TWI459885B - Electronic device and method for manufacturing housing thereof - Google Patents
Electronic device and method for manufacturing housing thereof Download PDFInfo
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- TWI459885B TWI459885B TW99145413A TW99145413A TWI459885B TW I459885 B TWI459885 B TW I459885B TW 99145413 A TW99145413 A TW 99145413A TW 99145413 A TW99145413 A TW 99145413A TW I459885 B TWI459885 B TW I459885B
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- wall
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- bottom wall
- support
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 title description 2
- 230000002093 peripheral effect Effects 0.000 claims description 17
- 238000005242 forging Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 238000003801 milling Methods 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims 2
- 238000003825 pressing Methods 0.000 claims 1
- 238000004512 die casting Methods 0.000 description 5
- 239000006261 foam material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Casings For Electric Apparatus (AREA)
Description
本發明涉及一種電子裝置及其殼體之製造方法。The present invention relates to an electronic device and a method of manufacturing the same.
電子裝置之殼體一般包括底殼及與底殼固定連接之上殼。底殼與上殼一般採用焊接、膠黏或機械卡合等方式固定連接。然,由於電子裝置使用過程中不可避免會受到外力撞擊或意外跌落,其抗摔性能則尤為重要。這種組裝式殼體之結構強度較差,抗摔性能不佳,導致電子裝置之耐用性受到影響。電子裝置意外跌落時,電子裝置邊角部為易摔壞區域。為保護電子裝置邊角部,一般之電子裝置通常採用設置撞擊緩衝裝置來保護邊角部。該撞擊緩衝裝置包括發泡材及連接件。發泡材通過連接件固定於電子裝置外殼外對應之邊角部。當電子裝置受到撞擊時,發泡材可吸收撞擊能量,從而保護邊角部。然,採用外接之撞擊緩衝裝置會增大電子裝置之體積並影響美觀。The housing of the electronic device generally includes a bottom case and a fixed connection upper shell to the bottom case. The bottom case and the upper case are generally fixedly connected by welding, adhesive or mechanical clamping. However, since the electronic device is inevitably subjected to external force impact or accidental fall during use, its anti-drop performance is particularly important. The assembled housing has poor structural strength and poor drop resistance, which affects the durability of the electronic device. When the electronic device accidentally falls, the corner of the electronic device is a vulnerable area. In order to protect the corners of the electronic device, a general electronic device usually uses an impact buffer device to protect the corners. The impact buffer device includes a foam material and a connecting member. The foam material is fixed to the corresponding corner portion outside the outer casing of the electronic device through the connecting member. When the electronic device is hit, the foam material absorbs the impact energy, thereby protecting the corners. However, the use of an external impact buffer device increases the size of the electronic device and affects the aesthetics.
鑒於上述狀況,有必要提供一種抗摔性能較好,體積小且美觀之電子裝置。In view of the above situation, it is necessary to provide an electronic device with better anti-drop performance, small size and beautiful appearance.
還有必要提供一種電子裝置之殼體之製造方法。It is also necessary to provide a method of manufacturing a housing for an electronic device.
一種電子裝置包括殼體。殼體包括底壁、從該底壁之邊緣向其一側延伸形成之週壁、從該週壁遠離該底壁之一端邊緣朝向該底壁之中心延伸形成之支撐壁,及保護部。週壁包括複數依次連接之側壁,保護部一體成型於相鄰二側壁之相交處,且保護部與底壁及支撐壁均固定連接。An electronic device includes a housing. The housing includes a bottom wall, a peripheral wall extending from an edge of the bottom wall toward one side thereof, a support wall extending from the end wall of the peripheral wall away from an end edge of the bottom wall toward a center of the bottom wall, and a protection portion. The peripheral wall includes a plurality of side walls connected in sequence, and the protection portion is integrally formed at an intersection of the adjacent two side walls, and the protection portion is fixedly connected to the bottom wall and the support wall.
一種電子裝置殼體之製造方法,其包括以下步驟:A method of manufacturing an electronic device housing, comprising the steps of:
提供一套模具及一種金屬坯料;在模具內壓鑄或鍛壓金屬坯料以形成預型體,預型體包括底壁及從底壁邊緣向其一側延伸之週壁,週壁包括複數依次連接之側壁;銑削預型體之側壁之內側面以開設槽結構,從而形成與底壁平行之支撐壁,並於二相鄰側壁相交處形成保護部,以將預型體成型為殼體。Providing a mold and a metal blank; die-casting or forging a metal blank in the mold to form a preform, the preform comprising a bottom wall and a peripheral wall extending from the edge of the bottom wall to one side thereof, the peripheral wall including a plurality of successively connected a sidewall; the inner side surface of the sidewall of the pre-formed body is formed with a groove structure to form a support wall parallel to the bottom wall, and a protection portion is formed at the intersection of the two adjacent sidewalls to form the preform into a casing.
由於上述電子裝置殼體為一體成型結構,相對於其他組裝式殼體,其結構強度較好,增強了抗摔性。且由於採用壓鑄或鍛壓方法成型預型體,相對於衝壓成型,殼體內之應力作用較小,也更有利於增加其結構強度,提高其抗摔性能。另外,當電子裝置意外跌落或受到外力撞擊時,位於殼體側壁之相交處之保護部可承受衝擊力,較好保護殼體之邊角部。保護部結構簡單、體積小,且設置於殼體內部,不影響電子裝置之外觀。Since the electronic device housing is an integrally formed structure, the structural strength is better than other assembled housings, and the drop resistance is enhanced. Because the preform is formed by die casting or forging, the stress in the shell is less than that of stamping, and it is more beneficial to increase the structural strength and improve its anti-drop performance. In addition, when the electronic device is accidentally dropped or impacted by an external force, the protection portion at the intersection of the side walls of the casing can withstand the impact force, and the corner portion of the casing is better protected. The protection part has a simple structure, a small volume, and is disposed inside the casing, and does not affect the appearance of the electronic device.
請參閱圖1及圖2,本發明實施方式之電子裝置100可為觸摸式平板電腦、手機、MP3、數碼相框、液晶顯示器等。於本實施方式中,以觸摸式平板電腦為例進行說明。電子裝置100包括殼體10及固定裝設於殼體10上之顯示屏30。電子裝置100還包括各種功能模組用於實現各種相應之功能,然,為節省篇幅,於本實施方式中重點介紹電子裝置100之殼體10及固定於殼體10上之顯示屏30。Referring to FIG. 1 and FIG. 2 , the electronic device 100 of the embodiment of the present invention may be a touch tablet computer, a mobile phone, an MP3, a digital photo frame, a liquid crystal display, or the like. In the present embodiment, a touch panel computer will be described as an example. The electronic device 100 includes a housing 10 and a display screen 30 fixedly mounted on the housing 10. The electronic device 100 further includes various functional modules for implementing various corresponding functions. However, in order to save space, the housing 10 of the electronic device 100 and the display screen 30 fixed to the housing 10 are mainly introduced in the present embodiment.
請同時參閱圖3,殼體10大致呈方形,其包括一體成型之底壁11、週壁12、支撐壁13及保護部14。週壁12從底壁11之邊緣向其一側延伸形成,其包括四依次連接之側壁121。底壁11與週壁12共同形成一可收納各種功能模組之收容空間101。支撐壁13從週壁12遠離底壁11之一端邊緣朝底壁11中心延伸形成。支撐壁13與底壁11基本平行。支撐壁13遠離底壁11之頂面上形成有安裝槽133,以用於收納並支持顯示屏30。保護部14固定設置於相鄰二側壁121相交處。每一保護部14沿與支撐壁13之頂面平行方向之橫截面大致呈扇形。每一保護部14上下二端面分別與底壁11及支撐壁13相連接。每一保護部14之二側面分別與相鄰二側壁121相連接。每二相鄰保護部14與其之間之側壁121、支撐壁13及底壁11共同圍成一具有開口之空腔141,空腔141與收容空間101相通。於本實施方式中,空腔141為U形槽。Referring to FIG. 3 at the same time, the housing 10 is substantially square and includes an integrally formed bottom wall 11, a peripheral wall 12, a support wall 13 and a protection portion 14. The peripheral wall 12 extends from the edge of the bottom wall 11 toward one side thereof, and includes four side walls 121 which are sequentially connected. The bottom wall 11 and the peripheral wall 12 together form a receiving space 101 for accommodating various functional modules. The support wall 13 is formed to extend from the one end edge of the peripheral wall 12 away from the bottom wall 11 toward the center of the bottom wall 11. The support wall 13 is substantially parallel to the bottom wall 11. A mounting groove 133 is formed on the top surface of the support wall 13 away from the bottom wall 11 for receiving and supporting the display screen 30. The protection portion 14 is fixedly disposed at the intersection of the adjacent two side walls 121. Each of the protection portions 14 has a substantially fan shape in a cross section in a direction parallel to the top surface of the support wall 13. The upper and lower ends of each of the protection portions 14 are respectively connected to the bottom wall 11 and the support wall 13. The two sides of each protection portion 14 are respectively connected to the adjacent two side walls 121. Each of the two adjacent protection portions 14 and the side wall 121, the support wall 13 and the bottom wall 11 define a cavity 141 having an opening, and the cavity 141 communicates with the receiving space 101. In the present embodiment, the cavity 141 is a U-shaped groove.
顯示屏30固定裝設於殼體10之支撐壁13之安裝槽133內,並與支撐壁13之頂面平齊,以使電子裝置100美觀。The display screen 30 is fixedly mounted in the mounting groove 133 of the support wall 13 of the housing 10 and flush with the top surface of the support wall 13 to make the electronic device 100 beautiful.
下面結合圖2至圖5,描述殼體10之製造方法,其包括以下步驟:A method of manufacturing the housing 10 will be described below with reference to FIGS. 2 through 5, including the following steps:
提供一套模具及一種金屬坯料;Providing a set of molds and a metal blank;
於該模具內採用壓鑄或者鍛壓方法將金屬坯料形成預型體50,預型體50包括底壁51及從底壁51邊緣向其一側延伸之週壁52,週壁52包括四依次連接之側壁521;The metal blank is formed into a preform 50 by die casting or forging in the mold. The preform 50 includes a bottom wall 51 and a peripheral wall 52 extending from an edge of the bottom wall 51 to one side thereof. The peripheral wall 52 includes four connected in sequence. Side wall 521;
銑削側壁521之內側面以開設U形槽,形成與底壁11平行之支撐壁13,並於二側壁521之相交處形成保護部14;Milling the inner side of the side wall 521 to open a U-shaped groove, forming a support wall 13 parallel to the bottom wall 11, and forming a protection portion 14 at the intersection of the two side walls 521;
銑削支撐壁13遠離底壁11之頂面以開設安裝槽133,從而將預型體50成型為殼體10。The milling support wall 13 is away from the top surface of the bottom wall 11 to open the mounting groove 133, thereby forming the preform 50 into the housing 10.
可以理解,也可於銑削加工後增加其他步驟,如拋光處理、鍍膜處理等,以使殼體10更美觀。It will be appreciated that other steps, such as polishing, coating, etc., may be added after the milling process to make the housing 10 more aesthetically pleasing.
本發明實施方式之殼體10通過壓鑄或者鍛壓方法成型預型體50,再採用銑削方式於側壁521上開設U形槽,以形成與底壁11平行之支撐壁13,得到殼體10。不僅使殼體10更輕薄,相對於其他組裝式殼體,由於殼體10為一體成型結構,其結構強度較好,增強了抗摔性。同時,由於採用壓鑄或鍛壓方法成型預型體50,相對於衝壓成型,殼體10之內應力作用較小,也更有利於增加其結構強度。另外,當電子裝置100意外跌落或受到外力撞擊時,位於殼體10之側壁121之相交處之保護部14使邊角部之厚度及結構強度增大,增強其承受衝擊力之能力,從而較好保護殼體10之邊角部。保護部14結構簡單、體積小,且設置於殼體10內部,不影響電子裝置100之外觀。The housing 10 of the embodiment of the present invention forms the preform 50 by die casting or forging, and then forms a U-shaped groove on the side wall 521 by milling to form a support wall 13 parallel to the bottom wall 11 to obtain the housing 10. Not only is the housing 10 thinner and lighter, but the housing 10 is an integrally formed structure with respect to other assembled housings, and its structural strength is better, and the drop resistance is enhanced. At the same time, since the preform 50 is formed by a die casting or forging method, the internal stress of the casing 10 is smaller than that of the press forming, and it is more advantageous to increase the structural strength. In addition, when the electronic device 100 is accidentally dropped or impacted by an external force, the protection portion 14 located at the intersection of the side walls 121 of the casing 10 increases the thickness and structural strength of the corner portion, thereby enhancing its ability to withstand impact, thereby It is good to protect the corners of the casing 10. The protection portion 14 has a simple structure and a small size, and is disposed inside the casing 10 without affecting the appearance of the electronic device 100.
綜上所述,本發明確已符合發明專利之要件,遂依法提出專利申請。惟,以上所述者僅為本發明之較佳實施方式,自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝之人士援依本發明之精神所作之等效修飾或變化,皆應涵蓋於以下申請專利範圍內。In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims.
100...電子裝置100. . . Electronic device
10...殼體10. . . case
101...收容空間101. . . Containing space
11,51...底壁11,51. . . Bottom wall
12,52...週壁12,52. . . Zhou wall
121,521...側壁121,521. . . Side wall
13...支撐壁13. . . Support wall
133...安裝槽133. . . Mounting slot
14...保護部14. . . Protection department
141...空腔141. . . Cavity
30...顯示屏30. . . Display
50...預型體50. . . Preform
圖1係本發明實施方式之電子裝置之立體組裝圖,電子裝置包括殼體和顯示屏。1 is an assembled, isometric view of an electronic device in accordance with an embodiment of the present invention, the electronic device including a housing and a display screen.
圖2係圖1所示電子裝置之殼體和顯示屏之立體分解圖。2 is an exploded perspective view of the housing and display screen of the electronic device shown in FIG. 1.
圖3係圖1所示電子裝置沿III-III線之局部剖面圖。3 is a partial cross-sectional view of the electronic device of FIG. 1 taken along line III-III.
圖4係圖1所示電子裝置沿IV-IV線之局部剖面圖。4 is a partial cross-sectional view of the electronic device of FIG. 1 taken along line IV-IV.
圖5係圖1所示電子裝置之殼體之預型體之立體圖。FIG. 5 is a perspective view of a preform of the housing of the electronic device shown in FIG. 1. FIG.
11...底壁11. . . Bottom wall
121...側壁121. . . Side wall
14...保護部14. . . Protection department
30...顯示屏30. . . Display
Claims (8)
提供一套模具及一種金屬坯料;
於該模具內壓鑄或鍛壓該金屬坯料以形成一預型體,該預型體包括底壁及從該底壁邊緣向其一側延伸之週壁,該週壁包括複數依次連接之側壁;
銑削該預型體之側壁之內側面以開設槽結構,從而形成與該底壁平行之支撐壁,並於二相鄰該側壁相交處形成保護部,從而將該預型體成型為殼體。A method of manufacturing an electronic device housing, comprising the steps of:
Providing a set of molds and a metal blank;
Pressing or forging the metal blank in the mold to form a preform, the preform comprising a bottom wall and a peripheral wall extending from the edge of the bottom wall to one side thereof, the peripheral wall comprising a plurality of sequentially connected side walls;
The inner side surface of the side wall of the preform is milled to define a groove structure to form a support wall parallel to the bottom wall, and a protective portion is formed at an intersection of two adjacent side walls to form the preform into a casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99145413A TWI459885B (en) | 2010-12-23 | 2010-12-23 | Electronic device and method for manufacturing housing thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW99145413A TWI459885B (en) | 2010-12-23 | 2010-12-23 | Electronic device and method for manufacturing housing thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201228525A TW201228525A (en) | 2012-07-01 |
| TWI459885B true TWI459885B (en) | 2014-11-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99145413A TWI459885B (en) | 2010-12-23 | 2010-12-23 | Electronic device and method for manufacturing housing thereof |
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| Country | Link |
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| TW (1) | TWI459885B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM581354U (en) | 2019-01-16 | 2019-07-21 | 和碩聯合科技股份有限公司 | Electronic device |
| CN115782643B (en) * | 2022-11-30 | 2025-05-16 | 浙江杭升电气科技有限公司 | Charging pile shell, shaping mold and shaping method thereof |
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2010
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| Publication number | Publication date |
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| TW201228525A (en) | 2012-07-01 |
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