TWI467141B - Measurement device and measurement method - Google Patents

Description

Measuring device and measuring method

The present disclosure relates to an optical property measurement method, and more particularly to a method for measuring the total luminous flux of a light-emitting diode (LED) by a conductive probe card.

LED (Light emitting diode) has the characteristics of low power consumption, long life and fast response, and is known as the lighting component of the next generation. The LED industry structure is divided into upper, middle and lower reaches. After the upstream material is made into an epitaxial wafer, the midstream is responsible for integration into an LED wafer, and then the die is cut into individual LED chips, and finally the die is packaged into LEDs of various types in the downstream. Therefore, measuring the optical parameters of the LED is very important for evaluating the energy conversion efficiency of the light source.

At present, for LEDs, the methods for measuring optical parameters (such as total luminous flux) can be mainly divided into two categories, namely, integrating spheres and PV panels. As far as the integrating sphere is concerned, this method can only measure the luminous flux of the 120-degree light receiving angle due to the height limitation of the conventional probe. Another method is a solar panel type, which uses a solar panel to align and then receive light. This method is also limited by the conventional probe height limitation such that the light acceptance angle is 128 degrees.

In view of this, a new solution is needed to solve the above problems.

The disclosure provides a measuring device and a measuring method, in an array type miniature The integrating sphere is based on the infrastructure and is equipped with a transparent conductive probe card, so that the light receiving angle of the full luminous flux can reach 140 degrees or more, and the number of alignments can be reduced, thereby reducing the alignment error generated by the mechanism and improving the measuring speed.

The present disclosure provides a measuring device for measuring a plurality of light emitting devices on a wafer, including a conductive probe card, an optical receiving module, a beam splitting module, and a data processing module. The conductive probe card is placed on the at least one illuminating device of the wafer to drive at least one illuminating device, so that at least one illuminating device emits an incident light and passes through the conductive probe card; and the optical receiving module receives the conductive probe The incident light of the needle card; the beam splitting module converts the incident light into a spectral signal; and the data processing module calculates an optical parameter based on the spectral signal.

The disclosure provides a measuring method applied to a measuring device, the measuring device comprises a conductive probe card, an optical receiving module, a beam splitting module and a data processing unit, and the measuring method comprises placing a conductive probe card The at least one illuminating device drives the at least one illuminating device to emit an incident light and passes through the conductive probe card; the optical receiving module receives the illuminating device The incident light of the conductive probe card is converted into a spectral signal by the beam splitting module; and an optical parameter is calculated according to the spectral signal by the data processing module.

The apparatus and method of use of the various embodiments of the present disclosure are discussed in detail below. It should be noted, however, that many of the possible inventive concepts provided by the present disclosure can be implemented in various specific ranges. These specific embodiments are only intended to illustrate the apparatus and methods of use of the present disclosure, but are not intended to limit the scope of the disclosure.

FIG. 1 is a schematic diagram of an embodiment of a measuring device according to the present disclosure. As shown, the measuring device 100 includes a conductive probe card 101, an optical receiving module 102, a beam splitting module 103, and a data processing module 104. The measuring device 100 can be applied to the detection of optical characteristics. For example, the measurement device 100 can detect various optical parameters such as the spectrum, wavelength, total luminous flux, brightness, and chromaticity of the illumination device 105. The light emitting device 105 can be a light emitting device composed of one or more thin film materials, semiconductor materials, optical materials, organic materials or inorganic materials placed on a wafer or a substrate. In a preferred embodiment of the present disclosure, the light emitting device 105 is a light emitting diode (LED).

The conductive probe card 101 is coupled to the data processing module 104 and a voltage source (not shown) and is electrically coupled to the illumination device 105 to provide a voltage and drive the illumination device 105. In detail, the conductive probe card 101 is formed by stacking and stacking a plurality of metal microwire array units to a certain thickness; and the metal microwire array unit is coated with a single layer of unidirectionally arranged plurality of metal microwires by an insulating film. Composition. When the conductive probe card 101 is placed on the light-emitting device 105 and electrically connected, the voltage source can transmit a voltage through the metal micro-wires in the conductive probe card 101 to drive the light-emitting device 105. In addition, the data processing module 104 can control the speed and direction of movement of the conductive probe card 101 and control it to receive voltage from a voltage source.

The optical receiving module 102 is connected to the data processing module 104 for receiving incident light emitted by the light emitting device 105 after being driven by the conductive probe card 102, and is transmitted to the beam splitting module 103. The optical receiving module 102 can be a variety of light collecting devices such as an integrating sphere, an integrating sphere array, a solar panel, and the like. In this disclosure In an embodiment, the integrating sphere array is composed of a plurality of integrating spheres, and the integrating spheres in the integrating sphere array can be moved synchronously or independently. In addition, the data processing module 104 can control the moving speed and direction of the optical receiving module 102. In the embodiment of the present invention, the conductive probe card 101 is disposed between the light emitting device 105 on the wafer and the optical receiving module 102. In other words, the incident light emitted by the light-emitting device 105 after being driven passes through the conductive probe card 101 and is received by the optical receiving module 102.

The beam splitting module 103 is configured to convert incident light received by the optical receiving module 102 into a spectral signal. In the embodiment of the present disclosure, the beam splitting module is a single channel spectrometer or a multi-channel spectrometer for separating and imaging different wavelengths of light beams included in incident light at different diffraction angles. In detail, the beam splitting module 103 includes a light detecting component, a dispersing component, and a plurality of lens groups. The incident light passes through the lens group to form a collimated beam, and the dispersive element is used to separate the beams of different wavelengths contained in the collimated beam at different diffraction angles, thereby focusing the beams of the respective wavelengths through another lens group and imaging On the light detecting component, the energy intensity of the beam of each wavelength is detected to obtain a spectral signal of the incident light. In summary, the function of the beam splitting module 103 is to analyze the wavelength of the incident light to obtain a corresponding spectral signal.

The data processing module 104 can determine the wavelength distribution according to the spectral signal from the beam splitting module 103 to calculate various optical parameters such as total luminous flux, brightness and chromaticity. The data processing module 104 can be a microcomputer processor, a chipset, or a software application built into the beam splitter module 103. In addition, the data processing module 104 can control the opening or closing of the beam splitting module 103, the optical receiving module 102 and the conductive probe card 101, and optical receiving. The moving speed and direction of the module 102 and the conductive probe card 101.

Figure 2 is a schematic diagram of the optical measurement method provided by the present disclosure. The conductive probe card 201 is placed on a wafer having at least a first light emitting device 205a and a second light emitting device 205b. At this time, the conductive probe card 201 electrically contacts the first light-emitting device 205a and the second light-emitting device 205b, and illuminates the first light-emitting device 205a and the second light-emitting device 205b on the wafer 202. It should be noted that the conductive probe card 201 can be a transparent conductive probe card 201, such that the incident light emitted by the first illuminating device 205a and the second illuminating device 205b can penetrate the conductive probe card 201 and pass through the integrating sphere. The opening 207 of 206 is received by the integrating sphere 206. In addition, the conductive probe card 201 is controlled by the data processing module 104 to drive all or part of the illumination device.

It should be noted that the conductive probe card 201 used in the present disclosure can align all of the light-emitting devices at one time and illuminate all or part of the light-emitting devices. However, in a general measuring device, since the probe is used to measure the light-emitting device, the probe and the light-emitting device must be aligned before the light-emitting device is measured every time. Therefore, the measuring device of the present disclosure can reduce the number of alignments and reduce the error generated by the mechanism when the alignment is performed, thereby increasing the measurement speed.

In general, the integrating sphere 206 includes a photo meter and a baffle, and the inner surface of the integrating sphere 206 is coated with a reflective film of high scattering properties (eg, barium sulfate). When the incident light passes through the opening 207, it is scattered inside the integrating sphere 206 and then absorbed by the photodetector. Therefore, the integrating sphere can collect the incident from the light emitting module 205a or 205b. Light, and the purpose of the baffle is to block incident light directly into the light meter. In a general measuring device, since the probe is used to illuminate the light-emitting device, in order to reserve the space of the probe, the distance between the integrating sphere 206 and the light-emitting device 205 is far, and the light-receiving angle is only 120 degrees. Since the conductive probe card 201 is used in the present disclosure, there is no need to reserve space between the integrating sphere 206 and the light-emitting device 205, and the distance between the two is greatly reduced, so that the light-receiving angle is raised to 140 degrees. In an embodiment of the present disclosure, the transparent conductive probe card has a thickness of about 0.5 mm, the opening 207 has a diameter of 3.75 mm, the integrating sphere opening area accounts for 8% of the total surface area, and the integrating sphere has an inner diameter of at least 6.6 mm. The diameter is about 7.6 mm, but is not limited thereto.

Figure 3 is another embodiment of the measuring device provided by the present disclosure. The measuring device 300 includes a data processing module 304, a beam splitting module 303, an integrating sphere 306, and a conductive probe card 301. First, the data processing module 304 controls the conductive probe card 301 to perform alignment, and then places the conductive probe card 301 on the light-emitting device 305, and causes the conductive probe card 301 to illuminate the light-emitting device 305. Next, the data processing module 304 controls the integrating sphere 306 for alignment. That is, the data processing module 304 places the integrating sphere 306 directly above the light emitting device 305 and as close as possible to the light emitting device 305 to receive the incident light 307 emitted by the light emitting device 305 as much as possible. In an embodiment, the integrating sphere 306 is placed directly above the illumination device 305 and its opening contacts the conductive probe card 301. After the alignment is completed, the integrating sphere 306 collects the incident light 308, and then the splitting module 303 converts the incident light 308 collected by the integrating sphere 306 into a spectral signal, and transmits it to the data processing module 304, and finally the data processing module 304 calculates Out of optical parameters.

It is worth noting that in a typical measuring device, since the probe is used to measure the light-emitting device, the probe and the light-emitting device 305 must be aligned before the light-emitting device 305 is measured every time. Since the present disclosure uses a conductive probe card 301, once the conductive probe card 301 is aligned with the light emitting device 305 and electrically connected to the light emitting device 305, all or a portion of the light emitting device 305 can be illuminated. In other words, the embodiment of the present disclosure only needs to align the conductive probe card 301 and the light-emitting device 305 at one time, and the conductive probe card 301 and the light-emitting device 305 must be performed before measuring each of the light-emitting devices 305. Counterpoint. Therefore, the measuring device of the present disclosure can reduce the number of alignments and reduce the error generated by the mechanism when the alignment is performed, thereby increasing the measurement speed.

Figure 4 is another embodiment of the measuring device provided by the present disclosure. The measuring device 400 includes a data processing module 404, a beam splitting module 403, an integrating sphere array 416, and a conductive probe card 401. The integrating sphere array 416 is constructed by a plurality of integrating spheres 406 arranged in a one-dimensional or two-dimensional array. In one embodiment, the integrating sphere array 416 is a 4x4 array, that is, consisting of 16 integrating spheres 406. The measuring device 400 illuminates and positions the light emitting device 405, collects the incident light 408, and calculates the optical parameters as described above, and details are not described herein again. It should be noted that the beam splitting module 403 can be a multi-channel spectrometer, and simultaneously receives the incident light 408 of the plurality of integrating spheres 406, and converts into a plurality of spectral signals, and then transmits the data to the data processing module 404.

In addition, the integrating sphere array 416 is controlled by the data processing module 404 to move in a two-dimensional manner in conjunction with other mechanical devices, mechanisms, or devices to receive incident light 408 from the illumination device 405 at different locations. It should be noted that the data processing module 404 can control the movement of one integrating sphere, a plurality of integrating spheres, or all of the integrating spheres in the integrating sphere array 416. In other words, each of the integrating spheres 416 of the integrating sphere array 416 can move independently, partially synchronously, or all simultaneously.

Figure 5 is another embodiment of the measuring device provided by the present disclosure. The measuring device 500 includes a data processing module 504, a beam splitting module 503, an integrating sphere 506, and a conductive probe card 501. The method of measuring the incident light 508 and calculating the optical parameters by the measuring device 500 is as described above, and will not be described herein. It should be noted that in this embodiment, the plurality of integrating spheres 506 are integrated on the conductive probe card 501. In other words, the plurality of integrating spheres 506 and the conductive probe card 501 are moved in synchronization. In other embodiments, the metrology procedure includes two alignment steps, namely alignment of the conductive probe card 501 with the illumination device 505, and alignment of the integrating sphere 506 with the illumination device 505. However, in the present embodiment, since the integrating sphere 506 is integrated on the conductive probe card 501, the integrating sphere 506 and the conductive probe card 501 can be simultaneously aligned with the light-emitting device 505 with only one alignment. Therefore, the measuring device in the embodiment can further reduce the number of alignments, reduce the error generated by the mechanism when the alignment is performed, and thus increase the measurement speed.

Figure 6 is another embodiment of the measuring device provided by the present disclosure. The measuring device 600 includes a data processing module 604, a beam splitting module 603, an integrating sphere 606, and a conductive probe card 601. The method of the measuring device 600 collecting the incident light 608 and calculating the optical parameters is as described above, and will not be described herein. It should be noted that in this embodiment, the conductive probe card group includes a plurality of conductive probe cards 601, and an integrating sphere 606 is integrated on each of the conductive probe cards 601. Since each conductive probe card 601 is integrated onto the integrating sphere 606, respectively, each integrating sphere in the integrating sphere array 616 can move independently. Similarly, since the integrating sphere 606 is integrated over the conductive probe card 601, the integrating sphere 606 and the conductive probe card 601 can be simultaneously aligned with the illumination device 605 with only one alignment. Therefore, the measuring device in the embodiment can further reduce the number of alignments, reduce the error generated by the mechanism when the alignment is performed, and thus increase the measurement speed.

FIG. 7 is a flow chart showing the operation of the measuring device 400 provided by the present disclosure. First, in step S71, the conductive probe card 401 is placed on at least one of the light-emitting devices 405, and the light-emitting device 405 is driven to cause the light-emitting device 405 to emit an incident light 408 and pass through the conductive probe card 401. Then, in step S72, the optical receiving module receives the incident light 408 passing through the conductive probe card 401. For example, the optical receiving module is an integrating sphere 406 or an integrating sphere array 416, and the integrating sphere array 416 is composed of a plurality of integrating spheres 406. It is worth noting that the integrating sphere 406 can be further integrated over the conductive probe card 401. In step S73, the beam splitting module 403 converts the incident light 408 into a spectral signal, and the splitting module 406 is a single channel spectrometer or a multi-channel spectrometer. Finally, in step S74, the data processing module 404 calculates optical parameters based on the spectral signals. For example, optical parameters include parameters such as full luminous flux, chromaticity, and brightness. The details of the foregoing steps S71 to S74 are as described in the embodiments of FIGS. 1 to 6 and therefore will not be described again.

However, the above description is only for the preferred embodiment of the present disclosure, and the scope of the disclosure is not limited thereto, that is, the patent application is disclosed in the above disclosure. The scope of the invention and the equivalent equivalents and modifications of the invention are still within the scope of the disclosure. In addition, any of the embodiments or advantages of the present disclosure are not required to achieve all of the objects or advantages or features disclosed in the present disclosure. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the disclosure.

100, 300, 400, 500, 600‧‧‧ detection devices

101, 201, 301, 401, 501, 601‧‧‧ conductive probe card

102‧‧‧Optical Receiver Module

103, 303, 403, 503, 603‧‧ ‧ splitter modules

104, 304, 404, 504, 604‧‧‧ data processing module

105, 305, 405, 505, 605‧‧‧ illuminating devices

202‧‧‧ wafer

205a‧‧‧First illuminating device

205b‧‧‧second illuminating device

206, 306, 406, 506, 606‧ ‧ integral ball

207‧‧‧ openings

308, 408, 508, 608‧‧‧ incident light

416, 516, 616‧ ‧ integral sphere array

Figure 1 is a schematic illustration of one embodiment of the present disclosure.

Figure 2 is a schematic diagram of the optical measurement method provided by the present disclosure.

Figure 3 is a schematic illustration of another embodiment of the present disclosure.

Figure 4 is a schematic illustration of another embodiment of the present disclosure.

Figure 5 is a schematic illustration of another embodiment of the present disclosure.

Figure 6 is a schematic illustration of another embodiment of the present disclosure.

Figure 7 is a flow chart showing the operation of the measuring device provided by the present disclosure.

400‧‧‧Detection device

401‧‧‧ Conductive probe card

403‧‧‧Distribution Module

404‧‧‧Data Processing Module

405‧‧‧Lighting device

406‧‧·score ball

408‧‧‧ incident light

416‧‧Integral Ball Array

Claims (18)

A measuring device for measuring a plurality of light emitting devices on a wafer, comprising: a conductive probe card disposed on at least one light emitting device of the wafer to drive the at least one light emitting device to enable the at least one light emitting device An illuminating device emits an incident light and passes through the conductive probe card, wherein the conductive probe card comprises a plurality of metal microwire array units for electrically connecting the illuminating device, and each layer of the metal microwire array unit is An insulating film is coated with a single layer of unidirectionally arranged plurality of metal microwires; an optical receiving module for receiving the incident light passing through the conductive probe card; and a beam splitting module for converting the incident light into a spectral signal; and a data processing module to calculate an optical parameter based on the spectral signal. The measuring device of claim 1, wherein the beam splitting module is a spectrometer for separating and imaging the light beams of different wavelengths included in the incident light according to a plurality of different diffraction angles. The measuring device of claim 1, wherein the conductive probe card is a transparent conductive probe card. The measuring device of claim 1, wherein the optical parameter comprises one or a combination of full luminous flux, chromaticity or brightness. The measuring device of claim 1, wherein the optical receiving module is an integrating sphere. The measuring device of claim 1, wherein the conductive probe card is used to drive one of the first light emitting device and the second light on the wafer. The optical device includes a first integrating sphere and a second integrating sphere to respectively receive the incident light emitted by the first illuminating device and the second illuminating device and passing through the conductive probe card. The measuring device of claim 5, wherein the integrating sphere is integrated onto the conductive probe card. The measuring device of claim 6, further comprising the data processing module for controlling the first integrating sphere and the second integrating sphere, so that the first integrating sphere is synchronized with the second integrating sphere Moving to align the first illuminating device and the second illuminating device, respectively. The measuring device of claim 6, further comprising the data processing module for controlling the first integrating sphere and the second integrating sphere, such that the first integrating sphere is independent of the second integrating sphere Moving to align the first illuminating device and the second illuminating device, respectively. A measuring method is applied to a measuring device, the measuring device comprises a conductive probe card, an optical receiving module, a beam splitting module and a data processing unit, the measuring method comprises: placing the conductive probe The conductive probe card comprises a plurality of metal microwire array units for electrically connecting the light emitting device, and each layer of the metal microwire array unit is insulated by an insulating film. The at least one illuminating device drives the at least one illuminating device to emit an incident light and pass through the conductive probe card; The optical receiving module receives the incident light passing through the conductive probe card; Converting the incident light into a spectral signal by the beam splitting module; and calculating an optical parameter according to the spectral signal by the data processing unit. The measuring method according to claim 10, wherein the step of converting the incident light into a spectral signal is performed by a spectrometer according to a diffractive angle of a plurality of different wavelengths of the incident light. Separate and image. The measuring method of claim 10, wherein the step of driving the at least one illuminating device drives the at least one illuminating device by a transparent conductive probe card. The measuring method of claim 10, wherein the optical parameter comprises one or a combination of full luminous flux, chromaticity or brightness. The measuring method of claim 10, wherein the receiving the incident light comprises receiving the incident light passing through the conductive probe card by an integrating sphere of the optical receiving module. The measuring method of claim 10, wherein the conductive probe card drives one of the first light emitting device and the second light emitting device of the wafer, and the step of receiving the incident light comprises the optical One of the first integrating sphere and the second integrating sphere of the receiving module respectively measure incident light emitted by the first illuminating device and the second illuminating device and passing through the conductive probe card. The measuring method of claim 14 or 15, wherein the integrating sphere is integrated onto the conductive probe card. The measuring method of claim 15, wherein the step of receiving the incident light further comprises controlling the first by the data processing module An integrating sphere and the second integrating sphere are caused to move independently of the first integrating sphere and the second integrating sphere to respectively align the first lighting device and the second lighting device. The measuring method of claim 15, wherein the step of receiving the incident light further comprises: using the data processing module to control the first integrating sphere and the second integrating sphere, so that the first integral The ball moves in synchronization with the second integrating sphere to align the first lighting device and the second lighting device, respectively.