TWI458183B - 連接端子 - Google Patents
連接端子 Download PDFInfo
- Publication number
- TWI458183B TWI458183B TW100141571A TW100141571A TWI458183B TW I458183 B TWI458183 B TW I458183B TW 100141571 A TW100141571 A TW 100141571A TW 100141571 A TW100141571 A TW 100141571A TW I458183 B TWI458183 B TW I458183B
- Authority
- TW
- Taiwan
- Prior art keywords
- end portion
- diameter
- contact member
- base end
- contact
- Prior art date
Links
- 239000000523 sample Substances 0.000 title description 3
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 229910000510 noble metal Inorganic materials 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000010948 rhodium Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Connecting Device With Holders (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010254840 | 2010-11-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201251216A TW201251216A (en) | 2012-12-16 |
| TWI458183B true TWI458183B (zh) | 2014-10-21 |
Family
ID=46084004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100141571A TWI458183B (zh) | 2010-11-15 | 2011-11-15 | 連接端子 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5805102B2 (ja) |
| TW (1) | TWI458183B (ja) |
| WO (1) | WO2012067077A1 (ja) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104425945A (zh) * | 2013-08-30 | 2015-03-18 | 贝尔威勒电子股份有限公司 | 伸缩端子 |
| TWI555987B (zh) * | 2014-01-28 | 2016-11-01 | Spring sleeve type probe and its manufacturing method | |
| WO2016021723A1 (ja) * | 2014-08-08 | 2016-02-11 | 日本発條株式会社 | 接続端子 |
| KR101552553B1 (ko) * | 2014-09-23 | 2015-10-01 | 리노공업주식회사 | 검사장치용 컨택트 프로브 |
| CN107121570A (zh) * | 2017-05-03 | 2017-09-01 | 林荣敏 | 高压开关柜分电接点的耐压试验装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200532207A (en) * | 2004-02-04 | 2005-10-01 | Nhk Spring Co Ltd | Needle shape member, conductive conductive contactor and conductive conductor unit |
| TWM389955U (en) * | 2010-02-08 | 2010-10-01 | Hon Hai Prec Ind Co Ltd | Electrical connector and contact thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005308684A (ja) * | 2004-04-26 | 2005-11-04 | Seiko Epson Corp | プローブおよび検査装置 |
| JP4574222B2 (ja) * | 2004-05-06 | 2010-11-04 | 日本電産リード株式会社 | 基板検査用接触子、これを用いた基板検査用治具及び基板検査装置 |
| JP4585024B2 (ja) * | 2005-06-10 | 2010-11-24 | デラウェア キャピタル フォーメーション インコーポレイテッド | 可撓性のある内部相互接続部を備えた電気コンタクトプローブ |
| JP5067790B2 (ja) * | 2007-04-27 | 2012-11-07 | センサータ テクノロジーズ マサチューセッツ インコーポレーテッド | プローブピンおよびそれを用いたソケット |
| US7862391B2 (en) * | 2007-09-18 | 2011-01-04 | Delaware Capital Formation, Inc. | Spring contact assembly |
-
2011
- 2011-11-14 WO PCT/JP2011/076214 patent/WO2012067077A1/ja not_active Ceased
- 2011-11-14 JP JP2012544242A patent/JP5805102B2/ja active Active
- 2011-11-15 TW TW100141571A patent/TWI458183B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200532207A (en) * | 2004-02-04 | 2005-10-01 | Nhk Spring Co Ltd | Needle shape member, conductive conductive contactor and conductive conductor unit |
| TWM389955U (en) * | 2010-02-08 | 2010-10-01 | Hon Hai Prec Ind Co Ltd | Electrical connector and contact thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012067077A1 (ja) | 2012-05-24 |
| TW201251216A (en) | 2012-12-16 |
| JP5805102B2 (ja) | 2015-11-04 |
| JPWO2012067077A1 (ja) | 2014-05-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GD4A | Issue of patent certificate for granted invention patent |