TWI466551B - Electronic device - Google Patents
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- TWI466551B TWI466551B TW097102871A TW97102871A TWI466551B TW I466551 B TWI466551 B TW I466551B TW 097102871 A TW097102871 A TW 097102871A TW 97102871 A TW97102871 A TW 97102871A TW I466551 B TWI466551 B TW I466551B
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- 238000005192 partition Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
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Description
本發明係關於一種電子裝置，尤其關於一種安裝有揚聲器之電子裝置。 The present invention relates to an electronic device, and more particularly to an electronic device in which a speaker is mounted.
電子裝置中，安裝有揚聲器之電子裝置較為常見，以滿足消費者對外音播放功能之要求。然習知電子裝置之揚聲器之音質效果不太理想，這因為揚聲器在安裝時，考慮到其他零部件之組裝所需之高度及尺寸要求，以及電路板之設計要求，使得電路板不能完全密封隔離揚聲器在電子裝置內部之聲音，因此揚聲器發聲時易發生漏音或破音現象，從而使得音質效果不好。 In electronic devices, electronic devices with speakers are more common to meet the requirements of the consumer's external sound playback function. However, the sound quality of the speaker of the electronic device is not ideal, because the speaker is not completely sealed and sealed because of the height and size requirements for assembly of other components and the design requirements of the circuit board. The sound of the speaker inside the electronic device, so the speaker is prone to sound leakage or broken sound when the sound is emitted, so that the sound quality is not good.
請參閱圖1，一電子裝置包括一殼體12、一揚聲器14、一墊圈16及一電路板18。該殼體12上開設有一容室122，用於容置所述揚聲器14。所述揚聲器14包括一播音面142及一與該播音面142相對之電連接面144。所述播音面142為揚聲器14朝外播放聲音之外表面。所述電連接面144為揚聲器14與電子裝置內部之電路板18形成電導通之內表面。該電連接面144上形成有二彈片146。該二彈片146在電連接面144上向上凸起，用於與電路板18抵持使揚聲器14與電路板18電導通。所述墊圈16對應所述容室122之側壁形成之框架結構，用於墊置於該容室122之側壁之頂部，以使揚聲器14於電子裝置內部之聲音密封隔離性更佳。請參閱圖2及圖3，所 述揚聲器14裝置於所述容室122之內部，所述墊圈16墊置於所述容室12之側壁頂面，所述電路板18壓抵所述墊圈16對所述容室122形成封閉。所述揚聲器14與該容室122之側壁卡合，且該揚聲器14之播音面142與容室122之底部鄰近，可以理解，該底部具有若干散音孔(未圖示)。該揚聲器14之電連接面144之二彈片146抵觸所述電路板18，以達成揚聲器14與電路板18電性導通。 Referring to FIG. 1 , an electronic device includes a housing 12 , a speaker 14 , a gasket 16 , and a circuit board 18 . A housing 122 is defined in the housing 12 for receiving the speaker 14. The speaker 14 includes a sound emitting surface 142 and an electrical connection surface 144 opposite the sound emitting surface 142. The sound emitting surface 142 is such that the speaker 14 plays the outer surface of the sound outward. The electrical connection surface 144 is an inner surface of the speaker 14 that electrically conducts with the circuit board 18 inside the electronic device. Two elastic pieces 146 are formed on the electrical connection surface 144. The two elastic pieces 146 are upwardly protruded on the electrical connection surface 144 for resisting the circuit board 18 to electrically conduct the speaker 14 and the circuit board 18. The gasket 16 corresponds to a frame structure formed by the side walls of the chamber 122, and is disposed on the top of the side wall of the chamber 122 to better provide sound insulation isolation of the speaker 14 inside the electronic device. Please refer to Figure 2 and Figure 3. The speaker 14 is disposed inside the chamber 122, and the gasket 16 is placed on the top surface of the side wall of the chamber 12. The circuit board 18 is pressed against the gasket 16 to form a closed space for the chamber 122. The speaker 14 is engaged with the side wall of the chamber 122, and the sound emitting surface 142 of the speaker 14 is adjacent to the bottom of the chamber 122. It can be understood that the bottom portion has a plurality of sound holes (not shown). The two elastic pieces 146 of the electrical connection surface 144 of the speaker 14 oppose the circuit board 18 to electrically connect the speaker 14 and the circuit board 18.
然由於電路板18之設計需要，電路板18尺寸不可太大，以避免電路板18由於中部承載或支撐之電子零部件而使電路板18週緣上翹，因而其難以充分抵觸殼體12之側壁以完全遮蔽所述容室12。裝配完成後，電子裝置之揚聲器14之容室122與電路板18間仍存在間隙124。另外，所述墊圈16也未達到對揚聲器14於電子裝置內部之聲音密封隔離之作用。如此，揚聲器14播音時，易發生漏音或破音現象。且該種結構依靠二彈片146直接抵觸電路板18以達成電導通，組裝時彈片146之抵接準確度難於把握，造成組裝不方便。當彈片146彈力較大時，易造成電路板18局部向上凸起，影響組裝也易損壞電路板。 However, due to the design requirements of the circuit board 18, the size of the circuit board 18 is not too large, so as to prevent the circuit board 18 from being upturned due to the electronic components carried or supported in the middle, so that it is difficult to fully resist the side wall of the housing 12. To completely shield the chamber 12. After the assembly is completed, there is still a gap 124 between the chamber 122 of the speaker 14 of the electronic device and the circuit board 18. In addition, the gasket 16 also does not function to provide acoustic sealing of the speaker 14 within the electronic device. Thus, when the speaker 14 broadcasts, it is prone to leakage or break. Moreover, the structure relies on the two elastic pieces 146 to directly contact the circuit board 18 to achieve electrical conduction, and the accuracy of the abutment of the elastic piece 146 during assembly is difficult to grasp, resulting in inconvenient assembly. When the elastic force of the elastic piece 146 is large, the circuit board 18 is partially raised upward, which may affect the assembly and damage the circuit board.
鑒於上述內容，有必要提供一種揚聲器組裝方便、密封效果好之電子裝置。 In view of the above, it is necessary to provide an electronic device which is easy to assemble and has a good sealing effect.
一種電子裝置，包括一殼體、一揚聲器及一電路板，所述殼體上開設有一容室，所述揚聲器容置於該容室，所述電路板部分封蓋所述容室，該電子裝置還包括一遮蓋及至少一電連接體，所述遮蓋封蓋所述容室且堆疊於所述殼體與電路板之間，所述遮蓋上開設有通孔，所述電連接體一端連接所述揚聲器，另一端穿過所述 通孔且抵觸所述電路板，所述揚聲器通過所述電連接體與所述電路板電性導通。 An electronic device includes a casing, a speaker and a circuit board, a housing is defined in the housing, the speaker is received in the housing, and the circuit board partially covers the housing, the electronic The device further includes a cover and at least one electrical connector, the cover covers the cavity and is stacked between the housing and the circuit board, the cover is provided with a through hole, and the electrical connector is connected at one end The speaker passes through the other end And a through hole that interferes with the circuit board, and the speaker is electrically connected to the circuit board through the electrical connector.
相較於習知電子裝置，本發明揚聲器安裝於殼體之容室內，且通過一遮蓋封蓋，使揚聲器形成一獨立之音箱結構，發音時產生漏音或破音等問題，音質效果好。另外，藉由所述遮蓋上開設通孔，該電連接體一端通過所述遮蓋上之通孔，該通孔使得該電連接體準確定位，所述電路板堆疊於所述遮蓋，電連接體與電路板抵接準確，組裝方便。電連接體亦可減少或消除對電路板之彈力作用，避免了電連接體造成電路板局部向上凸起之可能性，不會造成電路板損壞。 Compared with the conventional electronic device, the speaker of the present invention is installed in the housing of the housing, and the cover is formed by a cover, so that the speaker forms an independent speaker structure, and the sound is leaking or broken when the sound is pronounced, and the sound quality is good. In addition, a through hole is formed in the cover, and one end of the electrical connector passes through the through hole in the cover, the through hole allows the electrical connector to be accurately positioned, and the circuit board is stacked on the cover and the electrical connector It is accurate in connection with the circuit board and easy to assemble. The electrical connector can also reduce or eliminate the elastic force on the circuit board, and avoid the possibility that the electrical connector causes the circuit board to partially protrude upward without causing damage to the circuit board.
12‧‧‧殼體 12‧‧‧ housing
122‧‧‧容室 122‧‧ ‧ room
14‧‧‧揚聲器 14‧‧‧Speaker
142‧‧‧播音面 142‧‧‧ broadcast surface
144‧‧‧電連接面 144‧‧‧Electrical connection surface
146‧‧‧彈片 146‧‧‧Shrap
16‧‧‧墊圈 16‧‧‧Washers
18‧‧‧電路板 18‧‧‧ boards
20‧‧‧殼體 20‧‧‧shell
22‧‧‧容室 22‧‧‧ Room
222‧‧‧隔板 222‧‧ ‧ partition
224‧‧‧第一室 224‧‧‧First Room
226‧‧‧第二室 226‧‧‧ second room
2262‧‧‧底面 2262‧‧‧ bottom
2264‧‧‧週緣 2264‧‧‧ Periphery
30‧‧‧揚聲器 30‧‧‧Speakers
32‧‧‧播音面 32‧‧‧ broadcast surface
34‧‧‧電連接面 34‧‧‧Electrical connection surface
342‧‧‧彈片 342‧‧‧Shrap
40‧‧‧背膠層 40‧‧ ‧ adhesive layer
50‧‧‧電連接體 50‧‧‧Electrical connectors
52‧‧‧套設座 52‧‧‧ Sets
54‧‧‧伸縮桿 54‧‧‧ Telescopic rod
60‧‧‧遮蓋 60‧‧‧ Cover
62‧‧‧水平緣 62‧‧‧ horizontal edge
64‧‧‧凹部 64‧‧‧ recess
622‧‧‧通孔 622‧‧‧through hole
70‧‧‧電路板 70‧‧‧ boards
圖1係習知電子裝置之揚聲器裝置結構分解示意圖；圖2係習知電子裝置之揚聲器裝置結構組裝示意圖；圖3係習知之揚聲器裝置於電子裝置內部之沿圖2之III-III方向之剖示圖；圖4係本發明較佳實施例電子裝置之揚聲器裝置結構分解示意圖；圖5係本發明較佳實施例電子裝置之揚聲器裝置結構組裝示意圖；圖6係本發明較佳實施例揚聲器裝置於電子裝置內部之沿圖5之VI-VI方向之剖示圖。 1 is a schematic exploded view of a speaker device of a conventional electronic device; FIG. 2 is a schematic view showing the structure of a speaker device of a conventional electronic device; FIG. 3 is a cross-sectional view of the conventional speaker device in the direction of III-III of FIG. 4 is a schematic exploded view of a speaker device of an electronic device according to a preferred embodiment of the present invention; FIG. 5 is a schematic view showing the structure of a speaker device of the preferred embodiment of the present invention; FIG. 6 is a speaker device according to a preferred embodiment of the present invention; A cross-sectional view taken along line VI-VI of FIG. 5 inside the electronic device.
請參閱圖4及圖5，本發明較佳實施例一電子裝置(如手機等)包括一殼體20、一揚聲器30、一背膠層40、二電連接體50、一遮蓋60及一電路板70。 Referring to FIG. 4 and FIG. 5, an electronic device (such as a mobile phone, etc.) includes a housing 20, a speaker 30, a backing layer 40, two electrical connectors 50, a cover 60, and a circuit. Board 70.
所述殼體20表面一端開設有一容室22。該容室22大致呈一矩形框結構，其中央形成有一隔板222。該隔板222為弧形，且該隔板222較所述容室22之側壁低。該隔板222將該容室22分成一第一室224及一第二室226。該第一室224用於設置電子零部件於其內。所述第二室226用於容置所述揚聲器30於其內。該第二室226具有一底面2262及週緣2264。所述底面2262上形成有若干散音孔(未圖示)。所述週緣2264形成於該第二室226之側壁上且鄰近該底面2262。該底面2262與週緣2264使第二室226之底部呈大致喇叭狀結構。 A chamber 22 is defined at one end of the surface of the housing 20. The chamber 22 has a substantially rectangular frame structure with a partition 222 formed in the center thereof. The partition 222 is curved and the partition 222 is lower than the side walls of the chamber 22. The partition 222 divides the chamber 22 into a first chamber 224 and a second chamber 226. The first chamber 224 is used to set an electronic component therein. The second chamber 226 is for receiving the speaker 30 therein. The second chamber 226 has a bottom surface 2262 and a peripheral edge 2264. A plurality of sound holes (not shown) are formed on the bottom surface 2262. The circumference 2264 is formed on a sidewall of the second chamber 226 adjacent to the bottom surface 2262. The bottom surface 2262 and the peripheral edge 2264 have a substantially flared structure at the bottom of the second chamber 226.
所述揚聲器30為一獨立之元件結構，且厚度較所述第二室226之深度小。該揚聲器30包括一播音面32及一與所述播音面32相對之電連接面34。該播音面32與所述第二室226之底部相對應，其用於與所述第二室226之底部配合。所述電連接面34上設置有二彈片342，且該二彈片342大致水平彎折。 The speaker 30 is a separate component structure and has a smaller thickness than the second chamber 226. The speaker 30 includes a sound emitting surface 32 and an electrical connection surface 34 opposite the sound emitting surface 32. The sound emitting surface 32 corresponds to the bottom of the second chamber 226 for mating with the bottom of the second chamber 226. Two elastic pieces 342 are disposed on the electrical connection surface 34, and the two elastic pieces 342 are substantially horizontally bent.
所述背膠層40之形狀對應所述容室22之外框形狀，其用於黏接所述遮蓋60至所述容室22之開口端，使遮蓋60密封所述容室22之開口端。 The shape of the adhesive layer 40 corresponds to the outer frame shape of the chamber 22, and is used for bonding the cover 60 to the open end of the chamber 22, so that the cover 60 seals the open end of the chamber 22. .
所述電連接體50在本實施例中為市面上較常見之彈簧針(Po Go Pin)，其包括一套設座52及一伸縮桿54。所述套設座52大致為圓柱狀，其直徑較所述伸縮桿54大。所述伸縮桿54為一圓柱體，其一端裝置於所述套設座52內，另一端伸出該套設座52且可相對該套設座52自由伸縮，且向上伸出之彈力較小。 In this embodiment, the electrical connector 50 is a more common Po Go Pin on the market, and includes a set of a seat 52 and a telescopic rod 54. The sleeve 52 is substantially cylindrical and has a larger diameter than the telescopic rod 54. The telescopic rod 54 is a cylinder, and one end of the telescopic rod 54 is disposed in the sleeve 52, and the other end protrudes from the sleeve 52 and is freely expandable and contractable relative to the sleeve 52. .
所述遮蓋60為一凹形面板，其由一平板經衝壓後，形成有水平緣62及凹部64。該水平緣62之一側開設有二通孔622。該二通孔622 為圓孔，其直徑較電連接體50之套設座52直徑小，較伸縮桿54之直徑大。所述凹部64用於抵持所述揚聲器30之電連接面34。 The cover 60 is a concave panel which is stamped and formed with a horizontal edge 62 and a recess 64. Two through holes 622 are formed on one side of the horizontal edge 62. The two through holes 622 The circular hole has a smaller diameter than the sleeve 52 of the electrical connector 50 and is larger than the diameter of the telescopic rod 54. The recess 64 is for resisting the electrical connection surface 34 of the speaker 30.
所述電路板70為一大致矩形板，該電路板70用於與揚聲器30電性導通。 The circuit board 70 is a substantially rectangular board for electrically conducting with the speaker 30.
請參閱圖6，組裝該電子裝置之揚聲器30時，先將所述二電連接體50分別電連接(如焊接)至所述揚聲器30之二彈片342上，使得該二電連接體50之套設座52與相對應之彈片342相固接。 Referring to FIG. 6 , when the speaker 30 of the electronic device is assembled, the two electrical connectors 50 are electrically connected (eg, soldered) to the two elastic pieces 342 of the speaker 30 respectively, so that the two electrical connectors 50 are sleeved. The seat 52 is fixed to the corresponding elastic piece 342.
然後將揚聲器30安裝於所述第二室226內，使揚聲器30之播音面32與第二室226之底面2262配合，且揚聲器30之側壁與該第二室226之週緣2264配合，該揚聲器30之電連接面34與所述隔板222之頂面大致平齊。 The speaker 30 is then mounted in the second chamber 226 such that the broadcast surface 32 of the speaker 30 mates with the bottom surface 2262 of the second chamber 226, and the side walls of the speaker 30 cooperate with the periphery 2264 of the second chamber 226, the speaker 30 The electrical connection surface 34 is substantially flush with the top surface of the spacer 222.
再通過所述背膠層40將所述遮蓋60粘接至所述容室22之外框，以使該遮蓋60對容室22整體形成封閉。該遮蓋60之凹部64之底面抵至所述揚聲器30之電連接面34及所述隔板222之頂面。所述二電連接體50之伸縮桿54穿過所述遮蓋60之通孔622。 The cover 60 is bonded to the outer frame of the chamber 22 by the adhesive layer 40, so that the cover 60 is integrally closed to the chamber 22. The bottom surface of the recess 64 of the cover 60 abuts against the electrical connection surface 34 of the speaker 30 and the top surface of the partition 222. The telescopic rod 54 of the two electrical connectors 50 passes through the through hole 622 of the cover 60.
然後安裝所述電路板70，使所述電路板70固接至所述殼體20。且所述電連接體50之二伸縮桿54抵持所述電路板70，使該揚聲器30與電路板70電性導通。 The circuit board 70 is then mounted to secure the circuit board 70 to the housing 20. The two telescopic rods 54 of the electrical connector 50 abut against the circuit board 70 to electrically connect the speaker 30 and the circuit board 70.
所述電子裝置之揚聲器30組裝完成後，所述揚聲器30裝置於所述容室22之內部，所述遮蓋60封蓋所述容室22，所述電路板70壓抵所述遮蓋60。所述揚聲器30與該容室22之側壁及週緣2264配合，且該揚聲器30之播音面32鄰近容室22之底部。所述二電連接體50之套設座52之底部固接所述揚聲器30之二彈片342且伸縮桿54與 該二彈片342電導通，由於該二套設座52之直徑大於所述通孔622之直徑，在電連接面34上之二彈片342作用下，套設座52抵持所述遮蓋60。所述二伸縮桿54抵觸所述電路板70，達成揚聲器30與電路板70電性導通。 After the speaker 30 of the electronic device is assembled, the speaker 30 is disposed inside the chamber 22, the cover 60 covers the chamber 22, and the circuit board 70 is pressed against the cover 60. The speaker 30 cooperates with the side wall and the peripheral edge 2264 of the chamber 22, and the sound emitting surface 32 of the speaker 30 is adjacent to the bottom of the chamber 22. The bottom of the sleeve 52 of the two electrical connectors 50 is fixed to the two elastic pieces 342 of the speaker 30 and the telescopic rod 54 and The two elastic pieces 342 are electrically connected. Since the diameter of the two sleeves 52 is larger than the diameter of the through hole 622, the sleeve 52 abuts the cover 60 under the action of the two elastic pieces 342 on the electrical connection surface 34. The two telescopic rods 54 are in contact with the circuit board 70, so that the speaker 30 and the circuit board 70 are electrically connected.
本發電子裝置較佳實施例之揚聲器30安裝於殼體20之容室22內，通過遮蓋60封蓋，使揚聲器30形成一獨立之音箱結構。揚聲器30發音時不會產生漏音或破音等問題，音質效果好。 The speaker 30 of the preferred embodiment of the present invention is mounted in the housing 22 of the housing 20, and the cover 30 is covered by the cover 60 to form the speaker 30 into a separate speaker structure. When the speaker 30 is pronounced, there is no problem such as leakage or breakage, and the sound quality is good.
另外，所述遮蓋60上開設通孔622，該電連接體50具有伸縮桿54之一端通過所述遮蓋60上之通孔622，該通孔622使得該電連接體50相對電路板70能準確定位，所述電路板70堆疊於所述遮蓋60上方，電連接體50與電路板70抵接準確，且組裝方便。由於揚聲器30之彈片342之彈力可通過所述遮蓋60抵持，可減少對電路板70之彈力作用，避免了揚聲器30之彈片342之彈力過大造成電路板70局部向上凸起之可能性，不會造成電路板70損壞，該種結構組裝方便。 In addition, a through hole 622 is defined in the cover 60. The electrical connector 50 has one end of the telescopic rod 54 passing through the through hole 622 of the cover 60. The through hole 622 makes the electrical connector 50 accurate with respect to the circuit board 70. The circuit board 70 is stacked above the cover 60, and the electrical connector 50 is accurately abutted with the circuit board 70, and is easy to assemble. Since the elastic force of the elastic piece 342 of the speaker 30 can be resisted by the cover 60, the elastic force on the circuit board 70 can be reduced, and the elastic force of the elastic piece 342 of the speaker 30 is prevented from being excessively raised, which may cause the circuit board 70 to partially protrude upward. This can cause damage to the circuit board 70, which is easy to assemble.
可以理解，所述揚聲器30之每一彈片342與所述每一電連接體50可做成一整體固接於該揚聲器30之電連接面34上。 It can be understood that each of the elastic pieces 342 of the speaker 30 and the electrical connector 50 can be integrally fixed to the electrical connection surface 34 of the speaker 30.
可以理解，所述揚聲器30可省略彈片342，直接將所述電連接體50之底部之套設座52焊接至揚聲器30上。 It can be understood that the speaker 30 can omit the elastic piece 342 and directly solder the sleeve 52 of the bottom of the electrical connector 50 to the speaker 30.
可以理解，所述電連接體50可先設置於所述遮蓋60上，遮蓋60封閉揚聲器容室22時，該電連接體50一端抵持電路板70，一端抵持揚聲器30之電連接面34。 It can be understood that the electrical connector 50 can be disposed on the cover 60. When the cover 60 closes the speaker chamber 22, one end of the electrical connector 50 abuts the circuit board 70, and one end abuts the electrical connection surface 34 of the speaker 30. .
可以理解，所述遮蓋60之可為一平板結構，即無所述凹部64。 It can be understood that the cover 60 can be a flat structure, that is, without the recess 64.
20‧‧‧殼體 20‧‧‧shell
22‧‧‧容室 22‧‧‧ Room
222‧‧‧隔板 222‧‧ ‧ partition
224‧‧‧第一室 224‧‧‧First Room
226‧‧‧第二室 226‧‧‧ second room
2262‧‧‧底面 2262‧‧‧ bottom
2264‧‧‧週緣 2264‧‧‧ Periphery
30‧‧‧揚聲器 30‧‧‧Speakers
32‧‧‧播音面 32‧‧‧ broadcast surface
34‧‧‧電連接面 34‧‧‧Electrical connection surface
342‧‧‧彈片 342‧‧‧Shrap
40‧‧‧背膠層 40‧‧ ‧ adhesive layer
50‧‧‧電連接體 50‧‧‧Electrical connectors
52‧‧‧套設座 52‧‧‧ Sets
54‧‧‧伸縮桿 54‧‧‧ Telescopic rod
60‧‧‧遮蓋 60‧‧‧ Cover
62‧‧‧水平緣 62‧‧‧ horizontal edge
64‧‧‧凹部 64‧‧‧ recess
622‧‧‧通孔 622‧‧‧through hole
70‧‧‧電路板 70‧‧‧ boards
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097102871A TWI466551B (en) | 2008-01-25 | 2008-01-25 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097102871A TWI466551B (en) | 2008-01-25 | 2008-01-25 | Electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200934275A TW200934275A (en) | 2009-08-01 |
| TWI466551B true TWI466551B (en) | 2014-12-21 |
Family
ID=44866215
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097102871A TWI466551B (en) | 2008-01-25 | 2008-01-25 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI466551B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6477356B1 (en) * | 1998-11-11 | 2002-11-05 | Matsushita Electric Industrial Co., Ltd. | Sounding-body holding device |
| US20040202343A1 (en) * | 2003-04-11 | 2004-10-14 | Rye Ryan P. | Speakerphone accessory assembly |
| US20050094842A1 (en) * | 2003-10-30 | 2005-05-05 | Kazuo Hashiba | Speaker device and method for manufacturing the same |
| TWM283372U (en) * | 2005-07-22 | 2005-12-11 | Advanced Connectek Inc | Spring connector |
| US7069061B2 (en) * | 2003-07-18 | 2006-06-27 | Sony Ericsson Mobile Communications Ab | Speaker assemblies and mobile terminals including the same |
| US20060251281A1 (en) * | 2005-04-26 | 2006-11-09 | Samsung Electro-Mechanics Co., Ltd. | Actuator module of wireless communication terminals |
-
2008
- 2008-01-25 TW TW097102871A patent/TWI466551B/en not_active IP Right Cessation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6477356B1 (en) * | 1998-11-11 | 2002-11-05 | Matsushita Electric Industrial Co., Ltd. | Sounding-body holding device |
| US20040202343A1 (en) * | 2003-04-11 | 2004-10-14 | Rye Ryan P. | Speakerphone accessory assembly |
| US7069061B2 (en) * | 2003-07-18 | 2006-06-27 | Sony Ericsson Mobile Communications Ab | Speaker assemblies and mobile terminals including the same |
| US20060194618A1 (en) * | 2003-07-18 | 2006-08-31 | Sony Ericsson Mobile Communications Ab | Speaker assemblies and mobile terminals including the same |
| US20050094842A1 (en) * | 2003-10-30 | 2005-05-05 | Kazuo Hashiba | Speaker device and method for manufacturing the same |
| US20060251281A1 (en) * | 2005-04-26 | 2006-11-09 | Samsung Electro-Mechanics Co., Ltd. | Actuator module of wireless communication terminals |
| TWM283372U (en) * | 2005-07-22 | 2005-12-11 | Advanced Connectek Inc | Spring connector |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200934275A (en) | 2009-08-01 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |