TWI460115B - Wafer handling unit and probe station including the same - Google Patents

Description

Wafer handling unit and probe station including the same

The present invention relates to a wafer handling unit and a probe station including the wafer handling unit, and more particularly to a wafer handling unit for transporting a wafer from a wafer cassette to a wafer tray. And a probe station including one of the wafer transfer units.

Generally, a probe station includes a loading unit and a detecting unit. The loading unit is used to carry a wafer having a plurality of wafers formed thereon, and the loading unit pre-arranges the wafer. After receiving the wafer from the loading unit, the detecting unit electrically connects the wafer so that a tester can test the electrical characteristics of the wafer.

The loading unit is used to take out a wafer from a wafer cassette in which a plurality of wafers are continuously stacked and the wafer is transferred to the detecting unit.

The detecting unit comprises a wafer tray and a wafer adjusting component. The wafer disk is moved axially with x-y-z three-dimensional coordinates and rotated to direct the wafer toward a probe card through which each wafer can be electrically connected to a tester. In addition, when the wafer is loaded with the wafer, the wafer adjustment component can adjust the position of the wafer so that the position of the wafer and the probe card can correspond to each other.

At this time, the inside of the loading unit and the detecting unit must be kept clean to a considerable extent. Therefore, it is necessary to efficiently remove the particles inside the loading unit and the detecting unit. It is worth noting that when the probe station is used to test a plurality of wafers formed on a wafer and applied to a complementary metal-oxide semiconductor (CMOS) image sensing device, it is highly clean. The environment is necessary.

Embodiments of the present invention provide a wafer handling unit that can effectively remove particles on a wafer.

In addition, embodiments of the present invention provide a probe station that includes the wafer handling unit and that removes particles on a wafer.

According to an embodiment of the invention, a wafer handling unit includes: a rotating disk; a carrying arm disposed above the rotating disk for carrying a wafer; and a driving portion disposed under the rotating disk for linear Moving the carrying arm; and a cover covering the rotating disk and the carrying arm, and including a first through hole through which a cleaning gas flows downward through the first through hole. In addition, the driving portion includes: an engine rotatably coupled to a bottom surface of the rotating disk; a driving pulley mechanically engaged with the engine; and a transmission pulley rotatably fixed to the rotating disk The bottom surface; and a driving belt for coupling the driving pulley to the driving pulley and connecting the carrying arm to linearly move the carrying arm.

In an embodiment of the invention, the wafer handling unit further includes a detecting disk disposed between the rotating disk and the cover. The detecting disk includes a precision sensing component for detecting a wafer. One of the wafers in the cartridge to determine the presence of the wafer in the wafer cassette. In addition, the detecting disk includes a second through hole adjacent to the first through hole, so that the cleaning gas smoothly flows through the wafer. In addition, the wafer handling unit further includes a negative ion air purifier disposed at an edge of the detecting disk, and the negative ion air purifier removes static charge between the wafer and the particles.

According to an embodiment of the invention, a probe station includes: a base unit having a test space for testing a plurality of wafers formed on a wafer; and a loading unit for providing the wafer to the wafer a base unit; a gas supply unit disposed above the loading unit for supplying a cleaning gas to the loading unit; and a gas release unit disposed under the loading unit for releasing the cleaning gas downward; The loading unit comprises: a rotating disc; a carrying arm disposed above the rotating disc for carrying a wafer; a driving portion disposed under the rotating disc for linearly moving the carrying arm; and a cover The body covers the rotating disk and the carrying arm, and includes a first through hole through which a cleaning gas flows downward through the first through hole.

According to an embodiment of the invention, when a cleaning gas flows downward to remove particles on the wafer, a through hole formed in a cover allows the cleaning gas to smoothly flow to effectively remove particles on the wafer. In addition, since a transport arm is disposed above the rotating disc, and a first driving portion for driving the transport arm is disposed under the rotating disc, the particles generated by the operation of the first driving portion are transparently flowed through the cleaning gas. Avoid staying on the wafer on the carrier arm. In addition, an anion air purifier can be used to remove the static charge between the wafer surface and the particles to reduce the adhesion between the wafer and the particles, so that the cleaning gas can more effectively remove the particles on the wafer.

The embodiments of the present invention are described in detail in conjunction with the following drawings. The invention may be embodied in different specific forms and its construction is not limited to the embodiments described herein. In addition, the embodiments of the present invention are used to disclose the technology of the present invention, and the full technical scope is provided to those skilled in the art. Related elements of the present invention are described in conjunction with the associated reference numerals.

It is noted that when an element is on the other element, it can be seen as being directly on the other element or the other element is present. In contrast, when an element is directly on the other element, the element does not have the other element. The terms "and" or "an" are used in the <RTIgt;

It is to be noted that the terms "first, second, ..." as used herein may be used to describe different elements, but such elements are not limited. For example, a first film can be a second film. Similarly, a second film can be a first film without violating the disclosed technology.

The terminology used herein is for the purpose of illustration and description of the embodiments The singular noun "a", as used herein, is intended to encompass a In addition, the terms "comprising" and "comprising" are used in the specification and the description , scope, whole, steps, operations, components, components, and/or collections.

In addition, relational nouns such as "lower" or "bottom" and "above" or "top" are used herein to describe the relationship of the elements in the drawings. It is worth noting that the relational nouns, in addition to describing the orientation of the device in the illustration, also encompass different orientations of the device. For example, when the device in the drawings is reversed, the components described in the specification are "below" other components, and the components may be described as "above" other components. Therefore, in the specification, the description of the relationship of "below" and "above" may be included according to the direction of the device in the illustration. In the same way, when the device in the drawings is reversed, the elements described in the specification are "below" or "below" the other element, and may also be referred to as "above" or "above". Therefore, in the specification, the description of the relationship of "lower" and "above" may be included in the <RTI ID=0.0>

Unless otherwise defined, the nouns used in the present invention are those that are known to those of ordinary skill. It is worth noting that the definition of nouns is the meaning of ordinary use and related fields, and does not overly explain the meaning of defining nouns.

Herein, the embodiments in the specification are preferred embodiments of the present invention, and thus embodiments may have different shapes of results, for example, depending on the manufacturing technique, different results may result. The structure of embodiments of the invention is not limited by the particular shape, which may include results of different shapes. For example, a spatial extent is described as a plane, and in general, it has summary and/or non-linear features. In addition, the acute angles described in the specification may be arcuate. Therefore, the scope of the description is not limited to a specific shape range, and does not limit the field of the invention.

Please refer to FIG. 1 , which is a schematic diagram of a wafer transfer unit according to an embodiment of the present invention, FIG. 2 is a side view of one of the transfer arms shown in FIG. 1 , and FIG. 3 is a view of FIG. 1 . Side view of the cover.

Referring to FIG. 1-3, a wafer transfer unit 100 according to an embodiment of the present invention includes a rotary disk 110, a transfer arm 120, a first driving portion 130, and a cover 150.

The rotating disk 110 is rotatable. For example, when the rotating disk 110 rotates, the wafer handling unit 100 carries a wafer in a wafer cassette (not shown) and a wafer disk (not shown in the figure). The wafer cassette is used to receive the wafer, and the wafer tray is used to support the wafer. The rotating disk 110 includes a third hole 115 for allowing a cleaning gas to flow through the third hole 115 quickly. The rotating disk 110 includes a guiding member (not shown) for guiding the linear movement of the carrying arm 120, wherein the guiding member can correspond to a fourth hole (not shown) formed in the rotating disk 110.

The transport arm 120 is disposed on the rotating disk 110, and can transport the wafer in the wafer cassette to a predetermined position, wherein the predetermined position can include a position on the wafer disk.

In the embodiment of the present invention, the carrying arm 120 includes a first arm 121, a second arm 122, and a connecting portion 123. The connecting portion 123 is configured to connect the first arm 121 and the second arm 122 to the first driving portion. 130. The first arm 121 and the second arm 122 can transport the wafer placed on the wafer cassette or the wafer tray, and the connecting portion 123 can move along the fourth hole formed on the rotating disk 110.

The first driving portion 120 is disposed below the rotating disk 110, and can drive the transfer arm 120 to linearly move toward the wafer cassette.

In the embodiment of the present invention, the first driving unit 130 includes an engine 131, a driving pulley 133, a driving pulley 135, and a driving belt 137. The engine 131 is disposed below the rotating disk 110. The drive pulley 133 is coupled to the engine 131 to rotate in synchronization with the engine 131. The drive belt 137 connects the drive pulley 133 and the transmission pulley 135 and is coupled to the transport arm 120. Therefore, when the drive belt 137 is rotated, the transport arm 120 can move linearly.

The lid 150 is disposed on the rotating disk 110 and the transfer arm 120. The cover 150 covers the rotating disk 110 and the transfer arm 120 to prevent particles from approaching the wafer on the transfer arm 120. In addition, the cover 150 includes a first through hole 155 for allowing a cleaning gas to flow through the first through hole 155.

Since the first driving portion 130 is disposed below the rotating disk 110, and the transport arm 120 is disposed above the rotating disk 110, when the cleaning gas flows from the upper half of the rotating disk 110 toward the lower half of the rotating disk 110 (cleaning gas in sequence) The wafer on the transfer arm 120, the rotating disk 110, and the first driving unit 130), the wafer on the transfer arm 120 can avoid contamination of particles generated by the operation of the first driving unit 130.

In the embodiment of the present invention, the wafer handling unit 100 further includes a detecting disk 160, a precision sensing component 165 and an negative ion air purifier 170.

The detecting disk 160 is disposed between the rotating disk 110 and the cover 150. For example, the detecting disk 160 can be disposed in parallel with the rotating disk 110, and has an arc shape. In addition, a connecting member 161 is coupled to the detecting disk 160 and the rotating disk 110.

The precision sensing element 165 is movably disposed on the lower surface of the detecting disk 160, and is linearly movable. The precision sensing component 165 can move forward away from the edge of the detection disk 160, so that the precision sensing component 165 can detect the wafer in the wafer cassette to determine the presence of the wafer in the wafer cassette.

In an embodiment, the wafer handling unit 100 further includes a second driving portion (not shown) for moving the precision sensing element 165. The second driving portion is disposed on the detecting disc 160, and includes a linear moving guiding member (not shown in the drawing) and a cylinder (not shown in the drawing).

The negative ion air purifier 170 is disposed on the lower surface of the detecting disk 160 and faces the carrying arm 120 of the supporting wafer. For example, the negative ion air purifier 170 is disposed at an arcuate edge portion of the detection disk 160. The negative ion air purifier 170 removes static charges generated between the wafer and the particles to reduce a bond between the wafer and the particles. Thus, as the cleaning gas flows down the wafer, the particles are effectively removed from the wafer.

In the embodiment of the present invention, a second through hole 163 is formed on the detecting disk 160, and the position thereof corresponds to the first through hole 155, so that the cleaning gas can smoothly flow through the first through hole 155 and the second through hole. 163.

In the embodiment of the present invention, the wafer transfer unit 100 further includes a third driving portion 140 for rotating the rotating disk 110. In an embodiment, the third driving portion 140 includes a rotating motor 141, and a rotating shaft for connecting the rotating motor 141 to the rotating disk 110. In another embodiment, the third driving portion 140 includes a rotating shaft (not shown), a rotating motor (not shown), and a belt connecting the rotating shaft and the rotating motor, wherein the rotating shaft rotates The disk 110 extends downward.

Please refer to FIG. 4, which is a schematic diagram of a probe station according to an embodiment of the present invention, and FIG. 5 is a schematic diagram of a loading unit shown in FIG. 4.

Referring to FIG. 4-5, the probe station 200 of the embodiment of the present invention includes a base unit 210, a loading unit 220, a first gas supply unit, and a first gas release unit 240. The probe station 200 can electrically connect a plurality of wafers on a wafer to a tester (not shown), and transmit a signal to the wafer through a probe card (not shown) to determine each Whether the wafer is good or inferior.

The base unit 210 provides a test space 215 for testing the electrical characteristics of a plurality of wafers formed on the wafer.

In an embodiment, the base unit 210 includes a turntable 211, a platform 213, and a second cover 215. The swivel 211 is used to support the wafer. The platform 213 is disposed below the turntable 211 and is connected to the turntable 211, so that when the platform 213 moves, the turntable 211 moves accordingly. The second cover 215 covers the side of the turntable 211 and the platform 213, and has a superior linear shape. Therefore, the second cover 215 allows a cleaning gas to enter from one side of the probe station 200 and smoothly flows to the probe. The other side of the needle table 200.

The turntable 211 is disposed in the test space 215, and it can protect the wafer with a vacuum force.

In one embodiment, the base unit 210 further includes a plurality of protruding legs (not shown) for lifting or lowering the turntable 211 to support the wafer carried by the loading unit 220. In addition, the base unit 210 includes a vacuum pump (not shown) for generating a vacuum force, and a vacuum pipe (not shown) for connecting the vacuum pump to a vacuum hole formed in the turntable 211 (not As shown in the figure, the turntable 211 can protect the wafer with a vacuum force.

The platform 213 is disposed below the turntable 211 and is connected to the turntable 211 so that when the platform 213 moves, the turntable 211 also moves. For example, when the platform 213 moves in the x-y-z three-dimensional coordinate direction, the turntable 211 also moves in the x-y-z three-dimensional coordinate direction. Further, when the platform 213 is rotated, the turntable 211 also rotates. In another embodiment, the base unit 210 further includes a driving source (not shown) connected to the platform 213. The driving source can be a cylinder, a linear motor, a ball screw, and the like.

The second cover 215 covers one side of the platform 213, which prevents the particles generated by the operation of the platform 213 from entering the test space 215. In addition, the second cover 215 has a superb linear shape to cover the side of the platform 213, so that the flow resistance of the cleaning gas in the test space 215 can be reduced, so that it can smoothly flow.

The loading unit 220 is disposed adjacent to the base unit 210 and connected in a docking manner, meaning that the base unit 210 and the loading unit 220 can be separated or combined. The loading unit 220 can load the wafers stacked in the wafer cassette 20 to the base unit 210.

The loading unit 220 includes a loading port 221 and a carrying portion 222 as a control portion 223. The load port 221 supports the wafer cassette 20, wherein the wafer cassette has a plurality of continuously stacked wafers therein. The carrying portion 222 includes a carrying arm (not shown) for carrying the wafer in the wafer cassette 20 to the base unit 210. The control unit 223 includes wiring or circuitry for controlling the transport unit 222. For example, the load port 221, the transport portion 222, and the control portion 223 may be arranged one after another.

Referring to FIGS. 1 to 3 , the loading unit 220 further includes a rotating disk 110 , a transport arm 120 , a first driving portion 130 , and a first cover 150 , and the wafer handling unit of FIGS. 1 to 3 . The rotary disk 110, the transport arm 120, the first driving unit 130, and the first cover 150 are the same in the first embodiment. Therefore, the related operation modes can be referred to the above, and details are not described herein again.

Please continue to refer to Figures 1 to 3 and Figure 5. The loading unit 220 further includes a movable baffle 229 formed between the loading port 221 and the carrying portion 222 to isolate the carrying portion 222 from the loading port 221. The flapper 229 can be moved vertically or horizontally. For example, when the movable shutter 229 is opened, the carrying arm 120 can load or unload the wafer between the wafer cassette 20 on the loading port 221 and the carrying portion 222. Conversely, when the flapper 229 is closed, the carrying arm 120 stops operating. Therefore, particles on the wafer cassette 20 can be prevented from entering the carrying portion 222.

In one embodiment, the loading unit 220 further includes a third cover 226 that covers the control portion 223 having wiring and circuitry. The third cover 226 can guide the cleaning gas to flow toward the control portion 223 and guide it to the carrying portion 222. Therefore, the cleaning gas entering the loading unit 220 can be concentratedly flowed to the wafer on the load port 221 to effectively remove particles on the wafer.

In one embodiment, the loading unit 220 further includes a buffer portion 227 disposed under the control portion 223 and a fourth cover 228 for isolating the transport portion 222 and the buffer portion 227.

The buffer portion 227 includes a first plane for supporting the wafer (not shown) for rubbing the top end of the probe card, and a second plane (not shown) for supporting a test. Wafer.

The fourth cover 228 is placed between the transport portion 222 and the buffer portion 227 to isolate the transport portion 222 from the buffer portion 227 so that particles remaining in the buffer portion 227 can be prevented from entering the transport portion 222. In addition, the fourth cover 228 can prevent the cleaning gas from flowing downward through the buffer portion 227 to effectively discharge the cleaning gas.

In an embodiment, the loading unit 220 further includes a preset adjustment component 225 for pre-arranging the wafers.

The preset adjustment component 225 can be disposed under the load port 221, and includes an auxiliary turntable (not shown) for pre-arranging the wafer and a data reading component (not shown) for Read the identification data of the wafer, such as an optical character reader and a code reader.

According to the embodiment of the present invention, when the cleaning gas flows downward to remove the particles on the wafer, the cleaning gas can smoothly flow through the through holes formed in the cover body, and the particles on the wafer are effectively removed. Further, the first driving portion for driving the transport arm through the transport arm is disposed below the rotating disk, and the particles generated by the operation of the first driving portion are prevented from adhering to the wafer on the transport arm. In addition, the negative ion air purifier removes static charges between the wafer and the particles to reduce the adhesion between the wafer and the particles, allowing the cleaning gas to more effectively remove particles from the wafer.

In summary, in the embodiment of the present invention, when the cleaning gas flows downward to remove the particles on the wafer, the cleaning gas can smoothly flow through the through hole formed in the cover body, and the wafer is effectively removed. particle. Further, the first driving portion for driving the transport arm through the transport arm is disposed below the rotating disk, and the particles generated by the operation of the first driving portion are prevented from adhering to the wafer on the transport arm. In addition, the negative ion air purifier removes static charges between the wafer and the particles to reduce the adhesion between the wafer and the particles, allowing the cleaning gas to more effectively remove particles from the wafer. The invention can also be applied to a probe station to test the electrical characteristics of the wafer.

The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. In addition, any of the objects or advantages or features of the present invention are not required to be achieved by any embodiment or application of the invention. In addition, the abstract sections and headings are only used to assist in the search of patent documents and are not intended to limit the scope of the invention.

100. . . Wafer handling unit

110. . . Rotating disk

115. . . Third hole

120. . . Transport arm

121. . . First arm

122. . . Second arm

123. . . Connection

131. . . engine

133. . . Drive pulley

135. . . Transmission pulley

137. . . Drive belt

140. . . Third drive

141. . . Rotary motor

150. . . Cover

155. . . First through hole

160. . . Detection disk

161. . . Connecting element

163. . . Second through hole

165. . . Precise sensing component

170. . . Negative ion air purifier

200. . . Probe station

20. . . Wafer box

210. . . Base unit

211. . . Turntable

213. . . platform

215. . . Second cover

217. . . Test space

220. . . Loading unit

221. . . Load port

222. . . Transport department

223. . . Control department

225. . . Preset adjustment component

226. . . Third cover

227. . . Buffer section

228. . . Fourth cover

229. . . Moving baffle

240. . . First gas release unit

1 is a schematic view of a wafer handling unit according to an embodiment of the present invention.

Fig. 2 is a side view of one of the transport arms shown in Fig. 1.

Fig. 3 is a side view of a cover body shown in Fig. 1.

Figure 4 is a schematic view of a probe station according to an embodiment of the present invention.

Figure 5 is a schematic view of one of the loading units shown in Figure 4.

100. . . Wafer handling unit

110. . . Rotating disk

115. . . Third hole

131. . . engine

135. . . Transmission pulley

137. . . Drive belt

140. . . Third drive

141. . . Rotary motor

150. . . Cover

160. . . Detection disk

161. . . Connecting element

163. . . Second through hole

165. . . Precise sensing component

170. . . Negative ion air purifier

Claims (6)

A wafer handling unit includes: a rotating disk; a carrying arm disposed above the rotating disk for carrying a wafer; and a driving portion disposed under the rotating disk for linearly moving the carrying arm; And a cover body covering the rotating disk and the carrying arm, and a first through hole, wherein a cleaning gas flows through the wafer, the rotating disk and the driving portion through the first through hole. The wafer handling unit of claim 1, wherein the driving portion comprises: an engine rotatably connected to a bottom surface of the rotating disk; and a driving pulley mechanically engaged with the engine; a drive pulley rotatably fixing the bottom surface of the rotary disk; and a drive belt for coupling the drive pulley to the drive pulley and connecting the transfer arm to linearly move the transfer arm. The wafer handling unit of claim 1, further comprising a detecting disk disposed between the rotating disk and the cover, the detecting disk comprising an accurate sensing component for detecting a location One of the wafers in the wafer cassette to determine the presence of the wafer in the wafer cassette. The wafer handling unit of claim 3, wherein the detecting disk comprises a second through hole adjacent to the first through hole, so that the cleaning gas flows smoothly through the wafer. The wafer handling unit of claim 3, further comprising a negative ion air purifier disposed at an edge of the detecting disk, the negative ion air purifier removing the static charge between the wafer and the particle . A probe station comprising: a base unit having a test space for testing a plurality of wafers formed on a wafer; a loading unit for supplying the wafer to the base unit; and a gas supply unit And disposed above the loading unit for providing a cleaning gas to the loading unit; and a gas releasing unit disposed under the loading unit for discharging the cleaning gas downward; wherein the loading unit comprises: a rotating disk; a carrying arm disposed above the rotating disk for carrying a wafer; a driving portion disposed under the rotating disk for linearly moving the carrying arm; and a cover covering the rotating disk And the carrying arm includes a first through hole, and a cleaning gas flows through the wafer, the rotating disk and the driving portion through the first through hole.