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TWI466442B - Interdigitated coupling resonator - Google Patents

Interdigitated coupling resonator Download PDF

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Publication number
TWI466442B
TWI466442B TW100145070A TW100145070A TWI466442B TW I466442 B TWI466442 B TW I466442B TW 100145070 A TW100145070 A TW 100145070A TW 100145070 A TW100145070 A TW 100145070A TW I466442 B TWI466442 B TW I466442B
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Taiwan
Prior art keywords
resonant
coupling
beams
electrode
interdigitated
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TW100145070A
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Chinese (zh)
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TW201325081A (en
Inventor
Tsun Che Huang
Feng Chia Hsu
Pin Chang
Chin Hung Wang
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Ind Tech Res Inst
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Priority to TW100145070A priority Critical patent/TWI466442B/en
Priority to US13/412,641 priority patent/US8803403B2/en
Publication of TW201325081A publication Critical patent/TW201325081A/en
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Publication of TWI466442B publication Critical patent/TWI466442B/en

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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H9/2447Beam resonators
    • H03H9/2463Clamped-clamped beam resonators
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02244Details of microelectro-mechanical resonators
    • H03H9/02259Driving or detection means
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02244Details of microelectro-mechanical resonators
    • H03H2009/02283Vibrating means
    • H03H2009/02291Beams
    • H03H2009/02299Comb-like, i.e. the beam comprising a plurality of fingers or protrusions along its length
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/24Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive
    • H03H9/2405Constructional features of resonators of material which is not piezoelectric, electrostrictive, or magnetostrictive of microelectro-mechanical resonators
    • H03H2009/241Bulk-mode MEMS resonators

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Description

指叉型耦合共振器Interdigitated coupling resonator

本發明是有關於一種指叉型耦合共振器,且特別是一種增加電容之可傳感面積,有效地降低阻抗值並增進輸出效能之指叉型耦合共振器。The present invention relates to an interdigitated coupling resonator, and more particularly to an interdigitated coupling resonator that increases the sensible area of a capacitor, effectively reduces the impedance value, and improves output efficiency.

隨著科技的進步,微機電振盪器已具有逐漸取代現有振盪器的潛力。一般而言,微機電振盪器通常區分為低頻與高頻的應用,其中低頻的應用主要是取代傳統石英振盪器,而高頻的部分則是用以取代表面聲波(Surface Acoustic Wave,SAW)濾波器與薄膜體聲波諧振器(FILM BULK ACOUSTIC RESONATORS,FBAR)。With advances in technology, MEMS oscillators have the potential to gradually replace existing oscillators. In general, MEMS oscillators are usually distinguished between low frequency and high frequency applications. The low frequency application is mainly to replace the traditional quartz oscillator, while the high frequency part is used to replace the surface acoustic wave (SAW) filter. And film bulk acoustic resonator (FILM BULK ACOUSTIC RESONATORS, FBAR).

惟就目前的微機電振盪器而言,其除了元件的品質因子(Q-factor,簡稱Q值)外,阻抗(impedance)亦為影響其輸出的重要指標之一。舉例來說,在低頻的應用領域而言,若元件的阻抗太高,亦即代表其需要提高放大器的增益值(gain),因而造成放大器的電流增加,而產生較高的耗電量。另外,於高頻的應用領域而言,在現有的通訊系統中,元件的阻抗越高將造成元件的反射係數趨近於1,亦即其穿透損耗(insertion loss)太高,而不適於通訊系統使用。據此,如何就目前微機電振盪器所面臨之問題而加以改進,便值得相關人員予以進一步思考的。However, in the current MEMS oscillator, in addition to the component quality factor (Q-factor, referred to as Q value), impedance is also one of the important indicators affecting its output. For example, in the field of low frequency applications, if the impedance of the component is too high, that is, it needs to increase the gain of the amplifier, thereby causing the current of the amplifier to increase, resulting in higher power consumption. In addition, in the field of high frequency applications, in the existing communication system, the higher the impedance of the component, the closer the reflection coefficient of the component is to 1, that is, the insertion loss is too high, and is not suitable. Communication system use. Accordingly, how to improve the current problems faced by micro-electromechanical oscillators is worthy of further consideration.

本發明之目的係利用多個共振樑與至少一耦合樑連接,使增加電容感應面積,達到具低阻抗目的。The purpose of the invention is to use a plurality of resonant beams to be connected with at least one coupling beam, so as to increase the capacitive sensing area and achieve the purpose of low impedance.

本發明之又一目的係可以解決既有微機電共振器阻抗過大的問題。Still another object of the present invention is to solve the problem of excessive impedance of existing microelectromechanical resonators.

本發明之再一目的係當外在靜電力訊號頻率的1/2波長為該共振結構之寬度時,會引發該共振結構寬度方向的共振。A further object of the present invention is to cause resonance in the width direction of the resonant structure when the 1/2 wavelength of the external electrostatic force signal frequency is the width of the resonant structure.

為達到上述目的之指叉型耦合共振器包括:一共振結構,包括一或多數個共振樑以及一耦合樑,一或多數個共振樑係分別對稱地連接於該耦合樑之相對兩側;一或多數個輸入電極與一或多數個輸出電極,該輸入電極與該輸出電極係交互地配置於該一或多數個共振樑間,該輸入電極與該輸出電極和該共振樑彼此間平行地配置;一基材;及一支撐結構,係設置在基材上,該耦合樑之兩端係連接在該支撐結構上,使支撐該共振結構於該基材上方。The interdigitated coupling resonator for achieving the above object comprises: a resonant structure comprising one or more resonant beams and a coupling beam, wherein one or more resonant beam systems are symmetrically connected to opposite sides of the coupling beam; Or a plurality of input electrodes and one or more output electrodes, the input electrodes and the output electrode are alternately disposed between the one or more resonant beams, the input electrodes and the output electrodes and the resonant beams are arranged in parallel with each other a substrate; and a support structure disposed on the substrate, the two ends of the coupling beam being coupled to the support structure to support the resonant structure above the substrate.

較佳地,該指叉型耦合共振器為一體波模態(bulk mode)振盪器。Preferably, the interdigital coupled resonator is an integral wave mode oscillator.

較佳地,該輸入電極包括位於該耦合樑兩側分開之第一構件與第二構件,該第一構件與該第二構件間以導電結構連接,而該輸出電極包括位於該耦合樑兩側分開之第三構件與第四構件,該第三構件與該第四構件間以導電結構連接。Preferably, the input electrode comprises a first member and a second member separated on both sides of the coupling beam, the first member and the second member are connected by a conductive structure, and the output electrode comprises two sides of the coupling beam The third member and the fourth member are separated, and the third member and the fourth member are connected by a conductive structure.

本創作更包括有一第一軸向與一第二軸向,該第一軸向與該第二軸向係相互垂直,而該輸入電極與該輸出電極與該共振樑沿該第一軸向延伸,而沿該第二軸向交互地排列,其中該第一軸向、該第二軸向、該輸入電極、該輸出電極、該共振樑及該耦合樑位於同一平面上。其中該輸入電極與該輸出電極分別連接至一積體電路(ASIC),使該輸入電極與該輸出電極驅動該共振樑沿該第二軸向振動。The present invention further includes a first axial direction and a second axial direction, the first axial direction and the second axial direction being perpendicular to each other, and the input electrode and the output electrode and the resonant beam extending along the first axial direction And alternately arranged along the second axis, wherein the first axis, the second axis, the input electrode, the output electrode, the resonant beam and the coupling beam are on the same plane. The input electrode and the output electrode are respectively connected to an integrated circuit (ASIC), so that the input electrode and the output electrode drive the resonant beam to vibrate in the second axial direction.

較佳地,該耦合樑位於該兩共振樑間的長度等於該共振樑在共振狀態時之共振波長的二分之一;其中該共振樑之寬度W=(2n+1)×λ/2,其中n為0,1,2,3,4…,而該耦合樑位於該兩共振樑間的長度A1=(m+1)×λ/4,其中m為0,1,2,3,4...,且λ為共振樑在共振狀態時的共振波長。或該耦合樑位於該兩共振樑間的長度等於該共振樑的寬度。Preferably, the length of the coupling beam between the two resonant beams is equal to one-half of the resonant wavelength of the resonant beam in the resonant state; wherein the width of the resonant beam is W=(2n+1)×λ/2, Where n is 0, 1, 2, 3, 4... and the length of the coupling beam between the two resonant beams is A1 = (m + 1) × λ / 4, where m is 0, 1, 2, 3, 4 ..., and λ is the resonant wavelength of the resonant beam in the resonant state. Or the length of the coupling beam between the two resonant beams is equal to the width of the resonant beam.

較佳地,該支撐結構包括有一第一支撐構件與一第二支撐構件,該第一支撐構件包括有一第一支撐元件與一第一固定座,該第一支撐元件係設置在該第一固定座上,使該耦合樑之一端設置在該第一支撐元件上;及該第二支撐構件包括有一第二支撐元件與一第二固定座,該第二支撐元件係設置在該第二固定座上,使該耦合樑之另一端設置在該第二支撐元件上。其中該第一固定座包括二個第一固定座分別設置於該第一支撐元件之兩端,使該第一支撐元件懸空跨接,以及該第二固定座包括二個第二固定座分別設置於該第二支撐元件之兩端,使該第二支撐元件懸空跨接。Preferably, the support structure includes a first support member and a second support member, the first support member includes a first support member and a first mount, and the first support member is disposed at the first fix One end of the coupling beam is disposed on the first supporting member; and the second supporting member includes a second supporting member and a second fixing seat, wherein the second supporting member is disposed on the second fixing seat The other end of the coupling beam is disposed on the second support member. The first fixing base includes two first fixing seats respectively disposed at two ends of the first supporting component, so that the first supporting component is suspended and the second fixing seat includes two second fixing seats respectively The second support member is suspended across the two ends of the second support member.

較佳地,另一實施方式係該第一支撐元件與該第二支撐元件均各自分別具有延伸出之二懸臂,該二懸臂係分別各自連接於一第一彈性支撐件與一第二彈性支撐件,而使該第一彈性支撐件與該第二彈性支撐件分別連接該耦合樑,使該第一彈性支撐件與該第二彈性支撐件支撐該耦合樑而可振動。Preferably, in another embodiment, the first supporting element and the second supporting element respectively have two extending cantilevers respectively, and the two cantilever arms are respectively connected to a first elastic supporting member and a second elastic supporting body respectively. And connecting the first elastic support member and the second elastic support member to the coupling beam, respectively, so that the first elastic support member and the second elastic support member support the coupling beam to vibrate.

較佳地,該輸入電極或該輸出電極位於該耦合樑之同一側且極性相同一端側彼此連接而形成一叉狀結構,使該輸入電極提供訊號輸入或該輸出電極提供訊號輸出。Preferably, the input electrode or the output electrode is located on the same side of the coupling beam and the same polarity end is connected to each other to form a fork structure, so that the input electrode provides a signal input or the output electrode provides a signal output.

較佳地,該輸入電極為一體成型地配置在該耦合樑下方,而該輸入電極於該耦合樑下方的位置設置有一凹槽供該輸入電極配置在內,以及該輸出電極為一體成型地配置在該耦合樑下方,而該輸出電極於該耦合樑下方的位置設置有一凹槽供該輸出電極配置在內。Preferably, the input electrode is integrally formed under the coupling beam, and the input electrode is disposed at a position below the coupling beam with a groove for the input electrode, and the output electrode is integrally formed. Below the coupling beam, a position of the output electrode below the coupling beam is provided with a recess for the output electrode to be disposed.

本發明之再一實施例之指叉型耦合共振器包括:一共振結構,包括多個共振樑以及一耦合樑,多個共振樑係分別對稱地連接於該耦合樑之相對兩側;一或多數個電極設置於該共振樑的相鄰側且藉一或多個電容間隙彼此分開;一基材;及一支撐結構,係設置在基材上,該耦合樑之兩端係連接在該支撐結構上,使支撐該共振結構於該基材上方。A fork-type coupling resonator according to still another embodiment of the present invention includes: a resonant structure including a plurality of resonant beams and a coupling beam, wherein the plurality of resonant beam beams are symmetrically connected to opposite sides of the coupling beam; a plurality of electrodes are disposed on adjacent sides of the resonant beam and separated from each other by one or more capacitive gaps; a substrate; and a supporting structure disposed on the substrate, the two ends of the coupling beam being coupled to the support Structurally, the resonant structure is supported above the substrate.

較佳地,該共振樑寬度=(2×n+1)×λ/2,其中n為0,1,2,3,4...,且λ為共振樑在共振狀態時的共振波長。Preferably, the resonant beam width = (2 × n + 1) × λ / 2, where n is 0, 1, 2, 3, 4, ..., and λ is the resonant wavelength of the resonant beam in the resonant state.

較佳地,該共振樑與該耦合樑位於同一平面上,且該共振樑與該耦合樑係彼此垂直配置。Preferably, the resonant beam and the coupling beam are in the same plane, and the resonant beam and the coupling beam are arranged perpendicular to each other.

較佳地,該耦合樑位於該兩共振樑間的長度=(n+1)×λ/4,其中n為0,1,2,3,4...,且λ為共振樑在共振狀態時的共振波長。Preferably, the length of the coupling beam between the two resonant beams is = (n+1) × λ / 4, where n is 0, 1, 2, 3, 4, ..., and λ is the resonant beam in the resonance state Resonance wavelength at the time.

本發明之又一實施例之指叉型耦合共振器包括:一第一共振結構,包括:多個共振樑以及一耦合樑,多個共振樑係分別對稱地連接於該耦合樑之相對兩側;一或多數個電極設置於該共振樑的相鄰側且藉一或多個電容間隙彼此分開;一第二共振結構,包括:多個共振樑以及一耦合樑,多個共振樑係分別對稱地連接於該耦合樑之相對兩側;一或多數個電極設置於該共振樑的相鄰側且藉一或多個電容間隙彼此分開;一基材;一支撐結構,係設置在基材上,該耦合樑之兩端係連接在該支撐結構上,使支撐該第一與第二共振結構於該基材上方。According to still another embodiment of the present invention, the interdigitated coupling resonator includes: a first resonant structure including: a plurality of resonant beams and a coupling beam, the plurality of resonant beam systems being symmetrically coupled to opposite sides of the coupling beam One or more electrodes are disposed on adjacent sides of the resonant beam and separated from each other by one or more capacitive gaps; a second resonant structure includes: a plurality of resonant beams and a coupling beam, and the plurality of resonant beam systems are respectively symmetric Connected to opposite sides of the coupling beam; one or more electrodes are disposed on adjacent sides of the resonant beam and separated from each other by one or more capacitive gaps; a substrate; a supporting structure is disposed on the substrate The two ends of the coupling beam are connected to the support structure to support the first and second resonant structures above the substrate.

較佳地,該共振樑寬度=(2×n+1)×λ/2,其中n為0,1,2,3,4...,且λ為共振樑在共振狀態時的共振波長。Preferably, the resonant beam width = (2 × n + 1) × λ / 2, where n is 0, 1, 2, 3, 4, ..., and λ is the resonant wavelength of the resonant beam in the resonant state.

較佳地,該耦合樑位於該兩共振樑間的長度=(n+1)×λ/4,其中n為0,1,2,3,4...,且λ為共振樑在共振狀態時的共振波長。Preferably, the length of the coupling beam between the two resonant beams is = (n+1) × λ / 4, where n is 0, 1, 2, 3, 4, ..., and λ is the resonant beam in the resonance state Resonance wavelength at the time.

較佳地,該第一共振結構與該第二共振結構係並聯且該耦合樑係連接。Preferably, the first resonant structure is connected in parallel with the second resonant structure and the coupling beam is connected.

較佳地,該第一共振結構與該第二共振結構係分離。Preferably, the first resonant structure is separated from the second resonant structure.

基於上述,在本發明的上述實施例中,由至少兩個共振樑與連接其中的耦合樑所構成的共振結構,並於共振樑之間配設多個電極,以驅動上述結構振動,且其中耦合樑的長度為共振波長的二方之一。據此,以上述構件所形成的指叉型耦合共振器得以增加其電容傳感面積而降低其運作時的阻抗,進而增進指叉型耦合共振器的輸出效能。Based on the above, in the above embodiment of the present invention, a resonant structure composed of at least two resonant beams and a coupling beam connected thereto, and a plurality of electrodes are disposed between the resonant beams to drive the structural vibration, and wherein The length of the coupling beam is one of the two sides of the resonant wavelength. Accordingly, the interdigital coupling resonator formed by the above components can increase the capacitance sensing area thereof and reduce the impedance during operation, thereby improving the output performance of the interdigital coupled resonator.

為讓本發明之上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。The above described features and advantages of the present invention will be more apparent from the following description.

本發明以下各實施例的各元件如為相同但長度或尺寸不同,相同元件仍皆以相同編號標記。對於相同結構部分,為節省篇幅,不予贅述。The elements of the following embodiments of the invention are identical but different in length or size, and the same elements are still labeled with the same reference numerals. For the same structural part, in order to save space, we will not repeat them.

對於長度的計算或尺寸或波長如與本發明相接近,皆為本發明的精神所包括。The calculation of the length or the size or wavelength as close to the present invention are included in the spirit of the present invention.

圖1是依照本發明一實施例的一種指叉型耦合共振器的俯視圖。請參考圖1,在本實施例中,指叉型耦合共振器10為一體波模態(bulk mode)振盪器,其包括一共振結構100、至少一輸入電極110A與至少一輸出電極110B及一支撐結構160,該共振結構100包括多個共振樑120、130以及一耦合樑140。多個共振樑120、130係分別對稱地連接於該耦合樑140之相對兩側。該共振樑120、130與該耦合樑140位於同一平面上,且該共振樑120、130與該耦合樑140係彼此垂直配置。該共振樑120、130與該耦合樑140可一體成型。該輸入電極110A與該輸出電極110B交互地配置於該多個共振樑120、130間,但不接觸,如圖所示。亦即一或多數個電極設置於該共振樑120、130的相鄰側且藉一或多個電容間隙彼此分開。1 is a top plan view of an interdigitated coupling resonator in accordance with an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the interdigital coupled resonator 10 is an integrated bulk mode oscillator including a resonant structure 100 , at least one input electrode 110A and at least one output electrode 110B and one The support structure 160 includes a plurality of resonant beams 120, 130 and a coupling beam 140. The plurality of resonant beams 120, 130 are symmetrically coupled to opposite sides of the coupling beam 140, respectively. The resonant beams 120 and 130 are located on the same plane as the coupling beam 140, and the resonant beams 120 and 130 and the coupling beam 140 are disposed perpendicular to each other. The resonant beam 120, 130 and the coupling beam 140 can be integrally formed. The input electrode 110A and the output electrode 110B are alternately disposed between the plurality of resonant beams 120 and 130, but are not in contact as shown. That is, one or more electrodes are disposed on adjacent sides of the resonant beams 120, 130 and separated from one another by one or more capacitive gaps.

為方便說明,本發明以輸入電極和輸出電極區分其位置關係,且輸入電極與輸出電極可為相同材料。為使配置於該耦合樑140不同側的輸入電極110A電氣連接,每一輸入電極110A係包括位於該耦合樑140兩側分開之第一構件B1與第二構件B2,該第一構件B1與該第二構件B2間以導電結構111連接。而為使配置於該耦合樑140不同側的輸出電極110B電氣連接,每一輸出電極110B係包括位於該耦合樑140兩側分開之第三構件C1與第四構件C2,該第三構件C1與該第四構件C2間以導電結構111連接。該輸入電極110A與該輸出電極110B和該共振樑120、130彼此間平行地配置,且該輸入電極110A與該輸出電極110B與該共振樑120、130均沿一第一軸向L1延伸,而沿一第二軸向L2交互地排列。For convenience of description, the present invention distinguishes the positional relationship between the input electrode and the output electrode, and the input electrode and the output electrode may be the same material. In order to electrically connect the input electrodes 110A disposed on different sides of the coupling beam 140, each input electrode 110A includes a first member B1 and a second member B2 separated on both sides of the coupling beam 140, and the first member B1 and the The second members B2 are connected by a conductive structure 111. In order to electrically connect the output electrodes 110B disposed on different sides of the coupling beam 140, each of the output electrodes 110B includes a third member C1 and a fourth member C2 separated on both sides of the coupling beam 140, and the third member C1 and The fourth members C2 are connected by a conductive structure 111. The input electrode 110A and the output electrode 110B and the resonant beam 120, 130 are arranged in parallel with each other, and the input electrode 110A and the output electrode 110B and the resonant beam 120, 130 both extend along a first axial direction L1. Arranged alternately along a second axis L2.

在一實施例中,該第一軸向L1垂直該第二軸向L2並與該輸入電極110A、該輸出電極110B、該共振樑120、130位於同一平面上。據此,該輸入電極110A與該輸出電極110B分別連接至特殊應用積體電路(Application Specific Integrated Circuit,ASIC),以使該輸入電極110A與該輸出電極110B得以驅動與感測該共振樑120、130沿該第二軸向L2振動。In an embodiment, the first axial direction L1 is perpendicular to the second axial direction L2 and is located on the same plane as the input electrode 110A, the output electrode 110B, and the resonant beam 120, 130. Accordingly, the input electrode 110A and the output electrode 110B are respectively connected to an Application Specific Integrated Circuit (ASIC), so that the input electrode 110A and the output electrode 110B can drive and sense the resonant beam 120, The 130 vibrates along the second axis L2.

在一實施例中,該輸入電極110A可為輸入電極,該輸出電極110B可為輸出電極。或另一實施例中,該輸入電極110A可為輸出電極,該輸出電極110B可為輸入電極。其中該至少一輸入電極110A包括多個輸入電極之實施例,該至少一輸出電極110B包括多個輸出電極之實施例。In an embodiment, the input electrode 110A can be an input electrode, and the output electrode 110B can be an output electrode. In another embodiment, the input electrode 110A can be an output electrode, and the output electrode 110B can be an input electrode. The embodiment in which the at least one input electrode 110A includes a plurality of input electrodes, and the at least one output electrode 110B includes a plurality of output electrodes.

在本發明之一實施例中,該輸入電極110A具有一第一端111A與一第二端112A,該輸入電極110A之第一端111A或第二端112A可為電源輸入端,而該輸出電極110B具有一第一端111B與一第二端112B,該輸出電極110B之第一端111B或第二端112B可為電源輸出端。反之亦可由該輸出電極110B為輸入電極,該輸入電極110A為輸出電極。該輸入電極與輸出電極的輸入訊號由ASIC供應。In one embodiment of the present invention, the input electrode 110A has a first end 111A and a second end 112A. The first end 111A or the second end 112A of the input electrode 110A can be a power input end, and the output electrode 110B has a first end 111B and a second end 112B, and the first end 111B or the second end 112B of the output electrode 110B can be a power output. Conversely, the output electrode 110B may be an input electrode, and the input electrode 110A may be an output electrode. The input signals of the input and output electrodes are supplied by the ASIC.

再者,多個共振樑120、130平行配置地連接於該耦合樑之兩側,其中該共振樑120、130的寬度W=(2n+1)×λ/2,其中n為0,1,2,3,4...。另,該耦合樑140位於該兩共振樑120、130間的長度A1=(m+1)×λ/4,其中m為0,1,2,3,4...。當m=1且n=0時,亦即耦合樑寬度為λ/2,共振樑寬度也為λ/2,如此將會使本發明的指叉型耦合共振器10具有較佳的激發模態與輸出功率。Furthermore, a plurality of resonant beams 120, 130 are connected in parallel to both sides of the coupling beam, wherein the width of the resonant beam 120, 130 is W = (2n + 1) × λ / 2, where n is 0, 1, 2,3,4... In addition, the coupling beam 140 is located between the two resonant beams 120, 130 with a length A1=(m+1)×λ/4, where m is 0, 1, 2, 3, 4.... When m=1 and n=0, that is, the coupling beam width is λ/2, and the resonant beam width is also λ/2, so that the interdigital coupling resonator 10 of the present invention has a better excitation mode. With output power.

換句話說,此時,該耦合樑140位於該兩共振樑120、130間的長度A1等於共振樑120、130在共振狀態時,其共振波長的二分之一。在一較佳實施例中,該耦合樑140位於該兩共振樑120、130間的長度A1,共振樑120、130的寬度W,其中該長度A1等於寬度W。惟本發明結構並不限定於,該耦合樑140位於該兩共振樑120、130間的長度A1等於共振樑120的寬度W。其它實施例方式亦包括在本發明之精神範圍內。In other words, at this time, the length A1 of the coupling beam 140 between the two resonant beams 120, 130 is equal to one-half of the resonant wavelength of the resonant beams 120, 130 in the resonant state. In a preferred embodiment, the coupling beam 140 is located at a length A1 between the two resonant beams 120, 130 and a width W of the resonant beam 120, 130, wherein the length A1 is equal to the width W. However, the structure of the present invention is not limited to the length A1 of the coupling beam 140 between the two resonant beams 120, 130 being equal to the width W of the resonant beam 120. Other embodiments are also included within the spirit of the invention.

由上所述,本發明之一實施例係將平行排列的相鄰兩兩共振樑120、130和耦合樑140連接,兩兩共振樑120、130間交互地設置該輸入電極110A與該輸出電極110B,而形成在該第一軸向L1可延伸而沿該第二軸向L2振動之體波模態的共振結構100。該指叉型耦合共振器10除向該第一軸向L1延伸之共振樑120、130可增加電容可傳感面積外,也可以該耦合樑140並接多個共振樑120、130,進而使該共振結構100能在二維空間中拓展其電容可傳感面積,故而有效地降低該指叉型耦合共振器10的阻抗值並增進其輸出效能。As described above, an embodiment of the present invention connects adjacent two pairs of resonant beams 120 and 130 and the coupling beam 140 arranged in parallel, and the input electrodes 110A and the output electrodes are alternately disposed between the two resonant beams 120 and 130. 110B, forming a resonant structure 100 of a bulk wave mode in which the first axial direction L1 can be extended and vibrated along the second axial direction L2. The interdigital coupling resonator 10 can increase the capacitance sensible area except the resonant beams 120 and 130 extending to the first axial direction L1, and the coupling beam 140 can be connected to the plurality of resonant beams 120 and 130, thereby The resonant structure 100 can expand its capacitive sensing area in a two-dimensional space, thereby effectively reducing the impedance value of the interdigital coupled resonator 10 and improving its output efficiency.

請再參考圖1,在一實施例中,該共振結構100整體形狀近似柵欄結構,而每二共振樑120、130形近似雙十結構。該輸入電極110A與該輸出電極110B被該耦合樑140分隔在該耦合樑140之相對兩側上,亦即在該共振樑120、130與該耦合樑140所形成類似柵欄結構的空隙處交互地配置該輸入電極110A與該輸出電極110B。換句話說,在柵欄結構的共振樑120、130間的空隙處可依序配置該輸入電極110A、輸出電極110B、輸入電極110A、輸出電極110B、輸入電極110A等等之排列配置。在一實施例中,該輸入電極110A可為輸入電極,而該輸出電極110B可為輸出電極,因此如前所述,即以輸入電極、輸出電極、輸入電極、輸出電極、輸入電極...等交互地配置在柵欄結構間,即該多個共振樑間。而該輸入電極110A與該輸出電極110B與該共振樑120、130相互平行地並列配置。該輸入電極110A被耦合樑140分隔為該第一構件B1與該第二構件B2,而該輸出電極110B被耦合樑140分隔為該第三構件C1與該第四構件C2,藉由該第一構件B1與該第二構件B2,同時驅動共振樑120振盪,該第三構件C1與該第四構件C2感測共振樑120振盪。Referring again to FIG. 1, in an embodiment, the resonant structure 100 has an overall shape that approximates a fence structure, and each of the two resonant beams 120, 130 is approximately a double-decimal structure. The input electrode 110A and the output electrode 110B are separated by the coupling beam 140 on opposite sides of the coupling beam 140, that is, at the gap between the resonant beam 120, 130 and the coupling beam 140 forming a fence structure. The input electrode 110A and the output electrode 110B are disposed. In other words, the arrangement of the input electrode 110A, the output electrode 110B, the input electrode 110A, the output electrode 110B, the input electrode 110A, and the like may be sequentially arranged at the gap between the resonant beams 120, 130 of the barrier structure. In an embodiment, the input electrode 110A can be an input electrode, and the output electrode 110B can be an output electrode, so as described above, that is, an input electrode, an output electrode, an input electrode, an output electrode, an input electrode... The interaction is alternately arranged between the fence structures, that is, between the plurality of resonant beams. The input electrode 110A and the output electrode 110B and the resonant beams 120 and 130 are arranged in parallel with each other in parallel. The input electrode 110A is divided by the coupling beam 140 into the first member B1 and the second member B2, and the output electrode 110B is divided by the coupling beam 140 into the third member C1 and the fourth member C2, by the first The member B1 and the second member B2 simultaneously drive the resonant beam 120 to oscillate, and the third member C1 and the fourth member C2 sense the resonant beam 120 to oscillate.

在一實施例中,本發明藉由該多晶矽導電結構111跨越該耦合樑140分別將該輸入電極110A之第一構件B1與第二構件B2電性連接,以及藉該另一例如金屬導線之導電結構111將該輸出電極110B之第三構件C1與第四構件C2電性連接,使位在該共振樑120、130的同一側的輸入電極111A與112A具有相同的驅動電位或輸出電極111B與112B具有相同的驅動電位,其中該導電結構111可為一多晶矽導線或金屬導線等等。In one embodiment, the present invention electrically connects the first member B1 of the input electrode 110A and the second member B2 across the coupling beam 140 by the polysilicon conductive structure 111, and conducts electricity by the other metal wire, for example. The structure 111 electrically connects the third member C1 of the output electrode 110B and the fourth member C2 such that the input electrodes 111A and 112A located on the same side of the resonant beams 120 and 130 have the same driving potential or output electrodes 111B and 112B. The same driving potential is used, wherein the conductive structure 111 can be a polysilicon wire or a metal wire or the like.

另一方面,該指叉型耦合共振器10還包括一基材150(矽基材)與設置在基材150上的一支撐結構160。該耦合樑140之兩端係連接在該支撐結構160上,以讓該支撐結構160將該共振樑120、130與該耦合樑140支撐在該基材150上方。在一實施例中,該支撐結構160的配置位置位在該耦合樑140上。該支撐結構160包括有一第一支撐構件161與一第二支撐構件162。該第一支撐構件161包括有一第一支撐元件1611與一第一固定座1612,該第一支撐元件1611係設置在該第一固定座1612上,因此該耦合樑140之一端即可設置在該第一支撐元件1611上。而該第二支撐構件162包括有一第二支撐元件1621與一第二固定座1622,該第二支撐元件1621係設置在該第二固定座1622上,因此該耦合樑140之另一端即可設置在該第二支撐元件1621上。On the other hand, the interdigitated coupling resonator 10 further includes a substrate 150 (tantalum substrate) and a support structure 160 disposed on the substrate 150. Both ends of the coupling beam 140 are coupled to the support structure 160 such that the support structure 160 supports the resonant beam 120, 130 and the coupling beam 140 above the substrate 150. In an embodiment, the support structure 160 is disposed on the coupling beam 140. The support structure 160 includes a first support member 161 and a second support member 162. The first supporting member 161 includes a first supporting member 1611 and a first fixing seat 1612. The first supporting member 1611 is disposed on the first fixing seat 1612. Therefore, one end of the coupling beam 140 can be disposed on the first supporting member 1612. On the first support element 1611. The second support member 162 includes a second support member 1621 and a second mount 1622. The second support member 1621 is disposed on the second mount 1622. Therefore, the other end of the coupling beam 140 can be disposed. On the second support element 1621.

在一實施例中,該第一固定座1612係為二個,分別設置於該第一支撐元件1611之兩端,使該第一支撐元件1611懸空跨接。而該第二固定座1622係為二個,分別設置於該第二支撐元件1621之兩端,使該第二支撐元件1621懸空跨接。In one embodiment, the first fixing base 1612 is two and disposed at two ends of the first supporting component 1611 to suspend the first supporting component 1611. The second fixing base 1622 is two and disposed at two ends of the second supporting member 1621, so that the second supporting member 1621 is suspended.

在另一實施例中,該第一固定座1612與該第二固定座1622係為一個,且該第一支撐元件1611與該第二支撐元件1621分別各自具有延伸出之二懸臂,該二懸臂係分別各自連接該第一彈性支撐件與該第二彈性支撐件,而使該第一彈性支撐件與該第二彈性支撐件分別連接該耦合樑140,使該第一彈性支撐件與該第二彈性支撐件支撐該耦合樑140而可振動。此實施例方式如第5圖所示。In another embodiment, the first fixing base 1612 and the second fixing base 1622 are one, and the first supporting element 1611 and the second supporting element 1621 respectively have two extending cantilevers, the two cantilever Separating the first elastic support member and the second elastic support member respectively, and connecting the first elastic support member and the second elastic support member to the coupling beam 140 respectively, so that the first elastic support member and the first elastic support member The two elastic supports support the coupling beam 140 to vibrate. This embodiment mode is as shown in Fig. 5.

惟本發明並未限定共振樑120、130之兩兩相鄰面有相同電性相位,亦即不限定本發明中輸入電極110A與輸出電極110B的配置結構。However, the present invention does not limit the two adjacent surfaces of the resonant beams 120 and 130 to have the same electrical phase, that is, the configuration of the input electrode 110A and the output electrode 110B in the present invention is not limited.

圖2是本發明另一實施例的一種指叉型耦合共振器的俯視圖。請參考圖2,與上述實施例不同的是,位在該耦合樑140之同一側且極性相同的輸入電極110A或輸出電極110B的一端側可在同一平面上彼此連接而形成一叉狀結構F1或F2,進而使本實施例的電極110A與110B在共振樑170間配置形成兩個彼此相對的叉狀結構F1、F2。2 is a top plan view of an interdigitated coupling resonator according to another embodiment of the present invention. Referring to FIG. 2, different from the above embodiment, one end side of the input electrode 110A or the output electrode 110B having the same polarity on the same side of the coupling beam 140 may be connected to each other on the same plane to form a fork structure F1. Or F2, and further, the electrodes 110A and 110B of the present embodiment are disposed between the resonant beams 170 to form two fork-shaped structures F1 and F2 opposed to each other.

再者,本發明亦未限定共振樑170與耦合樑140的數目,如圖2所繪示,設計者可依其使用需求而沿第二軸向L2進行多個共振樑170與耦合樑140的並聯結構。Furthermore, the present invention also does not limit the number of the resonant beam 170 and the coupling beam 140. As shown in FIG. 2, the designer can perform the plurality of resonant beams 170 and the coupling beam 140 along the second axial direction L2 according to the use requirements of the designer. Parallel structure.

請參考圖3是本發明指叉型耦合共振器之第三實施例的俯視圖,本實施例的結構與前述實施例的結構相似,差異在於:本實施例的共振樑120、130的長度不同與前述實施例不同。在本實施例中,該共振樑120、130的寬度W=(2n+1)×λ/2,其中n為0,1,2,3,4...。另,該耦合樑140位於該兩共振樑120、130間的長度A1=(m+1)×λ/4,其中m為0,1,2,3,4...。當m=1且n=1時,該耦合樑140位於兩共振樑120、130間的長度為λ/2,而該共振樑120、130寬度為3λ/2,該共振樑120、130的寬度變寬。該耦合樑140位於該兩共振樑120、130間的長度為λ/2,且λ為共振樑120、130在共振狀態時的共振波長。本發明結構並不限定於該共振樑120、130的寬度W等於共振頻率之半波長。3 is a plan view of a third embodiment of the interdigitated coupling resonator of the present invention. The structure of the embodiment is similar to that of the previous embodiment, and the difference is that the lengths of the resonant beams 120 and 130 of the present embodiment are different. The foregoing embodiments are different. In the present embodiment, the width of the resonant beam 120, 130 is W = (2n + 1) × λ/2, where n is 0, 1, 2, 3, 4.... In addition, the coupling beam 140 is located between the two resonant beams 120, 130 with a length A1=(m+1)×λ/4, where m is 0, 1, 2, 3, 4.... When m=1 and n=1, the length of the coupling beam 140 between the two resonant beams 120, 130 is λ/2, and the width of the resonant beam 120, 130 is 3λ/2, the width of the resonant beam 120, 130 Widening. The length of the coupling beam 140 between the two resonant beams 120, 130 is λ/2, and λ is the resonant wavelength of the resonant beams 120, 130 in the resonant state. The structure of the present invention is not limited to the width W of the resonant beams 120, 130 being equal to half the wavelength of the resonant frequency.

其中位在該耦合樑140之同一側且極性相同的輸入電極110A或輸出電極110B的一端側可在同一平面上彼此連接而形成一叉狀結構F1或F2,進而使本實施例的電極110A與110B在共振樑120、130配置形成兩個彼此相對叉狀結構F1、F2。One end side of the input electrode 110A or the output electrode 110B having the same polarity on the same side of the coupling beam 140 may be connected to each other on the same plane to form a fork structure F1 or F2, thereby further the electrode 110A of the present embodiment. 110B is disposed in the resonant beams 120, 130 to form two mutually opposite fork structures F1, F2.

請參考圖4是本發明指叉型耦合共振器之第四實施例的俯視圖,本實施例的結構與前述實施例的結構相似,差異在於:本實施例的共振樑120、130的長度不同與前述實施例不同。在本實施例中,該共振樑120、130的寬度W=(2n+1)×λ/2,其中n為0,1,2,3,4...。另,該耦合樑140位於該兩共振樑120、130間的長度A1=(m+1)×λ/4,其中m為0,1,2,3,4...。當m=0且n=0時,該耦合樑140位於兩共振樑120、130間的長度為λ/4,該耦合樑140位於兩共振樑120、130間的長度變窄,而該共振樑120、130寬度為λ/2。亦即該共振樑120、130的寬度W=λ/2,且λ為共振樑120、130在共振狀態時的共振波長。其中位在該耦合樑140之同一側且極性相同的輸入電極110A或輸出電極110B的一端側可在同一平面上彼此連接而形成一叉狀結構F1或F2,進而使本實施例的電極110A與110B在共振樑120、130配置形成兩個彼此相對的叉狀結構F1、F2。4 is a plan view of a fourth embodiment of the interdigitated coupling resonator of the present invention. The structure of the embodiment is similar to that of the previous embodiment, and the difference is that the lengths of the resonant beams 120 and 130 of the present embodiment are different. The foregoing embodiments are different. In the present embodiment, the width of the resonant beam 120, 130 is W = (2n + 1) × λ/2, where n is 0, 1, 2, 3, 4.... In addition, the coupling beam 140 is located between the two resonant beams 120, 130 with a length A1=(m+1)×λ/4, where m is 0, 1, 2, 3, 4.... When m=0 and n=0, the length of the coupling beam 140 between the two resonant beams 120, 130 is λ/4, and the length of the coupling beam 140 between the two resonant beams 120, 130 is narrowed, and the resonant beam is The width of 120, 130 is λ/2. That is, the width of the resonant beams 120, 130 is W = λ/2, and λ is the resonant wavelength of the resonant beams 120, 130 in the resonant state. One end side of the input electrode 110A or the output electrode 110B having the same polarity on the same side of the coupling beam 140 may be connected to each other on the same plane to form a fork structure F1 or F2, thereby further the electrode 110A of the present embodiment. 110B is disposed on the resonant beams 120, 130 to form two forked structures F1, F2 that face each other.

圖5是本發明指叉型耦合共振器之第五實施例的示意圖。圖6是圖5的指叉型耦合共振器的局部俯視圖。請同時參考圖5與圖6,在本實施例中,指叉型耦合共振器200包括一基材210、一共振結構211包括多個共振樑220與一耦合樑230、多個輸入電極240A、多個輸出電極240B與一對支撐結構250。該支撐結構250配置在基材210上。該支撐結構250包括有一第一支撐構件251與一第二支撐構件252。該第一支撐構件251包括有一第一支撐元件2511與一第一固定座2512,該第一支撐元件2511係設置在該第一固定座2512上,因此該耦合樑230之一端即可設置在該第一支撐元件2511上。而該第二支撐構件252包括有一第二支撐元件2521與一第二固定座2522,該第二支撐元件2521係設置在該第二固定座2522上,因此該耦合樑140之另一端即可設置在該第二支撐元件2521上。在一實施例中,該第一支撐元件2511與該第二支撐元件2521均各自分別具有延伸出之二懸臂2513、2523,該二懸臂2513、2523係分別各自連接於一第一彈性支撐件2514與一第二彈性支撐件2524,而使該第一彈性支撐件2514與該第二彈性支撐件2524分別連接該耦合樑230之兩端,使該第一彈性支撐件2514與該第二彈性支撐件2524支撐該耦合樑230而可振動。Figure 5 is a schematic view showing a fifth embodiment of the interdigitated coupling resonator of the present invention. Fig. 6 is a partial plan view of the interdigitated coupling resonator of Fig. 5; Referring to FIG. 5 and FIG. 6 simultaneously, in the embodiment, the interdigital coupling resonator 200 includes a substrate 210, a resonant structure 211 includes a plurality of resonant beams 220 and a coupling beam 230, and a plurality of input electrodes 240A. A plurality of output electrodes 240B and a pair of support structures 250. The support structure 250 is disposed on the substrate 210. The support structure 250 includes a first support member 251 and a second support member 252. The first supporting member 251 includes a first supporting member 2511 and a first fixing seat 2512. The first supporting member 2511 is disposed on the first fixing seat 2512. Therefore, one end of the coupling beam 230 can be disposed at the first supporting member 2511. On the first support element 2511. The second supporting member 252 includes a second supporting member 2521 and a second fixing member 2522. The second supporting member 2521 is disposed on the second fixing seat 2522, so that the other end of the coupling beam 140 can be disposed. On the second support element 2521. In one embodiment, the first supporting member 2511 and the second supporting member 2521 each have two extending cantilevers 2513, 2523, respectively, and the two cantilevers 2513, 2523 are respectively connected to a first elastic supporting member 2514. And the second elastic support member 2524, the first elastic support member 2514 and the second elastic support member 2524 are respectively connected to the two ends of the coupling beam 230, so that the first elastic support member 2514 and the second elastic support The member 2524 supports the coupling beam 230 to vibrate.

多個共振樑220係分別對稱地連接於該耦合樑230之相對兩側。該共振樑220與該耦合樑230位於同一平面上,且該共振樑220與該耦合樑230係彼此垂直配置。該共振樑220與該耦合樑230可一體成型。其中多個共振樑220分別對稱地連接於該耦合樑230之相對兩側而形成一柵狀結構,且該支撐結構250連接在該耦合樑230的相對兩端,以讓該支撐結構250將該共振樑220與該耦合樑230支撐在該基材210的上方。該輸入電極240A與該輸出電極240B係分別交互地配置在該共振結構211之柵狀結構的空隙處以與該共振樑220形成交互配置,其中該輸入電極240A、該輸出電極240B與該共振樑220相互平行,亦即該共振樑220與輸入電極240A、輸出電極240B沿第一軸向L1延伸,而沿第二軸向L2進行排列。值得注意的是,該輸入電極240A、輸出電極240B是沿第一軸向L1跨越該耦合樑230上方或下方,以讓同一共振樑220能受到輸入電極240A驅動,並藉由輸出電極240B感測。此外,本實施例的電極亦可如同圖2的實施例一樣,將位在該耦合樑230同一側且具有相同極性的輸入電極240A或輸出電極240B加以連接而於同一平面形成叉狀結構,在此便不再予以贅述。A plurality of resonant beams 220 are symmetrically coupled to opposite sides of the coupling beam 230, respectively. The resonant beam 220 and the coupling beam 230 are located on the same plane, and the resonant beam 220 and the coupling beam 230 are perpendicular to each other. The resonant beam 220 and the coupling beam 230 can be integrally formed. The plurality of resonant beams 220 are symmetrically connected to opposite sides of the coupling beam 230 to form a grid structure, and the supporting structure 250 is coupled to opposite ends of the coupling beam 230 to allow the supporting structure 250 to The resonant beam 220 and the coupling beam 230 are supported above the substrate 210. The input electrode 240A and the output electrode 240B are alternately disposed at a gap of the grid structure of the resonant structure 211 to form an interaction with the resonant beam 220. The input electrode 240A, the output electrode 240B and the resonant beam 220 are alternately disposed. Parallel to each other, that is, the resonant beam 220 and the input electrode 240A and the output electrode 240B extend in the first axial direction L1 and are arranged along the second axial direction L2. It should be noted that the input electrode 240A and the output electrode 240B are above or below the coupling beam 230 along the first axial direction L1, so that the same resonant beam 220 can be driven by the input electrode 240A and sensed by the output electrode 240B. . In addition, as in the embodiment of FIG. 2, the electrodes of the present embodiment can also be connected to the input electrode 240A or the output electrode 240B having the same polarity on the same side of the coupling beam 230 to form a fork-like structure on the same plane. This will not be repeated.

如圖6所示,該輸入電極240A或該輸出電極240B均可為一體成型地配置在該耦合樑230下方,而該輸入電極240A或該輸出電極240B均於該耦合樑230下方的位置設置有一凹槽241、242供該輸入電極240A或該輸出電極240B配置在內。As shown in FIG. 6 , the input electrode 240A or the output electrode 240B may be integrally formed under the coupling beam 230 , and the input electrode 240A or the output electrode 240B is disposed at a position below the coupling beam 230 . The grooves 241, 242 are provided for the input electrode 240A or the output electrode 240B.

本實施例可如圖2所示之結構,不同處在於:一、該耦合樑230設置於該輸入電極240A或該輸出電極240B之凹槽241、242內。二、支撐結構251、252的設計。This embodiment can be configured as shown in FIG. 2, and the difference is that the coupling beam 230 is disposed in the grooves 241 and 242 of the input electrode 240A or the output electrode 240B. Second, the design of the support structure 251, 252.

請參考圖7是本發明指叉型耦合共振器之第六實施例的一種具雙頻輸出功能的指叉型耦合共振器的俯視圖,本發明係將兩個指叉型耦合共振器10A、10B並聯,分別輸出共振頻率,並將共振頻率訊號輸至該ASIC晶片。例如該輸入電極110A與該輸入電極110C共同電氣連接至該ASIC晶片,而該輸出電極110B與該輸出電極110D共同電氣連接至該ASIC晶片。該ASIC晶片提供一訊號至該輸入電極110A、110C,該輸入電極110A、110C即驅動該共振樑120A、120B、130A、130B震盪,而該輸出電極110B、110D感測該共振樑120A、120B、130A、130B之震盪頻率,而將該共振頻率輸出至該ASIC晶片。Please refer to FIG. 7 which is a plan view of a finger-type coupling resonator with a dual-frequency output function according to a sixth embodiment of the interdigital coupling resonator of the present invention. The present invention is a two-fork type coupling resonator 10A, 10B. Parallel, respectively output the resonant frequency and output the resonant frequency signal to the ASIC chip. For example, the input electrode 110A and the input electrode 110C are electrically connected to the ASIC chip, and the output electrode 110B and the output electrode 110D are electrically connected to the ASIC chip. The ASIC chip provides a signal to the input electrodes 110A, 110C. The input electrodes 110A, 110C drive the resonant beams 120A, 120B, 130A, 130B to oscillate, and the output electrodes 110B, 110D sense the resonant beams 120A, 120B, The oscillation frequency of 130A, 130B is output to the ASIC wafer.

本實施例之該指叉型耦合共振器10A、10B之結構可如前所述之實施例結構,但並不以該些實施例為限,凡符本發明精神範圍之實施例均為本發明所保護之範圍。The structure of the interdigitated coupling resonators 10A, 10B of the present embodiment can be constructed as described above, but is not limited to the embodiments, and all embodiments that are within the spirit of the present invention are the present invention. The scope of protection.

該指叉型耦合共振器10A、10B分別包括有一第一與第二共振結構100A、100B,該第一與第二共振結構100A、100B包括一耦合樑140將該第一與第二共振結構100A、100B連接。該第一與第二共振結構100A、100B分別包含一或多數個共振樑120A、120B、130A、130B,該第一共振結構100A、第二共振結構100B可如圖2、圖3或圖4之實施例形式,因此不予重複贅述相同結構。The interdigital coupling resonators 10A, 10B respectively include a first and second resonant structures 100A, 100B, the first and second resonant structures 100A, 100B including a coupling beam 140 for the first and second resonant structures 100A , 100B connection. The first and second resonant structures 100A, 100B respectively include one or more resonant beams 120A, 120B, 130A, 130B, and the first resonant structure 100A and the second resonant structure 100B can be as shown in FIG. 2, FIG. 3 or FIG. The embodiment forms, and therefore the same structure will not be repeated.

該共振樑120A、130A之寬度為W1,而該共振樑120B、130B之寬度為W2,依據前面所述的共振樑120A、130A之寬度W=(2n+1)×λ/2,其中n為0,1,2,3,4...,以及該耦合樑140位於該兩共振樑120A、130A間的長度A1=(m+1)×λ/4,其中m為0,1,2,3,4...,該第一共振結構100A的共振頻率為f1 。該共振樑120B、130B之寬度W2=(2n’+1)×λ’/2,其中n’為0,1,2,3,4…。該耦合樑140位於兩共振樑120B、130B間的長度A2=(m’+1)×λ’/4,其中m’為0,1,2,3,4...,該共振結構100B的共振頻率為f2The width of the resonant beam 120A, 130A is W1, and the width of the resonant beam 120B, 130B is W2, according to the width of the resonant beam 120A, 130A described above W = (2n + 1) × λ / 2, where n is 0, 1, 2, 3, 4, ..., and the length of the coupling beam 140 between the two resonant beams 120A, 130A is A1 = (m + 1) × λ / 4, where m is 0, 1, 2, 3, 4..., the resonant frequency of the first resonant structure 100A is f 1 . The width of the resonant beam 120B, 130B is W2 = (2n' + 1) × λ'/2, where n' is 0, 1, 2, 3, 4.... The coupling beam 140 is located between the two resonant beams 120B, 130B with a length A2=(m'+1)×λ'/4, where m' is 0, 1, 2, 3, 4..., the resonant structure 100B The resonance frequency is f 2 .

如此,當W1不等於W2該第一與第二共振結構100A、100B,可輸出兩種頻率f1 與f2 ,其中共振樑120A、130A之寬度為共振樑共振頻率f1 的半波長,共振樑120B、130B之寬度為共振樑共振頻率f2 的半波長。Thus, when W1 is not equal to W2, the first and second resonant structures 100A, 100B, two frequencies f 1 and f 2 can be output, wherein the widths of the resonant beams 120A, 130A are half wavelengths of the resonant beam resonant frequency f 1 , resonance The width of the beams 120B, 130B is a half wavelength of the resonant beam resonance frequency f 2 .

請參閱圖8是本發明指叉型耦合共振器之第七實施例的一種具選頻輸出功能的指叉型耦合共振器的俯視圖,本發明係將兩個指叉型耦合共振器10A、10B分開設置,分別輸出共振頻率,並將共振頻率訊號輸至該ASIC晶片。例如該輸入電極110A與該輸入電極110C共同電氣連接至該ASIC晶片,而該輸出電極110B與該輸出電極110D共同電氣連接至該ASIC晶片。8 is a top plan view of a finger-type coupling resonator with a frequency selective output function according to a seventh embodiment of the interdigitated coupling resonator of the present invention. The present invention is a two-fork type coupling resonator 10A, 10B. Separate settings, respectively output the resonant frequency, and the resonant frequency signal is sent to the ASIC chip. For example, the input electrode 110A and the input electrode 110C are electrically connected to the ASIC chip, and the output electrode 110B and the output electrode 110D are electrically connected to the ASIC chip.

該ASIC晶片提供一訊號至該輸入電極110A、110C,該輸入電極110A、110C即驅動該共振樑120A、120B、130A、130B震盪,而該輸出電極110B、110D感測該共振樑120A、120B、130A、130B之震盪頻率,而將該共振頻率輸出至該ASIC晶片。其中該第一與第二共振結構100A、100B利用一選擇功能電路20分別連接該共振結構100A、100B。ASIC晶片輸入一訊號至選擇功能電路20而可選擇性的驅動該第一共振結構100A或該第二共振結構100B,藉此可達到輸出訊號有選擇頻率之功能。The ASIC chip provides a signal to the input electrodes 110A, 110C. The input electrodes 110A, 110C drive the resonant beams 120A, 120B, 130A, 130B to oscillate, and the output electrodes 110B, 110D sense the resonant beams 120A, 120B, The oscillation frequency of 130A, 130B is output to the ASIC wafer. The first and second resonant structures 100A, 100B are respectively connected to the resonant structures 100A, 100B by a selection function circuit 20. The ASIC chip inputs a signal to the selection function circuit 20 to selectively drive the first resonant structure 100A or the second resonant structure 100B, thereby achieving the function of selecting a frequency of the output signal.

本實施例之該指叉型耦合共振器10A、10B之結構可如前所述之實施例結構,但並不以該些實施例為限,凡符本發明精神範圍之實施例均為本發明所保護之範圍。The structure of the interdigitated coupling resonators 10A, 10B of the present embodiment can be constructed as described above, but is not limited to the embodiments, and all embodiments that are within the spirit of the present invention are the present invention. The scope of protection.

該第一與第二共振結構100A、100B分別包含一或多數個共振樑120A、120B、130A、130B,該第一共振結構100A、第二共振結構100B可如圖2、圖3或圖4之實施例形式,因此不予重複贅述相同結構。該共振樑120A、130A之寬度為W1,而該共振樑120B、130B之寬度為W2,依據前面所述的共振樑120A、130A之寬度W=(2n+1)×λ/2,其中n為0,1,2,3,4...,以及該耦合樑140位於該兩共振樑120、130間的長度A1=(m+1)×λ/4,其中m為0,1,2,3,4...,該第一共振結構100A的共振頻率為f1 。120B、130B之寬度W2=(2n’+1)×λ’/2,其中n’為0,1,2,3,4…。該耦合樑140位於兩共振樑120B、130B間的長度A2=(m’+1)×λ’/4,其中m’為0,1,2,3,4...,該共振結構100B的共振頻率為f2 。因此,藉由該選擇功能電路20可選擇性地驅動該第一共振結構100A或該第二共振結構100B,藉此可達到輸出訊號有選擇頻率之功能。The first and second resonant structures 100A, 100B respectively include one or more resonant beams 120A, 120B, 130A, 130B, and the first resonant structure 100A and the second resonant structure 100B can be as shown in FIG. 2, FIG. 3 or FIG. The embodiment forms, and therefore the same structure will not be repeated. The width of the resonant beam 120A, 130A is W1, and the width of the resonant beam 120B, 130B is W2, according to the width of the resonant beam 120A, 130A described above W = (2n + 1) × λ / 2, where n is 0,1,2,3,4..., and the length of the coupling beam 140 between the two resonant beams 120, 130 is A1=(m+1)×λ/4, where m is 0, 1, 2, 3, 4..., the resonant frequency of the first resonant structure 100A is f 1 . The width W2 of 120B, 130B is (2n'+1) × λ'/2, where n' is 0, 1, 2, 3, 4.... The coupling beam 140 is located between the two resonant beams 120B, 130B with a length A2=(m'+1)×λ'/4, where m' is 0, 1, 2, 3, 4..., the resonant structure 100B The resonance frequency is f 2 . Therefore, the first resonant structure 100A or the second resonant structure 100B can be selectively driven by the selection function circuit 20, thereby achieving the function of selecting a frequency of the output signal.

綜上所述,在本發明的上述實施例中,產生體波模態共振的指叉型耦合共振器,其藉由耦合樑將並排的共振樑予以連接所產生的共振結構,其中耦合樑的長度為共振波長的二方之一。此舉讓共振樑除能在其延伸方向進行延伸以增加面積外,尚能藉由耦合樑連接多個並排的共振樑。換句話說,上述共振樑與耦合樑所組成的共振結構,其能在所處的二維空間中加以拓展,因而能有效地增加電容傳感面積以降低其阻抗,進而增進其輸出效能。In summary, in the above embodiment of the present invention, an interdigital type coupled resonator that generates a bulk wave mode resonance is obtained by coupling a side-by-side resonant beam by a coupling beam, wherein the coupling beam is The length is one of the two sides of the resonant wavelength. This allows the resonant beam to be extended in the direction of its extension to increase the area. It is also possible to connect a plurality of side-by-side resonant beams by means of a coupling beam. In other words, the resonant structure composed of the above resonant beam and the coupling beam can be expanded in the two-dimensional space, thereby effectively increasing the capacitive sensing area to reduce its impedance, thereby improving its output efficiency.

雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,故本發明之保護範圍當視後附之申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

10、200、10A、10B...指叉型耦合共振器10, 200, 10A, 10B. . . Interdigitated coupling resonator

20...選擇功能電路20. . . Select function circuit

100、211...共振結構100, 211. . . Resonance structure

100A...第一共振結構100A. . . First resonance structure

100B...第二共振結構100B. . . Second resonance structure

110A、240A、110C...輸入電極110A, 240A, 110C. . . Input electrode

111...導電結構111. . . Conductive structure

111A、111B...第一端111A, 111B. . . First end

112A、112B...第二端112A, 112B. . . Second end

110B、240B、110D...輸出電極110B, 240B, 110D. . . Output electrode

120、130、220、120A、120B、130A、130B...共振樑120, 130, 220, 120A, 120B, 130A, 130B. . . Resonant beam

140、230...耦合樑140, 230. . . Coupling beam

150、210...基材150, 210. . . Substrate

160、250...支撐結構160, 250. . . supporting structure

161、251...第一支撐構件161, 251. . . First support member

1611、2511...第一支撐元件1611, 2511. . . First support element

1612、2512...第一固定座1612, 2512. . . First mount

162、252...第二支撐構件162, 252. . . Second support member

1621、2521...第二支撐元件1621, 2521. . . Second support element

1622、2522...第二固定座1622, 2522. . . Second mount

2513、2523...懸臂2513, 2523. . . cantilever

2514...第一彈性支撐件2514. . . First elastic support

2524...第二彈性支撐件2524. . . Second elastic support

241、242...凹槽241, 242. . . Groove

B1...第一構件B1. . . First member

B2...第二構件B2. . . Second member

C1...第三構件C1. . . Third member

C2...第四構件C2. . . Fourth member

F1、F2...叉狀結構F1, F2. . . Fork structure

L1...第一軸向L1. . . First axial direction

L2...第二軸向L2. . . Second axial direction

圖1是本發明指叉型耦合共振器之第一實施例的俯視圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a plan view showing a first embodiment of an interdigitated coupling resonator of the present invention.

圖2是本發明指叉型耦合共振器之第二實施例的俯視圖。Figure 2 is a plan view showing a second embodiment of the interdigitated coupling resonator of the present invention.

圖3是本發明指叉型耦合共振器之第三實施例的俯視圖。Figure 3 is a plan view showing a third embodiment of the interdigitated coupling resonator of the present invention.

圖4是本發明指叉型耦合共振器之第四實施例的俯視圖。Figure 4 is a plan view showing a fourth embodiment of the interdigitated coupling resonator of the present invention.

圖5是本發明指叉型耦合共振器之第五實施例的示意圖。Figure 5 is a schematic view showing a fifth embodiment of the interdigitated coupling resonator of the present invention.

圖6是圖5的指叉型耦合共振器的局部俯視圖。Fig. 6 is a partial plan view of the interdigitated coupling resonator of Fig. 5;

圖7是本發明指叉型耦合共振器之第六實施例的一種具雙頻輸出功能的指叉型耦合共振器的俯視圖。Fig. 7 is a plan view showing a finger-type coupling resonator having a dual-frequency output function in a sixth embodiment of the interdigital coupling resonator of the present invention.

圖8是本發明指叉型耦合共振器之第七實施例的一種具選頻輸出功能的指叉型耦合共振器的俯視圖。Figure 8 is a plan view showing an interdigital type coupling resonator having a frequency selective output function of a seventh embodiment of the interdigital coupling resonator of the present invention.

10...指叉型耦合共振器10. . . Interdigitated coupling resonator

100...共振結構100. . . Resonance structure

110A...輸入電極110A. . . Input electrode

111...多晶矽導電結構111. . . Polycrystalline germanium conductive structure

111A...第一端111A. . . First end

112A...第二端112A. . . Second end

110B...輸出電極110B. . . Output electrode

120、130...共振樑120, 130. . . Resonant beam

140...耦合樑140. . . Coupling beam

150...基材150. . . Substrate

160...支撐結構160. . . supporting structure

161...第一支撐構件161. . . First support member

1611...第一支撐元件1611. . . First support element

1612...第一固定座1612. . . First mount

162...第二支撐構件162. . . Second support member

1621...第二支撐元件1621. . . Second support element

1622...第二固定座1622. . . Second mount

B1...第一構件B1. . . First member

B2...第二構件B2. . . Second member

C1...第三構件C1. . . Third member

C2...第四構件C2. . . Fourth member

L1...第一軸向L1. . . First axial direction

L2...第二軸向L2. . . Second axial direction

Claims (20)

一種指叉型耦合共振器,包括:一共振結構,包括多個共振樑以及一耦合樑,多個共振樑係分別連接於該耦合樑之相對兩側,該共振樑與該耦合樑垂直連接;至少一輸入電極與至少一輸出電極,該輸入電極與該輸出電極係交互地配置於該多個共振樑間,且該輸入電極配置於該耦合樑之兩側,該輸出電極配置於該耦合樑之兩側,該輸入電極與該輸出電極和該共振樑彼此間平行地配置,且該輸入電極或該輸出電極與相鄰兩共振樑分別形成電容間隙,使該輸入電極驅動兩相鄰共振樑振動或該輸出電極感測兩相鄰共振樑振動產生的電容變化;一基材;及一支撐結構,係設置在基材上,該耦合樑之兩端係連接在該支撐結構上,以支撐該共振結構於該基材上方。An interdigital coupling resonator comprising: a resonant structure comprising a plurality of resonant beams and a coupling beam, the plurality of resonant beam systems being respectively connected to opposite sides of the coupling beam, the resonant beam being perpendicularly connected to the coupling beam; At least one input electrode and at least one output electrode, the input electrode and the output electrode are alternately disposed between the plurality of resonant beams, and the input electrode is disposed on two sides of the coupling beam, and the output electrode is disposed on the coupling beam On both sides, the input electrode and the output electrode and the resonant beam are arranged in parallel with each other, and the input electrode or the output electrode and the adjacent two resonant beams respectively form a capacitance gap, so that the input electrode drives two adjacent resonant beams Vibration or the output electrode senses a change in capacitance caused by vibration of two adjacent resonant beams; a substrate; and a support structure disposed on the substrate, the two ends of the coupling beam being coupled to the support structure to support The resonant structure is above the substrate. 如申請專利範圍第1項所述之指叉型耦合共振器,其中該共振樑為一體波模態(bulk mode)共振器,其中該共振樑寬度=(2×n+1)×λ/2,其中n為0,1,2,3,4...,且λ為該些共振樑在共振狀態時的共振波長。The interdigitated coupling resonator according to claim 1, wherein the resonant beam is a bulk mode resonator, wherein the resonant beam width = (2 × n + 1) × λ / 2 Where n is 0, 1, 2, 3, 4..., and λ is the resonant wavelength of the resonant beams in the resonant state. 如申請專利範圍第1項所述之指叉型耦合共振器,其中該輸入電極包括位於該耦合樑兩側分開之第一構件與第二構件,該第一構件與該第二構件間以一導電結構連接,而該輸出電極包括位於該耦合樑兩側分開之第三構件與第四構件,該第三構件與該第四構件間以該導電結構連接。The interdigitated coupling resonator of claim 1, wherein the input electrode comprises a first member and a second member that are separated on both sides of the coupling beam, and the first member and the second member are The conductive structure is connected, and the output electrode comprises a third member and a fourth member which are separated on both sides of the coupling beam, and the third member and the fourth member are connected by the conductive structure. 如申請專利範圍第1項所述之指叉型耦合共振器,其中更包括有一第一軸向與一第二軸向,該第一軸相與該第二軸向係相互垂直,而該輸入電極與該輸出電極與該共振樑沿該第一軸向延伸,而沿該第二軸向交互地排列,其中該第一軸向、該第二軸向與該輸入電極、該輸出電極、該共振樑及該耦合樑位於同一平面上。The interdigitated coupling resonator of claim 1, further comprising a first axial direction and a second axial direction, the first axial phase and the second axial phase being perpendicular to each other, and the input An electrode and the output electrode and the resonant beam extend along the first axial direction and are alternately arranged along the second axial direction, wherein the first axial direction, the second axial direction and the input electrode, the output electrode, the The resonant beam and the coupling beam are on the same plane. 如申請專利範圍第1項所述之指叉型耦合共振器,其中該輸入電極與該輸出電極分別連接至一積體電路(ASIC),使該輸入電極與該輸出電極來驅動與感測該共振樑沿該第二軸向振動。The interdigitated coupling resonator of claim 1, wherein the input electrode and the output electrode are respectively connected to an integrated circuit (ASIC), and the input electrode and the output electrode are driven and sensed. The resonant beam vibrates along the second axis. 如申請專利範圍第1項所述之指叉型耦合共振器,其中該耦合樑位於該兩共振樑間的長度=(m+1)×λ/4,其中m為0,1,2,3,4…,且λ為該兩共振樑在共振狀態時的共振波長。The interdigitated coupling resonator of claim 1, wherein the coupling beam is located between the two resonant beams = (m + 1) × λ / 4, where m is 0, 1, 2, 3 , 4..., and λ is the resonant wavelength of the two resonant beams in the resonant state. 如申請專利範圍第1項所述之指叉型耦合共振器,其中該耦合樑位於該兩共振樑間的長度等於該耦合樑的寬度。The interdigitated coupling resonator of claim 1, wherein the length of the coupling beam between the two resonant beams is equal to the width of the coupling beam. 如申請專利範圍第1項所述之指叉型耦合共振器,其中該共振樑的截面形狀為矩型。The interdigitated coupling resonator according to claim 1, wherein the cross-sectional shape of the resonant beam is a rectangular shape. 如申請專利範圍第1項所述之指叉型耦合共振器,其中該共振結構為非等向性材料。The interdigitated coupling resonator of claim 1, wherein the resonant structure is an anisotropic material. 如申請專利範圍第1項所述之指叉型耦合共振器,其中該導電結構為多晶半導體材料或金屬。The interdigitated coupling resonator of claim 1, wherein the electrically conductive structure is a polycrystalline semiconductor material or a metal. 如申請專利範圍第1項所述之指叉型耦合共振器,其中該支撐結構包括有一第一支撐構件與一第二支撐構件,該第一支撐構件包括有一第一支撐元件與一第一固定座,該第一支撐元件係設置在該第一固定座上,使該耦合樑之一端設置在該第一支撐元件上;及該第二支撐構件包括有一第二支撐元件與一第二固定座,該第二支撐元件係設置在該第二固定座上,使該耦合樑之另一端設置在該第二支撐元件上。The interdigitated coupling resonator of claim 1, wherein the supporting structure comprises a first supporting member and a second supporting member, the first supporting member comprising a first supporting member and a first fixing a first support member disposed on the first mount, such that one end of the coupling beam is disposed on the first support member; and the second support member includes a second support member and a second mount The second supporting member is disposed on the second fixing base such that the other end of the coupling beam is disposed on the second supporting member. 如申請專利範圍第1項所述之指叉型耦合共振器,其中該輸入電極或該輸出電極位於該耦合樑之同一側且電位相同一端側彼此連接而形成一叉狀結構。The interdigitated coupling resonator according to claim 1, wherein the input electrode or the output electrode is located on the same side of the coupling beam and the same end side is connected to each other to form a fork structure. 如申請專利範圍第1項所述之指叉型耦合共振器,其中該輸入電極為一體成型地配置在該耦合樑下方,而該輸入電極於該耦合樑下方的位置設置有一凹槽供該輸入電極配置在內,以及該輸出電極為一體成型地配置在該耦合樑下方,而該輸出電極於該耦合樑下方的位置設置有一凹槽供該輸出電極配置在內。The interdigitated coupling resonator of claim 1, wherein the input electrode is integrally formed under the coupling beam, and the input electrode is provided with a groove at the position below the coupling beam for the input. The electrode is disposed, and the output electrode is integrally formed under the coupling beam, and the output electrode is disposed at a position below the coupling beam with a groove for the output electrode to be disposed. 如申請專利範圍第1項所述之指叉型耦合共振器,其中該共振樑間依序交互地配置該輸入電極、輸出電極、輸入電極、輸出電極、輸入電極、輸出電極之排列配置。The interdigitated coupling resonator according to claim 1, wherein the arrangement of the input electrode, the output electrode, the input electrode, the output electrode, the input electrode, and the output electrode is alternately arranged in sequence between the resonant beams. 一種指叉型耦合共振器,包括:一第一共振結構,包括:多個共振樑以及一耦合樑,多個共振樑係分別連接於該耦合樑之相對兩側,該共振樑與該耦合樑垂直連接;一或多數個電極設置於兩相鄰共振樑之間且與兩共振樑分別形成電容間隙,使該電極驅動兩相鄰共振樑振動或感測兩相鄰共振樑振動產生的電容變化,該電極與該共振樑彼此平行配置;一第二共振結構,包括:多個共振樑以及一耦合樑,多個共振樑係分別對稱地連接於該耦合樑之相對兩側,該共振樑與該耦合樑垂直連接;一或多數個電極設置於兩相鄰共振樑之間且與兩共振樑分別形成電容間隙,使該電極驅動兩相鄰共振樑振動或感測兩相鄰共振樑振動產生的電容變化,該電極與該共振樑彼此平行配置;一基材;一支撐結構,係設置在基材上,該耦合樑之兩端係連接在該支撐結構上,使支撐該第一與第二共振結構於該基材上方。An interdigitated coupling resonator includes: a first resonant structure comprising: a plurality of resonant beams and a coupling beam, the plurality of resonant beam systems being respectively connected to opposite sides of the coupling beam, the resonant beam and the coupling beam Vertical connection; one or more electrodes are disposed between two adjacent resonant beams and form a capacitance gap with the two resonant beams respectively, so that the electrode drives two adjacent resonant beams to vibrate or sense the capacitance change caused by the vibration of two adjacent resonant beams The second resonant structure includes: a plurality of resonant beams and a coupling beam, and the plurality of resonant beam beams are symmetrically connected to opposite sides of the coupling beam, the resonant beam and the resonant beam are respectively The coupling beams are vertically connected; one or more electrodes are disposed between the two adjacent resonant beams and form a capacitive gap with the two resonant beams respectively, so that the electrodes drive two adjacent resonant beams to vibrate or sense the vibration of two adjacent resonant beams. The capacitance changes, the electrode and the resonant beam are arranged parallel to each other; a substrate; a supporting structure is disposed on the substrate, and the two ends of the coupling beam are connected to the supporting structure to make a branch The first and second resonant structure in the upper substrate. 如申請專利範圍第15項所述之指叉型耦合共振器,其中該共振樑寬度=(2×n+1)×λ/2,其中n為0,1,2,3,4...,且λ為共振樑在共振狀態時的共振波長。The interdigitated coupling resonator according to claim 15, wherein the resonant beam width = (2 × n + 1) × λ / 2, wherein n is 0, 1, 2, 3, 4... And λ is the resonance wavelength of the resonant beam in the resonant state. 如申請專利範圍第15項所述之指叉型耦合共振器,其中該耦合樑位於該兩共振樑間的長度=(m+1)×λ/4,其中m為0,1,2,3,4...,且λ為共振樑在共振狀態時的共振波長。The interdigitated coupling resonator of claim 15, wherein the length of the coupling beam between the two resonant beams is = (m + 1) × λ / 4, where m is 0, 1, 2, 3 , 4..., and λ is the resonant wavelength of the resonant beam in the resonant state. 如申請專利範圍第15項所述之指叉型耦合共振器,其中該第一共振結構與該第二共振結構係並聯且該耦合樑係連接。The interdigitated coupling resonator of claim 15, wherein the first resonant structure is connected in parallel with the second resonant structure and the coupling beam is connected. 如申請專利範圍第15項所述之指叉型耦合共振器,其中該第一共振結構與該第二共振結構係分離。The interdigitated coupling resonator of claim 15, wherein the first resonant structure is separated from the second resonant structure. 如申請專利範圍第15項所述之指叉型耦合共振器,其中該第一共振結構之共振樑的寬度不等於該第二共振結構之共振樑的寬度。The interdigitated coupling resonator of claim 15, wherein the width of the resonant beam of the first resonant structure is not equal to the width of the resonant beam of the second resonant structure.
TW100145070A 2011-12-07 2011-12-07 Interdigitated coupling resonator TWI466442B (en)

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3054666B1 (en) * 2016-07-27 2018-07-20 Office National D'etudes Et De Recherches Aerospatiales (Onera) MECHANICAL RESONATOR OPTIMIZED TO OPERATE IN A FLUID
CN110661506B (en) * 2019-09-20 2021-09-10 中国科学院半导体研究所 RF-MEMS resonator based on bulk acoustic wave vibration mode coupling
WO2022169405A1 (en) * 2021-02-03 2022-08-11 Agency For Science, Technology And Research Acoustic resonator and method of forming the same
CN115395920A (en) * 2022-08-19 2022-11-25 麦斯塔微电子(深圳)有限公司 MEMS resonator and vibrating arm assembly thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4542356A (en) * 1982-07-26 1985-09-17 Toyo Communication Equipment Co., Ltd. High frequency narrow-band multi-mode filter
US5115216A (en) * 1988-04-11 1992-05-19 Hitachi, Ltd. Surface acoustic wave filter including saw resonators with transmission spaces therein
US5682126A (en) * 1994-12-23 1997-10-28 Advanced Saw Products Ladder saw filter contained in a single acoustic track
TW454378B (en) * 1996-05-28 2001-09-11 Fujitsu Ltd Surface-acoustic-wave device having an improved pass-band characteristic and an improved degree of freedom for setting input and output impedances
TW200633375A (en) * 2004-12-01 2006-09-16 Sony Corp Micro-resonator, frequency filter and communication apparatus

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5815054A (en) 1997-05-27 1998-09-29 Motorola Inc. Surface micromachined acoustic wave piezoelectric crystal with electrodes on raised ridges and in spaces therebetween
US6713938B2 (en) * 1999-01-14 2004-03-30 The Regents Of The University Of Michigan Method and apparatus for filtering signals utilizing a vibrating micromechanical resonator
DE19937747C2 (en) 1999-08-10 2001-10-31 Siemens Ag Mechanical resonator for rotation sensor
AU2001288387A1 (en) 2000-08-25 2002-03-04 Microcoating Technologies, Inc. Electronic and optical devices and methods of forming these devices
US6930596B2 (en) 2002-07-19 2005-08-16 Ut-Battelle System for detection of hazardous events
WO2004013893A2 (en) * 2002-08-01 2004-02-12 Georgia Tech Research Corporation Piezo electric on seminconductor on- insulator resonator
US7002281B2 (en) 2003-07-16 2006-02-21 Biode Inc. Multi-reflective acoustic wave device
US7176770B2 (en) 2004-08-24 2007-02-13 Georgia Tech Research Corp. Capacitive vertical silicon bulk acoustic resonator
WO2006046672A1 (en) 2004-10-26 2006-05-04 Koichi Hirama Composite resonance circuit and oscillation circuit using the circuit
US7492241B2 (en) 2005-06-02 2009-02-17 The Regents Of The University Of California Contour-mode piezoelectric micromechanical resonators
US7227432B2 (en) 2005-06-30 2007-06-05 Robert Bosch Gmbh MEMS resonator array structure and method of operating and using same
US20100007444A1 (en) 2006-04-20 2010-01-14 Anis Nurashikin Nordin GHz Surface Acoustic Resonators in RF-CMOS
JP4539920B2 (en) 2006-05-12 2010-09-08 国立大学法人 東京大学 Vibration wave detection method and apparatus
TWI318824B (en) 2006-07-07 2009-12-21 Advance Design Technology Inc A wideband filter with interdigital stepped impedance resonators
TWI325653B (en) 2006-07-07 2010-06-01 Advance Design Technology Inc An ultra wide band (uwb) diplexer
US7545238B2 (en) 2006-12-20 2009-06-09 Sitime Inc. Serrated MEMS resonators
US7639105B2 (en) * 2007-01-19 2009-12-29 Georgia Tech Research Corporation Lithographically-defined multi-standard multi-frequency high-Q tunable micromechanical resonators
JP2008221398A (en) 2007-03-13 2008-09-25 Oki Electric Ind Co Ltd Micro electro mechanical system and method of manufacturing micro electro mechanical system
WO2008151320A1 (en) 2007-06-08 2008-12-11 The Regents Of The University Of Michigan Resonator system such as a microresonator system and method of making same
US7898158B1 (en) * 2007-11-01 2011-03-01 Rf Micro Devices, Inc. MEMS vibrating structure using a single-crystal piezoelectric thin-film layer having domain inversions
US7855564B2 (en) 2008-02-14 2010-12-21 Delaware Capital Formation, Inc. Acoustic wave device physical parameter sensor
JP4690436B2 (en) * 2008-05-01 2011-06-01 株式会社半導体理工学研究センター MEMS resonator, MEMS oscillation circuit, and MEMS device
CN102113214B (en) * 2008-08-08 2014-03-19 株式会社村田制作所 Elastic wave device
US8686614B2 (en) 2008-12-17 2014-04-01 Sand 9, Inc. Multi-port mechanical resonating devices and related methods

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4542356A (en) * 1982-07-26 1985-09-17 Toyo Communication Equipment Co., Ltd. High frequency narrow-band multi-mode filter
US5115216A (en) * 1988-04-11 1992-05-19 Hitachi, Ltd. Surface acoustic wave filter including saw resonators with transmission spaces therein
US5682126A (en) * 1994-12-23 1997-10-28 Advanced Saw Products Ladder saw filter contained in a single acoustic track
TW454378B (en) * 1996-05-28 2001-09-11 Fujitsu Ltd Surface-acoustic-wave device having an improved pass-band characteristic and an improved degree of freedom for setting input and output impedances
TW200633375A (en) * 2004-12-01 2006-09-16 Sony Corp Micro-resonator, frequency filter and communication apparatus

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