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TWI465726B - 具有強化探針電性觸點結構之積體電路測試卡 - Google Patents

具有強化探針電性觸點結構之積體電路測試卡 Download PDF

Info

Publication number
TWI465726B
TWI465726B TW101100899A TW101100899A TWI465726B TW I465726 B TWI465726 B TW I465726B TW 101100899 A TW101100899 A TW 101100899A TW 101100899 A TW101100899 A TW 101100899A TW I465726 B TWI465726 B TW I465726B
Authority
TW
Taiwan
Prior art keywords
integrated circuit
test card
circuit board
circuit test
angle
Prior art date
Application number
TW101100899A
Other languages
English (en)
Chinese (zh)
Other versions
TW201329456A (zh
Inventor
Choon Leong Lou
Chih Kun Chen
Ho Yeh Chen
Original Assignee
Star Techn Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Star Techn Inc filed Critical Star Techn Inc
Priority to TW101100899A priority Critical patent/TWI465726B/zh
Priority to KR1020120025015A priority patent/KR101296523B1/ko
Priority to JP2012073003A priority patent/JP5731432B2/ja
Publication of TW201329456A publication Critical patent/TW201329456A/zh
Priority to JP2014257240A priority patent/JP2015064382A/ja
Application granted granted Critical
Publication of TWI465726B publication Critical patent/TWI465726B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0441—Details
    • G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2879—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to electrical aspects, e.g. to voltage or current supply or stimuli or to electrical loads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW101100899A 2012-01-10 2012-01-10 具有強化探針電性觸點結構之積體電路測試卡 TWI465726B (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW101100899A TWI465726B (zh) 2012-01-10 2012-01-10 具有強化探針電性觸點結構之積體電路測試卡
KR1020120025015A KR101296523B1 (ko) 2012-01-10 2012-03-12 탐침의 전기 접점 구조가 개선된 집적회로 테스트카드
JP2012073003A JP5731432B2 (ja) 2012-01-10 2012-03-28 プローブの電気的接点を強化した構造を備えた集積回路用プローブカード
JP2014257240A JP2015064382A (ja) 2012-01-10 2014-12-19 プローブの電気的接点を強化した構造を備えた集積回路用プローブカード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101100899A TWI465726B (zh) 2012-01-10 2012-01-10 具有強化探針電性觸點結構之積體電路測試卡

Publications (2)

Publication Number Publication Date
TW201329456A TW201329456A (zh) 2013-07-16
TWI465726B true TWI465726B (zh) 2014-12-21

Family

ID=48993520

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101100899A TWI465726B (zh) 2012-01-10 2012-01-10 具有強化探針電性觸點結構之積體電路測試卡

Country Status (3)

Country Link
JP (2) JP5731432B2 (ja)
KR (1) KR101296523B1 (ja)
TW (1) TWI465726B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI632374B (zh) * 2016-12-29 2018-08-11 Ｓｖ探針私人有限公司 探針卡
CN113533805B (zh) * 2020-04-20 2024-01-23 台湾中华精测科技股份有限公司 分隔式薄膜探针卡及其弹性模块
CN113777369B (zh) * 2020-06-10 2023-12-19 台湾中华精测科技股份有限公司 悬臂式薄膜探针卡
CN214473740U (zh) * 2021-01-08 2021-10-22 迪科特测试科技(苏州)有限公司 高速回送测试装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0962776A2 (en) * 1998-06-02 1999-12-08 Advantest Corporation Probe card suitable for inspection of multi-pin devices
US6535003B2 (en) * 1999-01-29 2003-03-18 Advantest, Corp. Contact structure having silicon finger contactor
TWM361631U (en) * 2009-03-26 2009-07-21 Mpi Corp Cantilever probe card
US20100176829A1 (en) * 2007-07-03 2010-07-15 Advantest Corporation Probe and probe card
TW201111792A (en) * 2009-09-17 2011-04-01 Mpi Corp High-frequency cantilever probe card

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0749355A (ja) * 1993-06-29 1995-02-21 Nobuaki Suzuki 検査・試験用プローブ装置とプローブ装置取付構造
JPH10239351A (ja) * 1997-02-27 1998-09-11 Mitsubishi Materials Corp コンタクトプローブおよびその製造方法
JPH11142433A (ja) * 1997-11-10 1999-05-28 Mitsubishi Electric Corp 垂直針型プローブカード用のプローブ針とその製造方法
KR20010017665A (ko) * 1999-08-13 2001-03-05 윤종용 반도체 웨이퍼 검사용 프로브카드 니들
JP2004020209A (ja) * 2002-06-12 2004-01-22 Mitsubishi Electric Corp プローブカード
JP2004069485A (ja) * 2002-08-06 2004-03-04 Yamaha Corp プローブユニットおよびその製造方法、プローブカードおよびその製造方法
JP2004170189A (ja) * 2002-11-19 2004-06-17 Micronics Japan Co Ltd プローブ及びこれを用いた電気的接続装置
KR100602231B1 (ko) * 2004-04-12 2006-07-19 스타 테크놀로지스 인코포레이션 프로브 카드
JP2006041073A (ja) * 2004-07-26 2006-02-09 Seiko Epson Corp プローブカード及びプローブカードを用いた測定方法
JP4087378B2 (ja) * 2004-12-24 2008-05-21 日本電子材料株式会社 プローブカード
JP4536525B2 (ja) * 2005-01-12 2010-09-01 富士通セミコンダクター株式会社 半導体装置の試験装置及び試験方法
JP2007303826A (ja) * 2006-05-08 2007-11-22 Tokyo Electron Ltd プローブ
JP4522975B2 (ja) * 2006-06-19 2010-08-11 東京エレクトロン株式会社 プローブカード
JP5086783B2 (ja) * 2007-12-05 2012-11-28 日本電子材料株式会社 カンチレバー型プローブカード
JP2009236509A (ja) * 2008-03-26 2009-10-15 Fujitsu Microelectronics Ltd プローブカード

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0962776A2 (en) * 1998-06-02 1999-12-08 Advantest Corporation Probe card suitable for inspection of multi-pin devices
US6535003B2 (en) * 1999-01-29 2003-03-18 Advantest, Corp. Contact structure having silicon finger contactor
US20100176829A1 (en) * 2007-07-03 2010-07-15 Advantest Corporation Probe and probe card
TWM361631U (en) * 2009-03-26 2009-07-21 Mpi Corp Cantilever probe card
TW201111792A (en) * 2009-09-17 2011-04-01 Mpi Corp High-frequency cantilever probe card

Also Published As

Publication number Publication date
KR101296523B1 (ko) 2013-08-13
KR20130082046A (ko) 2013-07-18
JP5731432B2 (ja) 2015-06-10
JP2015064382A (ja) 2015-04-09
TW201329456A (zh) 2013-07-16
JP2013142691A (ja) 2013-07-22

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