科技有限公司 | Coating alignment device and coating system |
| CN103966548B (en) * | 2014-05-07 | 2015-07-01 | 京东方科技集团股份有限公司 | Mask plate, manufacturing method of mask plate and mask assembly with mask plate |
| CN106206761B (en) * | 2014-10-31 | 2018-06-26 | 比亚迪股份有限公司 | Solar cell chip arrays, solar cell module and preparation method thereof |
| CN104733359A (en) * | 2015-03-24 | 2015-06-24 | 王春 | Efficient and energy-saving EPT for rapidly forming metal pattern circuit |
| CN106920894B (en) * | 2017-04-28 | 2020-04-24 | 陕西科技大学 | Transparent OLED device structure and preparation method thereof |
| SE1751265A1 (en) * | 2017-10-13 | 2019-03-12 | Stora Enso Oyj | Method and arrangement for producing a label with integrated electrically conductive pattern |
| CN113036016B (en) * | 2019-12-24 | 2022-10-11 | 群创光电股份有限公司 | Electronic device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW503444B (en) * | 2000-03-08 | 2002-09-21 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
| TWI232543B (en) * | 2003-03-17 | 2005-05-11 | Seiko Epson Corp | Method of forming contact holes and electronic device formed thereby |
| TWI263353B (en) * | 2005-11-15 | 2006-10-01 | Advanced Semiconductor Eng | Chip structure and manufacturing method of the same |
| TWI275187B (en) * | 2005-11-30 | 2007-03-01 | Advanced Semiconductor Eng | Flip chip package and manufacturing method of the same |
| TWI302921B (en) * | 2004-02-26 | 2008-11-11 | Taiwan Semiconductor Mfg | Method of forming a polyimide layer and photo-sensitive polymer layer, and a chip having the polyimide layer |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001322228A (en) * | 2000-05-17 | 2001-11-20 | Riso Kagaku Corp | Thermosensitive stencil making method, thermosensitive stencil stencil making machine, and thermoplastic resin film of thermosensitive stencil stencil |
| JP2009516388A (en) * | 2005-11-18 | 2009-04-16 | レプリソールス テクノロジーズ アーベー | Method for forming a multilayer structure |
| US7749883B2 (en) * | 2007-09-20 | 2010-07-06 | Fry's Metals, Inc. | Electroformed stencils for solar cell front side metallization |
| DE102009024877A1 (en) * | 2009-06-09 | 2010-12-23 | Nb Technologies Gmbh | screen printing forme |
-
2011
- 2011-08-03 TW TW100127607A patent/TW201308616A/en not_active IP Right Cessation
- 2011-10-14 CN CN201110310991XA patent/CN102916073A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW503444B (en) * | 2000-03-08 | 2002-09-21 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
| TWI232543B (en) * | 2003-03-17 | 2005-05-11 | Seiko Epson Corp | Method of forming contact holes and electronic device formed thereby |
| TWI302921B (en) * | 2004-02-26 | 2008-11-11 | Taiwan Semiconductor Mfg | Method of forming a polyimide layer and photo-sensitive polymer layer, and a chip having the polyimide layer |
| TWI263353B (en) * | 2005-11-15 | 2006-10-01 | Advanced Semiconductor Eng | Chip structure and manufacturing method of the same |
| TWI275187B (en) * | 2005-11-30 | 2007-03-01 | Advanced Semiconductor Eng | Flip chip package and manufacturing method of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201308616A (en) | 2013-02-16 |
| CN102916073A (en) | 2013-02-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |