TWI465562B - Cleaning solution composition and method for cleaning substrate by using the same - Google Patents
Cleaning solution composition and method for cleaning substrate by using the same Download PDFInfo
- Publication number
- TWI465562B TWI465562B TW101111136A TW101111136A TWI465562B TW I465562 B TWI465562 B TW I465562B TW 101111136 A TW101111136 A TW 101111136A TW 101111136 A TW101111136 A TW 101111136A TW I465562 B TWI465562 B TW I465562B
- Authority
- TW
- Taiwan
- Prior art keywords
- weight
- parts
- cleaning liquid
- acid
- liquid composition
- Prior art date
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- 238000004140 cleaning Methods 0.000 title claims description 63
- 239000000203 mixture Substances 0.000 title claims description 54
- 239000000758 substrate Substances 0.000 title claims description 31
- 238000000034 method Methods 0.000 title claims description 27
- 239000007788 liquid Substances 0.000 claims description 43
- 150000007514 bases Chemical class 0.000 claims description 24
- 150000001875 compounds Chemical class 0.000 claims description 24
- 239000002253 acid Substances 0.000 claims description 20
- 239000002736 nonionic surfactant Substances 0.000 claims description 20
- XLYOFNOQVPJJNP-DYCDLGHISA-N deuterium hydrogen oxide Chemical compound [2H]O XLYOFNOQVPJJNP-DYCDLGHISA-N 0.000 claims description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 9
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 claims description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims description 2
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 17
- 150000003839 salts Chemical class 0.000 description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- -1 alkali metal borate Chemical class 0.000 description 13
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical class C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 7
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000002518 antifoaming agent Substances 0.000 description 5
- 239000003963 antioxidant agent Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000003755 preservative agent Substances 0.000 description 5
- 229910021642 ultra pure water Inorganic materials 0.000 description 5
- 239000012498 ultrapure water Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 239000006260 foam Substances 0.000 description 4
- 239000003002 pH adjusting agent Substances 0.000 description 4
- 230000002335 preservative effect Effects 0.000 description 4
- 239000005361 soda-lime glass Substances 0.000 description 4
- QAIPRVGONGVQAS-DUXPYHPUSA-N trans-caffeic acid Chemical compound OC(=O)\C=C\C1=CC=C(O)C(O)=C1 QAIPRVGONGVQAS-DUXPYHPUSA-N 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- ACEAELOMUCBPJP-UHFFFAOYSA-N (E)-3,4,5-trihydroxycinnamic acid Natural products OC(=O)C=CC1=CC(O)=C(O)C(O)=C1 ACEAELOMUCBPJP-UHFFFAOYSA-N 0.000 description 2
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- ATHHXGZTWNVVOU-UHFFFAOYSA-N N-methylformamide Chemical compound CNC=O ATHHXGZTWNVVOU-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 229940074360 caffeic acid Drugs 0.000 description 2
- 235000004883 caffeic acid Nutrition 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- QAIPRVGONGVQAS-UHFFFAOYSA-N cis-caffeic acid Natural products OC(=O)C=CC1=CC=C(O)C(O)=C1 QAIPRVGONGVQAS-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- HQFQTTNMBUPQAY-UHFFFAOYSA-N cyclobutylhydrazine Chemical compound NNC1CCC1 HQFQTTNMBUPQAY-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- MNNHAPBLZZVQHP-UHFFFAOYSA-N diammonium hydrogen phosphate Chemical compound [NH4+].[NH4+].OP([O-])([O-])=O MNNHAPBLZZVQHP-UHFFFAOYSA-N 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 description 2
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000011975 tartaric acid Substances 0.000 description 2
- 235000002906 tartaric acid Nutrition 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- RHUYHJGZWVXEHW-UHFFFAOYSA-N 1,1-Dimethyhydrazine Chemical compound CN(C)N RHUYHJGZWVXEHW-UHFFFAOYSA-N 0.000 description 1
- RGASRBUYZODJTG-UHFFFAOYSA-N 1,1-bis(2,4-ditert-butylphenyl)-2,2-bis(hydroxymethyl)propane-1,3-diol dihydroxyphosphanyl dihydrogen phosphite Chemical compound OP(O)OP(O)O.C(C)(C)(C)C1=C(C=CC(=C1)C(C)(C)C)C(O)(C(CO)(CO)CO)C1=C(C=C(C=C1)C(C)(C)C)C(C)(C)C RGASRBUYZODJTG-UHFFFAOYSA-N 0.000 description 1
- IFZHGQSUNAKKSN-UHFFFAOYSA-N 1,1-diethylhydrazine Chemical compound CCN(N)CC IFZHGQSUNAKKSN-UHFFFAOYSA-N 0.000 description 1
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 1
- 229940058015 1,3-butylene glycol Drugs 0.000 description 1
- NCXUNZWLEYGQAH-UHFFFAOYSA-N 1-(dimethylamino)propan-2-ol Chemical compound CC(O)CN(C)C NCXUNZWLEYGQAH-UHFFFAOYSA-N 0.000 description 1
- PJEXUIKBGBSHBS-UHFFFAOYSA-N 1-(hydroxymethyl)pyrrolidin-2-one Chemical compound OCN1CCCC1=O PJEXUIKBGBSHBS-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- BPOVRAAUERBWFK-UHFFFAOYSA-N 1-hydroxycyclohexane-1-carboxylic acid Chemical compound OC(=O)C1(O)CCCCC1 BPOVRAAUERBWFK-UHFFFAOYSA-N 0.000 description 1
- GQXURJDNDYACGE-UHFFFAOYSA-N 1-hydroxycyclopropane-1-carboxylic acid Chemical compound OC(=O)C1(O)CC1 GQXURJDNDYACGE-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- RUFPHBVGCFYCNW-UHFFFAOYSA-N 1-naphthylamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1 RUFPHBVGCFYCNW-UHFFFAOYSA-N 0.000 description 1
- JMVIVASFFKKFQK-UHFFFAOYSA-N 1-phenylpyrrolidin-2-one Chemical compound O=C1CCCN1C1=CC=CC=C1 JMVIVASFFKKFQK-UHFFFAOYSA-N 0.000 description 1
- WJFKNYWRSNBZNX-UHFFFAOYSA-N 10H-phenothiazine Chemical compound C1=CC=C2NC3=CC=CC=C3SC2=C1 WJFKNYWRSNBZNX-UHFFFAOYSA-N 0.000 description 1
- OWGDCENIOHFPHD-UHFFFAOYSA-N 16,16,16-trihydroxyhexadecanoic acid Chemical compound OC(=O)CCCCCCCCCCCCCCC(O)(O)O OWGDCENIOHFPHD-UHFFFAOYSA-N 0.000 description 1
- IHWDSEPNZDYMNF-UHFFFAOYSA-N 1H-indol-2-amine Chemical class C1=CC=C2NC(N)=CC2=C1 IHWDSEPNZDYMNF-UHFFFAOYSA-N 0.000 description 1
- XHWHHMNORMIBBB-UHFFFAOYSA-N 2,2,3,3-tetrahydroxybutanedioic acid Chemical compound OC(=O)C(O)(O)C(O)(O)C(O)=O XHWHHMNORMIBBB-UHFFFAOYSA-N 0.000 description 1
- OPLCSTZDXXUYDU-UHFFFAOYSA-N 2,4-dimethyl-6-tert-butylphenol Chemical compound CC1=CC(C)=C(O)C(C(C)(C)C)=C1 OPLCSTZDXXUYDU-UHFFFAOYSA-N 0.000 description 1
- DKCPKDPYUFEZCP-UHFFFAOYSA-N 2,6-di-tert-butylphenol Chemical compound CC(C)(C)C1=CC=CC(C(C)(C)C)=C1O DKCPKDPYUFEZCP-UHFFFAOYSA-N 0.000 description 1
- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- ZUAURMBNZUCEAF-UHFFFAOYSA-N 2-(2-phenoxyethoxy)ethanol Chemical compound OCCOCCOC1=CC=CC=C1 ZUAURMBNZUCEAF-UHFFFAOYSA-N 0.000 description 1
- LJDSTRZHPWMDPG-UHFFFAOYSA-N 2-(butylamino)ethanol Chemical compound CCCCNCCO LJDSTRZHPWMDPG-UHFFFAOYSA-N 0.000 description 1
- MIJDSYMOBYNHOT-UHFFFAOYSA-N 2-(ethylamino)ethanol Chemical compound CCNCCO MIJDSYMOBYNHOT-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- HUHGPYXAVBJSJV-UHFFFAOYSA-N 2-[3,5-bis(2-hydroxyethyl)-1,3,5-triazinan-1-yl]ethanol Chemical compound OCCN1CN(CCO)CN(CCO)C1 HUHGPYXAVBJSJV-UHFFFAOYSA-N 0.000 description 1
- MVPRCWFLPDNGNR-UHFFFAOYSA-N 2-[amino(2-hydroxyethyl)amino]ethanol Chemical compound OCCN(N)CCO MVPRCWFLPDNGNR-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- FUKGJAREAJRUBC-UHFFFAOYSA-N 2-hydroperoxy-2-hydroxy-2-phenylacetic acid Chemical compound OOC(O)(C(O)=O)C1=CC=CC=C1 FUKGJAREAJRUBC-UHFFFAOYSA-N 0.000 description 1
- RGMMREBHCYXQMA-UHFFFAOYSA-N 2-hydroxyheptanoic acid Chemical compound CCCCCC(O)C(O)=O RGMMREBHCYXQMA-UHFFFAOYSA-N 0.000 description 1
- 229940100555 2-methyl-4-isothiazolin-3-one Drugs 0.000 description 1
- CFFZDZCDUFSOFZ-UHFFFAOYSA-N 3,4-Dihydroxy-phenylacetic acid Chemical compound OC(=O)CC1=CC=C(O)C(O)=C1 CFFZDZCDUFSOFZ-UHFFFAOYSA-N 0.000 description 1
- DOBCCCCDMABCIV-UHFFFAOYSA-N 3,5-dimethyl-1,3-oxazolidin-2-one Chemical compound CC1CN(C)C(=O)O1 DOBCCCCDMABCIV-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- PYSGFFTXMUWEOT-UHFFFAOYSA-N 3-(dimethylamino)propan-1-ol Chemical compound CN(C)CCCO PYSGFFTXMUWEOT-UHFFFAOYSA-N 0.000 description 1
- OLSDAJRAVOVKLG-UHFFFAOYSA-N 3-hydroxymandelic acid Chemical compound OC(=O)C(O)C1=CC=CC(O)=C1 OLSDAJRAVOVKLG-UHFFFAOYSA-N 0.000 description 1
- VWIIJDNADIEEDB-UHFFFAOYSA-N 3-methyl-1,3-oxazolidin-2-one Chemical compound CN1CCOC1=O VWIIJDNADIEEDB-UHFFFAOYSA-N 0.000 description 1
- MRBKEAMVRSLQPH-UHFFFAOYSA-N 3-tert-butyl-4-hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1 MRBKEAMVRSLQPH-UHFFFAOYSA-N 0.000 description 1
- GUUULVAMQJLDSY-UHFFFAOYSA-N 4,5-dihydro-1,2-thiazole Chemical class C1CC=NS1 GUUULVAMQJLDSY-UHFFFAOYSA-N 0.000 description 1
- SJZRECIVHVDYJC-UHFFFAOYSA-N 4-hydroxybutyric acid Chemical compound OCCCC(O)=O SJZRECIVHVDYJC-UHFFFAOYSA-N 0.000 description 1
- CUYTYLVEYFUAAX-UHFFFAOYSA-N 4-methylbenzenesulfonic acid;sodium Chemical compound [Na].CC1=CC=C(S(O)(=O)=O)C=C1 CUYTYLVEYFUAAX-UHFFFAOYSA-N 0.000 description 1
- 229940100484 5-chloro-2-methyl-4-isothiazolin-3-one Drugs 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 239000004254 Ammonium phosphate Substances 0.000 description 1
- 241000894006 Bacteria Species 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- DWLMIYNUGWGKQW-UHFFFAOYSA-N C(CCC)C=1C(=C(C(=C(C=1)NC1=CC=CC=C1)CCCC)CCCC)CCCC Chemical compound C(CCC)C=1C(=C(C(=C(C=1)NC1=CC=CC=C1)CCCC)CCCC)CCCC DWLMIYNUGWGKQW-UHFFFAOYSA-N 0.000 description 1
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- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 description 1
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- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 description 1
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- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
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- CDYHCLPQXKUDMV-UHFFFAOYSA-N n-decyl-n-phenylaniline Chemical compound C=1C=CC=CC=1N(CCCCCCCCCC)C1=CC=CC=C1 CDYHCLPQXKUDMV-UHFFFAOYSA-N 0.000 description 1
- RQVGZVZFVNMBGS-UHFFFAOYSA-N n-octyl-n-phenylaniline Chemical compound C=1C=CC=CC=1N(CCCCCCCC)C1=CC=CC=C1 RQVGZVZFVNMBGS-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
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- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
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- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 229950000688 phenothiazine Drugs 0.000 description 1
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
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- 238000000206 photolithography Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 239000001508 potassium citrate Substances 0.000 description 1
- 229960002635 potassium citrate Drugs 0.000 description 1
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 1
- 235000011082 potassium citrates Nutrition 0.000 description 1
- WSHYKIAQCMIPTB-UHFFFAOYSA-M potassium;2-oxo-3-(3-oxo-1-phenylbutyl)chromen-4-olate Chemical compound [K+].[O-]C=1C2=CC=CC=C2OC(=O)C=1C(CC(=O)C)C1=CC=CC=C1 WSHYKIAQCMIPTB-UHFFFAOYSA-M 0.000 description 1
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- 238000000926 separation method Methods 0.000 description 1
- JXOHGGNKMLTUBP-HSUXUTPPSA-N shikimic acid Chemical compound O[C@@H]1CC(C(O)=O)=C[C@@H](O)[C@H]1O JXOHGGNKMLTUBP-HSUXUTPPSA-N 0.000 description 1
- JXOHGGNKMLTUBP-JKUQZMGJSA-N shikimic acid Natural products O[C@@H]1CC(C(O)=O)=C[C@H](O)[C@@H]1O JXOHGGNKMLTUBP-JKUQZMGJSA-N 0.000 description 1
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- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
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- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- ISIJQEHRDSCQIU-UHFFFAOYSA-N tert-butyl 2,7-diazaspiro[4.5]decane-7-carboxylate Chemical compound C1N(C(=O)OC(C)(C)C)CCCC11CNCC1 ISIJQEHRDSCQIU-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- OSBSFAARYOCBHB-UHFFFAOYSA-N tetrapropylammonium Chemical compound CCC[N+](CCC)(CCC)CCC OSBSFAARYOCBHB-UHFFFAOYSA-N 0.000 description 1
- WJCNZQLZVWNLKY-UHFFFAOYSA-N thiabendazole Chemical compound S1C=NC(C=2NC3=CC=CC=C3N=2)=C1 WJCNZQLZVWNLKY-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- RIUWBIIVUYSTCN-UHFFFAOYSA-N trilithium borate Chemical compound [Li+].[Li+].[Li+].[O-]B([O-])[O-] RIUWBIIVUYSTCN-UHFFFAOYSA-N 0.000 description 1
- WUUHFRRPHJEEKV-UHFFFAOYSA-N tripotassium borate Chemical compound [K+].[K+].[K+].[O-]B([O-])[O-] WUUHFRRPHJEEKV-UHFFFAOYSA-N 0.000 description 1
- BSVBQGMMJUBVOD-UHFFFAOYSA-N trisodium borate Chemical compound [Na+].[Na+].[Na+].[O-]B([O-])[O-] BSVBQGMMJUBVOD-UHFFFAOYSA-N 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
Landscapes
- Detergent Compositions (AREA)
Description
本發明是有關於一種洗淨液組成物及基板之洗淨方法,且特別是有關於一種針對玻璃基板,具洗淨力佳且消泡性佳之洗淨液組成物。The present invention relates to a cleaning liquid composition and a method for cleaning a substrate, and more particularly to a cleaning liquid composition which is excellent in detergency and good in defoaming property against a glass substrate.
以往,作為電視、個人電腦、鐘錶等液晶顯示用之玻璃基板,如鈉鈣玻璃、硼矽玻璃、矽玻璃、無鹼玻璃等,可經溶融成形工程製得玻璃母板,並切割成任意尺寸以供使用。In the past, as a glass substrate for liquid crystal display such as a television, a personal computer, or a clock, such as soda lime glass, borosilicate glass, bismuth glass, or alkali-free glass, a glass mother board can be obtained by melt forming, and cut into any size. For use.
另外,近年來常用於彩色液晶顯示器、感測器及色分解裝置等之彩色濾光片,亦於透明玻璃基板上形成黑色矩陣及紅、綠、藍之畫素畫像,並使用分散顏料用之感光性樹脂,以一般微影製程(photolithography)製得。In addition, in recent years, color filters for color liquid crystal displays, sensors, and color separation devices have been commonly used, and black matrix and red, green, and blue pixel images have been formed on transparent glass substrates, and dispersed pigments have been used. A photosensitive resin is obtained by a general photolithography.
然而,上述玻璃基板於切割時,玻璃切削粉(glass cullet)常附著於基板上而妨礙後續之精密的研磨製程、膜處理製程等。此外,彩色濾光片於製造時,飛散的微粒或前製程使用的感光性樹脂之殘渣等亦會附著於基板上,其不僅造成製品良率的低下,且當彩色濾光片與TFT array貼合時甚至可能產生共同短路(common short)之情形。However, when the glass substrate is cut, glass cullets often adhere to the substrate to hinder the subsequent precise polishing process, film processing process, and the like. In addition, when the color filter is manufactured, scattered particles or residues of the photosensitive resin used in the pre-process are attached to the substrate, which not only causes the yield of the product to be low, but also when the color filter and the TFT array are attached. It may even be the case of a common short.
因此,上述製程中導入了玻璃基板的洗淨製程,而基板的製造及加工廠商為了提高製造良率,亦致力於洗淨技術的提升。特別是近年來,對於製品高度信賴性的需求,以及彩色濾光片之高精度化的走向,玻璃基板清淨化的要求變得愈來愈高。Therefore, in the above process, the cleaning process of the glass substrate is introduced, and the manufacturer and manufacturer of the substrate are also working to improve the cleaning technology in order to improve the manufacturing yield. In particular, in recent years, the demand for high reliability of products and the trend of high-precision color filters have become increasingly demanding for the purification of glass substrates.
為有效清除上述基板上殘存之附著物,目前業界改善之方式,乃採用特定之洗淨液組成物清洗玻璃基板。日本特開2009-084565號公開特許公報揭示,使用含非離子型界面活性劑、水、特定酸(或其鹽類)及鹼劑之鹼型非離子界面活性劑組成物等。然而,使用上述洗淨液組成物清洗玻璃基板時,仍有洗淨力不佳、消泡性不佳之問題,造成成本提高。In order to effectively remove the remaining deposits on the substrate, the current improvement in the industry is to clean the glass substrate with a specific cleaning liquid composition. Japanese Laid-Open Patent Publication No. 2009-084565 discloses a base type nonionic surfactant composition containing a nonionic surfactant, water, a specific acid (or a salt thereof), and an alkali agent. However, when the glass substrate is cleaned by using the above-described cleaning liquid composition, there is a problem that the detergency is poor and the defoaming property is not good, resulting in an increase in cost.
有鑑於此,亟需提出一種洗淨液組成物及基板之洗淨方法,藉以改善習知之洗淨液組成物洗淨力不佳、消泡性不佳等缺點。In view of the above, there is a need to provide a cleaning liquid composition and a method for cleaning a substrate, thereby improving the disadvantages of poor cleaning power and poor defoaming properties of conventional cleaning liquid compositions.
因此,本發明之一態樣是在提供一種洗淨力佳且消泡性佳之洗淨液組成物,該洗淨液樹脂組成物至少包含鹼性化合物(A)、如式(I)或式(II)所示之非離子型界面活性劑(B)、多羥基羧酸化合物(C)以及水(D)。Therefore, an aspect of the present invention provides a cleaning liquid composition which is excellent in detergency and good in defoaming property, and the cleaning liquid resin composition contains at least a basic compound (A), such as formula (I) or formula The nonionic surfactant (B), the polyhydroxycarboxylic acid compound (C), and water (D) shown in (II).
本發明之另一態樣是在提供一種基板之洗淨方法,其係利用上述洗淨液組成物清洗基板。Another aspect of the present invention provides a method of cleaning a substrate by cleaning the substrate with the cleaning composition.
本發明之洗淨液組成物包括鹼性化合物(A)、如式(I)或式(II)所示之非離子型界面活性劑(B)、多羥基羧酸化合物(C)以及水(D),以下析述之。The cleaning liquid composition of the present invention comprises a basic compound (A), a nonionic surfactant (B) represented by the formula (I) or the formula (II), a polyhydroxycarboxylic acid compound (C), and water ( D), as described below.
本發明之鹼性化合物(A)包含無機鹼性化合物(A-1)及/或有機鹼性化合物(A-2)。The basic compound (A) of the present invention contains an inorganic basic compound (A-1) and/or an organic basic compound (A-2).
上述無機鹼性化合物(A-1)之具體例,如:氫氧化鋰、氫氧化鈉、氫氧化鉀、氫氧化銨等之鹼金屬氫氧化物;磷酸氫二銨、磷酸氫二鈉、磷酸氫二鉀、磷酸二氫銨、磷酸二氫鈉、磷酸二氫鉀等之鹼金屬或銨之磷酸鹽類;矽酸鋰、矽酸鈉、矽酸鉀等之鹼金屬矽酸鹽類;碳酸鋰、碳酸鈉、碳酸鉀等之鹼金屬碳酸鹽類;硼酸鋰、硼酸鈉、硼酸鉀等之鹼金屬硼酸鹽類。其中,以鹼金屬氫氧化物為較佳。上述之無機鹼性化合物(A-1)可以單獨一種使用或者混合複數種使用。Specific examples of the inorganic basic compound (A-1) include alkali metal hydroxides such as lithium hydroxide, sodium hydroxide, potassium hydroxide, and ammonium hydroxide; diammonium hydrogen phosphate, disodium hydrogen phosphate, and phosphoric acid. An alkali metal or ammonium phosphate such as dipotassium hydrogen phosphate, ammonium dihydrogen phosphate, sodium dihydrogen phosphate or potassium dihydrogen phosphate; an alkali metal silicate such as lithium niobate, sodium citrate or potassium citrate; An alkali metal carbonate such as lithium, sodium carbonate or potassium carbonate; or an alkali metal borate such as lithium borate, sodium borate or potassium borate. Among them, an alkali metal hydroxide is preferred. The above inorganic basic compound (A-1) may be used singly or in combination of plural kinds.
本發明之有機鹼性化合物(A-2)包含氫氧四級銨基鹽類化合物及有機胺類之有機鹼性化合物。上述氫氧四級銨基鹽類化合物之具體例,如:氫氧四甲銨(tetramethyl ammonium hydroxide)、氫氧四乙胺、氫氧四丙胺、氫氧四丁胺、2-羥基-氫氧三甲銨(2-hydroxyl trimethyl ammonium hydroxide)等化合物;而有機胺類之具體例如:單甲胺、二甲胺、三甲胺、單乙胺、二乙胺、三乙胺、單異丙胺(monoisopropylamine)、二-異丙胺(di-isopropylamine)、單乙醇胺、二乙醇胺、三乙醇胺、2-(2-胺基乙氧基)乙醇(2-(2-aminoethoxy) ethanol)、單異丙醇胺(monoisopropanol-amine)、二異丙醇胺、三異丙醇胺、正乙基乙醇胺(N-ethyl ethanolamine)、正丁基乙醇胺、N,N-二甲基乙醇胺(N,N-dimethyl ethanolamine)、N,N-二甲基丙醇胺、N,N-二甲基異丙醇胺(N,N-dimethyl isopropanolamine)、環己胺、嗎啉(morpholine)等化合物。上述之有機鹼性化合物(A-2)可以單獨一種使用或者混合複數種使用。The organic basic compound (A-2) of the present invention contains a hydroxy quaternary ammonium salt compound and an organic basic organic compound. Specific examples of the above-mentioned oxyhydrogen quaternary ammonium salt compound are, for example, tetramethyl ammonium hydroxide, tetrahydroammonium hydroxide, tetrapropylamine hydrochloride, tetrabutylamine hydroxide, 2-hydroxy-hydrogen peroxide A compound such as 2-hydroxyl trimethyl ammonium hydroxide; and specific examples of organic amines such as monomethylamine, dimethylamine, trimethylamine, monoethylamine, diethylamine, triethylamine, monoisopropylamine , di-isopropylamine, monoethanolamine, diethanolamine, triethanolamine, 2-(2-aminoethoxy)ethanol, monoisopropanol -amine), diisopropanolamine, triisopropanolamine, N-ethyl ethanolamine, n-butylethanolamine, N,N-dimethylethanolamine, N , N-dimethylpropanolamine, N, N-dimethyl isopropanolamine, cyclohexylamine, morpholine and the like. The above organic basic compound (A-2) may be used singly or in combination of plural kinds.
本發明之有機鹼性化合物(A-2),於製造上因不含有金屬離子,故對於薄膜電晶體等半導體元件較不易產生殘影等不良影響。其中,乃以單乙醇胺、二乙醇胺、三乙醇胺以及單異丙醇胺為較佳。Since the organic basic compound (A-2) of the present invention does not contain metal ions in production, it is less likely to cause adverse effects such as residual images on semiconductor elements such as thin film transistors. Among them, monoethanolamine, diethanolamine, triethanolamine, and monoisopropanolamine are preferred.
本發明之非離子型界面活性劑(B)係具有如式(I)或式(II)所示之結構:The nonionic surfactant (B) of the present invention has a structure as shown in formula (I) or formula (II):
在式(I)及式(II)中,EO為乙氧基;AO為PO及/或BO,PO為丙氧基,且BO為丁氧基;m為3~100之數;n為0~0.2×m之數;p為3~100之數;q為0至0.2×p之數;x為1或2;且y為1或2。In formula (I) and formula (II), EO is ethoxy; AO is PO and/or BO, PO is propoxy, and BO is butoxy; m is from 3 to 100; n is 0. ~0.2×m; p is a number from 3 to 100; q is a number from 0 to 0.2×p; x is 1 or 2; and y is 1 or 2.
其次,在式(I)及式(II)中,m與p為平均加成莫耳數,m與p可互為不同,且n與q可互為不同。當AO為PO時,n與q為PO之平均加成莫耳數;當AO為BO時,n與q為BO之平均加成莫耳數;當AO包含PO及BO時,n與q則為PO之平均加成莫耳數以及BO之平均加成莫耳數的總和。在式(I)之(EO)m (AO)n 以及式(II)之(EO)p (AO)q 中,其各自的EO與AO的排列可為嵌段或隨機。當式(I)及式(II)之AO包含PO及BO時,PO與BO的排列可為嵌段或隨機。EO亦可為嵌段或隨機排列的方式插入由PO及/或BO構成的排列中。上述之平均加成莫耳數可利用1 H-核磁共振光譜儀(1 H-NMR spectroscopy)測定。Next, in the formulas (I) and (II), m and p are the average addition mole numbers, and m and p may be different from each other, and n and q may be different from each other. When AO is PO, n and q are the average addition moles of PO; when AO is BO, n and q are the average addition moles of BO; when AO contains PO and BO, n and q are The sum of the average addition moles of PO and the average addition mole of BO. In (EO) m (AO) n of formula (I) and (EO) p (AO) q of formula (II), the arrangement of their respective EO and AO may be block or random. When the AO of the formula (I) and the formula (II) contains PO and BO, the arrangement of PO and BO may be block or random. EO can also be inserted into an arrangement of PO and/or BO in a block or random arrangement. The above-described average addition molar number may be measured by 1 H- nuclear magnetic resonance spectroscopy (1 H-NMR spectroscopy).
當EO與AO為嵌段排列時,只要各個平均加成莫耳數在上述範圍之內,則EO的嵌段數與AO的嵌段數可分別為1個或分別為2個以上。其次,當EO構成之嵌段數為2個以上時,各嵌段中EO的重複數可互為相同或不同。當EO以嵌段排列的方式插入由PO及/或BO構成的排列時亦然,EO之嵌段數可為1個或2個以上。當EO的嵌段數為2個以上時,各嵌段中EO的重複數可互為相同或不同。When EO and AO are arranged in a block, as long as each of the average addition mole numbers is within the above range, the number of blocks of EO and the number of blocks of AO may be one or two or more, respectively. Next, when the number of blocks composed of EO is two or more, the number of repetitions of EO in each block may be the same or different from each other. When EO is inserted into an arrangement composed of PO and/or BO in a block arrangement, the number of blocks of EO may be one or two or more. When the number of blocks of EO is two or more, the number of repetitions of EO in each block may be the same or different from each other.
當AO包含PO及BO時,PO與BO可為嵌段排列,只要PO的嵌段數與BO的嵌段數之各個平均加成莫耳數在上述範圍內即可,可分別為1個或分別為2個以上。其次,當PO構成之嵌段數為2個以上時,各嵌段中PO的重複數可互為相同或不同。當BO的嵌段數為2個以上時,各嵌段中BO的重複數可互為相同或不同。When AO includes PO and BO, PO and BO may be arranged in blocks, as long as the average number of moles of PO and the number of blocks of BO is within the above range, and may be one or They are two or more. Next, when the number of blocks composed of PO is two or more, the number of repetitions of PO in each block may be the same or different from each other. When the number of blocks of BO is two or more, the number of repetitions of BO in each block may be the same or different from each other.
再者,基於確保非離子型界面活性劑(B)具有適當的水溶性之考量下,式(I)及式(II)構成醚鍵的氧原子(O)以與EO鍵結為較佳。Further, based on the consideration of ensuring that the nonionic surfactant (B) has an appropriate water solubility, the oxygen atom (O) constituting the ether bond of the formula (I) and the formula (II) is preferably bonded to EO.
又,為了提高玻璃基板表面附著之樹脂污垢的剝離性,因此式(I)與式(II)的m與p較佳分別為3至70之數,更佳分別為3至50之數;n較佳為0至0.1×m之數,更佳為0;而q較佳為0至0.1×p之數,更佳為0。Further, in order to improve the peeling property of the resin stain adhered on the surface of the glass substrate, m and p of the formulae (I) and (II) are preferably from 3 to 70, more preferably from 3 to 50, respectively; It is preferably 0 to 0.1 × m, more preferably 0; and q is preferably 0 to 0.1 × p, more preferably 0.
本發明之非離子型界面活性劑(B)中,較佳為m為5至50之數且n為0之聚乙氧基二苯乙烯化苯醚,如聚乙氧基-3,5-雙(1-苯乙基)苯醚(EO個數為13)、聚乙氧基-3,5-雙(1-苯乙基)苯醚(EO個數為19)、聚乙氧基-3,5-雙(1-苯乙基)苯醚(EO個數為64)、商品化之EMULGEN A-60、EMULGEN A-90、EMULGEN A-500(花王製)、Sinopol 607、Sinopol 609、Sinopol 610、Sinopol 614、Sinopol 620、Sinopol 623(中日合成化學製)等;p為5至50之數且q為0之聚乙氧基三芐基化苯醚,如聚乙氧基-2,4,6-三(1-苯甲基)苯醚(EO個數為14)、商品化之EMULGEN B-66(花王製)等。其中,更佳為聚乙氧基-3,5-雙(1-苯乙基)苯醚(EO個數為19)、聚乙氧基-3,5-雙(1-苯乙基)苯醚(EO個數為64)、EMULGEN A-60、EMULGEN A-90、Sinopol 607、Sinopol 609、Sinopol 620、Sinopol 623、聚乙氧基-2,4,6-三(1-苯甲基)苯醚(EO個數為14)以及EMULGEN B-66。In the nonionic surfactant (B) of the present invention, polyethoxylated styrenated phenyl ether having a m of 5 to 50 and n of 0, such as polyethoxy-3,5-, is preferred. Bis(1-phenethyl)phenyl ether (number of EO is 13), polyethoxy-3,5-bis(1-phenethyl)phenyl ether (number of EO is 19), polyethoxy- 3,5-bis(1-phenethyl)phenyl ether (64 number of EO), commercialized EMULGEN A-60, EMULGEN A-90, EMULGEN A-500 (made by Kao), Sinopol 607, Sinopol 609, Sinopol 610, Sinopol 614, Sinopol 620, Sinopol 623 (manufactured by Sino-Japanese Synthetic Chemicals, etc.); p is a polyethoxytribenzylated phenyl ether of 5 to 50 and q is 0, such as polyethoxy-2 4,6-tris(1-phenylmethyl)phenyl ether (the number of EO is 14), and commercialized EMULGEN B-66 (Kinghua). Among them, more preferred is polyethoxy-3,5-bis(1-phenethyl)phenyl ether (number of EO is 19), polyethoxy-3,5-bis(1-phenethyl)benzene Ether (EO number 64), EMULGEN A-60, EMULGEN A-90, Sinopol 607, Sinopol 609, Sinopol 620, Sinopol 623, polyethoxy-2,4,6-tris(1-benzyl) Phenyl ether (14 in EO) and EMULGEN B-66.
上述之非離子型界面活性劑(B)可以單獨一種使用或者混合複數種使用。The above-mentioned nonionic surfactant (B) may be used singly or in combination of plural kinds.
本發明之洗淨液組成物中,基於鹼性化合物(A)100重量份,非離子型界面活性劑(B)之使用量通常為10至300重量份,較佳為15至250重量份,更佳為20至200重量份。若無使用非離子型界面活性劑(B),則會因濕潤性不佳而造成洗淨力不佳之問題。In the cleaning liquid composition of the present invention, the nonionic surfactant (B) is used in an amount of usually 10 to 300 parts by weight, preferably 15 to 250 parts by weight, based on 100 parts by weight of the basic compound (A). More preferably, it is 20 to 200 parts by weight. If the nonionic surfactant (B) is not used, there is a problem that the detergency is poor due to poor wettability.
本發明之多羥基羧酸化合物(C)可包含2個或2個以上之羥基,例如酒石酸(鹽)、甘油酸(鹽)、咖啡酸(鹽)(caffeic acid)、二羥基苯甲酸(dihydroxy-benzoic acid)、二羥基苯乙酸(鹽)(dihydroxyphenylacetic acid)、3-羥基苯乙醇酸(鹽)、二羥基-2-二萘甲酸(鹽)(3,5-dihydroxy-2-naphthalenecarboxylic acid)等包含2個羥基之多羥基羧酸化合物;沒食子酸(鹽)、莽草酸(鹽)(shikimic acid)、三羥基棕櫚酸(鹽)(trihydroxy palmitic acid)、二羥基苯乙醇酸(鹽)等包含3個羥基之多羥基羧酸化合物;黏液酸(鹽)(mucic acid)、氨基葡萄糖酸(鹽)、二羥基酒石酸(鹽)、阿糖酸(鹽)等包含4個羥基之多羥基羧酸化合物;葡萄糖酸(鹽)(gluconic acid)、半乳糖酸(鹽)(galactonic acid)、葡庚糖酸(鹽)(glucoheptonic acid)等鹼金屬鹽或低級胺鹽等包含5個羥基以上之多羥基羧酸化合物。The polyhydroxycarboxylic acid compound (C) of the present invention may contain two or more hydroxyl groups such as tartaric acid (salt), glyceric acid (salt), caffeic acid (caffeic acid), dihydroxybenzoic acid (dihydroxybenzoic acid). -benzoic acid), dihydroxyphenylacetic acid, 3-hydroxyphenylglycolic acid (salt), 3,5-dihydroxy-2-naphthalenecarboxylic acid (3,5-dihydroxy-2-naphthalenecarboxylic acid) a polyhydroxycarboxylic acid compound containing two hydroxyl groups; gallic acid (salt), shikimic acid, trihydroxy palmitic acid, dihydroxyphenyl glycolic acid (salt) a polyhydroxycarboxylic acid compound containing three hydroxyl groups; mucic acid, glucosinolate, dihydroxytartaric acid (salt), and arabinic acid (salt), etc., containing 4 hydroxyl groups a hydroxycarboxylic acid compound; an alkali metal salt such as gluconic acid, galactonic acid, glucoheptonic acid or a lower amine salt or the like containing 5 hydroxyl groups The above polyhydroxycarboxylic acid compound.
上述之多羥基羧酸化合物(C)可以單獨一種使用或者混合複數種使用。The above polyhydroxycarboxylic acid compound (C) may be used singly or in combination of plural kinds.
基於鹼性化合物(A)100重量份,多羥基羧酸化合物(C)的使用量通常為10重量份至300重量份,較佳為15重量份至250重量份,更佳為20重量份至200重量份。若無使用多羥基羧酸化合物(C),則會有泡沫過多造成水垢容易累積之問題。當多羥基羧酸化合物(C)含3個或3個以上之羥基時,則可進一步提升消泡性,並減緩水垢的產生。The polyhydroxycarboxylic acid compound (C) is used in an amount of usually 10 parts by weight to 300 parts by weight, based on 100 parts by weight of the basic compound (A), preferably 15 parts by weight to 250 parts by weight, more preferably 20 parts by weight to 200 parts by weight. If the polyhydroxycarboxylic acid compound (C) is not used, there is a problem that too much foam causes the scale to easily accumulate. When the polyhydroxycarboxylic acid compound (C) contains 3 or more hydroxyl groups, the defoaming property can be further enhanced and the scale generation can be slowed down.
另外,在不影響本發明之洗淨液的消泡性質下,亦可選擇性併用單羥基羧酸化合物,其具體例如:乳酸(鹽)、蘋果酸(鹽)、檸檬酸(鹽)、水楊酸(鹽)、乙醇酸(鹽)、羥基丁酸(鹽)、羥基庚酸(鹽)、羥基辛酸(鹽)、羥基壬酸(鹽)、羥基癸酸(鹽)、羥基苯乙酸(鹽)、羥基苯丙酸(鹽)、羥基環丙烷羧酸(鹽)、羥基環己烷羧酸(鹽)等。Further, the monohydroxycarboxylic acid compound may be optionally used in combination with the antifoaming property of the cleaning liquid of the present invention, and specific examples thereof include lactic acid (salt), malic acid (salt), citric acid (salt), and water. Salicylic acid, salt, hydroxybutyric acid, hydroxyheptanoic acid, hydroxyoctanoic acid Salt), hydroxyphenylpropionic acid (salt), hydroxycyclopropanecarboxylic acid (salt), hydroxycyclohexanecarboxylic acid (salt), and the like.
本發明中所使用的水(D)並無特別限制。其具體例如:蒸餾水、純水(經離子交換樹脂等行脫鹽處理而得之水)、超純水(除無機離子外,不含有機物、生菌、微粒子及溶解氣體)及近年來被提案之各種機能水等。基於金屬離子對電子控制迴路具不佳影響,本發明中所使用的水(D)較佳為純水或超純水,更佳為超純水。其中,上述超純水可藉由將自來水通過活性碳、離子交換處理、蒸餾處理後,必要時以紫外光照射殺菌,或者通過過濾器而得。根據25℃之電阻值來區分,電阻值在1MΩ‧cm以上即可稱為純水,電阻值在10MΩ‧cm以上即可稱為超純水。The water (D) used in the present invention is not particularly limited. Specific examples thereof include distilled water, pure water (water obtained by deionization treatment by ion exchange resin, etc.), ultrapure water (excluding inorganic ions, containing no organic matter, bacteria, fine particles, and dissolved gas) and have been proposed in recent years. Various functional waters, etc. The water (D) used in the present invention is preferably pure water or ultrapure water, more preferably ultrapure water, based on the metal ion having a poor influence on the electronic control circuit. The ultrapure water may be obtained by passing the tap water through activated carbon, ion exchange treatment, distillation treatment, irradiation with ultraviolet light if necessary, or passing through a filter. According to the resistance value of 25 °C, the resistance value is 1MΩ‧cm or more, which can be called pure water, and the resistance value is 10MΩ‧cm or more, which can be called ultrapure water.
本發明之洗淨液組成物中,基於鹼性化合物(A)100重量份,水(D)之使用量通常為300重量份至25,000重量份,較佳為400重量份至20,000重量份,更佳為500重量份至15,000重量份。當水(D)之使用量介於300重量份至25,000重量份時,較不易有洗劑殘留及洗淨力下降之問題。In the cleaning liquid composition of the present invention, water (D) is usually used in an amount of from 300 parts by weight to 25,000 parts by weight, based on 100 parts by weight of the basic compound (A), preferably from 400 parts by weight to 20,000 parts by weight, more preferably It is preferably from 500 parts by weight to 15,000 parts by weight. When the amount of water (D) used is from 300 parts by weight to 25,000 parts by weight, there is a problem that the lotion remains and the detergency is lowered.
本發明之洗淨液組成物可進一步選擇性加入添加劑(E),例如:pH調整劑、有機溶劑、消泡劑、抗氧化劑、防腐劑等。The cleaning liquid composition of the present invention may further optionally be added with an additive (E) such as a pH adjuster, an organic solvent, an antifoaming agent, an antioxidant, a preservative, or the like.
上述pH調整劑之具體例如:鹽酸、硫酸、硝酸、磺胺酸、磷酸等之無機酸;氫氧化鋰、氫氧化鈉、氫氧化鉀等之無機鹼等。上述之pH調整劑可單獨一種或混合複數種以上使用。Specific examples of the pH adjuster include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid, sulfamic acid, and phosphoric acid; and inorganic bases such as lithium hydroxide, sodium hydroxide, and potassium hydroxide. The above-mentioned pH adjusters may be used singly or in combination of plural kinds or more.
上述之有機溶劑以於20℃時對水之溶解度以3(g/100g)以上為佳,然以10以上為更佳,其具體例如:二甲基亞碸、環丁碸、3-甲基環丁碸、2,4-二甲基環丁碸等之亞碸類;二甲碸、二乙碸、雙(2-羥乙基)碸等之碸類;N,N-二甲基甲醯胺、N-甲基甲醯胺、N,N-二甲基乙醯胺、N,N-二甲基丙酼胺等之醯胺類;N-甲基-2-吡咯烷酮、N-乙基-2-吡咯烷酮、N-羥甲基-2-吡咯烷酮等之內醯胺類;β-丙內酯、β-丁內酯、γ-丁內酯、γ-戊內酯、δ-戊內酯等之內酯類;甲醇、乙醇、異丙醇等之醇類;乙二醇、乙二醇單甲基醚、乙二醇單乙基醚、二乙二醇、二乙二醇單甲基醚、二乙二醇單乙基醚、二乙二醇單丁基醚、二乙二醇單己基醚、二乙二醇單苯基醚、三乙二醇單甲基醚、丙二醇、丙二醇單甲基醚、二丙二醇單甲基醚、1,3-丁二醇、二乙二醇二甲基醚、二乙二醇二乙基醚、三乙二醇二甲基醚、三乙二醇三乙基醚等之乙二醇及乙二醇醚類;N-甲基-2-噁唑烷酮、3,5-二甲基-2-噁唑烷酮等之噁唑烷酮(oxazolidinone)類;乙腈、丙腈、丁腈、丙烯腈、甲基丙烯腈、苯甲腈等之腈(nitrile)類;碳酸鹽類;(碳酸乙烯酯、碳酸丙烯酯等);丙酮、二乙酮、苯乙酮、甲乙酮、環己酮、環戊酮、二丙酮醇等之酮類;四氫呋喃、四氫吡喃等之環醚類等。上述之有機溶劑可單獨一種或混合複數種以上使用。The above organic solvent preferably has a solubility in water of 3 (g/100 g) or more at 20 ° C, more preferably 10 or more, and specifically, for example, dimethyl sulfoxide, cyclobutyl hydrazine, and 3-methyl group. Anthraquinones such as cyclobutyl hydrazine and 2,4-dimethylcyclobutyl hydrazine; hydrazines such as dimethyl hydrazine, diethyl hydrazine, and bis(2-hydroxyethyl) hydrazine; N, N-dimethyl group Amidoxime, N-methylformamide, N,N-dimethylacetamide, N,N-dimethylpropionamide, etc.; N-methyl-2-pyrrolidone, N-B Indoleamines such as phenyl-2-pyrrolidone and N-hydroxymethyl-2-pyrrolidone; β-propiolactone, β-butyrolactone, γ-butyrolactone, γ-valerolactone, δ-pentane Lactones such as esters; alcohols such as methanol, ethanol, isopropanol; ethylene glycol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, diethylene glycol, diethylene glycol monomethyl Ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol monophenyl ether, triethylene glycol monomethyl ether, propylene glycol, propylene glycol Monomethyl ether, dipropylene glycol monomethyl ether, 1,3-butylene glycol, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, triethylene glycol II Ethylene glycol and glycol ethers such as alkyl ether, triethylene glycol triethyl ether, etc.; N-methyl-2-oxazolidinone, 3,5-dimethyl-2-oxazolidinone, etc. Oxazoldinone; nitrile, nitrile, acrylonitrile, methacrylonitrile, benzonitrile, etc.; carbonates; (ethylene carbonate, propylene carbonate, etc.) a ketone of acetone, diethyl ketone, acetophenone, methyl ethyl ketone, cyclohexanone, cyclopentanone, diacetone or the like; a cyclic ether such as tetrahydrofuran or tetrahydropyran. The above organic solvents may be used singly or in combination of plural kinds or more.
上述消泡劑之具體例如:聚矽氧系、高級醇系、聚醚系、脂肪酸酯系、聚乙二醇系、礦物油系及包含下述結構式(III)所表示之化合物:Specific examples of the antifoaming agent include polyoxymethylene, higher alcohol, polyether, fatty acid ester, polyethylene glycol, mineral oil, and a compound represented by the following structural formula (III):
在式(III)中,z表示1或2之整數,R表示下述式(IV)所表示之官能基:In the formula (III), z represents an integer of 1 or 2, and R represents a functional group represented by the following formula (IV):
在式(IV)中,w表示3至7之整數。In the formula (IV), w represents an integer of from 3 to 7.
上述之結構式(III)所表示之化合物之具體例如:商品名Surfynol MD-20、Surfynol MD-30(Air Products and Chemicals公司製)。Specific examples of the compound represented by the above structural formula (III) are, for example, trade name Surfynol MD-20, Surfynol MD-30 (manufactured by Air Products and Chemicals Co., Ltd.).
上述之消泡劑可單獨一種或混合複數種以上使用。The above antifoaming agents may be used singly or in combination of plural kinds or more.
上述抗氧化劑之具體例如:2,6-二-第三丁基苯酚、2-第三丁基-4-甲氧基苯酚、2,4-二甲基-6-第三丁基苯酚等之苯酚系;單辛基二苯胺、單壬基二苯胺、4,4’-二丁基二苯胺、4,4’-二戊基二苯胺、四丁基二苯胺、四己基二苯胺、α-萘胺、苯基-α-萘胺等之胺系;吩噻嗪(phenothiazine)、季戊四醇四(3-月桂基硫代丙酸酯)、雙(3,5-第三丁基-4-羥基芐基)硫醚(bis(3,5-t-butyl-4-hydroxybenzyl)sulfide)等之硫系;二亞磷酸雙(2,4-二-第三丁基苯基)季戊四醇酯、亞磷酸一苯二異葵酯、亞磷酸二苯二異辛酯、亞磷酸三苯酯等之磷系等。上述之抗氧化劑可單獨一種或混合複數種以上使用。Specific examples of the above antioxidant include 2,6-di-tert-butylphenol, 2-tert-butyl-4-methoxyphenol, and 2,4-dimethyl-6-tert-butylphenol. Phenol; monooctyldiphenylamine, monodecyldiphenylamine, 4,4'-dibutyldiphenylamine, 4,4'-dipentyldiphenylamine, tetrabutyldiphenylamine, tetrahexyldiphenylamine, α- An amine group such as naphthylamine or phenyl-α-naphthylamine; phenothiazine, pentaerythritol tetrakis(3-laurylthiopropionate), bis(3,5-t-butyl-4-hydroxyl) Sulfur based on bis(3,5-t-butyl-4-hydroxybenzylsulfide); bis(2,4-di-t-butylphenyl)pentaerythritol diphosphite, phosphorous acid A phosphorus system such as monophenylisoyl ketone, diphenyl diisooctyl phosphite, or triphenyl phosphite. The above-mentioned antioxidants may be used singly or in combination of plural kinds or more.
上述防腐劑之具體例如:六氫-1,3,5-三(羥乙基)-s-三嗪等之三嗪(triazine)衍生物;1,2-苯並異噻唑啉-3-酮、2-甲基-4-異噻唑啉-3-酮、5-氯-2-甲基-4-異噻唑啉-3-酮等之異噻唑啉(isothiazolin)衍生物;4-(2-硝基丁基)嗎啉、4,4-(2-乙基-2-硝基三亞甲基)二嗎啉等之嗎啉衍生物;2-(4-噻唑基)苯並咪唑等之苯並咪唑(benzimidazole)衍生物等。上述之防腐劑可單獨一種或混合複數種以上使用。Specific examples of the above preservative include triazine derivatives such as hexahydro-1,3,5-tris(hydroxyethyl)-s-triazine; 1,2-benzisothiazolin-3-one , isothiazolin derivatives such as 2-methyl-4-isothiazolin-3-one, 5-chloro-2-methyl-4-isothiazolin-3-one; 4-(2- a morpholine derivative such as nitrobutyl)morpholine or 4,4-(2-ethyl-2-nitrotrimethylene)dimorpholine; benzene such as 2-(4-thiazolyl)benzimidazole And benzimidazole derivatives and the like. The above-mentioned preservatives may be used singly or in combination of plural kinds or more.
本發明之洗淨液組成物中,基於鹼性化合物(A)100重量份,添加劑(F)之使用量視種類而異;消泡劑之使用量通常為1重量份至10重量份,較佳為2重量份至9重量份,更佳為3重量份至8重量份;抗氧化劑、及防腐劑之使用量通常為10重量份以下,較佳為8重量份以下,更佳為5重量份以下;pH調整劑之使用量通常為90重量份以下,較佳為85重量份以下,更佳為80重量份以下;有機溶劑之使用量通常為500重量份以下,較佳為400重量份以下,更佳為300重量份以下。In the cleaning liquid composition of the present invention, the amount of the additive (F) to be used varies depending on the type of the basic compound (A), and the amount of the antifoaming agent is usually from 1 part by weight to 10 parts by weight. It is preferably 2 parts by weight to 9 parts by weight, more preferably 3 parts by weight to 8 parts by weight; the antioxidant and the preservative are usually used in an amount of 10 parts by weight or less, preferably 8 parts by weight or less, more preferably 5 parts by weight. The amount of the pH adjusting agent used is usually 90 parts by weight or less, preferably 85 parts by weight or less, more preferably 80 parts by weight or less; and the organic solvent is usually used in an amount of 500 parts by weight or less, preferably 400 parts by weight or less. Hereinafter, it is more preferably 300 parts by weight or less.
本發明之洗淨液組成物在25℃時之表面張力通常為25 dyne/cm至60 dyne/cm,較佳為25 dyne/cm至50 dyne/cm,更佳為25 dyne/cm至40 dyne/cm。當洗淨液組成物在25℃時之表面張力為25 dyne/cm至60 dyne/cm時,則有濕潤性佳、洗淨力強之優點。The surface tension of the cleaning composition of the present invention at 25 ° C is usually 25 dyne / cm to 60 dyne / cm, preferably 25 dyne / cm to 50 dyne / cm, more preferably 25 dyne / cm to 40 dyne /cm. When the surface tension of the cleaning liquid composition at 25 ° C is 25 dyne / cm to 60 dyne / cm, there is an advantage of good wettability and strong detergency.
本發明之洗淨液組成物的製備,一般係將上述鹼性化合物(A)、非離子型界面活性劑(B)、多羥基羧酸化合物(C)以及水(D),並可視需要添加pH調整劑、有機溶劑、消泡劑、抗氧化劑、防腐劑等添加劑(E),於攪拌器中攪拌,使其均勻混合成溶液狀態,即可獲得洗淨液組成物。The preparation of the cleaning liquid composition of the present invention generally comprises the above basic compound (A), a nonionic surfactant (B), a polyhydroxycarboxylic acid compound (C), and water (D), and may be added as needed. The additive (E) such as a pH adjuster, an organic solvent, an antifoaming agent, an antioxidant, and a preservative is stirred in a stirrer to uniformly mix it into a solution state, thereby obtaining a cleaning liquid composition.
本發明進一步提供一種基板之洗淨方法,該洗淨方法係使用前述所得之洗淨液組成物清洗基板;具體的洗淨手段包括但不限於浸泡法、沖淋法、刷洗法、超音波洗淨法及泡沫洗淨法等方法。其中,浸泡法係於浸泡槽內填滿洗淨液組成物,再將基板浸入洗淨液組成物內;沖淋法係將洗淨液組成物以沖淋、噴霧、噴射等方式清洗基板;刷洗法係將洗淨液組成物利用海綿、刷子等工具對基板進行清洗。The present invention further provides a method for cleaning a substrate, which is to clean the substrate by using the cleaning composition obtained as described above; the specific cleaning means include, but are not limited to, a soaking method, a shower method, a brushing method, and an ultrasonic washing method. Net method and foam washing method. Wherein, the immersion method is filled in the immersion tank with the composition of the cleaning liquid, and then the substrate is immersed in the composition of the cleaning liquid; the rinsing method washes the substrate by washing, spraying, spraying, etc.; In the brushing method, the substrate is cleaned by a tool such as a sponge or a brush.
本發明之洗淨液組成物,可應用於鈉鈣玻璃、硼矽玻璃、二氧化矽玻璃及無鹼玻璃等玻璃基板的洗淨。The cleaning liquid composition of the present invention can be applied to the cleaning of a glass substrate such as soda lime glass, borosilicate glass, cerium oxide glass or alkali-free glass.
以下利用數個實施方式以說明本發明之應用,然其並非用以限定本發明,本發明技術領域中具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾。The following embodiments are used to illustrate the application of the present invention, and are not intended to limit the present invention. Those skilled in the art can make various changes without departing from the spirit and scope of the present invention. Retouching.
以下係根據第1表製備實施例1至9以及比較例1至4之洗淨液組成物。Hereinafter, the cleaning liquid compositions of Examples 1 to 9 and Comparative Examples 1 to 4 were prepared according to Table 1.
將100重量份的氫氧化鉀(potassium hydroxide,以下簡稱A-1)、80重量份的聚乙氧基-3,5-雙(1-苯乙基)苯醚(EO個數為19;以下簡稱B-1)、150重量份的酒石酸(以下簡稱C-1)以及3000重量份之水。上述各成份以搖動式攪拌器混合均勻,即可獲得洗淨液組成物。所得之洗淨液組成物以下列各評價方式進行評價,其結果如第1表所述,其中表面張力、洗淨力以及消泡性的檢測方法容後再述。100 parts by weight of potassium hydroxide (hereinafter referred to as A-1) and 80 parts by weight of polyethoxy-3,5-bis(1-phenethyl)phenyl ether (the number of EO is 19; Abbreviated as B-1), 150 parts by weight of tartaric acid (hereinafter referred to as C-1) and 3000 parts by weight of water. The above components are uniformly mixed by a rocking stirrer to obtain a cleaning liquid composition. The obtained cleaning liquid composition was evaluated by the following evaluation methods, and the results are as described in Table 1, in which the method of detecting surface tension, detergency, and defoaming property will be described later.
實施例2至9Examples 2 to 9
同實施例1之洗淨液組成物的製作方法,不同處在於實施例2至9係改變洗淨液組成物中原料的種類及使用量,其配方以及檢測結果如第1表所示,此處不另贅述。The method for preparing the cleaning liquid composition of the first embodiment differs in that the examples 2 to 9 change the type and amount of the raw material in the cleaning liquid composition, and the formulation and the detection result are as shown in the first table. No further details are given.
比較例1至4Comparative Examples 1 to 4
同實施例1洗淨液組成物的製作方法,不同處在於比較例1至4所製得之洗淨液組成物並未同時使用非離子型界面活性劑(B)及多羥基羧酸化合物(C),其配方及檢測結果亦如第1表所示。The method for preparing the cleaning liquid composition of the first embodiment is different in that the cleaning liquid composition prepared in the comparative examples 1 to 4 does not simultaneously use the nonionic surfactant (B) and the polyhydroxycarboxylic acid compound ( C), the formulation and test results are also shown in Table 1.
1.表面張力:1. Surface tension:
以恆溫水槽控制洗淨液組成物在25℃,並使用表面張力儀(Tensiometer Model CBVP-A2,協和界面科學製)量測表面張力。(單位:dyne/cm)。測量所得之表面張力如第1表之所述。The composition of the washing liquid was controlled at 25 ° C with a constant temperature water bath, and the surface tension was measured using a surface tension meter (Tensiometer Model CBVP-A2, manufactured by Kyowa Interface Science Co., Ltd.). (Unit: dyne/cm). The surface tension measured was as described in Table 1.
2.洗淨力2. Detergency
將鈉鈣玻璃(Soda Lime Glass)粉碎,並將碎粉(粒徑介於10μm至100μm)均勻分散於水中後,塗佈於一玻璃基板上(20mm×100mm)。接著,於110℃下乾燥30分鐘後,浸泡在洗淨液組成物中,並以恆溫水槽控制在25℃。於浸泡3分鐘後,以500mL純水洗淨,然後以高壓空氣吹乾。之後,利用以顯微鏡(放大倍率為50倍)觀察玻璃基板之表面狀態,並根據以下基準進行評價:Soda lime glass (Soda Lime Glass) was pulverized, and the ground powder (particle size of 10 μm to 100 μm) was uniformly dispersed in water, and then coated on a glass substrate (20 mm × 100 mm). Next, after drying at 110 ° C for 30 minutes, it was immersed in the composition of the cleaning liquid, and controlled at 25 ° C with a constant temperature water bath. After soaking for 3 minutes, it was washed with 500 mL of pure water and then blown dry with high pressure air. Thereafter, the surface state of the glass substrate was observed with a microscope (magnification: 50 times), and evaluated according to the following criteria:
○:無切削粉殘留。○: No cutting powder remains.
╳:有明顯的切削粉殘留。╳: There is obvious residue of cutting powder.
3.消泡性3. Defoaming
取50mL之實施例1至9以及比較例1至4所製得之各種洗淨液組成物,倒入100mL量筒,上下震盪20回後,量測泡沫高度(T1),靜置30秒後,再次量測泡沫高度(T2),並根據下式(III)進行評價:50 mL of the various cleaning liquid compositions prepared in Examples 1 to 9 and Comparative Examples 1 to 4 were poured into a 100 mL measuring cylinder, and after shaking up and down for 20 times, the foam height (T1) was measured, and after standing for 30 seconds, The foam height (T2) was measured again and evaluated according to the following formula (III):
消泡率(%)=[(T1-T2)/(T1)]×100 (V)Defoaming rate (%) = [(T1-T2) / (T1)] × 100 (V)
◎:90%≦消泡率。◎: 90% ≦ defoaming rate.
○:80%≦消泡率<90%。○: 80% ≦ defoaming rate <90%.
△:50%≦消泡率<80%。△: 50% ≦ defoaming rate <80%.
╳:消泡率<50%。╳: Defoaming rate <50%.
前述實施例所得之洗淨液組成物,其表面張力、洗淨力以及消泡性之評估結果如第1表所示。The evaluation results of the surface tension, the detergency and the defoaming property of the cleaning liquid composition obtained in the above examples are shown in Table 1.
由第1表之結果可知,當同時使用非離子型界面活性劑(B)及多羥基羧酸化合物(C),所製得的洗淨液組成物具有較佳的洗淨力與較佳的消泡性。其次,當同時使用非離子型界面活性劑(B)及含有3個羥基之多羥基羧酸化合物(C)時,可獲致更佳的消泡性,故確實可達到本發明之目的。As is apparent from the results of the first table, when the nonionic surfactant (B) and the polyhydroxycarboxylic acid compound (C) are used at the same time, the prepared cleaning liquid composition has better detergency and is preferable. Defoaming. Secondly, when the nonionic surfactant (B) and the polyhydroxycarboxylic acid compound (C) having three hydroxyl groups are used at the same time, better defoaming property can be obtained, so that the object of the present invention can be attained.
比較例5Comparative Example 5
此外,取100重量份的氫氧化鉀、83重量份的非離子型界面活性劑(商品名EMALGEN LS-110;花王製)、83重量份的對甲苯磺酸鈉(sodium p-toluenesulfonic acid)以及3900重量份之水。上述各成份以搖動式攪拌器混合均勻,即可獲得洗淨液組成物,所得之洗淨液組成物亦以上列各評價方式進行評價。以上述各評價方式進行效能評估後,所得之洗淨力以及消泡性皆為╳。Further, 100 parts by weight of potassium hydroxide, 83 parts by weight of a nonionic surfactant (trade name: EMALGEN LS-110; manufactured by Kao), 83 parts by weight of sodium p-toluenesulfonic acid, and 3900 parts by weight of water. Each of the above components was uniformly mixed by a rocking stirrer to obtain a cleaning liquid composition, and the obtained cleaning liquid composition was also evaluated by the above evaluation methods. After the performance evaluation by the above evaluation methods, the obtained detergency and defoaming properties were all ╳.
需補充的是,本發明雖以特定的化合物、組成、反應條件、製程、分析方法或特定儀器作為例示,說明本發明之洗淨液組成物及基板之洗淨方法,惟本發明所屬技術領域中任何具有通常知識者可知,本發明並不限於此,在不脫離本發明之精神和範圍內,本發明之洗淨液組成物及基板之洗淨方法亦可使用其他的化合物、組成、反應條件、製程、分析方法或儀器進行。It should be noted that the present invention describes the cleaning liquid composition and the substrate cleaning method of the present invention by using specific compounds, compositions, reaction conditions, processes, analytical methods or specific instruments as an example, but the technical field to which the present invention pertains It is to be understood by those skilled in the art that the present invention is not limited thereto, and other compounds, compositions, and reactions may be used in the cleaning composition and substrate cleaning method of the present invention without departing from the spirit and scope of the present invention. Conditions, processes, analytical methods or instruments.
雖然本發明已以實施方式揭露如上,然其並非用以限定本發明,在本發明所屬技術領域中任何具有通常知識者,在不脫離本發明之精神和範圍內,當可作各種之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。The present invention has been disclosed in the above embodiments, and is not intended to limit the present invention. Any one of ordinary skill in the art to which the present invention pertains can make various changes without departing from the spirit and scope of the invention. The scope of protection of the present invention is therefore defined by the scope of the appended claims.
Claims (7)
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0397407B1 (en) * | 1989-05-12 | 1993-04-07 | Fuji Photo Film Co., Ltd. | Lithographic plate finisher |
| CN1225529C (en) * | 1999-04-20 | 2005-11-02 | 关东化学株式会社 | Base board cleaning liquid of electronic material |
| US20090197786A1 (en) * | 2006-07-31 | 2009-08-06 | Reckitt Benckiser (Uk) Limited | Hard Surface Cleaning Compositions |
| US7888300B2 (en) * | 2008-03-19 | 2011-02-15 | Fujifilm Corporation | Cleaning liquid for semiconductor device and cleaning method |
| US20110039748A1 (en) * | 2007-12-10 | 2011-02-17 | Reckitt Benckiser Inc. | Hob Cleaning Composition |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY156416A (en) * | 2007-09-14 | 2016-02-26 | Kao Corp | Alkali-type nonionic surfactant composition |
| CN102134529B (en) * | 2010-01-21 | 2012-11-28 | 奇美实业股份有限公司 | Cleaning solution composition for cleaning solar cell substrates |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0397407B1 (en) * | 1989-05-12 | 1993-04-07 | Fuji Photo Film Co., Ltd. | Lithographic plate finisher |
| CN1225529C (en) * | 1999-04-20 | 2005-11-02 | 关东化学株式会社 | Base board cleaning liquid of electronic material |
| US20090197786A1 (en) * | 2006-07-31 | 2009-08-06 | Reckitt Benckiser (Uk) Limited | Hard Surface Cleaning Compositions |
| US20110039748A1 (en) * | 2007-12-10 | 2011-02-17 | Reckitt Benckiser Inc. | Hob Cleaning Composition |
| US7888300B2 (en) * | 2008-03-19 | 2011-02-15 | Fujifilm Corporation | Cleaning liquid for semiconductor device and cleaning method |
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| CN103361206B (en) | 2014-12-24 |
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