TWI465855B - A method of adjusting an exposure apparatus, an exposure apparatus, and an element manufacturing method - Google Patents

Description

Adjustment method of exposure device, exposure device, and component manufacturing method

The present invention relates to an adjustment method of an exposure apparatus, an exposure apparatus, and a component manufacturing method.

The priority of Japanese Patent Application No. 2007-198675, filed on Jul. 31, 2007, is hereby incorporated by reference.

As an exposure apparatus used in a photolithography process, as disclosed in the following patent documents, there is known a liquid immersion exposure apparatus which exposes a substrate through a liquid.

Patent Document 1: Japanese Patent Laid-Open Publication No. 2005-12201

The exposure device includes a holding portion that holds the substrate that is irradiated with the exposure light. In the exposure apparatus, the relationship between the temperature of the holding portion and the temperature of the substrate becomes a problem. Further, in the liquid immersion exposure apparatus, the relationship between the temperature of the substrate and the temperature of the liquid becomes a problem.

It is an object of the present invention to provide an adjustment method of an exposure apparatus for performing an exposure operation well. Another object of the invention is to provide an exposure apparatus capable of performing an exposure operation satisfactorily and a method of manufacturing an element using the exposure apparatus.

The method for adjusting the first aspect of the present invention is for use in a liquid immersion exposure apparatus having a first holding portion for holding a substrate and a second holding portion for holding the substrate before holding the substrate by the first holding portion, and transmitting Liquid makes the first Exposure of the substrate held by the holding portion, comprising: an operation of holding the temperature detector by the first holding portion; an operation of holding the temperature detector by the second holding portion; and a temperature detector held by the first holding portion The detection result and the detection result of the temperature detector held by the second holding unit adjust the temperature of at least one of the first holding unit and the second holding unit.

The method for adjusting the second aspect of the present invention is for use in a liquid immersion exposure apparatus having a holding portion for holding a substrate, and exposing the substrate held by the holding portion through the liquid, and comprising: a holding portion The operation of the temperature detector holding the first information about the temperature of the holding unit, the operation of acquiring the second information about the temperature of the liquid supplied to the temperature detector by the temperature detector, and the first information and the second information Information, the action of adjusting the temperature of at least one of the holding portion and the liquid.

A method of manufacturing a device according to a third aspect of the present invention includes: an operation of exposing a substrate using a liquid immersion exposure apparatus adjusted by the adjustment method of the above aspect; and an operation of developing the substrate after exposure.

An exposure apparatus according to a fourth aspect of the present invention is characterized in that: the first holding portion is provided to hold the substrate at a position where the exposure light is irradiated, and the second holding portion is in the first portion. The holding unit holds the substrate in front of the substrate and adjusts the temperature of the substrate; the transport device transports the temperature detector held by the second holding unit from the second holding unit to the first holding unit; and the adjusting device according to the first holding unit The temperature of at least one of the first holding portion and the second holding portion is adjusted by the detection result of the temperature detector and the detection result of the temperature detector held by the second holding portion.

An exposure apparatus according to a fifth aspect of the present invention is characterized in that the liquid is exposed to light for exposure. Exposing a substrate, comprising: a holding portion that holds the substrate at a position where the exposure light is irradiated; a supply port for supplying the liquid; and an adjusting device that adjusts a temperature of at least one of the holding portion and the liquid; and the adjusting device Adjusting the temperature of at least one of the holding portion and the liquid according to the temperature information of the holding portion and the liquid, the temperature information being obtained by the temperature detector by supplying the liquid from the supply port to the temperature detector held by the holding portion .

A method of manufacturing a device according to a sixth aspect of the present invention includes: an operation of exposing a substrate using the exposure apparatus of the above aspect; and an operation of developing the substrate after exposure.

According to the aspect of the present invention, the desired exposure operation can be performed. Further, according to the embodiment of the present invention, a desired element can be manufactured.

Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, the XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system. Further, the predetermined direction in the horizontal plane is the X-axis direction, and the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction, and the direction orthogonal to the X-axis direction and the Y-axis direction (that is, the vertical direction). Set to the Z axis direction. Further, the directions of rotation (inclination) around the X-axis, the Y-axis, and the Z-axis are θ x , θ y , and θ z directions, respectively.

(First embodiment)

The first embodiment will be described. Fig. 1 is a schematic block diagram showing an exposure apparatus EX according to the first embodiment. In this embodiment, the exposure device EX is A case where the substrate stage holding the substrate P and the exposure apparatus for loading the measurement stage of the measuring device (including the measuring member) for measuring the exposure are provided will be described as an example. Further, an exposure apparatus including a substrate stage and a measurement stage is disclosed in, for example, U.S. Patent No. 6,897,963.

In FIG. 1, the exposure apparatus EX includes a mask stage 1 that can move while holding the mask M, and has a holder stage 2H that holds the substrate P, and a substrate stage 2 that can move while holding the substrate P with the holder portion 2H. , a measuring stage for exposure, a measuring stage 3 capable of independently moving with the substrate stage 2 without holding the substrate P, and an interferometer system 4 capable of measuring position information of each stage 1, 2, 3 for exposure The illumination system IL of the mask M held by the mask stage 1 is illuminated by the light EL, and the pattern image of the mask M illuminated by the exposure light EL is projected onto the projection optical system PL of the substrate P, and the substrate P is transported to the substrate. The transport device 10 of the stage 2 and the control device 5 that controls the overall operation of the exposure device EX.

Further, the substrate referred to herein includes a photosensitive material (photoresist) coated on a substrate such as a semiconductor wafer. The mask M includes a reticle that forms a projected element pattern on the substrate P. Further, in the present embodiment, the transmissive reticle is used as the reticle, but a reflective reticle may be used.

The exposure apparatus EX of the present embodiment is a liquid immersion exposure apparatus that irradiates the substrate P with the exposure light EL through the liquid LQ to expose the substrate P, and includes a nozzle member that fills the optical path space K of the exposure light EL with the liquid LQ. 6. In the present embodiment, water (pure water) is used as the liquid LQ.

The nozzle member 6 of the present embodiment is disposed in the end of the image plane closest to the projection optical system PL among the plurality of optical elements of the projection optical system PL. Near the end optical element FL. The liquid member L is filled with the light path space K of the exposure light EL between the lower surface (ejection surface) 7 of the terminal optical element FL and the surface of the object opposite to the lower surface 7 of the terminal optical element FL, in the nozzle member 6 and The liquid LQ is held between the objects, thereby forming the liquid immersion space LS. An object that can face the nozzle member 6 and the lower surface 7 of the terminal optical element FL includes an object that can be moved to a position irradiated by the exposure light EL from the terminal optical element FL. In the present embodiment, the object that can be moved to the position where the exposure light EL is irradiated includes the substrate P, the substrate stage 2, and the measurement stage 3. When the substrate P is exposed, a liquid immersion space LS is formed between the lower surface 7 of the nozzle member 6 and the terminal optical element FL and the surface of the substrate P. When the exposure light EL is irradiated onto the surface of the substrate P, the liquid LQ of the liquid immersion space LS contacts the surface of the substrate P.

In the present embodiment, when the substrate P is exposed, the liquid immersion space LS is formed so that the liquid LQ covers a partial region (partial region) of the surface of the substrate P. That is, the exposure apparatus EX of the present embodiment employs a partial liquid immersion method in which a portion of the surface of the substrate P including the projection region of the projection optical system PL is covered with the liquid LQ when the substrate P is exposed. The method forms a liquid immersion space LS.

The exposure apparatus EX of the present embodiment is a scanning type exposure apparatus (so-called scanning stepper) that moves the mask M while moving the mask M and the substrate P in synchronization with a predetermined scanning direction. The image is projected on the substrate P. In the present embodiment, the scanning direction (synchronous moving direction) of the substrate P is the Y-axis direction, and the scanning direction (synchronous moving direction) of the mask M is also the Y-axis direction. The exposure apparatus EX moves the projection area of the substrate P with respect to the projection optical system PL in the Y-axis direction, and the substrate P is in the Y-axis direction. The movement of the mask M relative to the illumination region of the illumination system IL is synchronously moved in the Y-axis direction, and the exposure light EL is applied to the substrate P through the projection optical system PL and the liquid LQ. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed by the exposure light EL.

Further, in the present embodiment, the exposure apparatus EX includes the holding member 8 that holds the substrate P before the substrate P is held by the substrate stage 2. The holding member 8 has a holder portion 8H that holds the substrate P in a detachable manner. The holder portion 8H has a holding surface that can face the back surface of the substrate P. Further, the exposure apparatus EX includes a substrate temperature adjusting device 9 that adjusts the temperature of the substrate P held by the holder portion 8H. At least a part of the substrate temperature adjusting device 9 is disposed on the holding member 8. The substrate temperature adjusting device 9 is controlled by the control device 5.

In the present embodiment, the holding member 8 is disposed on the transport path of the transport device 10. The transport device 10 transports the substrate P to the holding member 8 before transporting the substrate P to the substrate stage 2 . Further, the transport device 10 carries out the substrate P held by the holding member 8 from the holding member 8. The conveyance device 10 conveys the substrate P carried out from the holder portion 8H of the holding member 8 to the holder portion 2H of the substrate stage 2 .

The illumination system IL illuminates a predetermined illumination area on the reticle M with exposure light EL distributed over a uniform illumination. As the exposure light EL emitted from the illumination system IL, for example, a far-ultraviolet light (DUV light) such as a glow line (g line, h line, i line) emitted from a mercury lamp, and KrF excimer laser light (wavelength 248 nm), or ArF excimer laser light (wavelength 193 nm) and F ₂ laser light (wavelength 157 nm) and other vacuum ultraviolet light (VUV light). In the present embodiment, ArF excimer laser light is used as the exposure light EL.

The mask stage 1 is moved in the X-axis, the Y-axis, and the θ z direction while holding the mask M while the drive system 1D including an actuator such as a linear motor. The position information of the mask stage 1 (mask M) is measured by the laser interferometer 4A of the laser interferometer system 4. The laser interferometer 4A measures the position information of the mask stage 1 in the X-axis, the Y-axis, and the θ z direction using the measuring mirror 1R provided on the mask stage 1. The control device 5 controls the position of the reticle M held by the reticle stage 1 by the drive system 1D based on the measurement result of the laser interferometer system 4.

The projection optical system PL projects the pattern image of the mask M onto the substrate P at a predetermined projection magnification. The projection optical system PL has a plurality of optical elements that are held by the lens barrel PK. The projection optical system PL of the present embodiment is a reduction system in which the projection magnification is, for example, 1/4, 1/5, or 1/8. Further, the projection optical system PL may be any of an equal magnification system and an amplification system. In the present embodiment, the optical axis AX of the projection optical system PL is parallel to the Z-axis direction. Further, the projection optical system PL may be any one of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.

Further, the exposure device EX includes an optical adjustment device that can perform optical adjustment of the projection optical system PL. In the present embodiment, the exposure apparatus EX includes an imaging characteristic adjustment device 11 that can adjust the imaging characteristics of the projection optical system PL as an optical adjustment device. Examples of the imaging characteristic adjusting device 11 are disclosed in U.S. Patent No. 4,666,273, U.S. Patent No. 6,235,438, U.S. Patent Publication No. 2005/0206850, and the like. This embodiment The imaging characteristic adjusting device 11 includes a driving device that is part of a plurality of optical elements of the movable projection optical system PL. The driving device can move a specific optical element among a plurality of optical elements of the projection optical system PL in the optical axis AX direction (Z-axis direction). Further, the driving device can tilt a specific optical element with respect to the optical axis AX. The imaging characteristic adjustment device 11 adjusts imaging of various phase differences (projection magnification, distortion, spherical phase difference, etc.) and image plane position (focus position) including the projection optical system PL by moving a specific optical element of the projection optical system PL. characteristic. Further, the imaging characteristic adjusting device 11 may include a pressure adjusting device that adjusts the gas pressure of a space between a part of the optical elements held inside the lens barrel PK. The imaging characteristic adjusting device 11 is controlled by the control device 5.

The substrate stage 2 can hold the substrate P at a position where the exposure light EL is irradiated. The substrate stage 2 has a holder portion 2H that holds the substrate P in a detachable manner. The holder portion 2H has a holding surface that can face the back surface of the substrate P. The substrate stage 2 is movable in a predetermined region including a position facing the lower surface 7 of the nozzle member 6 and the terminal optical element FL (a position where the exposure light EL is irradiated) while holding the substrate P with the holder portion 2H. XY direction.

The substrate stage 2 is a drive system 2D including an actuator such as a linear motor, and is movable on the base member 13 on the X-axis, the Y-axis, and the Z-axis while holding the substrate P in the holder portion 2H. The direction of 6 degrees of freedom in the θ X, θ Y, and θ Z directions. The holder portion 2H is disposed in the recess 2R of the substrate stage 2 . The holder portion 2H can hold the substrate P such that the surface of the substrate P is substantially parallel to the XY plane. In the present embodiment, the upper surface 2F around the concave portion 2R of the substrate stage 2 and the surface of the substrate P held by the holder portion 2H are They are arranged in a substantially flat plane (the same height).

The positional information of the substrate stage 2 (substrate P) in the X-axis, the Y-axis, and the θ Z direction is measured by the laser interferometer 4B of the interferometer system 4. The laser interferometer 4B measures the position information of the substrate stage 2 in the X-axis, the Y-axis, and the θ Z direction using the measuring mirror 42R of the substrate stage 2. Moreover, the surface position information (position information on the Z axis, θ X , and θ Y directions) of the surface of the substrate P held by the holder portion 2H of the substrate stage 2 is detected by a focus leveling (not shown). System to detect. The control device 5 controls the position of the substrate P held by the substrate stage 2 by the drive system 2D based on the measurement results of the laser interferometer 4B and the detection result of the focus leveling detection system.

The measuring stage 3, the reference member (measuring member) on which the reference mark is formed, and various photodetectors and the like, and a measuring device for measuring the exposure processing, by a driving system 3D including an actuator such as a linear motor, The base member 13 can be moved in the directions of 6 degrees of freedom in the X-axis, Y-axis, Z-axis, θ X, θ Y, and θ Z directions. The position information of the measuring stage 3 is measured by the laser interferometer 4C of the interferometer system 4. The laser interferometer 4C measures the position information of the measurement stage 3 in the X-axis, the Y-axis, and the θ Z direction using the measuring mirror 43R of the measuring stage 3. The control device 5 controls the position of the measurement stage 3 by the drive system 3D based on the measurement result of the laser interferometer 4C.

The substrate stage 2 and the measurement stage 3 can be in a predetermined area on the base member 13 including the position facing the lower surface 7 of the nozzle member 6 and the terminal optical element FL (the position where the exposure light EL is irradiated) Move independently. Further, in the present embodiment, for example, the European Patent Application Publication No. 1,713,113 As disclosed, the liquid immersion space LS is movable between the substrate stage 2 and the measurement stage 3. In other words, in the present embodiment, the control unit 5 moves the substrate stage 2 and the measurement stage 3 in synchronization with the substrate stage 2 and the measurement stage 3 in proximity to the substrate stage 2 and the measurement. At least one of the stages 3 and the space between the nozzle member 6 and the terminal optical element FL continue to form a liquid LQ. Thereby, the liquid immersion space LS moves between the substrate stage 2 and the measurement stage 3.

The exposure apparatus EX includes a supply port 14 for supplying the liquid LQ to the optical path space K of the exposure light EL, and a recovery port 15 for recovering the liquid LQ. In the present embodiment, the supply port 14 and the recovery port 15 are disposed in the nozzle member 6. At the supply port 14, the liquid supply device 17 is connected through the supply pipe 16. At the recovery port 15, the liquid recovery device 19 is connected through a recovery pipe 18. In the present embodiment, a porous member (mesh hole) is disposed in the recovery port 15.

The liquid supply device 17 includes a liquid temperature adjustment device 20 that adjusts the temperature of the liquid LQ to be supplied. Further, the liquid supply device 17 includes a deaerator that reduces the gas component in the liquid LQ, and a filter unit that removes foreign matter in the liquid LQ. The liquid supply device 17 can supply a clean and temperature-adjusted liquid LQ. The liquid recovery device 19 includes a vacuum system capable of recovering the liquid LQ. The liquid LQ sent from the liquid supply device 17 is supplied to the optical path space K (on the substrate P) of the exposure light EL through the supply port 14 after flowing through the supply flow path of the supply pipe 16 and the nozzle member 6. Further, by driving the liquid recovery device 19, the liquid LQ recovered from the recovery port 15 flows through the recovery flow path of the nozzle member 6, and is recovered into the liquid recovery device 19 through the recovery pipe 18.

The control device 5 simultaneously performs the liquid supply action of the liquid supply device 17 The liquid recovery operation of the liquid recovery device 19 forms the liquid immersion space LS such that the liquid LQ fills the optical path space K of the exposure light EL. On the substrate P, a liquid immersion area larger than the projection area and smaller than the liquid LQ of the substrate P is formed so as to cover the projection area of the projection optical system PL.

In the exposure apparatus EX, when at least the pattern image of the mask M is projected onto the substrate P, the liquid immersion space LS is formed so that the liquid LQ fills the optical path space K of the exposure light EL by using the nozzle member 6. The exposure device EX passes through the projection optical system PL and the liquid LQ of the liquid immersion space LS, and irradiates the exposure light EL passing through the mask M to the substrate P held by the holder portion 2H of the substrate stage 2. Thereby, the pattern image of the mask M is projected onto the substrate P, and the substrate P is exposed.

The substrate temperature adjusting device 9 can adjust the temperature of the substrate P held by the holder portion 8H. At least a part of the substrate temperature adjusting device 9 is provided inside the holding member 8, and the control device 5 can adjust the temperature of at least the holder portion 8H using the substrate temperature adjusting device 9. The substrate temperature adjusting device 9 adjusts the temperature of the substrate P held by the holder portion 8H by adjusting the temperature of the holder portion 8H. The temperature of the holder portion 8H is substantially equal to the temperature of the temperature-adjusted substrate P held by the holder portion 8H.

In the present embodiment, the substrate temperature adjusting device 9 includes a flow path formed inside the holding member 8 and a fluid supply mechanism that causes the temperature-adjusted fluid to flow through the flow path. The temperature of the holder portion 8H (substrate P) is adjusted by the fluid flowing through the flow path. Further, the substrate temperature adjusting device 9 may include a Peltier element, a heater, or the like for adjusting the temperature of the holder portion 8H (substrate P).

2 is a plan view of the substrate stage 2 and the measurement stage 3 as viewed from above. A reference plate 21 is provided as a measuring device (measuring member) at a predetermined position on the upper surface 3F of the measuring stage 3, and the reference plate 21 is formed with the first image used for the alignment process of the image on the substrate P. Second reference marks FM1, FM2.

Further, an opening 22 is formed at a predetermined position on the upper surface 3F of the measurement stage 3. Further, at least under the opening 22 (in the -Z direction), for example, as disclosed in U.S. Patent Publication No. 2002/041377, the at least one of the aerial image measuring devices 23 for measuring the imaging characteristics (optical characteristics) of the projection optical system PL is disposed. portion. The space image measuring device 23 can detect a state in which a pattern image formed by the projection optical system PL and the liquid LQ is transmitted. When the state of the pattern image is detected by the space image measuring device 23, the mask M on which the predetermined pattern (for example, the pattern for measurement) is formed is disposed on the mask stage 1. The control device 5 causes the lower surface 7 of the terminal optical element FL to face the opening 22 of the upper surface 3F, and fills the optical path space K of the exposure light EL between the lower surface 7 of the terminal optical element FL and the upper surface 3F including the opening 22 with the liquid LQ. The manner of forming the liquid immersion space LS. The control device 5 illuminates the mask M with the exposure light EL by the illumination system IL. The exposure light EL that has been irradiated onto the mask M is transmitted through the mask M into the projection optical system PL. The exposure light EL incident on the projection optical system PL is transmitted through the projection optical system PL and the liquid LQ to the opening 22. The pattern image of the mask M is projected onto the opening 22 through the projection optical system PL and the liquid LQ. Thereby, the space image measuring device 23 disposed below the opening 22 can detect a state in which the pattern image formed by the projection optical system PL and the liquid LQ is transmitted. Further, the pattern in which the image is detected by the space image measuring device 23 may be disposed on a part of the mask stage 1.

Next, an example of an adjustment method of the exposure apparatus EX having the above configuration will be described with reference to the flowcharts of FIGS. 3, 4, and 5. In the following description, the holder portion 2H of the substrate stage 2 is appropriately referred to as a first holder portion 2H, and the holder portion 8H of the holding member 8 is appropriately referred to as a second holder portion 8H.

The adjustment method of the present embodiment includes a first process (steps SA1 to SA7) in which the temperature of the first holder portion 2H and the temperature of the second holder portion 8H are in a predetermined relationship (steps SA1 to SA7), and the temperature of the first holder portion 2H is set to The temperature of the liquid LQ is a second process (steps SB1 to SB5) of a predetermined relationship and a third process (steps SC1 to SC4) for performing optical adjustment.

In the present embodiment, when at least a part of the first process and the second process are performed, the temperature detector 30 shown in Fig. 6 is used. The temperature detector 30 includes a substrate 31, a plurality of temperature detecting units 32 disposed on the substrate 31, and a processing unit 33 that processes the detection result of the temperature detecting unit 32. The processing unit 33 includes a memory element 33M that stores the detection result of the temperature detecting unit 32. Further, the processing unit 33 includes a transmitting device 34 that wirelessly transmits the detection result of the temperature detecting unit 32 to the external receiving device 35. The receiving device 35 is connected to the control device 5, and outputs the detection result of the temperature detecting unit 32 to the control device 5. The control device 5 performs predetermined processing based on the detection result of the temperature detecting unit 32. Further, the processing unit 33 may not include the transmitting device 34, and may read the information stored in the memory element 33M (memory device) after the temperature detector 30 is carried out from the exposure device EX.

The temperature detector 30 has an outer shape which is substantially the same as the outer shape of the substrate P. The first holder portion 2H and the second holder portion 8H hold the temperature detector 30 in a detachable manner. The temperature detector 30 is held by the first holder portion 2H The temperature information of the first holder portion 2H can be obtained, and when held in the second holder portion 8H, the temperature information of the second holder portion 8H can be acquired. In the present embodiment, since the substrate P held by the second holder portion 8H is adjusted to have substantially the same temperature as the second holder portion 8H, the second holder can be measured by measuring the temperature of the second holder portion 8H. The temperature of the substrate P after the temperature adjustment of the portion 8H is carried out. Further, the temperature detector 30 can obtain temperature information of the liquid LQ supplied to the temperature detector 30.

Further, the transport device 10 capable of transporting the substrate P can transport the temperature detector 30. The transport device 10 can transport the temperature detector 30 between the first holder portion 2H and the second holder portion 8H.

First, a first process is performed in which the temperature of the first holder portion 2H and the temperature of the second holder portion 8H are in a predetermined relationship. When the first process is started (step SA1), the temperature detector 30 is carried into the second holder portion 8H (step SA2). In the present embodiment, the transport device 10 carries the temperature detector 30 into the second holder portion 8H.

As shown in the schematic view of FIG. 7A, the second holder portion 8H holds the temperature detector 30. The temperature detector 30 held by the second holder portion 8H acquires the temperature information of the second holder portion 8H (step SA3). The temperature information of the second holder portion 8H obtained by the temperature detector 30 is transmitted to the control device 5 through the transmission device 34 and the receiving device 35 of the processing unit 33.

After the temperature information of the second holder portion 8H is acquired by the temperature detector 30, the temperature detector 30 is transferred from the second holder portion 8H to the first holder portion 2H (step SA4). In the present embodiment, the temperature is detected by the transfer device 10 that transports the substrate P from the second holder portion 8H to the first holder portion 2H. The device 30 is transported from the second holder portion 8H to the first holder portion 2H.

In the schematic view of Fig. 7B, the temperature detector 30 is held by the first holder portion 2H. The temperature detector 30 held by the first holder portion 2H acquires temperature information of the first holder portion 2H (step SA5). The temperature information of the first holder portion 2H obtained by the temperature detector 30 is transmitted to the control device 5 through the transmission device 34 and the receiving device 35 of the processing unit 33.

The control device 5 adjusts the second hold using the substrate temperature adjusting device 9 based on the temperature information of the first holder portion 2H obtained by the temperature detector 30 and the temperature information of the second holder portion 8H obtained by the temperature detector 30. The temperature of the portion 8H is such that the temperature of the first holder portion 2H and the temperature of the second holder portion 8H are in a predetermined relationship (step SA6).

In the present embodiment, the controller 5 adjusts the temperature of the second holder portion 8H using the substrate temperature adjusting device 9 to reduce the temperature difference between the first holder portion 2H and the second holder portion 8H. In other words, the temperature of the second holder portion 8H is adjusted to reduce the temperature difference between the temperature of the substrate P conveyed from the second holder portion 8H to the first holder portion 2H and the first holder portion 2H. In the present embodiment, the controller 5 adjusts the temperature of the second holder portion 8H using the substrate temperature adjusting device 9 so that the temperature of the second holder portion 8H substantially matches the temperature of the first holder portion 2H.

In the present embodiment, the detection result of the temperature detector 30 when the temperature detector 30 is held by the first holder portion 2H and the detection result of the temperature detector 30 when the temperature detector 30 is held by the second holder portion 8H The acquisition of the temperature information of the first holder portion 2H of the temperature detector 30 and the acquisition of the temperature information of the second holder portion 8H are repeated before the substantially identical The operation and the temperature adjustment operation of the second holder portion 8H of the substrate temperature adjusting device 9 are used. When the temperature information acquisition operation of the first holder portion 2H of the temperature detector 30 and the temperature information acquisition operation of the second holder portion 8H are repeatedly used, the transport device 10 transports the temperature detector 30 to the first holder portion. Between 2H and the second holder portion 8H.

When it is determined that the temperature of the first holder portion 2H and the temperature of the second holder portion 8H are in a predetermined relationship, that is, the temperature of the first holder portion 2H and the temperature of the second holder portion 8H are determined. When the upper level is coincident, the first processing is ended (step SA7). In other words, after the first holder portion 2H is held, the temperature of the first holder portion 2H detected by the temperature detector 30 is used, and after the predetermined time elapses after the first holder portion 2H holds the temperature detector 30, the temperature detector is used. When the temperature of the first holder portion 2H detected by the 30 is substantially the same, the first processing is ended. When it is determined that the temperature of the first holder portion 2H substantially matches the temperature of the second holder portion 8H, the control information of the substrate temperature adjusting device 9 (the temperature of the fluid flowing through the second holder portion 8H, etc.) is determined. It is stored in the control device 5.

After the completion of the first process, that is, after the process of substantially matching the temperature of the first holder portion 2H with the temperature of the second holder portion 8H is completed, the temperature of the first holder portion 2H and the temperature of the liquid LQ are performed. It becomes the second process of the established relationship. When the second process is started (step SB1), the temperature detector 30 is held in the first holder portion 2H.

The control device 5 causes the nozzle member 6 and the lower surface 7 of the terminal optical element FL to face the temperature detector 30 held by the first holder portion 2H, and delivers the liquid LQ from the liquid supply device 17. The liquid sent from the liquid supply device 17 The body LQ is supplied from the supply port 14 to the temperature detector 30 held by the first holder portion 2H. Thereby, as shown in the schematic view of FIG. 8A, the liquid immersion space LS of the liquid LQ is formed between the lower surface 7 of the nozzle member 6 and the terminal optical element FL and the temperature detector 30 held by the first holder portion 2H, at the temperature. A portion of the surface of the detector 30 partially forms a liquid immersion area of the liquid LQ (step SB2). The temperature detector 30 acquires temperature information of the first holder portion 2H. The temperature information of the first holder portion 2H obtained by the temperature detector 30 is output to the control device 5 through the transmission device 34 and the receiving device 35 of the processing unit 33. Further, the temperature detector 30 acquires temperature information of the liquid LQ in the liquid immersion space LS (liquid immersion area). The temperature information of the liquid LQ obtained by the temperature detector 30 is output to the control device 5 through the transmitting device 34 and the receiving device 35 of the processing unit 33 (step SB3).

The control device 5 adjusts the supply from the supply port 14 using the liquid temperature adjustment device 20 based on the temperature information of the first holder portion 2H obtained by the temperature detector 30 and the temperature information of the liquid LQ obtained by the temperature detector 30. The temperature of the liquid LQ is such that the temperature of the first holder portion 2H and the temperature of the liquid LQ are in a predetermined relationship (step SB4).

In the present embodiment, the control device 5 adjusts the temperature of the liquid LQ using the liquid temperature adjusting device 20 to reduce the temperature difference between the first holder portion 2H and the liquid LQ. That is, the control device 5 adjusts the temperature of the liquid LQ using the liquid temperature adjusting device 20 so that the temperature of the liquid LQ substantially matches the temperature of the first holder portion 2H.

In the present embodiment, as shown in Fig. 8B, a liquid immersion area of the liquid LQ is partially formed on a part of the surface of the temperature detector 30. That is, in temperature detection The surface of the device 30 has a portion in contact with the liquid LQ of the liquid immersion area (liquid immersion space) and a portion which is not in contact with the liquid LQ of the liquid immersion area (liquid immersion space). Therefore, the temperature detector 30 obtains temperature information of the liquid LQ at a portion in contact with the liquid LQ in the liquid immersion area, and acquires temperature information of the first holder portion 2H in a portion that is not in contact with the liquid LQ in the liquid immersion area. In this manner, in the present embodiment, the temperature detector 30 can simultaneously acquire the temperature information of the first holder portion 2H and the temperature information of the liquid LQ. Further, the temperature information of the first holder portion 2H and the temperature information of the liquid LQ may not be acquired at the same time. For example, when the liquid immersion area of the liquid LQ is not formed on the surface of the temperature detector 30, the temperature information of the first holder portion 2H is obtained based on the detection result of the temperature detector 30 held by the first holder portion 2H, and the temperature is detected. When a part of the surface of the device 30 forms a liquid immersion area of the liquid LQ, the temperature information of the liquid LQ may be obtained based on the detection result of the temperature detector 30 (the portion in contact with the liquid LQ) held by the first holder portion 2H.

The control device 5 monitors the temperature information of the first holder portion 2H and the temperature information of the liquid LQ output from the temperature detector 30, and adjusts the temperature of the liquid LQ using the liquid temperature adjusting device 20 so that the temperature of the liquid LQ is The temperature of the first holder portion 2H substantially coincides. Then, the temperature detector 30 is continuously used until the detection result detected by the temperature detecting unit 32 that is not in contact with the liquid LQ and the detection result detected by the temperature detecting unit 32 that is in contact with the liquid LQ substantially match. The operation of acquiring the temperature information of the first holder portion 2H and the operation of acquiring the temperature information of the liquid LQ, and the temperature adjustment operation of the liquid LQ of the liquid temperature adjustment device 20 based on the acquired temperature information.

Further, in the present embodiment, the control device 5 performs the temperature information of the liquid LQ using the temperature detector 30 while moving the substrate stage 2 holding the temperature detector 30 to the nozzle member 6 and the terminal optical element FL in the XY direction. The acquisition operation and the acquisition operation of the temperature information of the first holder portion 2H. That is, in the present embodiment, the liquid immersion area of the liquid LQ is sequentially formed at a plurality of positions on the surface of the temperature detector 30, and the temperature information of the liquid LQ and the temperature information of the first holder portion 2H are sequentially obtained. The control device 5 processes the plurality of temperature information sequentially acquired, and adjusts the temperature of the liquid LQ based on the processing result. For example, the control device 5 adjusts the temperature of the liquid LQ such that the average of the plurality of temperatures coincides with the temperature of the first holder portion 2H.

Next, when it is determined that the temperature of the first holder portion 2H substantially coincides with the temperature of the liquid LQ supplied from the supply port 14, the second process is terminated (step SB5). When it is determined that the temperature of the first holder portion 2H substantially coincides with the temperature of the liquid LQ, the control information of the liquid temperature adjusting device 20 (the temperature of the fluid that exchanges heat with the liquid LQ, etc.) is stored in the control device 5.

After the first process and the second process are completed, that is, after the temperature of the first holder portion 2H, the temperature of the second holder portion 8H, and the temperature of the liquid LQ are substantially matched, the third process is performed. Make optical adjustments. The optical adjustment includes adjustment of the projection optical system PL. When the third process is started (step SC1), an operation of detecting the state of the image formed by the liquid LQ is performed (step SC2). In the present embodiment, the operation of detecting the state of the pattern image formed by the transmission of the projection optical system PL and the liquid LQ is performed by using a spatial image test. The measuring device 23 performs this.

As shown in the schematic view of FIG. 9, in order to detect the state of the pattern image, the mask M on which the predetermined measurement pattern is formed is disposed on the mask stage 1. The control device 5 causes the lower surface 7 of the terminal optical element FL to face the opening 22 of the upper surface 3F, and fills the optical path space K of the exposure light EL between the lower surface 7 of the terminal optical element FL and the upper surface 3F including the opening 22 with the liquid LQ. The manner of forming the liquid immersion space LS. The control device 5 controls the liquid temperature adjusting device 20 based on the control amount (adjustment amount) derived and stored in the second process. Thereby, the liquid LQ adjusted to the desired temperature by the above-described second processing is supplied to the measurement stage 3. Further, it is preferable that the temperature of the upper surface 3F of the measurement stage 3 is adjusted to substantially match the temperature of the first holder portion 2H. That is, it is preferable to adjust the temperature of the measurement stage 3 (3F above) so that the temperature of the upper surface 3F of the measurement stage 3 coincides with the temperature of the liquid LQ supplied to the upper surface 3F.

The control device 5 illuminates the mask M with the exposure light EL by the illumination system IL. By illuminating the mask M with the exposure light EL, the pattern image of the mask M is projected to the opening 22 through the projection optical system PL and the liquid LQ. The space image measuring device 23 disposed below the opening 22 detects a state in which a pattern image formed by the projection optical system PL and the liquid LQ is transmitted.

The measurement result of the space image measuring device 23 is output to the control device 5. The control device 5 performs optical adjustment of the projection optical system PL using the imaging characteristic adjustment device 11 based on the state of the pattern image detected by the aerial image measuring device 23 (step SC3). Thereby, the imaging characteristics of the projection optical system PL are optimized. Next, the third process is ended (step SC4). Further, the measurement mark provided on the mask stage 1 may be used without using the mask M.

As described above, when the substrate P is exposed, the substrate P before being exposed is held by the second holder portion 8H of the holding member 8 before being held by the first holder portion 2H of the substrate stage 2. The holding member 8 adjusts the temperature of the substrate P held by the second holder portion 8H. The substrate temperature adjusting device 9 adjusts the temperature of the substrate P held by the second holder portion 8H by adjusting the temperature of the second holder portion 8H. The temperature of the second holder portion 8H is substantially equal to the temperature of the temperature-adjusted substrate P held by the second holder portion 8H. In the first process, the first holder portion 2H and the second holder portion 8H can be adjusted in temperature by substantially matching the temperature of the first holder portion 2H with the temperature of the second holder portion 8H. The temperature of the subsequent substrate P is substantially the same. In other words, the temperature of the substrate P after the temperature adjustment of the second holder portion 8H of the holding member 8 can be substantially equal to the temperature of the first holder portion 2H of the substrate stage 2 by the first processing. . In other words, the temperature of the first holder portion 2H, the temperature of the second holder portion 8H, and the temperature of the substrate P after the temperature adjustment by the second holder portion 8H are substantially the same by the first processing. Consistent. Therefore, when the temperature-adjusted substrate P held by the second holder portion 8H is held by the first holder portion 2H, since there is almost no temperature difference between the substrate P and the first holder portion 2H, for example, the substrate P and the substrate P can be suppressed. Thermal deformation of the substrate P due to a temperature difference of the first holder portion 2H.

In the second process, the temperature of the first holder portion 2H and the temperature of the liquid LQ substantially match, so that the temperature of the liquid LQ supplied from the supply port 14 can be maintained by the first holder portion 2H. The temperatures of the substrates P are substantially uniform. Therefore, when the liquid LQ is supplied to the substrate P held by the first holder portion 2H, since the substrate P and the liquid LQ have almost no temperature difference, it is possible to suppress For example, a change in the optical characteristics of the liquid LQ (for example, a refractive index of the exposure light EL) caused by a temperature difference between the substrate P and the supplied liquid LQ, thermal deformation of the substrate P, and the like are performed.

Further, in the present embodiment, since the third process is performed after the completion of the first process and the second process, it is possible to suppress an imaging error caused by a temperature difference between the lower surface 7 of the terminal optical element FL and the liquid LQ, and the like. When the substrate P is exposed, the desired pattern image is projected on the substrate P.

As described above, according to the present embodiment, the temperature detector 30 can be used to make the temperature of the second holder portion 8H of the holding member 8 and the temperature of the first holder portion 2H of the substrate stage 2 in a desired relationship. Therefore, it is possible to suppress the occurrence of poor exposure due to the temperature difference between the substrate P and the first holder portion 2H.

Further, according to the present embodiment, the temperature detector 30 can be used to make the temperature of the first holder portion 2H and the temperature of the liquid LQ supplied to the substrate P held by the first holder portion 2H in a desired relationship. Therefore, it is possible to suppress the occurrence of poor exposure due to the temperature difference between the substrate P and the liquid LQ.

Further, in the present embodiment, the spatial image measuring device 23 detects the spatial image of the pattern in order to detect the state of the pattern image in the third processing, but the state of the pattern image may be detected without using the aerial image measuring device 23. For example, after the second treatment, the test substrate is exposed (test exposure) by the liquid LQ, and the development process of the test substrate after the exposure is performed, and the pattern shape detecting device such as SEM (Scanning Electron Microscope) is used to detect the formation. The state of the pattern of the substrate is tested, thereby detecting the state of the pattern image. Moreover, the third process may be performed using the measurement mark provided on the photomask stage 1 without using the mask M.

(Second embodiment)

Next, a second embodiment will be described. In the following description, the same or equivalent components as those in the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

As described above, the temperature detector 30 includes a plurality of temperature detecting units 32, and can detect the temperature distribution of the first holder portion 2H, the temperature distribution of the second holder portion 8H, and the liquid LQ of the liquid immersion area (liquid immersion space). Temperature Distribution.

In the first embodiment, the control device 5 acquires the first holder portion 2H using the temperature detector 30 in the first process for setting the temperature of the first holder portion 2H and the temperature of the second holder portion 8H to a predetermined relationship. The temperature distribution information of the holding surface and the temperature distribution information of the holding surface of the second holder portion 8H. Next, the control device 5 controls the substrate temperature adjusting device 9B based on the temperature distribution information of the first holder portion 2H and the temperature distribution information of the second holder portion 8H obtained by the temperature detector 30.

Fig. 10 is a schematic view showing the holding member 8B of the present embodiment. In the present embodiment, the substrate temperature adjusting device 9B can adjust the temperature distribution of the holding surface of the second holder portion 8H. In the present embodiment, the substrate temperature adjusting device 9B has a plurality of Peltier elements 9P disposed in a plane parallel to the holding surface of the second holder portion 8H. The temperature of the Peltier element 9P varies depending on the applied electric power (including the polarity, the amount of current). The control device 5 can adjust the temperature distribution of the holding surface of the second holder portion 8H by adjusting the electric power applied to each of the plurality of Peltier elements 9P.

For example, a case where the temperature distribution shown in the schematic view of FIG. 11A exists in the holding surface of the first holder portion 2H is considered. The horizontal axis of FIG. 11A is a position in which the holding surface of the first holder portion 2H is in a predetermined direction (for example, the Y-axis direction), and The temperature of the holding surface of the first holder portion 2H of the shaft system. For example, when the first holder portion 2H has a temperature distribution as shown in FIG. 11A due to the influence of the drive system 2D or the like, the temperature detector 30 can detect the temperature distribution of the first holder portion 2H.

The control device 5 adjusts the temperature distribution of the holding surface of the second holder portion 8H by the substrate temperature adjusting device 9B in accordance with the temperature distribution of the holding surface of the first holder portion 2H. When the temperature distribution of the second holder portion 8H is adjusted, the temperature detector 30 is held by the second holder portion 8H. The control device 5 controls the Peltier elements 9P of the substrate temperature adjusting device 9B while monitoring the temperature distribution information of the second holder portion 8H output from the temperature detector 30. In the present embodiment, the control device 5 controls the substrate temperature adjusting device 9B such that the temperature distribution of the holding surface of the first holder portion 2H matches the temperature distribution of the holding surface of the second holder portion 8H. 11B is a schematic view showing the temperature distribution of the holding surface of the second holder portion 8H after the adjustment, and the horizontal axis is the position of the holding surface of the second holder portion 8H in a predetermined direction (for example, the Y-axis direction), and the vertical axis is the first axis. 2 The temperature of the holding surface of the holder portion 8H. In this manner, in the present embodiment, the control device 5 substantially matches the temperature distribution of the holding surface of the first holder portion 2H with the temperature distribution of the holding surface of the second holder portion 8H. In other words, in the present embodiment, the temperature distribution of the holding surface of the first holder portion 2H substantially coincides with the temperature distribution of the substrate P before the first holder portion 2H is held. Thereby, it is possible to suppress thermal deformation of the substrate P due to the difference between the temperature distribution of the substrate P and the temperature distribution of the holding surface of the first holder portion 2H.

Moreover, the control device 5 adjusts the first holder portion 2H by using the liquid temperature adjusting device 20 in accordance with the temperature distribution of the holding surface of the first holder portion 2H. The temperature of the liquid LQ on the substrate P held. That is, when the holding surface of the first holder portion 2H has a temperature distribution as shown in FIG. 11A, the control device 5 adjusts the liquid temperature adjusting device 20 to a plurality of surfaces on the substrate P when the substrate P is exposed. The position changes the temperature of the liquid LQ supplied to the substrate P, respectively. In the present embodiment, as shown in the schematic view of Fig. 12, the control device 5 controls the liquid temperature adjusting device 20 so that the temperature distribution of the holding surface of the first holder portion 2H is supplied to the first holder portion 2H. The temperature of the liquid LQ at a plurality of positions on the surface of the substrate P substantially coincides.

As described above, in the second embodiment, even when the temperature distribution of the first holder portion 2H is present, the occurrence of exposure failure due to the temperature difference between the substrate P and the first holder portion 2H and the substrate P and the liquid can be suppressed. The poor exposure caused by the temperature difference of LQ.

Further, in the present embodiment, the temperature adjustment of the second holder portion 8H is performed by using the Peltier element 9P. However, as in the first embodiment, the temperature-adjusted fluid flows through the flow in the second holder portion 8H. The temperature adjustment of the second holder portion 8H may be performed.

Further, when the substrate P is exposed, the temperature of the liquid LQ supplied from the supply port 14 may not be changed as in the first embodiment.

(Third embodiment)

Next, a third embodiment will be described. In the following description, the same or equivalent components as those in the above-described embodiments are denoted by the same reference numerals, and the description thereof will be simplified or omitted.

Fig. 13 is a view showing an example of the substrate stage 2B of the third embodiment. In FIG. 13, the exposure apparatus EX is equipped with the temperature which adjusted the temperature of the 1st holder part 2H. Temperature adjustment device 40. The temperature adjustment device 40 includes a plurality of Peltier elements 40P, and the temperature distribution of the holding surface of the first holder portion 2H can be adjusted.

In the present embodiment, the temperature adjustment device 40 can adjust the temperature of the first holder portion 2H so that the temperature of the first holder portion 2H and the temperature of the second holder portion 8H have a predetermined relationship. For example, the control device 5 can control the temperature adjustment device 40 such that the temperature of the first holder portion 2H substantially matches the temperature of the second holder portion 8H. In addition, in order to make the temperature of the first holder portion 2H and the temperature of the second holder portion 8H have a predetermined relationship, only the temperature adjustment operation of the first holder portion 2H of the temperature adjustment device 40 may be performed, and the temperature adjustment device 40 may be performed. Both the temperature adjustment operation of the first holder portion 2H and the temperature adjustment operation of the second holder portion 8H of the substrate temperature adjustment device 9 may be employed.

Further, when only the temperature adjustment operation of the first holder portion 2H of the temperature adjustment device 40 is performed, the substrate temperature adjustment device 9 may not be provided.

Further, in the present embodiment, the temperature adjustment device 40 can adjust the temperature of the first holder portion 2H so that the temperature of the first holder portion 2H and the temperature of the liquid LQ have a predetermined relationship. For example, the control device 5 can control the temperature adjustment device 40 such that the temperature of the first holder portion 2H substantially matches the temperature of the liquid LQ. In addition, in order to make the temperature of the first holder portion 2H and the temperature of the liquid LQ have a predetermined relationship, only the temperature adjustment operation of the first holder portion 2H of the temperature adjustment device 40 may be performed, and the first maintenance of the temperature adjustment device 40 may be performed. Both the temperature adjustment operation of the component 2H and the temperature adjustment operation of the liquid LQ of the liquid temperature adjustment device 20 may be performed. Further, only the temperature adjustment of the first holder portion 2H of the temperature adjustment device 40 is performed. In the case of the operation, the liquid temperature adjusting device 20 may not be provided. Further, in the present embodiment, the temperature adjustment of the first holder portion 2H is performed using the Peltier element 40P, but the flow path in the first holder portion 2H is provided, and the temperature-adjusted fluid flows through the flow path. The temperature adjustment of the first holder portion 2H may be performed.

Further, when the exposure device EX includes the temperature adjustment device 40, the first process may be performed after the second process. In particular, when the temperature of the first holder portion 2H is adjusted in the second process, after the second process, the first process is performed to set the temperature of the first holder portion 2H and the second holder portion. The temperature of 8H becomes a predetermined relationship.

Further, in the above-described first to third embodiments, the temperature of the first holder portion 2H is adjusted to substantially match the temperature of the second holder portion 8H based on the temperature information acquired by the temperature detector 30, but the temperature may be different. . For example, while the substrate P is being transported from the holding member 8 to the substrate stage 2, the temperature of the substrate P may change. At this time, the temperature change amount of the substrate P during the conveyance is obtained (predicted) in advance, and the temperature of the substrate P can be adjusted by the holding member 8 based on the obtained temperature change amount. Further, the amount of temperature change of the substrate P during transportation can be obtained in advance by, for example, an experiment or a simulation.

In other words, the substrate temperature adjusting device 9 of the holding member 8 measures the temperature change amount of the substrate P during the conveyance from the holding member 8 to the substrate stage 2, and adjusts the temperature of the substrate P to reduce the first of the substrate stage 2 The temperature difference between the substrate P before holding the holder portion 2H and the first holder portion 2H, that is, the temperature of the substrate P before the first holder portion 2H is held and the temperature of the first holder portion 2H Consistent. Thereby, thermal deformation of the substrate P due to a temperature difference between the substrate P and the first holder portion 2H can be suppressed.

Further, in the above-described first to third embodiments, the substrate temperature adjusting device 9 adjusts the temperature of the holding member 8 (8H) to adjust the temperature of the substrate P held by the holding member 8 (8H), but does not adjust and maintain the temperature. The temperature of the member 8 (8H) may be adjusted to the temperature of the substrate P held by the holding member 8 (8H). For example, the substrate P held by the holding member 8 (8H) may be irradiated with infrared rays, and the temperature of the substrate P may be adjusted. At this time, in the first process, the temperature detector 30 held by the holding member 8 (8H) performs a temperature scheduling operation, and based on the detection result of the temperature detector 30 at this time, the substrate held by the holding member 8 (8H) is performed. At least one of the temperature adjustment of P and the temperature adjustment of the first holder portion 2H may be such that the temperature of the substrate P before the first holder portion 2H is held substantially coincides with the temperature of the first holder portion 2H.

Further, in the above-described first to third embodiments, one of the first processing and the second processing is performed, and the other is performed, but only one of them may be performed.

Further, in the above-described first to third embodiments, after the first processing and the second processing, the third processing is performed, but the third processing may be omitted. For example, when the imaging error caused by the temperature difference between the lower surface 7 of the terminal optical element FL and the liquid LQ is within the allowable range, the third processing can be omitted. Instead of the third process or the third process, the temperature adjustment of the terminal optical element FL may be performed to reduce the temperature difference between the liquid LQ and the terminal optical element FL.

Further, in the above-described first to third embodiments, the temperature of the liquid LQ and the temperature of at least one of the first holder portion 2H and the holding portion 8 (8H) are adjusted so that the substrate held by the first holder portion 2H is held. P, and the temperature of the liquid LQ supplied to the substrate P may coincide with a predetermined reference temperature (for example, a temperature at which the exposure of the substrate P is performed). At this time, the holding member 8 and the first one are also protected. The holder 2H holds the temperature detector 30, acquires at least the temperature of the holding member 8 and the temperature information of the liquid LQ, and adjusts the temperature of the liquid LQ and at least one of the first holder portion 2H and the holding portion 8 (8H) based on the result. The temperature can be.

Further, the liquid LQ of each of the above embodiments is water, but may be a liquid other than water. For example, as the liquid LQ, hydrofluoroether (HFE), perfluoropolyether (PFPE), perfluoropolyether oil, cedar oil or the like can also be used. Further, the liquid LQ may be a refractive index of 1.6 to 1.8.

Further, in each of the above embodiments, the optical path space on the image plane (ejecting surface) side of the terminal optical element of the projection optical system is filled with a liquid, but the terminal optical can be filled with liquid as disclosed in the pamphlet of International Publication No. 2004/019128. The optical path space on the object plane (incident surface) side of the component.

Further, in each of the above embodiments, an exposure apparatus that partially fills the liquid between the projection optical system PL and the substrate P is used. However, the entire surface of the substrate to be exposed may be immersed in the liquid as disclosed in U.S. Patent No. 5,825,043. The liquid immersion exposure apparatus that performs exposure in the state.

Further, the substrate P of each of the above embodiments is applicable not only to a semiconductor wafer for semiconductor element manufacture but also to a glass substrate for a display element, a ceramic wafer for a thin film magnetic head, or a photomask or a reticle for use in an exposure apparatus. The original (synthetic quartz, germanium wafer) and so on.

The exposure device EX can be used in the mask M and the scanning type exposure device (scanning stepper) of the step-scan method in which the mask M is moved in synchronization with the substrate P and the pattern of the mask M is scanned and exposed. In a state where the substrate P is stationary, the pattern of the mask M is exposed once, and the substrate P is sequentially stepped and moved in a step-and-repeat type projection exposure apparatus (stepper).

Further, the exposure apparatus EX may be a single exposure apparatus of a bonding type, and the single exposure apparatus of the bonding method is exposed by the step-and-repeat method, and the projection optical system is used in a state where the first pattern and the substrate P are substantially stationary. After the reduced image of the first pattern is transferred onto the substrate P, the second image and the substrate P are substantially stationary, and the reduced image of the second pattern is partially exposed to overlap with the first pattern by using the projection optical system. On the substrate P. Further, the exposure apparatus of the bonding method may be an exposure apparatus in which a stepwise bonding method in which at least two pattern portions are superimposed and transferred onto the substrate P to sequentially move the substrate P.

Further, the exposure apparatus EX may be formed by synthesizing two mask patterns on a substrate by a projection optical system as disclosed in, for example, US Pat. No. 6613116, and one irradiation area on the substrate is substantially simultaneously doubled by one scanning exposure. Exposure exposure device, etc. Further, the exposure apparatus EX may be a proximity type exposure apparatus, a reflection projection aligner, or the like.

In addition, the exposure apparatus EX can also be used in the plurals disclosed in U.S. Patent No. 6,341,007, U.S. Patent No. 6,400,441, U.S. Patent No. 6,549,269, U.S. Patent No. 6,509,034, U.S. Patent No. 6,208,407, U.S. Patent No. 6,262,796. Double-stage type exposure apparatus for substrate carriers. Further, an exposure apparatus including a plurality of substrate stages and a measurement stage can be employed.

The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element in which a semiconductor element pattern is exposed on a substrate P, and can be widely applied to an exposure apparatus for manufacturing a liquid crystal display element or a display, or a thin film magnetic head, Photographic element (CCD), micromachine, MEMS (micro electro mechanical system An exposure device such as a DNA (gene) wafer or a reticle or a mask.

Further, in each of the above embodiments, the position information of the mask stage, the substrate stage, and the measurement stage is measured using an interferometer system including a laser interferometer. However, the present invention is not limited thereto, and for example, a detection device may be used. An encoder system for the scale (diffraction grating) of each stage. In this case, it is preferable to form a parallel system including both the interferometer system and the encoder system, and the measurement result of the interferometer system is used to correct the measurement result of the encoder system. Further, the interferometer system and the encoder system may be switched, or both of them may be used for position control of the stage.

Further, in each of the above embodiments, the exposure light EL may be an ArF excimer laser light generated by a light source device that generates ArF excimer laser light. However, for example, as disclosed in U.S. Patent No. 7,023,610, DFB ( A distributed laser light source such as a semiconductor laser or a fiber laser includes a light generating unit having an optical amplifier such as a fiber amplifier and a wavelength converting unit, and a harmonic generating device that outputs pulsed light having a wavelength of 193 nm. Furthermore, in the above embodiment, each of the illumination regions and the projection regions is rectangular, but may have other shapes, such as an arc shape.

Further, in each of the above embodiments, a light-transmitting type mask in which a predetermined light-shielding pattern (or a phase pattern, a light-reducing pattern) is formed on a light-transmitting substrate is used, but it is also disclosed in, for example, US Pat. No. 6,778,257. Instead of the reticle, a variable shaping reticle (also referred to as an electronic reticle, an active reticle, or an image generator) forms a transmission pattern and a reflection according to an electronic material of a pattern to be exposed. Pattern, or illuminating pattern. Variable shaped reticle, for example comprising a non-illuminated image display element (spatial light modulator) One type of DMD (Digital Micro-mirror Device: Digital Miero-mirror Device). Further, the variable shaping mask is not limited to the DMD, and a non-light-emitting image display element described below may be used instead of the DMD. Here, the non-light-emitting image display element is an element that modulates the amplitude (intensity), phase, or polarization state of light traveling in a predetermined direction, and a transmissive spatial light modulator, except for a transmissive liquid crystal display element ( In addition to the LCD: Liquid Crystal Display, an electroluminescence display (ECD) or the like can also be exemplified. Further, the reflective spatial light modulator may be a mirror array, a reflective liquid crystal display element, an electrophoretic display (EPD: Electro Telephonetic Display), an electronic paper (or electronic ink), or a light winding in addition to the above-described DMD. Grating Light Valve, etc.

Further, instead of the variable shaping mask including the non-light-emitting image display element, a pattern forming device including a self-luminous type image display element may be provided. At this point, no lighting system is required. Here, examples of the self-luminous type image display device include a CRT (Cathode Ray Tube), an inorganic EL (electroluminescence) display, an organic EL display (OLED: Organic Light Emitting Diode), and an LED (Light Emitting Diode) (display), LD (Laser Diode) display, Field Emission Display (FED), Plasma Display Panel (PDP). Further, a self-luminous image display device including a pattern forming device uses a solid-state light source wafer having a plurality of light-emitting points, a solid-state light source wafer array in which a plurality of arrays are arranged in a matrix, or a plurality of light-emitting points are mounted on one sheet. A device of a type such as a substrate may be electrically controlled to form a pattern. Furthermore, the solid state light source elements can be inorganic or organic.

In each of the above embodiments, an exposure apparatus including the projection optical system PL will be described as an example. However, an exposure apparatus and an exposure method that do not use the projection optical system PL may be employed. As described above, when the projection optical system PL is not used, the exposure light is also transmitted to the substrate through an optical element such as a lens, and a predetermined space between the optical element and the substrate forms a liquid immersion space.

Further, the exposure apparatus EX, for example, disclosed in the pamphlet of International Publication No. 2001/035168, may employ an exposure apparatus (lithography system) in which interference fringes are formed on the substrate P to expose the line width and the line pitch pattern on the substrate P.

The exposure apparatus EX of the above-described embodiment is manufactured by assembling various subsystems including the respective constituent elements so as to maintain predetermined mechanical precision, electrical precision, and optical precision. In order to ensure these various precisions, various optical systems are used to adjust the optical precision before and after assembly, to adjust the mechanical precision for various mechanical systems, and to adjust the electrical precision for various electrical systems. . The steps of assembling various subsystems into an exposure apparatus include mechanical connection of various subsystems, wiring connection of circuits, piping connection of pneumatic circuits, and the like. Of course, prior to the step of assembling the various subsystems into an exposure device, there are individual assembly steps for each subsystem. When the steps of assembling the various subsystems into the exposure apparatus are completed, comprehensive adjustment is performed to ensure various precisions of the entire exposure apparatus. Further, the production of the exposure apparatus is preferably carried out in a clean room in which temperature and vacuum are managed.

As shown in FIG. 14, the micro-element such as a semiconductor element is manufactured through the following steps, that is, a step 201 of performing the function and performance design of the micro-element, and a step 202 of fabricating a photomask (reticle) according to the design procedure. Manufacturing component base The step 203 of the substrate of the material includes the substrate processing step 204 and the component assembly step (including the wafer cutting step and bonding) of the substrate processing (exposure processing) of exposing the mask pattern image to the substrate and developing the exposed substrate according to the above embodiment. Processing steps of steps, and packaging steps, etc.) 205, inspection step 206, and the like.

Further, although the embodiments of the present invention have been described above, the present invention can be used by appropriately combining all of the above-described constituent elements, and it is also possible to use a part of the constituent elements.

Further, all disclosures of the exposure apparatus and the like disclosed in the above embodiments and modifications are incorporated herein by reference.

2‧‧‧Substrate stage

2H‧‧‧1st holding part

5‧‧‧Control device

8‧‧‧Retaining components

8H‧‧‧2nd holder

9‧‧‧Substrate temperature adjustment device

10‧‧‧Transporting device

11‧‧‧ imaging characteristics adjustment device

14‧‧‧Supply

20‧‧‧Liquid temperature adjustment device

23‧‧‧Space image measuring device

30‧‧‧ Temperature detector

40‧‧‧temperature adjustment device

EL‧‧‧Exposure light

EX‧‧‧Exposure device

LQ‧‧‧Liquid

LS‧‧‧ liquid immersion space (liquid immersion area)

P‧‧‧Substrate

PL‧‧‧Projection Optical System

Fig. 1 is a schematic block diagram showing an example of an exposure apparatus according to the first embodiment.

2 is a plan view of the substrate stage and the measurement stage viewed from above.

Fig. 3 is a flow chart for explaining the adjustment method of the first embodiment.

Fig. 4 is a flow chart for explaining the adjustment method of the first embodiment.

Fig. 5 is a flow chart for explaining the adjustment method of the first embodiment.

Fig. 6 is a view showing an example of a temperature detector.

Fig. 7A is a schematic view for explaining an adjustment method of the first embodiment.

Fig. 7B is a schematic view for explaining the adjustment method of the first embodiment.

Fig. 8A is a schematic view for explaining an adjustment method of the first embodiment.

Fig. 8B is a schematic view for explaining the adjustment method of the first embodiment.

Fig. 9 is a schematic view for explaining an adjustment method of the first embodiment.

Fig. 10 is a schematic view for explaining a holding member of a second embodiment.

Fig. 11A is a schematic view for explaining an adjustment method of the second embodiment.

Fig. 11B is a schematic view for explaining the adjustment method of the second embodiment.

Fig. 12 is a schematic view for explaining an adjustment method of the second embodiment.

Fig. 13 is a schematic view for explaining the substrate stage of the third embodiment.

Fig. 14 is a flow chart showing an example of a process of a micro component.

AX‧‧‧ optical axis

EL‧‧‧Exposure light

EX‧‧‧Exposure device

FL‧‧‧Terminal optical components

IL‧‧‧Lighting System

K‧‧‧Light path space

LQ‧‧‧Liquid

LS‧‧‧ liquid immersion space

M‧‧‧Photo Mask

P‧‧‧Substrate

PK‧‧ lens tube

PL‧‧‧Projection Optical System

1‧‧‧Photomask stage

1D‧‧‧ drive system

1R‧‧‧Measuring mirror

2‧‧‧Substrate stage

2D‧‧‧ drive system

2F‧‧‧above

2H‧‧‧1st holding part

2R‧‧‧ recess

3‧‧‧Measurement stage

3D‧‧‧ drive system

3F‧‧‧above

4‧‧‧Interferometer system

4A, 4B, 4C‧‧‧ laser interferometer

5‧‧‧Control device

6‧‧‧Mouth components

7‧‧‧Under

8‧‧‧Retaining components

8H‧‧‧2nd holder

9‧‧‧Substrate temperature adjustment device

10‧‧‧Transporting device

11‧‧‧ imaging characteristics adjustment device

13‧‧‧Base member

14‧‧‧Supply

15‧‧‧Recovery

16‧‧‧Supply tube

17‧‧‧Liquid supply device

18‧‧‧Recycling tube

19‧‧‧Liquid recovery unit

20‧‧‧Liquid temperature adjustment device

22‧‧‧ openings

23‧‧‧Space image measuring device

42R‧‧‧Measuring mirror

43R‧‧‧Measuring mirror

Claims (33)

An adjustment method is used in a liquid immersion exposure apparatus having a first holding portion for holding a substrate and a second holding portion for holding the substrate before holding the substrate by the first holding portion, and permeating the liquid The substrate is exposed by the first holding portion, and includes: an operation of holding the temperature detector by the first holding portion; an operation of holding the temperature detector by the second holding portion; and The detection result of the temperature detector held by the holding unit and the detection result of the temperature detector held by the second holding unit adjusts the temperature of at least one of the first holding unit and the second holding unit . The method of adjusting the first aspect of the invention, wherein the immersion exposure apparatus adjusts a temperature of the substrate held by the second holding portion before the substrate is held by the first holding portion. The method of adjusting the first aspect of the patent application, further comprising the operation of transporting the temperature detector from the second holding unit to the first holding unit. The method of adjusting the third aspect of the invention, wherein the immersion exposure apparatus includes a transport device that transports the substrate from the second holding portion to the first holding portion, and the temperature detector is used by the transport device The second holding unit is transported to the first holding unit. The adjustment method according to any one of claims 1 to 4, wherein the temperature adjustment of at least one of the first holding portion and the second holding portion is performed to reduce the first holding portion and the second portion The temperature difference of the holding portion. An adjustment method according to any one of claims 1 to 4, Temperature adjustment is performed for at least one of the first holding portion and the second holding portion to reduce a temperature difference between the substrate and the first holding portion immediately before the first holding portion is held. The adjustment method according to any one of claims 1 to 4, further comprising: an action of supplying the liquid to the temperature detector held by the first holding portion after the adjustment of the temperature; The operation of adjusting the temperature of the liquid based on the detection result of the temperature detector regarding the temperature information of the liquid. The method of adjusting the seventh aspect of the patent application is to adjust the temperature of the liquid to reduce the temperature difference between the first holding portion and the liquid. The method of adjusting the seventh aspect of the patent application, further comprising: an operation of detecting a state of the image formed by the liquid after adjusting the temperature of the liquid; and an optical adjustment operation based on a state of the detected image. The method of adjusting the ninth aspect of the invention, wherein the immersion exposure apparatus is provided with a projection optical system; the optical adjustment comprises adjustment of the projection optical system. The adjustment method according to any one of the first to fourth aspect, wherein the temperature adjustment of at least one of the first holding portion and the second holding portion includes the first holding portion and the second holding portion Adjustment of the temperature distribution of at least one of them. The adjustment method according to any one of claims 1 to 4, wherein the detection result of the temperature detector held by the first holding portion The temperature information of the first holding unit is obtained, and the temperature information of the second holding unit is obtained from the detection result of the temperature detector held by the second holding unit. An adjustment method for use in a liquid immersion exposure apparatus having a holding portion for holding a substrate and exposing the substrate held by the holding portion through a liquid, comprising: holding the holding portion The temperature detector obtains the first information about the temperature of the holding portion; the temperature detector acquires the second information about the temperature of the liquid supplied to the temperature detector; and based on the first information The second information is an operation of adjusting a temperature of at least one of the holding portion and the liquid; the temperature detector has substantially the same outer shape as the substrate, and can be detected by temperature at a plurality of positions different from each other The portion measures the temperature of the holding portion or the temperature of the liquid and communicates wirelessly. The method of adjusting the scope of claim 13 wherein the obtaining of the first information and the second information comprises an operation of forming a liquid immersion area of the liquid on a surface of the temperature detector; wherein the temperature detector is The second information is obtained by a portion in contact with the liquid in the liquid immersion area, and the first information is obtained in a portion of the temperature detector that is not in contact with the liquid in the liquid immersion area. The adjustment method of claim 14, wherein the liquid immersion area is sequentially formed at a plurality of positions on the surface of the temperature detector, and the second information and the first information are sequentially acquired. The method of adjusting according to any one of claims 13 to 15, wherein the temperature adjustment of at least one of the holding portion and the liquid is performed to reduce a temperature difference between the holding portion and the liquid. The method of adjusting according to any one of claims 13 to 15, wherein the temperature adjustment of at least one of the holding portion and the liquid includes adjustment of a temperature distribution of at least one of the holding portion and the liquid. The method of adjusting according to any one of claims 13 to 15, further comprising: an operation of detecting a state of transmitting an image formed by the liquid after performing temperature adjustment of at least one of the holding portion and the liquid; And an optical adjustment operation based on the state of the detected image. The adjustment method of claim 18, wherein the immersion exposure device is provided with a projection optical system; and the optical adjustment comprises adjustment of the projection optical system. The adjustment method according to any one of claims 1 to 4, wherein the temperature detector has substantially the same outer shape as the outer shape of the substrate. An element manufacturing method comprising: an operation of exposing a substrate by using a immersion exposure apparatus adjusted by the adjustment method of any one of claims 1 to 20; and an operation of developing the exposed substrate. An exposure apparatus for exposing a substrate by exposing light through a liquid, comprising: a first holding portion that can hold the substrate at a position where the exposure light is irradiated; The second holding unit holds the substrate before the substrate is held by the first holding unit, and adjusts the temperature of the substrate. The transport device transports the temperature detector held by the second holding unit from the second holding unit to the second holding unit. And a first holding unit; and an adjustment device that adjusts the first holding unit based on a detection result of the temperature detector held by the first holding unit and a detection result of the temperature detector held by the second holding unit The temperature of at least one of the second holding portions. The exposure apparatus of claim 22, wherein the transport apparatus is capable of transporting the substrate from the second holding unit to the first holding unit. The exposure apparatus of claim 22 or 23, further comprising: a supply port for supplying the liquid to the temperature detector held by the first holding portion; the adjusting device, according to the temperature detector The temperature information of the liquid adjusts the temperature of the supplied liquid. The exposure apparatus of claim 24, wherein the temperature of the liquid is adjusted to reduce a temperature difference between the first holding portion and the liquid. An exposure apparatus according to claim 22 or 23, further comprising: an image detector for detecting a state of an image formed by the liquid; and an optical adjustment device for optically adjusting according to a state of the detected image; After the temperature of the liquid is adjusted, the image detector detects the state of the image, and based on the result of the detection, the light is used to perform the light. Learn to adjust. An exposure apparatus for exposing a substrate by exposing light through a liquid, comprising: a holding portion that holds the substrate at a position where the exposure light is irradiated; a supply port for supplying the liquid; and an adjusting device Adjusting a temperature of at least one of the holding portion and the liquid; the adjusting device adjusts a temperature of at least one of the holding portion and the liquid according to the temperature information of the holding portion and the liquid, wherein the temperature information is The liquid is supplied from the supply port to a temperature detector held by the holding portion, and is obtained by the temperature detector; the temperature detector has substantially the same outer shape as the substrate, and can be configured by being plural in different numbers from each other The temperature detecting unit of each position measures the temperature of the holding portion or the temperature of the liquid and communicates wirelessly. The exposure apparatus of claim 27, wherein the temperature detector obtains temperature information of the liquid at a portion in contact with the liquid supplied from the supply port, and is in contact with a liquid supplied from the supply port. The temperature information of the holding portion is obtained. An exposure apparatus according to claim 28, wherein the temperature of the liquid is adjusted to reduce a temperature difference between the holding portion and the liquid. An exposure apparatus according to claim 28 or 29, further comprising: an image detector for detecting a state of an image formed by the liquid; and an optical adjustment device for optically adjusting according to a state of the detected image; After the temperature of the liquid is adjusted, the image detector detects the state of the image, and based on the result of the detection, the optical adjustment is performed using the optical adjustment device. An element manufacturing method comprising: an operation of exposing a substrate using an exposure apparatus according to any one of claims 22 to 30; and an operation of developing the exposed substrate. The method of adjusting the scope of claim 13, wherein the obtaining of the first information and the second information is performed in parallel while the temperature detector is held in the holding portion. The exposure apparatus of claim 27, wherein the temperature information of the holding portion and the temperature information of the liquid are measured in parallel while the temperature detector is held in the holding portion.