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TWI467152B - Brush force detection device, the application of brush force detection device detection equipment and brush force detection method - Google Patents

Brush force detection device, the application of brush force detection device detection equipment and brush force detection method Download PDF

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Publication number
TWI467152B
TWI467152B TW101119813A TW101119813A TWI467152B TW I467152 B TWI467152 B TW I467152B TW 101119813 A TW101119813 A TW 101119813A TW 101119813 A TW101119813 A TW 101119813A TW I467152 B TWI467152 B TW I467152B
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Taiwan
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brush
force
detecting device
ball
brushing
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TW101119813A
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Chinese (zh)
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TW201350822A (en
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Hon Tech Inc
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Description

刷力偵測裝置、應用刷力偵測裝置之檢測設備及刷力偵測方法Brush force detecting device, detecting device for applying brush force detecting device and brushing force detecting method

本發明係提供一種可偵測刷具之實際刷力,以確保電子元件之錫球於適當刷力下執行刷檢作業,並有效降低電子元件損壞率,進而提升檢測品質及節省成本之刷力偵測裝置。The invention provides an actual brushing force capable of detecting a brush to ensure that the solder ball of the electronic component performs the brushing operation under an appropriate brushing force, and effectively reduces the damage rate of the electronic component, thereby improving the detection quality and the cost saving brushing force. Detection device.

在現今,具錫球之電子元件日趨精密與輕巧,電子元件之植球製程係以植球機於基板上植入複數個陣列配置之錫球(亦稱銲球),再以迴焊機將各錫球焊固於基板,以完成植球作業,由於迴焊作業易因溫度、雜質或錫球放置不佳,致使部份錫球無法確實焊固於基板,因此,業者為確保電子元件之品質,即以具刷具之檢測裝置進行錫球檢測作業,以檢測錫球之固定性,而淘汰出不良品;請參閱第1圖,係為台灣發明第90103773號「球柵陣列式封裝單元之銲球檢驗方法及裝置」之專利案,該銲球檢驗裝置係設有可載送具銲球121之電子元件12的送料器11,並於送料器11之行進路徑上方設有一由驅動源驅動旋轉之刷具13,用以刷檢銲球是否銲固,於執行檢驗作業時,送料器11係載送電子元件12行經刷具13,刷具13即刷檢電子元件12上之銲球121,若銲球121之黏銲強度低於刷具13之刷力,則會被刷具13刷除,進而淘汰不良品銲球121,若銲球121之黏銲強度高於刷具13之刷力,則會順利通過刷具13,而為良品之銲球121,達到檢驗銲球之目的;惟,刷具13刷檢電子元件12上之銲球121時,即會對銲球121產生刷力,由於電子元件12上之銲球121相當微小,不同型式尺寸之銲球121亦承受不同刷力,若刷具13之刷力過大,雖可刷除不良品之銲球121,卻會使良品之銲球121也遭到損壞,若刷力過小,則無法刷除不良品之銲球121,進而影響銲球檢驗品質,故於執行銲球檢驗作業時,必須精確設定刷具13之刷力,方可確保檢驗品質,但此一檢驗裝置並無設計可偵測刷具13實際刷力之偵測裝置,導致無法得知刷具13之刷力是否適用刷檢該型 式之銲球121,以致無法確保檢驗品質及防止銲球受損,實有待加以改善。Nowadays, the electronic components with tin balls are becoming more and more precise and lightweight. The ball-making process of electronic components is to implant a plurality of array-arranged solder balls (also called solder balls) on the substrate by a ball-planting machine, and then the re-welding machine will Each solder ball is soldered to the substrate to complete the ball-planting operation. Since the reflowing operation is liable to be poorly placed due to temperature, impurities or solder balls, some of the solder balls cannot be soldered to the substrate. Therefore, the manufacturer ensures the electronic components. Quality, that is, the solder ball inspection operation with the brush detection device to detect the solder ball's fixedness, and eliminate the defective product; please refer to Figure 1, which is the Taiwan invention No. 90103773 "ball grid array package unit" The solder ball inspection method is provided with a feeder 11 for carrying the electronic component 12 of the solder ball 121, and a driving source is provided above the traveling path of the feeder 11. The rotating brush 13 is used to check whether the solder ball is soldered. When performing the inspection operation, the feeder 11 carries the electronic component 12 through the brush 13, and the brush 13 scans the solder ball on the electronic component 12. 121, if the solder ball 121 has a lower bonding strength With the brushing force of 13, the brush 13 is brushed off, and the defective solder ball 121 is eliminated. If the soldering strength of the solder ball 121 is higher than the brushing force of the brush 13, the brush 13 will pass smoothly. The solder ball 121 of the good product achieves the purpose of inspecting the solder ball; however, when the brush 13 scans the solder ball 121 on the electronic component 12, the brush ball 121 is generated, because the solder ball 121 on the electronic component 12 is equivalent. Tiny, different sizes of solder balls 121 also bear different brushing power. If the brushing force of the brush 13 is too large, although the solder ball 121 of the defective product can be removed, the solder ball 121 of the good product is also damaged. If the force is too small, the solder ball 121 of the defective product cannot be removed, thereby affecting the quality of the solder ball inspection. Therefore, when performing the solder ball inspection operation, the brushing force of the brush 13 must be accurately set to ensure the inspection quality, but this inspection is performed. The device is not designed to detect the actual brushing force of the brush 13, so that it is impossible to know whether the brushing force of the brush 13 is suitable for brushing the type. The solder ball 121 of the type is such that the quality of the inspection cannot be ensured and the solder ball is prevented from being damaged, which needs to be improved.

本發明之目的一,係提供一種刷力偵測裝置,其係裝配於刷具刷檢錫球時而承受作用力之受力裝置上,該具受力件之受力裝置可為具刷具之刷球裝置或具載台之轉運裝置,刷力偵測裝置包含力傳機構、感測機構及處理單元,該力傳機構係設有至少一作動件,用以連結可為刷具或載台之受力件,並以作動件承受受力件所傳遞之作用力,感測機構係設有至少一感測器,用以感測作動件所輸出之待感測力,並將感測資料傳輸至處理單元,處理單元係設有資料模組及調控模組,資料模組係將感測資料作一運算分析檢知刷具之實際刷力,並判斷實際刷力是否符合預設刷力參數範圍,若未符合預設刷力參數範圍,再以調控模組調整刷具之刷力至預設參數範圍;藉此,可檢知刷具之實際刷力,以確保電子元件之錫球於適當刷力下執行刷檢作業,達到提升檢測品質之實用效益。A first object of the present invention is to provide a brush force detecting device which is mounted on a force receiving device which is subjected to a force when the brush brush is used to detect a solder ball, and the force receiving device of the force receiving member may be a brush device. The brush ball device or the transfer device with the loading platform, the brush force detecting device comprises a force transmitting mechanism, a sensing mechanism and a processing unit, wherein the force transmitting mechanism is provided with at least one actuating member for connecting the brush or the load The force receiving member of the table receives the force transmitted by the force receiving member, and the sensing mechanism is provided with at least one sensor for sensing the force to be sensed output by the actuating member, and sensing The data is transmitted to the processing unit, and the processing unit is provided with a data module and a control module. The data module performs the operation analysis to detect the actual brush force of the brush and determines whether the actual brush force conforms to the preset brush. If the range of force parameters is not met, the brushing force of the brush is adjusted to the preset parameter range by the regulating module; thereby, the actual brushing force of the brush can be detected to ensure the tin of the electronic component The ball performs the brushing operation under the appropriate brushing force to improve the inspection quality. Practical benefits.

本發明之目的二,係提供一種刷力偵測裝置,其係以力傳機構之作動件連結承受刷具或載台於錫球刷檢作業中所傳遞之作用力,並以感測機構之感測器感測作動件所輸出之待感測力,再將感測資料傳輸至處理單元作一分析運算,以得知刷具之實際刷力,並可視錫球之型式尺寸,而調控刷具之刷力,以確保電子元件之錫球於適當刷力下執行刷檢作業,進而有效防止電子元件受損,達到節省成本之實用效益。A second object of the present invention is to provide a brush force detecting device which is connected with a force transmitting mechanism to support a force transmitted by a brush or a stage in a solder ball inspection operation, and is used by a sensing mechanism. The sensor senses the to-be-sensed force output by the actuator, and then transmits the sensing data to the processing unit for an analysis operation to know the actual brushing force of the brush, and can view the size of the solder ball, and the control brush The brushing force is used to ensure that the solder ball of the electronic component performs the brushing operation under the appropriate brushing force, thereby effectively preventing the electronic component from being damaged, thereby achieving the practical benefit of cost saving.

本發明之目的三,係提供一種應用刷力偵測裝置之檢測設備,包含入料裝置、出料裝置、刷球裝置、轉運裝置及刷力偵測裝置,入料裝置係用以輸入待檢具錫球之電子元件,出料裝置係用以輸出已檢具錫球之電子元件,轉運裝置係用以移載電子元件至刷球裝置處,刷球裝置係用以刷檢電子元件上之錫球,刷力偵測裝置係用以偵測刷具之實際刷力,達到提升使用效能之實用效益。A third object of the present invention is to provide a detecting device for applying a brush force detecting device, comprising a feeding device, a discharging device, a brush ball device, a transfer device and a brush force detecting device, wherein the feeding device is used for inputting for inspection. The electronic component with the solder ball is used for outputting the electronic component of the solder ball which has been inspected, the transfer device is used for transferring the electronic component to the brush ball device, and the brush ball device is used for brushing the electronic component. The solder ball is used to detect the actual brush force of the brush to achieve the practical benefit of improving the performance.

本發明之目的四,係提供一種刷力偵測方法,其方法係為刷具執行刷檢電子元件之錫球作業,刷力偵測裝置之力傳機構承受刷檢作業中所產生之作用力,刷力偵測裝置之感測機構係感測力傳機構所輸出之待感測力,並將感測資料傳輸至處理單元,處理單元係將預設時間內之預設筆數感測資料作一整理,並排除雜訊數值,再將符合設定之各筆感測資料數值與非作用力數值進行計算,而獲取各時間點之刷具刷力,達到易於偵測刷力之實用效益。The fourth object of the present invention is to provide a brush force detecting method, which is a brush ball performing a solder ball inspection operation of the electronic component, and the force transmitting mechanism of the brush force detecting device is subjected to the force generated in the brushing operation. The sensing mechanism of the brush force detecting device senses the to-be-sensed force output by the force transmitting mechanism, and transmits the sensing data to the processing unit, and the processing unit compares the preset number of sensing data in the preset time. Make a sort and eliminate the noise value, and then calculate the values of the sensed data and the non-force force values that meet the set, and obtain the brush brush force at each time point to achieve the practical benefit of easily detecting the brush force.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如后:請參閱第2、3圖,本發明刷力偵測裝置20係應用於可為刷球機之檢測設備,刷球機包含具刷具之刷球裝置及具載台之轉運裝置,刷力偵測裝置20可用以偵測刷具刷檢錫球之刷力,由於刷檢作業中,刷具及載台均會受力而為一受力件,刷力偵測裝置20即裝配於可為刷球裝置或轉運裝置之受力裝置,用以偵測刷力,於本實施例中,受力裝置係為具載台31之轉運裝置30,轉運裝置30係設有可由驅動源33驅動作至少第一方向(如Y方向)位移之移動架32,驅動源33包含馬達、皮帶輪組及螺桿螺座組等,用以驅動移動架32作第一方向位移,移動架32之上方係設有具輸送器之載台31,其輸送器係為輸送帶311,用以輸送具錫球之電子元件作第二方向(如X方向)位移,又刷力偵測裝置20包含力傳機構、具感測器之感測機構及處理單元,力傳機構係設有至少一連結受力裝置之受力件的作動件,用以承受可為刷具或載台之受力件所傳遞之作用力,作動件可為承架或軸桿,若作動件為軸桿時,係可為獨立之轉桿或為刷具之轉軸,用以承受刷具所傳遞之作用力,該作用力可為待檢錫球對刷具之反用作力,若作動件為承架時,可承置刷具或載台,用以承受刷具或載台傳遞之作用力,該作用力可為待檢錫球對刷具之反用作力,或刷檢作業中之載台的反作用力,於本實施例中,刷力偵測裝置20係裝配於轉運裝置30的載台31及移動架32 之間,力傳機構之作動件係為可連結承置載台31之承架21,另於承架21與移動架32間係設有相互配合之壓塊211及感測機構的感測器,於本實施例中,係於承架21之底部設有壓塊211,並承受載台31所傳遞之作用力,另刷力偵測裝置20係設有可輔助作動件作至少一方向位移之滑移結構,於本實施例中,滑移結構係於承架21與移動架32之間設有相互配合之滑座212及滑軌321,又刷力偵測裝置20之感測機構係設有至少一感測器,用以感測作動件所輸出之待感測力,並將感測資料傳輸至處理單元,該感測器可為扭力感測器或壓力感測器,若作動件為刷具之轉軸,由於刷具所承受錫球之反作用力會傳遞到轉軸,而改變轉軸之扭力,感測器可為扭力感測器,用以感測轉軸所輸出之待感測扭力,若作動件為承架,感測器可為壓力感測器,用以感測承架所輸出之待感測壓力,於本實施例中,感測機構係於移動架32之頂部設有具按壓件221之壓力感測器22,用以感測承架21之壓塊211所輸出之待感測壓力,另刷力偵測裝置20係於移動架32與承架21間設有掣壓結構,用以輔助壓塊211與感測器22作初步相互貼置,而可避免壓塊211作空行程位移,於本實施例中,掣壓結構係於移動架32之上方架設有一套置彈性件之掣動桿23,彈性件可為彈簧231,掣動桿23則頂抵於承架21之壓塊211側面,用以頂推壓塊211初步貼置於壓力感測器22之按壓件221,又刷力偵測裝置20之處理單元(圖未示出)係包含資料模組及調控模組,資料模組係用以將感測資料(如扭力值資料或壓力值資料等)作一運算分析出刷具之實際刷力,並判斷實際刷力是否符合預設刷力參數範圍,調控模組係用以調整刷具之刷力,於本實施例中,資料模組係將壓力感測器22傳輸之感測資料作一運算分析而得知刷具之實際刷力,並視具錫球之不同電子元件的型式、尺寸,而加以判斷實際刷力是否符合預設刷力參數範圍,若未符合預設刷力參數範圍,再以調控模組調整刷具之刷力至預設參數範圍,例如調整刷具之轉速或刷具之高度等方式,使刷具之刷力符合預 設刷力。In order to make the present invention more fully understood by the reviewing committee, a preferred embodiment and a drawing will be described in detail as follows: Please refer to FIGS. 2 and 3, the brush detecting device 20 of the present invention is applied to For the detection device of the ball brushing machine, the brush ball machine comprises a brush ball device with a brush and a transfer device with a loading table, and the brush force detecting device 20 can be used to detect the brush force of the brush brush for the solder ball, due to the brush inspection In the operation, both the brush and the stage are subjected to a force, and the brush detecting device 20 is assembled on a force device which can be a brush ball device or a transfer device for detecting the brush force. In the embodiment, the force receiving device is a transfer device 30 having a stage 31. The transfer device 30 is provided with a moving frame 32 that can be driven by the driving source 33 to be displaced in at least a first direction (such as a Y direction), and the driving source 33 includes a motor. , the pulley set and the screw base set are used to drive the moving frame 32 for the first direction displacement, and the top of the moving frame 32 is provided with a carrier 31 with a conveyor, and the conveyor is a conveyor belt 311 for conveying The electronic component with the tin ball is displaced in the second direction (such as the X direction), and the brush force detecting device 20 includes the force. The mechanism, the sensing mechanism and the processing unit of the sensor, the force transmission mechanism is provided with at least one actuating member that is connected to the force receiving member of the force receiving device, and is adapted to bear the force transmitted by the force receiving member of the brush or the loading table. The force acting as the carrier or the shaft can be an independent rotating rod or a rotating shaft of the brush for supporting the force transmitted by the brush. It can be used as the counter force of the brush to be inspected. If the actuating member is the carrier, the brush or the carrier can be placed to bear the force transmitted by the brush or the carrier. The force can be In the present embodiment, the brush force detecting device 20 is mounted on the stage 31 and the moving frame of the transfer device 30, in response to the counter force of the solder ball to the brush or the reaction force of the stage in the brushing operation. 32 The actuator of the force transmitting mechanism is a bracket 21 that can be coupled to the mounting platform 31, and a sensor that cooperates with the pressing block 211 and the sensing mechanism between the carrier 21 and the moving frame 32. In this embodiment, the bottom of the frame 21 is provided with a pressing block 211, and is subjected to the force transmitted by the loading table 31. The other brushing force detecting device 20 is provided with an auxiliary actuator for at least one direction displacement. In the embodiment, the sliding structure is provided with a sliding seat 212 and a sliding rail 321 between the bracket 21 and the moving frame 32, and the sensing mechanism of the brush detecting device 20 is further Having at least one sensor for sensing the force to be sensed output by the actuator and transmitting the sensing data to the processing unit, the sensor may be a torsion sensor or a pressure sensor, if The workpiece is the rotating shaft of the brush. Since the reaction force of the solder ball received by the brush is transmitted to the rotating shaft and the torque of the rotating shaft is changed, the sensor can be a torque sensor for sensing the torque to be sensed outputted by the rotating shaft. If the actuating member is a carrier, the sensor can be a pressure sensor for sensing the pressure to be sensed outputted by the carrier. In this embodiment, the sensing mechanism is provided with a pressure sensor 22 having a pressing member 221 on the top of the moving frame 32 for sensing the pressure to be sensed by the pressing block 211 of the frame 21, and the other brushing force. The detecting device 20 is provided with a rolling structure between the moving frame 32 and the frame 21 for assisting the initial pressing of the pressing block 211 and the sensor 22, and avoiding the empty stroke displacement of the pressing block 211. In the embodiment, the rolling structure is provided with a set of elastic members 23 on the moving frame 32. The elastic member can be a spring 231, and the swinging rod 23 abuts against the side of the pressing block 211 of the bracket 21. The pressing unit 211 is initially attached to the pressing member 221 of the pressure sensor 22, and the processing unit (not shown) of the brush detecting device 20 includes a data module and a control module, and a data module. It is used to analyze the actual brushing force of the brush by sensing data (such as torque value data or pressure value data), and determine whether the actual brush force meets the preset brush force parameter range, and the control module is used to Adjusting the brushing force of the brush, in the embodiment, the data module performs the operation of sensing data transmitted by the pressure sensor 22. Analyze and know the actual brush force of the brush, and determine whether the actual brush force meets the preset brush force parameter range according to the type and size of the different electronic components of the solder ball. If the preset brush force parameter range is not met, Then, the regulating module adjusts the brushing force of the brush to a preset parameter range, for example, adjusting the rotating speed of the brush or the height of the brush, so that the brushing force of the brush conforms to the pre-predetermined Set the brush force.

請參閱第4、5圖,刷球機係於轉運裝置30之上方配置有具刷具41之刷球裝置40,該刷球裝置40係設有可由動力源42驅動作至少一方向位移及旋轉之刷具41,用以刷檢電子元件之錫球,於本實施例中,刷球裝置40之動力源42係驅動刷具41作第二方向位移、第三方向(如Z方向)位移及旋轉作動,於使用時,轉運裝置30係以載台31上之輸送帶311輸送具錫球51之電子元件50作第二方向位移,刷球裝置40之動力源42係驅動刷具41旋轉,並帶動刷具41作第三方向位移至電子元件50之上方,再驅動刷具41作第二方向刷檢電子元件50之錫球51,由於電子元件50係置放於載台31上,當刷具41作順時針旋轉刷檢電子元件50之錫球51時,亦會對載台31產生第二方向推力,載台31於承受該第二方向推力時即產生反作用力,並將此一反作用力傳遞至承架21,而使承架21作第二方向位移,承架21下方之滑座212則沿移動架32上之滑軌321位移,由於承架21之壓塊211已初步貼置於壓力感測器22之按壓件221,於承架21作第二方向位移時,可令壓塊211直接壓抵壓力感測器22之按壓件221,壓力感測器22即感測壓塊211所輸出之待感測壓力,並將感測之壓力資料傳輸至處理單元,由於不同電子元件50之錫球51可承受之刷力具有差異,處理單元之資料模組可將感測之壓力資料作一運算分析而得知刷具41之實際刷力,並加以判斷實際刷力是否符合該錫球51可承受之預設刷力參數範圍,若符合符合預設刷力參數範圍,則繼續執行錫球刷檢作業,若不符合預設刷力參數範圍,則以調控模組調整刷具41之刷力至預設刷力參數範圍,調控模組可調整刷具41之轉速,使刷具41之刷力符合預設刷力,進而提升刷檢品質及降低電子元件損壞率及後製程良率;請參閱第6圖,於刷具41刷檢錫球51完畢後,載台31並未承受刷具41之第二方向推力,亦無傳遞反作用力至承架21,承架21之壓塊211即無外力壓抵壓力感測器22之按 壓件221,壓力感測器22即利用按壓件221復位彈力頂推壓塊211外移,使承架21及其上之載台31復位,承架21下方之滑座212則沿移動架32上之滑軌321反向位移,以便刷力偵測裝置20執行下一刷力偵測作業。Referring to Figures 4 and 5, the ball brushing machine is disposed above the transfer device 30 with a brush ball device 40 having a brush 41. The brush ball device 40 is provided with a power source 42 for driving at least one direction of displacement and rotation. The brush 41 is used for brushing the solder ball of the electronic component. In the embodiment, the power source 42 of the brush ball device 40 drives the brush 41 to be displaced in the second direction and displaced in the third direction (such as the Z direction). In the operation, the transfer device 30 is configured to transport the electronic component 50 of the solder ball 51 in the second direction by the conveyor belt 311 on the stage 31, and the power source 42 of the brush ball device 40 drives the brush 41 to rotate. The brush 41 is driven to move in the third direction to the upper side of the electronic component 50, and then the brush 41 is driven to perform the second direction of the solder ball 51 of the electronic component 50. Since the electronic component 50 is placed on the stage 31, When the brush 41 rotates the solder ball 51 of the electronic component 50 clockwise, the second direction thrust is also generated on the stage 31, and the stage 31 generates a reaction force when receiving the thrust in the second direction, and this is generated. The reaction force is transmitted to the carrier 21, and the carrier 21 is displaced in the second direction, and the sliding under the carrier 21 The seat 212 is displaced along the sliding rail 321 of the moving frame 32. Since the pressing block 211 of the bracket 21 has been initially placed on the pressing member 221 of the pressure sensor 22, when the carrier 21 is displaced in the second direction, The pressing block 211 is directly pressed against the pressing member 221 of the pressure sensor 22, and the pressure sensor 22 senses the pressure to be sensed outputted by the pressing block 211, and transmits the sensed pressure data to the processing unit due to different electronic The solder ball 51 of the component 50 can withstand different brushing forces, and the data module of the processing unit can perform the operational analysis of the sensed pressure data to know the actual brushing force of the brush 41, and determine whether the actual brushing force is consistent. The tin ball 51 can withstand the preset brush force parameter range, and if it meets the preset brush force parameter range, the solder ball brush inspection operation is continued, and if the preset brush force parameter range is not met, the control module adjustment brush is used. With a brush force of 41 to the preset brush force parameter range, the control module can adjust the rotation speed of the brush 41 so that the brush force of the brush 41 conforms to the preset brush force, thereby improving the quality of the brush inspection and reducing the damage rate of the electronic component and thereafter. Process yield; please refer to Figure 6, in the brush 41 to check the solder ball 51 After the completion, the stage 31 does not bear the second direction thrust of the brush 41, and does not transmit the reaction force to the carrier 21. The pressing block 211 of the frame 21 is pressed by the pressure sensor 22 without external force. The pressure member 221, the pressure sensor 22 uses the pressing member 221 to reset the elastic pushing block 211 to move outward, so that the carrier 21 and the loading table 31 thereon are reset, and the sliding seat 212 below the carrier 21 is along the moving frame 32. The upper slide rail 321 is reversely displaced so that the brush force detecting device 20 performs the next brush force detecting operation.

請參閱第7圖,本發明刷力偵測裝置20A之另一應用實施例,該受力裝置係為具刷具41A之刷球裝置40A,刷球裝置40A係設有可由動力源42A驅動作至少一方向位移之移動架43A,於本實施例中,動力源42A係帶動移動架43A作第二、三方向位移,並驅動可為刷具41A之受力件旋轉作動,用以刷檢電子元件上之錫球,該刷力偵測裝置20A係裝配於刷具41A與移動架43A之間,並包含力傳機構、具感測器之感測機構及處理單元,力傳機構係設有可為承架21A之作動件,承架21A之下方係裝配連結有刷具41A,並承受刷具41A所傳遞之作用力,另於承架21A與移動架43A間係設有相互配合之壓塊211A及感測機構的感測器,於本實施例中,係於承架21A之上方設有壓塊211A,並承受刷具41A所傳遞之作用力,另刷力偵測裝置20A係設有可輔助作動件作至少一方向位移之滑移結構,於本實施例中,滑移結構係於承架21A與移動架43A之間設有相互配合之滑座212A及滑軌431A,又感測機構係於移動架43A之底部設有具按壓件221A之壓力感測器22A,用以感測承架21A之壓塊211A所輸出之待感測壓力,另刷力偵測裝置20A係於移動架43A與承架21A間設有掣壓結構,用以輔助壓塊211A與感測器22A作初步相互貼置,於本實施例中,掣壓結構係於移動架43A之下方架設有一套置彈性件之掣動桿23A,彈性件可為彈簧231A,掣動桿23A則頂抵於承架21A之壓塊211A側面,用以頂推壓塊211A初步貼置於壓力感測器22A之按壓件221A,又刷力偵測裝置20A之處理單元(圖未示出)係至少包含資料模組及調控模組,資料模組係用以將感測資料(如扭力值資料或壓力值資料等)作一運算分析出刷具41A之實際 刷力,並判斷實際刷力是否符合預設刷力參數範圍,調控模組係用以調整刷具41A之刷力,於本實施例中,資料模組係可將壓力感測器22A傳輸之感測資料經運算分析而得出刷具41A之實際刷力,並判斷實際刷力是否符合預設刷力參數範圍,若未符合預設刷力參數範圍,再以調控模組調整刷具41A之刷力至預設參數範圍,使刷具41A之刷力符合預設刷力。Referring to FIG. 7, another application example of the brush force detecting device 20A of the present invention is a brush ball device 40A having a brush 41A, and the brush ball device 40A is driven by a power source 42A. In the present embodiment, the power source 42A drives the moving frame 43A to perform the second and third directions of displacement, and drives the force receiving member of the brush 41A to rotate, for detecting the electronic a solder ball on the component, the brush detecting device 20A is mounted between the brush 41A and the moving frame 43A, and includes a force transmitting mechanism, a sensing mechanism with a sensor, and a processing unit, and the force transmitting mechanism is provided It can be the actuating member of the frame 21A. The lower part of the frame 21A is assembled and coupled with the brush 41A, and receives the force transmitted by the brush 41A, and the mutual pressure is applied between the frame 21A and the moving frame 43A. In the embodiment, the block 211A and the sensor of the sensing mechanism are provided with a pressing block 211A above the frame 21A, and are subjected to the force transmitted by the brush 41A, and the brush detecting device 20A is provided. a slip structure capable of assisting the actuator to be displaced in at least one direction. In this embodiment, the slip knot A sliding seat 212A and a sliding rail 431A are disposed between the frame 21A and the moving frame 43A, and the sensing mechanism is provided with a pressure sensor 22A having a pressing member 221A at the bottom of the moving frame 43A. The pressure to be sensed by the pressure piece 211A of the frame 21A is sensed, and the brush force detecting device 20A is provided with a rolling structure between the moving frame 43A and the frame 21A for assisting the pressing piece 211A and the sensor. 22A is initially placed on each other. In this embodiment, the rolling structure is disposed below the moving frame 43A, and a set of elastic members 23A is disposed. The elastic member can be a spring 231A, and the swaying rod 23A is abutted against The side of the pressing block 211A of the frame 21A is used for pushing the pressing block 211A to be initially placed on the pressing member 221A of the pressure sensor 22A, and the processing unit (not shown) of the brush detecting device 20A is at least containing data. The module and the control module are used to analyze the sensing data (such as the torque value data or the pressure value data) to analyze the actual shape of the brush 41A. The brush force is used to determine whether the actual brush force is in accordance with the preset brush force parameter range, and the control module is used to adjust the brush force of the brush 41A. In this embodiment, the data module can transmit the pressure sensor 22A. The sensing data is calculated and analyzed to obtain the actual brushing force of the brush 41A, and it is determined whether the actual brushing force conforms to the preset brushing force parameter range. If the preset brushing force parameter range is not met, the brush module 41A is adjusted by the regulating module. The brush force is up to the preset parameter range, so that the brush force of the brush 41A conforms to the preset brush force.

請參閱第8、9圖,該刷球裝置40A之下方係配置有具載台31A之轉運裝置30A,該轉運裝置30A係設有可由驅動源33A驅動作至少一方向位移之載台31A,用以承載具錫球51之電子元件50,於本實施例中,轉運裝置30A之驅動源33A係驅動載台31A作第一方向位移,並於載台31A設有可為輸送帶311A之輸送器,用以輸送具錫球51之電子元件50,於使用時,轉運裝置30A係以載台31A上之輸送帶311A輸送具錫球51之電子元件50作第二方向位移,刷球裝置40A之動力源42A係驅動刷具41A旋轉,並帶動刷具41A作第三方向位移至電子元件50之上方,再驅動刷具41A作第二方向位移刷檢電子元件50之錫球51,當刷具41A作順時針旋轉刷檢錫球51時,錫球51會對刷具41A產生反作用力,刷具41A係將反作用力傳遞至承架21A,而使承架21A作第二方向位移,承架21A上方之滑座212A則沿移動架43A下方之滑軌431A位移,由於承架21A之壓塊211A已初步貼置於壓力感測器22A之按壓件221A,於承架21A作第二方向位移時,可令壓塊211A直接壓抵壓力感測器22A之按壓件221A,壓力感測器22A即感測壓塊211A所輸出之待感測壓力,並將感測之壓力資料傳輸至處理單元,處理單元之資料模組可將感測之壓力資料作一運算而得知刷具41A之實際刷力,並加以判斷實際刷力是否符合該錫球51可承受之預設刷力參數範圍,若不符合預設刷力參數範圍,則以調控模組調整刷具41A之刷力至預設刷力參數範圍,調控模組可調整刷具41A之轉速,使刷具41A之刷力符合預設刷力, 進而提升刷檢品質及降低電子元件損壞率及後製程良率;請參閱第10圖,於刷具41A刷檢錫球51後,刷具41A並未承受錫球51之反作用力,亦無傳遞反作用力至承架21A,承架21A之壓塊211A即無外力壓抵壓力感測器22A之按壓件221A,壓力感測器22A即利用按壓件221A之復位彈力頂推壓塊211A外移,使承架21A及其上之刷具41A復位,承架21A之滑座212A則沿移動架43A之滑軌431反向位移,以便刷力偵測裝置20A執行下一偵測作業。Referring to Figures 8 and 9, a transfer device 30A having a stage 31A is disposed below the ball brushing device 40A. The transfer device 30A is provided with a stage 31A that can be driven by the drive source 33A to be displaced in at least one direction. In the present embodiment, the driving source 33A of the transfer device 30A drives the stage 31A to be displaced in the first direction, and the carrier 31A is provided with a conveyor that can be the conveyor belt 311A. For use in transporting the electronic component 50 with the solder ball 51, in use, the transfer device 30A transports the electronic component 50 of the solder ball 51 in the second direction by the conveyor belt 311A on the stage 31A, and the ball brushing device 40A The power source 42A drives the brush 41A to rotate, and drives the brush 41A to shift to the upper side of the electronic component 50 in the third direction, and then drives the brush 41A to perform the second direction displacement of the solder ball 51 of the electronic component 50. When the 41A rotates the solder ball 51 clockwise, the solder ball 51 generates a reaction force to the brush 41A, and the brush 41A transmits the reaction force to the carrier 21A, and the carrier 21A is displaced in the second direction, the carrier The slide 212A above the 21A is displaced along the slide rail 431A below the moving frame 43A due to The pressing block 211A of the frame 21A has been initially placed on the pressing member 221A of the pressure sensor 22A. When the carrier 21A is displaced in the second direction, the pressing block 211A can be directly pressed against the pressing member 221A of the pressure sensor 22A. The pressure sensor 22A senses the pressure to be sensed outputted by the pressure block 211A, and transmits the sensed pressure data to the processing unit, and the data module of the processing unit can calculate the pressure data of the sensing unit. Knowing the actual brushing force of the brush 41A, and determining whether the actual brushing force meets the range of the preset brushing force parameters that the solder ball 51 can withstand, and if it does not meet the preset brushing force parameter range, the regulating module adjusts the brush 41A. The brush force is up to the preset brush force parameter range, and the control module can adjust the rotation speed of the brush 41A so that the brush force of the brush 41A conforms to the preset brush force. Further improve the quality of the brush inspection and reduce the damage rate of the electronic components and the yield of the after-process; please refer to FIG. 10, after the brush 41A brushes the solder ball 51, the brush 41A does not bear the reaction force of the solder ball 51, and there is no transmission. The reaction force is applied to the frame 21A, and the pressure piece 211A of the frame 21A is pressed against the pressing member 221A of the pressure sensor 22A, and the pressure sensor 22A is moved outward by the reset spring pushing block 211A of the pressing member 221A. The frame 21A and the brush 41A thereon are reset, and the carriage 212A of the frame 21A is reversely displaced along the slide rail 431 of the moving frame 43A, so that the brush detecting device 20A performs the next detecting operation.

請參閱第11、12圖,係為應用上述刷力偵測裝置之刷球機,刷球機包含機台60、入料裝置70、出料裝置80、刷球裝置40、轉運裝置30及刷力偵測裝置20,入料裝置70係配置於機台60上,用以輸入至少一待檢具錫球之電子元件,出料裝置80係配置於機台60上,用以輸出至少一已檢具錫球之電子元件,刷球裝置40係配置於機台60上,並設有可由動力源驅動作至少一方向位移及旋轉作動之刷具41,用以刷檢電子元件之錫球,轉運裝置30係配置於機台60上,並設有可由驅動源驅動作至少一方向位移之載台31,用以移載電子元件至刷球裝置40處,至少一刷力偵測裝置20係相同上述之刷力偵測裝置(請配合參閱第2、3圖),係用以偵測刷具41刷於電子元件之錫球上的實際刷力,刷力偵測裝置20可裝配於刷球裝置40或轉運裝置30,於本實施例中,係裝配於轉運裝置30上,並包含力傳機構、感測機構及處理單元,力傳機構係設有至少一可為承架21之作動件,用以連結可為載台31之受力件,並以承架21承受載台41所傳遞之作用力,感測機構係設有至少一可為壓力感測器22之感測器,用以感測承架21所輸出之待感測壓力,並將感測資料傳輸至處理單元,處理單元係設有資料模組及調控模組,資料模組係將感測之壓力資料作一運算分析得知刷具41之實際刷力,並判斷實際刷力是否符合預設刷力參數範圍,若未符合預設刷力參數範圍,再以調控模組調整刷具41之刷力至預設參數範圍。Please refer to Figures 11 and 12, which are brush ball machines for applying the above-mentioned brush force detecting device. The ball brushing machine includes a machine table 60, a feeding device 70, a discharging device 80, a brush ball device 40, a transfer device 30 and a brush. The force detecting device 20 is disposed on the machine 60 for inputting at least one electronic component of the solder ball to be inspected, and the discharging device 80 is disposed on the machine 60 for outputting at least one The electronic component of the solder ball, the brush ball device 40 is disposed on the machine table 60, and is provided with a brush 41 that can be driven by the power source to perform at least one direction of displacement and rotation, for detecting the solder ball of the electronic component. The transfer device 30 is disposed on the machine table 60, and is provided with a stage 31 that can be driven by the driving source to be displaced in at least one direction for transferring the electronic components to the brush ball device 40, and at least one brush force detecting device 20 The same brush force detecting device (please refer to FIGS. 2 and 3) is used to detect the actual brushing force of the brush 41 on the solder ball of the electronic component, and the brush detecting device 20 can be assembled on the brush. The ball device 40 or the transfer device 30, in this embodiment, is mounted on the transfer device 30 and includes a force transmitter The sensing mechanism and the processing unit are provided with at least one actuating member which can be the carrier 21 for connecting the force receiving member which can be the loading table 31, and receiving the bearing table 41 by the carrier 21 The sensing mechanism is provided with at least one sensor which can be a pressure sensor 22 for sensing the pressure to be sensed outputted by the carrier 21 and transmitting the sensing data to the processing unit, the processing unit The system has a data module and a control module. The data module performs the operational analysis of the sensed pressure data to determine the actual brush force of the brush 41, and determines whether the actual brush force meets the preset brush force parameter range. The preset brush force parameter range is not met, and the brushing force of the brush 41 is adjusted to a preset parameter range by the regulating module.

請參閱第12、13、14圖(請配合第4、5、6圖),入料裝置70係將待檢具錫球51之電子元件50輸送至轉運裝置30之載台31上,載台31係以輸送帶311輸送電子元件50,轉運裝置30係控制驅動源33驅動載台31作第一方向位移至刷球裝置40之下方,刷球裝置40係控制動力源42驅動複數個刷具41分別作第一、二、三方向位移及旋轉作動,而刷檢電子元件50上之錫球51,當刷具41刷檢錫球51時,亦對載台31產生一第二方向推力,載台31即產生反作用力,並帶動承架21作第二方向位移,令承架21之壓塊211壓抵壓力感測器22之按壓件221,壓力感測器22即感測壓塊211所輸出之待感測壓力,並將感測資料傳輸至處理單元,處理單元係設有資料模組及調控模組,資料模組係將感測資料作一運算得知刷具41之實際刷力,並判斷實際刷力是否符合預設刷力參數範圍,若未符合預設刷力參數範圍,再以調控模組調整刷具41之刷力至預設參數範圍,於電子元件50之錫球51刷檢完畢後,轉運裝置30之輸送帶311係將已檢具錫球51之電子元件50輸送至出料裝置80,由出料裝置80輸出電子元件50,因此,可檢知刷具41之實際刷力,以確保電子元件50之錫球51於適當刷力下執行檢測作業,並防止電子元件50受損,達到提升檢測品質及節省成本之實用效益。Please refer to Figures 12, 13, and 14 (please cooperate with Figures 4, 5, and 6). The feeding device 70 transports the electronic component 50 of the solder ball 51 to be loaded onto the loading table 31 of the transfer device 30. 31 is a conveyor belt 311 for transporting electronic components 50. The transfer device 30 controls the drive source 33 to drive the stage 31 to be displaced in the first direction to below the brush ball device 40. The brush ball device 40 controls the power source 42 to drive a plurality of brushes. 41 is used for the first, second and third directions of displacement and rotation respectively, and the solder ball 51 on the electronic component 50 is brushed. When the brush 41 brushes the solder ball 51, the second direction thrust is also generated on the stage 31. The stage 31 generates a reaction force, and drives the frame 21 to be displaced in the second direction, so that the pressure piece 211 of the frame 21 is pressed against the pressing member 221 of the pressure sensor 22, and the pressure sensor 22 is the sensing pressure block 211. The output pressure to be sensed, and the sensing data is transmitted to the processing unit, the processing unit is provided with a data module and a control module, and the data module is used to calculate the actual data of the brush 41. Force, and determine whether the actual brush force meets the preset brush force parameter range, if it does not meet the preset brush force parameter range, then The control module adjusts the brushing force of the brush 41 to a preset parameter range. After the solder ball 51 of the electronic component 50 is brushed, the conveyor belt 311 of the transfer device 30 transports the electronic component 50 of the solder ball 51 to the electronic component 50. The discharging device 80 outputs the electronic component 50 from the discharging device 80. Therefore, the actual brushing force of the brush 41 can be detected to ensure that the solder ball 51 of the electronic component 50 performs the detecting operation under an appropriate brushing force and prevents the electronic component. 50 damage, to achieve the practical benefits of improved detection quality and cost savings.

請參閱第15圖,係為本發明之刷力偵測方法,包含下列步驟:步驟91:刷具執行刷檢電子元件之錫球作業,於本實施例中,電子元件上係具有複數顆錫球,刷具係作至少一方向位移及旋轉作動而逐一刷檢電子元件上之各錫球;步驟92:刷力偵測裝置之力傳機構係承受刷檢作業中所產生之作用力,於本實施例中,力傳機構可裝配於具刷具之刷球裝置或具載台之轉運裝置處,而承受可為刷具或載台所傳遞之反作用力等作用力;步驟93:刷力偵測裝置之感測機構係感測力傳機構所輸出 之待感測力,並將感測資料傳輸至處理單元,於本實施例中,感測機構之感測器可為壓力感測器或扭力感測器,以感測力傳機構所輸出之待感測力(如扭力、壓力等),並將各時間點所感測之感測資料傳輸至處理單元;步驟94:處理單元係將預設時間區塊內之預設筆數感測資料作一整理,於本實施例中,處理單元可分次執行將每2秒預設時間內所感測到之50筆感測資料,並依各感測資料之數值高低作一分析排序;步驟95:處理單元依整理後之感測資料進行排除雜訊數值,於本實施例中,感測器於偵測或傳輸過程中所產生之異常訊號可視為雜訊,例如突升數值或突降數值,於排除雜訊時,可依排序後之感測資料,將較高範圍10%的感測資料及較低範圍10%的感測資料視為雜訊,而排除較高、低範圍10%之雜訊感測資料;步驟96:處理單元係將符合設定之各筆感測資料數值與非作用力數值進行計算,而獲取各時間點之刷具刷力,於本實施例中,刷具刷檢錫球所產生之靜摩擦力,或掣壓結構之掣動桿初步貼置於感測器上所產生之預壓力,亦或馬達反轉瞬間之力量,均可視為非作用力,處理單元係將符合設定之各筆感測資料數值與非作用力數值進行計算,例如處理單元去除預壓力之計算方式係將感測資料數值減去無負載之壓力,而獲取各時間點之刷具刷力,又處理單元可利用刷具接觸錫球的時間與感測器感測之力量去判斷是否受靜摩擦力所影響,如受影響,即需整理出靜摩擦力之曲線圖,並作一補正,以獲取各時間點之刷具刷力,其補正方式首先要求出靜摩擦力與時間的關係圖,可將刷具接觸錫球之時間點的力量設為A,將感測器感測到力量變化之時間點的力設為B,B係為最大靜摩擦力,再將A、B及感測器感測到之資料數值等作一補正並整理出一刷力曲線,以得知各時間點之刷具刷力,再者,若非作用力為馬達反轉瞬間之力量時,可利用馬達在反轉處之時間點所產生的加速度而計算出反轉力,並將反轉力與 感測器感測到之資料數值作一整理,以獲取刷具之刷力,因此,經由以上方法即可獲取各時間點之刷具刷力,並將偵測出之刷力回饋至處理單元之調控模組作一刷力調整,達到易於偵測及調控刷力之實用效益。Please refer to FIG. 15 , which is a brush force detecting method according to the present invention, comprising the following steps: Step 91: The brush performs a solder ball operation for brushing electronic components. In this embodiment, the electronic component has a plurality of tins. The ball and the brush are used for at least one direction displacement and rotation to individually scan the solder balls on the electronic component; step 92: the force transmission mechanism of the brush force detecting device is subjected to the force generated in the brushing operation, In this embodiment, the force transmission mechanism can be assembled on the brush ball device with the brush or the transfer device with the carrier, and bears the reaction force that can be transmitted by the brush or the carrier; Step 93: Brush detection The sensing mechanism of the measuring device is outputted by the sensing force transmitting mechanism The sensing force is transmitted, and the sensing data is transmitted to the processing unit. In this embodiment, the sensor of the sensing mechanism may be a pressure sensor or a torsion sensor to sense the output of the force transmitting mechanism. To sense the force (such as torque, pressure, etc.), and transmit the sensed data sensed at each time point to the processing unit; step 94: the processing unit is to set the preset number of sensing data in the preset time block In one embodiment, in the embodiment, the processing unit may perform 50 pieces of sensing data sensed every 2 seconds within a preset time, and sort and sort according to the value of each sensing data; Step 95: The processing unit performs the noise removal value according to the sensed data. In this embodiment, the abnormal signal generated by the sensor during the detection or transmission process may be regarded as a noise, such as a sudden rise value or a sudden drop value. In the case of eliminating noise, the higher-range 10% of the sensing data and the lower-range 10% of the sensing data can be regarded as noise according to the sorted sensing data, and the higher and lower ranges of 10% are excluded. Noise sensing data; Step 96: The processing unit will meet the set of each sensing The material value and the non-force value are calculated, and the brush brush force at each time point is obtained. In this embodiment, the static friction force generated by the brush brushing the solder ball or the tilting rod of the rolling structure is initially placed. The pre-pressure generated on the sensor, or the force of the motor reversal moment, can be regarded as non-force. The processing unit will calculate the values of the sensed data and the non-force values according to the settings, for example, processing. The unit removes the pre-pressure calculation method by subtracting the pressure of the sensed data from the no-load pressure, and obtaining the brush brush force at each time point, and the processing unit can use the time when the brush contacts the solder ball and the sensor senses. Strength to determine whether it is affected by static friction. If affected, it is necessary to sort out the static friction curve and make a correction to obtain the brush brush force at each time point. The correction method first requires static friction and time. The relationship diagram can set the force of the brush to contact the solder ball as A, the force at the time when the sensor senses the change of force is B, the B is the maximum static friction, and then A, B And the sensor sensed The data value is used as a correction and a brush force curve is compiled to know the brush brush force at each time point. Further, if the force is the force of the motor reversal moment, the time at which the motor is reversed can be utilized. Calculate the reversal force by the acceleration generated by the point, and the reversal force The data sensed by the sensor is sorted to obtain the brush force of the brush. Therefore, the brush force of each brush point can be obtained by the above method, and the detected brush force is fed back to the processing unit. The control module makes a brush force adjustment to achieve practical benefits of easy detection and regulation of the brush force.

〔習知〕[study]

11‧‧‧送料器11‧‧‧Feeder

12‧‧‧電子元件12‧‧‧Electronic components

121‧‧‧銲球121‧‧‧ solder balls

13‧‧‧刷具13‧‧‧ brushes

〔本發明〕〔this invention〕

20、20A‧‧‧刷力偵測裝置20, 20A‧‧‧ brush force detection device

21、21A‧‧‧承架21, 21A‧‧‧ Shelf

211、211A‧‧‧壓塊211, 211A‧‧‧ briquettes

212、212A‧‧‧滑座212, 212A‧‧‧ slide

22、22A‧‧‧壓力感測器22, 22A‧‧‧ Pressure Sensor

221、221A‧‧‧按壓件221, 221A‧‧‧ Pressing parts

23、23A‧‧‧掣動桿23, 23A‧‧‧ swaying rod

231、231A‧‧‧彈簧231, 231A‧ ‧ spring

30、30A‧‧‧轉運裝置30, 30A‧‧‧Transportation device

31、31A‧‧‧載台31, 31A‧‧‧ stage

311、311‧‧‧輸送帶311, 311‧‧‧ conveyor belt

32‧‧‧移動架32‧‧‧Mobile rack

321‧‧‧滑軌321‧‧‧rails

33‧‧‧驅動源33‧‧‧Drive source

40、40A‧‧‧刷球裝置40, 40A‧‧‧ brush ball device

41、41A‧‧‧刷具41, 41A‧‧‧ brushes

42、42A‧‧‧動力源42, 42A‧‧‧ power source

43A‧‧‧移動架43A‧‧‧Mobile rack

431A‧‧‧滑軌431A‧‧‧rails

50‧‧‧電子元件50‧‧‧Electronic components

51‧‧‧錫球51‧‧‧ solder balls

60‧‧‧機台60‧‧‧ machine

70‧‧‧入料裝置70‧‧‧Feeding device

80‧‧‧出料裝置80‧‧‧Drawing device

91~96‧‧‧步驟91~96‧‧‧Steps

第1圖:習知檢測機檢測電子元件之錫球的使用示意圖。Fig. 1 is a schematic view showing the use of a solder ball for detecting electronic components by a conventional detecting machine.

第2圖:本發明刷力偵測裝置應用於轉運裝置之外觀圖。Fig. 2 is an external view of the brush detecting device of the present invention applied to a transfer device.

第3圖:本發明刷力偵測裝置應用於轉運裝置之前視圖。Figure 3: Front view of the brush force detecting device of the present invention applied to the transfer device.

第4圖:係刷力偵測裝置、轉運裝置及刷球裝置之配置示意圖。Figure 4: Schematic diagram of the configuration of the brush force detecting device, the transfer device and the brush ball device.

第5圖:本發明刷力偵測裝置之使用示意圖(一)。Figure 5: Schematic diagram of the use of the brush force detecting device of the present invention (1).

第6圖:本發明刷力偵測裝置之使用示意圖(二)。Figure 6: Schematic diagram of the use of the brush force detecting device of the present invention (2).

第7圖:本發明刷力偵測裝置應用於刷球裝置之示意圖。Fig. 7 is a schematic view showing the application of the brush force detecting device of the present invention to a brush ball device.

第8圖:係刷力偵測裝置、轉運裝置及刷球裝置之另一實施例配置示意圖。Figure 8 is a schematic view showing the configuration of another embodiment of the brush force detecting device, the transfer device and the brush ball device.

第9圖:本發明刷力偵測裝置另一實施例之使用示意圖(一)。Fig. 9 is a schematic view showing the use of another embodiment of the brush force detecting device of the present invention (1).

第10圖:本發明刷力偵測裝置另一實施例之使用示意圖(二)。Fig. 10 is a schematic view showing the use of another embodiment of the brush force detecting device of the present invention (2).

第11圖:本發明刷力偵測裝置應用於刷球機之外觀圖。Figure 11: Appearance diagram of the brush force detecting device of the present invention applied to a ball brushing machine.

第12圖:本發明刷球機之前視圖。Figure 12: Front view of the ball brushing machine of the present invention.

第13圖:本發明刷球機之使用示意圖(一)。Figure 13: Schematic diagram of the use of the ball brushing machine of the present invention (1).

第14圖:本發明刷球機之使用示意圖(二)。Figure 14: Schematic diagram of the use of the ball brushing machine of the present invention (2).

第15圖:係本發明刷力偵測方法之流程圖。Figure 15 is a flow chart of the brush force detecting method of the present invention.

20‧‧‧刷力偵測裝置20‧‧‧Brush force detection device

21‧‧‧承架21‧‧‧ Shelf

211‧‧‧壓塊211‧‧‧Clamps

212‧‧‧滑座212‧‧‧ slide

22‧‧‧壓力感測器22‧‧‧ Pressure Sensor

221‧‧‧按壓件221‧‧‧Pressing parts

23‧‧‧掣動桿23‧‧‧掣动杆

231‧‧‧彈簧231‧‧‧ Spring

30‧‧‧轉運裝置30‧‧‧Transportation device

31‧‧‧載台31‧‧‧ stage

311‧‧‧輸送帶311‧‧‧ conveyor belt

32‧‧‧移動架32‧‧‧Mobile rack

321‧‧‧滑軌321‧‧‧rails

33‧‧‧驅動源33‧‧‧Drive source

Claims (9)

一種刷力偵測裝置,其係裝配於刷具刷檢錫球時而承受作用力之具受力件的受力裝置,用以感測刷具之刷力,包含:力傳機構:係設有至少一可連結受力件之作動件,用以承受受力件所傳遞之作用力;感測機構:係設有至少一感測器,用以感測作動件所輸出之待感測力;處理單元:係用以接收感測機構之感測資料,並設有可依感測資料分析刷具之實際刷力的資料模組以及調整刷具刷力之調控模組。 A brush force detecting device is a force receiving device of a force receiving member that is subjected to a force when the brush is brushed to detect the solder ball, and is used for sensing the brushing force of the brush, comprising: a force transmission mechanism: There is at least one actuating member that can be coupled to the force receiving member for receiving the force transmitted by the force receiving member; and the sensing mechanism is provided with at least one sensor for sensing the force to be sensed output by the actuating member The processing unit is configured to receive the sensing data of the sensing mechanism, and has a data module capable of analyzing the actual brushing force of the brush according to the sensing data and a regulating module for adjusting the brushing force of the brush. 依申請專利範圍第1項所述之刷力偵測裝置,其中,該受力裝置係為具載台之轉運裝置,載台可為受力件,刷力偵測裝置係裝配於轉運裝置上,並以力傳機構之作動件連結載台。 According to the brush detecting device of claim 1, wherein the force receiving device is a transfer device with a loading platform, the loading platform can be a force receiving member, and the brush force detecting device is assembled on the transfer device. And use the force transmission mechanism to connect the stage. 依申請專利範圍第2項所述之刷力偵測裝置,其中,該轉運裝置係設有可由驅動源驅動作至少一方向位移之移動架,並於移動架之上方設有可承置具錫球之電子元件的載台,刷力偵測裝置之力傳機構的作動件係為可連結承置載台之承架,承架與移動架間係設有相互配合之壓塊及感測機構的感測器,感測器用以感測承架所輸出之待感測力。 The brush detecting device according to claim 2, wherein the transfer device is provided with a movable frame that can be driven by the driving source to be displaced in at least one direction, and is provided with a tin capable of being placed above the moving frame. The carrier of the electronic component of the ball, the actuator of the force transmission mechanism of the brush force detecting device is a frame that can be coupled to the mounting platform, and the clamping block and the sensing mechanism are matched between the carrier and the moving frame. The sensor is used to sense the force to be sensed output by the rack. 依申請專利範圍第1項所述之刷力偵測裝置,其中,該受力裝置係為具刷具之刷球裝置,刷具可為受力件,刷力偵測裝置係裝配於刷球裝置上,並以力傳機構之作動件連結刷具。 The brush detecting device according to claim 1, wherein the force receiving device is a brush ball device with a brush, the brush device can be a force receiving member, and the brush force detecting device is assembled on the brush ball. The device is connected to the brush by a force transmitting mechanism. 依申請專利範圍第4項所述之刷力偵測裝置,其中,該刷球裝置係設有可由驅動源驅動作至少一方向位移之移動架,並於移動架之下方設有刷具,刷力偵測裝置之力傳機構的作動件係為可連結承置刷具之承架,承架與移動架間係設有相互配合之壓塊及感測機構的感測器,感測器用以感測承架所輸出之待感測力。 The brush detecting device according to claim 4, wherein the brush ball device is provided with a moving frame that can be driven by the driving source to be displaced in at least one direction, and a brush is disposed under the moving frame, and the brush is provided. The actuating member of the force transmitting mechanism of the force detecting device is a frame that can be coupled to the supporting brush, and the sensor is provided with a matching pressing block and a sensing mechanism between the frame and the moving frame, and the sensor is used for the sensor. Sensing the force to be sensed by the rack. 依申請專利範圍第3或5項所述之刷力偵測裝置,其中,刷力偵測裝置係於移動架與承架間設有掣壓結構,用以輔助壓 塊與感測器作初步相互貼置,另刷力偵測裝置係於承架與移動架間設有滑移結構,以輔助承架位移。 The brush detecting device according to the third or fifth aspect of the patent application, wherein the brush detecting device is provided with a rolling structure between the moving frame and the frame for assisting pressing The block and the sensor are initially placed on each other, and the other force detecting device is provided with a sliding structure between the frame and the moving frame to assist the displacement of the frame. 一種應用刷力偵測裝置之檢測設備,包含:機台;入料裝置:係用以輸入待檢具錫球之電子元件;出料裝置:係用以輸出已檢具錫球之電子元件;刷球裝置:係設有刷具,用以刷檢電子元件上之錫球;轉運裝置:係用以移載具錫球之電子元件至刷球裝置處;至少一依申請專利範圍第1項所述之刷力偵測裝置,用以檢知刷具之刷力。 A detecting device for applying a brush force detecting device comprises: a machine table; a feeding device: an electronic component for inputting a solder ball to be inspected; and a discharging device: an electronic component for outputting a solder ball of the inspected tool; Brush ball device: is provided with a brush for brushing the solder ball on the electronic component; the transfer device is for transferring the electronic component of the solder ball to the brush ball device; at least one according to the patent application scope The brush force detecting device is configured to detect the brushing force of the brush. 一種刷力偵測方法,其包含下列步驟:a.刷具執行刷檢電子元件之錫球作業;b.刷力偵測裝置之力傳機構係承受刷檢作業中所產生之作用力;c.刷力偵測裝置之感測機構係感測力傳機構所輸出之待感測力,並將感測資料傳輸至處理單元;d.處理單元係將預設時間區塊內之預設筆數感測資料作一整理,並依整理後之感測資料進行排除雜訊數值;e.處理單元係將符合設定之各筆感測資料數值與非作用力數值進行計算,而獲取各時間點之刷具刷力,並將偵測出之刷力回饋至處理單元之調控模組作一刷力調整。 A brush force detecting method comprising the following steps: a. The brush performs a solder ball operation for brushing electronic components; b. The force transmission mechanism of the brush force detecting device is subjected to the force generated in the brushing operation; c. The sensing mechanism of the brush force detecting device senses the force to be sensed output by the force transmitting mechanism, and transmits the sensing data to the processing unit; d. The processing unit sorts the preset number of sensing data in the preset time block, and excludes the noise value according to the sorted sensing data; e. The processing unit calculates the values of the sensed data and the non-force values according to the settings, and obtains the brush brush force at each time point, and feeds the detected brush force back to the control module of the processing unit. Brush force adjustment. 依申請專利範圍第8項所述之刷力偵測方法,其中,該非作用力包含摩擦力、掣動桿之預壓力或馬達反轉瞬間之力量。 The brush force detecting method according to claim 8 , wherein the non-force includes a friction force, a pre-pressure of the raking rod, or a force of a motor reversal moment.
TW101119813A 2012-06-01 2012-06-01 Brush force detection device, the application of brush force detection device detection equipment and brush force detection method TWI467152B (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200402346A (en) * 2002-06-28 2004-02-16 Esec Trading Sa Clamping element with an integrated force sensor

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200402346A (en) * 2002-06-28 2004-02-16 Esec Trading Sa Clamping element with an integrated force sensor

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